KR102080762B1 - Speed Buffer, In-Line Type Substrate Processing System and Controlling Method Therefor - Google Patents

Abstract

Disclosed are a speed buffer, a continuous substrate processing system including the same, and a control method thereof.
The speed buffer according to an embodiment of the present invention is a speed buffer which transfers and transports a loaded substrate in a first direction. The speed buffer detects a position of a substrate being transported in the speed buffer. And a driver for controlling the rotational speed of the roller for conveying the latex substrate in response to the conveying speed of the latex substrate and the latent substrate determined to have a target spacing before the second sensor and the first substrate are completely removed from the speed buffer. can do.

Description

Speed Buffer, Continuous Substrate Processing System Containing It and Control Method thereof {Speed Buffer, In-Line Type Substrate Processing System and Controlling Method Therefor}

The present invention relates to substrate manufacturing equipment, and more particularly to a speed buffer, a continuous substrate processing system including the same, and a control method thereof.

The substrate processing apparatus is a device that performs processes such as physical / chemical deposition, ion implantation, and coating on a target substrate in a vacuum chamber, and has been developed from a cluster type to an inline type.

In-line type substrate processing apparatus, that is, a continuous substrate processing system is a system in which a process proceeds while passing through a chamber in which a substrate to be processed is arranged in a row while the deposition source is stopped. This is an advantageous advantage.

The substrate to be processed may be, for example, a transparent conductive film such as a solar cell, a liquid crystal display device, a touch panel, an organic electroluminescent device, a plasma display, a field emission device, a flexible display, or the like. It is becoming.

As the substrate to be processed is enlarged, the production facility also has to be enlarged, which increases the overall facility area and increases the production cost. In addition, the development of new treatment processes, etc. also contributes to the increase in production costs.

The unit cost of the final produced product depends on productivity per unit area, so in a continuous substrate processing system, it is important to efficiently configure a plurality of process chambers to reduce equipment costs.

In a continuous substrate processing system, the substrate moves at a constant speed for sufficient and uniform deposition during material deposition on the substrate. After the deposition is completed, a mask replacement, an encapsulation process, a modularization process, a system process, and the like are performed. In carrying out this series of processes, the deposition source is wasted if the distance between the substrates moving in the deposition chamber is wide.

Therefore, in order to lower the cost of the product more efficient use of the evaporation source is required, for this purpose, a situation that requires a method that can minimize the substrate gap in the chamber.

Embodiments of the present invention provide a speed buffer capable of minimizing the distance between substrates, a continuous substrate processing system including the same, and a control method thereof.

Speed buffer according to an embodiment of the present invention is a speed buffer for transporting the substrate to be carried in the first direction to carry out, a first sensor for detecting whether the substrate is carried; A second sensor detecting a position of the substrate being transferred in the speed buffer; And a driver for controlling the rotational speed of the roller for conveying the latex substrate in response to the conveying speed of the latex substrate and the latex substrate determined to have a target spacing before the starting substrate is completely removed from the speed buffer. It may include.

On the other hand, the continuous substrate processing system according to an embodiment of the present invention includes an alignment chamber for aligning the substrate and the mask; A speed buffer including a plurality of sensors installed at a designated position, the substrate receiving the substrate from the alignment chamber and transporting the substrate at a predetermined speed; A process chamber which processes the substrate provided from the speed buffer to a predetermined process condition; And a speed controller configured to control the starting substrate brought into the speed buffer and the starting substrate to have a target interval before the starting substrate provided as the speed buffer is completely removed from the speed buffer.

On the other hand, the speed buffer control method according to an embodiment of the present invention includes a plurality of sensors installed in a specified position and control in the speed control unit for controlling the speed buffer for transporting and transporting the substrate to be carried out at a predetermined speed As a method, as the substrate is loaded into the speed buffer by any one of the plurality of sensors, the controller is transported out of the speed buffer until the starting substrate being transferred ahead of the late board is detected. Predicting the remaining time of the; Determining, by the speed controller, a transfer speed of the latex substrate such that the latex substrate has a target distance from the first substrate within the remaining time; And transferring the latex substrate according to the determined transfer speed.

According to the present technology, the spacing between the substrates provided to the process chamber can be optimized. Therefore, it is possible to efficiently use the deposition source to improve productivity, and to lower the cost of the final product.

1 is a configuration diagram of a continuous substrate processing system according to an embodiment of the present invention;
2 is a schematic plan view of a speed buffer according to an embodiment of the present invention;
3 is a block diagram of a control system according to an embodiment of the present invention;
4 is an exemplary diagram of the speed controller shown in FIG. 3;
5 is a flowchart illustrating a speed buffer control method according to an embodiment of the present invention;
6 is a detailed flowchart illustrating a speed buffer control method according to an embodiment of the present invention;
7 is a flowchart illustrating an example of a time prediction process illustrated in FIG. 6;
8 is a flowchart illustrating a speed buffer control method according to another embodiment of the present invention;
9 is a flowchart illustrating a speed buffer control method according to another embodiment of the present invention;
10 and 11 illustrate a speed buffer control concept according to the present invention.

Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention in more detail.

In the accompanying drawings of the present invention, each block may represent a module containing one or more executable instructions for executing a particular logical function (s), or may represent a segment or a portion of code. In addition, in the implementation examples that may replace the present invention, the functions mentioned in the respective blocks may be executed in a different order. For example, it should be noted that two blocks shown in succession may be performed substantially concurrently, or may be performed in reverse order in alternative examples.

1 is a configuration diagram of a continuous substrate processing system according to an embodiment of the present invention.

Referring to FIG. 1, the continuous substrate processing system 10 according to an exemplary embodiment of the present invention may include an alignment chamber 101, a first speed buffer 103, a plurality of process chambers 105, and a second speed buffer ( 107, a detach chamber 109. Each of the chambers 101 to 109 transfers the substrates under the control of the control system 100 to perform substrate processing as desired.

Each chamber is controlled in a vacuum state and a gate may be provided between the chambers. The gate may be controlled to maintain an open state, but is not limited thereto. The gate may be controlled on / off under the control of the control system 100.

The substrate moving from the alignment chamber 101 to the detachment chamber 109 is transferred in a direction designated by substrate transfer units provided in each chamber. The substrate transfer part may be configured with, for example, a linear rail, a movable conveyor belt, a roller, or the like, and the substrate may be installed horizontally or vertically with respect to the ground.

Although not shown, the continuous substrate processing system 10 may further include a substrate loading chamber, a substrate unloading chamber, a mask stock, and the like.

When the substrate is guided from the substrate loading chamber to the alignment chamber 101, the alignment chamber 101 aligns the substrate with the mask.

The first speed buffer 103 guides the aligned substrate to the process chamber 105. In particular, the speed buffer 103 according to the present invention is controlled so that the interval between the starting substrate and the latter substrate has a desired interval, which will be described later with reference to FIG. 2.

The process chamber 105 is configured such that the plurality of units 105-1 to 105-n are arranged in a line. Each process unit 105-1-105-n discharges a source of a kind and amount as desired under the control of the control system 100 to deposit a target material on a substrate moving through the process chamber.

The second speed buffer 107 receives the completed substrate and provides the substrate to the detach chamber 109. The detach chamber 109 separates the mask from the substrate on which the process is completed. The separated mask is conveyed, cleaned and reused, and the substrate from which the mask is separated is transferred to the next process module.

The control system 100 can include a programmable microprocessor. Then, the control software stored in the memory is executed to control the overall operation of the continuous substrate processing. Specifically, power control, substrate transfer control, chamber temperature control, deposition source control, and the like, and an input device for receiving commands from the operator and an output device for monitoring the status of the continuous substrate processing system 10 It includes.

In addition, the control system 100 controls the gap between the substrates to have a desired gap when the aligned substrate is provided to the process chamber 105 through the first speed buffer 103.

As described above, since the substrate is transferred at a constant speed in the process chamber 105 so that a uniform and sufficient source is deposited on the substrate, the distance between the substrates is determined according to the substrate transfer speed of the speed buffer 103.

Therefore, the control system 100 of the present invention, when sensing the substrate loading into the first speed buffer 103, before the selection substrate fully enters the process chamber, the first speed so that the interval between the selection substrate and the late substrate has a target spacing. The substrate transfer speed of the buffer 103 is controlled.

2 is a schematic plan view of a speed buffer according to an embodiment of the present invention.

FIG. 2 shows a schematic plan view of a speed buffer, for example, a first speed buffer 103, wherein a plurality of rollers 1031 are equally spaced on both sidewalls of the buffer centering on the transport direction of the substrate A. FIG. You can see that it is installed.

The motor M and the driver D are electrically connected to each roller 1031. The driver D drives the motor M according to the control of the control system 100, and the power of the motor M rotates the roller 1031 through the power transmission shaft 1033 to process the substrate A. Proceeding to the chamber 105 side.

On the other hand, the first speed buffer 103 includes a plurality of sensors S1: S11, S13 (S2: S21, S23) (S3: S31, S33). The first sensor S1 is installed at the inlet of the first speed buffer 103 to sense the loading of the substrate A. The second sensor S2 is installed at a designated position in consideration of the length of the substrate A, and for example, may be provided at a position where the substrate A starts to be unloaded from the first speed buffer 103. The third sensor S3 is for detecting that the substrate A has completely removed the first speed buffer 103, and may be omitted. In this sense, the first sensor S1 may be referred to as a carry-in sensor, the second sensor S2 may be a start detection sensor, and the third sensor S3 may be referred to as a carry-out detection sensor. In addition, the first speed buffer 103 may further include a larger number of sensors in addition to the above-described first to third sensors, in which case the position of the substrate moving in the first speed buffer 103 in real time. Can be detected.

In FIG. 2, the individual rollers 1031 are illustrated as having motors M and drivers D, respectively, to show that each roller 1031 can be individually controlled, but is not limited thereto. . That is, the first speed buffer 103 divides the roller 1031 based on the second sensor S2, and simultaneously controls the first roller group by the first substrate transfer units 1035-1 and 1035-2. It is also possible to simultaneously control the second roller group by the second substrate transfer units 1037-1 and 1037-2.

When the substrate is loaded into the first speed buffer 103, it is sensed by the first sensor S1. Then, the control system 100 checks whether there is a substrate selected and moved from the loaded substrate, and controls the distance between the two substrates at a desired interval. To this end, the control system 100 accelerates the conveying speed of the substrate on which the loading is sensed, that is, the late substrate, so that the desired distance between the two substrates becomes the desired interval before the starting substrate completely leaves the first speed buffer 103. can do.

3 is a block diagram of a control system according to an embodiment of the present invention.

As shown in FIG. 3, the control system 100 includes a controller 110, a power control unit 120, a transfer control unit 130, a source control unit 140, a memory 150, a user interface (UI) 160, and the like. And a speed controller 170 for controlling substrate spacing in the speed buffer 103.

Controller 110 may be a microprocessor, which may be designed to be programmable.

The power control unit 120 controls the power of the continuous substrate processing apparatus 10, and the transfer control unit 130 moves the roller so that the substrate is transferred from the alignment chamber 101 to the detachment chamber 109 as the process starts. Control the motor and driver to drive.

The source controller 140 controls the type, quantity, and the like of the process source injected in the process chamber 105.

The memory 150 may store various applications, data, and the like necessary for operating the control system 100, and store control parameters and the like for substrate processing.

The user interface 160 includes an input unit 161 for receiving control commands, data, and the like from an operator, and an output unit 163 for providing an operator with processing status, progress status, and error status of the continuous substrate processing system 10. It includes.

As the speed controller 170 detects the fact that the substrate is loaded from the first sensor S1 into the first speed buffer 103, the speed controller 170 checks whether there is a substrate that is selected and moved from the imported substrate, and thus the distance between the two substrates is determined. Control at intervals. In particular, the speed controller 170 accelerates the transfer speed of the substrate on which the loading is sensed, that is, the late substrate, to control the interval between the two substrates before the first substrate completely exits the first speed buffer 103. can do.

4 is an exemplary diagram of the speed controller shown in FIG. 3.

Referring to FIG. 4, the speed controller 170 may include a sensor manager 171, a position detector 173, a calculator 175, a speed determiner 177, and a control signal generator 179.

The sensor manager 171 manages locations and identifiers for each of the plurality of sensors installed in the first speed buffer 103, and receives a detection signal transmitted from each sensor.

Based on the detection signal received by the sensor manager 171, the position detector 173 detects the position of each substrate carried in the first speed buffer 103. In a preferred embodiment of the present invention, the position of the starting substrate can be detected by the second sensor S2 described above, and the position of the latter substrate can be detected by the first sensor S1. In another embodiment of the present invention, the position detection unit 173 may detect the gap between the selection substrate and the late substrate at the time when the substrate loading into the first speed buffer 103 is detected. When the position of the starting substrate is detected by the second sensor S2 and the position of the latter board is detected by the first sensor S1, the feed speed V1 of the selection substrate, the first and second sensors S1. , The gap between the substrates can be detected based on the installation position of S2).

The calculator 175 predicts the position of the selection substrate. More specifically, the operation unit 175 is provided with a latent substrate detection signal by the sensor manager 171, and the position detection unit 173 detects the position of the selection substrate, so that the selection substrate is removed from the first speed buffer 103. Predict the remaining time until complete removal. In a preferred embodiment of the present invention, when the position of the selection substrate is detected by the second sensor S2, until the selection substrate is completely taken out based on the installation position of the second sensor S2 and the transfer speed of the selection substrate. The remaining time of the can be predicted.

The speed determiner 177 determines the transfer speed of the latex substrate so that the latex substrate may move to a desired position within the predicted remaining time, as the remaining time for the selection substrate is predicted by the calculator 175.

For example, assume that the starting substrate is being transferred at the speed of V1 and the remaining time is T _R. The latent substrate should be transferred to have a target spacing D _T with the starting substrate within the time of residual time T _R , preferably T _R −α. Here, α can be an offset necessary to complete the arrangement between the starting substrate and the late substrate at the target interval. The latent substrate should be transferred to a position having a target spacing D _T with the starting substrate at a time T _R −α, preferably T _R −β (β <α). If the position of the starting substrate after the T _R -β time can be represented by coordinates (X1, 0), the speed determiner 177 is configured such that the X-axis position of the latter substrate becomes (X1-D _T ) after the T _R -β time. The acceleration movement speed V2 can be determined.

In addition, the speed determining unit 177 changes the speed of the late board to the speed V1 of the starting board, that is, the equal interval holding speed, when the distance between the late board and the starting board reaches the target interval D _T.

The control signal generator 179 transmits the speed control signal to the driver of the roller which transfers the latex substrate in the first speed buffer 103 as the speed determining unit 177 determines the feed rate of the latex substrate.

Accordingly, when the substrate is loaded into the first speed buffer 103, before the selection substrate is completely taken out from the first speed buffer 103, the rear substrate is spaced so that the gap between the selection substrate and the late substrate has a target distance D _T. The speed of the substrate can be determined and transferred.

5 is a flowchart illustrating a speed buffer control method according to an embodiment of the present invention.

As substrate loading is sensed by the sensor manager 171 of the speed controller 170 to the first speed buffer 103 (S100), the operation unit 175 is configured to transfer the selection substrate that is being transferred before the substrate on which the loading is detected. The remaining time until it is completely taken out from the one speed buffer 103 is predicted (S200).

In addition, the speed determiner 177 determines the speed of the latex substrate such that the latex substrate has a target distance D _T with the starting substrate within the estimated remaining time, and transfers the control signal generated accordingly to the latex substrate. Transfer the latent substrate to the driver (S300).

Each step will be described in more detail with reference to FIG. 6 as follows.

6 is a detailed flowchart illustrating a speed buffer control method according to an embodiment of the present invention.

As the continuous substrate processing system 10 starts operation, the speed control unit 170 is in a standby state (S101). When the substrate manager is detected by the sensor manager 171 into the first speed buffer 103 in the standby state (S103), the position detector 173 determines whether a selection substrate exists according to the signal detected by the sensor manager 171. Check (S105).

At this time, when the selection substrate is not detected, that is, the substrate in which the detection is carried out is the substrate first brought into the first speed buffer 103 or the state where the selection substrate has already been carried out to the process chamber 105 is detected. The substrate is transferred at a specified speed (S107).

On the other hand, when the selection substrate is detected, the calculation unit 175 predicts the remaining time until the selection substrate is completely removed from the first speed buffer 103 (S200). In a preferred embodiment of the present invention, when the position of the selection substrate is detected by the second sensor S2, the selection substrate is completely based on the installation position of the second sensor S2 and the feeding speed V1 of the selection substrate. It is possible to predict the remaining time T _R until it is taken out.

After the residual time T _R for the starting substrate is predicted, the speed determiner 177 may accelerate the transfer speed V2 of the latter substrate in order to transfer the latter substrate to the target position within the estimated residual time T _R. ) Is determined (S301).

The control signal generator 179 transmits a control command according to the accelerated feed rate V2 of the latex substrate determined in step S301 to the corresponding driver, and accordingly, the roller is driven so as to retard at the accelerated feed rate V2 determined in step S301. The substrate is transferred (S303).

As a result, when the latter board and the first board have a target interval, the speed determining unit 177 changes the speed of the late board to the same speed V1 as the first board (S305).

Meanwhile, the step S200 of predicting the remaining time T _R for the selection substrate may be embodied as shown in FIG. 7.

FIG. 7 is a flowchart for explaining an example of the time prediction process illustrated in FIG. 6.

When the loading substrate is sensed by the first speed buffer 103 and the selection substrate exists, the calculation unit 175 calculates the remaining time T _R until the selection substrate is completely taken out from the first speed buffer 103. (S201).

In addition, the calculation unit 175 checks whether the latex substrate can be transferred to the target position, that is, the position having the target substrate and the target distance D _T within the calculated remaining time T _R , in consideration of the maximum feed speed of the roller. (S203).

If the transfer of the latex substrate is impossible within the remaining time, the speed determining unit 177 determines the transfer speed of the latex substrate as the preset speed V3, and if the transfer is possible, proceeds to step S300. In one embodiment of the present invention, the transfer speed of the latex substrate when the transfer of the latex substrate in the remaining time is not possible may be the reference speed Vref or the maximum feed speed Vmax of the roller, but is not limited thereto. Here, the reference speed Vref is the substrate transfer speed in the process chamber.

Meanwhile, in the flowchart shown in FIG. 6, another late substrate (hereinafter referred to as a second late substrate) may be introduced into the first speed buffer 103 while transferring the late substrate to the accelerated transfer speed V2. . Since the trailing substrate is being transferred at a predetermined acceleration transfer speed V2, and the trailing substrate being transferred to V2 will be the starting substrate on the side of the second trailing substrate, it is necessary to control the gap therebetween to be the target distance D _T. There is. This will be described with reference to FIG. 8 as follows.

8 is a flowchart illustrating a speed buffer control method according to another embodiment of the present invention.

In the state where the latex substrate is being transported at the speed of the accelerated feeding speed V2, the second latex substrate is formed before the speed of the latex substrate is changed at the equal interval holding speed V1, that is, between steps S303 and S305 of FIG. In the detected case (S401), the speed determiner 177 may control the second late substrate to be divided into the following three cases.

As a first embodiment, there may be mentioned a case where the second late substrate is controlled to simulate the speed of the late substrate (S411).

The latex substrate is transferred at the speed of V2 until it has a target distance D _T from the starting substrate, and is transferred at the speed of V1 from the point of time when the target distance D _T is reached. Therefore, the second late substrate can also be controlled at the same speed as the late substrate. However, it should be noted that the present embodiment can be applied to the case where the initial spacing between the starting substrate and the late substrate and the initial spacing between the late substrate and the second late substrate are the same.

As a second embodiment, the second late substrate is paused (S421), and step S200, that is, the calculation unit 175 predicts the remaining time until the late substrate is completely taken out of the first speed buffer 103. After proceeding to (S200), it may be to proceed to the subsequent process.

As a third embodiment, the position after the designated time DELTA t is predicted with respect to the late substrate being transferred to V2 (S431), and the late late substrate and the second late substrate are made to have a target spacing D _T after DELTA t. After determining the speed V4 of the second latex substrate, that is, the accelerated transfer speed of the second latex substrate (S433), the second latex substrate is transferred at the determined speed V4 (S435). At the same time, the second late substrate is transferred at a speed of V4, and the speed of the second late substrate is changed to the speed of the late substrate when the interval between the late substrate and the second late substrate reaches the target distance D _T ( S437).

Therefore, in the situation where the latex substrate is being transferred so as to have the target substrate D _T with the starting substrate, even if the second late substrate is detected, the distance between the late substrate and the second late substrate can be controlled to the desired interval D _T. .

Meanwhile, in another embodiment of the present invention, after the substrate loading into the first speed buffer 103 is sensed (S100), before the movement position of the selection substrate is predicted (S200), according to the distance between the selection substrate and the late substrate. The speed of the latex substrate can be controlled and described with reference to FIG. 9.

9 is a flowchart illustrating a speed buffer control method according to another embodiment of the present invention.

As the substrate loading into the first speed buffer 103 is sensed (S100), the position detector 173 based on the sensing position and the moving speed V1 of the starting substrate and the sensing position of the late board, the starting substrate and the late board. The interval between the two is detected (S501).

Then, the relationship between the detected distance between the two substrates and the target distance (D _T ) is checked (S503). If the detection interval is larger than the target distance (D _T ), the process proceeds to step S200 to continue the subsequent process. .

On the other hand, if the detection interval is the same as the target interval (D _T ) (S505) it is notified to the speed determining unit 177 so that the late substrate is transferred at the speed of the selection substrate (S507).

If not, that is, when the detection interval is narrower than the target interval (D _T ), it is reported to the speed determining unit 177 to stop the transfer of the latex substrate for a preset time, and then to the transfer speed of the starting substrate. The late substrate is transferred (S509).

10 and 11 illustrate a speed buffer control concept according to the present invention.

It is assumed that after the first substrate A1 in which the alignment is completed in the alignment chamber 101 is provided to the first speed buffer 103, it is located in the speed buffer 103 as in the time point T1. At this point, it is assumed that the alignment of the second substrate A2 in which the alignment is completed in the alignment chamber 101 starts into the speed buffer 103. In addition, let the conveyance speed of the 1st board | substrate A1 be V1.

Input of the second substrate A2 is sensed by the first sensor S1, and the speed controller 170 allows the selection substrate, that is, the first substrate A1, to be completely taken out of the speed buffer 103 to process the process chamber 105. Estimate the remaining time before import into In addition, the accelerated transfer speed V2 of the second substrate A2 is determined such that the second substrate A2 and the first substrate A1 have a target distance D _T within the remaining time.

Accordingly, it can be seen that the second substrate A2 is transferred at the accelerated feed rate V2, and the first substrate A1 and the distance D1> D _T are narrowed at the time point T2.

It is understood that the second substrate A2 is continuously conveyed at the accelerated feed rate V2, and the distance D2, D1>D2> D _T with the first substrate A1, which is the selection substrate, is further narrowed at the time point T3. have.

At a time point T4, the first substrate A1 and the second substrate A2 eventually have a target spacing D _T , and from this point on, the second substrate A2 transfers the speed V1 of the first substrate A1. It is fed at the same speed as).

In this way, the first substrate A1 and the second substrate A2 are carried out to the process chamber 105 while maintaining the same interval.

In this case, as shown in FIG. 11, another third substrate A3 may be aligned in the alignment chamber 101 and transferred to the speed buffer 103 (time T5).

Also in this case, the transfer speed of the third substrate A3 is determined according to the remaining time until the second substrate A2 is completely taken out of the speed buffer 103, and the third substrate A3 is subjected to the acceleration transfer speed ( Transfer to V4). Therefore, the second substrate A2 and the third substrate A3 have a distance D3> D _T at the time point T6, and the second and the second time points at the time T7 as the acceleration to the third substrate A3 continues. The spacing D4, D3>D4> D _T between the three substrates A2 and A3 is further narrowed, and the second substrate A2 and the third substrate A3 have a target spacing D _T at the time point T8. Able to know.

As described above, according to the present invention, the selection substrate and the late substrate are detected using the sensors S1 and S2 of the speed buffer 103. Then, before the starting substrate is completely taken out of the speed buffer 103, the accelerated feeding speed with respect to the starting substrate is determined so that the starting substrate has a target distance D _T from the starting substrate, and accordingly, the rotation speed of the starting substrate feeding roller is determined. To control the late substrate. In addition, from the time point when the starting substrate and the latter substrate have a target distance D _T , the rotation speed of the latter substrate feeding roller is controlled so that the feeding speed of the latter substrate is the same as that of the starting substrate. Therefore, the starting substrate and the late substrate may be transferred to the process chamber 105 while maintaining the target distance D _T.

On the other hand, in the above, the case where the speed of the late board | substrate with respect to a selection board | substrate was controlled regardless of the height of a loading buffer gate and a carrying gate of a speed buffer was demonstrated.

As an example of the present invention, the speed buffer may be provided with a loading gate at a position of a first height and a carrying gate at a position of a second height lower than the first height. In this case, the substrate provided from the alignment chamber to the loading gate can be lowered by the lifting means. The lifting means may be a cylinder for lifting and lowering the roller itself, or may be a cylinder having a pin for holding a substrate.

Those skilled in the art to which the present invention described above belongs will appreciate that the present invention can be implemented in other specific forms without changing the technical spirit or essential features. Therefore, the above-described embodiments are to be understood as illustrative in all respects and not as restrictive. The scope of the present invention is shown by the following claims rather than the detailed description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included in the scope of the present invention. do.

10: continuous substrate processing system
100: control system
101: alignment chamber
103: first speed buffer
105: process chamber
107: second speed buffer
109: Detach Chamber
1031: Roller
1033 power transmission shaft
S1 (S11, S13), S2 (S21, S23), S3 (S31, S33): Sensor
M: motor
D: Driver
A: Substrate
1035-1, 1035-2: first substrate transfer part
1037-1, 1037-2: second substrate transfer part

Claims (14)

delete delete As a speed buffer to be carried out by adjusting the interval between the starting substrate and the second substrate is carried in the first speed and the second speed, respectively, to the target interval,
A speed controller configured to independently control the first speed and the second speed so that the gap between the starting substrate and the late substrate is the target interval within the speed buffer;
A first substrate transfer unit configured to transfer the selected substrate at the first speed in the speed buffer under the control of the speed controller; And
And a second substrate transfer unit configured to transfer the latex substrate at the second speed into the speed buffer under the control of the speed controller.
Further comprising a sensor for detecting the position of the starting substrate and the second substrate in the speed buffer,
The speed control unit,
Controlling the first speed and the second speed based on the positions of the starting substrate and the second substrate detected by the sensor,
A calculation unit for predicting the remaining time until the starting substrate is taken out of the speed buffer based on the first speed and positions of the starting substrate and the late substrate detected by the sensor,
The speed control unit
And controlling the first speed and the second speed so that the interval between the starting substrate and the latter substrate has the target interval within the speed buffer within the remaining time predicted by the calculating unit.
The method of claim 3, wherein
Based on the position of the starting substrate and the latent substrate detected by the sensor, further comprising a position detection unit for detecting the gap between the starting substrate and the late substrate in the speed buffer,
The speed control unit,
And controlling the first speed and the second speed based on the distance between the starting substrate and the late substrate detected by the position detecting unit.
The method of claim 4, wherein
The speed control unit,
And the second speed is controlled such that the feeding speed of the latex substrate is decelerated if the gap between the starting substrate and the latex substrate detected by the position detection unit is smaller than the target interval.
The method of claim 4, wherein
The speed control unit,
And the second speed is controlled so that the feeding speed of the latex substrate is accelerated if the gap between the starting substrate and the latex substrate detected by the position detector is greater than the target interval.
The method of claim 4, wherein
The speed control unit,
And the second speed is controlled so that the feed rate of the latex substrate is the same as the feed rate of the first substrate when the interval between the starting substrate and the latter substrate detected by the position detector is equal to the target interval. Speed buffer. A speed buffer included in a substrate processing system in which a plurality of chambers are arranged in a row and sequentially pass through the plurality of chambers, and a process is continuously performed on a substrate having the same size and shape.
The speed buffer includes a speed chamber; A second substrate transfer part which transfers the substrate loaded into the speed chamber at a second speed; A first substrate transfer part configured to transfer the substrate having passed through the second substrate transfer part at a first speed; And a speed controller configured to control the first speed and the second speed such that a gap between the selection substrate transferred by the first substrate transfer unit and the selection substrate transferred by the second substrate transfer unit has a predetermined target interval. ,
After adjusting the interval between the starting substrate transferred by the first substrate transfer unit and the late substrate transferred by the second substrate transfer unit to the target interval in the speed chamber, and transported out of the speed chamber,
The second substrate transfer part is disposed at a position where the substrate is loaded into the speed chamber based on the moving direction of the substrate, and the first substrate transfer part is adjacent to the second substrate transfer part and moves outward from the speed chamber. Is placed in the discharged position,
Each of the first substrate transfer unit and the second substrate transfer unit may include a plurality of rollers installed on both side walls of the speed chamber to transfer the substrate by rotation.
And the rollers are electrically connected to a driver controlling the motor by a motor and a control system for driving the rollers.
The method of claim 8,
A sensor for detecting a substrate position of each of the substrates transported by the first substrate transporter and the substrate transported by the second substrate transporter,
The speed control unit,
Controlling the first speed and the second speed based on a substrate position of each of the substrates transferred by the first substrate transfer unit and the substrates transferred by the second substrate transfer unit detected by the sensor. buffer.
The method of claim 9,
The substrate is transferred by the second substrate transfer unit based on the first speed and the substrate position of each substrate transferred by the first substrate transfer unit detected by the sensor and the substrate transferred by the second substrate transfer unit. Including an operation unit for predicting the remaining time until the substrate is taken out,
The speed control unit
Within the remaining time predicted by the calculating unit, the first speed and the second speed such that an interval between the substrate transferred by the first substrate transfer unit and the substrate transferred by the second substrate transfer unit has the target interval. Speed buffer, characterized in that for controlling.
The method of claim 10,
The substrate transferred by the first substrate transfer part therein and the first substrate based on the substrate position of each of the substrate transferred by the first substrate transfer part and the substrate transferred by the second substrate transfer part detected by the sensor. 2 includes a position detection unit for detecting a gap between the substrates transferred by the substrate transfer unit,
The speed control unit,
Controlling the first speed and the second speed based on a distance between the substrate transferred by the first substrate transfer unit and the substrate transferred by the second substrate transfer unit detected by the position detector. buffer.
The method of claim 11,
The speed control unit,
And controlling the second speed to be reduced if the distance between the substrate transferred by the first substrate transfer unit detected by the position detector and the substrate transferred by the second substrate transfer unit is smaller than the target interval. Speed buffer.
The method of claim 11,
The speed control unit,
And controlling the second speed to be increased if the distance between the substrate transferred by the first substrate transfer unit detected by the position detector and the substrate transferred by the second substrate transfer unit is greater than the target interval. Speed buffer.
The method of claim 11,
The speed control unit,
The second speed is controlled to be equal to the first speed when the distance between the substrate transferred by the position detection unit and the substrate transferred by the second substrate transfer unit is equal to the target interval. Speed buffer characterized by the above-mentioned.

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