KR102077774B1 - Apparatus and method for measuring the chip resistance and thickness - Google Patents

Apparatus and method for measuring the chip resistance and thickness Download PDF

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KR102077774B1
KR102077774B1 KR1020180153358A KR20180153358A KR102077774B1 KR 102077774 B1 KR102077774 B1 KR 102077774B1 KR 1020180153358 A KR1020180153358 A KR 1020180153358A KR 20180153358 A KR20180153358 A KR 20180153358A KR 102077774 B1 KR102077774 B1 KR 102077774B1
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resistance
chip
measuring
target
ltcc
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KR1020180153358A
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Korean (ko)
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권오형
양승민
김건희
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한국생산기술연구원
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D21/00—Measuring or testing not otherwise provided for
    • G01D21/02—Measuring two or more variables by means not covered by a single other subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
    • G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
    • G01D5/20—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying inductance, e.g. by a movable armature
    • G01D5/22—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying inductance, e.g. by a movable armature differentially influencing two coils
    • G01D5/2291—Linear or rotary variable differential transformers (LVDTs/RVDTs) having a single primary coil and two secondary coils
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant

Abstract

The present invention relates to a device for measuring a chip for hemodiagnosis and a measuring method using the same and, specifically, to a device and a method for measuring the resistance and thickness of a chip for hemodiagnosis at the same time by using an LVDT sensor. To achieve the purpose of the present invention, the device for measuring the thickness and resistance of a chip for a hemodiagnosis includes: a resistance measuring unit including a resistance measuring pin and disposed for a target LTCC chip to be mounted thereon; and an LVDT sensor moving in the vertical direction of the target LTCC chip and formed to compress and decompress the upper part of the target LTCC chip. Also, according to the present invention, the method for measuring the resistance and thickness of a chip for hemodiagnosis includes: a step of mounting the target LTCC chip on the upper end of the resistance measuring unit; a step of arranging the LVDT sensor in the upper part of the target LTCC chip mounted; a step of compressing the upper part of the target LTCC chip with the LVDT sensor; and a step of measuring the resistance and thickness of the target LTCC chip.

Description

혈액진단용 칩 저항 및 두께 측정장치 및 이를 이용한 측정방법{APPARATUS AND METHOD FOR MEASURING THE CHIP RESISTANCE AND THICKNESS} Blood resistance chip resistance and thickness measuring device and measuring method using same {APPARATUS AND METHOD FOR MEASURING THE CHIP RESISTANCE AND THICKNESS}

본 발명은 혈액진단용 칩 측정장치 및 측정방법에 관한 것으로, 상세하게는 LVDT센서를 통하여 혈액진단용 칩의 저항 및 두께를 동시에 측정하는 장치 및 이를 이용한 측정방법에 관한 것이다.The present invention relates to a blood diagnostic chip measuring apparatus and a measuring method, and more particularly, to a device for simultaneously measuring the resistance and thickness of the blood diagnostic chip through the LVDT sensor and a measuring method using the same.

LTCC(Low Temperature Co-fired Ceramic: 저온동시소성 세라믹)는 저온에서 금속과 그 세라믹 기판이 동시에 만들어지는 공정기술과 그 결과물을 지칭하는 것으로서 LTCC기술은 전자 패키징에 대한 모듈과 기판 특히, 무선 또는 마이크로파 응용부품을 개발하는데 매우 중요하다. LTCC기술은 금 혹은 은과 같은 전도성이 우수하고 산화 분위기에서도 소성이 가능한 전도성 금속을 사용할 수 있다는 장점으로 인해 저항, 커패시터, 인덕터 등의 다양한 수동 소자를 구현하여 적용되고 있다. 또한, LTCC 기술은 히터, 온도센서, 챔버 등으로 패키징되어 하나의 칩으로 사용된다.Low Temperature Co-fired Ceramic (LTCC) refers to a process technology and the result of simultaneous metal and its ceramic substrates being made at low temperatures. LTCC technology refers to modules and substrates for electronic packaging, especially wireless or microwave It is very important for developing application parts. LTCC technology is implemented by implementing various passive devices such as resistors, capacitors, and inductors due to the advantage of using a conductive metal such as gold or silver that can be baked in an oxidizing atmosphere. In addition, LTCC technology is packaged into a heater, temperature sensor, chamber, etc. and used as a single chip.

한편, 도 1은 종래의 혈액진단용 칩 저항 측정장치를 나타내는 도면이고, 도 2는 종래의 혈액진단용 칩 두께 측정장치를 나타내는 도면이다.On the other hand, Figure 1 is a view showing a conventional blood diagnostic chip resistance measuring device, Figure 2 is a view showing a conventional blood diagnostic chip thickness measuring device.

도 1의 종래의 혈액진단용 칩 저항 측정장치는 칩(100) 및 저항 측정부(110)를 포함하며, 도 2의 혈액진단용 칩 저항 측정장치는 칩(2O0) 및 레이저 센서(210)을 포함한다.The conventional blood diagnosing chip resistance measuring apparatus of FIG. 1 includes a chip 100 and a resistance measuring unit 110, and the blood diagnosing chip resistance measuring apparatus of FIG. 2 includes a chip 20 and a laser sensor 210. .

대상 LTCC 칩(100, 200)은 혈액진단용으로 많이 쓰이는 세라믹 칩으로 혈액진단용 LTCC 칩을 포함하며, LTCC 칩은 챔버, 히터, 온도센서 등으로 패키징되어 형성된다.혈액진단용 LTCC 칩은 중합효소 연쇄반응(PCR; Polymerase chain reaction)을 일으키는 부품으로, 중합효소 연쇄반응(PCR; Polymerase chain reaction)은 분자생물학 기술의 하나로 핵산 분자를 생체 내에서 증폭시키는 것으로 열에 약하다는 단점을 가지고 있다.The target LTCC chips 100 and 200 are ceramic chips that are frequently used for blood diagnosis, and include a blood diagnostic LTCC chip, and the LTCC chip is packaged and formed by a chamber, a heater, a temperature sensor, and the like. Polymerase chain reaction (PCR) is a component that causes polymerase chain reaction (PCR), which is one of molecular biology techniques.

대상 LTCC 칩(100, 200)에 내장된 히터를 이용하여 용액의 특정 온도를 정확하게 제어하고, DNA의 정확한 증폭을 통하여 단점을 보완하였다. 특정 온도를 제어하기 위해서는 칩 내부에 위치하는 저항을 정확하게 측정하는 것이 중요하다.  The heaters embedded in the target LTCC chips 100 and 200 were used to precisely control the specific temperature of the solution and to compensate for the shortcomings by accurately amplifying DNA. To control a specific temperature, it is important to accurately measure the resistance located inside the chip.

저항측정부(110)는 대상 LTCC 칩(100, 200)과의 접촉하는 방식으로 저항을 측정하였으며, 압력을 가하는 역할을 하는 저항측정부(110)가 존재하지 않는 경우, 측정 오차가 발생하여 온도의 제어가 정확하게 발생하지 않는다는 문제가 발생하였다.The resistance measuring unit 110 measures the resistance by contacting the target LTCC chips 100 and 200, and when there is no resistance measuring unit 110 that applies a pressure, a measurement error occurs to generate a temperature. A problem arises that control of does not occur correctly.

레이저 센서(211)는 대상 LTCC 칩(200)의 상부에 위치하는 두께 측정부(210)에 장착되어 대상 LTCC 칩(200)의 두께(변위)를 측정하는 역할을 한다. 종래의 레이저 센서(211)는 빠른 처리 속도를 보이고 있으나, 두께 측정부(210)의 진동에 취약하다는 문제가 발생한다.The laser sensor 211 is mounted on the thickness measuring unit 210 positioned above the target LTCC chip 200 to measure the thickness (displacement) of the target LTCC chip 200. Although the conventional laser sensor 211 shows a high processing speed, a problem arises that it is vulnerable to vibration of the thickness measuring unit 210.

또한, 저항 측정부 및 두께 측정부가 구비된 볼피더부를 사용하는 경우, 저항 및 두께의 동시 측정이 가능하지만 하나의 프레임에 연결되어 두께 측정에서 오차가 발생한다. In addition, in the case of using a ball feeder provided with a resistance measuring unit and a thickness measuring unit, simultaneous measurement of resistance and thickness is possible, but an error occurs in thickness measurement by being connected to one frame.

본 발명은 상기와 같은 문제점을 해결하기 위해 창안된 것으로, 본 발명의 목적은 저항을 측정하여 칩에 내장된 히터를 정확하게 제어하는 혈액진단용 칩 저항 및 두께 측정장치 및 이를 이용한 측정방법을 제공하는데 있다.The present invention was devised to solve the above problems, and an object of the present invention is to provide a blood diagnostic chip resistance and thickness measuring device for accurately controlling a heater embedded in a chip and a measuring method using the same. .

본 발명의 다른 목적은, 시스템에 장착되어 동작하는 칩의 외형 두께를 측정하여 칩의 품질을 향상시키는 혈액진단용 칩 저항 및 두께 측정장치 및 이를 이용한 측정방법을 제공하는데 있다.Another object of the present invention is to provide a blood diagnostic chip resistance and thickness measuring apparatus for improving the quality of the chip by measuring the outer thickness of the chip mounted and operated in the system and a measuring method using the same.

본 발명의 다른 목적은, 혈액진단용 칩의 저항 및 두께를 동시에 측정하는 혈액진단용 칩 저항 및 두께 측정장치 및 이를 이용한 측정방법을 제공하는데 있다.Another object of the present invention is to provide a blood diagnostic chip resistance and thickness measuring apparatus for simultaneously measuring the resistance and thickness of the blood diagnostic chip and a measuring method using the same.

본 발명의 다른 목적은, 진동의 영향을 감소시켜 저항 및 두께의 오차를 감소시키는 혈액진단용 칩 저항 및 두께 측정장치 및 이를 이용한 측정방법을 제공하는데 있다Another object of the present invention is to provide a blood diagnostic chip resistance and thickness measuring apparatus and a measuring method using the same for reducing the effects of vibration to reduce the resistance and thickness error.

이를 위하여, 본 발명에 따른 혈액진단용 칩 저항 및 두께 측정장치는 저항측정 핀을 구비하고, 대상 LTCC 칩이 안착될 수 있게 배치되는 저항측정부와, 상기 대상 LTCC 칩의 수직방향으로 이동하며, 상기 대상 LTCC 칩의 상부를 가감압하도록 형성되는 LVDT센서를 포함한다.To this end, the blood resistance chip resistance and thickness measuring apparatus according to the present invention includes a resistance measuring pin having a resistance measuring pin and disposed so that the target LTCC chip is seated, and moving in the vertical direction of the target LTCC chip. And an LVDT sensor configured to pressurize and depress the upper part of the target LTCC chip.

실시 예에 있어서, 상기 LVDT센서는내부 중앙에 위치하고, 길이방향으로 직선운동하는 코어와, 상기 코어와 이격되어 상기 코어의 외면을 감싸는 복수의 코일과, 최외각에 위치하여 상기 대상 LTCC 칩을 가압하는 외각지지대를 포함하는 것을 특징으로 한다.The LVDT sensor may include a core positioned at an inner center, linearly moving in a longitudinal direction, a plurality of coils spaced apart from the core and surrounding the outer surface of the core, and positioned at an outermost position to press the target LTCC chip. It characterized in that it comprises an outer support.

실시 예에 있어서, 상기 코어는 상기 코일의 내부에서 길이방향으로 직선운동하며 발생하는 자기장을 통하여 상기 대상 LTCC 칩의 두께를 측정하는 것을 특징으로 한다.In an embodiment, the core may measure the thickness of the target LTCC chip through a magnetic field generated by linearly moving in the longitudinal direction of the coil.

실시 예에 있어서, 상기 저항 측정부는 상기 저항측정 핀으로 상기 가압된 대상 LTCC 칩의 저항을 측정하는 것을 특징으로 한다.The resistance measuring unit may measure the resistance of the pressed LTCC chip with the resistance measuring pin.

실시 예에 있어서, 상기 LVDT센서는 세라믹으로 형성되는 것을 특징으로 한다.In an embodiment, the LVDT sensor is formed of a ceramic.

또한, 혈액진단용 칩 저항 및 두께 측정방법은 저항 측정부의 상단에 대상 LTCC 칩을 안착하는 단계와, 상기 안착되는 대상 LTCC 칩의 상부에 LVDT센서를 배치하는 단계와, 상기 LVDT센서로 상기 대상 LTCC 칩의 상부를 가압하는 단계와, 상기 대상 LTCC 칩의 두께 및 저항을 측정하는 단계를 포함한다.In addition, the method for measuring the resistance and thickness of the chip for diagnosing blood may include mounting a target LTCC chip on an upper end of a resistance measuring unit, arranging an LVDT sensor on an upper portion of the target LTCC chip to be seated, and using the LVDT sensor, the target LTCC chip. Pressing the upper portion of the, and measuring the thickness and resistance of the target LTCC chip.

실시 예에 있어서, 상기 대상 칩의 두께 및 저항을 측정하는 단계는 상기 LVDT센서의 내부에서 코어를 길이방향으로 직선운동하며 발생하는 자기장으로 두께를 측정하는 단계와, 상기 대상 LTCC 칩과 상기 저항 측정부의 저항측정 핀을 접촉시켜 저항을 측정하는 단계를 포함한다.The measuring of the thickness and resistance of the target chip may include measuring the thickness with a magnetic field generated by linearly moving the core in the longitudinal direction of the LVDT sensor, and measuring the target LTCC chip and the resistance. Measuring a resistance by contacting the negative resistance measurement pin.

상술한 바와 같이, 본 발명에 따른 혈액진단용 칩 저항 및 두께 측정장치 및 이를 이용한 측정방법은 상기와 같은 문제점을 해결하기 위해 창안된 것으로, 본 발명의 목적은 저항을 측정하여 칩에 내장된 히터를 정확하게 제어할 수 있다.As described above, the blood diagnostic chip resistance and thickness measuring apparatus according to the present invention and a measuring method using the same have been devised to solve the above problems, an object of the present invention is to measure the resistance to the heater built in the chip Precise control.

본 발명에 따른 혈액진단용 칩 저항 및 두께 측정장치 및 이를 이용한 측정방법은 단독으로 사용되는 것이 아닌 시스템에 장착되어 동작하는 칩의 특성에 따라 외형 두께를 측정하여 칩의 품질을 향상시킬 수 있다.Blood resistance chip resistance and thickness measuring apparatus and a measuring method using the same according to the present invention can improve the quality of the chip by measuring the outer thickness in accordance with the characteristics of the chip operating in the system is not used alone.

본 발명에 따른 혈액진단용 칩 저항 및 두께 측정장치 및 이를 이용한 측정방법은 LVDT센서를 통하여 칩의 저항 및 두께를 측장할 수 있다.Blood resistance chip resistance and thickness measuring apparatus according to the present invention and the measuring method using the same can measure the resistance and thickness of the chip through the LVDT sensor.

본 발명에 따른 혈액진단용 칩 저항 및 두께 측정장치 및 이를 이용한 측정방법은 진동의 영향을 감소시켜 저항 및 두께의 오차를 감소시킬 수 있다.Blood diagnostic chip resistance and thickness measuring apparatus and a measuring method using the same according to the present invention can reduce the effect of vibration to reduce the error of resistance and thickness.

도 1은 종래의 혈액진단용 칩 저항 측정장치를 나타내는 도면.
도 2는 종래의 혈액진단용 칩 두께 측정장치를 나타내는 도면.
도 3 및 도 4는 본 발명에 따른 혈액진단용 칩 저항 및 두께 측정장치를 나타내는 도면.
도 5는 도 3 및 도 4에 따른 혈액진단용 칩 저항 및 두께 측정장치에서 LVDT 센서를 구체적으로 나타내는 도면.
도 6는 본 발명에 따른 혈액진단용 칩 저항 및 두께를 측정하는 방법을 나타내는 블록도.1 is a view showing a conventional blood diagnostic chip resistance measuring apparatus.
2 is a view showing a conventional blood diagnostic chip thickness measuring apparatus.
3 and 4 is a view showing a blood diagnostic chip resistance and thickness measuring apparatus according to the present invention.
5 is a view specifically showing the LVDT sensor in the blood diagnostic chip resistance and thickness measuring apparatus according to FIGS. 3 and 4.
Figure 6 is a block diagram showing a method for measuring the blood resistance chip resistance and thickness according to the present invention.

이하, 첨부된 도면을 참조하여 본 발명에 따른 실시 예를 상세하게 설명한다. 본 발명은 여러 가지 상이한 형태로 구현될 수 있으며, 따라서 여기에서 설명하는 실시예로 한정되는 것은 아니다. 본 발명의 구성 및 그에 따른 작용 효과는 이하의 상세한 설명을 통해 명확히 이해될 것이다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. The configuration of the present invention and the resulting effects thereof will be clearly understood through the following detailed description.

도 3은 및 도 4는 본 발명에 따른 혈액진단용 칩 저항 및 두께 측정장치를 나타내는 도면이다.3 and 4 is a view showing a blood diagnostic chip resistance and thickness measuring apparatus according to the present invention.

구체적으로, 도 3은 대상 LTCC 칩(300)의 상부에서 수직방향으로 이동하는 LVDT센서(310)를 나타내는 도면이고, 도 4는 LVDT센서(410)가 가압되어 대상 LTCC 칩(400)과 접촉되는 LVDT센서(410) 및 저항측정 핀(422)을 나타내는 도면이다.Specifically, FIG. 3 is a view showing the LVDT sensor 310 moving vertically from the top of the target LTCC chip 300, Figure 4 is the LVDT sensor 410 is pressed is in contact with the target LTCC chip 400 The LVDT sensor 410 and the resistance measurement pin 422 are shown.

도 3 및 도 4를 참조하면, 본 발명에 따른 혈액진단용 칩 저항 및 두께 측정장치는 대상 LTCC 칩(300, 400), LVDT센서(310, 410) 및 저항측정부(320, 420) 및 저항측정 핀(322, 422)를 포함한다.3 and 4, the blood resistance chip resistance and thickness measurement apparatus according to the present invention includes a target LTCC chip 300 and 400, an LVDT sensor 310 and 410, and a resistance measurement unit 320 and 420 and a resistance measurement. Pins 322, 422.

대상 LTCC 칩(300, 400)은 혈액진단용 LTCC 칩을 포함하며, 여기에서 LTCC는 저온동시소성 세라믹(Low Temperature Cofired Ceramics) 기술로 수동소자의 소형화 및 성능을 향상시키는 기술이다. LTCC 칩은 히터, 챔버, 온도센서와 같이 패키징 되어 형성된다.The target LTCC chips 300 and 400 include LTCC chips for diagnosing blood, in which LTCC is a technology for miniaturizing and improving performance of passive devices by using low temperature cofired ceramics technology. LTCC chips are packaged together with heaters, chambers and temperature sensors.

이와 같은 과정으로 형성되는 대상 LTCC 칩(300, 400)은 내장된 히터를 통하여 환자의 DNA혈액속에 존재하는 DNA의 특정 부분을 증폭시켜 DNA 조각을 분리하고, 환자를 진단하는 역할을 한다.The target LTCC chips 300 and 400 formed by the above process amplify a specific portion of the DNA present in the DNA blood of the patient through a built-in heater to separate the DNA fragment and diagnose the patient.

LVDT센서(310, 410)는 저항측정부(320, 420)에 안착된 대상 LTCC 칩(300, 400)의 상부에 존재한다. 도 3의 LVDT센서(310)는 대상 LTCC 칩(300)의 상부에서 수직 방향으로 이동하는 구조를 나타내고, 도 4의 LVDT센서(410)는 대상 칩(400)을 가압하여 접촉하는 구조를 나타낸다. The LVDT sensors 310 and 410 are present on the target LTCC chips 300 and 400 mounted on the resistance measuring units 320 and 420. The LVDT sensor 310 of FIG. 3 shows a structure of moving in the vertical direction from the top of the target LTCC chip 300, and the LVDT sensor 410 of FIG. 4 shows a structure of pressing and contacting the target chip 400. FIG.

먼저, 도 3의 LVDT센서(310)는 수직방향으로 이동하며, 대상 LTCC 칩(300)의 상부와의 비접촉 형태이다. 대상 LTCC 칩(300)이 감압되는 경우, 대상 LTCC 칩(300), LVDT센서(310) 및 저항측정 핀(322)은 도 3과 같이 비접촉 형태로, 각각 독립적으로 존재한다.First, the LVDT sensor 310 of FIG. 3 moves in the vertical direction and is in a non-contact form with the upper portion of the target LTCC chip 300. When the target LTCC chip 300 is depressurized, the target LTCC chip 300, the LVDT sensor 310, and the resistance measuring pin 322 are each in a non-contact form as shown in FIG. 3.

다음으로, 도 4의 LVDT센서(410)는 대상 LTCC 칩(400)을 가압하는 형태이다. 대상 LTCC 칩(400)이 가압되는 경우, 대상 LTCC 칩(400), LVDT센서(410) 및 저항측정 핀(422)은 도 4와 같이 접촉하는 형태이다. 구체적으로, 접촉하는 경우, LVDT(410)센서를 통하여 LTCC 칩(400)의 두께(변위)를 측정하고, 저항측정 핀(422)를 통하여 저항을 측정한다.Next, the LVDT sensor 410 of FIG. 4 presses the target LTCC chip 400. When the target LTCC chip 400 is pressed, the target LTCC chip 400, the LVDT sensor 410, and the resistance measuring pin 422 are in contact as shown in FIG. 4. Specifically, when contacting, the thickness (displacement) of the LTCC chip 400 is measured through the LVDT 410 sensor, and the resistance is measured through the resistance measuring pin 422.

저항 측정부(320, 420)는 대상 LTCC 칩(300, 400)이 안착될 수 있게 배치되며, LVDT센서(310, 410)의 압력에 따라 대상 LTCC 칩(300, 400)과 접촉 및 비접촉의 구조를 형성한다.The resistance measuring units 320 and 420 may be disposed to allow the target LTCC chips 300 and 400 to be seated thereon, and may be in contact or non-contact structure with the target LTCC chips 300 and 400 according to the pressure of the LVDT sensors 310 and 410. To form.

또한, 저항측정부(320, 420)는 저항측정 핀(322, 422)을 구비하고, 저항측정 핀(322, 422)은 대상 LTCC 칩(300)과 일정한 간격만큼 이격되어 배치된다. 이격된 대상 LTCC 칩(400)은 LVDT센서(410)에서 가해진 압력으로 저항측정 핀(422)과 접촉하여 저항을 측정한다.In addition, the resistance measuring units 320 and 420 include resistance measuring pins 322 and 422, and the resistance measuring pins 322 and 422 are spaced apart from the target LTCC chip 300 by a predetermined interval. The spaced target LTCC chip 400 contacts the resistance measuring pin 422 with the pressure applied by the LVDT sensor 410 to measure resistance.

저항측정부(320, 420)는 회로가 장착된 모듈 및 저항 측정기 등의 접촉을 통하여 저항의 측정이 가능한 기기를 포함한다.The resistance measuring units 320 and 420 include a device capable of measuring resistance through contact with a module equipped with a circuit and a resistance meter.

도 5는 도 3 및 도 4에 따른 혈액진단용 칩 저항 및 두께 측정장치에서 LVDT 센서(310, 410)를 구체적으로 나타내는 도면이다.5 is a view illustrating in detail the LVDT sensors 310 and 410 in the blood diagnostic chip resistance and thickness measurement apparatus according to FIGS. 3 and 4.

LVDT센서(510)은 복수의 코일(514) 및 코어(516)사이에 실질적인 접촉 없이 발생하는 자기장에 따라 대상 LTCC 칩의 두께를 측정하며, 재질은 강도, 내부식성, 습도 등에 우수한 세라믹을 포함한다.The LVDT sensor 510 measures the thickness of the target LTCC chip according to a magnetic field generated without substantial contact between the plurality of coils 514 and the core 516. The material includes a ceramic having excellent strength, corrosion resistance, humidity, and the like. .

도 5를 참조하면, LVDT센서(510)는 외각지지대(512), 복수의 코일(514) 및 코어(516)을 포함한다.Referring to FIG. 5, the LVDT sensor 510 includes an outer support 512, a plurality of coils 514, and a core 516.

외각 지지대(512)는 LVDT센서(510)의 최외각에 위치하여, 대상 LTCC 칩(300, 400)을 누르면서 저항을 측정하도록 저항측정 핀(322, 422)에 접촉시킨다. The outer support 512 is located at the outermost position of the LVDT sensor 510 and contacts the resistance measuring pins 322 and 422 to measure the resistance while pressing the target LTCC chips 300 and 400.

도 3 및 도 4에서는 LVDT센서(310, 410)의 수직이동으로 대상 LTCC 칩(300) 가압한다고 설명하지만 구체적으로 LVDT센서(510)의 구조를 살펴보면, 외각지지대(514)를 통하여 대상 LTCC 칩을 가압한다고 설명된다.In FIGS. 3 and 4, the target LTCC chip 300 is pressed by vertical movement of the LVDT sensors 310 and 410. Specifically, referring to the structure of the LVDT sensor 510, the target LTCC chip is connected through the outer support 514. It is explained that it is pressurized.

코일(514)은 코어(516)와 이격되고, 코어(516)의 외면을 감싸는 형태로 형성된다. 본 발명에서 코일(514)은 3개로 설명되었으나, 2개 이상의 복수 개로 형성될 수 있다. 복수의 코일(514)은 코어(516)의 길이방향 직선운동으로 발생하는 자기장의 크기 및 변화에 따라 칩의 두께를 측정한다.The coil 514 is spaced apart from the core 516 and is formed to surround the outer surface of the core 516. Although the coil 514 has been described as three in the present invention, two or more coils may be formed. The plurality of coils 514 measures the thickness of the chip according to the size and change of the magnetic field generated by the longitudinal linear motion of the core 516.

코어(516)는 LVDT센서(510)의 내부 중앙에 위치하고, LVDT센서(510)의 길이방향으로 직선운동한다. 코어(516)의 길이방향 이동에 따라 발생하는 자기장으로 두께(변위)를 측정한다.The core 516 is located at the inner center of the LVDT sensor 510 and linearly moves in the longitudinal direction of the LVDT sensor 510. The thickness (displacement) is measured by the magnetic field generated by the longitudinal movement of the core 516.

코어(516)는 환경변화에 대한 영향을 적게 받으며 투자율이 높은 자성체 및 외부의 자속 영향력을 줄이기 위한 차폐케이스를 사용한다.The core 516 is less susceptible to environmental changes and uses a high permeability magnetic material and a shielding case to reduce the influence of external magnetic flux.

도 6는 본 발명에 따른 혈액진단용 칩 저항 및 두께를 측정하는 방법을 나타내는 블록도이다.Figure 6 is a block diagram showing a method for measuring the chip resistance and thickness for diagnosing blood according to the present invention.

도 6의 각 단계는 도 3 내지 도 5에 따른 본 발명의 실시 예를 참조하여 설명된다.Each step of FIG. 6 is described with reference to the embodiment of the present invention according to FIGS. 3 to 5.

도 6를 참조하면, 저항측정부의 상단에 대상 LTCC 칩을 안착하는 단계(S610), 안착되는 대상 LTCC 칩의 상부에 LVDT센서를 배치하는 단계(S620), LVDT센서로 대상 LTCC 칩의 상부를 가압하는 단계(S630) 및 대상 LTCC 칩의 두께 및 저항을 측정하는 단계(S640)를 포함한다.Referring to Figure 6, the step of seating the target LTCC chip on the upper end of the resistance measuring unit (S610), the step of placing the LVDT sensor on the upper part of the target LTCC chip to be seated (S620), pressing the upper portion of the target LTCC chip with the LVDT sensor In step S630 and measuring the thickness and resistance of the target LTCC chip (S640).

저항측정부(320, 420)의 상단에 대상 LTCC 칩(300, 400)을 안착하는 단계(S610)는 저항측정부(320, 420)의 상단에 대상 LTCC 칩(300, 400)을 안착하여, 대상 LTCC 칩(300, 400)의 저항 및 두께 측정을 준비하는 단계이다.In the step S610 of mounting the target LTCC chips 300 and 400 on the upper ends of the resistance measuring units 320 and 420, the target LTCC chips 300 and 400 may be seated on the upper ends of the resistance measuring units 320 and 420. In this step, the resistance and thickness measurements of the target LTCC chips 300 and 400 are prepared.

저항접촉 핀(322)이 구비되는 저항측정부(320)와 대상 LTCC 칩(300)은 일정한 간격으로 이격되어 있다. 저항 접촉핀(322)과 대상 LTCC 칩(300)은 정확한 저항을 측정하도록 비접촉 구조로 형성된다.The resistance measuring unit 320 including the resistance contact pins 322 and the target LTCC chip 300 are spaced apart at regular intervals. The ohmic contact pin 322 and the target LTCC chip 300 are formed in a non-contact structure to measure accurate resistance.

안착되는 대상 LTCC 칩(300, 400)의 상부에 LVDT센서(310, 410)를 배치하는 단계(S620)는 S610단계에서 준비된 대상 LTCC 칩(300, 400)의 상부에 LVDT센서(310, 410)를 배치하는 단계이다.The arrangement of the LVDT sensors 310 and 410 on the target LTCC chips 300 and 400 to be seated (S620) includes the LVDT sensors 310 and 410 on the target LTCC chips 300 and 400 prepared in step S610. To place it.

상기 LVDT센서(310, 410)로 대상 LTCC 칩(300, 400)의 상부를 가압하는 단계(S620)는 배치된 LVDT센서(310, 410)를 대상 LTCC 칩(300, 400)에 접촉시켜 압력을 가하는 단계이다. Pressing the upper portion of the target LTCC chips 300 and 400 with the LVDT sensors 310 and 410 (S620) may contact the disposed LVDT sensors 310 and 410 with the target LTCC chips 300 and 400 to apply pressure. It is a step to add.

여기에서, LVDT센서(310)는 대상 LTCC 칩(300)의 상부에서 수직이동하며, 대상 LTCC 칩(300)을 가압 및 감압하고, LVDT센서(310, 4120, 510)에서도 외각지지대(512)에서 이와 같은 역할을 수행한다.Here, the LVDT sensor 310 moves vertically on the upper part of the target LTCC chip 300, pressurizes and depressurizes the target LTCC chip 300, and also on the outer support 512 of the LVDT sensors 310, 4120, and 510. It plays the same role.

상기 대상 LTCC 칩(300, 400)의 두께 및 저항을 측정하는 단계(S630)는 LVDT센서(510)의 압력을 통한 대상 LTCC 칩(400), LVDT센서(410) 및 저항측정 핀(422)의 접촉으로 저항 및 두께를 측정하는 단계이다.Measuring the thickness and resistance of the target LTCC chip (300, 400) (S630) of the target LTCC chip 400, LVDT sensor 410 and the resistance measuring pin 422 through the pressure of the LVDT sensor 510 It is the step of measuring the resistance and thickness by contact.

구체적으로, 대상 LTCC 칩(400), LVDT센서(410) 및 저항측정 핀(422)의 접촉된 상태에서 LVDT센서(510)의 내부에서 코어(516)를 길이방향으로 직선운동하며 발생하는 자기장으로 두께를 측정하고, 대상 LTCC 칩(300, 400)과 저항측정부(320, 420)의 저항측정 핀(322, 422)을 접촉시켜 저항을 측정한다.Specifically, in the state where the target LTCC chip 400, the LVDT sensor 410, and the resistance measuring pin 422 are in contact with each other, a magnetic field generated by linearly moving the core 516 in the longitudinal direction in the LVDT sensor 510. The thickness is measured, and the resistance is measured by contacting the target LTCC chips 300 and 400 with the resistance measuring pins 322 and 422 of the resistance measuring units 320 and 420.

이상의 설명은 본 발명을 예시적으로 설명한 것에 불과하며, 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자에 의해 본 발명의 기술적 사상에서 벗어나지 않는 범위에서 다양한 변형이 가능할 것이다.The above description is merely illustrative of the present invention, and various modifications may be made by those skilled in the art without departing from the technical spirit of the present invention.

따라서 본 발명의 명세서에 개시된 실시 예들은 본 발명을 한정하는 것이 아니다. 본 발명의 범위는 아래의 청구범위에 의해 해석되어야 하며, 그와 균등한 범위 내에 있는 모든 기술도 본 발명의 범위에 포함되는 것으로 해석해야 할 것이다.Therefore, the embodiments disclosed in the specification of the present invention are not intended to limit the present invention. It is intended that the scope of the invention be interpreted by the following claims, and that all techniques falling within the scope of the present invention shall be included in the scope of the present invention.

100, 200, 300, 400 : 대상 LTCC 칩
110 : 저항측정부
210 : 두께측정부
212 : 레이저 센서
310, 410, 510 : LVDT센서
320, 420 : 저항측정부
322, 422 : 저항측정 핀
512 : 외각지지대
514 : 복수의 코일
516 : 코어100, 200, 300, 400: target LTCC chips
110: resistance measurement unit
210: thickness measurement unit
212: laser sensor
310, 410, 510: LVDT sensor
320, 420: resistance measurement unit
322, 422: resistance measurement pin
512: outer support
514: plurality of coils
516: core

Claims (7)

저항측정 핀을 구비하고, 대상 LTCC 칩이 안착될 수 있게 배치되는 저항측정부와,
상기 대상 LTCC 칩의 수직방향으로 이동하며, 상기 대상 LTCC 칩의 상부를 가감압하도록 형성되는 LVDT센서를 포함하는 혈액진단용 칩 저항 및 두께 측정장치.A resistance measurement unit having a resistance measurement pin and disposed to allow the target LTCC chip to be seated thereon;
And a LVDT sensor moving in a vertical direction of the target LTCC chip, the LVDT sensor being configured to pressurize and depress the upper portion of the target LTCC chip. 제 1항에 있어서,
상기 LVDT센서는,
내부 중앙에 위치하고, 길이방향으로 직선운동하는 코어와,
상기 코어와 이격되어 상기 코어의 외면을 감싸는 복수의 코일과,
최외각에 위치하여 상기 대상 LTCC 칩을 가압하는 외각지지대를 포함하는 혈액진단용 칩 저항 및 두께 측정장치.The method of claim 1,
The LVDT sensor,
A core located in the inner center and linearly moving in the longitudinal direction,
A plurality of coils spaced apart from the core and surrounding the outer surface of the core;
Blood diagnostic chip resistance and thickness measurement device including an outer support that is located on the outermost to press the target LTCC chip. 제 2항에 있어서,
상기 코어는,
상기 코일의 내부에서 길이방향으로 직선운동하며 발생하는 자기장을 통하여 상기 대상 LTCC 칩의 두께를 측정하는 것을 특징으로 하는 혈액진단용 칩 저항 및 두께 측정장치.The method of claim 2,
The core is,
A device for measuring chip resistance and thickness for blood diagnosis, characterized in that for measuring the thickness of the target LTCC chip through a magnetic field generated by linear movement in the longitudinal direction inside the coil. 제 1항에 있어서,
상기 저항 측정부는,
상기 저항측정 핀으로 상기 가압된 대상 LTCC 칩의 저항을 측정하는 것을 특징으로 하는 혈액진단용 칩 저항 및 두께 측정장치.The method of claim 1,
The resistance measuring unit,
Blood resistance chip resistance and thickness measuring device, characterized in that for measuring the resistance of the LTCC chip pressed by the resistance measuring pin. 상기 1항에 있어서,
상기 LVDT센서는,
세라믹으로 형성되는 것을 특징으로 하는 혈액진단용 칩 저항 및 두께 측정장치.According to claim 1,
The LVDT sensor,
Blood resistance chip resistance and thickness measuring apparatus, characterized in that formed of ceramic. 저항 측정부의 상단에 대상 LTCC 칩을 안착하는 단계와,
상기 안착되는 대상 LTCC 칩의 상부에 LVDT센서를 배치하는 단계와,
상기 LVDT센서로 상기 대상 LTCC 칩의 상부를 가압하는 단계와,
상기 대상 LTCC 칩의 두께 및 저항을 측정하는 단계를 포함하는 혈액진단용 칩 저항 및 두께 측정방법. Mounting a target LTCC chip on top of the resistance measurement unit;
Disposing an LVDT sensor on an upper part of the target LTCC chip to be seated;
Pressing an upper portion of the target LTCC chip with the LVDT sensor;
Blood diagnostic chip resistance and thickness measuring method comprising the step of measuring the thickness and resistance of the target LTCC chip. 제 6항에 있어서,
상기 대상 칩의 두께 및 저항을 측정하는 단계는,
상기 LVDT센서의 내부에서 코어를 길이방향으로 직선운동하며 발생하는 자기장으로 두께를 측정하는 단계와,
상기 대상 LTCC 칩과 상기 저항 측정부의 저항측정 핀을 접촉시켜 저항을 측정하는 단계를 포함하는 혈액진단용 칩 저항 및 두께 측정방법.The method of claim 6,
Measuring the thickness and resistance of the target chip,
Measuring the thickness with a magnetic field generated by linearly moving the core in the longitudinal direction in the LVDT sensor;
And measuring the resistance by contacting the target LTCC chip with the resistance measurement pin of the resistance measurement unit.
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