KR102055441B1 - Water purifier having improved fixing structure for power semiconductor element - Google Patents

Abstract

The present invention relates to a water purifier with an improved fixing structure for a power semiconductor device. In addition, according to one embodiment of the present invention, the water purifier includes: a noise printing circuit substrate reducing a noise of AC power output from an input power part; and an induction heating printing circuit substrate supplied with the AC power in which the noise is reduced from the noise printing circuit substrate and controlling induction heating operation of a working coil based on the supplied AC power, wherein the induction heating printing circuit substrate includes: a rectification part rectifying the AC power supplied from the noise printing circuit substrate into DC power; an induction heating driving part provided with the DC power from the rectification part to perform switching operation; a water cooling type radiator plate performing radiating operation of the rectification part and the induction heating driving part; and a fixing member fixing the rectification part and the induction heating driving part to the water cooling type radiator plate.

Description

Water purifier with improved structure for fixing power semiconductor devices {WATER PURIFIER HAVING IMPROVED FIXING STRUCTURE FOR POWER SEMICONDUCTOR ELEMENT}

The present invention relates to a water purifier with improved power semiconductor device fixing structure.

In general, the water purifier is a device for converting the safe and sanitary drinking water by filtering various harmful components contained in the raw water such as tap water or ground water by the filter of the various stages installed inside the main body.

The water purifier may be divided into a water storage tank type and a direct water type according to whether the water purifier includes a water storage tank. The reservoir water purifier is configured to store the purified water in the reservoir and to provide the purified water stored in the reservoir when the user manipulates the outlet.

In contrast, the direct type water purifier does not have a water tank, and when the user manipulates the water outlet, the raw water is immediately filtered to provide purified water to the user.

Such direct water purifiers also provide hot and cold water in addition to room temperature water. The direct type water purifier providing hot water and cold water is provided with a heating device and a cooling device therein. The heating device is adapted to heat the purified water to produce hot water, and the cooling device is adapted to cool the purified water to produce cold water.

Direct water purifiers must be able to heat or cool the purified water in a short time to provide hot or cold water. There can be several ways in which the heating device heats the purified water in a short time.

For example, Korean Unexamined Patent Publication No. 10-2005-0103723 (2005.11.01.) Discloses a configuration for heating purified water by an induction heating method.

Induction heating refers to a method of heating a heating target object using electromagnetic induction. When a current is supplied to the coil, an eddy current is generated in the heated object, and Joule heating generated by the resistance of the metal increases the temperature of the heated object.

That is, the direct type water purifier that heats the purified water by the induction heating method may heat the hot water tank by controlling the induction heating operation of the working coil according to the temperature of the water selected by the user, thereby allowing the hot water to be discharged.

However, in the case of the direct type water purifier of the induction heating method, heat is generated in the power semiconductor device (for example, the bridge diode or the switching device) in the heating device (that is, the induction heating module). A heat sink is needed to carry out this.

In the conventional induction heating type direct water purifier, an air-cooled heat sink (heat sink having a structure for dissipating heat in air) has been used to dissipate heat generated in a power semiconductor device.

The air-cooled heat sink performs heat dissipation on the power semiconductor device through a natural air cooling method, and the power semiconductor device is fixed to the air-cooled heat sink through a screw.

Accordingly, even if the power semiconductor device malfunctions or the insulation of the power semiconductor device is broken, there is no risk of electric shock to the user.

However, when an air-cooled heat sink is used, there is a limit that hot water output performance depends on the size of the air-cooled heat sink. Furthermore, when the hot water output amount is exceeded, there is a problem that the operation of the water purifier is limited due to the temperature rise of the power semiconductor device.

In order to solve this problem, a water-cooled heat sink (heat sink having a structure for dissipating heat by using water in the water purifier) was introduced to the direct type water purifier of induction heating.

In the case of the water-cooled heat sink, the size of the air-cooled heat sink is about 20% smaller than that of the air-cooled heat sink.

However, when the power semiconductor device is fixed to the water-cooled heat sink through the screw in the same manner as described above, when the dielectric breakdown of the power semiconductor device is broken, electricity may be conducted with the screw, and the electric conduction with the screw is transferred to the water to give an electric shock. The problem is that accidents can happen.

Accordingly, there is a need for a fixed structure of a power semiconductor device capable of stably fixing the power semiconductor device to a water-cooled heat sink and preventing an electric shock accident.

An object of the present invention is to provide a water purifier with improved heat dissipation performance and hot water continuous water output of the power semiconductor device.

It is also an object of the present invention to provide a water purifier capable of stably fixing a power semiconductor device and preventing an electric shock accident.

The objects of the present invention are not limited to the above-mentioned objects, and other objects and advantages of the present invention, which are not mentioned above, can be understood by the following description, and more clearly by the embodiments of the present invention. Also, it will be readily appreciated that the objects and advantages of the present invention may be realized by the means and combinations thereof indicated in the claims.

The water purifier according to the present invention may include a water-cooled heat sink that performs heat dissipation of the power semiconductor device, thereby improving heat dissipation performance and continuous hot water output of the power semiconductor device.

In addition, the water purifier according to the present invention includes a fixing member for fixing the power semiconductor device to the water-cooled heat sink, it is possible to stably fix the power semiconductor device and prevent electric shock.

The water purifier according to the present invention may improve heat dissipation performance and hot water continuous water output of the power semiconductor device through a water-cooled heat sink. In addition, the water-cooled heat sink is smaller in size than the conventional air-cooled heat sink, it is possible to reduce the volume of the induction heating printed circuit board compared to the conventional. In addition, the water is pre-heated through the water-cooled heat sink to reduce the output of the induction heating drive (or working coil) required to achieve the target temperature, thereby saving power.

In addition, in the water purifier according to the present invention, the power semiconductor device may be stably fixed to the water-cooled heat sink. Furthermore, the water purifier according to the present invention can prevent the conduction of electricity and water during abnormal operation or breakdown of the power semiconductor device, and can prevent an electric shock accident.

In addition to the effects described above, the specific effects of the present invention will be described together with the following description of specifics for carrying out the invention.

1 is a perspective view illustrating a water purifier according to an embodiment of the present invention.
FIG. 2 is an exploded perspective view illustrating the internal configuration of the water purifier of FIG. 1.
3 is an exploded perspective view illustrating an induction heating module and a control module of the water purifier of FIG. 2.
FIG. 4 is a schematic diagram illustrating a flow path configuration of the water purifier of FIG. 1.
FIG. 5 is a schematic view for explaining a partial configuration of the water purifier of FIG. 1.
FIG. 6 is a plan view illustrating an induction heating printed circuit board of FIG. 5.
7 is a perspective view illustrating a power semiconductor device fixing structure of FIG. 6.
8 is an exploded perspective view of FIG. 7.

The above objects, features, and advantages will be described in detail with reference to the accompanying drawings, whereby those skilled in the art may easily implement the technical idea of the present invention. In describing the present invention, when it is determined that the detailed description of the known technology related to the present invention may unnecessarily obscure the gist of the present invention, the detailed description will be omitted. Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals are used to indicate the same or similar components.

In the following, any configuration is arranged on the "top (or bottom)" of the component or "upper (or bottom)" of the component, that any configuration is disposed in contact with the top (or bottom) of the component. In addition, it may mean that another configuration may be interposed between the component and any configuration disposed on (or under) the component.

In addition, when a component is described as being "connected", "coupled" or "connected" to another component, the components may be directly connected or connected to each other, but other components may be "interposed" between each component. It is to be understood that each component may be "connected", "coupled" or "connected" through another component.

Hereinafter, to describe the water purifier according to an embodiment of the present invention.

1 is a perspective view illustrating a water purifier according to an embodiment of the present invention.

Referring to FIG. 1, the water purifier 1000 according to an embodiment of the present invention includes a cover 1010, a water extraction unit 1020, a base 1030, and a tray 1040.

The cover 1010 forms the exterior of the water purifier 1000. The appearance of the water purifier 1000 formed by the cover 1010 may be referred to as a main body of the water purifier 1000. Parts for filtering the raw water is installed inside the water purifier (1000) body. Cover 1010 wraps the components to protect them. The name of the cover 1010 may be renamed to a case or a housing. In any case, the cover 1010 described in the present invention corresponds to forming the exterior of the water purifier 1000 and surrounding components filtering the raw water.

The cover 1010 may be formed of a single part, but may be formed by combining several parts. For example, as illustrated in FIG. 1, the cover 1010 may include a front cover 1011, a rear cover 1014, a side panel 1013a, an upper cover 1012, and a top cover 1015.

The front cover 1011 is disposed in front of the water purifier 1000. The rear cover 1014 is disposed behind the water purifier 1000. Here, the front and rear of the water purifier 1000 are set based on the direction of looking at the water outlet 1020 in front of the user's eyes, respectively. However, since the concept of the front and rear of the water purifier 1000 is not absolute, it may vary depending on the manner in which the water purifier 1000 is described.

The side panels 1013a are disposed on the left and right sides of the water purifier 1000, respectively. The side panel 1013a is disposed between the front cover 1011 and the rear cover 1014. The side panel 1013a may be coupled to the front cover 1011 and the rear cover 1014, respectively. The side panel 1013a substantially forms the side of the water purifier 1000.

The upper cover 1012 is disposed in front of the water purifier 1000. The upper cover 1012 is installed at a position higher than the front cover 1011. The water outlet 1020 is exposed to a space between the upper cover 1012 and the front cover 1011. The upper cover 1012 together with the front cover 1011 forms an exterior of the front of the water purifier 1000.

The top cover 1015 forms an upper surface of the water purifier 1000. An input / output unit 1016 may be formed in front of the top cover 1015. The input / output unit 1016 is a concept including an input unit and an output unit. The input unit is configured to receive a user's control command. The manner in which the input unit receives the user's control command may include all of the touch input, the physical pressing, or the like. The output unit is provided to visually provide the state information of the water purifier 1000 to the user.

The water extraction unit (takeout unit or coke assembly 1020) serves to provide an integer to the user according to the user's control command. At least a portion of the water outlet 1020 is exposed to the outside of the water purifier 1000 body to supply water. Particularly, in the water purifier 1000 configured to provide room temperature purified water, cold water cooler than room temperature, and hot water hotter than room temperature, at least one of room temperature purified water, cold water, and hot water is discharged through the water extraction unit 1020 according to a control command received from the user. Can be.

The water extraction unit 1020 may be configured to be rotatable according to a user's manipulation. The front cover 1011 and the upper cover 1012 form a rotation region of the water extraction portion 1020 therebetween, and the water extraction portion 1020 may be rotated left and right in the rotation region. Rotation of the water extraction unit 1020 may be made by a force physically applied to the water extraction unit 1020. In addition, the water extraction unit 1020 may be rotated based on a control command applied by the user to the input / output unit 1016. The configuration for implementing the rotation of the water extraction unit 1020 may be installed in the water purifier 1000, specifically, may be installed in the area covered by the upper cover 1012. In addition, the input / output unit 1016 may be implemented to rotate together with the water extraction unit 1020 when the water extraction unit 1020 is rotated.

The base 1030 forms the bottom of the water purifier 1000. Internal parts of the water purifier 1000 are supported by the base 1030. When the water purifier 1000 is placed on the floor or a shelf, the base 1030 faces the floor or the shelf. Therefore, when the water purifier 1000 is placed on a floor or a shelf, the structure of the base 1030 is not exposed to the outside.

The tray 1040 is disposed to face the water outlet 1020. Based on the case where the water purifier 1000 is installed as shown in FIG. 1, the tray 1040 faces the water outlet 1020 in the vertical direction. The tray 1040 is formed to support a container or the like for containing purified water discharged through the water extraction unit 1020. In addition, the tray 1040 is formed to accommodate the remaining water falling from the water outlet 1020. When the tray 1040 receives and receives the remaining water falling from the water outlet 1020, the tray 1040 may prevent contamination of the remaining water around the water purifier 1000.

Since the tray 1040 needs to receive the remaining water falling from the water extraction unit 1020, the tray 1040 may also be implemented to rotate together with the water extraction unit 1020. The input / output unit 1016 and the tray 1040 may be implemented to rotate in the same direction as the water extraction unit 1020.

Next, an internal configuration of the water purifier 1000 of FIG. 1 will be described with reference to FIG. 2.

FIG. 2 is an exploded perspective view illustrating the internal configuration of the water purifier of FIG. 1.

Specifically, the filter unit 1060 is installed inside the front cover 1011. The filter unit 1060 is configured to filter the raw water supplied from the raw water supply unit to generate purified water. Since only one filter may be difficult to generate an integer suitable for a user to drink, the filter unit 1060 may include a plurality of unit filters 1061 and 1062. The unit filters 1061 and 1062 may be, for example, prefilters such as carbon blocks, adsorption filters, HEPA filters (High Efficiency Particulate Air filters), UF filters (Ultra Filteration or Ultra Filteration filters), and the like. We include high-performance filter of. Although two unit filters 1061 and 1062 are installed in FIG. 2, the number of unit filters 1061 and 1062 may be expanded or reduced as necessary.

The plurality of unit filters 1061 and 1062 are connected in a predetermined order. The predetermined order means a suitable order for the filter unit 1060 to filter the water. Raw water may contain various foreign objects. Since large particles such as hair and dust cause deterioration of the filtration performance of high performance filters such as HEPA filters and UF filters, the high performance filters should be protected from large particles such as hair and dust. Therefore, in order to protect the high performance filters, a pre filter must be installed upstream of the high performance filters.

The prefilter is adapted to remove large particles from the water. If the pre-filter is disposed upstream of the high performance filters to remove the large particles contained in the raw water first, the high performance filters can be protected since the raw water that does not contain the large particles is supplied to the high performance filter. The raw water passing through the prefilter is then filtered by a HEPA filter, an UF filter, or the like.

The integer generated by the filter unit 1060 may be directly provided to the user through the water extraction unit 1020. In this case, the temperature of the purified water provided to the user corresponds to room temperature. Alternatively, the purified water generated by the filter unit 1060 may be heated by the induction heating module 1100 or cooled by the cold water tank assembly 1200.

The filter bracket assembly 1070 is a structure for fixing the unit filters 1061 and 1062 of the filter unit 1060 and fixing components such as water discharge passages, valves, and sensors such as purified water and cold water.

The bottom 1071 of the filter bracket assembly 1070 is coupled with the tray 1040. The bottom 1071 of the filter bracket assembly 1070 is formed to receive the protruding engagement portion 1041 of the tray 1040. As the protruding coupling portion 1041 of the tray 1040 is inserted into the lower portion 1071 of the filter bracket assembly 1070, the filter bracket assembly 1070 and the tray 1040 are engaged.

The bottom 1071 of the filter bracket assembly 1070 and the tray 1040 have curved surfaces corresponding to each other. The bottom 1071 of the filter bracket assembly 1070 can be rotated independently of the rest of the filter bracket assembly 1070.

The upper portion 1072 of the filter bracket assembly 1070 is made to support the water outlet 1020. The upper portion 1072 of the filter bracket assembly 1070 defines the rotation path of the outlet portion 1020. The water extraction unit 1020 may be divided into a blowout cock portion 1021 protruding to the outside of the water purifier 1000 and a rotating portion 1022 disposed inside the water purifier 1000. Rotating portion 1022 may be formed in a circular shape for rotation as shown in FIG. The rotating portion 1022 is mounted to the upper portion 1072 of the filter bracket assembly 1070. The water outlet 1020 mounted on the upper portion 1072 of the filter bracket assembly 1070 is configured to rotate relative to the filter bracket assembly 1070.

The bottom 1071 and the top 1072 of the filter bracket assembly 1070 may be connected to each other by the vertical connection 1073. The lower portion 1071 and the upper portion 1072 of the filter bracket assembly 1070 connected to each other by the vertical connecting portion 1073 may be rotated in the same direction. If the user rotates the water outlet 1020, the upper portion 1072, the upper and lower connecting portions 1073, the lower portion 1071, and the tray 1040 of the filter bracket assembly 1070 connected to the water extraction portion 1020 are discharged portions. Can be rotated with 1020.

A filter installation region 1074 is formed between the lower 1071 and the upper 1072 of the filter bracket assembly 1070 to receive the unit filters 1061 and 1062 of the filter unit 1060. The filter installation area 1074 provides an installation space for the unit filters 1061 and 1062.

On the opposite side of the filter installation region 1074, a support 1075 protruding toward the rear of the water purifier 1000 is formed. The support 1075 is made to support the control module 1080 and the induction heating module 1100. The control module 1080 and the induction heating module 1100 are mounted on the support 1075. The support 1075 is disposed between the induction heating module 1100 and the compressor 1051 to block heat generated in the induction heating module 1100 from being conducted to the compressor 1051 or the like.

The control module 1080 is adapted to implement overall control of the water purifier 1000. The control module 1080 may include various printed circuit boards for controlling the operation of the water purifier 1000.

The induction heating module 1100 generates hot water by heating the purified water generated by the filter unit 1060. Induction heating module 1100 has components that can heat the purified water in an induction heating method. The induction heating module 1100 receives purified water from the filter unit 1060, and the hot water generated in the induction heating module 1100 is discharged through the water extraction unit 1020.

Induction heating module 1100 may include a printed circuit board for controlling the generation of hot water. A protective cover 1161 may be coupled to one side of the induction heating module 1100 to prevent water from penetrating into the printed circuit board and to protect the printed circuit board in the event of a fire.

Refrigeration cycle apparatus 1050 produces cold water. The refrigeration cycle device 1050 refers to a set of devices in which the compression-condensation-expansion-evaporation process of the refrigerant occurs continuously. In order to generate cold water in the cold water tank assembly 1200, the refrigeration cycle apparatus 1050 must first operate to bring the coolant filled in the cold water tank assembly 1200 to a low temperature.

Refrigeration cycle apparatus 1050 includes a compressor 1051, a condenser 1052, a capillary 1053, an evaporator (not shown, disposed inside the cold water tank assembly), a dryer 1055, and a refrigerant flow path connecting them to each other. . The refrigerant passage may be formed by a pipe or the like, and the refrigerant passage connects the compressor 1051, the condenser 1052, the capillary tube 1053, and the evaporator to form a circulation passage of the refrigerant.

The compressor 1051 compresses the refrigerant. The compressor 1051 is connected to the condenser 1052 by a refrigerant passage, and the refrigerant compressed in the compressor 1051 flows to the condenser 1052 through the refrigerant passage. The compressor 1051 may be disposed under the support 1075 and installed to be supported by the base 1030.

Condenser 1052 condenses the refrigerant. The refrigerant compressed by the compressor 1051 flows into the condenser 1052 through the refrigerant passage, and is condensed by the condenser 1052. The refrigerant condensed in the condenser 1052 flows to the dryer 1055 through the refrigerant passage.

Dryer 1055 removes moisture from the refrigerant. In order to improve the efficiency of the refrigeration cycle apparatus 1050, water must be removed from the capillary 1053 and the refrigerant to be introduced into the evaporator. The dryer 1055 is installed between the condenser 1052 and the capillary 1053, and removes moisture from the refrigerant to improve the efficiency of the refrigeration cycle device 1050.

Expansion of the refrigerant is implemented by capillary tube 1053. The capillary tube 1053 is formed to expand the refrigerant, and the throttling valve or the like may form an expansion device instead of the capillary tube 1053 according to the design. Capillary tube 1053 may be wound in a coil form to secure a sufficient length in a narrow space.

The evaporator evaporates the refrigerant and is installed inside the cold water tank assembly 1200. The cooling water filled inside the cold water tank assembly 1200 and the refrigerant of the refrigerating cycle apparatus 1050 exchange heat with each other by an evaporator, and the cooling water may be kept at a low temperature by heat exchange. The purified water may be cooled by the cooling water maintained at a low temperature.

The refrigerant heated by heat exchange with the cooling water in the evaporator is returned to the compressor 1051 again along the refrigerant passage, and continuously circulates through the refrigeration cycle apparatus 1050.

The base 1030 supports the compressor 1051, the front cover 1011, the rear cover 1014, both side panels 1013a and 1013b, the filter bracket assembly 1070, the condenser 1052 and the fan 1033, and the like. It is formed to. The base 1030 preferably has a high stiffness to support these components.

The condenser 1052 and the fan 1033 may be installed at the rear side of the water purifier 1000, and the continuous circulation of air is required for the heat dissipation of the condenser 1052. An inlet 1034 may be formed at the bottom of the base 1030 to circulate air. The air sucked through the inlet port 1034 is caused to flow by the fan 1033. Air flows toward the condenser 1052 to achieve air cooled cooling. In the base 1030, the duct structure 1032 surrounding the fan 1033 and the condenser 1052 may be fixed to increase the heat radiation efficiency of the condenser 1052.

A drain 1035 is installed behind the duct structure 1032. The drain 1035 is exposed to the outside of the water purifier 1000 to form a drain flow path. Since all of the internal flow paths of the water purifier 1000 pass through, even if the drain 1035 is connected to only one of the internal flow paths, all of the fluid present in the internal flow paths may be discharged through the drain 1035.

A pedestal 1031 supporting the cold water tank assembly 1200 may be installed at an upper portion of the condenser 1052. The pedestal 1031 has a first hole 1031a at the rear side, and the rear cover 1014 has a second hole 1014a. The first hole 1031a and the second hole 1014a are formed at positions corresponding to each other. The first hole 1031a and the second hole 1014a are for disposing a drain valve for draining the coolant filled in the cold water tank assembly 1200.

The cold water tank assembly 1200 is formed to receive the coolant therein. The cold water tank assembly 1200 is supplied with purified water generated by the filter unit 1060. In particular, in the case of the direct type water purifier 1000 having no separate water tank, the cold water tank assembly 1200 may be supplied with purified water directly from the filter unit 1060.

The temperature of the coolant filled in the cold water tank assembly 1200 is lowered by the operation of the refrigeration cycle apparatus 1050. The cold water tank assembly 1200 is configured to cool the purified water with the coolant to form cold water.

Since the cooling water is stored in the cold water tank assembly 1200 and does not circulate, the contamination of the cooling water increases after a long time. For hygiene, the coolant stored in the cold water tank assembly is periodically discharged to the outside, and the new coolant needs to be filled in the cold water tank assembly 1200.

Here, referring to FIG. 3, the induction heating module 1100 and the control module 1080 of the water purifier 1000 of FIG. 2 will be described in more detail.

3 is an exploded perspective view illustrating an induction heating module and a control module of the water purifier of FIG. 2.

In detail, the induction heating module 1100 indicates a set of parts that receive hot water generated by the filter unit 1060 (see FIG. 2) to generate hot water. In particular, in the case of a direct type water purifier 1000 (see FIG. 1) that does not have a separate reservoir, the purified water may be supplied directly to the induction heating module 1100 from the filter unit 1060 (see FIG. 2) without passing through the reservoir.

The induction heating module 1100 includes an induction heating printed circuit board 1110, an induction heating printed circuit board cover 1121 and 1122, a hot water tank 1130, a working coil 1140, a bracket 1160, and a shield plate 1190. It includes.

The induction heating printed circuit board 1110 controls the induction heating operation of the working coil 1140. Both ends of the working coil 1140 are connected to the induction heating printed circuit board 1110 and controlled by the induction heating printed circuit board 1110. For example, when a user inputs a control command through the input / output unit 1016 of the water purifier 1000 (see FIGS. 1 and 2) to take out hot water, the purified water generated by the filter unit 1060 (see FIG. 2) is hot water. It is supplied to the tank 1130. The induction heating printed circuit board 1110 controls the current to flow in the working coil 1140. The hot water tank 1130 is inductively heated by the current supplied to the working coil 1140. The purified water is heated instantaneously through the hot water tank 1130 to become hot water.

Induction heating printed circuit board covers 1121 and 1122 are formed to surround the induction heating printed circuit board 1110. Induction heating printed circuit board covers 1121 and 1122 include a first induction heating cover 1121 and a second induction heating cover 1122.

An induction heating printed circuit board 1110 is installed in an inner space formed by the first induction heating cover 1121 and the second induction heating cover 1122. The first induction heating cover 1121 and the second induction heating cover 1122 are coupled to each other so as to prevent penetration of water. In addition, a sealing member (not shown) may be coupled to the edges of the first induction heating cover 1121 and the second induction heating cover 1122 to prevent penetration of water. The first induction heating cover 1121 and the second induction heating cover 1122 are preferably made of a flame retardant material to prevent the induction heating printed circuit board 1110 from being damaged by a fire.

The hot water tank 1130 generates hot water by heating the purified water. The hot water tank 1130 has an internal space for heating the liquid. The hot water tank 1130 is inductively heated under the influence of the magnetic force line formed by the working coil 1140. The liquid is heated while passing through the internal space of the hot water tank 1130 to become hot water. The hot water tank 1130 is made to maintain airtightness.

The working coil 1140 forms a magnetic force line for induction heating of the hot water tank 1130. The working coil 1140 is disposed at one side of the hot water tank 1130 to face the hot water tank 1130. When a current is supplied to the working coil 1140, a magnetic force line is formed in the working coil 1140. The magnetic force line affects the hot water tank 1130, and the hot water tank 1130 is inductively heated under the influence of the magnetic force line.

The shield plate 1190 is disposed on one side of the working coil 1140. The shield plate 1190 is disposed on the opposite side of the hot water tank 1130 based on the working coil 1140. The shield plate 1190 is for preventing magnetic field lines generated from the working coil 1140 from being radiated to the remaining regions except for the hot water tank 1130. Shield plate 1190 may be made of aluminum or other material that changes the flow of magnetic field lines.

The control module 1080 may include a control printed circuit board 1082, a noise printed circuit board 1083, a near field communication (NFC) printed circuit board 1084, a buzzer 1085, and a main printed circuit board ( 1086 and main printed circuit board covers 1087 and 1088.

The control printed circuit board 1082 is a sub configuration of a display printed circuit board (not shown). The control printed circuit board 1082 is not an essential component for driving a water supply device such as a water purifier 1000 (see FIG. 1), but serves as an auxiliary part of a display printed circuit board (not shown).

The noise printed circuit board 1083 is for supplying power to the induction heating printed circuit board 1110. That is, the noise printed circuit board 1083 may reduce noise of AC power (that is, AC power) output from the input power supply unit 100 (refer to FIG. 5) to reduce the noise of the induction heating printed circuit board 1110. To provide. In addition, the noise printed circuit board 1083 may serve to supply power to other components (eg, the main printed circuit board 1086) as well as the induction heating printed circuit board 1110.

For reference, since the output voltage for induction heating is very high, sufficient power must be supplied. Accordingly, an input power supply unit 100 (refer to FIG. 5) may be provided in case the power required for induction heating is not sufficiently supplied. The input power supply unit 100 (refer to FIG. 5) may supply a separate power source to the induction heating printed circuit board 1110 to satisfy an output voltage for induction heating. In addition, the input power supply unit 100 (refer to FIG. 5) may serve to provide auxiliary power to not only the induction heating printed circuit board 1110 but also other components (for example, the main printed circuit board 1086).

On the other hand, the buzzer 1085 outputs a sound so that when a failure occurs in the water supply apparatus such as the water purifier 1000 (see FIG. 1), accurate failure information may be provided to the user. The buzzer 1085 may output a specific sound of a previously input code according to a failure.

The NFC printed circuit board 1084 is for exchanging data with a communication device. At present, personal communication devices such as smartphones are widely used. Therefore, if the consumer can check the state of the water purifier or input a control command using the personal communication device, the convenience of the consumer can be improved. The NFC printed circuit board 1084 may provide status information of the water supply device to the paired personal communication device, and receive a user's control command from the personal communication device.

The main printed circuit board 1086 controls the overall operation of a water supply such as a water purifier 1000 (see FIG. 1). The driving of the input / output unit 1016 (see FIG. 1) described in FIG. 1 or the compressor 1051 (see FIG. 2) described in FIG. 2 may also be controlled by the main printed circuit board 1086. The main printed circuit board 1086 may receive insufficient power through the noise printed circuit board 1083 when power is insufficient.

The main printed circuit board covers 1087 and 1088 are formed to surround the main printed circuit board 1086. The main printed circuit board covers 1087 and 1088 include a first main cover 1087 and a second main cover 1088.

The main printed circuit board 1086 is installed in an inner space formed by the first main cover 1087 and the second main cover 1088.

The first main cover 1087 and the second main cover 1088 are coupled to each other so as to prevent penetration of water. Sealing members (not shown) may be installed on the first main cover 1087 and the second main cover 1088 to prevent the penetration of water. In addition, the first main cover 1087 and the second main cover 1088 are preferably made of a flame retardant material to prevent the main printed circuit board 1086 from being damaged by a fire.

As described above, the water purifier 1000 may supply hot water using the induction heating module 1100 and the control module 1080. Hereinafter, the flow path of the water purifier 1000 of FIG. 1 will be described with reference to FIG. 4. Describe the configuration.

FIG. 4 is a schematic diagram illustrating a flow path configuration of the water purifier of FIG. 1. For reference, the solid line in FIG. 4 represents a flow path of water.

Specifically, the water flow path may be divided into a raw water line 1400 on the upstream side of the filter unit 1060 and a water purification line 1500 on the downstream side of the filter unit 1060 based on the filter unit 1060. Here, the upstream or downstream side is a division based on the flow of water.

The water supply valve 1312 is opened and closed based on a control command input through the input / output unit 1016 (see FIG. 1). When a control command for outputting purified water, hot water, or cold water is input through the input / output unit 1016, the water supply valve 1312 is opened to supply raw water from the raw water supply unit 10 to the filter unit 1060.

Raw water passes through the pressure reducing valve 1311 in the process of being supplied to the filter unit 1060. The pressure reducing valve 1311 is installed between the raw water supply unit 10 and the filter unit 1060. The pressure reducing valve 1311 reduces the pressure of the raw water supplied from the raw water supply part 10.

Since the direct type water purifier 1000 does not include a water tank, the pressure of the purified water discharged through the water extraction unit 1020 is determined by the pressure of the raw water supplied from the raw water supply unit 10. In general, since the pressure of the raw water supplied from the raw water supply unit 10 is a high pressure, if there is no pressure reducing valve 1311, the water extraction unit 1020 is discharged at an excessively high pressure. In addition, the unit filters 1061 and 1062 of the filter unit 1060 may be physically damaged by the pressure of raw water. Therefore, pressure reduction of raw water is required.

The pressure reducing valve 1311 depressurizes the raw water supplied from the raw water supply unit 10 to the filter unit 1060. Accordingly, the filter unit 1060 may be protected, and the water extraction unit 1020 may be discharged at an appropriate pressure.

The raw water is filtered while sequentially passing through the unit filters 1061 and 1062 of the filter unit 1060. The water upstream of the filter unit 1060 may be named raw water, and the water downstream may be named an integer.

The purified water generated by the filter unit 1060 sequentially passes through the water supply valve 1312 and the flow rate sensor 1313. The flow rate sensor 1313 measures the flow rate supplied from the filter unit 1060. The flow rate measured by the flow sensor 1313 is used for control of the water purifier.

For example, when a control command for outputting a constant amount of purified water is input through the input / output unit 1016 of the water purifier 1000, a pulse value corresponding to the predetermined amount is input to the flow sensor 1313 by the control module 1080. The water supply valve 1312 is opened by the control of the control module 1080. When the constant of the flow rate corresponding to the pulse value passes through the flow sensor 1313, the control module 1080 receives feedback from the flow sensor 1313 to control the feed water valve 1312, and the feed water valve 1312. Is closed by the control of the control module 1080. Through this process, the flow rate measured by the flow sensor 1313 may be used to control the water purifier 1000.

The purified water line 1500 connected to the flow sensor 1313 is branched into two branches 1600 and 1700, and the branch line is sequentially connected to the flow regulating valve 1351 and the induction heating module 1100. This branch, which is sequentially connected to the flow control valve 1351 and the induction heating module 1100, may be referred to as a hot water line 1700. The other branch 1600 is provided with a check valve 1321, which branches back to the purified water line 1601 and the cold water line 1602 on the downstream side of the check valve 1321. The purified water discharge valve 1330 is installed in the purified water line 1601, and the cold water discharge valve 1340 is installed in the cold water line 1602. The purified water line 1601 and the cold water line 1602 are once again joined together and connected to the water outlet 1020, and a check valve 1322 is installed in the joined flow path 1603.

The two check valves 1321 and 1322 installed at the upstream side and the downstream side of the purified water outlet valve 1330 and the cold water outlet valve 1340 are separated from each other by the first check valve 1321 and the second check valve 1322. Can be named. The first check valve 1321 and the second check valve 1322 are for preventing the generation of residual water.

When a control command for supplying hot water is input to the water purifier, the water supply valve 1312, the flow control valve 1351, and the hot water discharge valve 1353 are opened, and hot water is discharged through the hot water line 1700. In this process, the pressure inside the purified water line 1601 and the cold water line 1602 is lowered, which may cause the purified water discharge valve 1330 or the cold water discharge valve 1340 to open and close momentarily. In the structure in which the water extraction unit 1020 includes only one ejection coke and both cold water and hot water are discharged through the ejection coke, there is no problem of residual water. However, in a structure in which both cold water and hot water are discharged through two different takeout coke, a small amount of residual water may be discharged from the other takeout coke while hot water is discharged from one takeout coke.

However, when the first check valve 1321 is installed upstream of the branch point between the purified water line 1500 and the cold water line 1602, the pressure change formed during the hot water withdrawal process through the hot water line 1700 is changed to the purified water line ( 1601 and cold water line 1602 can be blocked. Accordingly, it is possible to prevent occurrence of the phenomenon in which the purified water discharge valve 1330 or the cold water discharge valve 1340 is momentarily opened and closed.

Comparing the configuration in which the cold water discharge valve 1340 is installed upstream of the cold water tank assembly 1200 and the configuration in which the cold water discharge valve 1340 is installed downstream of the cold water tank assembly 1200, the former is applied to the latter. You can get even more cold water. This is because the amount of cold water corresponding to the length of the flow path between the cold water tank assembly 1200 and the cold water outlet valve 1340 may be further supplied. Therefore, the cold water outlet valve 1340 is preferably installed upstream of the cold water tank assembly 1200 as shown. However, in the structure in which the cold water outlet valve 1340 is installed upstream of the cold water tank assembly 1200, residual water may occur in the cold water line 1602 due to a pressure change in the cold water line 1602, and a small amount may be generated even when the water is stopped. The residual amount of may be discharged through the water outlet 1020.

However, when the second check valve 1322 is installed in the confluence channel 1603 of the purified water line 1601 and the cold water line 1602, the change in pressure of the cold water line 1602 may be prevented from being transmitted to the water outlet 1020. . Accordingly, when the water extraction is stopped, it is possible to prevent a phenomenon in which a small amount of residual water is discharged through the water extraction unit 1020.

The purified water passing through the flow sensor 1313 may be immediately supplied to the user in a state of normal temperature, or may be supplied to the user after the hot water or the cold water becomes.

The purified water discharge valve 1330 and the cold water discharge valve 1340 are opened and closed based on a control command input through the input / output unit 1016, respectively. When a control command for extracting purified water through the input / output unit 1016 is input, the water supply valve 1312 and the purified water discharge valve 1330 are opened. The purified water generated by the filter unit 1060 is discharged to the water extraction unit 1020 through the water purification line 1601. Similarly, when a control command for outputting cold water is input through the input / output unit 1016, the water supply valve 1312 and the cold water discharge valve 1340 are opened. The purified water generated by the filter unit 1060 is introduced into the cold water tank assembly 1200 along the cold water line 1602 and cooled while passing through the cold water tank assembly 1200. The cold water generated in the cold water tank assembly 1200 is discharged through the water outlet 1020.

The drain valve 1280 is installed in the cold water tank assembly 1200, and the coolant filled in the cold water tank assembly 1200 may be discharged to the outside through the drain valve 1280.

The hot water line 1700 is provided with a flow control valve 1351. When a flow rate of more than an appropriate amount is introduced into the hot water tank 1130 (see FIG. 3), since sufficient heating may not be performed, it should always be adjusted so that only an appropriate amount of flow rate is introduced. The flow control valve 1351 is installed upstream of the induction heating module 1100 and is configured to adjust the flow rate of the purified water flowing into the hot water tank 1130 (see FIG. 3).

For reference, the purified water may flow into the water-cooled heat sink 1118 (see FIG. 5) provided in the induction heating printed circuit board 1110 (see FIG. 3) before the purified water flows into the hot water tank 1130 (see FIG. 3).

That is, the purified water introduced into the water-cooled heat sink 1118 (see FIG. 5) is preheated by the heat radiation operation of the water-cooled heat sink 1118 (see FIG. 5). , See FIG. 3) may be higher than the temperature of the purified water flowing into the air-cooled heat sink. Accordingly, the output of the induction heating module 1100 required to achieve the target temperature can be reduced.

The thermistor 1352 may be installed together with the flow control valve 1351. The temperature of the purified water measured by the thermistor 1352 is utilized for the control of the induction heating module 1100. For example, if the temperature of the purified water measured by thermistor 1352 is relatively low, induction heating module 1100 may be operated at high power. Conversely, if the temperature of the purified water measured by thermistor 1352 is relatively high, induction heating module 1100 can be operated at low power.

The hot water discharge valve 1353 is installed downstream of the hot water tank 1130. When a control command for outputting hot water is input through the input / output unit 1016, the water supply valve 1312 and the hot water discharge valve 1353 are opened and the hot water is discharged along the hot water line 1700.

A safety valve 1360 may be installed in the flow path branched from the hot water line 1700. The safety valve 1360 is formed to operate by a pressure change formed in the flow path of water. When the flow path of the water purifier 1000 is overpressured such that the induction heating module 1100 is abnormally operated, the safety valve 1360 is opened, and the purified water is drained through the drain 1035.

Thus, the flow path of the water purifier 1000 is configured. Hereinafter, a partial configuration of the water purifier 1000 of FIG. 1 will be described with reference to FIGS. 5 and 6.

FIG. 5 is a schematic view for explaining a partial configuration of the water purifier of FIG. 1. FIG. 6 is a plan view illustrating an induction heating printed circuit board of FIG. 5.

First, referring to FIG. 5, an input power supply unit 100, a noise printed circuit board 1083, an induction heating printed circuit board 1110, a hot water tank 1130, a temperature fuse 1182, and a working coil 1140 are illustrated. Each structure is as follows.

In detail, the input power supply unit 100 is a power supply unit that outputs AC power to satisfy a high output voltage for induction heating. The AC power output from the input power supply unit 100 may be provided to the noise printed circuit board 1083. In addition, one end of the input power supply unit 100 is connected to the noise printed circuit board 1083, the other end of the input power supply unit 100 is connected to one end of the temperature fuse 1182, and the other end of the temperature fuse 1182 is the noise printed circuit. May be connected to the substrate 1083. Accordingly, when the thermal fuse 1182 is operated to block the circuit, the AC power output from the input power supply unit 100 may not be provided to the noise printed circuit board 1083, and thus the induction heating printed circuit board 1110 may also be used. The drive is stopped.

For reference, the thermal fuse 1182 operates when the liquid in the hot water tank 1130 is overheated.

The noise printed circuit board 1083 is a board for reducing noise of AC power output from the input power supply unit 100 and supplying power with reduced noise to the induction heating printed circuit board 1110. In addition, one end of the noise printed circuit board 1083 is connected to one end of the input power supply 100 and the other end of the temperature fuse 1182, and the other end of the noise printed circuit board 1083 is an input end of the induction heating printed circuit board 1110. (INPT; ie SINPT1, SINPT2). That is, the noise printed circuit board 1083 may provide AC power with reduced noise to the induction heating printed circuit board 1110 through the input terminal INPT.

For reference, the noise printed circuit board 1083 may include an electric fuse (not shown) that operates when an overcurrent of a predetermined size or more flows. Accordingly, when overcurrent flows in the induction heating printed circuit board 1110 and the noise printed circuit board 1083 due to a short circuit of the switching element of the induction heating driver 1113, the electric fuse is operated to cut off the circuit to induce heating printing. The driving of the circuit board 1110 and the noise printed circuit board 1083 may be stopped.

The working coil 1140 is formed of a wire wound in an annular shape. In addition, both ends of the working coil 1140 are connected to the output terminals OUPT (ie, SOUPT1 and SOUPT2) of the induction heating printed circuit board 1110, and are connected to the induction heating printed circuit board 1110 (particularly, the induction heating driver 1113). The induction heating operation can be controlled by this.

The hot water tank 1130 may be disposed to face the working coil 1140 at a position spaced apart from the working coil 1140, and may be inductively heated by the working coil 1140 to heat the liquid passing through the internal space. In addition, the hot water tank 1130 may be induction heated by the working coil 1140 to heat the liquid (that is, purified water) passing through the internal space thereof. In addition, the hot water tank 1130 is coupled with the bracket 1160 (see FIG. 3) with the working coil 1140 interposed therebetween, and the hot water tank 1130 has a preset temperature (for example, the bracket 1160 (see FIG. 3)). , 450 ° C.) may be provided with a thermal fuse 1118 that operates when overheated. As described above, one end of the thermal fuse 1182 may be connected to the other end of the input power supply unit 100, and the other end of the thermal fuse 1182 may be connected to one end of the noise printed circuit board 1083.

The induction heating printed circuit board 1110 may control the induction heating operation of the working coil 1140 by receiving AC power with reduced noise from the noise printed circuit board 1083.

Specifically, the induction heating printed circuit board 1110 includes a rectifier 1111, a DC link capacitor 1112, an induction heating driver 1113, an induction heating control unit 1114, a gate driver 1115, a resonant capacitor 1116, The insulating members 1117a and 1117b, the water-cooled heat sink 1118, and the fixing member 1184 may be included.

The rectifier 1111 may convert the AC power provided from the input terminal INPT into DC power and supply the DC power to the induction heating driver 1113.

In detail, the rectifier 1111 may rectify and convert the AC power supplied from the input terminal INPT into DC power, and supply DC power to the induction heating driver 1113. In addition, the rear side of the rectifying unit 1111 is equipped with a water-cooled heat sink 1118, the heat generated during the driving of the rectifier 1111 may be radiated through the water-cooled heat sink (1118). The rectifying unit 1111 may be fixed to the water-cooled heat sink 1118 through the fixing member 1184. In addition, the rectifier 1111 may include, for example, a bridge diode, but is not limited thereto.

For reference, the DC power rectified by the rectifier 1111 may be provided to the DC link capacitor 1112, and the DC link capacitor 1112 may reduce ripple of the DC power.

As described above, the DC power rectified by the rectifier 150 and the ripple is reduced by the DC link capacitor 1112 may be supplied to the induction heating driver 1113.

The induction heating driver 1113 may receive a DC power from the rectifier 1111 to perform a switching operation. That is, the induction heating driver 1113 may be rectified by the rectifier 1111 and may be provided with DC power having a reduced ripple by the DC link capacitor 1112. In addition, the switching operation may be controlled by the induction heating control unit 1113 by the induction heating control unit 1114, and may apply a resonance current to the working coil 1140 through the switching operation. That is, the induction heating driver 1113 may drive the working coil 1140 by providing a resonance current to the working coil 1140, and accordingly, the working coil 1140 may perform the induction heating operation. In addition, the water-cooled heat sink 1118 is mounted on the rear surface of the induction heating driver 1113, and heat generated when the induction heating driver 1113 is driven may be radiated by the water-cooled heat sink 1118. In addition, the induction heating driver 1113 may be fixed to the water-cooled heat sink 1118 through the fixing member 1184. In addition, the induction heating driver 1113 includes a plurality of switching elements (for example, even switching elements) for performing a switching operation, and each of the plurality of switching elements may include, for example, an insulated gate bipolar mode transistor (IGBT). It may include, but is not limited thereto.

For reference, the plurality of switching elements may be alternately turned on and off by the switching signal provided from the gate driver 1115. In addition, high frequency alternating current (ie, resonant current) may be generated by the switching operation of the plurality of switching elements, and the generated high frequency alternating current may be applied to the working coil 1140.

The induction heating control unit 1114 may control the switching operation of the induction heating driving unit 1113. That is, the induction heating control unit 1114 may control the switching operation of the induction heating driver 1113 by controlling the gate driver 1115 that turns on or off the switching element provided in the induction heating driver 1113.

The gate driver 1115 is controlled by the induction heating control unit 1114, and may turn on or off the switching element provided in the induction heating driver 1113. That is, the switching operation of the switching element provided in the induction heating driver 1113 may be controlled according to the switching signal of the gate driver 1115.

For reference, the gate driver 1115 may generate various switching signals through a pulse width modulation (PWM) function.

The resonant capacitor 1116 may be connected to the working coil 1140 through the output terminal OUPT. In the case of the resonant capacitor 1116, when the switching operation of the induction heating driver 1113 starts (that is, when a voltage is applied by the switching operation), resonance is started. In addition, when the resonant capacitor 1116 resonates, a current flowing through the working coil 1140 connected to the resonant capacitor 1116 increases.

Through this process, the eddy current is induced to the hot water tank 1130 disposed near the working coil 1140 connected to the resonant capacitor 1116.

The first insulating member 1117a may be attached between the rectifier 1111 and the water-cooled heat sink 1118. That is, the first insulating member 1117a may be attached between the rear surface of the rectifier 1111 and the water cooled heat sink 1118 to insulate the rectifier 1111 from the water cooled heat sink 1118. As a result, even when the rectifier 1111 is abnormally operated or destroyed, the electrical conduction between the electricity of the rectifier 1111 and the water of the water-cooled heat sink 1118 may be prevented.

For reference, the first insulating member 1117a may include, for example, a ceramic heat sink made of insulating paper or alumina. In addition, when the first insulation member 1117a includes a ceramic heat sink made of alumina, securing an insulation distance (eg, 2 mm) between the rectifying portion 1111 and the water-cooled heat sink 1118 and improving the thermal conductivity (eg, 20 W / mk and above; W: Watt, m: meter, K: Kelvin).

The second insulating member 1117b may be attached between the induction heating driver 1113 and the water-cooled heat sink 1118. That is, the second insulating member 1117b may be attached between the rear surface of the induction heating driver 1113 and the water cooling heat sink 1118 to insulate between the induction heating driver 1113 and the water cooling heat sink 1118. As a result, even when the induction heating driver 1113 malfunctions or is broken, the electrical conduction between the electricity of the induction heating driver 1113 and the water of the water-cooled heat sink 1118 may be prevented.

For reference, the second insulating member 1117b may include, for example, a ceramic heat sink made of insulating paper or alumina. In addition, when the second insulating member 1117b includes a ceramic heat sink made of alumina, securing an insulation distance (eg, 2 mm) between the induction heating driver 1113 and the water-cooled heat sink 1118 and improving the thermal conductivity (eg, 20W / mk or more).

The water-cooled heat sink 1118 may perform heat radiation of the rectifier 1111 and the induction heating driver 1113. 5 and 6, the water-cooled heat sink 1118 is mounted on the rear surface of the rectifier 1111 and the induction heating driver 1113, and has a first insulation between the water-cooled heat sink 1118 and the rectifier 1111. The member 1117a may be attached, and the second insulating member 1117b may be attached between the water-cooled heat sink 1118 and the induction heating driver 1113.

And the material of the water-cooled heat sink may be made of, for example, aluminum, but is not limited thereto.

For reference, the water-cooled heat sink 1118 is a heat dissipation work using water, the purified water may be introduced into the water-cooled heat sink 1118 through the flow path of the water purifier described above. In addition, the purified water introduced into the water-cooled heat sink 1118 may be preheated by a heat radiation operation of the water-cooled heat sink 1118. Accordingly, the temperature of the purified water flowing into the hot water tank 1130 through the water-cooled heat sink 1118 may be higher than when the air-cooled heat sink is used. Accordingly, the output of the working coil 1140 (that is, the output of the induction heating driver 1113) required to achieve the target temperature can be reduced.

However, when the power semiconductor elements (that is, the rectifier 1111 and the induction heating driver 1113) are fixed to the water-cooled heat sink 1118 through screws, the electricity is water-cooled through the screws during abnormal operation or breakdown of the power semiconductor elements. Electric shock may occur due to the water inside the heat sink 1118.

Accordingly, as shown in FIG. 6, the power semiconductor device (ie, the rectifying unit 1111 and the induction heating driving unit 1113) is fixed to the water-cooled heat sink 1118 through the fixing member 1184. Referring to FIGS. 7 and 8, the fixing structure of the power semiconductor device will be described.

7 is a perspective view illustrating a power semiconductor device fixing structure of FIG. 6. 8 is an exploded perspective view of FIG. 7.

7 and 8, the rectifier 1111 and the induction heating driver 1113 may be fixed to the water-cooled heat sink 1118 through the fixing member 1184.

Specifically, the water-cooled heat sink 1118 is mounted on the rear surface of each of the rectifier 1111 and the induction heating driver 1113, and the fixing member 1184 may face the front and side surfaces of the rectifier 1111 and the induction heating driver 1113, respectively. It is formed to surround the rectifying unit 1111 and the induction heating driver 1113 can be fixed to the water-cooled heat sink (1118).

That is, the rectifying part 1111 is fixed to the first portion P1 of the rear surface of the fixing member 1184, and the induction heating driving part is disposed on the second portion P2 spaced apart from the first portion P1 of the rear surface of the fixing member 1184. 1113 may be fixed. In addition, holes H1 and H2 penetrating the fixing member 1184 in the front-rear direction FB in the third portion P3 which is not overlapped with the first and second portions P1 and P2 of the rear surface of the fixing member 1184. , H3 may be formed, and fixing screws FS1, FS2, and FS3 for fixing the fixing member 1184 to the water-cooled heat sink 1118 may be inserted into the holes H1, H2, and H3.

Here, the first portion P1 may be provided with a first protrusion PR1 protruding backward to penetrate the rectifying portion 1111 and coupled to the water-cooled heat sink 1118.

Accordingly, the rectifying part 1111 is fixed between the fixing member 1184 and the water-cooled heat sink 1118 through the first protrusion PR1 (made of an insulating material) instead of a screw, thereby preventing abnormal operation or insulation of the rectifying part 1111. Even when broken, electricity is not conducted to the water inside the water-cooled heat sink 1118.

For reference, the first protrusion PR1 may also penetrate the first insulating member 1117a.

On the other hand, the second portion (P2) may be provided with a second protrusion (PR2) protruding to the rear to penetrate the induction heating driver 1113, coupled to the water-cooled heat sink (1118).

Accordingly, the induction heating driver 1113 is fixed between the fixing member 1184 and the water-cooled heat sink 1118 through the second protrusion PR2 (made of an insulating material) instead of a screw. Even during abnormal operation or insulation breakdown, electricity is not conducted to the water inside the water-cooled heat sink 1118.

For reference, the second protrusion PR2 may also penetrate the second insulating member 1117b.

The third portion P3 may include a first sub portion SP1 positioned on one side of the rectifier 1111, a second sub portion positioned between the other side of the rectifier 1111 and one side of the induction heating driver 1113. SP2) and a third sub-part SP3 positioned on the other side of the induction heating driver 1113.

In addition, the hole is formed through the first hole H1 formed in the first sub-part SP1 to penetrate the fixing member 1184 in the front-rear direction FB, and the hole to penetrate the fixing member 1184 in the front-back direction FB. And a second hole H2 formed in the second sub-part SP2 and a third hole H3 formed in the third sub-part SP3 so as to penetrate the fixing member 1184 in the front-rear direction FB. Can be.

The fixing screws FS1 to FS3 are inserted into the holes H1 to H3, and the fixing member 1184 is fixed to the water-cooled heat sink 1118 through the fixing screws FS1 to FS3. A first fixing screw FS1 inserted into the H1 and coupled to the water-cooled heat sink 1118, a second fixing screw FS2 inserted into the second hole H2 and coupled to the water-cooled heat sink 1118, and The third fixing screw FS3 may be inserted into the three holes H3 and coupled to the water-cooled heat sink 1118.

For reference, the fixing member 1184 may be made of at least one material of, for example, poly phenyl sulphide (PPS) and polycarbonate (PC).

Specifically, PPS is an engineering plastic having excellent strength, heat resistance, chemical resistance, dimensional stability, and the like. Since PPS is a thermoplastic resin, it is easy to mold and inexpensive.

In addition, PC has the advantages of excellent toughness, impact strength, heat resistance, low temperature characteristics, electrical characteristics, dimensional stability, weather resistance, etc., stable to light, low oxidation during processing, strong against water and strong acid, and no toxicity.

That is, the fixing member 1184 is made of the above-described material, it can serve as an insulating injection molding. In particular, even during abnormal operation or dielectric breakdown of the power semiconductor element (that is, the rectifier 1111 or the induction heating driver 1113), electricity can pass through the first and second protrusions PR1 and PR2 made of an insulating material. It is possible to prevent an electric shock accident.

As a result, in the embodiment of the present invention, the water-cooled heat sink 1118 and the power semiconductor element (that is, the rectifier 1111 and the induction heating driver 1113) have a double insulation structure (i.e., the first and second insulation members 1117a). 1117b and the fixing member 1184 are applied to prevent an electric shock accident.

As described above, the water purifier 1000 according to the embodiment of the present invention may improve the heat dissipation performance and the hot water continuous water output of the power semiconductor device through the water-cooled heat sink. In addition, the water-cooled heat sink is smaller in size than the conventional air-cooled heat sink, it is possible to reduce the volume of the induction heating printed circuit board compared to the conventional. In addition, the water is pre-heated through the water-cooled heat sink to reduce the output of the induction heating drive (or working coil) required to achieve the target temperature, thereby saving power.

In addition, in the water purifier 1000 according to an embodiment of the present invention, the power semiconductor device may be stably fixed to the water-cooled heat sink. Furthermore, the water purifier according to the present invention can prevent the conduction of electricity and water during abnormal operation or breakdown of the power semiconductor device, and can prevent an electric shock accident.

Although the present invention has been described with reference to the drawings exemplified as above, the present invention is not limited to the embodiments and drawings disclosed herein, and various modifications may be made by those skilled in the art within the scope of the technical idea of the present invention. It is obvious that modifications can be made. In addition, even if the above described embodiments of the present invention while not explicitly described by describing the effect of the configuration of the present invention, it is obvious that the effect predictable by the configuration is also to be recognized.

1083: noise printed circuit board 1110: induction heating printed circuit board
1111: rectifier 1113: induction heating drive
1118: water-cooled heat sink 1184: fixing member

Claims (11)

A noise printed circuit board for reducing noise of AC power output from an input power supply unit; And
Including the induction heating printed circuit board receives the AC power is reduced noise from the noise printed circuit board, and controls the induction heating operation of the working coil based on the supplied AC power,
The induction heating printed circuit board,
A rectifier for rectifying the AC power supplied from the noise printed circuit board into DC power, an induction heating driver configured to perform a switching operation by receiving the DC power from the rectifier, and a rear side of the rectifier and the induction heating driver. It includes a water-cooled heat sink for performing the heat radiation operation of the rectifying unit and the induction heating drive unit, and a fixing member for fixing the rectifying unit and the induction heating drive unit to the water-cooled heat sink.
water purifier.
The method of claim 1,
The water-cooled heat sink is mounted on the rear of each of the rectifier and the induction heating drive,
The fixing member is formed to surround front and side surfaces of each of the rectifying part and the induction heating driving part to fix the rectifying part and the induction heating driving part to the water-cooled heat sink.
water purifier.
The method of claim 1,
The rectifying part is fixed to the first portion of the rear surface of the fixing member,
The induction heating driver is fixed to a second portion of the rear surface of the fixing member spaced apart from the first portion,
A third portion of the rear surface of the fixing member which is not overlapped with the first and second portions is formed with a hole penetrating the fixing member in the front-rear direction,
A fixing screw is inserted into the hole to fix the fixing member to the water-cooled heat sink.
water purifier.
The method of claim 3,
The third portion may include a first sub portion positioned on one side of the rectifier, a second sub portion positioned between the other side of the rectifier and one side of the induction heating driver, and a third portion located on the other side of the induction heating driver. Containing sub-part
water purifier.
The method of claim 4, wherein
The hole may include a first hole formed in the first sub portion to penetrate the fixing member in the front and rear direction, a second hole formed in the second sub portion so as to penetrate the fixing member in the front and rear direction, and A third hole formed in the third sub portion to penetrate the fixing member in the front and rear directions;
The fixing screw may include a first fixing screw inserted into the first hole and coupled to the water-cooling heat sink, a second fixing screw inserted into the second hole and coupled to the water-cooling heat sink, and inserted into the third hole. A third fixing screw coupled to the water-cooled heat sink.
water purifier.
The method of claim 3,
The fixing member,
A first protrusion protruding from the first portion to penetrate the rectifying portion, and coupled to the water-cooled heat sink;
A second protrusion protruding from the second portion to penetrate the induction heating driver, and coupled to the water-cooled heat sink;
water purifier.
The method of claim 6,
The rectifying part is fixed between the fixing member and the water-cooled heat sink through the first protrusion,
The induction heating driver is fixed between the fixing member and the water-cooled heat sink through the second protrusion.
water purifier.
The method of claim 1,
The fixing member is made of at least one material of poly phenylene sulfide (PPS) and polycarbonate (PC).
water purifier.
The method of claim 1,
The rectifier includes a bridge diode,
The induction heating driver includes a plurality of switching elements for performing the switching operation.
water purifier.
The method of claim 9,
The plurality of switching elements each include an insulated gate bipolar mode transistor (IGBT)
water purifier.
The method of claim 1,
The induction heating printed circuit board,
A DC link capacitor which reduces the ripple of the DC power rectified by the rectifier and provides the DC power having the ripple reduced to the induction heating driver;
An induction heating control unit which controls the switching operation of the induction heating drive unit;
A gate driver controlled by the induction heating control unit, and configured to turn on or off a switching element provided in the induction heating driver;
A resonance capacitor which starts resonance when the switching operation of the induction heating driver starts;
A first insulating member attached between the rectifying unit and the water-cooled heat sink;
Further comprising a second insulating member attached between the induction heating drive and the water-cooled heat sink
water purifier.

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