KR102053422B1 - Light emitting device, manufactured method of the light emitting device and lighting apparatus - Google Patents

Abstract

The light emitting device according to the embodiment may have an upper portion between the first and second side portions corresponding to each other, the third and fourth side portions adjacent to the first and second side portions, and the first to fourth side portions. A body having an open recess; A first lead frame disposed in the first region of the concave portion; A second lead frame disposed in the second region of the concave portion; A light emitting chip disposed on at least one of the first and second lead frames; And a molding member disposed in the recess to protect the light emitting chip, wherein the body has a length longer than the length of the third and fourth side portions, and the length of the first and second side portions is increased. The first side portion and the second side portion include a plurality of recesses recessed inwardly of the body so as to be connected to the lower surface of the body, wherein the plurality of recess portions are spaced apart from each other on the first side portion and the second side portion, respectively. do.

Description

LIGHT EMITTING DEVICE, MANUFACTURED METHOD OF THE LIGHT EMITTING DEVICE AND LIGHTING APPARATUS}

The present embodiment relates to a light emitting device, a light emitting device manufacturing method and an illumination device.

A light emitting device, such as a light emitting device, is a kind of semiconductor device that converts electrical energy into light, and has been spotlighted as a next-generation light source by replacing an existing fluorescent lamp and an incandescent lamp.

Since light emitting diodes generate light using semiconductor devices, they consume much less power than incandescent lamps that generate light by heating tungsten or fluorescent lamps that generate light by colliding ultraviolet light generated through high-pressure discharges with phosphors. .

In addition, since the light emitting diode generates light using the potential gap of the semiconductor device, the light emitting diode has a longer life, a faster response characteristic, and an environment-friendly characteristic than a conventional light source.

Accordingly, many researches are being conducted to replace the existing light sources with light emitting diodes, and the light emitting diodes are increasingly used as light sources of lighting devices such as various lamps, liquid crystal displays, electronic displays, and street lamps that are used indoors and outdoors. have.

The embodiment provides a light emitting device having a new structure.

The embodiment provides a light emitting device having at least one recess in at least one of the first and second side surfaces of the body.

The embodiment provides a light emitting device having a plurality of recesses on the first and second side surfaces of the body.

The embodiment provides a light emitting device having a plurality of recesses having different lengths or depths on first and second side surfaces of the body.

The embodiment provides a light emitting device including a cavity in which an upper portion of a body having the lease portion is opened.

The embodiment provides a method of manufacturing a light emitting device for supporting a body by inserting a hanger in a recess part when the body is ejected.

The light emitting device according to the embodiment may have an upper portion between the first and second side portions corresponding to each other, the third and fourth side portions adjacent to the first and second side portions, and the first to fourth side portions. A body having an open recess; A first lead frame disposed in the first region of the concave portion; A second lead frame disposed in the second region of the concave portion; A light emitting chip disposed on at least one of the first and second lead frames; And a molding member disposed in the recess to protect the light emitting chip, wherein the body has a length longer than the length of the third and fourth side portions, and the length of the first and second side portions is increased. The first side portion and the second side portion include a plurality of recesses recessed inwardly of the body so as to be connected to the lower surface of the body, wherein the plurality of recess portions are spaced apart from each other on the first side portion and the second side portion, respectively. do.

The lighting system according to the embodiment includes a module in which the light emitting devices are arrayed.

The embodiment can prevent damage to the body during injection molding of the light emitting device.

The embodiment can improve the yield of the light emitting device.

The embodiment can improve the reliability of the light emitting device.

The embodiment can improve the reliability of the light emitting device and the lighting device having the same.

1 is a view showing a perspective view of a light emitting device according to the first embodiment.
FIG. 2 is a cross-sectional view taken along the AA side of the light emitting device of FIG. 1.
FIG. 3 is a view seen from the first side of the light emitting device of FIG. 1.
FIG. 4 is a view seen from the second side of the light emitting device of FIG. 1.
5 is a partially enlarged view of FIG. 3.
6 is a rear view of the light emitting device of FIG. 1.
FIG. 7 is a partially enlarged view of the light emitting device of FIG. 6.
8 is a cross-sectional view taken along the BB side of the light emitting device of FIG. 6.
9 is a cross-sectional view of the center side of the light emitting device of FIG. 6.
10 to 14 are views showing a manufacturing process of the light emitting device.
15 and 16 are views illustrating another arrangement structure of the recessed portion of the light emitting device of FIG. 6.
17 is a view illustrating a position of a manufacturing runner of the light emitting device of FIGS. 15 and 16.
18 and 19 are side cross-sectional views of a light emitting device according to a second embodiment, showing different shapes and hangers of a recess.
20 and 21 are side cross-sectional views of a light emitting device according to a third embodiment, showing different shapes and hangers of a recess.
22 and 23 are side cross-sectional views of a light emitting device according to an embodiment, and illustrate examples of deformation of a shape of a recess.
24 to 27 are rear views of the light emitting device according to the fifth embodiment, and show an example in which the positions and shapes of the recesses are modified.
28 and 29 are rear views of the light emitting device according to the sixth embodiment, and illustrate a length and a hanger of a recess.
30 to 32 are rear views of the light emitting device according to the seventh embodiment, and show modified examples of the recess.
33 is a plan view of a light emitting device according to an eighth embodiment.
34 to 37 are diagrams illustrating back examples of the light emitting device of FIG. 33.
38 is a plan view of a light emitting device according to a ninth embodiment.
39 is a plan view of a light emitting device according to a tenth embodiment.
40 is a rear view of the light emitting device of FIG. 39.
41 is a side cross-sectional view of the light emitting device of FIG. 39.
42 illustrates an example of a light emitting chip of a light emitting device according to the embodiment.
43 is a view showing another example of a light emitting chip of the light emitting device according to the embodiment.
44 is a perspective view illustrating a display device having a light emitting device according to the embodiment.
45 is a perspective view illustrating a display device having a light emitting device according to the embodiment.
46 to 48 illustrate a lighting apparatus according to the embodiment.
49 and 50 are diagrams illustrating another example of the lighting apparatus according to the embodiment.

In the description of the embodiment, each substrate, frame, sheet, layer, or pattern is formed "on" or "under" of each substrate, frame, sheet, layer, or pattern. In the case of what is described as being intended, "on" and "under" include both "directly" or "indirectly" formed. . In addition, the criteria for the top or bottom of each component will be described with reference to the drawings. The size of each component in the drawings may be exaggerated for description, and does not mean a size that is actually applied.

Hereinafter, the embodiments will be apparent from the accompanying drawings and the description of the embodiments. In the drawings, sizes are exaggerated, omitted, or schematically illustrated for convenience and clarity of description. In addition, the size of each component does not necessarily reflect the actual size. Like reference numerals denote like elements throughout the description of the drawings.

Hereinafter, a light emitting device according to an embodiment will be described with reference to the accompanying drawings.

1 is a perspective view of a light emitting device according to a first embodiment, FIG. 2 is a sectional view taken along the AA side of the light emitting device of FIG. 1, and FIG. 3 is a view seen from the first side of the light emitting device of FIG. 4 is a view from the second side of the light emitting device of FIG. 1, FIG. 5 is a partially enlarged view of FIG. 3, FIG. 6 is a rear view of the light emitting device of FIG. 1, and FIG. 7 is a part of the light emitting device of FIG. 6. 8 is an enlarged view of a BB side of the light emitting device of FIG. 6, and FIG. 9 is a cross-sectional view of the center side of the light emitting device of FIG. 6.

1 to 9, the light emitting device 100 includes a body 10 having a concave portion 16, a first lead frame 21 having a first cavity 25, and a second cavity 35. And a second lead frame 31, a connection frame 46, light emitting chips 71 and 72, wires 73 to 76, and a molding member 40.

The body 10 may include an insulating material or a conductive material. The body 10 may include at least one of a resin material such as polyphthalamide (PPA), silicon (Si), a metal material, photo sensitive glass (PSG), sapphire (Al ₂ O ₃ ), and a printed circuit board (PCB). It can be formed as one. For example, the body 10 may be made of a resin material such as polyphthalamide (PPA), epoxy, or silicone. In the epoxy or silicon material used as the body 10, a filler, which is a metal oxide such as TiO ₂ or SiO ₂ , may be added to increase reflection efficiency.

The shape of the body 10 may be formed in a polygonal structure such as a triangle, a square, a pentagon, or a circular or curved shape when viewed from above.

The body 10 has a predetermined depth and an open top, and includes a concave portion 16 having an inner surface 16-1 and a bottom. The concave portion 16 may be formed in the form of a concave cup structure, a cavity structure, or a recess structure from the upper portion 15 of the body 10, but is not limited thereto. The side 16-1 of the recess 16 may be perpendicular or inclined with respect to the floor.

The shape of the concave portion 16 viewed from above may be a polygonal shape having a circular shape, an ellipse shape, a polygonal shape (for example, a rectangle), and a curved edge.

The body 10 may include a plurality of side parts, for example, four side parts 11-14. At least one of the plurality of side parts 11-14 may be disposed to be perpendicular or inclined with respect to a lower surface of the body 10. For example, the side portions 11-14 of the body 10 may be inclined at a first angle θ1 with respect to a line segment perpendicular to the bottom surface of the body 10, and the first angle θ1. ) May be formed in the range of 1 to 10 degrees. Since the side portions 11-14 of the body 10 are formed to be inclined, separation of the mold for ejecting is easy.

The body 10 describes first to fourth side parts 11 to 14 as an example, and the first side part 11 and the second side part 12 are opposite to each other, and the third side part 13 and The fourth side portions 14 are opposite sides. The length of each of the first side portion 11 and the second side portion 12 may be different from that of the third side portion 13 and the fourth side portion 14, for example, the first side portion 11 and the second side portion. The length of the side portion 12 may be formed longer than the length of the third side portion 13 and the fourth side portion 14. The length of the first side portion 11 or the second side portion 12 may be an interval between the third side portion 13 and the fourth side portion 14, and the length direction of the body 10 may be a first direction. The direction of the axis X may be a direction passing through the centers of the second and third cavities 25 and 35, or an interval between the third and fourth side portions 13 and 14. The width direction of the body 10 is a second axis (Y) axis direction, a direction perpendicular to the first axis (X) direction and the width direction of the body 10, or the first and second side portions 11, 12).

The length X1 of the body 10 may be formed two times or more, for example, three times or more longer than the width Y1. Since the length X1 of the body 10 is long, a problem may occur that the middle portion of the body 10 is bent or broken during injection molding. The embodiment is for preventing the body 10 from being damaged due to the length of the body 10 so that the yield of the light emitting device is lowered. The first lead frame 21 is disposed in the first region of the recess 16, a portion of which is disposed at the bottom of the recess 16, and more than the bottom of the recess 16 in the inner region thereof. The first cavity 25 having a low depth is disposed. The first cavity 25 has a shape concave from the bottom of the concave portion 16 toward the lower surface of the body 10, for example, a cup structure or a recess shape.

Sides and bottoms of the first cavity 25 are formed by the first lead frame 21, and circumferential side surfaces of the first cavity 25 are inclined or perpendicular to the bottom of the first cavity 25. Can be bent. Two opposite sides of the side surface of the first cavity 25 may be inclined at the same angle or inclined at different angles.

The second lead frame 31 is disposed in a second area spaced apart from the first area of the concave part 16, and a part of the second lead frame 31 is disposed on the bottom of the concave part 16, and the concave part is located in an inner area thereof. A concave second cavity 35 having a depth lower than the bottom of 16 is formed. The second cavity 35 includes a concave shape, for example, a cup structure or a recess shape, in the direction of the bottom surface of the body 10 from an upper surface of the second lead frame 31. The bottom and side surfaces of the second cavity 35 are formed by the second lead frame 31, and the side surfaces of the second cavity 35 are bent or vertically bent from the bottom of the second cavity 35. Can be. Two sides corresponding to the side surfaces of the second cavity 35 may be inclined at the same angle or inclined at different angles.

The first cavity 25 and the second cavity 35 may be formed in the same shape when viewed from above, but is not limited thereto.

The bottom shape of the first cavity 25 and the second cavity 35 may be a rectangle, a regular rectangle, or a portion having a curved surface, a circle, or an ellipse shape as shown in FIG. 6, but is not limited thereto. .

Each of the inner regions of the first lead frame 21 and the second lead frame 31 is exposed to the lower portion of the body 10 and may be disposed on the same plane or a different plane as the bottom surface of the body 10. Can be.

2 to 6, the first lead frame 21 includes a first lead portion 23, and the first lead portion 23 penetrates through the body 10 to form a body of the body 10. It may protrude into the three side portions 13. The second lead frame 31 includes a second lead part 33, and the second lead part 33 is disposed under the body 10 and the first side part 13 of the body 10. It may protrude to the second side portion 14 opposite to).

The first lead frame 21 and the first lead portion 23 and the second lead frame 31 and the second lead portion 33 exposed on the lower surface of the body 10 may be mounted on a circuit board. Can be. The first lead frame 21 and the second lead frame 31 may have a thickness of 0.15 mm or more, for example, 0.18 mm or more. The first and second lead frames 21 and 31 may function as lead frames for supplying power.

The connection frame 46 is disposed between the first lead frame 21 and the second lead frame 31 in the bottom region of the recess 16 to serve as an intermediate connection terminal. As shown in FIG. 3, a portion 46-1 of the connection frame 46 may be exposed on the first side portion 11 of the body 10.

The first lead frame 21, the second lead frame 31 and the connection frame 46 may be formed of a metal material, for example, titanium (Ti), copper (Cu), nickel (Ni), gold (Au), It may include at least one of chromium (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), and phosphorus (P), and may be formed of a single metal layer or a multilayer metal layer. The first and second lead frames 21 and 31 may have the same thickness, but the thickness of the first and second lead frames 21 and 31 is not limited thereto.

The first light emitting chip 71 is disposed in the first cavity 25 of the first lead frame 21, and the first light emitting chip 71 is the first cavity 25 as the first bonding member 81. ) Is adhered to. A second light emitting chip 72 is disposed in the second cavity 35 of the second lead frame 31, and the second light emitting chip 72 is a second cavity 35 as the second bonding member 82. ) Is adhered to. The first and second bonding members 81 and 82 may be insulating adhesives or conductive adhesives. The insulating adhesive may include a material such as epoxy or silicon, and the conductive adhesive may include a bonding material such as solder. The first and second bonding members 81 and 82 may further include, but are not limited to, metal oxides to improve thermal conductivity.

The first and second light emitting chips 71 and 72 may selectively emit light in a range of visible light to ultraviolet light, for example, a red LED chip, a blue LED chip, a green LED chip, and a yellow green LED. It can be chosen from chips. The first and second light emitting chips 71 and 72 include an LED chip including at least one of a compound semiconductor of group III-V elements and a compound semiconductor of group II-VI elements.

The first light emitting chip 71 is connected to the first lead frame 21 disposed on the bottom of the concave portion 16 by a first wire 73 and the connection frame 46 by a second wire 74. ). The second light emitting chip 72 is connected to the connection frame 46 by a third wire 75, and a second lead frame 31 disposed on the bottom of the recess 16 by a fourth wire 76. ). The connection frame 46 electrically connects the first light emitting chip 71 and the second light emitting chip 72.

The protection element may be disposed on the first lead frame 21 or a part of the second lead frame 31. The protection element may be implemented as a thyristor, a zener diode, or a transient voltage suppression (TVS), and the zener diode protects the light emitting chip from electro static discharge (ESD). The protection element may be connected to the connection circuits of the first light emitting chip 71 and the second light emitting chip 72 in parallel, thereby protecting the light emitting chips 71 and 72.

A molding member 40 may be formed in the concave portion 16, the first cavity 25, and the second cavity 35. The molding member 40 may include a light transmissive resin layer such as silicon or epoxy, and may be formed in a single layer or multiple layers.

In addition, the molding member 40 may include a phosphor for converting a wavelength of light emitted onto the light emitting chips 71 and 72, and the phosphor may include the first cavity 25 and the second cavity ( It may be added to the molding member 40 formed in at least one region of 35, but is not limited thereto. The phosphor excites a part of light emitted from the light emitting chips 71 and 72 to emit light of different wavelengths. The phosphor may be selectively formed among YAG, TAG, Silicate, Nitride, and Oxy-nitride based materials. The phosphor may include at least one of a red phosphor, a yellow phosphor, and a green phosphor, but is not limited thereto. The surface of the molding member 40 may be formed in a flat shape, concave shape, convex shape and the like, but is not limited thereto.

The surface of the molding member 40 may be a light exit surface. A lens may be disposed above the molding member 40, and the lens may include a convex lens, a concave lens, and a convex lens having a total reflection surface at the center of the light emitting chips 71 and 72. It is not limited to.

1, 3, 4, and 6, at least one recess structure (hereinafter, abbreviated as recess portion) in at least one of the first and second side portions 11 and 12 of the body 10 is referred to. It may include. The recess portion is formed in a concave shape in the inward direction of the body 10 than the surfaces of the first and second side portions (11, 12), when the injection molding of the body (10) the body (10) This is the area where hangers are inserted. Hereinafter, an example in which recesses are disposed in the first and second side parts 11 and 12 will be described for the purpose of explanation.

3, 4, and 6, first and second recesses 51 and 52 are disposed in the first side portion 11 of the body 10, and a third portion is disposed in the second side portion 12. And fourth recesses 53 and 54 are disposed. The distance D1 between the first and second recesses 51 and 52 is equal to the distance between the third and fourth recesses 53 and 54. The first recess 51 and the third recess 53 are disposed to face each other, and the second recess 52 and the fourth recess 54 are disposed to face each other.

When the first to fourth recesses 51 to 54 are equally spaced apart from the third or fourth side parts 13 and 14, the first to fourth recesses 51 to 54 are disposed at the outermost part as illustrated in FIG. 5. Reference is made to the distance D2 between the recessed portions 51-54 and the first or third side portions 11, 13. The first recess 51 may be spaced apart from the third side surface 13 of the body 10 by more than a predetermined distance D2, and the distance D2 may be 130 μm or more, for example, 130. And may be spaced beyond the range of μm-500 μm. Here, the distance (D2) is disposed on the inner side than the width of the upper portion 15 (T3 of FIG. 2) of the body 10 to the impact transmitted to the body 10 by the first recess 51. It can be minimized. The upper portion 15 width T3 of the body 10 may be 130 μm or more. That is, the outermost recessed portions of the recessed portions 11-15 of the body 10 may be spaced apart from the outer edge of the upper portion 15 of the body 10 in the center direction of the body.

When the heights of the first to fourth recesses 51 to 54 are the same, the height T2 of the recesses 51 to 54 illustrated in FIGS. 5 and 8 will be referred to. The height T2 of the first recess 51 is the height from the lower surface 17 of the body 10, and is equal to or greater than 0.015 mm, for example, the thickness T1 of the lead frames 21 and 31. It may be thick or thinner.

When the first to fourth recesses 51 to 54 have the same width, the width W1 of the first recess 51 shown in FIG. 5 will be referred to. The width W1 of the first recess 51 may be formed to be 50 μm or more, for example, 50 μm to 500 μm, and the width that the insertion protrusion of the hanger can support is at least 50 μm. The width W1 of the first recess portion 51 may be 50 μm or more. In addition, the width W1 may be formed at a ratio less than 1/10 of the length X1 of the body 10, but is not limited thereto.

7 and 8, the depths D4 of the first to fourth recesses 51 to 54 may be the same as or different from the width W1, for example, in a range of 30 μm to 130 μm. Can be formed. The depth D4 of the recesses 51-54 may be 50 μm or more when the width W1 is 100 μm or less.

As illustrated in FIG. 6, the recesses 51-54 of the body 10 may be formed in two or more, four or more, or six to twelve. As the length of the body 10 increases in the long axis direction, the number of the recesses 51 to 54 may also increase, but is not limited thereto. In addition, the recess 51-54 may be symmetrically formed with respect to the line segment in the length X1 direction passing through the center of the cavities 25 and 35 of the body 10, but is not limited thereto. .

1 and 6, the positions of the first and third recesses 51 and 53 connected to the lower surface 17 of the body 10 are centered on the lower surface 22 of the first cavity 25. It is disposed adjacent to the line segment (Y2) passing through, the position of the second and fourth recesses (52, 54) is adjacent to the line segment (Y3) passing through the center of the lower surface 32 of the second cavity (35). To be placed. As another example, the distance D1 between the adjacent recesses 51 and 52 and 53 and 54 may be arranged to be spaced apart from the distance G1 between the first and second cavities 25 and 35. .

Referring to FIG. 7, the distance G2 between the first recess 51 and the lower surface 22 of the first cavity, and the lower surface 22 of the third recess 53 and the first cavity The distance G3 between may be the same or different, but is not limited thereto.

6 and 8, the spacing D3 between each lead frame 21 and 31 and each recess 51-54 is equal to the thickness T1 of each lead frame 21 and 31. Or more spaced apart. For example, the spacing D3 may be spaced apart by 200 μm or more, and when the spacing D3 is narrow, the rigidity of the body 10 may be weakened.

6 and 9, in the first side portion 11 of the body 10, the first lower region 11A between the first and second recess portions 51 and 52 is the body 10. ) May be formed at a second angle θ2 different from the first angle θ1 of the first side surface portion 11 with respect to the bottom surface 17 of. The first angle θ1 may be formed in a range of less than 90 degrees, for example, 60 degrees to 85 degrees. The second angle θ2 may be formed at an angle substantially perpendicular to the bottom surface of the body 10 (eg, 90 degrees to 92 degrees), and the inner side of the hanger may have both side portions of the body 10. The first lower region 11A and the first side portion 11 may be formed at different angles by contacting the first lower regions 11A and 12A in close contact with each other. In the second side portion 12 of the body 10, the second lower region 12A between the third and fourth recessed portions 53 and 54 refers to the first lower region 11A. do.

As described above, recesses 51-54 concave inwardly than the side parts 11 and 12 of the body 10 by using the insertion protrusions of the hangers under the side parts 11 and 12 that are long sides of the body 10. ), While the lower regions 11A and 12A of the side portions 11 and 12 of the body 100 are brought into contact with the inner side of the hanger, thereby causing a problem of breakage of the body 10 having a length relatively longer than the width. Can be reduced. Accordingly, the yield of the light emitting device 100 may be improved, and the reliability of the light emitting device 100 and the lighting system having the same may be improved.

10 to 14 are views illustrating a manufacturing process of the light emitting device according to the first embodiment. The embodiment will be described an example of the manufacturing process of a single light emitting device.

Referring to FIG. 10, the metal frame 20 is processed into a press to form a first lead frame 21 having a first cavity 25, a second lead frame 31 having a second cavity 35, and The supporting frame 46 is supported. In the metal frame 20, a plurality of holes 20A are used to arrange different frames 21, 31, and 46.

In addition, the metal frame 20 includes a first hanger 26 and a second hanger 36. The first hanger 26 is disposed in one direction of the first and second lead frames 21 and 31, and the width of the first hanger 26 corresponds to the distance D1 between adjacent recess portions, and the first and second hangers 26 are disposed at both ends thereof. The second insertion protrusions 27 and 28 protrude. The second hangers 36 are disposed in different directions of the first and second lead frames 21 and 31, and the widths of the second hangers 36 correspond to the gaps D1 of adjacent recess portions, and the third and third ends thereof are disposed at opposite ends thereof. Four insertion protrusions 37 and 38 protrude.

When the upper frame and the lower frame are disposed above and below the metal frame 20 and then injection molded with a body material, the body 10 is injection molded on a predetermined area of the metal frame 20 as shown in FIG. 11. do.

12 to 14, in the first side portion 11 of the body 10, the inner portion 26A of the first hanger 26 is in close contact with the first region 11A, and the first recessed portion ( The first insertion protrusion 27 is inserted into the second insertion protrusion 27, and the second insertion protrusion 28 is inserted into the second lease detail 52. The inner portion 36A of the second hanger 36 is in close contact with the second area 12A of the second side portion 12 of the body 10, and the third recessed portion 37 is formed by the third insertion protrusion 37. 53 is formed, and the fourth recess 54 is formed by the fourth insertion protrusion 38.

In this case, the inner portions 26A and 36A of the first hanger 26 and the second hanger 36 may extend to the first and second regions 11A and 12A of both side portions 11 and 12 of the body 10. By being in close contact with 14, it is possible to prevent the body 10 from falling down. In addition, by supporting the insertion body (27, 28, 37, 38) inserted into each recess 51-54 at different positions of the body 10, the long body 10 is broken Can be prevented.

Subsequently, light emitting chips are mounted on the cavities 25 and 35 of the first and second lead frames, and electrically connected to each other by wires, and then molded by molding members. In addition, the individual light emitting device may be completed by cutting to a size of a predetermined package unit.

15 and 16 are views illustrating another arrangement structure of the recessed portion of the light emitting device of FIG. 6.

Referring to FIG. 15, the number of lease details 51, 52, and 55 disposed on the first side portion 11 of the body 10 and the recess portions 53 and 54 disposed on the second side portion 12 are described. The number is an example different.

A fifth recess 55 is disposed between the first and second recesses 51 and 52 on the first side portion 11, and the fifth recess 55 is inserted during injection molding. The insertion protrusion may be disposed in one region between the first and second lead frames 21 and 31 to further support the body 10 at the boundary portion of the first and second lead frames 21 and 31. .

Referring to FIG. 16, a structure including fifth and sixth recesses 55 and 56 in a central portion of the first and second side portions 11 and 12 of the body 10 is illustrated. The fifth and sixth recesses 55 and 56 may include insertion protrusions inserted during injection molding of the body 10 in both regions between the first and second lead frames 21 and 31. The body 10 at the boundary of the first and second lead frames 21 and 31 may be further supported.

FIG. 17 is a view showing the position of a hanger in the manufacture of the light emitting device of FIGS. 15 and 16, wherein the metal frame 20 is interposed between the first and second insertion protrusions 27 and 28 of the first hanger 26. The structure further includes a projection 29. For the second hanger, refer to the first hanger.

18 to 23 illustrate another example of the recesses, which will be described with reference to the first and third recesses.

18 and 19 are side cross-sectional views of a light emitting device according to a second embodiment, showing different shapes and hangers of a recess.

Referring to FIG. 18, recesses 51A and 53A are formed in the first and third recesses 51 and 53 of the body 10, and the recesses 51A and 53A are upper portions of the body 10. Protrude in the direction. The recessed portions 51A and 53A may have a polygonal shape such as a triangle or a quadrangle, a hemispherical shape, or a rough structure. The height T21 of the first and third recesses 51 and 53 may be used. ) May be thinner than the thickness of the lead frames 21 and 31.

Referring to FIG. 19, convex portions 26-1 and 37-1 are formed in the first and third insertion protrusions 27 and 37, and the convex portions 26-1 and 27-1 are formed in the first and third insertion protrusions 27 and 37. The upper portions of the two hangers 26 and 36 may be formed by etching, or may be formed by pressing, but the present invention is not limited thereto. The convex portions 26-1 and 37-1 may increase the coupling force with the body 10, thereby reducing the insertion depth of the first and second insertion protrusions 27 and 37.

20 and 21 are side cross-sectional views of a light emitting device according to a third embodiment, showing different shapes and hangers of a recess.

Referring to FIG. 20, convex portions 51B and 53B are formed in the first and third recessed portions 51 and 53 of the body 10, and the convex portions 51B and 53B are formed in the lower portion of the body 10. Protrude in the direction. The convex portions 51B and 53B may have a polygonal shape such as a triangle or a square, a hemispherical shape, or a rough structure such as an uneven structure. The heights of the first and third recesses 51 and 53 may be formed to have the same thickness as that of the lead frames 21 and 31.

Referring to FIG. 21, recesses 26-2 and 37-2 are formed in the first and third insertion protrusions 27 and 37, and the recesses 26-2 and 27-2 are formed in the first and third insertion protrusions 27 and 37. It can be formed in the notch shape of the two hangers (26, 36), but is not limited thereto. The recesses 26-2 and 37-2 may increase the coupling force with the body 10, thereby reducing the insertion depth of the first and second insertion protrusions 27 and 37.

22 and 23 are side cross-sectional views of a light emitting device according to an embodiment, and illustrate examples of deformation of a shape of a recess.

Referring to FIG. 22, the height T5 of the first and third recesses 51-1 and 53-1 disposed on the body 10 is 1 / 3- of the thickness of the first lead frame 21. It may be formed in the range of 1/5, but is not limited thereto. For the second and fourth recesses, reference is made to the above description.

Referring to FIG. 23, the first and third recesses 51-2 and 53-2 disposed on the body 10 have a triangular side cross-sectional shape inward from the first and second side parts 11 and 12. Protrudes. It arranges the insertion protrusions of the triangular shape on the side portions 11 and 12 that are not in contact with the lower surface 17 of the body 10, thereby forming the first and third recesses 51-2 and 53-2. can do.

24 to 27 are rear views of the light emitting device according to the fifth embodiment, and show an example in which the positions and shapes of the recesses are modified.

Referring to FIG. 24, the body 10 of the light emitting device includes recesses 55A and 56A disposed on the first and second side portions 11 and 12 to correspond to each other, and the recesses 55A, 56A is disposed to correspond to each other based on the center line Y0 perpendicular to the center of the first axis X in the longitudinal direction of the body 10. The center line Y0 is a line in the second axis direction perpendicular to the center in the first axis direction, and may be a line connecting the centers of the first and second side parts 11 and 12.

The recesses 55A and 56A are disposed to correspond to the center line Y0 perpendicular to the center of the first axis X of the body 10, so that the first and second parts of the body 10 are injection molded. It is possible to effectively support the body 10 in the boundary region of the two-lead frame (21, 31). This has the effect of reinforcing the boundary regions of the first and second lead frames 21 and 31, which are weak portions of the body 10 having a longer side length than the short side length.

Referring to FIG. 25, in the body 10 of the light emitting device, the first recess 57 formed in the first side portion 11 and the second recess portion 58 formed in the second side portion 12 are shifted from each other. Is placed. The first recess 57 is disposed to correspond to the line Y2 passing through the center of the first cavity 25 of the first lead frame 21, and the second recess 58 It is disposed to correspond to the line Y3 passing through the center of the second cavity 35 of the two-lead frame 31. This embodiment is a hanger which is inserted into the first and second recesses 57 and 58 outside the areas of the first and second cavities 25 and 35, which are the areas with the greatest load during the injection molding of the body 10. It can be supported by the insertion protrusion of. Here, the center outer side of the body 10 may be supported by the connecting frame 46 as shown in FIG. 10, but is not limited thereto.

Referring to FIG. 26, in the body 10 of the light emitting device, the first recess 57A formed in the first side portion 11 and the second recess 58A formed in the second side portion 12 are shifted from each other. Is placed. The first recess 57A is disposed in an area adjacent to the first cavity 25 of the first lead frame 21. For example, the center line Y2 of the first cavity 25 and the body ( It may be arranged between the center line (Y0) of 10). The second recess 58A is disposed adjacent to the second cavity 35 of the second lead frame 31, for example, the center line Y3 and the body 10 of the second cavity 35. It can be arranged between the center line (Y0) of. In this embodiment, the first and second recesses may be formed in an outer region between the centers of the first and second cavities 25 and 35 and the center of the body 10, which are the areas with the greatest load during the injection molding of the body 10. It can be supported by the insertion protrusion of the hanger inserted into 57A, 58A). Here, the center outer side of the body 10 may be supported by the connecting frame 46 as shown in FIG. 10, but is not limited thereto.

Referring to FIG. 27, the light emitting device has a hemispherical shape of the first to fourth recesses 51D, 52D, 53D, and 54D formed on the first and second side portions 11 and 12 of the body 10. Include. As another example, the shapes of the first to fourth recesses 51D, 52D, 53D, and 54D may include a triangular shape or a stepped shape, but are not limited thereto.

28 and 29 are rear views of the light emitting device according to the sixth embodiment, and illustrate a length and a hanger of a recess.

Referring to FIG. 28, the body 10 of the light emitting device may be disposed such that the first recess 61 of the first side part 11 and the second recess 62 of the second side part 12 correspond to each other. do. The width W11 of the first recess portion 61 and the second recess portion 62 is wider than the gap G1 between the first and second cavities 25 and 35, and the first and second widths W11. It may be formed narrower than the gap (G11) between the center of the cavity (25, 35). In addition, the width W11 may be formed to be equal to or greater than 1/4 of the distance between the third and fourth side portions 13 and 14 of the body 10.

28 and 29, an insertion protrusion 39, which is a hanger inner portion 26A inserted into the first and second recesses 61 and 62, is formed on each side portion 11 of the body 10. 12) may cover the center area. Here, the connecting frame 46 disposed in the body 10 may be removed due to the insertion protrusion 39 which is the inner portion 26A of the hanger, but is not limited thereto.

30 to 32 are rear views of the light emitting device according to the seventh embodiment, and show modified examples of the recess.

Referring to FIG. 30, in the body 10 of the light emitting device, a first recess 51 and a second recess 52 are disposed on the first side surface 11, and the first and second recesses are disposed. A fifth recess 61 is disposed between the sections 51 and 52. The width of the fifth recess 61 may be formed to be wider than the width of the first and second recesses 51 and 52, and both ends of the fifth recess 61 may include the first and second recesses. 51,52). The fifth recess portion 61 may be formed from the first recess portion 51 and the second recess portion 52 in the direction of the center line Y0 of the body 10 or the first and second side portions 11. 12 may be formed in a structure that gradually deepens toward the center. The depths of the first and second recesses 51 and 52 may be the same as or different from the maximum depth of the fifth recess 61, but are not limited thereto. The width of the fifth recess 61 may be formed to be 1/4 or more of the length of the body 10, but is not limited thereto.

Sixth recesses between the third and fourth recesses 53 and 54 disposed on the second side portion 12 of the body 10 and the third and fourth recesses 53 and 54. For the structure of the part 62, the first, second and fifth recesses 51, 52 and 61 will be referred to.

The fifth and sixth recesses 61 and 62 may include a triangular shape or a hemispherical shape in which a central portion is concave inwardly of the body 10.

The first to fourth recesses 51, 52, 53, and 54 may have a predetermined distance D21 from the third and fourth side parts 13 and 14 of the body 10, as described in the first embodiment. Can be spaced apart.

Referring to FIG. 31, the light emitting device includes fifth and sixth recessed portions 61A and 62A disposed at the first side portion 11 and the second side portion 12 of the body 10, and the fifth portion. The width of the sixth recesses 61A and 62A may be formed to be 1/4 or more of the length of the body 10. The fifth and sixth recesses 61A and 62A are spaced apart from the third side portion 13 and the fourth side portion 14 of the body 10 by a predetermined distance D21, and It may be formed to a deeper depth toward the center line (Y0). The distance D21 may be formed to be 130 μm or more. On the contrary, the depth of the recesses 61A and 62A is the deepest in the region corresponding to the central portion of the body 10 and may be gradually decreased toward the third and fourth side portions 13 and 14.

Referring to FIG. 32, the light emitting device includes fifth and sixth recessed portions 61C and 62C disposed in the first side portion 11 and the second side portion 12 of the body 10, and the fifth portion. The width of the sixth recesses 61C and 62C may be formed to be 1/4 or more of the length of the body 10. The fifth and sixth recess portions 61C and 62C are spaced apart from the third side portion 13 and the fourth side portion 14 of the body 10 by a predetermined distance D22. The distance D22 may be formed to be 130 μm or more. The depth is gradually formed toward the center of the center line (Y0) of the body 10 or the first and second side portions (11, 12), or the depth in the center line (Y0) of the body (10) It can be formed into a structure with little. Accordingly, the depth of the recesses 61C and 62C may be the lowest in the region corresponding to the center of the body 10 and gradually deeper toward the third and fourth side portions 13 and 14.

33 is a plan view of a light emitting device according to an eighth embodiment, and FIG. 34 is a view illustrating a rear example of the light emitting device of FIG. 33.

33 and 34, the light emitting device 101 includes a body 110 having a recess 116, a first lead frame 121 at the bottom first region of the recess 116, and the recess. The second lead frame 131 disposed in the bottom second area of 116, the gap portion 119 between the first and second lead frames 121 and 131 at the bottom of the recess 116, and the light emitting chips 171 and 172. ), Wires 173-176 and a molding member (not shown).

The body 110 may include at least one of a resin material such as polyphthalamide (PPA), silicon (Si), a metal material, photo sensitive glass (PSG), sapphire (Al ₂ O ₃ ), and a printed circuit board (PCB). It can be formed as one. The body 110 may be made of, for example, a resin material such as polyphthalamide (PPA), epoxy, or silicone.

The outer shape of the body 110 may have various shapes such as triangles, squares, polygons, and circles depending on the use and design thereof. The first lead frame 121 and the second lead frame 131 may be disposed on the bottom of the body 110 and mounted on the substrate in a direct type, and may be disposed on the side of the body 110 in an edge type. It may be mounted on a substrate, but is not limited thereto.

The body 110 is open at the top and has a recess 116 such as a cavity, cup structure or recess structure consisting of side and bottom. The shape of the concave portion 116 viewed from above may be circular, elliptical, or polygonal (eg, rectangular). The body 110 may include a plurality of side parts 111 to 114, and at least one of the plurality of side parts 111 to 114 may be disposed vertically or inclined with respect to a bottom surface of the body 110. For example, the length (ie, the long side length) of the first side portion 111 and the second side portion 112 is greater than the length (ie, the long side length) of the third side portion 113 and the fourth side portion 114. For example, it may be formed to be at least two times longer.

The first lead frame 121 is disposed in the first area at the bottom of the recess 116, and the second lead frame 131 is spaced apart from the first area at the bottom of the recess 116. It is arranged in two areas.

The bottom surface of the first lead frame 121 and the bottom surface of the second lead frame 131 may be exposed to the bottom surface of the body 110 or disposed on the same plane as the bottom surface of the body 110.

The gap portion 119 between the first lead frame 121 and the second lead frame 131 may be disposed in an oblique shape, and a center portion of the gap portion 119 may have a stepped structure. By forming the gap portion 119 in an oblique line, the rigidity of the boundary portion between the first and second lead frames 121 and 131 can be reinforced.

The first lead part 123 of the first lead frame 121 may be disposed on the bottom surface of the body 110 and protrude to the third side portion 113 of the body 110. The second lead part 133 of the second lead frame 131 may be disposed on the lower surface of the body 110 and protrude to the fourth side portion 114 of the body 110. Materials and thicknesses of the first and second lead frames 121 and 131 will be described with reference to the first embodiment.

As shown in FIG. 34, the first and second lead frames 121 and 131 do not have a cavity, and a bottom surface thereof is disposed in a flat structure. That is, the entire lower surface of the first and second lead frames 121 and 131 may be disposed on the same plane as the lower surface 117 of the body 110. By removing the cavity structures from the first and second lead frames 121 and 131, the thickness of the light emitting device 101 can be provided thinly.

The first side portion 111 of the body 110 includes a first recess portion 151 and a second recess portion 152, and the second side portion 112 has a third recess portion 153. And a fourth recess 154.

The first to fourth recesses 151, 152, 153 and 154 may have an inner width W2 that is smaller than an outer width W3. The interior of the first to fourth recesses 151, 152, 153, and 154 may be inward of the body 110, and the exterior may be in the direction of side portions of the body.

Depth T6 of the first to fourth recesses 151, 152, 153, and 154 may be formed in a range of 30 μm to 130 μm, but is not limited thereto. In addition, the first to fourth recesses 151, 152, 153, and 154 may have a distance D6 from the outermost second or fourth side parts 113 and 114 to be 130 μm or more.

In the first to fourth recesses 151, 152, 153 and 154, when the injection molding of the body 110 is performed, the shape of the insertion protrusion of the hanger is arranged to have a wide inner width and a narrow outer width, thereby effectively supporting the inside of the body. .

A first light emitting chip 171 may be disposed on the first lead frame 121, and a second light emitting chip 172 may be disposed on the second lead frame 131. The first light emitting chip 171 is connected to the first lead frame 121 by a first wire 173, and is connected to the second lead frame 131 by a second wire 174. The second light emitting chip 172 is disposed on the second lead frame 131, is connected to the second lead frame 131 by a third wire 176, and is connected to the second lead frame 131 by a fourth wire 176. 121). Here, since the gap portion 119 is disposed in an oblique shape, the second and fourth wires 174 and 176 may be provided in the shortest length.

Referring to FIG. 35, a fifth recessed portion 161 is included in the first side portion 111 of the body 110, and the fifth recessed portion 161 is provided with the third and fourth side portions 113 and 114. The distance D7 may be spaced at least 130 μm, for example at least 200 μm. The body 110 includes a sixth recess 162 in the second side portion 112 and has a width substantially the same as that of the fifth recess 161 and is spaced apart from the third and fourth side portions 113 and 114. .

The fifth and sixth recessed portions 161 and 162 may be formed to have a width of 1/4 or more of the length of the body 110, but is not limited thereto. Here, the length direction of the body 110 may be a direction passing through the center of the light emitting chips 171 and 172 illustrated in FIG. 33.

The fifth and sixth recesses 161 and 162 may be spaced apart from the first and second lead frames 121 and 131 by 200 μm or more, which is the fifth and sixth recesses 161 and 162 and the first and second recesses 161 and 162. When the gap between the second lead frames 121 and 131 is narrow, a problem may occur in that the rigidity of the body cannot be secured due to the gap.

Referring to FIG. 36, first and second recesses 163 and 164 are disposed in the first side portion 111 of the body 110, and a fifth rib is disposed between the first and second recesses 163 and 164. The set portion 161A is disposed. The fifth recess 161A may have a width corresponding to a gap between the first and second recesses 163 and 164 and may be connected to the first and second recesses 163 and 164. The fifth recess 161A may have a deeper depth or a thinner thickness as the fifth recess 161A is closer to the center line Y0 of the body 110 from the first and second recesses 163 and 164. It is not limited to.

Third and fourth recesses 165 and 166 are disposed on the second side portion 112 of the body 110, and a sixth recess 162A is disposed between the third and fourth recesses 165 and 166. Is placed. For the structures of the third, fourth, and sixth recesses 165, 166, 162A, the structures of the first, second, and fifth recesses 163, 164, 161A will be referred to.

Referring to FIG. 37, a fifth recessed portion 161C is formed in the first side portion 111 of the body 110, and a sixth recessed portion 162C is formed in the second side portion 112. The centers of the fifth and sixth recesses 161C and 162C are positioned at the center of the body 110, and the width thereof may be formed to be 1/4 or more of the length of the body 110. Depth will be referred to the structure of the recessed portion of the first embodiment.

A seventh recess 161D is formed in the fifth recess 161C, and the seventh recess 161D is narrower than a width of the fifth recess 161C. It may have a width in the range of 200 μm, and may be formed to have a depth in the range of 10 to 50 μm from the fifth recess 161C. The seventh recess 161D may be disposed to correspond to the gap 119 between the first and second lead frames 121 and 131.

An eighth recessed portion 162D is formed in the sixth recessed portion 162C, and the eighth recessed portion 162D has a width smaller than the width of the sixth recessed portion 162C, for example, 50˜. It may have a width in the range of 200 μm, and may be formed to have a depth in the range of 10 μm to 50 μm from the sixth recess 162C. The eighth recess 161D may be disposed to correspond to the gap 119 between the first and second lead frames 121 and 131. Accordingly, the distance G4 between the vertical lines of the seventh and eighth recesses 161D and 162D may be spaced by 30 μm or more, but is not limited thereto.

38 is a plan view of a light emitting device according to a ninth embodiment. In describing the ninth embodiment, the same configuration as that of FIG. 38 will be referred to FIGS. 33 and the first embodiment.

Referring to FIG. 38, in the light emitting device, first to fourth recesses 151A, 152A, 153A, and 154A are formed in the first and second side parts 111 and 112 of the body 110. Such a structure may selectively apply to the embodiments disclosed above, but is not limited thereto.

The connecting frame 146 is disposed between the first and second lead frames 121 and 131 in the body 110, and the connecting frame 146 is disposed between the first and second lead frames 121 and 131 to be intermediate. Functions as a connection terminal.

39 is a plan view of a light emitting device according to a tenth embodiment, FIG. 40 is a rear view of the light emitting device of FIG. 39, and FIG. 41 is a side cross-sectional view of the light emitting device of FIG. 39.

Referring to FIG. 39, the light emitting device 200 may include a body 210 having a recess 216, first and second lead frames 221 and 231, light emitting chips 271 and 272, and wires in the recess 216. 273, 274, 275, and molding member 240.

The first lead frame 221 is formed with a first lead portion 223 disposed on the third side portion 213 of the body 210 and a second lead portion 233 disposed on the fourth side portion 214. It includes.

The length of the second lead frame 231 is formed longer than the length of the first lead frame 221, for example, may be formed to more than 1/2 of the length of the body 110.

First and second light emitting chips 271 and 272 are disposed on the second lead frame 231, and the first light emitting chip 271 is connected to the first lead frame 221 by a wire 273, and a second The light emitting chip 272 is connected to the wire 274. The second light emitting chip 272 may be connected to the second lead frame 231 by a wire 275.

40 and 41, a plurality of recess portions, that is, two or more recess portions, may be disposed in the first side portion 211 of the body 210, for example, the first to fourth recess portions 251, 252, 253, and 254. Is placed. A plurality of second or more recesses may be disposed in the second side portion 212, for example, fifth to eighth recesses 255, 256, 257, and 258 are disposed. A total of 6-12 recesses may be disposed in the body, but is not limited thereto.

The first to fourth recesses 251, 252, 253, and 254 correspond to the fifth to eighth recesses 255, 256, 257, and 258, respectively. It may be arranged symmetrically with each other in the center of the longitudinal direction of the body (210).

The first and fifth recesses 251 and 255, and the fourth and eighth recesses 254 and 258, have a predetermined distance D2 from the third side portion 213 and the fourth side portion 214 of the body 210. ), And this distance D2 will be described with reference to the first embodiment.

Here, the distances D11 and D12 between adjacent recesses among the first to fourth recesses 251, 252, 253 and 254 may be different from each other. For example, the distance D11 between the first and fourth recesses 251 and 254 disposed at the outermost side and the second and third recesses 252 and 253 adjacent thereto may be the same, and the second and the second recesses may be the same. The spacing D12 between the three recesses 252 and 253 may be wider than the spacing D11. The first to eighth recesses 251 to 258 are disposed in consideration of the difference between the lengths of the first and second lead frames 221 and 231 and the boundary areas of the first and second lead frames 221 and 231. It may be one structure.

A light emitting chip according to an embodiment will be described with reference to FIGS. 42 and 43.

42 illustrates a light emitting chip according to an embodiment.

Referring to FIG. 42, the light emitting chip 71 may include a substrate 311, a buffer layer 312, a light emitting structure 310, a first electrode 316, and a second electrode 317. The substrate 311 includes a substrate of a light transmissive or non-transparent material, and also includes a conductive or insulating substrate.

The buffer layer 312 reduces the lattice constant difference between the substrate 311 and the material of the light emitting structure 310 and may be formed of a nitride semiconductor. A nitride semiconductor layer that is not doped with a dopant may be further formed between the buffer layer 312 and the light emitting structure 310 to improve crystal quality.

The light emitting structure 310 includes a first conductive semiconductor layer 313, an active layer 314, and a second conductive semiconductor layer 315.

The first conductive semiconductor layer 313 is formed of a group III-V compound semiconductor doped with a first conductive dopant, and the first conductive semiconductor layer 313 is an n-type semiconductor layer. The conductive dopant is an n-type dopant and includes Si, Ge, Sn, Se, Te.

A first cladding layer may be formed between the first conductive semiconductor layer 313 and the active layer 314. The first cladding layer may be formed of a GaN based semiconductor, and the band gap may be formed to be greater than or equal to the band gap of the active layer 314. The first cladding layer is formed of a first conductive type and serves to restrain the carrier.

The active layer 314 is disposed on the first conductive semiconductor layer 313 and optionally includes a single quantum well, a multi-quantum well (MQW), a quantum wire structure, or a quantum dot structure. do. The active layer 314 includes a cycle of a well layer and a barrier layer. The well layer includes a composition formula of In _x Al _y Ga _{1 -x- y} N (0 ≦ x ≦ 1, 0 ≦ y ≦ 1, 0 ≦ x + y ≦ 1), and the barrier layer is In _x Al _y The compositional formula of Ga _1-xy N (0 ≦ x ≦ 1, 0 ≦ y ≦ 1, 0 ≦ x + y ≦ 1) may be included. The period of the well layer / barrier layer may be formed in one or more cycles using, for example, a stacked structure of InGaN / GaN, GaN / AlGaN, InGaN / AlGaN, InGaN / InGaN, InAlGaN / InAlGaN. The barrier layer may be formed of a semiconductor material having a band gap higher than that of the well layer.

The second conductive semiconductor layer 315 is formed on the active layer 314. The second conductive semiconductor layer 315 may be formed of any one of a semiconductor doped with a second conductive dopant, for example, a compound semiconductor such as GaN, InN, AlN, InGaN, AlGaN, InAlGaN, or AlInN. The second conductive semiconductor layer 315 is a p-type semiconductor layer, and the second conductive dopant is a p-type dopant and may include Mg, Zn, Ca, Sr, and Ba.

The second conductive semiconductor layer 315 may include a superlattice structure, and the superlattice structure may include an InGaN / GaN superlattice structure or an AlGaN / GaN superlattice structure. The superlattice structure of the second conductive semiconductor layer 315 may abnormally diffuse the current included in the voltage to protect the active layer 314.

In addition, the conductive type of the light emitting structure 310 may be disposed to be reversed. For example, the first conductive semiconductor layer 313 may be a P-type semiconductor layer, and the second conductive semiconductor layer 315 may be an n-type semiconductor layer. can do. The first conductive semiconductor layer having a polarity opposite to that of the second conductive type may be further disposed on the second conductive semiconductor layer 315.

The light emitting structure 310 may be implemented as any one of an n-p junction structure, a p-n junction structure, an n-p-n junction structure, and a p-n-p junction structure. Here, p is a p-type semiconductor layer, n is an n-type semiconductor layer, and-includes a structure in which the p-type semiconductor layer and the n-type semiconductor layer is in direct contact or indirect contact. Hereinafter, for convenience of description, the uppermost layer of the light emitting structure 310 will be described as the second conductive semiconductor layer 315.

The first electrode 316 is disposed on the first conductive semiconductor layer 313, and the second electrode 317 has a current diffusion layer on the second conductive semiconductor layer 315.

43 is a view showing another example of a light emitting chip according to the embodiment. In FIG. 43, the same parts as in FIG. 42 are omitted and will be briefly described.

Referring to FIG. 43, in the light emitting chip 71A, an ohmic contact layer 321 is formed under the light emitting structure 310, a reflective layer 324 is formed under the ohmic contact layer 321, and the reflective layer 324 is formed. The support member 325 may be formed below the protective member 325, and a protective layer 323 may be formed around the reflective layer 324 and the light emitting structure 310.

The light emitting chip 3102 forms an ohmic contact layer 321 and a protective layer 323, a reflective layer 324, and a support member 325 under the second conductive semiconductor layer 315, and then removes the growth substrate. Can be formed.

The ohmic contact layer 321 is in ohmic contact with a lower layer of the light emitting structure 310, for example, the second conductive semiconductor layer 315, and the material may be selected from a metal oxide, a metal nitride, an insulating material, and a conductive material. For example, indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (IZTO), indium aluminum zinc oxide (IAZO), indium gallium zinc oxide (IGZO), indium gallium tin oxide (IGTO), aluminum (AZO) material consisting of zinc oxide), antimony tin oxide (ATO), gallium zinc oxide (GZO), Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, Hf and optional combinations thereof It can be formed from. In addition, the metal material and the light transmitting conductive material such as IZO, IZTO, IAZO, IGZO, IGTO, AZO, ATO, etc. may be formed in multiple layers, for example, IZO / Ni, AZO / Ag, IZO / Ag / Ni, AZO. / Ag / Ni and the like can be laminated. An inside of the ohmic contact layer 321 may further include a layer blocking a current to correspond to the electrode 316.

The protective layer 323 may be selected from a metal oxide or an insulating material, for example, indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (IZTO), indium aluminum zinc oxide (IZAO), or IGZO. (indium gallium zinc oxide), IGTO (indium gallium tin oxide), AZO (aluminum zinc oxide), ATO (antimony tin oxide), GZO (gallium zinc oxide), SiO ₂ , SiO _x , SiO _x N _y , It may be selectively formed from Si ₃ N ₄ , Al ₂ O ₃ , TiO ₂ . The protective layer 323 may be formed using a sputtering method or a deposition method, and may prevent a metal such as the reflective layer 324 from shorting the layers of the light emitting structure 310.

The reflective layer 324 may be formed of a material made of a metal, for example, Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, Hf, and a combination thereof. The reflective layer 324 may be formed larger than the width of the light emitting structure 310, which may improve the light reflection efficiency. A metal layer for bonding and a metal layer for heat diffusion may be further disposed between the reflective layer 324 and the support member 325, but the embodiment is not limited thereto.

The support member 325 is a base substrate, and may be a metal such as copper (Cu), gold (Au), nickel (Ni), molybdenum (Mo), copper-tungsten (Cu-W), or a carrier wafer (eg, Si, Ge, GaAs, ZnO, SiC). A bonding layer may be further formed between the support member 325 and the reflective layer 324, and the bonding layer may bond two layers to each other. The disclosed light emitting chip is one example and is not limited to the features disclosed above. The light emitting chip may be selectively applied to the above embodiment of the light emitting device, but is not limited thereto.

The light emitting device according to the embodiment may be applied to a lighting system. The lighting system includes a structure in which a plurality of light emitting elements are arranged, and includes a display device shown in FIGS. 44 and 45 and a lighting device shown in FIGS. 46 to 50. This may be included.

44 is an exploded perspective view of a display device according to an exemplary embodiment.

Referring to FIG. 44, the display device 1000 includes a light guide plate 1041, a light source module 1031 providing light to the light guide plate 1041, a reflective member 1022 under the light guide plate 1041, and the light guide plate 1041. A bottom cover 1011 that houses an optical sheet 1051 on the light guide plate 1041, a display panel 1061 on the optical sheet 1051, the light guide plate 1041, a light source module 1031, and a reflective member 1022. ), But is not limited thereto.

The bottom cover 1011, the reflective sheet 1022, the light guide plate 1041, and the optical sheet 1051 may be defined as a light unit 1050.

The light guide plate 1041 serves to diffuse surface light provided from the light source module 1031 to make a surface light source. The light guide plate 1041 is made of a transparent material, for example, an acrylic resin series such as polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), polycarbonate (PC), cycloolefin copolymer (COC), and polyethylene naphthalate (PEN). It may include one of the resins.

The light source module 1031 is disposed on at least one side of the light guide plate 1041 to provide light to at least one side of the light guide plate 1041, and ultimately serves as a light source of the display device.

At least one light source module 1031 may be disposed in the bottom cover 1011, and may provide light directly or indirectly at one side of the light guide plate 1041. The light source module 1031 may include a circuit board 1033 and a light emitting device 100 according to the embodiment disclosed above, and the light emitting device 100 may be arranged on the circuit board 1033 at predetermined intervals. have. The circuit board may be a printed circuit board, but is not limited thereto. In addition, the circuit board 1033 may include a metal core PCB (MCPCB, Metal Core PCB), flexible PCB (FPCB, Flexible PCB) and the like, but is not limited thereto. When the light emitting device 100 is mounted on the side surface of the bottom cover 1011 or the heat dissipation plate, the circuit board 1033 may be removed. A portion of the heat dissipation plate may contact the top surface of the bottom cover 1011. Therefore, heat generated in the light emitting device 100 may be discharged to the bottom cover 1011 via the heat dissipation plate.

The plurality of light emitting devices 100 may be mounted on the circuit board 1033 such that an emission surface for emitting light is spaced apart from the light guide plate 1041 by a predetermined distance, but is not limited thereto. The light emitting device 100 may directly or indirectly provide light to a light incident portion, which is one side of the light guide plate 1041, but is not limited thereto.

The reflective member 1022 may be disposed under the light guide plate 1041. The reflective member 1022 may improve the luminance of the display panel 1061 by reflecting light incident on the lower surface of the light guide plate 1041 to the display panel 1061. The reflective member 1022 may be formed of, for example, PET, PC, or PVC resin, but is not limited thereto. The reflective member 1022 may be an upper surface of the bottom cover 1011, but is not limited thereto.

The bottom cover 1011 may accommodate the light guide plate 1041, the light source module 1031, the reflective member 1022, and the like. To this end, the bottom cover 1011 may be provided with an accommodating part 1012 having a box shape having an upper surface opened thereto, but is not limited thereto. The bottom cover 1011 may be combined with a top cover (not shown), but is not limited thereto.

The bottom cover 1011 may be formed of a metal material or a resin material, and may be manufactured using a process such as press molding or extrusion molding. In addition, the bottom cover 1011 may include a metal or non-metal material having good thermal conductivity, but is not limited thereto.

The display panel 1061 is, for example, an LCD panel and includes a first and second substrates of transparent materials facing each other, and a liquid crystal layer interposed between the first and second substrates. A polarizer may be attached to at least one surface of the display panel 1061, but the polarizer is not limited thereto. The display panel 1061 transmits or blocks the light provided from the light source module 1031 to display information. The display device 1000 may be applied to various types of portable terminals, monitors of notebook computers, monitors of laptop computers, and video display devices such as televisions.

The optical sheet 1051 is disposed between the display panel 1061 and the light guide plate 1041 and includes at least one light transmitting sheet. The optical sheet 1051 may include, for example, at least one of a sheet such as a diffusion sheet, horizontal and vertical prism sheets, a brightness enhanced sheet, and the like. The diffusion sheet diffuses incident light, the horizontal or vertical prism sheet focuses incident light onto the display panel 1061, and the brightness enhancement sheet reuses the lost light to improve luminance. Let it be. In addition, a protective sheet may be disposed on the display panel 1061, but is not limited thereto.

The light guide plate 1041 and the optical sheet 1051 may be included as an optical member on the optical path of the light source module 1031, but are not limited thereto.

45 is a diagram illustrating a display device having a light emitting device according to an embodiment.

Referring to FIG. 45, the display device 1100 may include a bottom cover 1152, a circuit board 1120 on which the light emitting device 100 according to the above-described embodiment is arranged, an optical member 1154, and a display panel 1155. Include.

The circuit board 1120 and the light emitting device 100 may be defined as a light source module 1060. The bottom cover 1152, at least one light source module 1060, and the optical member 1154 may be defined as a light unit 1150.

The bottom cover 1152 may include an accommodating part 1153, but is not limited thereto.

The optical member 1154 may include at least one of a lens, a light guide plate, a diffusion sheet, horizontal and vertical prism sheets, and a brightness enhancement sheet. The light guide plate may be made of a PC material or a poly methy methacrylate (PMMA) material, and the light guide plate may be removed. The diffusion sheet diffuses the incident light, and the horizontal and vertical prism sheets focus the incident light onto the display panel 1155, and the brightness enhancement sheet reuses the lost light to improve the brightness. .

The optical member 1154 is disposed on the light source module 1060 and performs surface light, or diffuses, condenses, or the like the light emitted from the light source module 1060.

46 to 48 illustrate a lighting apparatus according to the embodiment.

46 is a perspective view from above of the lighting apparatus according to the embodiment, FIG. 47 is a perspective view of the lighting apparatus illustrated in FIG. 46 from below, and FIG. 48 is an exploded perspective view of the lighting apparatus illustrated in FIG. 46.

46 to 48, a lighting apparatus according to the embodiment may include a cover 2100, a light source module 2200, a heat radiator 2400, a power supply unit 2600, an inner case 2700, and a socket 2800. It may include. In addition, the lighting apparatus according to the embodiment may further include any one or more of the member 2300 and the holder 2500. The light source module 2200 may include a light emitting device or a light emitting device package according to an embodiment.

For example, the cover 2100 may have a shape of a bulb or hemisphere, may be hollow, and may be provided in an open shape. The cover 2100 may be optically coupled to the light source module 2200. For example, the cover 2100 may diffuse, scatter or excite the light provided from the light source module 2200. The cover 2100 may be a kind of optical member. The cover 2100 may be coupled to the heat sink 2400. The cover 2100 may have a coupling part coupled to the heat sink 2400.

An inner surface of the cover 2100 may be coated with a milky paint. The milky paint may include a diffuser to diffuse light. The surface roughness of the inner surface of the cover 2100 may be greater than the surface roughness of the outer surface of the cover 2100. This is for the light from the light source module 2200 to be sufficiently scattered and diffused to be emitted to the outside.

The cover 2100 may be made of glass, plastic, polypropylene (PP), polyethylene (PE), polycarbonate (PC), or the like. Here, polycarbonate is excellent in light resistance, heat resistance, and strength. The cover 2100 may be transparent and opaque so that the light source module 2200 is visible from the outside. The cover 2100 may be formed through blow molding.

The light source module 2200 may be disposed on one surface of the heat sink 2400. Thus, heat from the light source module 2200 is conducted to the heat sink 2400. The light source module 2200 may include a light source unit 2210, a connection plate 2230, and a connector 2250.

The member 2300 is disposed on an upper surface of the heat dissipator 2400, and has a plurality of light source parts 2210 and guide grooves 2310 into which the connector 2250 is inserted. The guide groove 2310 corresponds to the board and the connector 2250 of the light source unit 2210.

The surface of the member 2300 may be coated or coated with a light reflective material. For example, the surface of the member 2300 may be coated or coated with a white paint. The member 2300 is reflected on the inner surface of the cover 2100 to reflect the light returned to the light source module 2200 side again toward the cover 2100. Therefore, it is possible to improve the light efficiency of the lighting apparatus according to the embodiment.

The member 2300 may be made of an insulating material, for example. The connection plate 2230 of the light source module 2200 may include an electrically conductive material. Therefore, electrical contact may be made between the radiator 2400 and the connection plate 2230. The member 2300 may be formed of an insulating material to block an electrical short between the connection plate 2230 and the radiator 2400. The radiator 2400 receives heat from the light source module 2200 and heat from the power supply unit 2600 to radiate heat.

The holder 2500 may block the accommodating groove 2719 of the insulating portion 2710 of the inner case 2700. Therefore, the power supply unit 2600 accommodated in the insulating unit 2710 of the inner case 2700 is sealed. The holder 2500 has a guide protrusion 2510. The guide protrusion 2510 may include a hole through which the protrusion 2610 of the power supply unit 2600 passes.

The power supply unit 2600 processes or converts an electrical signal provided from the outside to provide the light source module 2200. The power supply unit 2600 is accommodated in the accommodating groove 2725 of the inner case 2700, and is sealed in the inner case 2700 by the holder 2500.

The power supply unit 2600 may include a protrusion 2610, a guide unit 2630, a base 2650, and an extension unit 2670.

The guide part 2630 has a shape protruding outward from one side of the base 2650. The guide part 2630 may be inserted into the holder 2500. A plurality of parts may be disposed on one surface of the base 2650. The plurality of components may include, for example, a DC converter for converting AC power provided from an external power source into DC power, a driving chip for controlling the driving of the light source module 2200, and an ESD for protecting the light source module 2200. (ElectroStatic discharge) protection element and the like, but may not be limited thereto.

The extension part 2670 has a shape protruding outward from the other side of the base 2650. The extension part 2670 is inserted into the connection part 2750 of the inner case 2700 and receives an electrical signal from the outside. For example, the extension part 2670 may be provided equal to or smaller than the width of the connection part 2750 of the inner case 2700. Each end of the "+ wire" and the "-wire" may be electrically connected to the extension 2670, and the other end of the "+ wire" and the "-wire" may be electrically connected to the socket 2800. .

The inner case 2700 may include a molding unit together with the power supply unit 2600 therein. The molding part is a part where the molding liquid is hardened, so that the power supply part 2600 can be fixed inside the inner case 2700.

49 and 50 are diagrams illustrating another example of the lighting apparatus according to the embodiment.

49 is a perspective view of a lighting apparatus according to an embodiment, and FIG. 50 is an exploded perspective view of the lighting apparatus illustrated in FIG. 49.

49 and 50, the lighting apparatus according to the embodiment may include a cover 3100, a light source unit 3200, a radiator 3300, a circuit unit 3400, an inner case 3500, and a socket 3600. Can be. The light source unit 3200 may include a light emitting device or a light emitting device package according to the embodiment.

The cover 3100 has a bulb shape and is hollow. The cover 3100 has an opening 3110. The light source 3200 and the member 3350 may be inserted through the opening 3110.

The cover 3100 may be coupled to the radiator 3300 and may surround the light source unit 3200 and the member 3350. By combining the cover 3100 and the radiator 3300, the light source 3200 and the member 3350 may be blocked from the outside. The cover 3100 and the radiator 3300 may be coupled to each other through an adhesive, and may be coupled in various ways such as a rotation coupling method and a hook coupling method. The rotation coupling method is a method in which a screw thread of the cover 3100 is coupled to a screw groove of the heat sink 3300, and the cover 3100 and the heat sink 3300 are coupled by the rotation of the cover 3100. The hook coupling method is a method in which the jaw of the cover 3100 is fitted into the groove of the heat sink 3300 and the cover 3100 and the heat sink 3300 are coupled to each other.

The cover 3100 is optically coupled to the light source 3200. In detail, the cover 3100 may diffuse, scatter, or excite light from the light emitting device 3230 of the light source unit 3200. The cover 3100 may be a kind of optical member. Here, the cover 3100 may have a phosphor on the inside / outside or inside to excite the light from the light source unit 3200.

An inner surface of the cover 3100 may be coated with a milky paint. Here, the milky white paint may include a diffusion material for diffusing light. The surface roughness of the inner surface of the cover 3100 may be greater than the surface roughness of the outer surface of the cover 3100. This is to sufficiently scatter and diffuse the light from the light source unit 3200.

The cover 3100 may be made of glass, plastic, polypropylene (PP), polyethylene (PE), polycarbonate (PC), or the like. Here, polycarbonate is excellent in light resistance, heat resistance, and strength. The cover 3100 may be a transparent material that can be seen by the light source unit 3200 and the member 3350 from the outside, or may be an invisible opaque material. The cover 3100 may be formed through, for example, blow molding.

The light source unit 3200 may be disposed on the member 3350 of the radiator 3300 and may be disposed in plural. Specifically, the light source 3200 may be disposed on one or more side surfaces of the plurality of side surfaces of the member 3350. The light source 3200 may be disposed at an upper end of a side surface of the member 3350.

In FIG. 19, the light source unit 3200 may be disposed on three side surfaces of the six side surfaces of the member 3350. However, the present invention is not limited thereto, and the light source unit 3200 may be disposed on all side surfaces of the member 3350. The light source 3200 may include a substrate 3210 and a light emitting device 3230. The light emitting device 3230 may be disposed on one surface of the substrate 3210.

The substrate 3210 has a rectangular plate shape, but is not limited thereto and may have various shapes. For example, the substrate 3210 may have a circular or polygonal plate shape. The substrate 3210 may be a circuit pattern printed on an insulator, and for example, a general printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, and the like. It may include. In addition, it is possible to use a Chips On Board (COB) type that can directly bond the LED chip unpacked on the printed circuit board. In addition, the substrate 3210 may be formed of a material that efficiently reflects light, or may be formed of a color that reflects light efficiently, for example, white, silver, or the like. The substrate 3210 may be electrically connected to the circuit unit 3400 accommodated in the radiator 3300. The substrate 3210 and the circuit unit 3400 may be connected by, for example, a wire. A wire may pass through the radiator 3300 to connect the substrate 3210 and the circuit unit 3400.

The light emitting device 3230 may be a light emitting diode chip emitting red, green, or blue light or a light emitting diode chip emitting UV. The LED chip may be a horizontal type or a vertical type, and the LED chip may emit blue, red, yellow, or green. Can be.

The light emitting device 3230 may have a phosphor. The phosphor may be one or more of a Garnet-based (YAG, TAG), a silicate (Silicate), a nitride (Nitride) and an oxynitride (oxyxyride). Alternatively, the phosphor may be one or more of a yellow phosphor, a green phosphor, and a red phosphor.

The radiator 3300 may be coupled to the cover 3100 to radiate heat from the light source unit 3200. The radiator 3300 has a predetermined volume and includes an upper surface 3310 and a side surface 3330. A member 3350 may be disposed on the top surface 3310 of the heat sink 3300. An upper surface 3310 of the heat sink 3300 may be coupled to the cover 3100. The top surface 3310 of the heat sink 3300 may have a shape corresponding to the opening 3110 of the cover 3100.

A plurality of heat sink fins 3370 may be disposed on the side surface 3330 of the heat sink 3300. The heat radiating fins 3370 may extend outward from the side surface 3330 of the heat sink 3300 or may be connected to the side surface 3330. The heat dissipation fins 3370 may improve heat dissipation efficiency by widening a heat dissipation area of the heat dissipator 3300. Here, the side surface 3330 may not include the heat dissipation fins 3370.

The member 3350 may be disposed on an upper surface 3310 of the heat sink 3300. The member 3350 may be integrated with the top surface 3310 or may be coupled to the top surface 3310. The member 3350 may be a polygonal pillar. Specifically, the member 3350 may be a hexagonal pillar. The member 3350 of the hexagonal column has a top side and a bottom side and six sides. Here, the member 3350 may be a circular pillar or an elliptical pillar as well as a polygonal pillar. When the member 3350 is a circular pillar or an elliptic pillar, the substrate 3210 of the light source unit 3200 may be a flexible substrate.

The light source unit 3200 may be disposed on six side surfaces of the member 3350. The light source unit 3200 may be disposed on all six side surfaces, or the light source unit 3200 may be disposed on some of the six side surfaces. In FIG. 15, the light source unit 3200 is disposed on three side surfaces of the six side surfaces.

The substrate 3210 is disposed on the side surface of the member 3350. Side surfaces of the member 3350 may be substantially perpendicular to the top surface 3310 of the heat sink 3300. Therefore, the substrate 3210 and the top surface 310 of the heat sink 3300 may be substantially perpendicular to each other.

The material of the member 3350 may be a material having thermal conductivity. This is for receiving heat generated from the light source unit 3200 quickly. The material of the member 3350 may be, for example, aluminum (Al), nickel (Ni), copper (Cu), magnesium (Mg), silver (Ag), tin (Sn), or an alloy of the metals. Alternatively, the member 3350 may be formed of a thermally conductive plastic having thermal conductivity. Thermally conductive plastics are lighter than metals and have the advantage of having unidirectional thermal conductivity.

The circuit unit 3400 receives power from the outside and converts the received power to match the light source unit 3200. The circuit unit 3400 supplies the converted power to the light source unit 3200. The circuit unit 3400 may be disposed on the heat sink 3300. In detail, the circuit unit 3400 may be accommodated in the inner case 3500 and may be accommodated in the radiator 3300 together with the inner case 3500. The circuit unit 3400 may include a circuit board 3410 and a plurality of components 3430 mounted on the circuit board 3410.

The circuit board 3410 has a circular plate shape, but is not limited thereto and may have various shapes. For example, the circuit board 3410 may have an oval or polygonal plate shape. The circuit board 3410 may have a circuit pattern printed on an insulator. The circuit board 3410 is electrically connected to the substrate 3210 of the light source unit 3200. The electrical connection between the circuit board 3410 and the substrate 3210 may be connected through, for example, a wire. A wire may be disposed in the heat sink 3300 to connect the circuit board 3410 and the board 3210. The plurality of components 3430 may include, for example, a DC converter for converting an AC power provided from an external power source into a DC power source, a driving chip for controlling the driving of the light source unit 3200, and the protection of the light source unit 3200. Electrostatic discharge (ESD) protection element and the like.

The inner case 3500 accommodates the circuit unit 3400 therein. The inner case 3500 may have an accommodating part 3510 for accommodating the circuit part 3400. For example, the accommodating part 3510 may have a cylindrical shape. The shape of the accommodating part 3510 may vary depending on the shape of the heat sink 3300. The inner case 3500 may be accommodated in the heat sink 3300. The accommodating part 3510 of the inner case 3500 may be accommodated in an accommodating part formed on a lower surface of the heat sink 3300.

The inner case 3500 may be coupled to the socket 3600. The inner case 3500 may have a connection part 3530 that is coupled to the socket 3600. The connection part 3530 may have a thread structure corresponding to the screw groove structure of the socket 3600. The inner case 3500 is an insulator. Therefore, an electrical short circuit between the circuit part 3400 and the heat sink 3300 is prevented. For example, the inner case 3500 may be formed of plastic or resin.

The socket 3600 may be coupled to the inner case 3500. In detail, the socket 3600 may be coupled to the connection part 3530 of the inner case 3500. The socket 3600 may have a structure such as a conventional conventional incandescent bulb. The circuit unit 3400 and the socket 3600 are electrically connected to each other. Electrical connection between the circuit unit 3400 and the socket 3600 may be connected through a wire. Therefore, when external power is applied to the socket 3600, the external power may be transferred to the circuit unit 3400. The socket 3600 may have a screw groove structure corresponding to the screw thread structure of the connection part 3550.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and various substitutions, modifications, and changes can be made without departing from the technical spirit of the present invention. It will be evident to those who have knowledge of. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

10,110,210: body
11-14,111-114,211-214: side section
21,31,121,131,221,231: lead frame
16,116,216: concave
25,35: cavity
51-56,61,61A ,, 61B, 61C, 62,62A, 62B, 62C, 151-154,161,162,251-258: recess 20: metal frame
26,36: Hanger
27,28,37,38: Insertion protrusion
71,72,171,172,271,272: Light emitting chip
40,240: molding member

Claims (16)

A body including an upper surface and a lower surface corresponding to each other, a first side portion and a second side portion corresponding to each other, a third and fourth side portions corresponding to each other, and a concave portion;
A first lead frame under the recess;
A second lead frame disposed below the recess and spaced apart from the first lead frame; And
A light emitting chip on at least one of the first and second lead frames,
Each length of the third and fourth side portions is a gap between the first and second side portions,
The length of each of the third and fourth side portions is shorter than the length of each of the first and second side portions,
The body,
A first recessed portion recessed from the first side portion toward the second side portion;
A second recess portion recessed toward the second side portion from the first side portion;
A third recessed portion recessed from the second side portion toward the first side portion; And
A fourth recessed portion recessed from the second side portion toward the first side portion,
The first recess portion and the third recess portion correspond to each other,
The second recess portion and the fourth recess portion correspond to each other,
The first recess portion and the second recess portion are spaced apart from each other along the first side portion of the body,
The third recess portion and the fourth recess portion are spaced apart from each other along the second side portion of the body,
The first recess portion, the second recess portion, the third recess portion and the fourth recess portion are connected to the lower surface of the body,
Each of the first recessed portion, the second recessed portion, the third recessed portion and the fourth recessed portion is recessed from the lower surface of the body toward the upper surface of the body,
The body includes a gap disposed between the first and second lead frame at the bottom of the recess,
And the gap portion extends in a direction inclined with respect to an imaginary central straight line passing through the center of the first side portion and the center of the second side portion. The method of claim 1,
The first recess portion and the third recess portion overlap each other in a direction from the first side portion to the second side portion,
And the second recess portion and the fourth recess portion overlap each other in a direction from the second side portion to the first side portion. The method of claim 1,
The first recess portion and the third recess portion overlap the first lead frame in a direction from the first side portion to the second side portion.
And the second recess portion and the fourth recess portion overlap with the second lead frame in a direction from the second side portion to the first side portion. The method of claim 3,
The first recess portion and the third recess portion are spaced apart from the first lead frame,
The second recessed portion and the fourth recessed portion are spaced apart from the second lead frame. The method according to any one of claims 1 to 4,
The first recess portion and the third recess portion are closer to the third side portion than the fourth side portion,
The second recess portion and the fourth recess portion are closer to the fourth side portion than the third side portion,
The distance between the first recess portion and the third side portion is smaller than the distance between the first and second recess portions,
And a distance between the third recessed portion and the third side portion is smaller than a distance between the third and fourth recessed portions. The method according to any one of claims 1 to 4,
The light emitting chip includes a first light emitting chip disposed on the first lead frame, and a second light emitting chip disposed on the second lead frame.
The minimum distance between the first and second light emitting chips is smaller than the distance between the first and second recesses,
And a minimum distance between the first and second light emitting chips is smaller than a distance between the third and fourth recessed portions. The method according to any one of claims 1 to 4,
The first recess portion and the third recess portion are closer to the third side portion than the fourth side portion,
The second recess portion and the fourth recess portion are closer to the fourth side portion than the third side portion,
The distance between the first recessed portion and the third side portion is equal to the distance between the third recessed portion and the third side portion,
The distance between the second recessed portion and the fourth side portion is equal to the distance between the fourth recessed portion and the fourth side portion. The method according to any one of claims 1 to 4,
A lower surface of the first and second lead frame is the same plane as the lower surface of the body. The method according to any one of claims 1 to 4,
The lower surface of the first to fourth recesses is the same plane as the lower surface of the body. The method according to any one of claims 1 to 4,
The gap portion is disposed between the first and second lead frame on the lower surface of the body,
A portion of the first lead frame protrudes further from the lower surface of the body toward the fourth side portion than the center straight line,
A portion of the second lead frame protrudes from the lower surface of the body toward the third side portion more than the center straight line. The method of claim 10,
A portion of the first lead frame protrudes more toward the fourth side portion than the center straight line at the bottom of the concave portion,
A portion of the second lead frame protrudes more toward the third side portion than the center straight line at the bottom of the concave portion. The method according to any one of claims 1 to 4,
Depth of the first and second recessed portion is in the range of 30㎛ to 130㎛ from the first side portion toward the second side portion,
The depth of the third and fourth recessed portion is in the range of 30㎛ to 130㎛ from the second side portion toward the first side portion. The method according to any one of claims 1 to 4,
The light emitting device of claim 1, wherein a height of the first to fourth recesses is equal to or smaller than a thickness of the first and second lead frames. The method according to any one of claims 1 to 4,
Each of the first to fourth recesses includes an inner upper surface and an inner side surface, wherein the inner side surface is disposed perpendicular to the lower surface of the body,
And a length of each of the first and second recessed portions disposed in the first side portion is equal to a length of each of the third and fourth side portions disposed in the second side portion. The method of claim 6,
A molding member in the recess;
A protection element on the first lead frame or the second lead frame; And
A first wire connected to the first light emitting chip and the first lead frame;
A second wire connected to the first light emitting chip and the second lead frame;
A third wire connected to the second light emitting chip and the second lead frame; And
A fourth wire connected to the second light emitting chip and the first lead frame,
The distance between the third side portion and the first or third recessed portion is 130 μm or more,
The light emitting device of which the distance between the fourth side portion and the second or fourth recess portion is 130 μm or more. The method according to any one of claims 1 to 4,
The width of the first lead frame in a direction from the first recessed portion to the third recessed portion of the lower surface of the body is smaller than the distance between the first and third recessed portions,
And a width of the second lead frame in a direction from the second recessed portion to the fourth recessed portion of the lower surface of the body is smaller than an interval between the second and fourth recessed portions.

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