KR102044408B1 - Electrical overstress protection device - Google Patents

Abstract

Electrical overload protection is provided. Electrical overload protection device according to an embodiment of the present invention includes a filter for filtering a high speed signal; A protection unit having protection against electrical overload and static electricity; A forward diode connected in series to the protection unit; And a molding unit molding the forward diode. Here, the first package includes a filter unit, the second package includes a forward diode, flip-chip stacked on the first package, any one of the first package and the second package includes a protection unit.

Description

Electrical overstress protection device

The present invention relates to an electrical overload protection device, and more particularly, to an electrical overload protection device that can simultaneously implement a low capacitance and a protection against static electricity and electrical overload to be suitable for high-speed signal lines.

In general, electric overstress (EOS) occurs in the form of inrush current, or starting current, in various environments, such as, for example, charging, transformer, and motor drive circuitry. At this time, an abnormal increase in voltage causes sparks in the system, causing damage to components, components, and the system.

Such an electrical overload is a relatively low voltage compared to electrostatic discharge (ESD), but is applied for a relatively long time, which may cause breakdown of the insulating layer of the internal circuit, thereby preventing inflow into the internal circuit. It is necessary to do

As such, devices such as TVS (transient voltage suppressor) and varistors are used to protect the electrical overload occurring in the main circuit. However, since these devices have high capacitance, they are adversely affected when used in high-speed signal lines. Crazy

Therefore, there is an urgent need to develop a device having a low capacitance along with a protection against electric overload or static electricity.

KR 10-2016-0038648 A (2016.04.07 open)

The present invention has been made in view of the above, and an object thereof is to provide an electrical overload protection device having a low capacitance to be suitable for use in a high-speed signal line as well as a protection against electrical overload and static electricity.

In order to solve the above problems, the present invention provides a filter for filtering a high speed signal; A protection unit having protection against electrical overload and static electricity; A forward diode connected in series with the protection unit; And a molding part for molding the forward diode. Here, the first package includes the filter unit, the second package includes the forward diode, flip chip stacked on the first package, any one of the first package and the second package is the protection unit Include.

On the other hand, the present invention includes a first package including a filter unit for filtering a high-speed signal, and a protection unit having a protection function against electrical overload and static electricity; A second package including a forward diode connected in series to the protection unit and stacked in a flip chip shape on the first package; And a molding part for molding the second package.

In addition, the present invention includes a first package including a filter unit for filtering a high-speed signal; A second package including a protection unit having a protection function against electrical overload and static electricity, and a forward diode connected in series with the protection unit, the second package being stacked in a flip chip shape on the first package; And a molding part for molding the second package.

In addition, the present invention includes a first package including a protection unit having a protective function against electrical overload and static electricity; A second package including a forward diode connected in series to the protection unit and stacked in a flip chip shape on the first package; And a molding part for molding the second package.

According to a preferred embodiment of the present invention, the second package may be configured of the forward diode as a single package.

The protection unit may be a varistor, and the first package may include at least one of the filter unit and the varistor.

The protection unit may be a zener diode, and the second package may include the zener diode and the forward diode.

In addition, the first package, a pair of ground electrodes provided in a 'c' shape on both sides of one direction; A plurality of input / output electrodes provided in a 'c' shape on both sides of the other direction perpendicular to the pair of ground electrodes; A body comprising a plurality of sheet layers; A first electrode spaced at a predetermined interval between the pair of ground electrodes on the first sheet layer on the top; A plurality of second electrodes disposed on the second sheet layer below the first sheet layer to partially overlap the first electrode and connected to any one of the plurality of input / output electrodes; And a plurality of resistors connected to any one of the plurality of input / output electrodes in the plurality of sheet layers below the second sheet layer, wherein the resistors provided on adjacent sheet layers are connected through via holes and face each other. It can be connected to the input and output electrode.

The first package may include a pair of ground electrodes provided in a 'c' shape on both sides of one direction; A plurality of input / output electrodes provided in a 'c' shape on both sides of the other direction perpendicular to the pair of ground electrodes; A body comprising a plurality of sequentially stacked sheet layers; And a plurality of coil patterns connected to any one of the plurality of input / output electrodes in the plurality of sheet layers, wherein the coil patterns provided on the sheet layers that are cross-laminated among the plurality of sheet layers are connected through via holes. It may be connected to input and output electrodes facing each other.

In addition, the first package, a pair of ground electrodes provided in a 'c' shape on both sides of one direction; A plurality of input / output electrodes provided in a 'c' shape on both sides of the other direction perpendicular to the pair of ground electrodes; A body comprising a plurality of sheet layers; And a plurality of capacitor electrodes connected to any one of the plurality of input / output electrodes in the plurality of sheet layers, wherein the capacitor electrodes provided on the sheet layers stacked in the plurality of sheet layers overlap each other. Can be.

In addition, the first package, a pair of ground electrodes provided in a 'c' shape on both sides of one direction; A plurality of input / output electrodes provided in a 'c' shape on both sides of the other direction perpendicular to the pair of ground electrodes; A body comprising a plurality of sheet layers; A first electrode spaced at a predetermined interval between the pair of ground electrodes on the first sheet layer on the top; And a plurality of second electrodes disposed on the second sheet layer below the first sheet layer to partially overlap with the first electrode, and connected to input / output electrodes facing each other among the plurality of input / output electrodes. .

In addition, the second package may include a pair of drawing electrodes provided on both sides in one direction from a lower surface thereof; And a plurality of diode electrodes provided on at least one side of the other direction perpendicular to the pair of lead electrodes.

The high speed signal may be a signal of any one of low voltage differential signaling (LVDS), high definition multimedia interface (HDMI), universal serial bus (USB), V by 1, and USB 3.0 / 3.1.

According to the present invention, by connecting the forward diode in series with the protection function to reduce the total capacitance, it is possible to perform the electrical overvoltage protection and the electrostatic protection while suppressing the attenuation of the high-speed data signal.

In addition, the present invention can package a filter according to the type of high-speed signal line and flip chip a forward diode on the package, thereby easily implementing a single package and improving manufacturing efficiency.

1 is a perspective view showing an electrical overload device according to a first embodiment of the present invention;
2 is a perspective view of the protective part of FIG.
3 is an exploded perspective view of the protective part of FIG.
4 is an equivalent circuit diagram of FIG. 1;
5 is a perspective view showing an electrical overload device according to a second embodiment of the present invention;
6 is a perspective view of the protective part of FIG.
7 is an exploded perspective view of the protection unit of FIG. 6, FIG.
8 is a bottom perspective view of the second package of FIG. 5;
9 is an equivalent circuit diagram of a second package of FIG. 8;
10 is an equivalent circuit diagram of FIG. 5;
11 is a perspective view showing an electrical overload device according to a third embodiment of the present invention;
12 is an exploded perspective view of the protection unit of FIG. 11;
13 is an equivalent circuit diagram of FIG.
14 is a perspective view showing an electrical overload device according to a fourth embodiment of the present invention;
15 is an exploded perspective view of the protection unit of FIG. 14, and
FIG. 16 is an equivalent circuit diagram of FIG. 14.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. The drawings and description are to be regarded as illustrative in nature and not restrictive. Like reference numerals designate like elements throughout the specification.

Electrical overload protection device (100, 200, 300, 400) according to the present invention, as shown in Figures 1, 5, 11 and 14, the first package (110, 210, 310, 410), the second package (120, 220, 320, 420) and the molding unit (130, 230, 330, 430) do.

The electrical overload protection devices 100, 200, 300, and 400 are protection devices for high-speed signal lines, and include low voltage differential signaling (LVDS), high definition multimedia interface (HDMI), universal serial bus (USB), V by 1, and USB 3.0 / 3.1. It may be a protection element for any one signal line.

Here, the electrical overload protection device (100, 200, 300, 400) has a function to protect against electrical overload (EOS) and static electricity (ESD), is disposed on the signal line as described above, is connected to the ground of the circuit board.

The first packages 110 and 410 include a filter unit for filtering a high speed signal and a protection unit having a protection function against electrical overload and static electricity, and the second packages 120 and 420 include a forward diode connected in series to the protection unit.

Here, the protection part includes a varistor or a zener diode, has a high capacitance, and the forward diode is made of a separate package and has a low capacitance.

In this way, the high capacitance protection part is connected in series with the low capacitance forward diode so that the total capacitance between the signal output terminal and ground becomes smaller than the capacitance of the forward diode.

As a result, by using a high capacitance protection unit and implementing a low capacitance suitable for a high speed signal line, an electrical overload (EOS) and an electrostatic (ESD) protection function can be performed while suppressing attenuation of a high speed data signal.

In this case, the forward diode is flip chip stacked on the first packages 110 and 410. That is, since the forward diode is a single component package, the forward diode is flip-chip stacked on the first packages 110 and 410, so that the electrical overload protection devices 100 and 400 can be easily implemented in a single package and the manufacturing efficiency is improved. You can.

The filter unit may be a filter implemented according to the type of the high speed signal line, and may be a high pass filter. The filter unit may be formed of a capacitor, a resistor, a transformer, or a capacitor.

Alternatively, the protection unit may be implemented in the second packages 220 and 320. That is, the first packages 210 and 310 include only the filter unit, and the second packages 220 and 320 include the protection unit together with the forward diode.

In this case, the protection unit may be a zener diode. That is, the second packages 220 and 320 may be a single package consisting of the forward diode and the zener diode. In this case, the second packages 220 and 320 may be disposed on the bottom surface of the package such that the second packages 220 and 320 may be flip-chip stacked on the first packages 210 and 310.

 As a result, the first packages 210 and 310 are manufactured using the existing filter manufacturing process, and the second packages 220 and 320 are manufactured using the diode manufacturing process, thereby easily implementing a single package of the electrical overload protection device 200 and 300. At the same time, by manufacturing the second package 220,320 separately, the manufacturing efficiency can be improved.

The molding parts 130, 230, 330, and 430 are molded to cover the top surfaces of the first packages 110, 210, 310, 410 and the second packages 120, 220, 320, and 420 stacked on the second packages 120, 220, 320, and 420. That is, the molding parts 130, 230, 330, and 430 mold the forward diode.

Hereinafter, embodiments according to types of high-speed signal lines to which the electrical overload protection devices 100, 200, 300, and 400 are applied will be described in more detail.

Electrical overload protection device 100 according to the first embodiment of the present invention is a protection device for LVDS or HDMI signal line, as shown in Figure 1, the first package 110, the second package 120, and The molding part 130 is included.

Here, the first package 110 may include a protection unit and a filter unit, and the second package 120 may include a forward diode made of a single package. That is, the first package 110 may be a package in the form of a protection device, and the second package 120 may be a package composed of a single component.

In this case, the protection part may be a varistor, and the filter part may be a high pass filter including a resistor and a capacitor.

The first package 110 includes a plurality of sheet layers 111-1 to 111-7, a pair of ground electrodes 112a and 112b, a pair of input / output electrodes 113a and 113b, a first electrode 114, A plurality of second electrodes 115a and 115b and a plurality of resistors 116a to 119a and 116b to 119b may be included.

The plurality of sheet layers 111-1 to 111-7 may be body bodies. Here, the first sheet layer 111-1 and the second sheet layer 111-2 correspond to the protection part, and the third sheet layer 111-3 is a buffer layer for distinguishing the protection part and the filter part. The remaining sheet layers 111-4 to 111-7 correspond to the filter portion (see FIG. 3). Here, the plurality of sheet layers 111-1 to 111-7 may include a varistor material layer and a dielectric.

The pair of ground electrodes 112a and 112b may be provided in a 'c' shape on both sides of one direction of the first package 110. That is, each of the pair of ground electrodes 112a and 112b may be formed over a portion of the side, top and bottom surfaces of the first package 110 (see FIG. 2). The ground electrodes 112a and 112b are connected to the ground of the circuit board when the electrical overload protection device 100 is disposed on the high speed signal line.

The plurality of input / output electrodes 113a and 113b may be provided in a 'c' shape on both sides of the other direction perpendicular to the pair of ground electrodes 112a and 112b. That is, each of the plurality of input / output electrodes 113a and 113b may be formed over a part of the side surface, the upper surface, and the lower surface of the first package 110 (see FIG. 2). The input / output electrodes 113a and 113b are connected to a high speed signal line.

The first electrode 114 is spaced at a predetermined interval between the pair of ground electrodes 112a and 112b on the first sheet layer 111-1 disposed at the top of the plurality of sheet layers 111-1 to 111-7. May be arranged (see FIG. 2). The first electrode 114 is an electrode for connecting to the forward diode as one side of the varistor.

The plurality of second electrodes 115a and 115b may be partially overlapped with the first electrode 114 on the second sheet layer 111-2 below the first sheet layer 111-1 (FIG. 3). The second electrodes 115a and 115b may be connected to one of the plurality of input / output electrodes 113a and 113b as the other electrode of the varistor, respectively.

The plurality of resistors 116a to 119a and 116b to 119b may be disposed on the plurality of sheet layers 111-4 to 111-7 below the second sheet layer 111-2 (see FIG. 3). In this case, the plurality of resistors 116a to 119a and 116b to 119b may be connected to one of the plurality of input / output electrodes 113a and 113b, respectively.

That is, the resistors 116a and 116b are disposed on the fourth sheet layer 111-4 and disposed at one edge of the fourth sheet layer 111-4 so that one side thereof is connected to the input / output electrode 113b. The side is disposed in the central portion, and may extend in a spiral shape therebetween.

The resistors 117a and 117b are disposed on the fifth sheet layer 111-5, and the other side of the fifth sheet layer 111-5 so that one side thereof is connected to the input / output electrode 113a opposite to the input / output electrode 113b. It is disposed on the edge, and the other side is disposed in the center portion, and may extend in a predetermined shape therebetween.

Here, the resistors 116a and 117a provided in the adjacent sheet layers are connected through the via holes 116a-1 and 117a-1 at the center portion, and the resistors 116b and the resistor 117b are via holes 116b at the center portion. -1,117b-1) may be connected.

Similarly, the resistors 118a and 118b are disposed on the sixth sheet layer 111-6 and disposed at one edge of the sixth sheet layer 111-6 so that one side thereof is connected to the input / output electrode 113a. , The other side is disposed in the central portion, and may extend in a predetermined shape therebetween.

The resistors 119a and 119b are disposed on the seventh sheet layer 111-7 and the other side of the seventh sheet layer 111-7 so that one side thereof is connected to the input / output electrode 113b opposite to the input / output electrode 113a. It is disposed at the edge, the other side is disposed in the central portion, and may extend in a spiral shape therebetween.

Here, the resistors 118a and 119a provided in the adjacent sheet layers are connected through the via holes 118a-1 and 119a-1 at the center portion, and the resistors 118b and the resistor 119b are via holes 118b at the center portion. -1, 119b-1) can be connected.

In this case, the resistors 116a to 119a and 116b to 119b are not limited to the shapes described above, but may have various forms.

The second package 120 may be a forward diode composed of one single component. Here, the electrical overload protection device 100 may include two second packages 120. That is, the electrical overload protection device 100 may include two forward diodes.

Each second package 120 may be disposed between the first electrode 114 and the pair of ground electrodes 112a and 112b. In this case, the second package 120 may be stacked on the first electrode 114 and the ground electrode 112a or the first electrode 114 and the ground electrode 112b in the form of a flip chip.

That is, the forward diode may be connected in series with the protection unit between the input / output electrodes 113a and 113b and the ground electrodes 112a and 112b.

The molding part 130 is molded to cover the top surfaces of the second package 120 and the first package 110. As a result, the electrical overload protection device 100 may form a plurality of individual packages into one package.

As illustrated in FIG. 4, the electrical overload protection device 100 configured as described above is equivalent to a resistor and a pair of varistors between the input / output electrodes c to j and a forward diode connected to the ground electrodes a and b. It can be represented by a circuit.

Here, the varistor and the forward diode are connected in series between the input / output electrodes c to j and the ground electrodes a and b, so that the total capacitance between the input and output electrodes c to j and the ground electrodes a and b is increased. It is possible to form smaller capacitances than forward diodes with lower capacitance.

In addition, a high pass filter may be formed by a capacitance between the input / output electrodes c to j and the ground electrodes a and b and a resistance between the input and output electrodes c to j. As a result, the electrical overload protection device 100 may provide a protection function of the electrical overload (EOS) and the static electricity (ESD) while minimizing the attenuation of the signal with respect to the high speed signal.

As shown in FIG. 5, the electrical overload protection device 200 according to the second embodiment of the present invention is a protection device for any one of the signal lines of LVDS, HDMI, and USB. 2 package 220, and the molding unit 230.

Here, the first package 210 may include only the filter unit, and the second package 220 may include a protection unit and a plurality of forward diodes. In this case, the protection unit may be a zener diode, and the filter unit may be a high pass filter made of a transformer.

That is, the first package 210 may be a filter-type package, and the second package 220 may be a package including a plurality of forward diodes and one zener diode as a single component.

The first package 210 includes a plurality of sheet layers 211-1 to 211-5, a pair of ground electrodes 212a and 212b, a pair of input / output electrodes 213a and 213b, and a plurality of coil patterns 215a. ~ 217a, 215b-217b).

The plurality of sheet layers 211-1 to 211-5 may be a body. Here, the first sheet layer 211-1 is a protective layer as the uppermost layer, and the remaining sheet layers 211-2 to 211-5 correspond to the filter portion (see FIG. 7). Here, the plurality of sheet layers 211-1 to 211-5 may include magnetic materials.

Since the pair of ground electrodes 212a and 212b and the plurality of input / output electrodes 213a and 213b are the same as those of the pair of ground electrodes 112a and 112b and the plurality of input / output electrodes 113a and 113b of the first embodiment. Detailed description thereof will be omitted here (see FIG. 6).

The plurality of coil patterns 214a to 217a and 214b to 217b may be disposed on the plurality of sheet layers 211-2 to 211-5 below the first sheet layer 211-1 (see FIG. 7). In this case, the plurality of coil patterns 214a to 217a and 214b to 217b may be connected to one of the plurality of input / output electrodes 213a and 213b, respectively.

That is, the coil patterns 214a and 214b are disposed on the second sheet layer 211-2, and disposed at one edge of the second sheet layer 211-2 so that one side thereof is connected to the input / output electrode 213b. The other side is disposed in the center portion, and may extend in a spiral shape therebetween.

The coil patterns 215a and 215b are disposed on the third sheet layer 211-3 and disposed at the other edge of the third sheet layer 211-3 so that one side is connected to the input / output electrode 213b. It is disposed in the center portion, and may extend in a spiral shape therebetween.

Similarly, the coil patterns 216a and 216b are disposed on the fourth sheet layer 211-4, and the fourth sheet layer 211 is connected to the input / output electrode 213a opposite to the input / output electrode 213b. It is disposed on one side edge of -4), the other side is disposed in the center portion, and may extend in a spiral shape therebetween.

The coil patterns 217a and 217b are disposed on the fifth sheet layer 211-5, and one side of the fifth sheet layer 211-5 is connected to the input / output electrode 213a opposite to the input / output electrode 213b. It is disposed on the other edge, the other side is disposed in the central portion, and may extend in a spiral shape therebetween.

In this case, the coil patterns 214a and the coil patterns 216a provided in the sheet layers that are cross-laminated among the plurality of sheet layers 211-2 to 211-5 are provided with via holes 214a-1 and 216a-1 at the center thereof, and between them. It is connected through the through hole 215a-2 of the sheet layer 211-3 disposed of the coil pattern 214b and the coil pattern 216b at the center portion of the via holes 214b-1 and 216b-1 and the sheet layer ( It may be connected through the through hole 215b-2 of 211-3.

Similarly, the coil pattern 215a and the coil pattern 217a are formed through the through holes 216a-2 of the sheet layers 211-4 and the via holes 215a-1 and 217a-1 disposed therebetween at the center portion. The coil pattern 215b and the coil pattern 217b may be connected through the via holes 215b-1 and 217b-1 and the through hole 216b-2 of the sheet layer 211-4 at the center portion.

In this case, the coil patterns 214a to 217a and 214b to 217b are not limited to the shapes described above, but may have various forms.

The second package 220 includes a plurality of forward diodes and one zener diode. Here, the cathode of each of the plurality of forward diodes may be connected to the cathode of the zener diode, the anode of each of the plurality of forward diodes may be connected to the diode electrode 223b, and the anode of the zener diode may be connected to the extraction electrodes 222a and 222b. (See FIG. 9).

In this case, the forward diode is shown and described as being connected to only one diode electrode 223b of the second package 220, but is not limited thereto and may be provided to be connected to both diode electrodes 223a and 223b.

The second package 220 corresponds to the ground electrodes 212a and 212b and the input / output electrodes 213a and 213b provided on the upper surface of the first package 210 to be flip chip stacked on the first package 210. A pair of lead electrodes 222a and 222b and a plurality of diode electrodes 223a and 223b are provided on the bottom surface.

Here, the pair of lead electrodes 222a and 222b may be provided at both sides of one direction of the second package 220, and the plurality of diode electrodes 223a and 223b may be perpendicular to the lead electrodes 222a and 222b. It may be provided on at least one side of the.

At this time, the second package 220 is flip-chip stacked on the first package 210, so that each forward diode is connected to the input / output electrodes 213a and 213b through the diode electrodes 223a and 223b and the zener diode is connected. It may be connected to the ground electrodes 212a and 212b via the lead electrodes 222a and 222b. Therefore, each of the forward diodes may be connected in series with a zener diode as a protection part between the input / output electrodes 213a and 213b and the ground electrodes 212a and 212b.

The molding part 230 is molded to cover the top surfaces of the second package 220 and the first package 210. As a result, the electrical overload protection device 200 may form a plurality of individual packages into one package.

The electrical overload protection device 200 configured as described above is represented by an equivalent circuit of a forward diode and a zener diode connected to the transformer and the ground electrodes a and b between the input / output electrodes c1 to j1 as shown in FIG. 10. Can be.

Here, the Zener diode and the forward diode are connected in series between the input / output electrodes c1 to j1 and the ground electrodes a1 and b1, respectively, so that the total capacitance between the input / output electrodes c1 to j1 and the ground electrodes a1 and b1 is reduced. Can form a smaller capacitance than the forward diode with lower capacitance.

In addition, a high pass filter may be formed by a capacitance between the input / output electrodes c1 to j1 and the ground electrodes a1 and b1 and a transformer between the input and output electrodes c1 to j1. As a result, the electrical overload protection device 200 may provide a protection function of the electrical overload (EOS) and the static electricity (ESD) while minimizing the attenuation of the signal with respect to the high speed signal.

Electrical overload protection device 300 according to the third embodiment of the present invention is a protection device for the V by 1 or USB 3.0 / 3.1 signal line, as shown in Figure 11, the first package 310, the second package 320 and the molding part 330.

Here, the first package 310 may include only the filter unit, and the second package 320 may include a protection unit and a plurality of forward diodes. In this case, the protection unit may be a zener diode, and the filter unit may be a high pass filter made of a capacitor.

That is, the first package 310 may be a package in the form of a filter, and the second package 320 may be a package in which a plurality of forward diodes and one zener diode are composed of a single component.

The first package 310 includes a plurality of sheet layers 311-1 to 311-5, a pair of ground electrodes 312a and 312b, a pair of input / output electrodes 313a and 313b, and a plurality of capacitor electrodes 314a. , 315a, 314b, 315b).

The plurality of sheet layers 311-1 to 311-5 may be a body. Here, the first sheet layer 311-1 is a protective layer as the uppermost layer, and the remaining sheet layers 311-2 to 311-5 correspond to the filter portion (see FIG. 12). Here, the plurality of sheet layers 311-1 to 311-5 may include a dielectric.

Since the pair of ground electrodes 312a and 312b and the plurality of input / output electrodes 313a and 313b are the same as those of the pair of ground electrodes 112a and 112b and the plurality of input / output electrodes 113a and 113b of the first embodiment. Detailed description is omitted here (see FIG. 11).

The plurality of capacitor electrodes 314a, 315a, 314b, and 315b may be disposed in the plurality of sheet layers 311-2 to 311-5 below the first sheet layer 311-1 (see FIG. 12). In this case, the plurality of capacitor electrodes 314a, 315a, 314b, and 315b may be connected to one of the plurality of input / output electrodes 313a and 313b, respectively.

That is, the capacitor electrode 314a is disposed on the second sheet layer 311-2, and is disposed at one side edge of the second sheet layer 311-2 so that one side is connected to the input / output electrode 313b, and the other side is It is disposed in the center portion, and may extend in a straight shape between.

The capacitor electrode 314b is disposed on the third sheet layer 311-3 and one edge of the third sheet layer 311-3 so that one side thereof is connected to the input / output electrode 313a opposite to the input / output electrode 313b. The other side is disposed in the center portion, and may extend in a straight line therebetween.

Similarly, the capacitor electrode 315a is disposed on the fourth sheet layer 311-4, and is disposed at one side edge of the fourth sheet layer 311-4 so that one side thereof is connected to the input / output electrode 313b. The other side is disposed in the center portion, and may extend in a straight line between them.

The capacitor electrode 315b is disposed on the fifth sheet layer 311-5, and one side edge of the fifth sheet layer 311-5 is connected so that one side thereof is connected to the input / output electrode 313a opposite to the input / output electrode 313b. The other side is disposed in the center portion, and may extend in a straight line therebetween.

At this time, the capacitor electrode 314a and the capacitor electrode 315a provided in the sheet layers stacked in a stack among the plurality of sheet layers 311-2 to 311-5 may be disposed to overlap each other.

The second package 320 includes a plurality of forward diodes and one zener diode. Here, since the second package 320 is the same as the configuration of the second package 220 of the second embodiment, a detailed description thereof will be omitted.

The molding part 330 is molded to cover the top surfaces of the second package 320 and the first package 310. As a result, the electrical overload protection device 300 may form a plurality of individual packages into one package.

 The electrical overload protection device 300 configured as shown in FIG. 13 may be represented as an equivalent circuit of a forward diode and a zener diode connected to the capacitor and the ground electrodes a2 and b2 between the input / output electrodes c2 ˜ j2. have.

Here, the Zener diode and the forward diode are connected in series between the input / output electrodes c2 ˜ j2 and the ground electrodes a2 and b2, respectively, so that the total capacitance between the input and output electrodes c2 ˜ j2 and the ground electrodes a2 and b2 is achieved. Can form a smaller capacitance than the forward diode with lower capacitance.

In addition, a high pass filter may be formed by a capacitance between the input / output electrodes c2 ˜ j2 and the ground electrodes a2 and b2 and a capacitor between the input and output electrodes c2 ˜ j2. As a result, the electrical overload protection device 300 may provide a protection function of the electrical overload (EOS) and the static electricity (ESD) while minimizing the attenuation of the signal with respect to the high speed signal.

The electrical overload protection device 400 according to the fourth embodiment of the present invention is a protection device for a V by 1 or USB 3.0 / 3.1 signal line, and as shown in FIG. 14, the first package 410 and the second package. 420, and the molding unit 430.

Here, the first package 410 may include a protection unit and a filter unit, and the second package 420 may include a forward diode made of a single package. That is, the first package 410 may be a package in the form of a protection device, and the second package 420 may be a package composed of a single component.

In this case, the protection part may be a varistor, and the filter part may be a high pass filter including a capacitor formed by the varistor and the forward diode.

The first package 410 includes a plurality of sheet layers 411-1 to 411-2, a pair of ground electrodes 412a and 412b, a pair of input / output electrodes 413a and 413b, a first electrode 414, And a plurality of second electrodes 415.

The plurality of sheet layers 411-1 to 111-2 may be a body. Here, the plurality of sheet layers 411-1 to 411-2 may include varistor material layers (see FIG. 15).

The pair of ground electrodes 412a and 412b, the plurality of input / output electrodes 413a and 413b, and the first electrode 414 are the pair of ground electrodes 112a and 112b and the plurality of input / output electrodes 113a of the first embodiment. 113b and the first electrode 114, the detailed description thereof is omitted here (see FIG. 14).

The plurality of second electrodes 415 may be partially overlapped with the first electrodes 414 on the second sheet layer 411-2 below the first sheet layer 411-1 (see FIG. 15). ). The second electrode 415 may be connected to the plurality of input / output electrodes 413a and 413b as the other electrode of the varistor facing the first electrode 414, respectively. That is, the plurality of second electrodes 415 may be provided in a straight line connected to both edges of the second sheet layer 411-2.

The second package 420 may be a forward diode composed of one single component. Here, since the second package 420 is the same as the configuration of the second package 120 of the first embodiment, a detailed description thereof will be omitted.

In this case, since the second package 420 is flip-chip stacked on the first package 410, the forward diode may be connected in series with the protection unit between the input / output electrodes 413a and 413b and the ground electrodes 412a and 412b. have.

The molding part 430 is molded to cover the top surfaces of the second package 420 and the first package 410. As a result, the electrical overload protection device 400 may form a plurality of individual packages into one package.

As illustrated in FIG. 16, the electrical overload protection device 400 configured as described above may be represented by an equivalent circuit of a varistor and a forward diode connected in series between the input / output electrodes c3 to j3 and the ground electrodes a3 and b3. .

Here, the varistor and the forward diode are connected in series between the input / output electrodes c3 to j3 and the ground electrodes a3 and b3, so that the total capacitance between the input and output electrodes c3 to j3 and the ground electrodes a3 and b3 is reduced. It is possible to form smaller capacitances than forward diodes with lower capacitance.

In addition, a high pass filter may be formed by a capacitance between the input / output electrodes c3 ˜ j3 and the ground electrodes a3 and b3. As a result, it is possible to minimize the attenuation of the signal with respect to the high-speed signal and to provide a function of protecting the electrical overload (EOS) and the static electricity (ESD).

Although one embodiment of the present invention has been described above, the spirit of the present invention is not limited to the embodiments set forth herein, and those skilled in the art who understand the spirit of the present invention, within the scope of the same idea, the addition of components Other embodiments may be easily proposed by changing, deleting, adding, and the like, but this will also fall within the spirit of the present invention.

100,200,300,400: Electrical overload protection device
110,210,310,410: first package 120,220,320,420: second package
130,230,330,430: Molding part
111-1 ~ 111-7,211-1 ~ 211-5,311-1 ~ 311-5,411-1 ~ 411-2: Sheet layer
112a, 112b, 212a, 212b, 312a, 312b, 412a, 412b: ground electrode
113a, 113b, 213a, 213b, 313a, 313b, 413a, 413b: input / output electrodes
222a, 222b, 322a, 322b: lead-out electrode
223a, 223b, 323a, 323b: Diode electrode

Claims (13)

delete A first package including a filter unit filtering a high speed signal, and a protection unit having a protection function against electrical overload and static electricity;
A second package including a forward diode connected in series to the protection unit and stacked in a flip chip shape on the first package; And
Includes; a molding unit for molding the second package;
The first package includes a pair of ground electrodes and a plurality of input / output electrodes,
The protection unit is a plurality of varistors connected to each of the plurality of input and output electrodes,
The second package is the forward diode is composed of a single component package,
The forward diode is an electrical overload protection device connected in series with each of the plurality of varistors between each of the plurality of input and output electrodes and the pair of ground electrodes. A first package including a filter unit for filtering a high speed signal;
A second package including a protection unit having a protection function against electrical overload and static electricity, and a forward diode connected in series with the protection unit, the second package being stacked in a flip chip form on the first package; And
Includes; a molding unit for molding the second package;
The first package includes a pair of ground electrodes and a plurality of input / output electrodes,
The protection part is a zener diode,
The second package is a package consisting of a plurality of forward diodes and one zener diode as a single component,
The plurality of forward diodes are respectively connected to some of the plurality of input and output electrodes,
And the zener diode is connected to each of the plurality of forward diodes in series between each of some of the plurality of input / output electrodes and one of the pair of ground electrodes. A first package including a protection unit having a protection function against electrical overload and static electricity;
A second package including a forward diode connected in series to the protection unit and stacked in a flip chip shape on the first package; And
Includes; a molding unit for molding the second package;
The first package includes a pair of ground electrodes and a plurality of input and output electrodes,
The protection unit is a plurality of varistors connected to each of the plurality of input and output electrodes,
The second package is the forward diode is composed of a single component package,
And the forward diode is electrically connected to each of the plurality of varistors in series between each of the plurality of input / output electrodes and the pair of ground electrodes. delete delete delete The method of claim 2,
The pair of ground electrodes are provided in a 'c' shape on both sides of one direction of the first package,
The plurality of input and output electrodes are provided in a 'c' shape on both sides of the other direction perpendicular to the pair of ground electrodes,
The first package,
A body comprising a plurality of sheet layers;
A first electrode spaced at a predetermined interval between the pair of ground electrodes on the first sheet layer on the top;
A plurality of second electrodes disposed on the second sheet layer below the first sheet layer to partially overlap the first electrode and connected to any one of the plurality of input / output electrodes; And
And a plurality of resistors connected to any one of the plurality of input / output electrodes in the plurality of sheet layers under the second sheet layer.
The resistors provided on the sheet layers adjacent to each other are connected through via holes, and are electrically connected to the input / output electrodes facing each other. The method of claim 2,
The pair of ground electrodes are provided in a 'c' shape on both sides of one direction of the first package,
The plurality of input and output electrodes are provided in a 'c' shape on both sides of the other direction perpendicular to the pair of ground electrodes,
The first package,
A body comprising a plurality of sequentially stacked sheet layers; And
And a plurality of coil patterns connected to any one of the plurality of input / output electrodes in the plurality of sheet layers.
The coil pattern provided on the sheet layer that is cross-laminated among the plurality of sheet layers is connected via a via hole, the electrical overload protection device connected to the input and output electrodes facing each other. The method of claim 2,
The pair of ground electrodes are provided in a 'c' shape on both sides of one direction of the first package,
The plurality of input and output electrodes are provided in a 'c' shape on both sides of the other direction perpendicular to the pair of ground electrodes,
The first package,
A body comprising a plurality of sheet layers; And
A plurality of capacitor electrodes connected to any one of the plurality of input / output electrodes in the plurality of sheet layers;
Capacitor electrodes provided on the sheet layer that is cross-laminated among the plurality of sheet layers are disposed to overlap each other. The method of claim 4, wherein
The pair of ground electrodes are provided in a 'c' shape on both sides of one direction of the first package,
The plurality of input and output electrodes are provided in a 'c' shape on both sides of the other direction perpendicular to the pair of ground electrodes,
The first package,
A body comprising a plurality of sheet layers;
A first electrode spaced at a predetermined interval between the pair of ground electrodes on the first sheet layer on the top; And
And a plurality of second electrodes disposed on the second sheet layer below the first sheet layer to partially overlap the first electrode and connected to input / output electrodes facing each other among the plurality of input / output electrodes. Protection element. The method of claim 3, wherein the second package,
A pair of lead-out electrodes provided on both sides of one direction at a bottom surface thereof; And
An electrical overload protection device comprising a plurality of diode electrodes provided on at least one side of the other direction perpendicular to the pair of extraction electrodes. The method according to claim 2 or 3,
The high speed signal is an electrical overload protection device which is a signal of any one of low voltage differential signaling (LVDS), high definition multimedia interface (HDMI), universal serial bus (USB), V by 1, and USB 3.0 / 3.1.

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