JP4441969B2 - Electronic component and electronic device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component and an electronic device, and can be applied to, for example, a battery pack. The present invention makes it possible to prevent deterioration of elements due to static electricity with a simple configuration by forming discharge gaps at substantially constant intervals in opposing portions between wiring patterns.
[0002]
[Prior art]
Conventionally, in a battery pack using a lithium ion battery, the type of the battery pack can be identified by determining the resistance for identification from an external device. That is, in this type of battery pack, in addition to the charge / discharge terminal for inputting / outputting the charge / discharge current, an identification terminal connected to the identification resistor is arranged, and a predetermined current is supplied to the identification resistor via the identification terminal. Is applied to determine the terminal voltage of the identification resistor, so that the type of the battery pack can be determined.
[0003]
[Problems to be solved by the invention]
By the way, in this type of battery pack, a high voltage due to static electricity may be applied through such a terminal. That is, for example, when the user touches the charge / discharge terminal of the battery pack in a charged state, static electricity of about 15 [kV] is applied to the charge / discharge terminal.
[0004]
When electrostatic discharge is repeatedly performed by the identification resistor due to the high voltage, in the battery pack, the identification resistor is deteriorated and the resistance value gradually changes, and finally it may not be correctly identified by an external device. In this type of battery pack, the charge / discharge current is controlled to be turned on / off by controlling the field effect transistor, and when discharge due to a high static voltage occurs in the field effect transistor, the field effect transistor also has the same effect. The characteristics may deteriorate. Similarly, the control circuit for controlling the field effect transistor may be deteriorated by discharge.
[0005]
As one method for solving these problems, there is a method in which circuit elements such as resistors are arranged, and further, overvoltage prevention elements such as Zener diodes, varistors, and capacitors are arranged to prevent deterioration of the elements due to static electricity. However, depending on the arrangement of these elements on the substrate, these elements may not always be effectively protected.
[0006]
By the way, this This These protection elements cannot avoid a certain time delay in operation, and even when such elements are arranged, the voltage due to the high voltage waveform is directly applied to the identification resistor or the like at the rise of the high voltage waveform due to static electricity. In some cases, the deterioration of the element cannot be effectively protected. Furthermore, the repeated application of static electricity deteriorates the characteristics of these protective elements themselves, and this may also prevent the identification resistance and the like from being effectively retained.
[0007]
In addition, when a protective element is separately provided in this way, there is a problem that the configuration becomes complicated accordingly.
[0008]
The present invention has been made in consideration of the above points, and an object of the present invention is to propose an electronic component and an electronic device that can prevent deterioration of an element due to static electricity with a simple configuration.
[0009]
[Means for Solving the Problems]
In order to solve such a problem, the invention according to claim 1 is applied to an electronic component and includes a first wiring pattern having one end connected to a first input terminal and the other end connected to a battery pack identification resistor. A second wiring pattern having one end connected to the second input terminal and the other end connected to the side of the battery pack identification resistor not connected to the first wiring pattern. To the earth line A third wiring pattern connected to each other, and a portion where the first and third wiring patterns face each other and a portion where the second and third wiring patterns face each other are discharged at a substantially constant interval. It is formed so as to extend with a gap in between.
[0010]
According to a fifth aspect of the present invention, when applied to an electronic device, the wiring board of the electronic device has at least an external connection. First and second input terminals; A first wiring pattern having one end connected to the first input terminal and the other end connected to the battery pack identifying resistor, and one end connected to the second input terminal, the battery pack identifying resistor A second wiring pattern having the other end connected to the side to which the first wiring pattern is not connected To the earth line A third wiring pattern connected to each other, and a portion where the first and third wiring patterns face each other and a portion where the second and third wiring patterns face each other are discharged at a substantially constant interval. It is formed so as to extend with a gap in between.
[0011]
According to the configuration of claim 1, one end is connected to the first input terminal, the other end is connected to the battery pack identification resistor, and one end is connected to the second input terminal. A second wiring pattern having the other end connected to the side of the battery pack identification resistor not connected to the first wiring pattern; To the earth line A third wiring pattern connected to each other, and a portion where the first and third wiring patterns face each other and a portion where the second and third wiring patterns face each other are discharged at a substantially constant interval. By being formed so as to extend with the gap interposed therebetween, when a high voltage due to static electricity is applied to the input terminal, it is possible to discharge at this discharge gap. As a result, it is possible to prevent electric discharge in other elements and elements of this electronic component, thereby preventing deterioration of the elements due to static electricity.
[0012]
According to the configuration of claim 5, when applied to an electronic device, in the wiring board of the electronic device, at least for connection to the outside. First and second input terminals; A first wiring pattern having one end connected to the first input terminal and the other end connected to the battery pack identifying resistor, and one end connected to the second input terminal, the battery pack identifying resistor A second wiring pattern having the other end connected to the side to which the first wiring pattern is not connected To the earth line A third wiring pattern connected to each other, and a portion where the first and third wiring patterns face each other and a portion where the second and third wiring patterns face each other are discharged at a substantially constant interval. By forming so as to extend with a gap in between, an element constituting this electronic device, which is mounted on this wiring board and connected to the first wiring pattern, is caused by static electricity. A high voltage is discharged through the discharge gap, and the applied voltage can be lowered, thereby preventing deterioration of the element due to static electricity.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as appropriate.
[0014]
(1) First embodiment
(1-1) Configuration of the first embodiment
FIG. 2 is a connection diagram showing the battery pack according to the first embodiment of the present invention. The battery pack 1 is prepared by housing the battery cell 2 and the wiring board 3 in a predetermined case, and an identification terminal T2 for identifying the battery pack 1 on the side of the case, charging / discharging for inputting / outputting charging / discharging current. Terminals T1 and T3 are arranged.
[0015]
Here, the wiring board 3 is a multilayer wiring board, to which the battery cell 2 is connected via a predetermined connection end, and similarly, the charge / discharge terminals T1, T3 and the identification terminal T2 are connected. The wiring board 3 has a predetermined wiring pattern, and an identification resistor 5 is connected between the negative terminal T3 and the identification terminal T2 of the charge / discharge terminals T1 and T3. An element 6 is arranged.
[0016]
Further, the wiring board 3 includes field effect transistors 8 and 9 that operate under the control of the control integrated circuit (control IC) 7 and are arranged in series between the negative electrode side terminal T3 and the negative electrode side terminal of the battery cell. In the pack 1, the charge / discharge current is on / off controlled by the on / off control of the field effect transistors 8 and 9. In the wiring substrate 3, a control signal output from the control integrated circuit 7 is input to the gates of the field effect transistors 8 and 9 according to a predetermined wiring pattern. 9 is configured to be capable of on / off control, and electrostatic breakdown preventing elements 10 and 11 are disposed on the field effect transistors 8 and 9 side of the wiring pattern connected to the gate, respectively. In the field effect transistors 8 and 9, diodes 12 and 13 are arranged between the source and drain, respectively.
[0017]
Further, the wiring substrate 3 is formed with a wiring pattern so as to supply the power of the battery cell 2 to the control integrated circuit 7, and an element 15 for preventing electrostatic breakdown is arranged on the control integrated circuit 7 side of the wiring pattern. It is made to be done.
[0018]
FIG. 1 is an exploded perspective view showing an electrostatic breakdown preventing element 6 connected to the identification resistor 5. This element 6 for preventing electrostatic breakdown is composed of wiring patterns P1 to P3 of the wiring board 3 and an interlayer insulating layer 17.
[0019]
Here, the wiring pattern P <b> 1 is formed to meander on the interlayer insulating layer 17, and one end is connected to the identification terminal T <b> 2 and the other end is connected to the identification resistor 5. The wiring pattern P2 is formed to meander on the same interlayer insulating layer 17 as the wiring pattern P1, and one end is connected to the side of the identification resistor 5 to which the wiring pattern P1 is not connected. The other end of the wiring pattern P2 is connected to the negative electrode side charge / discharge terminal T3.
[0020]
On the other hand, the wiring pattern P3 is disposed below the interlayer insulating layer 17 of the wiring patterns P1 and P2, and avoids the connection terminals t2 and t3 of the wiring patterns P1 and P2, and these wiring patterns P1 and P2 are for identification. It is formed so as to cover almost the entire surface of the interlayer insulating layer at the portion where the resistor 5 is disposed. The wiring pattern P3 is connected to the wiring pattern P2 and connected to the negative electrode side charge / discharge terminal T3. Further, the wiring pattern P3 is connected to the negative electrode of the battery cell 2 via the field effect transistors 8 and 9, thereby constituting an earth line in the battery pack 1.
[0021]
As a result, in the wiring board 3, the wiring pattern P1 connected to the identification resistor 5 and the wiring pattern P3 connected to the identification resistor 5 in the same manner are extended with a certain interval by the interlayer insulating layer. A discharge gap for discharging static electricity is formed at regular intervals.
[0022]
On the other hand, the electrostatic breakdown prevention elements 10, 11, 15 assigned to the field effect transistors 8, 9 and the control integrated circuit 7 are the electrostatic breakdown prevention elements 6 assigned to the identification resistor 5. It is configured in the same way.
[0023]
(1-2) Operation of the first embodiment
In the above configuration, when the battery pack 1 is connected to the charging device, the capacity of the battery pack 1 is determined by the charging device by the identification resistor 5 connected between the identification terminal T2 and the negative charge / discharge terminal T3. When the battery pack 1 can be charged, the charging power is supplied via the charging / discharging terminals T1 and T3.
[0024]
In the battery pack 1, overcharge and the like are prevented by the control of the control integrated circuit 7 in a state where the field effect transistors 8 and 9 are set to the on state, and the battery cell 2 is supplied with the electric power thus supplied. Is charged.
[0025]
On the other hand, when connected to a device such as a mobile phone, in the battery pack 1, the field effect transistors 8 and 9 are set to the on state, and the power of the battery cell 2 is connected via the charge / discharge terminals T1 and T3. Supplied to the equipment. At this time, the field effect transistors 8 and 9 are controlled by the control integrated circuit 7, thereby preventing overdischarge and the like. At the device side connected at this time, the resistance value of the identification resistor 5 is detected via the identification terminal T2 as necessary, and the capacity, type, and the like of the battery pack 1 are identified based on the detection result.
[0026]
The battery pack 1 is charged by the charging device in this way until it is attached to a portable device or the like, and conversely, until the battery pack 1 consumes power in the portable device or the like and is attached to the charging device, for example, When carrying and carrying, the high voltage by the static electricity charged to the human body etc. is applied to the various electronic components which comprise the battery pack 1 via charging / discharging terminal T1, T3, identification terminal T2, etc. FIG.
[0027]
In the battery pack 1, when such a high voltage due to static electricity is applied to the identification terminal T <b> 2, the high voltage due to static electricity is discharged in the element 6 for preventing electrostatic breakdown connected to both ends of the identification resistor 5. As a result, the voltage applied to the identification resistor 5 becomes a very small voltage, and the degradation of the identification resistor 5 due to static electricity is prevented accordingly.
[0028]
That is, in the battery pack 1 (FIG. 1), the wiring pattern P3 that constitutes the ground line and the wiring pattern P1 that connects the identification terminal T2 and the identification resistor 5 sandwich the discharge gap by the interlayer insulating layer 17 therebetween. By being arranged so as to face each other, the wiring pattern P1 is formed so as to meander, and in this way, the parts facing each other with the discharge gap interposed therebetween are formed at a long distance. When a high voltage due to static electricity is applied, the discharge is caused at any part extending by this long distance, thereby lowering the voltage due to static electricity.
[0029]
In particular, since the application of a high voltage due to static electricity is considered to be a transient response in which the characteristics of the transmission line change remarkably, the wiring pattern P1 is meandered in this way to add an inductance component to the wiring pattern P1, and this wiring If the pattern P1 is extended for a long distance so as to face the wiring pattern P3, a high voltage due to static electricity is surely discharged at any part, and the voltage applied to the identification resistor 5 is reduced to a remarkably low voltage. This can prevent deterioration of the identification resistor 5.
[0030]
Further, in this embodiment, the wiring pattern P2 on the ground line side of the identification resistor 5 is also similar to the wiring pattern P1 on the identification terminal T2 side. Even if a high voltage is induced on the ground line side of the identification resistor 5 due to a high static electricity voltage, the high voltage identification resistor is formed so as to be opposed to each other. 5 can be prevented, and the deterioration of the identification resistor 5 can also be prevented by this.
[0031]
Accordingly, according to the experimental results, as shown in FIGS. 3 and 4, the change in the resistance value of the identification resistor 5 when no such element 6 for preventing electrostatic breakdown is arranged is identified by static electricity. It has been found that the deterioration of the resistance for use can be remarkably reduced. 3 and 4 show the rate of change of the resistance for identification when a pulsed high voltage is applied. FIG. 3 shows the high voltage by directly contacting the electrode of the test apparatus to the identification terminal T2. FIG. 4 shows a case where an electrode of the test apparatus is brought close to the identification terminal T2 and a high voltage is applied by discharge via air between the identification terminal T2 and the electrode. (This is the case of so-called air discharge).
[0032]
3A and 4A show the case where a chip resistance of 900 [Ω] is used as the identification resistor, and FIGS. 3B and 4B show that the identification resistance is 18 [kΩ]. This is the case of using a chip resistor of L2 as well as L4 The characteristic indicated by indicates the deterioration of the characteristic in the conventional wiring board. L1 as well as L3 The characteristic shown by (1) indicates the deterioration of the characteristic caused by the wiring board according to this embodiment. In addition, the number attached to the horizontal axis of each characteristic curve diagram is the peak voltage of the applied pulsed high voltage, and the unit is kV. In this experiment, the polarity of the pulsed high voltage was alternately switched in this way, and the voltage was gradually increased to observe the change in characteristics. In any case, according to this embodiment, it can be seen that the change in the resistance value is small. Thereby, it can be seen that the high voltage waveform applied to the identification resistor 5 is alleviated by the arrangement of the element 6 for preventing electrostatic breakdown.
[0033]
On the other hand, when a high voltage due to static electricity is applied to the charging / discharging terminal T1 or the like, the battery pack 1 has a similar electrostatic breakdown preventing countermeasure disposed in the control integrated circuit 7 and the field effect transistors 8 and 9. In the elements 15, 10, and 11, the high voltage due to the static electricity is discharged, so that the voltage applied to each element becomes a very small voltage, and the deterioration due to the static electricity of each element is prevented accordingly.
[0034]
At this time, these electrostatic breakdown preventing elements 15, 10, 11 are arranged on the corresponding element side, so that, for example, a field effect transistor is connected via the control IC 7 due to a high voltage applied to the terminal T 1. Even when a high voltage is applied to the gate lines 8 and 9, the high voltage is surely discharged by the elements 10 and 11 for preventing electrostatic breakdown so that no high voltage is applied to each element. This can also reliably prevent the deterioration of the characteristics of the field effect transistors 8 and 9 due to static electricity.
[0035]
In this way, when high voltage application is prevented by discharge in the discharge gap, overvoltage application is higher than when high voltage application is prevented by disposing an overvoltage prevention element such as a varistor, for example. It is possible to respond at a speed, which makes it possible to reliably protect the desired element.
[0036]
(1-3) Effects of the first embodiment
According to the above configuration, the wiring patterns are opposed to each other with the discharge gap formed by the interlayer insulating layer interposed therebetween, and the high voltage due to static electricity is discharged by this discharge gap, thereby allowing the device to be electrostatically discharged with a simple configuration. Deterioration can be prevented.
[0037]
Furthermore, by causing the parts to be opposed to meander to meander, it is possible to reliably discharge a high voltage due to static electricity at any part of the meandering as described above, and to further prevent deterioration of the element due to static electricity. be able to.
[0038]
(2) Second embodiment
FIG. 5 is a plan view (FIG. 5 (A)) and a side view (FIG. 5 (B)) showing an element for preventing electrostatic breakdown according to the second embodiment of the present invention. This element 21 for preventing electrostatic breakdown is arranged in an electronic component connected to an input / output terminal in a desired device, and prevents deterioration of characteristics of the electronic component due to static electricity.
[0039]
That is, the electrostatic breakdown preventing element 21 meanders with the wiring patterns P1 and P2 in pairs, so that the side edges of the wiring patterns P1 and P2, which are the opposing portions of the wiring patterns P1 and P2, are almost It is formed so as to extend with a discharge gap having a constant interval in between.
[0040]
In the element 21 for preventing electrostatic breakdown, electrodes are formed on both ends of the wiring patterns P1 and P2, one end side electrode is assigned to the signal input ends IN1 and IN2, and the other end side electrode is the signal output end OUT1. Assigned to OUT2. As a result, the element 21 for preventing electrostatic breakdown is arranged in various electronic devices, for example, connecting the signal input terminals IN1 and IN2 to the external terminal side of the device and the signal output terminals OUT1 and OUT2 to various electronic components. The high voltage due to static electricity applied to the external terminal of the device is discharged through the discharge gap so that the high voltage due to static electricity is not applied to the electronic component.
[0041]
Furthermore, the element 21 for preventing electrostatic breakdown is formed so that the wiring patterns P1 and P2 alternately move up and down the front surface and the back surface of the interlayer insulating layer. As a result, the electrostatic breakdown preventing element 21 increases inductance components L1 and L2 due to the wiring patterns P1 and P2 above and below the wiring patterns P1 and P2, as shown in FIG. It is designed to smooth the rise of the remaining voltage after electricity. In FIG. 6, reference numerals C1 and C2 are capacitances between the wiring patterns P1 and P2, and R1 and R2 are resistances of the wiring patterns P1 and P2.
[0042]
According to the configuration shown in FIG. 5, the first and second wiring patterns P1 and P2 are formed so as to be opposed to each other and extend so as to extend with a discharge gap having a substantially constant interval therebetween. However, the use of this separate part can prevent the deterioration of the element due to static electricity with a simple configuration.
[0043]
At this time, the front and back surfaces of the interlayer insulating layer are alternately moved up and down to create these wiring patterns P1 and P2, thereby further preventing deterioration of the element due to static electricity.
[0044]
(3) Third embodiment
FIG. 7 is a plan view showing an element for preventing electrostatic breakdown according to the third embodiment of the present invention. This element 31 for preventing electrostatic breakdown is used in place of the element 21 for preventing electrostatic breakdown according to the second embodiment, and the wiring pattern P1 is formed in a rectangular shape at a substantially central portion of the wiring board. In contrast, the wiring pattern P2 is formed along the three sides of the first wiring pattern P1. As a result, the electrostatic breakdown preventing element 31 has the side edges of the wiring patterns P1 and P2, which are the opposing portions of the wiring patterns P1 and P2, sandwiching a linear discharge gap with a substantially constant interval therebetween. It is formed to extend.
[0045]
In the element 31 for preventing electrostatic breakdown, a grounding electrode T5 is formed on a part of the rectangular wiring pattern P1, whereas a signal input terminal and a signal output terminal are formed on both ends of the wiring pattern P2. The
[0046]
Further, in the element 31 for preventing electrostatic breakdown, the rectangular wiring pattern P1 on the ground side is formed with a large area, whereas the wiring pattern P2 is formed with a narrow wiring pattern, and thereby the signal With respect to the pulsed high voltage input through the input terminal, the current due to the high voltage is likely to flow toward the wiring pattern P1 side.
[0047]
As shown in FIG. 7, even if the wiring patterns P1 and P2 are formed so as to extend with a linear discharge gap interposed therebetween, deterioration of the element due to static electricity can be prevented with a simple configuration.
[0048]
In addition, since the rectangular wiring pattern P1 on the ground side is formed with a large area, it is possible to more reliably prevent deterioration of the element due to static electricity.
[0049]
(4) Fourth embodiment
FIG. 8 is a plan view showing an element for preventing electrostatic breakdown according to the fourth embodiment of the present invention. In the element 41 for preventing electrostatic breakdown, the wiring patterns P1A and P1B are formed in a rectangular shape along both side surfaces of the wiring board, whereas the wiring pattern P2 is connected between the wiring patterns P1A and P1B. It is formed along the side surfaces of the patterns P1A and P1B. As a result, the element 41 for preventing electrostatic breakdown has a linear discharge gap between the side edges of the wiring patterns P1A and P2 and the side edges of the wiring patterns P1B and P2 between them, respectively. It is formed so as to extend.
[0050]
In the element 41 for preventing electrostatic breakdown, grounding electrodes T6 and T7 are formed on a part of the rectangular wiring patterns P1A and P1B, whereas a signal input terminal and a signal output are formed at both ends of the wiring pattern P2. An edge is created. Also in this embodiment, the wiring patterns P1A and P1B on the ground side are formed with a large area, thereby facilitating current flow with respect to a pulsed high voltage.
[0051]
As shown in FIG. 8, even if the wiring patterns P1A, P1B, and P2 are created with a linear discharge gap in between, deterioration of the element due to static electricity can be prevented with a simple configuration.
[0052]
(5) Fifth embodiment
FIG. 9 is a plan view showing an element for preventing electrostatic breakdown according to the fifth embodiment of the present invention. The element 51 for preventing electrostatic breakdown is formed so that the opposing portions of the wiring patterns P1 and P2 described above with reference to FIG. 7 meander, and the shape of the wiring pattern on the signal line side is different. The third embodiment is configured in the same manner as the electrostatic breakdown preventing element 31 described above.
[0053]
The element 51 for preventing electrostatic breakdown is formed so that the opposing portions of the wiring patterns P1 and P2 meander. Thereby, the element 51 for preventing electrostatic breakdown is configured to increase the number of parts subjected to discharge compared to the element 31 for preventing electrostatic breakdown described above with respect to the third embodiment. The device is surely prevented from being deteriorated by static electricity.
[0054]
Further, the electrostatic breakdown preventing element 51 is formed so that the wiring pattern itself meanders so as to correspond to the meandering of the opposing part of the wiring pattern P2 on the signal transmission side. Thereby, the element 51 for preventing electrostatic breakdown increases the time required for transmission when a pulsed high-voltage waveform is applied, thereby further reliably preventing deterioration of the element due to static electricity. It is made to be able to.
[0055]
In addition, the wiring pattern P1 on the ground side is formed with a large area, whereas the wiring pattern P2 on the signal transmission side is formed narrower because the wiring pattern itself meanders, and this further increases the pulse shape. With respect to a high voltage, current is made to easily flow to the ground side.
[0056]
According to the configuration shown in FIG. 9, by causing the opposing portions of the wiring patterns P <b> 1 and P <b> 2 to meander, the deterioration of the element due to static electricity can be prevented more reliably as compared with the third embodiment.
[0057]
(6) Sixth embodiment
FIG. 10 (A) is a plan view showing an element for preventing electrostatic breakdown according to the sixth embodiment of the present invention, and FIG. 10 (B) shows this FIG. 10 (A) along the line AA. FIG. The electrostatic breakdown preventing element 61 is formed except that the wiring patterns P1A and P2 described above with reference to FIG. 8 are opposed to each other, the wiring patterns P1B and P2 are opposed to each other, and the wiring pattern P2 is meandered. Thus, the fourth embodiment is configured in the same manner as the element 41 for preventing electrostatic breakdown described above.
[0058]
The electrostatic breakdown preventing element 61 is configured such that the number of parts subjected to discharge increases as compared with the electrostatic breakdown preventing element 41 described in the fourth embodiment, and is used for signal transmission. The distance between the wiring patterns P2 is increased, the signal transmission wiring pattern P2 is narrowed, and the ground-side wiring patterns P1A and P1B are formed with a large area. Thereby, the element 61 for preventing electrostatic breakdown can further prevent the element from being deteriorated due to static electricity.
[0059]
According to the configuration shown in FIG. 10, it is possible to further prevent the deterioration of the element due to static electricity more reliably than in the fourth embodiment.
[0060]
(7) Seventh embodiment
FIG. 11 is a plan view showing an element for preventing electrostatic breakdown according to the seventh embodiment of the present invention. In the element 71 for preventing electrostatic breakdown, the wiring pattern P1 described above with reference to FIG. 9 is assigned to the wiring pattern for signal input. For this reason, the electrostatic breakdown preventing element 71 is provided with electrodes T6A and T7A for signal input at one end of the wiring patterns P1 and P2, respectively, and electrodes T6B and T7B for signal output at the other end, respectively. Further, due to the meandering of these wiring patterns P1 and P2, the opposing parts of the wiring patterns P1 and P2 meander.
[0061]
Thus, the element 71 for preventing electrostatic breakdown is arranged in the device as a four-terminal circuit network so as to prevent deterioration of characteristics due to static electricity of the electronic component.
[0062]
As shown in FIG. 11, even when the input / output terminals are arranged, the same effects as those of the above-described embodiment can be obtained.
[0063]
(8) Eighth embodiment
FIG. 12 is a plan view showing an electronic component according to the eighth embodiment of the present invention. This electronic component 82 is configured by disposing an element body 84 of a two-terminal circuit element on a predetermined wiring board 83. Here, as the element body 84, for example, a diode, a capacitor, or the like can be applied in addition to the identification resistor as described above.
[0064]
The wiring board 83 is provided with external input terminals T1 and T2, and the element body 84 is connected to the external input terminals T1 and T2 via the wiring patterns P1 and P2. Here, the wiring patterns P <b> 1 and P <b> 2 are formed so as to bend at a substantially right angle and meander on the wiring board 83. Furthermore, the wiring patterns P1 and P2 are formed such that the meandering portions meander with a discharge gap of a constant interval in between.
[0065]
As a result, the electronic component 82 does not apply a high voltage due to static electricity applied to the external input terminals T1 and T2 to the element body 84 due to discharge between the wiring patterns P1 and P2, and prevents deterioration of the element body 84. Has been made. Further, the length of the opposing portions is increased by meandering with the discharge gap interposed therebetween, so that the high voltage due to static electricity is surely discharged and the deterioration of the element body 84 is prevented.
[0066]
In addition, as the meandering of the wiring patterns P1 and P2, instead of the arrangement bent at a right angle, when meandering by bending with a corner having an arc shape, when meandering the whole as a zigzag shape, Various pattern shapes can be widely applied such as meandering by arrangement.
[0067]
From the viewpoint of ensuring sufficient reliability and easily discharging with a high voltage due to static electricity to protect various element bodies 84, in the case of a wiring substrate with fine pitch, the discharge gap is 0.01 to 0.5. About [mm] is preferable, and in the case of a normal wiring board, the discharge gap is preferably about 0.1 to 0.2 [mm]. From the same viewpoint, the wiring patterns P1 and P2 preferably have a pattern width of about 0.2 to 0.3 [mm], and the pattern length is preferably 10 [mm] or more. The wiring patterns P1 and P2 can be made of copper, aluminum, gold, or the like that can reduce the resistance value, but by applying metal oxide, nichrome, semiconductor, or the like having a large specific resistance value. In addition, the resistance value of the wiring patterns P1 and P2 can be set to a high value of about several hundreds [kΩ] to facilitate the discharge between the wiring patterns P1 and P2, thereby further reliably protecting the element body 84. can do.
[0068]
As shown in FIG. 12, even if the protection element is formed integrally with the circuit element, the same effect as that of the above-described embodiment can be obtained.
[0069]
(9) Ninth embodiment
FIG. 13 is a plan view showing an electronic component according to the ninth embodiment of the present invention in comparison with FIG. In the electronic component 92, the wiring pattern 93 is disposed on the wiring board 93 so as to surround the wiring patterns P1 and P2 connected to the external input terminals T1 and T2.
[0070]
Here, the wiring pattern P3 is formed so that the portion on the inner peripheral side protrudes at a predetermined position, and is formed so as to face the wiring patterns P1 and P2 with the discharge gap interposed therebetween. The wiring pattern P3 can be grounded via the external terminal T3.
[0071]
As a result, in the electronic component 92, a high voltage due to static electricity is not applied to the element body 4 due to a discharge between the wiring patterns P1 and P3 and a discharge between the wiring patterns P2 and P3. Has been made.
[0072]
Further, these wiring patterns P1 and P2 are created under the conditions described above for the eighth embodiment, and the discharge gaps in the wiring patterns P1 to P3 are also created under the conditions described above for the eighth embodiment.
[0073]
On the other hand, the wiring pattern P3 is formed with a large area and a wide pattern using a conductive material such as copper, aluminum, and gold having a low specific resistance value. Thereby, in the electronic component 92, the resistance value of the wiring pattern P3 is set to about 1 [mΩ], and the discharge between the wiring patterns P1 and P3 and the discharging between the wiring patterns P2 and P3 are performed. The element main body 84 is protected more reliably.
[0074]
(10) Tenth embodiment
FIG. 14 is a plan view showing an electrostatic breakdown protection element according to the tenth embodiment of the present invention in comparison with FIG. In this protection element 101, the wiring board 103 is formed so that the opposing portions of the wiring patterns P1 and P2 meander with a discharge gap at a constant interval in between due to the meandering of the wiring patterns P1 and P2 bent substantially at a right angle. Is done. Further, the wiring patterns P1 and P2 are created under the conditions described above for the eighth embodiment.
[0075]
As shown in FIG. 14, even if the wiring patterns P1 and P2 are meandered so as to be bent substantially at a right angle, the same effect as the above-described embodiment can be obtained.
[0076]
(11) Eleventh embodiment
FIG. 15 is a plan view showing an electrostatic breakdown protection element according to the eleventh embodiment of the present invention in comparison with FIG. In the electrostatic breakdown protection element 111, the wiring board 113 has the wiring pattern P3 disposed in the center, and the wiring pattern P3 is connected to the earth line via the external terminal IN3. Further, wiring patterns P1 and P2 connecting the external input terminals IN1 and IN2 and the external output terminals OUT1 and OUT2 are arranged on both sides of the wiring pattern P3.
[0077]
The wiring patterns P1 and P2 are formed so as to bend at substantially a right angle and meander, and the pattern width of the wiring pattern P3 changes so as to correspond to the meandering of the wiring patterns P1 and P2, thereby the wiring patterns P1 and P3. The opposing portions of the wiring patterns P2 and P3 are formed so as to face each other with the discharge gap therebetween, and the length of the facing portions is longer than the size of the wiring board 113. Formed to be.
[0078]
The wiring patterns P1 to P3 are created under the same conditions as in the ninth embodiment described above.
[0079]
As shown in FIG. 15, even if the wiring pattern P3 connected to the ground line is arranged at the center, the same effect as the above-described embodiment can be obtained.
[0080]
(12) Twelfth embodiment
FIG. 16 is an exploded perspective view showing a wiring board applied to the battery pack according to the twelfth embodiment of the present invention in comparison with FIG. In the configuration shown in FIG. 16, the same configuration as that of the wiring board of FIG. 1 is denoted by the corresponding reference numeral, and a duplicate description is omitted.
[0081]
In this wiring board 124, the second ground pattern P4 is disposed above the wiring patterns P1 and P2 via the second interlayer insulating layer 117, and the identification resistor 5 and the terminals t2 of the wiring patterns P1 and P2 are arranged on the uppermost layer. And t3.
[0082]
As shown in FIG. 16, even if the ground wiring patterns P1 and P4 are arranged on the upper and lower sides of the wiring patterns P1 and P2, the same effects as in the above-described embodiment can be obtained.
[0083]
(13) Thirteenth embodiment
FIG. 17 is an exploded perspective view showing a wiring board applied to the battery pack according to the thirteenth embodiment of the present invention in comparison with FIG. In the configuration shown in FIG. No The same configurations as those of the wiring board of FIG. 16 are denoted by the corresponding reference numerals, and redundant description is omitted.
[0084]
The wiring board 134 further causes the wiring patterns P1 and P2 to meander with a discharge gap having a substantially constant interval therebetween, whereby the wiring pattern P1 and the ground pattern P3 or P4, and the wiring pattern P2 and the ground. It is configured to easily discharge not only between the pattern P3 or P4 but also between the wiring patterns P1 and P2.
[0085]
According to the configuration shown in FIG. 17, the wiring patterns P1 and P2 meander with a discharge gap having a substantially constant interval therebetween, thereby further preventing the deterioration of the element due to static electricity.
[0086]
(14) Fourteenth embodiment
FIG. 18 is an exploded perspective view showing a wiring board applied to the battery pack according to the fourteenth embodiment of the present invention in comparison with FIG. In the configuration shown in FIG. 18, the same configuration as that of the wiring board of FIG. 16 is denoted by the corresponding reference numeral, and a duplicate description is omitted.
[0087]
In this wiring pattern 144, instead of the opposing arrangement of the wiring patterns P1 and P2 on the same surface, the wiring patterns P1 and P2 are opposed to each other with the interlayer insulating layer 117 interposed therebetween.
[0088]
As shown in FIG. 18, even if the wiring patterns P1 and P2 are opposed to each other with the interlayer insulating layer 117 interposed therebetween, the same effect as that of the thirteenth embodiment can be obtained.
[0089]
(15) Other embodiments
In the above-described second to seventh embodiments, etc., the case where the element for preventing electrostatic breakdown is configured by separate parts has been described. However, the present invention is not limited to this, and the first embodiment and Similarly, it may be formed on the wiring board.
[0090]
In the first embodiment described above, the case where an element for preventing electrostatic breakdown is built in the wiring board has been described, but the present invention is not limited to this, and the second to seventh embodiments and the like. Similarly, you may comprise as another component.
[0091]
In the second to seventh embodiments described above, the case where the wiring pattern is formed on the same surface of the wiring board has been described. However, the present invention is not limited to this, as in the first embodiment. Alternatively, it may be arranged in another layer with an interlayer insulating layer interposed therebetween.
[0092]
In the second to seventh embodiments, etc., the case where the element for preventing electrostatic breakdown is configured exclusively is described. However, the present invention is not limited to this, for example, input of an element such as a field effect transistor. You may make it comprise integrally in the side.
[0093]
In the above-described second to seventh embodiments, etc., the case where no wiring pattern is processed has been described. However, the present invention is not limited to this, and for example, between the wiring patterns using an inert gas such as nitrogen or argon. You may make it seal the site | part which opposes. In this way, it is possible to prevent deterioration of the part to be discharged.
[0094]
Further, in the above-described embodiment, when a wiring pattern is simply arranged when configured as an electrostatic breakdown preventing element, when a target element body is arranged with a wiring pattern when configured as an electronic component. As described above, the present invention is not limited to this, and overvoltage protection elements such as capacitors, Zener diodes, and thyristors may be disposed between the wiring patterns. In this way, various elements can be protected more reliably.
[0095]
In the above-described embodiment, the case where the present invention is applied to the battery pack has been described. However, the present invention is not limited to this, and can be widely applied to various electronic devices.
[0096]
That is, in an electronic device having a high-inductance element such as a relay or a motor, a high surge voltage may be generated by driving the inductance element, and such a surge voltage may be applied to various electronic components. is there. Moreover, in an electronic device or the like used for data communication, a surge voltage may be generated by electromagnetic induction, lightning strike, or the like, and a high voltage may be applied to an internal element.
[0097]
When the protection element according to the above-described embodiment is applied to such an electronic device, it is possible to prevent deterioration of element characteristics due to these surge voltages.
[0098]
【The invention's effect】
As described above, according to the present invention, it is possible to prevent deterioration of the element due to static electricity with a simple configuration by forming the discharge gap with a substantially constant interval at the opposing portions between the wiring patterns.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view showing an element for preventing electrostatic breakdown according to a first embodiment of the present invention.
2 is a connection diagram showing a battery pack to which the element for preventing electrostatic breakdown of FIG. 1 is applied. FIG.
FIG. 3 is a characteristic curve diagram for explaining the operation of the element for preventing electrostatic breakdown of FIG. 1;
FIG. 4 is a characteristic curve diagram for explaining the operation of the element for preventing electrostatic breakdown shown by comparison with FIG. 3;
FIGS. 5A and 5B are a plan view and a side view showing an element for preventing electrostatic breakdown according to a second embodiment of the present invention. FIGS.
6 is a connection diagram illustrating an equalization circuit of the element for preventing electrostatic breakdown in FIG. 5;
FIG. 7 is a plan view showing an element for preventing electrostatic breakdown according to a third embodiment of the present invention.
FIG. 8 is a plan view showing an element for preventing electrostatic breakdown according to a fourth embodiment of the present invention.
FIG. 9 is a plan view showing an element for preventing electrostatic breakdown according to a fifth embodiment of the present invention.
FIGS. 10A and 10B are a plan view and a cross-sectional view showing an element for preventing electrostatic breakdown according to a sixth embodiment of the present invention. FIGS.
FIG. 11 is a plan view showing an element for preventing electrostatic breakdown according to a seventh embodiment of the present invention.
FIG. 12 is a plan view showing an electronic component according to an eighth embodiment of the present invention.
FIG. 13 is a plan view showing an electronic component according to a ninth embodiment of the present invention.
FIG. 14 is a plan view showing an element for preventing electrostatic breakdown according to a tenth embodiment of the present invention.
FIG. 15 is a plan view showing an element for preventing electrostatic breakdown according to an eleventh embodiment of the present invention.
FIG. 16 is an exploded perspective view showing a wiring board according to a twelfth embodiment of the present invention.
FIG. 17 is an exploded perspective view showing a wiring board according to a thirteenth embodiment of the present invention.
FIG. 18 is an exploded perspective view showing a wiring board according to a fourteenth embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Battery pack, 2 ... Battery cell, 3, 83, 93, 103, 113, 123, 124, 144 ... Wiring board, 5 ... Identification resistance, 6, 10, 11, 15, 21, 31 , 41, 51, 61, 71, 101, 111... Element for preventing electrostatic breakdown, 7... Integrated circuit for control, 8, 9... Field effect transistor, 82, 92. P1A, P1B, P2, P3, P4 ... Wiring pattern

Claims (8)

Battery pack identification resistor,
In an electronic component having at least first and second input terminals for connection to the outside,
A first wiring pattern having one end connected to the first input terminal and the other end connected to the battery pack identifying resistor;
A second wiring pattern having one end connected to the second input terminal and the other end connected to the side of the battery pack identification resistor not connected to the first wiring pattern;
A third wiring pattern connected to the ground line ;
The opposing part of the first and third wiring patterns and the opposing part of the second and third wiring patterns are formed so as to extend with a discharge gap having a substantially constant interval therebetween. Electronic parts characterized by   2. The electronic component according to claim 1, wherein the facing portions are formed with a predetermined interlayer insulating layer interposed therebetween.   The electronic component according to claim 1, wherein the third wiring pattern is formed with a larger area than the first and second wiring patterns.   2. The electronic component according to claim 1, wherein the third wiring pattern is formed of a conductive member having a specific resistance smaller than that of the first and second wiring patterns. In an electronic device created by mounting electronic components on a predetermined wiring board,
The wiring board is
At least first and second input terminals for connection to the outside;
A first wiring pattern having one end connected to the first input terminal and the other end connected to a battery pack identifying resistor;
A second wiring pattern having one end connected to the second input terminal and the other end connected to the side of the battery pack identification resistor not connected to the first wiring pattern;
A third wiring pattern connected to the ground line ;
The opposing part of the first and third wiring patterns and the opposing part of the second and third wiring patterns are formed so as to extend with a discharge gap having a substantially constant interval therebetween. An electronic device characterized by the above.   The electronic device according to claim 5, wherein the facing portions are formed with a predetermined interlayer insulating layer interposed therebetween.   The electronic device according to claim 5, wherein the third wiring pattern is formed with a larger area than the first and second wiring patterns.   6. The electronic device according to claim 5, wherein the third wiring pattern is formed of a conductive member having a specific resistance smaller than that of the first and second wiring patterns.

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