KR102040466B1

KR102040466B1 - Laminate

Info

Publication number: KR102040466B1
Application number: KR1020160015263A
Authority: KR
Inventors: 권윤경; 김현철; 박현규
Original assignee: 주식회사 엘지화학
Priority date: 2016-02-05
Filing date: 2016-02-05
Publication date: 2019-11-05
Also published as: KR20170093622A

Abstract

The present application is directed to laminates and touch panels. In the present application, a laminate including an adhesive layer exhibiting excellent peeling characteristics with respect to a release film may be provided, and thus the laminate may exhibit excellent process characteristics.

Description

Laminates {LAMINATE}

This application relates to a laminate.

The touch panel or touch screen is applied to various information processing or display devices. The electroconductive laminated body is used for manufacture of a touchscreen, as disclosed in patent document 1.

Among the conductive laminates, the so-called pressure-sensitive adhesive laminate has a structure in which an adhesive layer is formed on one surface of a base film having a transparent conductive layer represented by an indium tin oxide (ITO) layer on one surface. The conductive laminate has a structure in which a protective film is attached on the conductive layer and a release film is attached to the pressure-sensitive adhesive layer in the step of applying the conductive laminate. During the process, any one of the protective film and the release film is first peeled off, and the other film is subsequently peeled off in the lamination of the structure.

In such a structure, a balance between the peeling force on the conductive layer of the protective film and the peeling force on the pressure-sensitive adhesive layer of the release film is required, for example, when the release film is first peeled off during the process, When the peeling force with respect to is low, a problem, such as a protective film floats in the peeling process of a release film, arises.

Patent Document 1: Republic of Korea Patent Publication No. 2002-0036837

The present application aims to provide a laminate.

The present application is for a laminate. The laminate may be a so-called adhesive conductive laminate, and may include a base film, a conductive layer formed on one surface of the base film, and an adhesive layer formed on the other side of the base film.

The adhesive layer contained in the said laminated body is adjusted so that a low high speed peeling force and an appropriate low speed peeling force can be shown. Thus, for example, the protective film is attached to the conductive layer even when the release film is first peeled off during the process in the structure in which the protective film is attached to the conductive layer of the laminate, and the release film is attached to the pressure-sensitive adhesive layer. This excitement does not occur.

The kind of base film used for a laminated body is not specifically limited, A well-known base film can be applied. For example, as the base film, various plastic films can be used. Plastic films include polyester films, acetate resin films, polyethersulfone films, polycarbonate films, polyamide films, polyimide films, polyolefin films, acrylic films, polyvinyl chloride films, polyvinylidene chloride films, polystyrene films, poly Vinyl alcohol film, polyarylate film or polyphenylene sulfide film and the like can be used. The thickness of the base film is also not particularly limited, and may be adjusted to an appropriate thickness in consideration of the use of the laminate. Usually, the base film may have a thickness of about 10 μm to 110 μm, 10 μm to 80 μm, 10 μm to 60 μm, or 10 μm to 30 μm.

One surface or both surfaces of the base film may be subjected to a known surface treatment such as sputtering, corona discharge, flame, ultraviolet irradiation, electron beam irradiation, chemical conversion treatment or primer treatment.

The kind of the conductive layer formed on one surface of the base film in the present application is also not particularly limited. For example, the conductive layer may include at least one metal selected from indium, tin, zinc, gallium, antimony, titanium, silicon, zirconium, magnesium, aluminum, gold, silver, copper, palladium, and tungsten or an oxide thereof. Can be. Indium tin oxide, commonly referred to as ITO, can be applied.

The thickness of the conductive layer is usually 10 nm or more, and may be formed in the range of about 15 to 40 nm or 20 to 30 nm in consideration of its surface resistance and transparency. Such a conductive layer may be crystallized or an amorphous layer, and in some cases, may be patterned.

The adhesive layer is formed in the surface in which the electroconductive layer of a base film is not formed.

The pressure-sensitive adhesive layer may include an adhesive polymer. As the adhesive polymer, an acrylic polymer, a urethane polymer, an olefin polymer or a silicone polymer can be used without particular limitation.

An acrylic polymer can be used in consideration of convenience of use. As used herein, the term acrylic polymer may mean a polymer including an acrylic monomer as a polymer unit. As used herein, the term polymerization unit may refer to a form in which a monomer forms a part of the adhesive polymer through a polymerization reaction. In the above, the acrylic monomer means acrylic acid, methacrylic acid or derivatives thereof. Acrylic polymer may be included as a main component in the pressure-sensitive adhesive layer. In the present application, the term main component includes at least 55%, at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, or at least 95% of the components by weight. It means the case. The upper limit of the weight ratio of the main component in the above is not particularly limited, and may be, for example, less than 100%.

The polymer may include, for example, polymerized units of alkyl (meth) acrylates, rigid comonomers and crosslinkable monomers.

In the above, the alkyl (meth) acrylate is the main component of the polymer, so that the weight ratio in the polymer of the polymerized unit is at least 55%, at least 60%, at least 65%, at least 70%, at least 75%, at least 80%. , At least 85%, at least 90% or at least 95%.

As alkyl (meth) acrylate, the thing of the glass transition temperature of a homopolymer in the range of -80 degreeC--30 degreeC can be used. In the present application, the term glass transition temperature of a homopolymer may mean a glass transition temperature of a homopolymer prepared using the monomer. As alkyl (meth) acrylate, any kind can be used as long as the glass transition temperature of a homopolymer is in the said range. For example, an alkyl (meth) acrylate having an alkyl group having 1 to 20 carbon atoms, 1 to 16 carbon atoms, 1 to 12 carbon atoms, 1 to 8 carbon atoms, or 1 to 4 carbon atoms can be used. In the above, the alkyl group may be linear, branched or cyclic. Such monomers include n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, t-butyl (meth) acrylate, sec-butyl (meth) acrylate, pentyl ( Meta) acrylate, 2-ethylhexyl (meth) acrylate, 2-ethylbutyl (meth) acrylate, n-octyl (meth) acrylate, isooctyl (meth) acrylate, isononyl (meth) acrylate or Lauryl (meth) acrylate etc. can be illustrated, It can select and use one or more types of the above.

As used herein, the term (meth) acryl means acryl or methacryl.

In the present application, the term hard monomer refers to a monomer copolymerizable with the alkyl (meth) acrylate, and a monomer having a glass transition temperature of a homopolymer of the monomer within a range of 85 ° C to 130 ° C. . The homopolymer glass transition temperature of the hard comonomer may be 125 ° C. or less, 120 ° C. or less, 115 ° C. or less or about 110 ° C. or less in another example. Such comonomers include isobornyl (meth) acrylate, vinyl pyrrolidone, hydroxyalkylacrylamide (wherein alkyl has 1 to 4 carbon atoms), tertiarylbutyl (meth) acrylate), dihydrodicyclopentadienyl acrylate (DCPA, dihydrodicyclopentadienyl acrylate), N-vinylformamide (VFA), cyclohexyl (meth) acrylate (CHMA, cyclohexyl methacrylate), acrylamide, benzyl (Meth) acrylate, tert-butyl acrylate, iso-butyl methacrylate, n-butyl methacrylate, sec-butyl methacrylate, cyclopropyl acrylate, cyclobutyl acrylate, N, N-dimethyl (meth ) Acrylamide, N, N-diphenyl methacrylamide, N- (n-dodecyl) methacrylamide, 1-hexadecyl methacrylate, 2-methoxyethyl methacrylate, methyl methacrylate, N- Naphthyl acrylic , 2-phenoxyethyl methacrylate, phenyl (meth) acrylate, 2-phenylethyl (meth) acrylate, n-propyl methacrylate, styrene, methyl acrylate, dicyclopentanyl methacrylate , N-vinylcaprolactam or N-hydroxyethyl acrylamide may be exemplified, but is not limited thereto.

The hard comonomer may be included in the polymer in a ratio of 25 to 120 parts by weight based on 100 parts by weight of the alkyl (meth) acrylate. The ratio may be at least 30 parts by weight, at least 35 parts by weight, at least 40 parts by weight, at least 45 parts by weight, at least 50 parts by weight, at least 55 parts by weight, at least 60 parts by weight or at least 65 parts by weight. In another example, the ratio may be 115 parts by weight or less, 110 parts by weight or less, 100 parts by weight or less, 90 parts by weight or less, 80 parts by weight or less, or 75 parts by weight or less. Under such a ratio, the pressure-sensitive adhesive layer may exhibit appropriate peel force characteristics.

In order to ensure more appropriate peel force characteristics, at least two kinds of mixing may be used as the hard comonomer. For example, the hard monomer may include the isobornyl (meth) acrylate as the first monomer, and may further include the vinyl pyrrolidone or hydroxyalkylacrylamide as the second monomer. When the monomer is used, the ratio (C / D) of the weight (C) of the first monomer and the weight (D) of the second monomer may be in the range of 1 to 5. The ratio (C / D) may be about 1.5 or more, about 2 or more, about 3.5 or more, about 4 or more, about 4.5 or more, about 5 or more, or about 5.5 or more, in another example, about 9 or less, About 8 or less or about 7 or less.

The crosslinkable monomer contained in the adhesive polymer may mean a monomer having a crosslinkable functional group and having a functional group copolymerizable with the alkyl (meth) acrylate. As said crosslinkable functional group, a carboxyl group, a hydroxyl group, glycidyl group, an isocyanate group, or a nitrogen containing functional group etc. can be illustrated. In the field of making adhesive polymers, various crosslinkable functional groups and comonomers comprising the functional groups which can be used are known.

For example, as said crosslinkable monomer, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl ( Hydroxyalkyl (meth) acrylates such as meth) acrylate or 8-hydroxyoctyl (meth) acrylate, or 2-hydroxyethylene glycol (meth) acrylate or 2-hydroxypropylene glycol (meth) acrylate Comonomers having hydroxy groups such as hydroxyalkylene glycol (meth) acrylates such as these; (Meth) acrylic acid, 2- (meth) acryloyloxy acetic acid, 3- (meth) acryloyloxy propyl acid, 4- (meth) acryloyloxy butyl acid, acrylic acid duplex, itaconic acid, maleic acid or Comonomer etc. which have carboxyl groups, such as maleic anhydride, can be illustrated.

The acrylic polymer may include, for example, 0.1 to 40 parts by weight of the crosslinkable monomer with respect to 100 parts by weight of the alkyl (meth) acrylate. The ratio is, in another example, at least 1 part by weight, at least 3 parts by weight, at least 5 parts by weight, at least 6 parts by weight, at least about 8 parts by weight, at least 10 parts by weight, at least about 15 parts by weight, at least about 20 parts by weight or About 25 parts by weight or more. The ratio may also be up to 38 parts by weight or up to 36 parts by weight in another example. Under such a ratio, proper peel force characteristics can be secured to the pressure-sensitive adhesive layer, and adhesiveness and cohesive force can be properly maintained.

The adhesive polymer may, if necessary, include polymerized units of known monomers in addition to the above-mentioned monomers.

The molecular weight of the pressure-sensitive adhesive polymer, for example, the weight average molecular weight is not particularly limited, and may be, for example, in the range of 500,000 to 2.5 million.

Such adhesive polymers may be prepared by a general polymerization method, for example, solution polymerization, photo polymerization, bulk polymerization, suspension polymerization or emulsion polymerization, or the like. It can manufacture.

The pressure-sensitive adhesive layer may further include a crosslinking agent. The crosslinking agent may crosslink the adhesive polymer in the pressure-sensitive adhesive layer. As used herein, the term crosslinking agent may refer to a compound having two or more functional groups capable of reacting with the crosslinkable functional groups of the adhesive polymer. Such a crosslinking agent can adjust the cohesion force of an adhesive and can adjust an adhesive characteristic.

The kind of crosslinking agent is not particularly limited, and a known crosslinking agent may be used. As such a crosslinking agent, an isocyanate compound, an epoxy compound, an aziridine compound, a metal chelate compound, etc. can be illustrated, In consideration of the crosslinkable functional group of a polymer, 1 type, or 2 or more types of crosslinking agents can be selected suitably. Examples of the isocyanate compound include tolylene diisocyanate, xylene diisocyanate, diphenylmethane diisocyanate, hexamethylene diisocyanate, isoborone diisocyanate, tetramethylxylene diisocyanate or naphthalene diisocyanate, and the like. The addition reactant of an isocyanate compound and a polyol can be used. The polyol may be triol such as trimethylolpropane, alkylene glycol, dialkylene glycol, benzenediol (ex. Catechol, resorcinol or hydroquinone), benzenetriol ( ex. 1,2,3-benzenetriol), dialcoalamine, trialcoholamine, arabitol, mannitol, isomalt, glycerol, xylitol, sorbitol ( sorbitol, maltitol, erythritol, ribitol, ribitol, dulcitol, lactitol, threitol, iditol or polyglyitol ( polyglycitol) and the like can be used. Moreover, as an epoxy compound, ethylene glycol diglycidyl ether, triglycidyl ether, trimethylol propane triglycidyl ether, N, N, N ', N'- tetraglycidyl ethylenediamine, or glycerin diglycidyl ether One kind or two or more kinds thereof may be used, and as the aziridine compound, N, N'-toluene-2,4-bis (1-aziridinecarboxamide), N, N'-diphenylmethane-4,4 '-Bis (1-aziridinecarboxamide), triethylenemelamine, bisisoprotaloyl-1- (2-methylaziridine) or tri-1-aziridinylphosphine oxide or the like Can be used. As the metal chelate compound, a compound in which a polyvalent metal exists in a state in which it is coordinated with acetyl acetone, ethyl acetoacetate, or the like can be used. As the type of the polyvalent metal, aluminum, iron, zinc, tin, titanium, antimony , Magnesium or vanadium.

In the pressure-sensitive adhesive layer, the crosslinking agent is 0.01 to 20 parts by weight, 0.01 to 15 parts by weight, 0.01 to 10 parts by weight, 0.01 to 5 parts by weight, 0.01 to 3 parts by weight, 0.01 to 1 parts by weight, 0.01 to about 100 parts by weight of the adhesive polymer. 0.5 parts by weight, 0.05 to 0.5 parts by weight or 0.1 to 0.5 parts by weight may be included.

The pressure-sensitive adhesive layer may further include any component necessary for the above components. As such a component, a silane coupling agent; Tackifiers; Epoxy resins; Ultraviolet stabilizers; Antioxidants; Colorant; Adjuvant; Fillers; Antifoam; It may further include one or two or more additives such as surfactants or plasticizers.

The thickness of an adhesive layer can be set to an appropriate range in consideration of target physical property, for example, adhesiveness. For example, the pressure-sensitive adhesive layer may have a thickness within the range of 5 μm to 50 μm.

The pressure-sensitive adhesive layer having the above composition exhibits appropriate cohesion force and adhesiveness, and can exhibit particularly excellent peel force balance described later.

The laminate may further include a release film attached to the pressure-sensitive adhesive layer. As a release film, a well-known release film can be used without a restriction | limiting. In general, the release film may have a structure in which a release layer, an oligomer migration prevention layer, and a base sheet are sequentially formed, in which the release layer may be attached to the pressure-sensitive adhesive layer. The kind of the release layer, oligomer migration prevention layer, and base material sheet which comprise a release film in the above is not specifically limited.

Peeling force on the pressure-sensitive adhesive layer of the release film can be adjusted. For example, the ratio (A / B) of the low speed peeling force (A) and the high speed peeling force (B) with respect to the adhesive layer of the said release film may be in the range of 1-10. The term low speed peel force in the present application means a peel force measured while peeling the release film from the pressure-sensitive adhesive layer at a peel rate of about 0.3 m / min and a peel angle of 180 degrees, and the high speed peel force is about 20 m / It is the peeling force measured, peeling from an adhesive layer at the peeling speed of min and the peeling angle of 180 degree | times. On the other hand, when referring to the physical properties in the present application, unless otherwise specified, the physical properties means the physical properties measured at room temperature. The term room temperature is a natural temperature that is warmed or not reduced, and may mean, for example, any temperature in the range of 10 ° C to 30 ° C, about 25 ° C, or about 23 ° C. The ratio (A / B) may be about 9 or less, about 8 or less, about 7 or less, about 6 or less, about 5.5 or less, about 5 or less, about 4.5 or less, about 4 or less, about 3.5 or less, or about 2.5 or less. Can be.

Under a ratio as described above, the high speed peeling force of the release film to the pressure-sensitive adhesive layer may be 50 gf / in or less. The high speed peeling force may be about 45 gf / in or less, about 40 gf / in or less, about 35 gf / in or less, about 30 gf / in or less, about 25 gf / in or less or about 20 gf / in or less in another example. have. The lower limit of the high speed peeling force is not particularly limited, and may be, for example, about 1 gf / in or more or about 5 gf / in or more.

The peel force characteristics as described above can be achieved through the composition control of the above-described pressure-sensitive adhesive layer, it can provide a laminate having excellent process characteristics under these characteristics. The kind of the release film which is a criterion of the peel force measurement in the above is not particularly limited, and a release film applied when applied to an actual process may be a reference. For example, the release film may be a release film distributed under a brand name such as MRF125 (F08) or MRF125 (F04).

The laminate may further comprise elements generally applied in the conductive laminate in addition to the above-described configuration. Such elements may be formed between the process protection film attached on the conductive layer of the laminate, an undercoat layer that may exist between the base film and the conductive layer, or between the base film and the pressure-sensitive adhesive layer. Hard coating layer and the like can be illustrated, but is not limited thereto. The specific kind of each element is not particularly limited, and known elements may be applied.

The present application also relates to an electronic device including the laminate. The electronic device may be, for example, a touch panel. The touch panel may include the laminate as an electrode.

The specific configuration of the touch panel is not particularly limited as long as it includes the laminate, and may have a structure according to a known capacitance method or a resistive film method, and the like. Known methods can be followed.

This application relates to a laminate, specifically a conductive laminate. In the present application, a laminate including an adhesive layer exhibiting excellent peeling characteristics with respect to a release film may be provided, and thus the laminate may exhibit excellent process characteristics.

Although the laminated body of this application is demonstrated concretely through the following Example and a comparative example, the range of the said resin etc. is not restrict | limited to the following Example.

1. Measurement of peeling force

After the laminate was cut to have a length of 1 inch and a length of 15 cm, the peeling force was measured while the release film was peeled from the pressure-sensitive adhesive layer in the transverse direction with a tensile tester in the cut laminate at room temperature. . The high-speed peeling force was measured at a peel rate of 20 m / min at the time of peeling, and the peel angle was 180 degrees. The low-speed peeling force was a peel rate at 0.3 m / min at the time of peeling, and the peel angle was 180 degrees. Measured by

Preparation Example 1 Preparation of Adhesive Polymer (A)

55-N-butyl acrylate (BA), isobornyl acrylate (IBOA) and 2-hydroxyethyl acrylate (HEA) were added to a 1 L reactor equipped with a refrigeration system and nitrogen gas was refluxed to facilitate temperature control. The weight ratio was 30:15 (BA: IBOA: HEA). Subsequently, about 150 parts by weight of ethyl acetate (EAc) was added as a solvent to 100 parts by weight of the total monomers, and after purging with nitrogen gas for 60 minutes to remove oxygen, the temperature was maintained at 60 ° C. A proper amount of AIBN (Azobisisobutyronitrile), a reaction initiator, was added to carry out a polymerization reaction, and the reaction product was diluted with ethyl acetate (EAc) after the reaction to prepare an adhesive polymer solution having a weight average molecular weight of about 1 million.

Preparation Example 2 Preparation of Adhesive Polymer (B)

As a monomer mixture, 2-ethylhexyl acrylate (EHA), isobornyl acrylate (IBOA), hydroxyethyl acrylamide (HEAA) and 2-hydroxyethyl acrylate (HEA) are 50: 30: 5: 15 A pressure-sensitive adhesive polymer (B) solution was prepared in the same manner as in Preparation Example 1, except that the weight ratio (EHA: IBOA: HEAA: HEA) was used. The weight average molecular weight of the adhesive polymer solution (B) was about 1 million.

Preparation Example 3 Preparation of Adhesive Polymer (C)

As a monomer mixture, 2-ethylhexyl acrylate (EHA), isobornyl acrylate (IBOA), vinyl pyrrolidone (VA) and 2-hydroxyethyl acrylate (HEA) are obtained by 50: 30: 5: 15 A pressure-sensitive adhesive polymer (C) solution was prepared in the same manner as in Preparation Example 1, except that the weight ratio (EHA: IBOA: VA: HEA) was used. The weight average molecular weight of the adhesive polymer solution (C) was about 900,000.

Preparation Example 4 Preparation of Adhesive Polymer (D)

As a monomer mixture, 2-ethylhexyl acrylate (EHA), isobornyl acrylate (IBOA) and 2-hydroxyethyl acrylate (HEA) were added in a weight ratio of 78: 15: 7 (EHA: IBOA: HEA). A pressure-sensitive adhesive polymer (D) solution was prepared in the same manner as in Preparation Example 1, except that it was used. The weight average molecular weight of the adhesive polymer solution (D) was about 1.1 million.

Example 1.

A pressure-sensitive adhesive composition is applied to a surface where the ITO layer of a known conductive PET having an indium tin oxide (ITO) layer is formed on one surface of a poly (ethylene terephthalate) (PET) film. The pressure-sensitive adhesive layer was formed. The pressure-sensitive adhesive composition was prepared by uniformly mixing a crosslinking agent (Takenate D110N, Mitsui Chemicals) at 0.25 parts by weight with respect to 100 parts by weight of the solid content of the adhesive polymer (A) solution of Production Example 1. A laminate was prepared by attaching a release film (MRF125 (F08), Mitsubishi Polyester) on the pressure-sensitive adhesive layer.

Example 2.

As the pressure-sensitive adhesive composition, a composition prepared by uniformly mixing a crosslinking agent (Takenate D110N, Mitsui Chemicals) at 0.25 parts by weight with respect to 100 parts by weight of the solid content of the adhesive polymer (B) solution of Preparation Example 2, was used as a release film MRF125 ( A laminate was prepared in the same manner as in Example 1 except that F04) (manufacturer: Mitsubishi Polyester) was used.

Example 3.

As the pressure-sensitive adhesive composition, a composition prepared by uniformly mixing a crosslinking agent (Takenate D110N, Mitsui Chemicals) at 0.25 parts by weight with respect to 100 parts by weight of the solid content of the adhesive polymer (C) solution of Preparation Example 3, was used as a release film MRF125 ( A laminate was prepared in the same manner as in Example 1 except that F04) (manufacturer: Mitsubishi Polyester) was used.

Comparative Example 1.

Except for using the composition prepared by uniformly mixing a crosslinking agent (Takenate D110N, Mitsui Chemicals) to 0.25 parts by weight based on 100 parts by weight of the solid content of the adhesive polymer (D) solution of Preparation Example 4 as a pressure-sensitive adhesive composition. In the same manner as in the laminate was prepared.

The peel force evaluation result performed on each said laminated body is as follows.

Example Comparative example One 2 3 One Low Peel Force (A, gf / in) 30.6 10.6 13.6 18 High speed peeling force (B, unit: gf / in) 14.2 8.2 6.6 56.9 Peel Force Ratio (B / A) 2.2 1.3 2.1 0.3

Claims

Base film; An adhesive layer formed on one surface of the base film and a surface on which the conductive layer of the base film is not formed;
The pressure-sensitive adhesive layer is an alkyl (meth) acrylate having a glass transition temperature of a homopolymer in a range of -80 ° C to -30 ° C, a comonomer and a crosslinkable monomer having a glass transition temperature of a homopolymer in a range of 85 ° C to 130 ° C. A polymer having a polymer unit of about 25 parts by weight to 25 parts by weight of the comonomer and 0.1 to 40 parts by weight of the crosslinkable monomer, based on 100 parts by weight of the alkyl (meth) acrylate,
The comonomer is isobornyl (meth) acrylate as the first monomer; And vinyl pyrrolidone, hydroxyalkylacrylamide, tertiarylbutyl (meth) acrylate, dihydrodicyclopentadienyl acrylate (DCPA), N-vinylformamide ( VFA, N-vinylformamide), cyclohexyl (meth) acrylate (CHMA, cyclohexyl methacrylate), acrylamide, benzyl (meth) acrylate, tert-butyl acrylate, iso-butyl methacrylate, n-butyl methacrylate , sec-butyl methacrylate, cyclopropyl acrylate, cyclobutyl acrylate, N, N-dimethyl (meth) acrylamide, N, N-diphenyl methacrylamide, N- (n-dodecyl) methacrylamide , 1-hexadecyl methacrylate, 2-methoxyethyl methacrylate, N-naphthyl acrylate, 2-phenoxyethyl methacrylate, phenyl (meth) acrylate, 2-phenylethyl (meth) acrylate , n-propyl methacryl Sites, styrene, and methacrylic acid include dicyclopentanyl (dicyclopentanyl) ester, N- vinylcaprolactam, and N- hydroxyethyl one or more second monomer selected from the group consisting of acrylamide,
The ratio (C / D) of the weight (C) of the first monomer and the weight (D) of the second monomer is in the range of 1.5 to 9.

The laminate according to claim 1, wherein the alkyl (meth) acrylate having a glass transition temperature of the homopolymer in the range of -80 ° C to -30 ° C is butyl acrylate or ethylhexyl acrylate.

delete

The laminate according to claim 1, wherein the crosslinkable monomer is hydroxyalkyl (meth) acrylate.

The laminate according to claim 1, further comprising a crosslinking agent for crosslinking the polymer.

The laminate according to claim 7, wherein the crosslinking agent is an isocyanate compound, an epoxy compound, an aziridine compound or a metal chelate compound.

The laminate according to claim 7, wherein the crosslinking agent is included in a ratio of 0.1 to 20 parts by weight relative to 100 parts by weight of the polymer.

The laminate according to claim 1, further comprising a release film attached to the pressure-sensitive adhesive layer.

The low-speed peeling force (A, peeling rate: 0.3 m / min, peeling angle: 180 degrees) and the high-speed peeling force (B, peeling rate: 20 m / min, peeling angle with respect to the adhesive layer of a release film of Claim 10. : 180 degree) laminated body whose ratio (A / B) exists in the range of 1-10.

The laminated body of Claim 11 whose high speed peeling force (B, peeling rate: 20 m / min, peeling angle: 180 degree | time) with respect to the adhesive layer of a release film is 50 gf / in or less.

The laminate according to claim 1, further comprising a protective film attached to the conductive layer.

The laminate according to claim 1, further comprising a hard coat layer formed between the base film and the pressure-sensitive adhesive layer.

A touch panel comprising the laminate of claim 1.