KR101266195B1 - Double-sided pressure-sensitive adhesive tape, preparation method thereof and touch panel - Google Patents

Abstract

The present invention relates to a double-sided adhesive tape, a method for producing the same, and a touch panel including the above. The double-sided adhesive tape of the present invention has excellent adhesiveness, restoring force, elastic properties, stress relaxation and flexibility. Accordingly, the adhesive tape of the present invention can be applied to the touch panel to secure a wide effective operating area through excellent stress relaxation and flexibility while providing excellent durability, restoring force and spot durability.

Double sided adhesive tape, touch panel, base resin, polymer microspheres, foam, burst

Description

Double-sided adhesive tape, its manufacturing method and touch panel TECHNICAL FIELD

TECHNICAL FIELD This invention relates to a double-sided adhesive tape, its manufacturing method, and a touch panel.

In recent years, demand for electronic devices in which touch panel-type switches are installed in an input operation unit, such as a PDA, a mobile communication terminal, or a vehicle navigation, is increasing.

Touch panel electronic devices are usually manufactured using a transparent conductive film, and the operating principle thereof includes a capacitive type, a resistive film type, or an ultrasonic type, among which a touch panel can be implemented at low cost. Has an advantage.

In the resistive film system, a transparent conductive film or transparent conductive glass is disposed to face each other, and a gap is maintained by a spacer. The electrode is formed in the peripheral portion by using a low resistance element, and the electrodes are in contact with each other when pressure is applied from the outside. In addition, the resistive film type is a structure that receives signals from four electrodes made of a low-resistance body, and detects a change in potential at a contact position due to an input load while giving a potential inclination to one transparent electrode, and on the opposite side of the transparent electrode. Edo also has the operating principle of detecting the position by digitizing the analog signal obtained by giving the potential gradient and detecting the potential in the same manner.

As described above, the resistive film method of finding the input coordinate through the change amount of the resistance has the advantage of simple structure. On the other hand, the spacer (ex. Double-sided adhesive tape) for separating the conductive polymer film or glass spaced apart in the resistive film mode to fully relieve the stress generated when the pressure applied from the peripheral portion, to play a role of widening the effective use area of the panel do.

For this purpose, Japanese Patent Laid-Open No. 2003-022729 discloses a technique using an adhesive having an elastic modulus of 10 ⁶ dyne / cm ² to 10 ⁸ dyne / cm ² as a spacer of a panel. Further, Japanese Patent Laid-Open No. 2006-259815 discloses a technique for controlling the elastic modulus of upper and lower adhesive layers by interposing a polymer spacer between the adhesive layers.

However, as in the above technique, when only the elastic modulus of the adhesive layer is adjusted, it is difficult to secure an effective use area unless the elastic modulus is lowered, and when the elastic modulus is lowered, the resilience or durability of the touch panel is serious. There is a problem that is degraded.

In addition, in the case of interposing the polymer material between the adhesive layers, it is difficult to expand the effective use area of the touch panel due to the thickness of the interposed material itself, and the elastic modulus is low, so that deformation of the pressure sensitive adhesive easily occurs, so that the restoring force is increased. Seriously degraded. In addition, as described above, when the spacer is composed of a structure of three or more layers, there is a limit to peeling of the touch panel due to the complexity of the structure.

An object of this invention is to provide a double-sided adhesive tape, its manufacturing method, and a touch panel containing the above.

This invention provides the double-sided adhesive tape for touch panels which has a 1st adhesive surface and a 2nd adhesive surface, and contains the hardened | cured material of the resin composition containing a base resin and a polymer microsphere as a means for solving the said subject. .

The present invention as another means for solving the above problems, the first step of producing a resin composition comprising a base resin and a polymer microspheres; And it provides a method for producing a double-sided adhesive tape for a touch panel comprising a second step of curing the resin composition prepared in the first step.

The present invention is another means for solving the above problems, the first insulating sheet having an electrode surface formed on the bottom; A second insulating sheet spaced apart from the first insulating sheet and having an electrode surface formed on a surface of the first insulating sheet opposite to the electrode surface; And

Provided is a touch panel including a double-sided adhesive tape according to the present invention attached to edge portions of the first and second insulating sheets, respectively, to which the first and second insulating sheets are bonded.

Double-sided adhesive tape of the present invention has excellent adhesion, restoring force, elastic properties, stress relaxation and flexibility. In particular, the double-sided adhesive tape of the present invention, when applied to the touch panel, can have excellent elasticity and stress relief, flexibility, etc., while having an elastic property that can exhibit excellent restoring force and durability. Accordingly, the adhesive tape of the present invention can be applied to the touch panel to provide a wide effective operating area while providing excellent restoring force, durability, and spot durability. In addition, even if the double-sided pressure-sensitive adhesive tape of the present invention is applied to the panel in a single layer structure instead of a multi-layer structure, it exhibits the excellent properties as described above, there is an advantage that can achieve a thinning of the touch panel.

This invention relates to the double-sided adhesive tape for touch panels which has a 1st adhesive surface and a 2nd adhesive surface, and contains the hardened | cured material of the resin composition containing a base resin and a polymeric microsphere.

Hereinafter, the double-sided adhesive tape of the present invention will be described in more detail.

The double-sided adhesive tape of this invention contains hardened | cured material (henceforth a "resin hardened | cured material") of the resin composition containing a base resin and a polymer microsphere, and also makes a 1st and 2nd adhesive surface As long as it has at the same time, the specific structure is not particularly limited.

For example, the double-sided adhesive tape of the present invention, as shown in the accompanying Figure 1, made of a resin cured product contained therein the polymer microspheres 3, the first adhesive surface (1) on both sides And a double-sided adhesive tape 10 having a single layer structure in which the second adhesive surface 2 is formed.

In addition, according to another aspect of the present invention, as shown in FIG. 2, the double-sided adhesive tape 20 forms the first adhesive surface 1, and is composed of a cured resin containing polymer microspheres 3. A first adhesive layer 11; A base 13 formed below the first adhesive layer 11; And a second adhesive layer 12 formed under the substrate 13, forming a second adhesive surface 2, and composed of a cured resin material including the polymer microspheres 3. .

On the other hand, when the double-sided adhesive tape of the present invention includes the base material 13 as described above, the thickness occupied by the adhesive layer (that is, the total thickness of the first adhesive layer 11 and the second adhesive layer 12) is the whole. It is preferable to control so that it may become 70% or more of the thickness of the double-sided adhesive tape 20. FIG. In this way, by controlling the thickness of the adhesive layer, it is used under high temperature or in a severe temperature difference, so that even when deformation such as thermal expansion or contraction occurs in the upper and lower substrates constituting the touch panel, By absorbing effectively, it is possible to prevent peeling, lifting, or generation of bubbles, and to provide a panel having excellent operation efficiency.

In addition, when the double-sided adhesive tape of this invention contains the base material 13, the specific kind of the said base material is not specifically limited, A general raw material of this field can be used. For example, the substrate 13 may be a woven or nonwoven fabric composed of various natural and synthetic materials, or may be a conventional plastic film such as a polyester film. According to another aspect of the present invention, the base 13 may be an insulating layer made of silicon, urethane, butadiene, or a vinyl material.

Meanwhile, the double-sided adhesive tape of the present invention has a total thickness of about 1 μm to 200 μm, preferably about 20 μm to 150 μm, more preferably about 20 μm to 90 μm, and more preferably about 30 μm to 80 μm. It can be in the range of. By controlling the thickness of the adhesive tape in the above range, when the sheet is applied to the touch panel, it is possible to ensure a wide operating area while having excellent spot durability, operating efficiency and durability.

In addition, the cured resin contained in the double-sided adhesive tape of the present invention has a storage modulus at room temperature of 10 ² dyne / cm ² to 10 ¹⁰ dyne / cm ² , more preferably 10 ⁴ dyne / cm ² to 10 ⁸ dyne / cm ² , more preferably 10 ⁵ dyne / cm ² to 10 ⁶ dyne / cm ² . In the present invention, when the storage elastic modulus of the adhesive tape is too low, deformation may occur due to repeated stress during touch input, and durability, such as spot durability, may be lowered. Increasingly, the operation efficiency is lowered or the cushioning effect is deteriorated, so that the stress at the time of touch is transmitted to the electrode layer as it is, and there is a risk of damage.

Moreover, it is preferable that the glass transition temperature of the resin cured material contained in the double-sided adhesive tape of this invention is -10 degrees C or less. In the present invention, when the glass transition temperature is excessively increased, the modulus of elasticity is excessively increased, so that the adhesiveness may be lowered or the workability may be deteriorated. In the present invention, the lower limit of the glass transition temperature of the cured resin is not particularly limited, and can be appropriately controlled in the range of -50 ° C or higher, for example.

In addition, the cured resin contained in the double-sided adhesive tape of the present invention may have a crosslinking density in the range of 1% to 95%, preferably 50% to 95%. If the crosslinking density of the cured resin is less than 1%, the cohesive force may be lowered. If the crosslinked density of the cured resin is more than 95%, lifting, peeling or bubbles may occur, or the durability may be lowered.

The type of base resin included in the resin composition in the present invention is not particularly limited, and various thermosetting or radiation curable base resins that can be used in the art may be freely used. In the present invention, for example, an acrylic resin, rubbers, urethane resins, silicone resins or EVA (Ethylene Vinyl acetate) resins may be used as the base resin. In the present invention, it is particularly preferred to use an acrylic resin having excellent optical properties such as transparency, oxidation resistance, and high resistance to yellowing, but is not limited thereto.

In one aspect of the present invention, the acrylic resin may be a polymer of a monomer mixture including a (meth) acrylic acid ester monomer and a polar monomer.

In the present invention, the kind of the (meth) acrylic acid ester monomer included in the monomer mixture is not particularly limited, and may be, for example, alkyl (meth) acrylate. In this case, when the alkyl group contained in the monomer is too long, the cohesive force of the pressure-sensitive adhesive may be lowered, and the glass transition temperature and the adhesion may become difficult to control. Therefore, an alkyl (meth) acrylate having an alkyl group having 1 to 12 carbon atoms is used. It is desirable to. Examples of such monomers include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, t-butyl ( Meta) acrylate, sec-butyl (meth) acrylate, pentyl (meth) acrylate, hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, 2-ethylbutyl (meth) acrylate, n- And at least one selected from the group consisting of octyl (meth) acrylate, isooctyl (meth) acrylate, isononyl (meth) acrylate, lauryl (meth) acrylate and tetradecyl (meth) acrylate.

On the other hand, the polar monomers contained in the monomer mixture impart cohesive force to the resin composition, improve adhesion, and in some cases, provide a site capable of reacting with the multifunctional crosslinking agent or photocuring agent described later, thereby providing a crosslinking structure. It means a monomer containing a polar functional group capable of. The specific kind of such a polar monomer is not specifically limited, For example, the kind of carboxyl group containing monomer, a nitrogen containing monomer, and a hydroxyl group containing monomer, or a mixture of 2 or more types can be used. Examples of the carboxyl group-containing monomers include (meth) acrylic acid, acrylic acid duplex, fumaric acid, itaconic acid, maleic acid and maleic anhydride; Examples of nitrogen-containing monomers include (meth) acrylonitrile, (meth) acrylamide, N-methyl (meth) acrylamide, N-methylol (meth) acrylamide, N-vinyl pyrrolidone and N-vinyl caprolactam And the like; Examples of the hydroxy group-containing monomer include glycerol (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxy Hydroxyhexyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate, 2-hydroxyethylene glycol (meth) acrylate or 2-hydroxypropylene glycol (meth) acrylate, and the like. It is not limited.

The monomer mixture of the present invention may include the polar monomer in an amount of 1 to 20 parts by weight based on 100 parts by weight of the (meth) acrylic acid ester monomer. By controlling a polar monomer in the said range, the adhesiveness, workability, and storage stability of hardened | cured material of resin can be maintained excellent.

In the present invention, the monomer mixture may further include a co-monomer represented by the following general formula (1) as needed. Such comonomers may be added for the purpose of controlling the glass transition temperature of the cured resin (adhesive) and providing other functionalities.

[Formula 1]

Wherein each of R ₁ to R ₃ independently represents hydrogen or alkyl, R ₄ is cyano; Phenyl unsubstituted or substituted with alkyl; Acetyloxy; Or COR < _{5 &} gt ;, wherein R < ₅ > represents amino or glycidyloxy substituted or unsubstituted with alkyl or alkoxyalkyl.

Alkyl or alkoxy in the definition of R ₁ to R _{5 in} the above formula means alkyl or alkoxy having 1 to 8 carbon atoms, preferably methyl, ethyl, methoxy, ethoxy, propoxy or butoxy.

Specific examples of comonomers of formula (1) include nitrogen-containing monomers such as (meth) acrylonitrile, (meth) acrylamide, N-methyl (meth) acrylamide or N-butoxy methyl (meth) acrylamide; Styrene-based monomers such as styrene or methylstyrene; Glycidyl (meth) acrylate; Or a carboxylic acid vinyl ester such as vinyl acetate, or the like, or a heterogeneous compound, but is not limited thereto. When such a comonomer is included in the monomer mixture of the present invention, the content is preferably 20 parts by weight or less. When the content exceeds 20 parts by weight, there is a fear that the flexibility and / or peeling force of the pressure-sensitive adhesive composition is lowered.

Acrylic polymer containing the above components can be prepared by a conventional method in the art. For example, the polymer may be prepared by a method such as radical polymerization, for example, solution polymerization, photo polymerization, bulk polymerization, suspension polymerization or emulsion polymerization. It is preferable that the acrylic polymer is prepared by solution polymerization in the above, wherein the polymerization temperature is 50 ° C to 140 ° C, and the reaction is preferably performed by adding an initiator in a state where monomers are uniformly mixed.

On the other hand, in the present invention, when the cured resin is formed of a radiation curable composition described below, the above-described acrylic polymer may be used by itself, and in some cases, may be used in a state where a radiation polymerizable group is introduced into the side chain thereof. In this case, the method of introducing the radiation polymerizable group into the side chain of the acrylic resin is not particularly limited, and for example, a functional group capable of reacting with a polar functional group introduced into the acrylic resin and a radiation polymerizable group (ex. It can be introduced using a radiation polymerizable compound having simultaneously.

The specific kind of the radiation polymerizable compound used at this time is not particularly limited, but 1 to 5, preferably 1 to 2, per molecule of radiation polymerizable groups (e.g., radiation polymerizable carbon-carbon double bonds). And a compound having a functional group capable of reacting with a polar functional group contained in an acrylic resin (chain). Examples of the functional group capable of reacting with the functional group of the main chain include an isocyanate group, an epoxy group, a silane group or a carboxyl group, but are not limited thereto. For example, when a hydroxyl group or a carboxyl group is introduced into the main chain, the functional group included in the radiation polymerizable compound may be an isocyanate group, an epoxy group or a chlorosilane group, or the like, and when an amino group or a substituted amino group is introduced into the main chain, It is preferable that an isocyanate group etc. are contained in a radiation polymerizable compound, and when an epoxy group is contained in a principal chain, a radiation polymerizable compound may contain a carboxyl group.

Specific examples of the radiation polymerizable compound which can be used in the present invention include 2-isocyanatoethyl (meth) acrylate, 1,1-bis (acryloyloxymethyl) ethyl isocyanate, and (meth) acryloyloxy Ethyl isocyanate, meta-isopropenyl-α, α-dimethylbenzyl isocyanate, methacryloyl isocyanate or allyl isocyanate; An acryloyl monoisocyanate compound obtained by reacting a diisocyanate compound or a polyisocyanate compound with 2-hydroxyethyl (meth) acrylate; Acryloyl monoisocyanate compounds obtained by reacting a diisocyanate compound or a polyisocyanate compound, a polyol compound, and 2-hydroxyethyl (meth) acrylate; Glycidyl (meth) acrylate; (Meth) acrylic acid; Or 3-methacryloxypropyldimethylchlorosilane, or the like, or a heterogeneous compound, but is not limited thereto.

In the present invention, the content of the radiation polymerizable group-containing compound in the base resin is not particularly limited to be selected according to the intended use. For example, 5 to 100 equivalents per 100 equivalents of the polar monomer contained in the acrylic resin. May be included in proportions.

In the present invention, the method of introducing a radiation polymerizable group into the side chain of the acrylic resin is not particularly limited, and for example, the acrylic resin and the radiation polymerizable-containing compound may be used for 4 hours to 48 hours at an atmospheric pressure of room temperature to 40 ° C. Can be prepared by reaction. At this time, the reaction may be carried out using a catalyst such as organic tin in a solvent such as ethyl acetate.

In the present invention, the type of the resin composition including the base resin and the polymer microspheres described above is not particularly limited, and may be prepared, for example, with a radiation curable or thermosetting pressure-sensitive adhesive composition. In the present invention, in some cases, the cured resin may be constituted by appropriately mixing the two kinds of pressure-sensitive adhesive compositions. The term "radiation" used in the present invention means an energy ray that can cause a curing reaction by affecting a polymerizable group or an initiator contained in the pressure-sensitive adhesive composition (coating solution), and can be used as a concept including an electron beam and ultraviolet rays. . On the other hand, the resin composition used in the present invention may be a solvent-free pressure-sensitive adhesive composition, in particular may be a radiation curable non-solvent-type pressure-sensitive adhesive composition. By configuring the cured resin using the composition of the non-solvent type in this way, it is possible to more uniformly control physical properties such as the thickness of the adhesive layer, it is possible to minimize the problem of environmental pollution due to the use of toxic solvents. In the present invention, when the pressure-sensitive adhesive composition is configured in a solvent-free form, the method for producing a cured resin using the same is not particularly limited. For example, first, the (meth) acrylic acid ester monomer and the polar group-containing monomer described above are partially polymerized, preferably partially polymerized by heat, and the viscosity thereof is adjusted to prepare a resin syrup. Then, the photocuring agent, photoinitiator, and / or other additives which are mentioned later are added to the manufactured resin syrup, and it stirred and mixed so that it may disperse | distribute uniformly, and prepares an adhesive composition. Subsequently, the above-mentioned pressure-sensitive adhesive composition is polymerized, and photopolymerization and crosslinking reaction by ultraviolet irradiation can be carried out to prepare the cured resin of the present invention. In this process, UV irradiation conditions are not particularly limited and may be appropriately selected in consideration of the preferable degree of curing of the resin composition.

On the other hand, in the present invention, when the hand composition is composed of a radiation curable composition, the composition may include a photocuring agent and a photoinitiator together with the base resin described above.

In the radiation-curable composition, the photocuring agent may play a role of adjusting the adhesive property of the cured resin (adhesive) according to the amount of use, and in some cases providing a crosslinked structure. The photocuring agent that can be used is not particularly limited, and examples thereof include crosslinking monomers such as polyfunctional acrylate, and specifically 1,4-butanediol di (meth) acrylate and 1,6-hexanediol di (Meth) acrylate, neopentyl glycol di (meth) acrylate, 1,2-ethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, 1,12-dodecanediol di (meth) acrylic Latex, neopentylglycol adipate di (meth) acrylate, hydroxypivalic acid neopentylglycol di (meth) acrylate, dicyclopentanyl di (meth) acrylate, caprolactone modified dicyclopentenyl di (meth) acrylic Ethylene oxide modified di (meth) acrylate, di (meth) acryloxy ethyl isocyanurate, allylated cyclohexyl di (meth) acrylate, tricyclodecanedimethanol (meth) acrylate, Dimethylol dicyclopentane di (meth) acrylate, ethylene oxide modified hexahydrophthalic acid di (meth) acrylate, tricyclodecane dimethanol (meth) acrylate, neopentylglycol modified trimethylpropane di (meth) acrylate, Adamantane di (meth) acrylate, 9,9-bis [4- (2-acryloyloxyethoxy) phenyl] fluorene, trimethylolpropane tri (meth) acrylate, dipentaerythritol tri ( Meta) acrylate, propionic acid modified dipentaerythritol tri (meth) acrylate, pentaerythritol tri (meth) acrylate, propylene oxide modified trimethylolpropane tri (meth) acrylate, tris (meth) acryloxy Ethyl isocyanurate, diglycerin tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, propionic acid modified dipentaerythritol penta (meth) acrylic , Dipentaerythritol hexa (meth) acrylate, caprolactone modified dipentaerythritol hexa (meth) acrylate, and urethane (meth) acrylate which is a reaction product of an isocyanate monomer and trimethylolpropane tri (meth) acrylate. It may be one or more selected from the group consisting of.

In the present invention, the photocuring agent may be included in an amount of 0.05 parts by weight to 2 parts by weight based on 100 parts by weight of the base resin in the radiation curable composition. If the content of the photocuring agent is less than 0.05 part by weight, the durability may be deteriorated due to the decrease in cohesion. If the content of the photocuring agent is more than 2 parts by weight, the peeling force of the pressure-sensitive adhesive may be excessively lowered, or the durability may be lowered at high temperature or high humidity conditions. have.

On the other hand, the photoinitiator included in the radiation curable composition plays a role of controlling the degree of polymerization of the cured water according to the amount used. The kind of photoinitiator that can be used in the present invention is not particularly limited, and for example, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin n-butyl ether, benzoin isobutyl ether , Acetophenone, dimethylanino acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 2-hydroxy-2-methyl-1-phenylpropane- 1-one, 1-hydroxycyclohexylphenyl ketone, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholino-propane-1-one, 4- (2-hydroxyethoxy) phenyl 2- (hydroxy-2-propyl) ketone, benzophenone, p-phenylbenzophenone, 4,4'-diethylaminobenzophenone, dichlorobenzophenone, 2-methylanthraquinone, 2-ethylanthraquinone, 2 t-butyl anthraquinone, 2-aminoanthraquinone, 2-methylthioxanthone, 2-ethylthioxanthone, 2-chlorothioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone Benzyldimethyl Dea, acetophenone dimethyl ketal, p-dimethylamino benzoic acid ester, oligo [2-hydroxy-2-methyl-1- [4- (1-methylvinyl) phenyl] propanone], 2,4,6-trimethylbenzoyl Diphenyl phosphine oxide, bis (2,4,6-trimethylbenzoyl) phenyl phosphine oxide, α, α-methoxy-α-hydroxy acetophenone, 2-benzoyl-2- (dimethylamino) -1- [ 4- (4-morphonyl) phenyl] -1-butanone, 2,2-dimethoxy-2-phenyl acetophenone, etc. are mentioned. In the present invention, one or more of the above can be used.

In the radiation curable composition, the photoinitiator is preferably included in an amount of 0.01 to 2 parts by weight based on 100 parts by weight of the base resin. When the content of the photoinitiator is out of the above range, the crosslinking and curing reaction may not be performed smoothly, or the physical properties of the cured product may deteriorate due to the remaining components after the reaction.

In addition, the radiation-curable composition is at least one additive selected from the group consisting of pigments, antioxidants, ultraviolet stabilizers, dispersants, antifoaming agents, thickeners, plasticizers, tackifying resins and silane coupling agents within a range that does not affect the effects of the invention. It may include as appropriate.

On the other hand, when the cured resin of the present invention is composed of a thermosetting composition, the composition may include a multifunctional crosslinking agent together with the base resin described above. Such a crosslinking agent improves the cohesion of the cured resin (adhesive) through the reaction with the polar functional group contained in the base resin, gives a crosslinked structure, and serves to adjust the adhesive properties.

The type of crosslinking agent that can be used in the present invention is not particularly limited, and for example, a general crosslinking agent such as an isocyanate crosslinking agent, an epoxy crosslinking agent, an aziridine crosslinking agent, and a metal chelating compound can be used, and a double isocyanate crosslinking agent is used. Preferably, but not limited thereto. Examples of the isocyanate-based crosslinking agent include tolylene diisocyanate, xylene diisocyanate, diphenylmethane diisocyanate, hexamethylene diisocyanate, isoform diisocyanate, tetramethylxylene diisocyanate, naphthalene diisocyanate and any one of the above polyols ( ex. trimethylol propane); Examples of epoxy crosslinkers include ethylene glycol diglycidyl ether, triglycidyl ether, trimethylolpropane triglycidyl ether, N, N, N ', N'-tetraglycidyl ethylenediamine and glycerin diglycidyl ether. One or more selected from the group consisting of; Examples of the aziridine crosslinking agent include N, N'-toluene-2,4-bis (1-aziridinecarboxide), N, N'-diphenylmethane-4,4'-bis (1-aziridinecarbox Id), triethylene melamine, bisisoprotaloyl-1- (2-methylaziridine), and one or more selected from the group consisting of tri-1-aziridinylphosphine oxide. In addition, examples of the metal chelate-based compound may be a compound in which a polyvalent metal such as aluminum, iron, zinc, tin, titanium, antimony, magnesium, and / or vanadium is coordinated with acetyl acetone, ethyl acetoacetate, or the like. It is not limited.

In the thermosetting composition of the present invention, the multifunctional crosslinking agent may be included in an amount of 0.01 to 10 parts by weight based on 100 parts by weight of the base resin. In the present invention, when the content of the crosslinking agent is less than 0.01 part by weight, the cohesive force of the cured product (adhesive) may be lowered. When the content of the crosslinking agent is more than 10 parts by weight, the crosslinking reaction proceeds excessively, and the interlayer peeling is performed in the laminated structure using the cured resin. Or there is a possibility that the lifting phenomenon occurs.

In one aspect of the present invention, the thermosetting composition is an acrylic low molecular weight, an epoxy resin, a curing agent, a pigment, an antioxidant, an ultraviolet stabilizer, a dispersant, a colorant, a reinforcing agent, a filler, an interface within a range that does not affect the effect of the invention. One or more additives selected from the group consisting of active agents, plasticizers, foaming agents, antifoaming agents, thickeners, plasticizers, tackifying resins and silane coupling agents may be suitably included.

The resin composition of this invention contains a polymeric microsphere. The term "polymer microsphere" used in the present invention is composed of a polymer material, and means a spherical material whose size (average diameter) is defined at the micrometer level. On the other hand, the term "spherical material" used in the present invention is used as a concept that includes all of the materials having a uniform spherical shape or a part or the entire non-definite shape itself. In one aspect of the present invention, the polymer microspheres may be composed of, for example, acrylic resin, vinylidene chloride resin and / or styrene resin. In addition, in one aspect of the present invention, the polymer microspheres may have an average diameter of 5 ㎛ to 150 ㎛, preferably 10 ㎛ to 80 ㎛. If the average diameter of the polymer microspheres is less than 5 μm, uniform dispersion of the polymer microspheres may not occur in the cured resin, and if it exceeds 150 μm, control of the total thickness of the double-sided adhesive tape may be difficult. .

In the present invention, the polymer microspheres may also have a density in the range of 0.01 g / cm ³ to 0.1 g / cm ³ . By controlling the density of the polymer microspheres in the above range, the process workability and the cushioning properties of the adhesive tape can be maintained more excellently.

In addition, in one aspect of the present invention, the polymer microspheres may have a hollow structure in which an empty space (hollow part) is formed and the empty space is surrounded by a shell of the polymer material described above. At this time, in consideration of the foaming or bursting effect to be described later, the foaming gas may be collected in the hollow portion. In this case, the type of gas used is not particularly limited, but the boiling point is preferably relatively low, and specifically, butane, isobutane, pentane or isopentane may be used.

Examples of the polymer microspheres as described above that can be used in the present invention include, but are not limited to, the Expancel series (ex. Expancel 092 DE 40 d30) manufactured by Akzo Nobel.

In one aspect of the invention, the polymer microspheres may be contained in a foamed or ruptured state in the adhesive tape. The term "foaming of polymer microspheres" used in the present invention means the case where the polymer material constituting the cell is not blown, but inflated to a certain range, particularly in the polymer microspheres of the hollow structure described above. Means a case where the polymer microspheres are inflated to the extent that the polymer material constituting the cell is partially or totally ruptured, especially in the above-described hollow polymer microspheres. As such, the method of foaming or rupturing the polymer microspheres is not particularly limited, and can be achieved through, for example, a heating or microwave irradiation process described later. In the present invention, since the polymer microspheres contained in the cured resin are present in a foamed or ruptured state as described above, the adhesive tape may be formed in a foam structure as a whole, thereby having excellent elasticity and hardness. can do. In particular, since the polymer microspheres are present in a ruptured or foamed state, the flexibility and the stress relaxation of the adhesive tape can be significantly increased.

In the resin composition of the present invention, the polymer microspheres are 0.1 parts by weight to 20 parts by weight, preferably 0.1 parts by weight to 10 parts by weight, more preferably 0.1 parts by weight to 5 parts by weight, based on 100 parts by weight of the base resin described above. It can be included in a positive amount. If the content of the polymer microspheres is less than 0.1 part by weight, there is a fear that the stress relaxation or flexibility is inferior. If the content of the polymer microspheres is more than 20 parts by weight, the viscosity of the resin composition is increased, coating properties and workability is lowered, or the volume during heat-resistant conditions There is a fear that the durability is reduced due to expansion.

The present invention also comprises a first step of preparing a resin composition comprising a base resin and polymer microspheres; And it relates to a method for producing a double-sided adhesive tape for touch panels comprising a second step of curing the resin composition prepared in the first step.

In the above production method of the present invention, following the second step, a third step of foaming or rupturing the polymer microspheres contained in the cured product of the resin composition may be further performed.

In the manufacturing method of the double-sided adhesive tape of this invention, after manufacturing a resin composition, the method of hardening it is not specifically limited. For example, when the resin composition is to be composed of a radiation curable composition in the present invention, first, as described above, the (meth) acrylic acid ester monomer and the polar group-containing monomer are partially polymerized, preferably partially polymerized by heat, The viscosity is adjusted to prepare a resin syrup. Thereafter, a photocuring agent, a photoinitiator and / or other additives may be added to the prepared resin syrup, and stirred and mixed to uniformly disperse the resin composition. In the present invention, the resin cured product of the present invention can be prepared by appropriately blending the desired polymer microspheres in the resin composition prepared above, followed by polymerization, preferably photopolymerization and crosslinking reaction by ultraviolet irradiation. . At this time, the curing conditions (ex. Ultraviolet irradiation conditions) is not particularly limited and may be appropriately selected in consideration of the desired degree of curing.

In addition, when the cured resin of the present invention is to be manufactured in a sheeted state, the viscosity of the pressure-sensitive adhesive composition including the above-described partial polymer, photocuring agent and polymer microspheres may be adjusted to an appropriate level (ex. 100 cps to 10,000). After adjusting to cps), it is applied to a substrate or a release film, and photopolymerized and crosslinked by UV irradiation or the like to prepare a cured resin in the form of a sheet. In addition, in the present invention, when the first and second pressure-sensitive adhesive layer is to produce a pressure-sensitive adhesive tape laminated structure between the substrate, the process of applying and curing the composition on the base material is sequentially performed, or appropriate peeling Once the cured resin is formed on the substrate, a method of transferring it to the substrate may be used.

On the other hand, when using the thermosetting pressure-sensitive adhesive composition in the present invention, the method for preparing and curing it is not particularly limited, for example, a method similar to the case of the radiation-curable pressure-sensitive adhesive described above can be used. However, in the case of a thermosetting adhesive composition, superposition | polymerization and crosslinking reaction of a composition are advanced by means, such as hot air irradiation, ie, heat. At this time, it is preferable that the crosslinking agent contained in the thermosetting adhesive composition is controlled so that the crosslinking reaction of a functional group hardly progresses in the compounding process for formation of hardened | cured material from a viewpoint of uniform coating performance. That is, the crosslinking agent after the coating operation is completed, it is preferable to form a crosslinked structure in the drying and aging process, thereby improving the cohesive force, adhesive properties and cutability of the cured resin.

In the present invention, after the cured resin is prepared through the above-described process, a third step of foaming or rupturing the polymer microspheres included in the cured resin may be further performed. By appropriately performing such a foaming or rupturing process, the cured resin can be formed into a foam structure, and thus stress relaxation and flexibility can be further improved. At this time, the method of foaming or rupturing the polymer microspheres is not particularly limited. For example, the cured resin may be appropriately heated or irradiated with microwaves. At this time, the heat treatment conditions or microwave irradiation conditions are not particularly limited, and may be appropriately adjusted according to the degree of the desired foaming or bursting, or the number of polymer microspheres to be foamed or bursting. For example, when foaming or rupturing the polymer microspheres by heat treatment in the present invention, the heating temperature can be appropriately controlled within the range of 100 ° C to 250 ° C, and the heating time is within the range of 10 seconds to 60 minutes. Can be.

The present invention also includes a first insulating sheet having an electrode formed on the bottom; A second insulating sheet spaced apart from the first insulating sheet and having an electrode formed on a surface of the first insulating sheet opposite to the electrode; And

The present invention relates to a touch panel comprising a double-sided adhesive tape according to the present invention attached to edge portions of the first and second insulating sheets, respectively, to bond the first and second insulating sheets.

In the present invention, as described above, using a double-sided adhesive tape excellent in adhesiveness, elastic properties, stress relaxation and flexibility, as a result of configuring the touch panel, it is excellent in durability and effectively relieves the stress generated during touch or pressing It is possible to provide a touch panel having a large effective area while having excellent RBI durability.

In the present invention, in the configuration of the touch panel, as long as the double-sided adhesive tape according to the present invention is used, other configurations are not particularly limited, and a general material in this field can be adopted without limitation.

3 is a view illustrating a resistive touch panel 30 according to an aspect of the present invention.

As shown in FIG. 3, in the touch panel 30 of the present invention, a first insulating sheet 31 having an electrode surface (ex. ITO electrode layer) 32 formed thereon and an electrode surface (ex. ITO electrode surface) formed thereon The second insulating sheet 35 on which the 34 is formed may be attached by the double-sided adhesive tape 33 according to the present invention. In the present invention, the material constituting the first and second insulating sheets 31 and 35 is not particularly limited. For example, the electrode surface (ITO) may be formed on a polymer film or glass having excellent flexibility through a deposition process or the like. It can be formed and used. In the present invention, a transparent conductive film is formed on a polymer film (eg, a polyethylene terephthalate film or a polycarbonate film) that is excellent in physical properties such as workability, impact resistance and fracture resistance, and can be used as the insulating sheet. .

In the present invention, the adhesive tape 33 is attached only to the edge portions of the first and second insulating sheets 31 and 35 or the electrode surfaces 32 and 34 formed thereon, and when viewed from the top, It may have a frame shape. Such a double-sided adhesive tape is preferably attached so that the first and second insulating sheets 31 and 35 can be maintained at a predetermined interval, for example, spaced at intervals of about 1 μm to 200 μm. If the spacing is less than 1 μm, unwanted contact may occur when curls or the like occur on the upper and lower electrode surfaces, and when it exceeds 200 μm, the distance between the electrode surfaces becomes too long, resulting in poor touch characteristics. There is concern. In addition, as described above, the double-sided adhesive tape to which the first and second insulating sheets 31 and 35 are attached may have a width of about 1 mm or more. At this time, the upper limit of the width (width) of the double-sided adhesive tape is not particularly limited, and for example, 40 mm or less, preferably 30 mm or less, more preferably 20 mm or less. In one aspect of the present invention, in order to impart better insulation to the double-sided adhesive tape 33, separate insulator layers may be further formed on the upper and lower portions thereof.

The touch panel of the present invention is also provided with a reinforcing base material 37 such as polycarbonate sheet or glass having a predetermined thickness under the second insulating sheet 35 in order to reinforce its rigidity when using a polymer film as an insulating sheet. Can be bonded via the adhesive layer 36 or the like.

In the touch panel of the present invention configured as described above, when a power source is connected to the upper and lower electrode surfaces, and a contact is formed on the upper and lower electrode surfaces by a pen touch or pressing, a voltage difference is formed by the contact, Can be identified.

As described above, in the case of the double-sided adhesive tape of the present invention, it has excellent adhesiveness and can impart excellent durability to the touch panel. In particular, the adhesive tape of the present invention is excellent in stress relaxation property, flexibility, restoring force and elasticity, which gives the panel excellent spot durability even when repeated input operations are performed on the touch panel, Deterioration or the like can be effectively prevented.

Hereinafter, the present invention will be described in more detail with reference to the following examples and comparative examples, but the scope of the present invention is not limited by the following examples.

Example 1.

40 parts by weight of butyl acrylate (BA), 45 parts by weight of cyclohexyl methacrylate, 10 parts by weight of 2-ethylhexyl acrylate (2-EHA) and 5 parts by weight of acrylic acid were charged in a 1 liter glass reactor, followed by thermal polymerization. A syrup having a viscosity of 4000 cP was prepared. Subsequently, 1.5 parts by weight of Igacure-651 as a photoinitiator and 0.3 parts by weight of 1.6-hexanediol diacrylate (HDDA) as a crosslinking agent were mixed with 100 parts by weight of the prepared syrup and stirred sufficiently. Thereafter, 1 part by weight of polymer microspheres (Expancel 092 DET 40 d25, manufactured by AKZP NOBEL) having a diameter of 40 µm was added thereto, and the mixture was stirred until sufficiently uniform in a vacuum defoaming state. The UV-type adhesive liquid thus obtained was coated with a film applicator to a thickness of about 60 μm on a PET release film having a thickness of 38 μm. Covering the PET release film on the coating layer of the adhesive liquid to block oxygen, and irradiated with a metal halide UV lamp (UV irradiation conditions 50 mJ / cm ² ) to prepare a pressure-sensitive adhesive, using both sides An adhesive tape was prepared. Using ARES (Advanced Rheometric Expansion System, TA), pressure-sensitive adhesive is loaded on an 8 mm plate at 25 ° C with a thickness of 1 mm, frequency 1 rad / sec, strain Storage modulus (G ') was measured under the condition of 5%, and the measured storage modulus was 1.70 × 10 ⁵ dyne / cm ² .

Example 2.

As a crosslinking agent, 0.5 part by weight of 1.6-hexanediol diacrylate (HDDA) was used, and a double-sided pressure-sensitive adhesive tape was manufactured in the same manner as in Example 1 except that the compounding amount of the polymer microspheres was changed to 0.75 part by weight. The storage modulus of the pressure-sensitive adhesive was 4.66 × 10 ⁵ dyne / cm ² .

Example 3.

The double-sided adhesive tape prepared in Example 2 was treated at 160 ° C. for 10 minutes in an oven to prepare a double-sided adhesive tape having microspheres foamed therein.

Example 4.

A monomer mixture comprising 95 parts by weight of n-butyl acrylate (BA) and 5 parts by weight of acrylic acid was added to a 1000 cc reactor equipped with a refrigeration device for easy reflux of nitrogen gas, and ethyl acetate (EAc) as a solvent. ) 100 parts by weight was added. The nitrogen gas was then purged for 20 minutes for oxygen removal and then held at 60 ° C. The mixture was uniformed, and then 0.1 parts by weight of azobisisobutyronitrile (AIBN) diluted to 50% concentration in ethyl acetate was added as a reaction initiator, and reacted for 8 hours to obtain a molecular weight (measured using a polystyrene standard sample). This 400K acrylic copolymer was produced. Ethyl acetate (EAc) was additionally added to the acrylic copolymer to prepare a coating liquid having a solid content of 40%, and 1.5 parts by weight of a polymer microsphere (Expancel 092 DET 40 d25, AKZP NOBEL (manufactured)) having a diameter of 40 μm was added thereto. Stir until sufficiently uniform. Thereafter, 0.5 parts by weight of an isocyanate-based curing agent (tolylene diisocyanate adduct of trimethylolpropane) and 0.03 part by weight of an epoxy-based curing agent (N, N, N ', N'-tetraglycidylethylenediamine) were added to the coating solution, followed by stirring. . The prepared pressure-sensitive adhesive coating liquid was coated on a PET having a release thickness of 38 μm using a film applicator, dried at a temperature of 100 ° C. for 2 minutes to prepare a pressure-sensitive adhesive having a thickness of 60 μm, and to prepare a double-sided adhesive tape using the same. It was. The storage modulus of the pressure-sensitive adhesive prepared above was 2.83 × 10 ⁵ dyne / cm ² .

Comparative Example 1

Except not adding the polymer microspheres, a double-sided adhesive tape having a storage modulus of 8.12 × 10 ⁴ dyne / cm ² was obtained in the same manner as in Example 1.

Comparative Example 2

A double-sided pressure-sensitive adhesive tape having a storage modulus of 3.72 × 10 ⁵ dyne / cm ² was prepared in the same manner as in Example 1, except that 0.8 parts by weight of 1.6-hexanediol diacrylate (HDDA) was used without adding the polymer microspheres. Got it.

Comparative Example 3

Except not adding the polymer microspheres, a double-sided adhesive tape having a storage modulus of 6.21 × 10 ⁴ dyne / cm ² was obtained in the same manner as in Example 4.

The physical properties of the prepared double-sided adhesive tape were evaluated by the method shown below.

1. Pressability evaluation

Covering the release film having a thickness of 38 μm on the pressure-sensitive adhesive of the double-sided pressure-sensitive adhesive tapes prepared in Examples and Comparative Examples, using TA (Texture analyzer XT-2i, micro stable system (manufactured)), 1mm in diameter round type (round type) When the probe (probe) is pressed under the condition of 0.05 mm / sec, the force for deformation of 50 ㎛ depth was measured.

The measurement results are summarized in Table 1 below.

[Table 1]

Example Comparative example One 2 3 4 One 2 3 Force for deformation (gf) 54.8 72.6 45.3 67.4 48.1 117.7 30.7

As can be seen from the results of Table 1, in the case of Examples 1 to 4, compared to Comparative Example 2 containing no polymer microspheres, despite the similar level of storage modulus, the force for deformation Very few were confirmed. In particular, comparing the results of Comparative Example 2 with Example 2 having a similar storage modulus, it can be seen that the stress on the ITO electrode layer is significantly reduced by the addition of the polymer microspheres. In addition, in the case of Example 3 in which the foaming treatment of the polymer microspheres was carried out after the production of the adhesive tape, it was confirmed that compared with the other cases, the force for deformation was further reduced.

2. Deformation force measurement according to RBI distance

As shown in FIG. 4, the ITO PET 41 and the glass substrate 43 whose thickness was 188 micrometers were affixed using the double-sided adhesive tape 42 manufactured in the Example and the comparative example. At this time, the spacer (double-sided pressure-sensitive adhesive tape) 42 was set so that the thickness was set in the range of about 120 µm to 140 µm by appropriately stacking the sheets produced in Examples or Comparative Examples. Subsequently, using TA (manufactured by Texture analyzer Stable micro system), the degree of deformation force was measured according to the RBI distance (distance with the inner end of the double-sided adhesive tape), and the results are shown in Table 2 below. .

[Table 2]

Example Comparative example One 2 3 4 One 2 3 One 51 100 72 79 38 140 27 2 20 43 26 38 17 84 15 3 16 29 17 24 11 44 10 4 14 23 14 20 9 32 8 5 13 18 12 16 10 26 9 6 13 16 12 12 8 25 6 10 12 15 11 12 8 25 7

As confirmed from the results of Table 2, in the case of Examples 1 to 4, compared with Comparative Example 2, it can be confirmed that the force required for deformation is very small, in particular, while the RBI distance exceeds 2 mm, The force dropped very sharply, and it can be seen from this that the adhesive tape according to the present invention can impart an effective operation function while keeping the effective use area of the touch panel wide.

3. High temperature durability measurement

Using the double-sided pressure-sensitive adhesive tapes prepared in Examples and Comparative Examples, the upper ITO layer 32 and the lower ITO layer 34 were bonded in the form as shown in FIG. 3. At this time, the width of the double-sided adhesive tape 33 was 5 mm, and the sample of the size of 5 cm x 10 cm (width x length) was produced. The prepared samples were stored in an oven at 80 ° C. for 500 hours to observe changes in appearance, and the results are shown in Table 3 by evaluation according to the following criteria.

○: When measuring high temperature durability, there is no occurrence of lifting, bubbles and peeling, and the appearance is maintained without damage

X: When lifting, foaming, or peeling off after high-temperature durability measurement, or serious damage to the appearance occurs

[Table 3]

Example Comparative example One 2 3 4 One 2 3 High temperature durability ○ ○ ○ ○ × × ×

As can be seen from the results of Table 3, in the embodiment according to the present invention, it was confirmed that the lifting force during deformation of the touch panel was maintained at an appropriate level, and that the spot durability and the high temperature durability were also excellent. However, in Comparative Examples 1 and 3, in which the storage elastic modulus of the pressure-sensitive adhesive is set relatively low to ensure a relatively good operating function, severe bubbles are generated between the upper ITO layer and the lower ITO layer during the high temperature durability test. In addition, it was confirmed that peeling or lifting occurred partially or entirely, and the high temperature durability was severely lowered.

1 is a cross-sectional view of a double-sided adhesive tape according to an aspect of the present invention.

2 is a cross-sectional view of a double-sided adhesive tape according to another aspect of the present invention.

3 is a schematic cross-sectional view of a touch panel according to an aspect of the present invention.

4 is a view schematically showing an experimental procedure for measuring the force of the deformation according to the spot distance in the present invention.

≪ Description of reference numerals &

10, 20: double-sided adhesive tape 1: first adhesive surface

2: second adhesive surface 3: polymer microspheres

11: first adhesive film 12: second adhesive film

13: base material 30: touch panel

31, 35: insulation sheet 32, 34: ITO electrode

36: adhesive 37: reinforcing base material

41: ITO PET 42: double-sided adhesive tape

43: glass

Claims (20)

The storage elastic modulus of the resin composition which has a 1st adhesive surface and a 2nd adhesive surface, and contains a base resin and a polymeric microsphere is 10 ² dyne / cm <^2> -10 <^10> dyne / cm <^2>, and glass transition temperature is -50 degreeC or more Double-sided adhesive tape for touch panels containing hardened | cured material which is -10 degrees C or less. The semiconductor device of claim 1, further comprising: a first adhesive layer forming a first adhesive surface; A substrate formed under the first adhesive layer; And The double-sided adhesive tape for touch panels formed in the lower part of the said base material, and including the 2nd adhesion layer which forms a 2nd adhesion surface. The double-sided pressure sensitive adhesive tape for touch panel according to claim 1, wherein the thickness is 1 µm to 200 µm. delete delete The double-sided adhesive tape for touch panels according to claim 1, wherein the base resin is a polymer of a monomer mixture containing a (meth) acrylic acid ester monomer and a polar group-containing monomer. The double-sided adhesive tape for touch panels of Claim 1 whose resin composition is a solvent-free adhesive composition. The double-sided adhesive tape for touch panel according to claim 1, wherein the resin composition further comprises a photocuring agent and a photoinitiator. 9. The photocuring agent according to claim 8, wherein the photocuring agent is a polyfunctional acrylate, and the photoinitiator is benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin n-butyl ether, benzoin isobutyl ether, aceto Phenone, dimethylanino acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 2-hydroxy-2-methyl-1-phenylpropane-1one , 1-hydroxycyclohexylphenyl ketone, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholino-propan-1-one, 4- (2-hydroxyethoxy) phenyl-2 -(Hydroxy-2-propyl) ketone, benzophenone, p-phenylbenzophenone, 4,4'-diethylaminobenzophenone, dichlorobenzophenone, 2-methylanthraquinone, 2-ethylanthraquinone, 2-t -Butyl anthraquinone, 2-aminoanthraquinone, 2-methyl thioxanthone, 2-ethyl thioxanthone, 2-chloro thioxanthone, 2,4-dimethyl thioxanthone, 2,4-diethyl thioxanthone, benzyldimethyl ketal, Acetophenone Dimethyl De, p-dimethylamino benzoic acid ester, oligo [2-hydroxy-2-methyl-1- [4- (1-methylvinyl) phenyl] propanone], 2,4,6-trimethylbenzoyldiphenyl phosphine jade Seed, bis (2,4,6-trimethylbenzoyl) phenyl phosphineoxide, α, α-methoxy-α-hydroxy acetophenone, 2-benzoyl-2- (dimethylamino) -1- [4- (4 Double-sided adhesive tape for touch panels which is -morphonyl) phenyl] -1-butanone or 2,2-dimethoxy-2-phenyl acetophenone. The double-sided adhesive tape for a touch panel according to claim 1, wherein the resin composition further comprises a multifunctional crosslinking agent. The double-sided adhesive tape for touch panel according to claim 10, wherein the multifunctional crosslinking agent is an isocyanate compound, an epoxy compound, an aziridine compound or a metal chelate compound. The double-sided adhesive tape for touch panel according to claim 1, wherein the polymer microspheres have an average diameter of 5 µm to 150 µm. The double-sided adhesive tape for a touch panel according to claim 1, wherein the polymer microspheres have a density of 0.01 g / cm ³ to 0.1 g / cm ³ . The double-sided adhesive tape for touch panel according to claim 1, wherein the polymer microspheres have a hollow structure. The double-sided adhesive tape for touch panel according to claim 1, wherein the polymer microspheres are present in a foamed state or a ruptured state. The double-sided adhesive tape for touch panel according to claim 1, wherein the resin composition comprises 0.1 part by weight to 20 parts by weight of polymer microspheres with respect to 100 parts by weight of the base resin. A first step of preparing a resin composition comprising a base resin and polymer microspheres; And a second step of curing the resin composition prepared in the first step. The method of manufacturing a double-sided pressure-sensitive adhesive tape for touch panel according to claim 17, further comprising performing a third step of foaming or rupturing the polymer microspheres contained in the cured product. The method for manufacturing a double-sided pressure-sensitive adhesive tape for touch panel according to claim 18, wherein the foaming or rupture is performed by heating the cured product at a temperature of 100 ° C to 250 ° C for 10 seconds to 60 minutes. A first insulating sheet having an electrode surface formed below; A second insulating sheet spaced apart from the first insulating sheet and having an electrode surface formed on a surface of the first insulating sheet opposite to the electrode surface; And Both surfaces according to any one of claims 1 to 3 and 6 to 16 attached to edge portions of the first and second insulating sheets, respectively, to bond the first and second insulating sheets. Touch panel comprising an adhesive tape.

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