KR102030051B1 - Apparatus and method for transfering substrate - Google Patents

Apparatus and method for transfering substrate Download PDF

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Publication number
KR102030051B1
KR102030051B1 KR1020120103333A KR20120103333A KR102030051B1 KR 102030051 B1 KR102030051 B1 KR 102030051B1 KR 1020120103333 A KR1020120103333 A KR 1020120103333A KR 20120103333 A KR20120103333 A KR 20120103333A KR 102030051 B1 KR102030051 B1 KR 102030051B1
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section
damping
main
speed
hand
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KR1020120103333A
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Korean (ko)
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KR20140037429A (en
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김대훈
이현호
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세메스 주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4189—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the transport system
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Automation & Control Theory (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A substrate transfer method is disclosed. In a substrate transfer method, a transfer section in which a hand picking up a substrate loaded in a storage container retreats to the outside of the storage container, wherein the transfer section includes a main transport section having a section in which the hand moves at constant speed at a main speed, and the main speed. It includes a damping transfer section having a section moving at a constant speed at a slower damping speed.

Description

Substrate transfer apparatus and method {APPARATUS AND METHOD FOR TRANSFERING SUBSTRATE}

The present invention relates to a substrate transfer apparatus and method.

The substrate processing system provided for semiconductor device fabrication includes a load port, an index robot, a buffer unit, a main transfer robot, and a plurality of processing units. The cassette is placed in the load port. The cassette and the buffer portion are provided as a storage container for loading the substrate. The index robot and the main transfer robot are provided as a substrate transfer device for transferring a substrate. The index robot transfers the substrate between the cassette and the buffer portion, and the main transfer robot transfers the substrate between the buffer portion and the processing units.

The substrate transfer device has a hand that picks up the substrate loaded in the storage container, and the hand retreats to the outside of the storage container after picking up the substrate. As shown in FIG. 1, the hand retreats and stops while sequentially passing through the acceleration section AS, the constant speed section CS, and the deceleration section RS. The hand speed control forms the acceleration section AS and the deceleration section RS relatively long in the entire transport section. As a result, the guide and the substrate formed on the hand may collide with a large force, thereby damaging the substrate.

Korea Patent Registration No. 10-0978127

The present invention provides a substrate transfer apparatus and method that can prevent damage to the substrate to be transferred.

The present invention provides a substrate transfer method. In a substrate transfer method, a transfer section in which a hand picking up a substrate loaded in a storage container retreats to the outside of the storage container, wherein the transfer section includes a main transport section having a section in which the hand moves at constant speed at a main speed, and the main speed. It includes a damping transfer section having a section moving at a constant speed at a slower damping speed.

The damping transfer section may include a first damping transfer section having a section in which the hand moves at a constant speed at a first damping speed before the hand moves at a constant speed at the main speed; And a second damping conveying section having a section in which the hand is conveyed at a constant speed at a second damping speed after the constant velocity movement at the main speed.

In addition, the first damping speed and the second anti-ping speed may be the same size.

The main transport section may include a main acceleration section in which the hand is accelerated to reach the main speed, and a main deceleration section in which the hand is decelerated from the main speed. Has a first damping deceleration section that is decelerated from the second damping conveying section has a second damping acceleration section in which the hand is accelerated to reach the second damping speed, and the first damping deceleration section comprises the main acceleration section. Continuous, the second damping acceleration section may be continuous with the main deceleration section.

The main transport section may include a main acceleration section in which the hand is accelerated to reach the main speed, and a main deceleration section decelerated from the main speed, and the constant speed section of the first damping transport section may be equal to the main acceleration section. Continuous, the constant velocity section of the second damping transfer section may be continuous with the main deceleration section.

The present invention also provides a substrate transfer apparatus. The substrate transfer apparatus includes a hand for picking up a substrate loaded in a container, transferring a picked up substrate, picking up a substrate, and placing the picked up substrate; A hand drive unit for retracting the hand picked up a substrate to the outside of the storage container; And a control unit controlling the hand drive unit to include a main transport section and a damping transport section in a transport section in which the hand retreats to the outside of the storage container, wherein the main transport section is a section in which the hand moves at a constant speed at a main speed. The damping transfer section includes a section in which the hand moves at a constant speed at a damping speed slower than the main speed.

The damping transfer section may include a first damping transfer section having a section in which the hand moves at a constant speed at a first damping speed before the hand moves at a constant speed at the main speed; And a second damping conveying section having a section in which the hand is conveyed at a constant speed at a second damping speed after the constant velocity movement at the main speed.

The main transport section may include a main acceleration section in which the hand is accelerated to reach the main speed, and a main deceleration section in which the hand is decelerated from the main speed. Has a first damping deceleration section decelerating from the second damping conveying section, and has a second damping acceleration section in which the hand is accelerated to reach the second damping speed, and the first damping deceleration section comprises the main acceleration section. Continuous, the second damping acceleration section may be continuous with the main deceleration section.

The main transport section may include a main acceleration section in which the hand is accelerated to reach the main speed, and a main deceleration section decelerated from the main speed, and the constant speed section of the first damping transport section may be equal to the main acceleration section. Continuous, the constant velocity section of the second damping transfer section may be continuous with the main deceleration section.

According to the embodiment of the present invention, since the impact force of the substrate and the guide is reduced during the transfer process, damage to the substrate may be prevented.

1 is a graph showing a conventional hand speed control.
2 is a schematic view of a substrate processing system according to an embodiment of the present invention.
3 is a perspective view showing a substrate transfer apparatus according to an embodiment of the present invention.
4 is a diagram illustrating a process in which a hand picks up a substrate according to an embodiment of the present invention.
5 is a graph illustrating hand speed control according to an embodiment of the present invention.
6 is a graph illustrating hand speed control according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. The embodiments of the present invention can be modified in various forms, and the scope of the present invention should not be construed as being limited to the following embodiments. This embodiment is provided to more completely explain the present invention to those skilled in the art. Therefore, the shape of the elements in the drawings are exaggerated to emphasize a more clear description.

2 is a schematic view of a substrate processing system according to an embodiment of the present invention.

Referring to FIG. 2, the substrate processing system 1000 of the present invention includes a load fort 10, an indext module 20, and a process module 30. The load port 10, the index module 20, and the process module 30 are sequentially arranged in one direction. Hereinafter, the direction in which the load port 10, the index module 20, and the process module 30 are disposed will be referred to as a first direction 3, and a direction perpendicular to the first direction 3 when viewed from the top will be described. A direction perpendicular to the first direction 3 and a second direction 4, respectively, is referred to as a second direction 4 and is referred to as a third direction 5. Hereinafter, each structure is demonstrated in detail.

The load port 10 has a mounting table 11 on which the cassette 12 is placed. The cassette 12 is provided as a storage container in which substrates are loaded. The mounting table 11 is provided in plural and arranged in a line along the second direction 4. In one embodiment four mounting tables 11 are provided.

The index module 20 transfers the substrate W between the cassette 12 placed on the mounting table 11 and the buffer portion 40. The index module 20 has a frame 21, an index robot 22, and a guide rail 23. The frame 21 is generally provided in the shape of an empty rectangular parallelepiped, and is disposed between the load port 10 and the buffer portion 40. Although not shown, the frame 21 is further provided with a door opener for opening and closing the door of the cassette 12. The index robot 22 and the guide rail 23 are disposed in the frame 21.

The index robot 22 picks up the substrate loaded on the cassette 12, transfers the picked up substrate to the buffer unit 40, or picks up the substrate loaded on the buffer unit 40, and transfers the substrate to the cassette 12. It is provided with a substrate transfer device. The index robot 22 is coupled to the guide rail 23 so as to be linearly movable along the guide rail 23.

The process module 30 includes a buffer unit 40, a transfer passage 50, a main transfer robot 60, and a plurality of substrate processing apparatuses 70.

The transfer passage 50 is provided along the first direction 3 in the process module 30, and provides a passage through which the main transfer robot 60 moves. Substrate processing apparatuses 70 face each other on both sides of the transfer passage 50 and are disposed along the first direction 3. In the transfer passage 50, the main transfer robot 60 may move along the first direction 3, and may move up and down the upper and lower layers of the substrate processing apparatus 70 and the upper and lower layers of the buffer unit 40. The rail 51 is installed.

The buffer part 40 is loaded by the index robot 22 before the substrate which has not been processed by the main transfer robot 60 is provided to the substrate processing apparatus 70, or whose processing has been completed in the substrate processing apparatus 70. It is provided as a storage container which is temporarily loaded before being conveyed to the port 10. The buffer unit 40 may be positioned in front of the first direction 3 of the transfer passage 50 and may have a multi-layer structure separated from each other in an upper layer or a lower layer. For example, the upper layer of the buffer unit 40 is provided to a place where the substrate after processing is transferred to the cassette 12, and the lower layer is to wait before the unprocessed substrate is transferred to each substrate processing apparatus 70. May be provided in place.

The main transfer robot 60 is installed in the transfer passage 50 and is provided as a substrate transfer apparatus for transferring a substrate between the substrate processing apparatuses 70 and the buffer unit 40. The main transfer robot 60 provides an unprocessed substrate waiting in the buffer unit 40 to each substrate processing apparatus 70 or transfers a substrate on which the process is completed in the substrate processing apparatus 70 to the buffer unit 40. .

The substrate processing apparatuses 70 perform various processing on the substrate. The substrate processing apparatuses 70 may be disposed along the first direction 3 to face each other with the transfer passage 60 therebetween within the process module 30, and may have a multilayer structure having an upper layer and a lower layer. According to the embodiment, in the substrate processing apparatus 70, two substrate processing apparatuses 70 are disposed on both sides of the transfer passage 50, respectively, in the lower layer of the processing unit 30 along the first direction 3. The substrate processing apparatus 70 is disposed on the upper layer of the processing unit 30 in the same manner as the lower layer. The substrate processing apparatuses 70 may be provided in the form of independent modules. The module means that the relevant parts are installed in one independent housing so that each substrate processing apparatus 70 can operate independently in performing each substrate processing function. The substrate processing apparatus 70 provided in the form of a module constitutes the process module 30 according to the layout of the substrate processing equipment.

3 is a perspective view showing a substrate transfer apparatus according to an embodiment of the present invention. The substrate transfer apparatus 100 may be provided as the above-described index robot (22 in FIG. 2) and the main transfer robot (60 in FIG. 2). Referring to FIG. 3, the substrate transfer apparatus 100 may include a hand 110, a hand driver 120, a controller (not shown), a rotating part 140, a vertical moving part 150, and a horizontal moving part 160. Include.

The hand 110 can load one substrate. A plurality of hands 110 are provided, and are arranged side by side facing each other in the third direction 5. According to an embodiment, four hands 110 may be provided. The two hands 110 positioned on the upper side may load the substrate on which the process is completed, and the two hands 110 positioned on the lower side may load the unprocessed substrate. The front guide 111 and the rear guide 112 are formed on the upper surface of the hand 110. The front guide 111 is formed in front of the upper surface of the hand 110, the rear guide 112 is formed in the rear of the upper surface of the hand 110. The substrate is loaded in the area between the front guide 111 and the rear guide 112. The front and rear guides 111 and 112 prevent the substrate from being separated when the hand 110 moves.

The hand driver 120 is positioned below the hands 110 and individually moves the hands 110 in the horizontal direction. The controller controls the hand driver 120. A method of controlling the hand driver 120 by the controller will be described in detail below.

The rotating unit 140 is coupled to the hand driving unit 120 at the bottom of the hand driving unit 120. The rotating unit 140 rotates to rotate the hand driver 120. Accordingly, the hands 110 rotate together with the hand driver 120.

The vertical moving part 150 is installed below the rotating part 140. The vertical moving part 150 raises and lowers the rotating part 140, whereby the height of the hand driving part 120 and the hand 110 may be adjusted.

The horizontal moving part 160 is coupled to the lower part of the vertical moving part 150 and moves horizontally along the transfer rails (23 and 51 of FIG. 2).

4 is a diagram illustrating a process in which a hand picks up a substrate according to an embodiment of the present invention.

Referring to FIG. 4, the hand 110 picks up the substrate W loaded in the storage containers 12 and 40 by driving the hand driver 120, and then retreats to the outside of the storage containers 12 and 40. do. The controller 130 controls the transfer speed of the hand 110 in the transfer section in which the hand 110 on which the substrate W is loaded retreats.

As illustrated in FIG. 5, the controller 130 controls the hand driver 120 to include at least two sections in which the hand 110 moves at constant speed at different speeds. According to the embodiment, the conveying section includes a first damping conveying section S1, a main conveying section S2, and a second damping conveying section S3. The first damping transfer section S1, the main transfer section S2, and the second damping transfer section S3 are sequential and continuous sections, and the storage container in which the hand 110 picking up the substrate W is stopped. It is the section from moving to the outside of (C) and stopping again.

The first damping transfer section S1 has a first damping acceleration section AS1, a first damping constant velocity section CS1, and a first damping deceleration section DS1. The hand 110 which picked up the board | substrate W is stopped in the horizontal direction. The hand 110 accelerates with an acceleration of a predetermined size in the first damping acceleration section AS1 to reach the first damping speed V1. In the first damping constant velocity section CS1, the hand 110 moves at a constant speed at a first damping speed V1 for a predetermined time. After the constant speed movement, the hand 110 is decelerated in the first damping deceleration section DS1 to move at a speed lower than the first damping speed V1.

The main transport section S2 is a section occupying most of the section in which the substrate W is transported in the transport section, and has a main acceleration section AS2, a main constant velocity section CS2, and a main deceleration section DS2.

The main acceleration section AS2 is continuous with the first damping deceleration section DS1, and the feed speed of the hand 110 accelerates to an acceleration of a predetermined size to reach the main speed V2. The main speed V2 is faster than the first damping speed V1. In the main constant velocity section CS2, the hand 110 moves at a constant speed at a main speed V2 for a predetermined time. After the constant speed movement, the hand 110 is decelerated in the main deceleration section DS2 to move at a speed lower than the first damping speed V1. In the main deceleration section DS2, the hand 110 may be decelerated at a slower speed than the first damping speed V1 of the first damping constant velocity section CS1.

The second damping transfer section S3 includes a second damping acceleration section AS3, a second damping constant velocity section CS3, and a second damping deceleration section DS3. The second damping acceleration section AS3 is continuous with the main deceleration section DS2, and the conveying speed of the hand 110 accelerates with an acceleration of a predetermined size to reach the second damping speed V3. The second damping speed V3 is slower than the main speed V2. The second damping speed V3 may be the same as the first damping speed V1. In contrast, the second damping speed V3 may be different from the first damping speed V1. In the second damping constant velocity section CS3, the hand 110 moves at a constant speed at a second damping speed V3 for a predetermined time. After the constant speed movement, the hand 110 is decelerated in the second damping deceleration section DS3. The hand 110 is stopped while passing through the second damping deceleration section DS3.

As described above, the transport section includes a plurality of sections traveling at constant speed at different speeds. As a result, the acceleration and deceleration sections in the transport section are shorter than the transport section in FIG. 1. Since the acceleration and deceleration sections are formed short, the impact force of the substrate W and the guides 111 and 112 placed on the hand 110 is smaller than the impact force of the substrate and the guide in FIG. 1. Therefore, the substrate W can be transported stably.

6 is a graph illustrating hand speed control according to another embodiment of the present invention.

Referring to FIG. 6, the transport section includes a first damping transport section S1, a main transport section S2, and a second damping transport section S3. The first damping transport section S1, the main transport section S2, and the second damping transport section S3 are sequential and continuous.

The first damping transfer section S1 has a first damping acceleration section AS1 and a first damping constant velocity section CS1. The hand 110 accelerates with an acceleration of a predetermined size in the first damping acceleration section AS1 to reach the first damping speed V1. In the first damping constant velocity section AS1, the hand 110 moves at a constant speed at a first damping speed V2 for a predetermined time.

The main feed section S2 has a main acceleration section AS2, a main constant velocity section CS2, and a main deceleration section DS2. The main acceleration section AS2 is continuous with the first damping constant velocity section CS1, and the conveying speed of the hand 110 accelerates with an acceleration of a predetermined size to reach the main speed V2. The main speed V2 is faster than the first damping speed V1. In the main constant velocity section CS2, the hand 110 moves at a constant speed at the main speed V2 for a predetermined time. After the constant speed movement, the hand is decelerated in the main deceleration section DS2.

The second damping transfer section S3 includes a second damping constant velocity section CS3 and a second damping deceleration section DS3. The second damping constant velocity section CS3 is continuous with the main deceleration section DS2 and moves at a constant speed for a predetermined time at the second damping speed V3. The second damping speed V3 is slower than the main speed V2. The second damping speed V3 may be the same as the first damping speed V1. In contrast, the second damping speed V3 may be different from the first damping speed V1. After the constant speed movement, the hand 110 is decelerated in the second damping deceleration section S3. The hand 110 is stopped while passing through the second damping deceleration section S3.

In the above-described conveying section, the acceleration and deceleration section is formed shorter than the conveying section of FIG. Since the acceleration and deceleration sections are formed short, the impact force between the substrate W and the guides 111 and 112 placed on the hand 110 may be reduced.

The foregoing detailed description illustrates the present invention. In addition, the foregoing description shows and describes preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications may be made within the scope of the concept of the invention disclosed in the present specification, the scope equivalent to the disclosed contents, and / or the skill or knowledge in the art. The described embodiments illustrate the best state for implementing the technical idea of the present invention, and various modifications required in the specific application field and use of the present invention are possible. Thus, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed as including other embodiments.

100: substrate transfer device 110: hand
120: hand drive unit 130: control unit
140: rotating part 150: vertical moving part
160: horizontal moving part S1: first damping transfer section
S2: main transfer section S3: second damping transfer section
AS1: first damping acceleration section AS2: main acceleration section
AS3: second damping acceleration section CS1: first damping constant velocity section
CS2: main constant velocity section CS3: second damping constant velocity section
DS1: first damping deceleration section DS2: main deceleration section
DS3: second damping deceleration section

Claims (9)

In the transfer section in which the hand picking up the substrate loaded in the storage container retreats to the outside of the storage container,
The conveying section includes a main conveying section having a section in which the hand moves at constant speed at a main speed, and a damping conveying section having a section moving at constant speed at a damping speed slower than the main speed,
The damping transfer section is
A first damping transfer section having a section in which the hand moves at a constant speed at a first damping speed before the hand moves at a constant speed at the main speed; And
And a second damping transfer section having a section in which the hand moves at a constant speed at a second damping speed after the constant speed movement at the main speed. delete The method of claim 1,
And the first damping speed and the second damping speed have the same size. The method according to claim 1 or 3,
The main transport section has a main acceleration section in which the hand is accelerated to reach the main speed, and a main deceleration section decelerated from the main speed,
The first damping transfer section has a first damping deceleration section in which the hand is decelerated from the first damping speed,
The second damping transfer section has a second damping acceleration section in which the hand is accelerated to reach the second damping speed,
The first damping deceleration section is continuous with the main acceleration section,
And the second damping acceleration section is continuous with the main deceleration section. The method according to claim 1 or 3,
The main transport section has a main acceleration section in which the hand is accelerated to reach the main speed, and a main deceleration section decelerated from the main speed,
The constant velocity section of the first damping transfer section is continuous with the main acceleration section,
And a constant velocity section of the second damping transfer section is continuous with the main deceleration section. In the substrate transfer apparatus that picks up the substrate loaded in the storage container, and transfers the picked up substrate,
A hand picking up a substrate, on which the picked up substrate is placed;
A hand drive unit for retracting the hand picked up a substrate to the outside of the storage container; And
It includes a control unit for controlling the hand drive unit to include a main transport section and a damping transport section in the transport section for the hand to retreat to the outside of the storage container,
The main transport section includes a section in which the hand moves at constant speed at the main speed, and the damping transport section includes a section in which the hand moves at constant speed at a damping speed slower than the main speed,
The damping transfer section is
A first damping transfer section having a section in which the hand moves at a constant speed at a first damping speed before the hand moves at a constant speed at the main speed; And
And a second damping transfer section having a section in which the hand moves at a constant speed at a second damping speed after the constant speed movement at the main speed. delete The method of claim 6,
The main transport section has a main acceleration section in which the hand is accelerated to reach the main speed, and a main deceleration section decelerated from the main speed,
The first damping transfer section has a first damping deceleration section in which the hand is decelerated from the first damping speed,
The second damping transfer section has a second damping acceleration section in which the hand is accelerated to reach the second damping speed,
The first damping deceleration section is continuous with the main acceleration section,
And the second damping acceleration section is continuous with the main deceleration section. The method of claim 6,
The main transport section has a main acceleration section in which the hand is accelerated to reach the main speed, and a main deceleration section decelerated from the main speed,
The constant velocity section of the first damping transfer section is continuous with the main acceleration section,
And a constant velocity section of the second damping transfer section is continuous with the main deceleration section.
KR1020120103333A 2012-09-18 2012-09-18 Apparatus and method for transfering substrate KR102030051B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210283779A1 (en) * 2018-07-06 2021-09-16 Kawasaki Jukogyo Kabushiki Kaisha Substrate transfer robot and method of controlling the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004119554A (en) 2002-09-25 2004-04-15 Rorze Corp Apparatus for holding plate-like object and manufacturing facility equipped with same
JP2005052919A (en) * 2003-08-01 2005-03-03 Yaskawa Information Systems Co Ltd Acceleration control method of work carrying device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0891840A4 (en) * 1996-03-18 2000-01-19 Komatsu Mfg Co Ltd Control device for a work carrying system
KR100978127B1 (en) 2008-07-16 2010-08-26 세메스 주식회사 Substrate processing apparatus and method for transferring substrate of the same
KR100989851B1 (en) * 2008-08-28 2010-10-29 세메스 주식회사 Substrate processing apparatus and method for transferring substrate of the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004119554A (en) 2002-09-25 2004-04-15 Rorze Corp Apparatus for holding plate-like object and manufacturing facility equipped with same
JP2005052919A (en) * 2003-08-01 2005-03-03 Yaskawa Information Systems Co Ltd Acceleration control method of work carrying device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210283779A1 (en) * 2018-07-06 2021-09-16 Kawasaki Jukogyo Kabushiki Kaisha Substrate transfer robot and method of controlling the same
US12036680B2 (en) * 2018-07-06 2024-07-16 Kawasaki Jukogyo Kabushiki Kaisha Substrate transfer robot and method of controlling the same

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