KR102020961B1 - A heat exchange assembly for an heat dissipating electronic device having improved sealing performance and thermal efficiency - Google Patents

A heat exchange assembly for an heat dissipating electronic device having improved sealing performance and thermal efficiency Download PDF

Info

Publication number
KR102020961B1
KR102020961B1 KR1020180119784A KR20180119784A KR102020961B1 KR 102020961 B1 KR102020961 B1 KR 102020961B1 KR 1020180119784 A KR1020180119784 A KR 1020180119784A KR 20180119784 A KR20180119784 A KR 20180119784A KR 102020961 B1 KR102020961 B1 KR 102020961B1
Authority
KR
South Korea
Prior art keywords
heat exchange
heat
heat dissipation
circulation path
electronic device
Prior art date
Application number
KR1020180119784A
Other languages
Korean (ko)
Inventor
황창한
Original Assignee
삼익기전 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼익기전 주식회사 filed Critical 삼익기전 주식회사
Priority to KR1020180119784A priority Critical patent/KR102020961B1/en
Application granted granted Critical
Publication of KR102020961B1 publication Critical patent/KR102020961B1/en

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20145Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20154Heat dissipaters coupled to components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention relates to a heat exchange assembly for a heat dissipating electronic device having improved sealing performance and heat dissipating efficiency and, more specifically, to a heat exchange assembly for a heat dissipating electronic device having improved sealing performance and heat dissipating efficiency to maintain the proper temperature in the electronic device through heat exchange between outdoor air and indoor air by being installed in the heat dissipating electronic device. The heat exchange assembly is assembled with a plurality of stacked heat exchange plates.

Description

향상된 밀폐성능과 방열효율이 확보된 전자기기 방열장치용 열교환 조립체{A heat exchange assembly for an heat dissipating electronic device having improved sealing performance and thermal efficiency}A heat exchange assembly for an heat dissipating electronic device having improved sealing performance and thermal efficiency

본 발명은 향상된 밀폐성능과 방열효율이 확보된 전자기기 방열장치용 열교환 조립체에 관한 것으로, 더욱 상세하게는 전자기기 방열장치에 내설되어 외부공기와 내부공기 사이의 열교환을 통해 전자기기 내부에 적정온도를 유지하도록 하는 향상된 밀폐성능과 발열효율이 확보된 전자기기 방열장치용 열교환 조립체에 관한 것이다.The present invention relates to a heat exchange assembly for an electronic device heat dissipation device that ensures improved sealing performance and heat dissipation efficiency. The present invention relates to a heat exchange assembly for an electronic device heat dissipation device having an improved sealing performance and heating efficiency.

주지하는 바와 같이 전자기기의 내부에는, 필연적으로 열이 발생된다. 상기 열은 전자기기의 각 구성요소간의 작동을 저해하는 요소이기도 하며, 또 고온으로 무단가열시 회로부품의 손상을 입히기도 한다.As is known, heat is inevitably generated inside the electronic device. The heat is a factor that hinders the operation between the components of the electronic device, and also damages the circuit components during the unauthorized heating at a high temperature.

당분야에서는 상기 전자기기의 내부에서 발생한 열을 신속하게 배출시켜 안정된 작동상태가 확보되도록, 전자기기의 케이스에 흡기팬과 배기팬을 각각 마련하여 흡기팬을 통해서는 상대적으로 저온인 외기를 전자기기 내로 유입시키고, 배기팬을 통해서는 상대적으로 고온인 내기를 케이스 밖으로 배출시킴으로써, 전자기기의 내부온도가 항시 적정온도를 유지할수 있도록 하고 있다.In this field, the intake fan and the exhaust fan are respectively provided in the case of the electronic device to quickly discharge the heat generated in the electronic device to ensure a stable operating state, so that the outside air having relatively low temperature is introduced into the electronic device through the intake fan. By discharging a relatively hot bet out of the case through the exhaust fan, the internal temperature of the electronic device can be maintained at an appropriate temperature at all times.

그런데, 상기 흡기팬과 배기팬은 케이스의 내측과 외측과 연통되도록 형성된 설치구에 설치되는 바, 공기 중의 먼지, 수분 등을 포함한 이물질이 전자기기내로 다량 유입될 소지가 있다.However, the intake fan and the exhaust fan are installed in the installation hole formed to communicate with the inside and the outside of the case, there is a possibility that a large amount of foreign matter, including dust, moisture, etc. in the air into the electronic device.

상기 공기 중에 포함된 이물질은 먼지나 수분은, 온도와 같이 전자회로의 작동을 저해하는 요소임과 동시에, 전자기기의 수명을 단축시키는 주요인이기도 하다.The foreign matter contained in the air is a factor that inhibits the operation of the electronic circuit, such as temperature, dust and water, and is also a major factor in shortening the life of the electronic device.

KR 10-1267015 B1KR 10-1267015 B1 KRKR 10200600552861020060055286 AA KRKR 10200600816021020060081602 AA JPJP 20012373572001237357 AA JPJP 20070429472007042947 AA

상기한 문제점을 해소하기 위해 안출된 본 발명의 목적은, 외부 순환경로와 내부 순환경로를 구획되게 형성하는 열교환부의 열교환판의 구조와 조립구조를 개량하여, 이들 열교환판들의 정형화된 조립을 통해 외부 순환경로와 내부 순환경로 사이의 안정된 밀폐성을 확보하고, 또 외부 순환경로와 내부 순환경로를 따라 이동하는 외부공기와 내부공기의 독특한 순환 기류를 확보하여 내부공기와 외부공기 사이의 향상된 열교환 효율이 확보되도록 한 전자기기 방열장치용 열교환 조립체를 제공함에 있다.An object of the present invention devised to solve the above problems is to improve the structure and assembly structure of the heat exchanger plate of the heat exchanger to form the external circulation path and the internal circulation path to be partitioned, the external through the standard assembly of these heat exchanger plates Ensuring stable sealing between the circulation path and the internal circulation path, and securing unique circulation airflow of the external air and the internal air moving along the external circulation path and the internal circulation path to ensure improved heat exchange efficiency between the internal air and the external air. The present invention provides a heat exchange assembly for an electronic device heat dissipation device.

상기한 목적은, 본 발명에서 제공되는 하기 구성에 의해 달성된다.The above object is achieved by the following configuration provided in the present invention.

본 발명에 따른 향상된 밀폐성능과 방열효율이 확보된 전자기기 방열장치용 열교환 조립체는,The heat exchange assembly for an electronic device heat dissipation device which ensures an improved sealing performance and heat dissipation efficiency according to the present invention,

외기 유입구를 통해 강제 유입되는 외부공기와, 내기 유입구를 통해 강제 유입되는 내부공기를 상호 차폐되게 열교환하는 전자기기 방열장치용 열교환 조립체에 있어서,In the heat exchange assembly for an electronic device heat dissipation device for heat-exchanging heat shielding the external air forced through the outside air inlet and the internal air forced through the inside inlet,

상기 열교환 조립체는, 복수의 열교환판들이 적층하여 조립된 적층 조립체로 구성되고,The heat exchange assembly is composed of a stack assembly in which a plurality of heat exchange plates are stacked and assembled.

상기 열교환판은, 직교하는 제 1 변과 제 2 변은 외향 절곡된 개방 날개편을 형성하고, 제 1 변과 평행하는 제 3 변과 제 3 변과 직교하며 제 2 변과 평행하는 제 4 변은 내향 절곡된 밀폐 날개편을 형성한 사각의 금속판재로 구성되고,The heat exchange plate has a first side and a second side that are orthogonal to form an open blade piece that is bent outwardly, and a third side that is parallel to the first side and a fourth side that is orthogonal to the third side and parallel to the second side. Is composed of a square metal plate formed inwardly bent sealed wing piece,

상기 열교환판들은, 밀폐 날개편을 상호 내접되게 적층 조립하여, 일편과 외측에 'ㄱ'자의 개방부를 형성한 외기 순환로와, 타편과 내측에 'ㄴ'형의 개방부를 형성한 내기 순환로를 교번하여 형성한 적층 조립체를 형성하도록 구성된 것을 특징으로 한다.The heat exchange plates alternately assemble the sealed wing pieces to be inscribed with each other, alternating an outdoor air circulation path having an 'a' opening on one side and an outside, and an internal air circulation path having an 'b' shaped opening on the other side and the inside. It is characterized in that it is configured to form the laminated assembly formed.

바람직하게는, 상기 적층하여 조립된 열교환판들은, 관통하는 압착볼트에 의해 상호 압착하여, 마주하는 밀폐 날개편들을 내접되게 적층하여 조립된다.Preferably, the laminated assembled heat exchanger plates are compressed by mutually compressing through the compression bolts, and are assembled by internally stacking opposing sealing wing pieces.

보다 바람직하게는, 상기 상호 내접된 각 밀폐 날개편 사이와, 각 열교환판과 압착볼트 사이에는 실링재가 주입 및 고착된 실링층이 더 형성된다.More preferably, a sealing layer in which a sealing material is injected and fixed is further formed between each of the sealing blade pieces inscribed to each other and between each heat exchange plate and the compression bolt.

그리고, 상기 열교환판에는 내향 돌출된 내향 방열리브들이 길이방향으로 정렬된 내향 돌출 리브구간의 양편에, 외향 돌출된 내향 방열리브들이 길이방향으로 정렬하여 형성된 외향 돌출 리브구간이 각각 형성된다.The heat exchange plate is provided with outwardly projecting rib sections formed on both sides of the inwardly projecting rib section in which the inwardly projecting inward heat dissipating ribs are aligned in the longitudinal direction, respectively.

또한, 상기 내향 돌출 리브구간을 형성하는 내향 방열리브들과, 외향 돌출 리브구간을 형성하는 외향 방열리브들은 지그재그 형태를 형성하여, 상기 외기 순환로에 급기하여 순환 배출되는 외부공기와, 내부 순환로에 급기하여 순환 배출되는 내부공기는 지그재그 형태로 순환 배출공간을 따라 순환하여 배출되도록 구성한다.In addition, the inward heat dissipation ribs forming the inwardly projecting rib section and the outward heat dissipation ribs forming the outwardly projecting rib section form a zigzag shape, and are supplied to the external air circulation path and discharged to the outside air circulation path, and are supplied to the internal circulation path. The internal air discharged circulating is configured to be circulated and discharged along the circulating discharge space in a zigzag form.

그리고, 상기 열교환판들을 적층되게 조립한 적층 조립체의 각 모서리부에는 수납공간의 내벽에 밀착되는 차폐가드가 각각 배치된다.In addition, shielding guards in close contact with inner walls of the storage spaces are disposed at respective corners of the stack assembly in which the heat exchange plates are stacked.

또한, 상기 각 내기 순환로의 개방부 측과 외기 순환로의 개방부 측에는 내향 돌출형 중공림이 마주하여 형성되고, 상기 각 내기 순환로의 밀폐부 측과 외기 순환로의 밀폐부 측에는 외향 돌출형 중공림이 마주하여 형성되는 한편, 상기 적층된 열교환판들은 중공림들을 관통하는 압착볼트에 의해 상호 압착하여 조립되어서, 상기 각 개방부 측은 내향 돌출형 중공리브를 통해 지지되어 설정 간격을 유지하고, 밀폐부 측은 외향 돌출형 중공리브의 탄성 압착에 의해 긴밀히 밀착되도록 구성한다.In addition, an inwardly projecting hollow forest is formed on the open side of each of the internal air circulation paths and an open part of the external air circulation path, and an outwardly projecting hollow forest is opposite to the airtight side of the internal air circulation path and the airtight side of the external air circulation path. On the other hand, the laminated heat exchange plates are assembled by pressing each other by a compression bolt passing through the hollow forest, each opening side is supported by the inwardly projecting hollow ribs to maintain a set interval, the sealing side is outward It is configured to be in close contact by elastic compression of the protruding hollow ribs.

전술한 바와 같이 본 발명에서는 직교하는 제 1 변과 제 2 변은 외향 절곡된 개방 날개편을 형성하고, 제 1 변과 평행하는 제 3 변과 제 3 변과 직교하며 제 2 변과 평행하는 제 4 변은 내향 절곡된 밀폐 날개편을 형성한 사각의 금속판재로 이루어진 열교환판을 포함한다.As described above, in the present invention, the first and second sides that are orthogonal form an open wing piece that is bent outwardly, and the third and third sides that are parallel to the first side and the second side that are orthogonal to the second side are parallel to the second side. The four sides include a heat exchanger plate consisting of a square metal plate formed with an inwardly bent closed wing piece.

따라서, 본 발명은 각기 다른 형상이나 규격의 복수의 열교환판을 조립함에 따른 불량 발생을 최소화할 수 있고, 또 단일 형상과 규격의 열교환판을 정형화되게 조립하여 외기 유입로와 내기 유입로를 정형화되게 형성할 수 있고, 또 제작과 치수 유지에 따른 비용 발생이 최소화되고 조립의 편리성이 확보된다.Therefore, the present invention can minimize the occurrence of defects by assembling a plurality of heat exchanger plates of different shapes or specifications, and also to form a uniform shape of the heat exchanger plate of a single shape and specification to form an external air inlet and internal air inlet It is possible to form, minimize the cost of manufacturing and maintaining the dimensions and ensure the convenience of assembly.

특히, 이와 같이 구성된 열교환판을 적층되게 조립한 열교환 조립체는, 밀폐 날개편의 정형화된 내접과, 압착볼트에 의해 압착에 의해 안정된 밀착상태를 형성하고, 결과적으로 이들 열교환판들의 정형화된 조립을 통해 외부 순환로와 내부 순환로 사이의 안정된 밀폐성이 확보되고, 또 실링층에 의해 보다 향상된 밀폐성이 담보될 수 있다.In particular, the heat exchange assembly in which the heat exchange plates configured as described above are stacked to form a stable internal state of the sealing blade pieces and a compression contact by compression bolts, and consequently, the external heat exchanger is formed through the standard assembly of these heat exchange plates. The stable sealing property between the circulation path and the internal circulation path is ensured, and the improved sealing property can be ensured by the sealing layer.

따라서, 본 발명을 채택한 전자기기 냉각장치를 채택하면, 외부공기에 잔류된 오일 미스트 등의 이물질이 전자기기 내부로 유입되지 아니하면서, 내부공기의 안정적인 냉각이 가능하다.Therefore, when the electronic device cooling apparatus adopting the present invention is adopted, foreign matters such as oil mist remaining in the external air do not flow into the electronic device, and stable cooling of the internal air is possible.

그리고, 본 발명은 상기 열교환판에는 내향 돌출된 내향 방열리브들이 길이방향으로 정렬된 내향 돌출 리브구간의 양편에, 외향 돌출된 내향 방열리브들이 길이방향으로 정렬하여 형성된 외향 돌출 리브구간에 의해, 상기 외기 순환로에 급기하여 순환 배출되는 외부공기와, 내부 순환로에 급기하여 순환 배출되는 내부공기는 지그재그 형태로 순환 배출공간을 따라 순환하여 배출되므로, 열교환판은 외부공기와 내부공기 사이의 보다 안정적인 열교환을 도모하여 내부공기의 신속하고 안정적인 냉각을 도모할 수 있다.In addition, the heat exchange plate has an outwardly projecting rib section formed on both sides of the inwardly projecting rib section in which the inwardly projecting heat dissipating ribs are arranged in the longitudinal direction, and the outwardly projecting inward heat dissipating ribs are arranged in the longitudinal direction. Since the outside air that is circulated and discharged by supplying to the outside air circulation path and the inside air that is circulated and discharged by the inside circulation path are circulated and discharged along the circulating discharge space in a zigzag form, the heat exchange plate provides more stable heat exchange between the outside air and the inside air. In this way, the internal air can be cooled quickly and stably.

도 1과 도 2는 본 발명에 따른 향상된 밀폐성능과 방열효율이 확보된 전자기기 방열장치용 열교환 조립체를 포함하여 구성된 전자기기 방열장치의 전체 구성과 전체적인 작용상태를 보여주는 것이고,
도 3과 도 4는 본 발명에 따른 향상된 밀폐성능과 방열효율이 확보된 전자기기 방열장치용 열교환 조립체의 전체 구성을 보여주는 것이고,
도 5 내지 도 8은 본 발명에 따른 향상된 밀폐성능과 방열효율이 확보된 전자기기 방열장치용 열교환 조립체를 구성하는 열교환판의 세부 구성, 및 조립상태를 보여주는 것이고,
도 9 내지 도 11은 본 발명에 따른 향상된 밀폐성능과 방열효율이 확보된 전자기기 방열장치용 열교환 조립체에 형성된 내기 순환로와, 외기 순환로의 순환작용을 모식적으로 보여주는 것이다.
1 and 2 is a view showing the overall configuration and overall operating state of the electronic device heat dissipation device including the heat exchange assembly for the electronic device heat dissipation device ensured improved sealing performance and heat dissipation efficiency according to the present invention,
3 and 4 show the overall configuration of the heat exchange assembly for the heat dissipation device of the electronic device ensured improved sealing performance and heat dissipation efficiency according to the present invention,
5 to 8 show the detailed configuration, and the assembled state of the heat exchanger plate constituting the heat exchange assembly for the heat dissipation device of the electronic device with improved sealing performance and heat dissipation efficiency according to the present invention,
9 to 11 schematically show the circulation action between the internal air circulation path and the internal air circulation path formed in the heat exchange assembly for the electronic device heat dissipation device ensured improved sealing performance and heat radiation efficiency according to the present invention.

이하, 첨부된 도면을 참조하여 본 발명에서 바람직한 실시예로 제안하고 있는 향상된 밀폐성능과 방열효율이 확보된 전자기기 방열장치용 열교환 조립체를 상세히 설명하기로 한다.Hereinafter, with reference to the accompanying drawings it will be described in detail the heat exchange assembly for an electronic device heat dissipation device which is an improved sealing performance and heat dissipation efficiency is proposed as a preferred embodiment in the present invention.

도 1과 도 2는 본 발명에 따른 향상된 밀폐성능과 방열효율이 확보된 전자기기 방열장치용 열교환 조립체를 포함하여 구성된 전자기기 방열장치의 전체 구성과 전체적인 작용상태를 보여주는 것이고, 도 3과 도 4는 본 발명에 따른 향상된 밀폐성능과 방열효율이 확보된 전자기기 방열장치용 열교환 조립체의 전체 구성을 보여주는 것이고, 도 5 내지 도 8은 본 발명에 따른 향상된 밀폐성능과 방열효율이 확보된 전자기기 방열장치용 열교환 조립체를 구성하는 열교환판의 세부 구성, 및 조립상태를 보여주는 것이고, 도 9 내지 도 11은 본 발명에 따른 향상된 밀폐성능과 방열효율이 확보된 전자기기 방열장치용 열교환 조립체에 형성된 내기 순환로와, 외기 순환로의 순환작용을 모식적으로 보여주는 것이다.1 and 2 is a view showing the overall configuration and overall operating state of the electronic device heat dissipation device including the heat exchange assembly for the electronic device heat dissipation device ensured improved sealing performance and heat dissipation efficiency according to the present invention, Figures 3 and 4 Shows the overall configuration of the heat exchange assembly for the electronic device heat dissipation device is ensured improved sealing performance and heat dissipation efficiency according to the present invention, Figures 5 to 8 is a heat dissipation of the electronic device ensured improved sealing performance and heat dissipation efficiency according to the present invention 9 shows the detailed configuration of the heat exchanger plate constituting the heat exchange assembly for the device, and the assembled state, and FIGS. 9 to 11 show a bet circulation path formed in the heat exchange assembly for the heat dissipation device of the electronic device having improved sealing performance and heat dissipation efficiency according to the present invention. And, to show the circulation of the open air circulation typically.

본 발명에 따른 향상된 밀폐성능과 방열효율이 확보된 전자기기 방열장치용 열교환 조립체(100)는, 도 1 과 도 2에서 보는 바와 같이 전자기기 방열장치(1) 내에 설치되어 외부공기와 전자기기의 내부공기를 밀폐된 상태로 열교환하여서, 전자기기의 내부공기를 냉각하는 열교환 수단이다.The heat exchange assembly 100 for an electronic device heat dissipation device having an improved sealing performance and heat dissipation efficiency according to the present invention is installed in the electronic device heat dissipation device 1 as shown in FIGS. 1 and 2. Heat exchange means for cooling internal air of an electronic device by exchanging internal air in a sealed state.

상기 전자기기 방열장치(1)는, 외면에 외기 유입구(11)와 외기 배출구(12)가 이격하여 형성되고, 내면에 내기 유입구(13)와 내기 배출구(14)가 이격하여 형성된 중공 케이스(10)를 포함한다.The electronic device heat dissipation device 1 has an outer air inlet 11 and an outer air outlet 12 spaced apart from each other, and an inner air inlet 13 and an air outlet 14 spaced apart from each other in a hollow case 10. ).

그리고, 상기 외기 유입구(11)에는 외부 공기를 수납공간(10a) 내로 강제 유입하는 외기팬 유닛(20)이 배치되고, 내부 유입구(13)에는 내부공기를 수납공간(10a) 내로 강제 유입하는 내기팬 유닛(30)이 배치된다.In addition, the outside air inlet 11 is provided with an outside air fan unit 20 for forcibly introducing outside air into the storage space 10a, and the inside inlet 13 is a bet for forcing internal air into the storage space 10a. The fan unit 30 is disposed.

본 발명에서 바람직한 실시예로 제안하고 있는 열교환 조립체(100)는, 상기 수납 케이스(10)의 수납공간(10a) 내에 수납되어, 외기 유입구(11)를 통해 급기되는 외부공기를 순환시켜 외기 배출구(12)를 통해 배기하고, 내기 유입구(13)를 통해 급기되는 내부공기를 순환시켜 내기 배출구(14)를 통해 배기하여서, 이들 외부공기와 내부공기 사이의 열교환을 도모하여 내부공기를 냉각한다.The heat exchange assembly 100 proposed as a preferred embodiment in the present invention is accommodated in the storage space 10a of the storage case 10, and circulates the external air supplied through the outside air inlet port 11 to the outside air outlet port ( 12), the internal air supplied through the internal air inlet 13 is circulated and exhausted through the internal air discharge port 14, so as to exchange heat between these external air and the internal air to cool the internal air.

한편, 본 실시예에 따른 열교환 조립체(100)는, 도 3 내지 도 8에서 보는 바와 같이 복수의 열교환판(110)들이 적층되게 조립되어, 급기된 외부공기의 순환 배출공간을 제공하는 외기 순환로(101)와, 급기된 내부공기의 순환 배출공간을 제공하는 내기 순환로(102)가 교번하여 형성된 적층 조립체로 구성된다.On the other hand, the heat exchange assembly 100 according to the present embodiment, as shown in Figures 3 to 8, the plurality of heat exchange plates 110 are assembled to be stacked, the outdoor air circulation path for providing a circulating discharge space of the supplied outside air ( 101 and a stack assembly formed alternately with a bet circulation path 102 that provides a circulation discharge space of the supplied internal air.

본 발명에서는 상기 열교환 조립체(100)를 구성하는 열교환판(110)들의 구조와 조립구조를 개량하여, 이들 열교환판(110)들의 정형화된 조립을 통해 외기 순환로(101)와 내기 순환로(102) 사이의 안정된 밀폐성을 확보하고, 또 외기 순환로(101)와 내기 순환로(102)를 따라 이동하는 외부공기와 내부공기의 독특한 순환 기류를 형성하여 내부공기와 외부공기 사이의 향상된 열교환 효율을 확보하고 있으며, 이를 본원의 기술적 특징으로 예정한다.In the present invention, by improving the structure and the assembly structure of the heat exchange plate 110 constituting the heat exchange assembly 100, between the air circulation path 101 and the internal air circulation path 102 through the standard assembly of these heat exchange plate (110) To ensure stable sealing of the air and also to form a unique circulation air flow of the outside air and the internal air moving along the outdoor air circulation path 101 and the internal air circulation path 102 to ensure improved heat exchange efficiency between the internal air and the outside air, This is intended as a technical feature of the present application.

본 실시예에서는 상기 열교환 조립체(100)를 구성하는 열교환판(110)들은 열전도률이 높은 금속판재로 구성된다.In the present embodiment, the heat exchange plates 110 constituting the heat exchange assembly 100 are made of a metal plate having a high thermal conductivity.

본 실시예에서는 도 5 내지 도 7에서 보는 바와 같이 상기 열교환판(110)을 직교하는 제 1 변(111a-a)과 제 2 변(111a-b)은 외향 절곡된 개방 날개편(111a)을 형성하고, 제 1 변(111a-a)과 평행하는 제 3 변(111b-a)과 상기 제 3 변(111b-a)과 직교하며 제 2 변(111a-b)과 평행하는 제 4 변(111b-b)은 내향 절곡된 밀폐 날개편(111b)을 형성한 사각의 금속판재로 구성한다.In the present embodiment, as shown in FIGS. 5 to 7, the first side 111a-a and the second side 111a-b orthogonal to the heat exchange plate 110 may have the open blade pieces 111a bent outward. And a fourth side 111b-a parallel to the first side 111a-a and a fourth side perpendicular to the third side 111b-a and parallel to the second side 111a-b. 111b-b) consists of a square metal plate formed with the sealing wing piece 111b bent inwardly.

이러한 개방 날개변(111a)과 밀폐 날개변(111b)이 형성된 열교환판(110)은, 절삭가공이나 커팅가공을 통해 제작이 가능하지만, 본 실시예에서는 대량 생산이 가능한 프레스 가공을 통해 성형하고 있다.The heat exchanger plate 110 having the open wing side 111a and the closed wing side 111b formed therein may be manufactured by cutting or cutting, but in the present embodiment, the heat exchanger plate 111 is formed through press working, which is capable of mass production. .

따라서, 상기 열교환판(110)들은 밀폐 날개편(111b)을 상호 마주하여 밀착된 상태로 적층하여 조립되어, 일편과 외측이 'ㄱ'자의 개방부(101a)를 형성한 외기 순환로(101)와, 타편과 내측이 'ㄴ'형의 개방부(102a)을 형성한 내기 순환로(102)가 교번하여 형성된 적층 구조체를 형성하며, 이들 외기 순환로(101)와 내기 순환로(102)는 상호 내접된 밀폐 날개변(111b)들로 이루어진 밀폐부(101b, 102b)에 의해 상호 밀폐된 상태를 형성하도록 구성된다.Accordingly, the heat exchange plates 110 are assembled by stacking the airtight blade pieces 111b in close contact with each other, and the outside air circulation path 101 having one side and an outer side forming an open portion 101a of the 'a' and In addition, the other side and the inner side is formed with a laminated structure formed by alternating the bet circulation circuit 102 formed the 'b' type opening portion 102a, these outdoor air circulation path 101 and the bet circulation circuit 102 is in a sealed internally mutually It is configured to form a state of being mutually closed by the closing portion (101b, 102b) consisting of the wing edge (111b).

즉, 본 발명에서는 독특한 형태의 개방 날개편(111a)과 밀폐 날개편(111b)을 갖는 동일한 형상과 규격으로 제작된 열교환판(110)들을 상하 마주보게 조립하여, 일편과 외측이 'ㄱ'자의 개방부(101a)을 형성한 외기 순환로(101)와, 타편과 내측이 'ㄴ'형의 개방부(101b)를 형성한 내기 순환로(102)가 교번하여 형성된 열교환 조립체를 형성한다.That is, in the present invention, by assembling the heat exchanger plate 110 made of the same shape and standard having the open wing piece 111a and the closed wing piece 111b of a unique shape to face up and down, one side and the outside of the 'B' The outside air circulation path 101 which forms the opening part 101a, and the inside air circulation path 102 which formed the open part 101b of the "b" type inside and the other side form the heat exchange assembly formed alternately.

그리고, 본 실시예에서는 상기 외기 순환로(101)와 내기 순환로(102)를 구획하는 밀폐부(101b, 102b)의 안정적인 형성을 도모하기 위해, 교번하여 적층된 열교환판(110)들은 관통하는 압착볼트(120)에 의해 압착되어서, 밀폐부(101b, 102b)를 구성하는 밀폐 날개편(111b)들 사이의 긴밀한 밀착상태가 형성된 적층 조립체를 형성한다.In addition, in the present embodiment, in order to achieve stable formation of the sealing parts 101b and 102b that divide the outside air circulation path 101 and the inside air circulation path 102, the alternately stacked heat exchanger plates 110 are compressed through the compression bolts. It is crimped | bonded by 120, and forms the laminated assembly by which the close contact state between the sealing blade pieces 111b which comprise the sealing part 101b, 102b was formed.

따라서, 상기 내기 유입구(13)를 통해 유입된 내부공기는 내기 순환로(102)의 일측으로 급기되어 내기 순환로(102)를 순환한 다음, 내면에 형성된 내기 배출구(14)를 통해 전자기기 내로 재공급된다.Therefore, the internal air introduced through the internal air inlet 13 is supplied to one side of the internal air circulation path 102 to circulate the internal air circulation path 102, and then re-supplied into the electronic device through the internal air outlet 14 formed in the inner surface. do.

그리고, 상기 외기 유입구(11)를 통해 유입된 외부공기는 외기 순환로(101)의 일측으로 급기되어 외기 순환로(101)를 순환한 다음, 외면에 형성된 외기 배출구(12)를 통해 외부로 배출된다.In addition, the outside air introduced through the outside air inlet 11 is supplied to one side of the outside air circulation path 101 to circulate the outside air circulation path 101, and then discharged to the outside through the outside air outlet 12 formed on the outer surface.

이러한 과정에, 각 열교환판(110)들은 외기 순환로(101)를 따라 순환 배출되는 외부공기에 의해 냉각되고, 냉각된 열교환판(110)들은 내기 순환로(102)를 따라 순환 배출되는 내부공기를 냉각시켜서, 전자기기 내에 잔류된 내부공기의 냉각을 도모한다.In this process, each heat exchange plate 110 is cooled by external air circulated and discharged along the outdoor air circulation path 101, and the cooled heat exchange plate 110 cools the internal air circulated and discharged along the internal air circulation path 102. By doing so, the internal air remaining in the electronic device is cooled.

보다 바람직하게는, 도 6b와 같이 상기 외기 순환로(102)와 내기 순환로(102) 내에 복수의 순환 유도공(141)이 형성된 순환 유도판(140)을 더 배치한다.More preferably, as illustrated in FIG. 6B, a circulation guide plate 140 having a plurality of circulation guide holes 141 is further disposed in the outside air circulation path 102 and the inside air circulation path 102.

상기 순환 유도판(140)에 형성된 순환 유도공(141)들은 버링가공을 통해 일측과 타측으로 돌출된 관상형태로 이루어져, 외기 순환로(101)와 내기 순환로(102)를 따라 순환 이동하는 외부공기와 내부공기는 관상의 순환 유도공(141)을 통해 외기 순환로(102)와 내기 순환로(102) 내에서 내외측으로 순환하면서 배출된다.The circulating induction hole 141 formed in the circulating guide plate 140 is formed in a tubular shape protruding to one side and the other side through a burring process, and circulates and moves along the outside air circulation path 101 and the internal air circulation path 102. The air is discharged while circulating in and out in the outside air circulation path 102 and the inside air circulation path 102 through the tubular circulation induction hole 141.

따라서, 상기 외부공기와 내부공기는 외기 순환로(101)와 내기 순환로(102) 내에서 채류 시간의 증대되고, 결과적으로 열교환판(110)과 외기공기 사이, 그리고 열교환판(101)과 내부공기 사이의 보다 향상된 열교환 상태가 확보되어서, 내부공기의 보다 안정적인 냉각을 도모한다.Therefore, the outside air and the internal air are increased in the holding time in the outside air circulation path 101 and the internal air circulation path 102, and consequently between the heat exchange plate 110 and the outside air, and between the heat exchange plate 101 and the internal air A more improved heat exchange state is ensured, which leads to more stable cooling of the internal air.

특히, 본 발명에서는 상기 압착볼트(120)를 통해 적층된 열교환판(110)들을 압착하여 조립함에 있어, 각 밀폐부(101b, 102b)들은 안정된 밀착 상태를 형성하여 향상된 기밀성이 확보되고, 또 각 개방부(101a, 102a)들은 정형화된 개방공간을 확보하여서 안정된 외부공기, 또는 내부공기의 안정적인 순환 배출이 가능하도록 한다.Particularly, in the present invention, in compressing and assembling the heat exchange plates 110 stacked through the compression bolts 120, each of the sealing parts 101b and 102b forms a stable close state to ensure improved airtightness. The openings 101a and 102a secure a standard open space to enable stable circulation of outside air or internal air.

이를 위해, 본 실시예에서는 도 5 내지 도 8에서 보는 바와 같이 상기 개방부(101a, 102a) 측에는 내향 돌출형 중공림(112)이 마주하여 형성되고, 밀폐부(101b, 102b) 측에는 외향 돌출형 중공림(113)이 마주하여 형성되는 한편, 상기 적층된 열교환판(110)들은 중공림(112, 113)들을 순차적으로 관통하는 압착볼트(120)에 의해 상호 압착하여 밀폐되도록 구성한다.To this end, in this embodiment, as shown in Figures 5 to 8, the inwardly projecting hollow forest 112 is formed facing the opening portion (101a, 102a) side, the outwardly projecting type on the sealing portion (101b, 102b) side While the hollow rim 113 is formed to face each other, the stacked heat exchange plates 110 are configured to be compressed by each other by a compression bolt 120 that sequentially passes through the hollow rims 112 and 113.

즉, 상기 열교환판(110)에서 내향 돌출형 중공림(112)은 개방 날개편(111a)이 형성된 제 1 변측(111a-a)에 편중하여 형성되고, 외향 돌출형 중공림(113)은 밀폐 날개편(111b)이 형성된 제 3 변측(111b-a)에 편중하여 형성된다.That is, the inwardly projecting hollow forest 112 in the heat exchange plate 110 is formed to be biased on the first side 111a-a on which the open wing piece 111a is formed, and the outwardly projecting hollow forest 113 is closed. The blade piece 111b is formed to be biased toward the third side 111b-a.

따라서, 상기 개방부(101a, 102a)는 내향 돌출형 중공림(112)을 통해 직접 지지되어 설정 간격이 유지되고, 밀폐부(101b, 102b)은 외향 돌출형 중공림(113)의 탄성 압착에 의해 긴밀히 밀착되도록 구성한다.Therefore, the openings 101a and 102a are directly supported by the inwardly projecting hollow forest 112 to maintain a set interval, and the sealing portions 101b and 102b are elastically compressed to the outwardly projecting hollow forest 113. It is configured to be in close contact with each other.

즉, 상기 내향 돌출형 중공림(112)은 마주하는 열교환판(110) 사이를 지지하는 지지대의 기능을 수행하고, 외향 돌출형 중공림(113)은 탄성 압착기능을 수행하는 긴요한 구성요소이다.That is, the inwardly projecting hollow forest 112 performs the function of supporting the support between the facing heat exchange plate 110, the outwardly projecting hollow forest 113 is an essential component to perform the elastic crimping function. .

이와 같이 구성하면, 상기 압착볼트(120)를 통해 적층된 열교환판(110)들을 조임하여 압착하더라도 적층 조립된 열교환판(110)들은 밀폐부(101b, 102b)를 보다 긴밀히 밀착하여 외기 순환로(101)와 내기 순환로(102) 사이의 안정적인 밀폐성을 확보한다.When configured in this way, even if the heat exchange plate 110 is tightened by pressing the compression bolt 120, the laminated heat exchange plate 110 is in close contact with the closed portion (101b, 102b) more closely to the outside air circulation path 101 And a stable sealing between the bet circulation path 102.

그리고, 상기 개방부(101a, 102a) 측은 함몰되지 아니하고 내향 돌출된 중공림(112)에 의해 설정간격을 유지하면서 상호 지지되어서, 외부공기와 내부공기의 안정적인 순환 배출 경로를 제공할 수 있다.In addition, the opening portions 101a and 102a may be mutually supported while not being recessed and maintained by the hollow forest 112 protruding inwardly, thereby providing a stable circulation discharge path between the outside air and the inside air.

또한, 상기 상호 밀착된 각 밀폐부(101b, 102b), 및 각 열교환판(110)에 형성된 중공리브(112, 113)와 압착볼트(120) 사이에는 실링재가 주입 및 고착되어서, 고착된 실링재에 의해 형성된 실링층(미도시)에 의해 보다 안정된 밀폐성이 확보되도록 구성하는 것이 바람직하다.In addition, a sealing material is injected and adhered between the sealing parts 101b and 102b and the hollow ribs 112 and 113 and the compression bolt 120 formed on the heat exchange plate 110. It is preferable to configure so that a more stable sealing property is ensured by the sealing layer formed by this.

이와 같이 구성된 열교환 조립체(100)는, 외기 유입구(11)를 통해 유입된 외부공기는 외부 순환로(101)를 통해서 순환한 다음 외기 배출구(12)를 통해 외부로 배출되고, 내기 유입구(12)를 통해 유입된 내부공기는 내기 배출구(14)를 통해 전자기기 내부로 배출된다.The heat exchange assembly 100 configured as described above, the outside air introduced through the outside air inlet 11 is circulated through the external circulation path 101 and then discharged to the outside through the outside air outlet 12, and the inside air inlet 12 The internal air introduced through is discharged into the electronic device through the internal air outlet 14.

따라서, 상기 열교환 조립체(100)는 밀폐부(101a, 102a)에 의해 정형화된 외기 순환로(101)와 내기 순환로(102)가 각각 형성된 관계로, 외기 순환로(101)를 통해 순환하는 외부공기가 내기 순환로(102)로 유입되어 전자기기 내부가 외부공기에 잔류된 오일 미스트 등의 오염물질에 의해 오염되는 현상이 안정되게 차단될 수 있다.Accordingly, in the heat exchange assembly 100, external air circulating through the external air circulation path 101 is formed due to the external air circulation path 101 and the internal air circulation path 102 formed by the closed parts 101a and 102a, respectively. The phenomenon of contamination by contaminants such as oil mist remaining in external air introduced into the circulation path 102 and remaining in external air may be stably blocked.

또한, 본 발명에서는 도 5 내지 도 8에서 보는 바와 같이 상기 적층된 열교환판(110)들 사이에 형성된 외기 순환로(101)와 내기 순환로(102)에 독특한 와류 형성구조를 형성하여서, 도 9 내지 도 11에서 보는 바와 같이 외기 순환로(101)를 따라 순환하여 배출되는 외부공기와, 내부 순환로(102)를 따라 순환하여 배출되는 내부공기는, 열교환판(110)들의 내벽에 형성된 입체적인 순환 배출경로(101c, 102c)에 의해 순환 배출되어 향상된 열교환 성능이 발휘되도록 한다.In addition, in the present invention, as shown in Figures 5 to 8 to form a unique vortex forming structure in the outdoor air circulation path 101 and the internal air circulation path 102 formed between the laminated heat exchange plate 110, 9 to FIG. As shown in FIG. 11, the external air circulated through the external air circulation path 101 and the internal air circulated through the internal circulation path 102 are discharged in three-dimensional circulation discharge path 101c formed on the inner walls of the heat exchange plates 110. , 102c) is circulated and discharged to achieve improved heat exchange performance.

이를 위해, 본 실시예에서는 상기 열교환판(110)의 중앙부에 내향 돌출형 방열리브(114a)들이 길이방향으로 정렬된 내향 돌출 리브구간(114)의 양편에, 외향 돌출형 방열리브(115a)들이 길이방향으로 정렬하여 형성된 외향 돌출 리브구간(115)을 각각 형성한다.To this end, in the present embodiment, the outwardly projecting heat dissipation ribs 115a are formed at both sides of the inwardly projecting heat dissipation ribs 114a in which the inwardly projecting heat dissipation ribs 114a are aligned in the longitudinal direction. The outwardly protruding rib sections 115 formed in alignment in the longitudinal direction are respectively formed.

이때, 상기 내향 돌출 리브구간(114)을 형성하는 내향 돌출형 방열리브(114a)들과, 외향 돌출 리브구간(115)을 형성하는 외향 방열리브(115a)들은 지그재그 형태를 형성한다.In this case, the inwardly projecting heat dissipation ribs 114a that form the inwardly projecting rib sections 114 and the outwardly of heat dissipation ribs 115a that form the outwardly projecting rib sections 115 form a zigzag shape.

따라서, 이와 같이 구성된 이를 적층하여 형성된 적층 조립체의 외기 순환로(101)의 내벽과 내기 순환로(102)의 내벽에는, 내향 돌출 리브구간(114)으로 이루어진 내향 순환 공간의 양편에 외향 돌출 리브구간으로 이루어진 외향 순환 공간이 각각 형성된다.Therefore, the inner wall of the outer air circulation path 101 and the inner wall of the inner air circulation path 102 of the stack assembly formed by stacking the above-described structure are formed with outwardly projecting rib sections on both sides of the inward circulation space composed of the inwardly projecting rib sections 114. Outwardly circulating spaces are formed respectively.

그리고, 상기 외기 순환로(101)의 내벽, 그리고 내기 순환로(102)의 내벽에는 내향 돌출 리브구간(114)과 외향 돌출 리브구간(115)으로 이루어진 지그재그 형태의 순환 배출경로가 각각 형성된다.In addition, a zigzag circulating discharge path including an inwardly projecting rib section 114 and an outwardly projecting rib section 115 is formed on an inner wall of the outer air circulation path 101 and an inner wall of the inner air circulation path 102, respectively.

따라서, 도 9 내지 도 11에서 보는 바와 같이 상기 외기 순환로(101)에 급기하여 순환 배출되는 외부공기와, 내부 순환로(102)에 급기하여 순환 배출되는 내부공기는 지그재그 형태의 순환 배출공간을 따라 입체적이면서 지그재그 형태로 순환 배출된다.Accordingly, as shown in FIGS. 9 to 11, external air circulated and discharged by supplying air to the external air circulation path 101 and internal air circulated and discharged by air supply to the internal circulation path 102 are three-dimensional along a zigzag-shaped circulation discharge space. At the same time, it is circulated and discharged in a zigzag form.

그리하여, 상기 외기 순환로(101)를 따라 순환 배출되는 외부공기와 열교환판(110) 사이, 그리고 내기 순환로(102)를 따라 순환 배출되는 내부공기와 열교환판(110) 사이는 열교환 면적과 열교환 시간이 증대되고, 결과적으로 외부공기와 열교환판(110)들 사이, 내부공기와 열교환판(110)들 사이의 향상된 열교환 성능이 확보되어 내부공기의 보다 안정적인 냉각효율이 이룩된다.Thus, the heat exchange area and the heat exchange time between the outside air circulated and discharged along the outside air circulation path 101 and the heat exchange plate 110, and between the inside air and the heat exchange plate 110 circulated and discharged along the inside air circulation path 102 are different. As a result, improved heat exchange performance between the outside air and the heat exchange plate 110 and between the inside air and the heat exchange plate 110 is ensured, thereby achieving more stable cooling efficiency of the inside air.

1. 전자기기용 방열장치
10. 수납 케이스 10a. 수납공간
11. 외기 유입구 12. 외기 배출구
13. 내기 유입구 14. 내기 배출구
20. 외기팬 유닛 30. 내기팬 유닛
40. 차폐패드 100. 전자기기 방열장치용 열교환 조립체
101. 외기 순환로 101a. 'ㄱ'자형 개방부
101b. 'ㄴ'자형 밀폐부 101c. 순환 배출경로
102. 내기 순환로 102a. 'ㄴ'자형 개방부
102b. 'ㄴ'자형 밀폐부 102c. 순환 배출경로
110. 방열편
111a. 개방 날개편 111a-a. 제 1변
111a-b. 제 2변 111b. 밀폐 날개편
111b-a. 제 3변 111b-b. 제 4변
112. 내향 돌출형 중공리브 113. 외향 돌출형 중공리브
114. 내향 방열리브 구간 114a. 내향 돌출형 방열리브
115. 외향 방열리브 구간 115a. 외향 방열리브
120. 압착볼트 130. 차폐가드
140. 순환 유도판 141. 순환 유도공
1. Radiator for electronic devices
10. Storage case 10a. Storage space
11. Outside air inlet 12. Outside air outlet
13. Bet Inlet 14. Bet Outlet
20. Fan unit 30. Fan unit
40. Shield pad 100. Heat exchanger assembly for electronic device heat dissipation
101. Open air circulation 101a. 'ㄱ' shaped opening
101b. 'B' shaped seal 101c. Circulation discharge path
102. Bet loop 102a. 'B' shaped opening
102b. 'B' shaped seal 102c. Circulation discharge path
110. Heat Sink
111a. Open wing 111a-a. The first side
111a-b. Second side 111b. Airtight wing
111b-a. Third side 111b-b. Fourth side
112. Outwardly protruding hollow ribs 113. Outwardly protruding hollow ribs
114. Inwardly radiating rib section 114a. Inwardly projecting heat dissipation rib
115. Outwardly radiating rib section 115a. Outward heat dissipation rib
120. Crimping bolt 130. Shielding guard
140. Circulation guide plate 141. Circulation guide hole

Claims (6)

외기 유입구를 통해 강제 유입되는 외부공기와, 내기 유입구를 통해 강제 유입되는 내부공기를 상호 차폐되게 열교환하는 전자기기 방열장치용 열교환 조립체에 있어서,
상기 열교환 조립체는, 복수의 열교환판들이 적층하여 조립된 적층 조립체로 구성되고,
상기 열교환판은, 직교하는 제 1 변과 제 2 변은 외향 절곡된 개방 날개편을 형성하고, 제 1 변과 평행하는 제 3 변과 제 3 변과 직교하며 제 2 변과 평행하는 제 4 변은 내향 절곡된 밀폐 날개편을 형성한 사각의 금속판재로 구성되고,
상기 열교환판들은, 밀폐 날개편을 상호 내접되게 적층 조립하여, 일편과 외측에 'ㄱ'자의 개방부를 형성한 외기 순환로와, 타편과 내측에 'ㄴ'형의 개방부를 형성한 내기 순환로를 교번하여 형성한 적층 조립체를 형성하도록 구성된 것을 특징으로 하는 향상된 밀폐성능과 방열효율이 확보된 전자기기 방열장치용 열교환 조립체.
In the heat exchange assembly for an electronic device heat dissipating device for heat-exchanging heat shielding the outside air forced through the outside air inlet and the internal air forced through the inside inlet,
The heat exchange assembly is composed of a stack assembly in which a plurality of heat exchange plates are stacked and assembled.
The heat exchange plate has a first side and a second side that are orthogonal to form an open blade piece that is bent outwardly, and a third side that is parallel to the first side and a fourth side that is orthogonal to the third side and parallel to the second side. Is composed of a square metal plate formed inwardly bent sealed wing piece,
The heat exchange plates alternately assemble the sealed wing pieces to be inscribed with each other, alternating an outdoor air circulation path having an 'a' opening on one side and an outer side, and an internal air circulation path having an 'b' shaped opening on the other side and the inside. A heat exchange assembly for an electronic heat dissipation device having improved sealing performance and heat dissipation efficiency, which is configured to form a formed laminated assembly.
제 1항에 있어서, 상기 적층하여 조립된 열교환판들은, 관통하는 압착볼트에 의해 상호 압착하여, 마주하는 밀폐 날개편들을 내접되게 적층하여 조립된 것을 특징으로 하는 향상된 밀폐성능과 방열효율이 확보된 전자기기 방열장치용 열교환 조립체.The method of claim 1, wherein the laminated heat exchange plate is compressed by mutually compressed through the compression bolts, the improved sealing performance and heat dissipation efficiency is ensured, characterized in that assembled by inlay laminated to each other Heat exchange assembly for electronic heat dissipation device. 제 2항에 있어서, 상기 상호 내접된 각 밀폐 날개편 사이와, 각 열교환판과 압착볼트 사이에는 실링재가 주입 및 고착된 실링층이 더 형성된 것을 특징으로 하는 향상된 밀폐성능과 방열효율이 확보된 전자기기 방열장치용 열교환 조립체.3. The electron of claim 2, wherein a sealing layer in which a sealing material is injected and fixed is further formed between each of the sealing blade pieces inscribed to each other and between each of the heat exchange plates and the compression bolts. Heat exchange assembly for appliance heatsink. 제 1항에 있어서, 상기 각 열교환판에는 내향 돌출된 내향 방열리브들이 길이방향으로 정렬된 내향 돌출 리브구간의 양편에, 외향 돌출된 내향 방열리브들이 길이방향으로 정렬하여 형성된 외향 돌출 리브구간이 각각 형성된 것을 특징으로 하는 향상된 밀폐성능과 방열효율이 확보된 전자기기 방열장치용 열교환 조립체.According to claim 1, wherein each of the heat exchange plate is inwardly projecting rib section formed by aligning the inwardly projecting ribs longitudinally aligned inwardly inwardly radiating ribs in the longitudinal direction, the outwardly projecting ribs in the longitudinal direction, respectively Heat exchange assembly for electronic device heat dissipation device is characterized in that the improved sealing performance and heat dissipation efficiency secured. 제 4항에 있어서, 상기 내향 돌출 리브구간을 형성하는 내향 방열리브들과, 외향 돌출 리브구간을 형성하는 외향 방열리브들은 지그재그 형태로 형성되어, 상기 외기 순환로와 내기 순환로에 지그재그 형태의 순환 배출공간을 형성한 것을 특징으로 하는 향상된 밀폐성능과 방열효율이 확보된 전자기기 방열장치용 열교환 조립체.The inward heat dissipation ribs forming the inwardly projecting rib section and the outward heat dissipation ribs forming the outwardly protruding rib section are formed in a zigzag form, and the circulating discharge space is zigzag in the external air circulation path and the internal air circulation path. Heat exchange assembly for an electronic device heat dissipation device is characterized in that the improved sealing performance and heat dissipation efficiency secured. 제 1항에 있어서, 상기 열교환판들을 적층되게 조립한 적층 조립체의 각 모서리부에는 수납공간의 내벽에 밀착되는 차폐가드가 각각 배치된 것을 특징으로 하는 향상된 밀폐성능과 방열효율이 확보된 전자기기 방열장치용 열교환 조립체.The heat dissipation device of claim 1, wherein shielding guards in close contact with the inner wall of the storage space are disposed at each corner of the stack assembly in which the heat exchange plates are stacked. Heat exchange assembly for the device.
KR1020180119784A 2018-10-08 2018-10-08 A heat exchange assembly for an heat dissipating electronic device having improved sealing performance and thermal efficiency KR102020961B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020180119784A KR102020961B1 (en) 2018-10-08 2018-10-08 A heat exchange assembly for an heat dissipating electronic device having improved sealing performance and thermal efficiency

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020180119784A KR102020961B1 (en) 2018-10-08 2018-10-08 A heat exchange assembly for an heat dissipating electronic device having improved sealing performance and thermal efficiency

Publications (1)

Publication Number Publication Date
KR102020961B1 true KR102020961B1 (en) 2019-09-11

Family

ID=67949114

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180119784A KR102020961B1 (en) 2018-10-08 2018-10-08 A heat exchange assembly for an heat dissipating electronic device having improved sealing performance and thermal efficiency

Country Status (1)

Country Link
KR (1) KR102020961B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021231939A1 (en) * 2020-05-14 2021-11-18 Lumileds Llc Dual function lighting device

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237357A (en) 2000-02-24 2001-08-31 Sts Kk Heat transfer device with meandering path
US20020134537A1 (en) * 2001-02-07 2002-09-26 Stephen Memory Heat exchanger
KR100552472B1 (en) * 2005-10-17 2006-02-14 삼익기전 주식회사 Cooler for electronic apparatus
KR20060055286A (en) 2004-11-17 2006-05-23 후지쯔 가부시끼가이샤 Cooling device of electronic device
KR20060081602A (en) 2005-01-10 2006-07-13 정인숙 Heat exchanger and heat exchanging ventilator using the same
JP2007042947A (en) 2005-08-04 2007-02-15 Denso Corp Thermoelectric conversion device and manufacturing method thereof
KR101267015B1 (en) 2011-10-26 2013-05-30 히트텍(주) Cooler for electrical and electronic equipment
WO2014147035A1 (en) * 2013-03-18 2014-09-25 Behr Gmbh & Co. Kg Method for producing connected heat exchanger elements
KR101897927B1 (en) * 2017-11-23 2018-09-12 조형석 The plate heat exchanger of welding type for high pressure condition

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237357A (en) 2000-02-24 2001-08-31 Sts Kk Heat transfer device with meandering path
US20020134537A1 (en) * 2001-02-07 2002-09-26 Stephen Memory Heat exchanger
KR20060055286A (en) 2004-11-17 2006-05-23 후지쯔 가부시끼가이샤 Cooling device of electronic device
KR20060081602A (en) 2005-01-10 2006-07-13 정인숙 Heat exchanger and heat exchanging ventilator using the same
JP2007042947A (en) 2005-08-04 2007-02-15 Denso Corp Thermoelectric conversion device and manufacturing method thereof
KR100552472B1 (en) * 2005-10-17 2006-02-14 삼익기전 주식회사 Cooler for electronic apparatus
KR101267015B1 (en) 2011-10-26 2013-05-30 히트텍(주) Cooler for electrical and electronic equipment
WO2014147035A1 (en) * 2013-03-18 2014-09-25 Behr Gmbh & Co. Kg Method for producing connected heat exchanger elements
KR101897927B1 (en) * 2017-11-23 2018-09-12 조형석 The plate heat exchanger of welding type for high pressure condition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021231939A1 (en) * 2020-05-14 2021-11-18 Lumileds Llc Dual function lighting device

Similar Documents

Publication Publication Date Title
KR100766109B1 (en) A heat radiating apparatus
EP3199007B1 (en) Enclosure for liquid submersion cooled electronics
JP5532623B2 (en) Air conditioner electrical equipment
KR20010000940A (en) Computer having cooling apparatus and heat exchanging device of the cooling apparatus
US20160258636A1 (en) Control box, and outdoor unit of air conditioner comprising same
KR101185567B1 (en) Cooling apparatus using thermoelement module
KR20170057018A (en) Dehumidifying module using thermoeletric element and dehumidifyer having the same
US20170257976A1 (en) Shelf thermostat device and thermostat system
KR102020961B1 (en) A heat exchange assembly for an heat dissipating electronic device having improved sealing performance and thermal efficiency
KR102062778B1 (en) Cooling Apparatus using thermoelectric module
JP2009281696A (en) Condenser
JP2017158413A (en) Sealing container and power conversion device
KR20130085633A (en) Cooling apparatus using thermoelement module
US20220291727A1 (en) Cooling apparatus
CN215412220U (en) Automatically controlled box, outer machine of air conditioner and air conditioner
WO2019150577A1 (en) Outdoor unit and air conditioner
JP2010192211A (en) Battery unit
KR102468783B1 (en) Dehumidifyer
KR20190041305A (en) Outdoor Enclosure for Electric System
JP2018207074A (en) Device including heat generation device
KR101993798B1 (en) Heat exchanger
KR101267015B1 (en) Cooler for electrical and electronic equipment
JP2017112190A (en) Cooler and power converter
KR100552472B1 (en) Cooler for electronic apparatus
JP2017011229A (en) Cooling device

Legal Events

Date Code Title Description
E701 Decision to grant or registration of patent right
GRNT Written decision to grant