KR102018660B1 - Lighting module array - Google Patents

Abstract

The module array according to the embodiment includes at least three light emitting device modules including a light source unit, a body on which a seating part on which the light source unit is seated is formed, and a plurality of heat dissipation fins located on the other surface facing one side of the body. The light emitting device modules may be arranged in a direction parallel to the one surface, and air flow holes may be formed between the light emitting device modules in a direction from the other surface to the other surface.

Description

 Module Array {LIGHTING MODULE ARRAY}

Embodiments relate to a module array and a luminaire comprising the same.

In general, a lot of bulbs or fluorescent lights are used as indoor or outdoor lighting. Such bulbs or fluorescent lamps have a short lifespan and thus require frequent replacement. In addition, the conventional fluorescent lamp may be excessively degraded due to the deterioration occurs as the use time is over.

In order to solve this problem, a light emitting diode (LED) capable of implementing excellent controllability, fast response speed, high electro-optical conversion efficiency, long swimming, low power consumption, high brightness, and sensitive lighting is employed. Various types of lighting modules are being developed.

Light emitting diodes (LEDs) are a type of semiconductor device that converts electrical energy into light. Light emitting diodes have the advantages of low power consumption, semi-permanent life, fast response speed, safety and environmental friendliness compared to conventional light sources such as fluorescent and incandescent lamps. Accordingly, many researches are being conducted to replace the existing light sources with light emitting diodes, and the light emitting diodes have been increasingly used as light sources for lighting devices such as liquid crystal displays, electronic displays, and street lamps that are used indoors and outdoors.

The light emitting device is manufactured in the form of a light emitting device module in order to protect the convenience of assembly, external shock and moisture.

The light emitting device module has a problem in that a high heat is generated because a plurality of light emitting devices are integrated at a high density. In addition, research is underway to effectively release this heat.

The module array and the lighting apparatus according to the embodiment aim to effectively release the heat generated from the light emitting device.

The module array according to the embodiment includes at least three light emitting device modules including a light source unit, a body on which a seating part on which the light source unit is seated is formed, and a plurality of heat dissipation fins located on the other surface facing one side of the body. The light emitting device modules may be arranged in a direction parallel to the one surface, and air flow holes may be formed between the light emitting device modules in a direction from the other surface to the other surface.

Here, the air flow hole may be formed between the bodies of the two light emitting device modules adjacent to each other.

According to the light emitting device module of the embodiment, the inside of the air guide portion and the air hole has a higher temperature than the outside of the light emitting device module, the air in the air guide portion and the air hole is moved to the top under buoyancy, the outside of the light emitting device Since cold air in the lower region of the region is introduced (chimney effect), it is possible to effectively release the heat generated in the light emitting device module.

 In addition, the flow rate of the air passing through the air hole and the air guide portion is faster than the convection caused by general heat, thereby increasing the heat dissipation effect.

In addition, the embodiment may have the effect of cooling using the fan, without using a separate fan.

Using the lighting device of the embodiment, it is possible to effectively cool the heat generated from the light emitting device module due to the chimney effect, it has the effect of reducing the manufacturing cost by not using a separate fan.

In addition, if air flow holes are further formed between the light emitting device modules, a chimney effect occurs due to a temperature difference between the inside and the outside of the air flow holes, thereby promoting air circulation.

The air circulation promoted by the chimney effect cools the light emitting device module more effectively.

By using the slide protrusion and the slide groove, it is possible to improve the convenience of assembly while forming an air flow hole between the light emitting device module.

In addition, the number of light emitting device modules included in the module array can be easily adjusted in consideration of the lighting capacity and the space of the lighting device.

1 is a perspective view of a module array according to an embodiment of the present invention;
2 is a plan view of the module array of FIG. 1;
3 is an exploded perspective view of a light emitting device module according to an embodiment;
4 is a front view of a light emitting device module according to the embodiment;
5 is a side view of a light emitting device module according to an embodiment;
6 is a view showing an air flow rate distribution of a light emitting device module in an embodiment;
7 is a plan view of a module array according to another embodiment of the present invention;
8 is a perspective view of a lighting device including a light emitting device module of the present invention.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various different forms, only the embodiments are to make the disclosure of the present invention complete, and common knowledge in the art It is provided to fully inform the person having the scope of the invention, which is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

In addition, the angle and direction mentioned in the process of demonstrating the structure of an Example are based on what was described in drawing. In the description of the structure constituting an embodiment in the specification, if the reference point and the positional relationship with respect to the angle is not clearly mentioned, reference is made to related drawings.

Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification may be used in a sense that can be commonly understood by those skilled in the art. In addition, the terms defined in the commonly used dictionaries are not ideally or excessively interpreted unless they are specifically defined clearly.

Hereinafter, exemplary embodiments will be described in more detail with reference to the accompanying drawings.

1 is a perspective view of a module array according to an embodiment of the present invention, Figure 2 is a plan view of the module array of Figure 1, Figure 3 is an exploded perspective view of a light emitting device module according to the embodiment, Figure 4 is a light emitting device according to the embodiment 5 is a side view of the light emitting device module according to the embodiment.

In the module array 200 according to the embodiment, at least two light emitting device modules 100 are coupled to each other. Hereinafter, first, the light emitting device module 100 constituting the module array 200 will be described.

3 to 5, the light emitting device module 100 constituting the module array 200 includes a light source unit 110 and a body 120 in which a mounting unit 121 on which a light source unit 110 is mounted is formed. ), It may include a plurality of heat dissipation fins 130 which are located on the other surface facing one surface of the body 120.

In addition, the light emitting device module 100 may include an air hole 122 formed through the body 120 in the direction of the heat dissipation fin 130 from the seating part 121 to allow air to flow.

The light source unit 110 may include all means for generating light.

For example, the light source unit 110 is disposed on the substrate 112 and the substrate 112, and includes a light emitting element 111 electrically connected to the substrate 112.

The substrate 112 is disposed on one surface of the body 120. The substrate 112 has a rectangular plate shape corresponding to one surface of the body 120, but is not limited thereto. For example, it may be a variety of shapes such as polygonal shape, elliptic shape.

The substrate 112 may be a circuit pattern printed on an insulator, and may be, for example, a general printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, or the like. have.

Here, the light source unit 110 may be a chip on board (COB) that can directly bond the LED chip not packaged on the printed circuit board. COB may include a ceramic material to secure heat resistance and insulation against heat.

The upper surface of the substrate 112 may be coated with a material that can reflect light efficiently. For example, the top surface of the substrate 112 may be coated with a white or silver material.

One or more light emitting devices 111 may be disposed. In addition, when the plurality of light emitting elements 111 are disposed, each light emitting element 111 may emit different colors or may have different color temperatures.

For example, the light source 110 may be positioned on a seating portion 121 formed on one surface of the body 120 of the light source unit 110, and may be supported by the body 120.

The seating part 121 may be formed by recessing one surface of the body 120, and the substrate 112 may have a shape corresponding to the shape of the seating part 121 and may be coupled to the seating part 121.

In detail, a substrate hole 113 communicating with the air hole 122 may be formed in the substrate 112.

The substrate holes 113 are vertically overlapped with the air holes 122 (Y-axis direction) and communicate with each other to provide a space in which air flows.

Here, the vertical meaning does not mean the perfect vertical of the mathematical meaning, but in the engineering sense will mean the vertical including the error.

In this case, the plurality of light emitting elements 111 positioned on the substrate 112 may be disposed to surround the substrate hole 113.

Specifically, the substrate hole 113 may be formed by penetrating the substrate 112 in the Y-axis direction, and the light emitting devices 111 may be disposed to surround the substrate hole 113 in the X-Z axis plane.

A heat dissipation pad 150 may be further included between the substrate 112 and the mounting portion 121 to improve heat transfer.

The heat dissipation pad 150 may include a material having a shape corresponding to the seating part 121, excellent heat transfer, and adhesiveness. For example, the heat radiation pad 150 may be made of a silicon material.

Specifically, the heat radiation pad 150 may have a film shape, and a pad hole 153 may be formed to communicate with the air hole 122.

In addition, the embodiment may further include a plurality of lenses 141 for shielding the light emitting device 111 and refracting the light generated by the light emitting device 111.

The lens 141 diffuses the light generated by the light emitting element 111. The angle of diffusion of light generated by the light emitting device 111 may be determined according to the shape of the lens 141.

For example, the lens 141 may mold the light emitting device 111 in a convex shape.

In detail, the lens 141 may include a material that transmits light.

For example, the lens 141 may be formed of transparent silicone, epoxy, and other resin materials.

In addition, the lens 141 may be disposed to surround the light emitting device 111 so that the light emitting device 111 is isolated from the outside so as to protect the light emitting device 111 from external moisture and impact.

More specifically, for ease of assembly, the lens 141 may be disposed on the lens cover 142 formed to correspond to the substrate 112.

The lens cover 142 may be formed to correspond to the substrate 112, and the lens 141 positioned on the lens cover 142 may be disposed at a position overlapping the light emitting device 111.

In the lens cover 142, a cover hole 143 communicating with the air hole 122 may be formed.

In detail, the cover hole 143 may be formed to penetrate in the vertical direction (Y-axis direction) in the center of the lens cover 142.

The body 120 provides a place where the light source unit 110 is seated, and transfers heat generated from the light source unit 110 to the heat dissipation fin 130.

In order to increase the heat transfer efficiency, the body 120 may be formed of a metal or resin material having excellent heat dissipation efficiency, but is not limited thereto.

For example, the material of the body 120 may include at least one of aluminum (Al), nickel (Ni), copper (Cu), silver (Ag), and tin (Sn). In addition, the body 120 is made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), liquid crystal polymer (PSG, photo sensitive glass), polyamide 9T (PA9T), neogeotactic polystyrene (SPS), a metal material, sapphire (Al2O3), beryllium oxide (BeO), may be formed of at least one of a ceramic. The body 120 may be formed by injection molding, an etching process, or the like, but is not limited thereto.

In detail, the body 120 may include a seating part 121 in which the light source unit 110 is seated on one surface thereof, and a plurality of heat dissipation fins 130 may be positioned on the other surface of the body 120.

The body 120 may have a plate shape, and the plane (X-Z axis plane) shape may be quadrangular.

The seating part 121 may be formed by being recessed inwardly of the body 120 in a shape corresponding to the substrate 112 on one surface (for example, an upper surface) of the body 120.

When coupled to a lighting device or the like, a corner of the body 120 may be formed with a screw hole 126 through which the screw penetrates.

In particular, referring to Figure 4, the heat radiation fin 130 may have a shape for maximizing the area in contact with the air.

In detail, the heat dissipation fins 130 may have a plurality of plate shapes that extend from the other surface (eg, the lower surface) of the body 120 in the lower direction (the opposite direction of the Y axis).

More specifically, the heat dissipation fin 130 may be arranged in a plurality with a constant pitch, the width of the heat dissipation fin 130 is formed to be the same as the width of the body 120, so that the heat of the body 120 can be effectively transmitted Can be.

It may be integrally molded with the body 120 of the heat dissipation fin 130, or may be manufactured as a separate component.

The heat dissipation fin 130 may include at least one of a material having excellent heat transfer, for example, aluminum (Al), nickel (Ni), copper (Cu), silver (Ag), and tin (Sn).

4 and 5, the heat dissipation fins 130 are disposed long in the width direction (X-axis direction) of the body 120 and have a constant pitch in the length (Z-axis direction) direction of the body 120. Can be installed.

 The central portion 131 of the heat dissipation fin 130 may be recessed toward the body 120 rather than both ends 133 of the heat dissipation fin 130.

Since the light emitting device 111 is positioned to vertically overlap both ends 133 of the heat dissipation fin 130, both ends 133 of the heat dissipation fin 130 are formed higher than the central portion 131 of the heat dissipation fin 130, thereby contacting the air. Increasing the area, the central portion 131 of the heat dissipation fin 130 is formed to reduce the manufacturing cost.

Again, referring to FIGS. 1 and 3, the air hole 122 is formed through the body 120 in the direction of the heat dissipation fin 130 (Y-axis direction) from the seating portion 121, and a space in which air flows. to provide.

The air hole 122 may be formed long in the longitudinal direction of the body 120 in the central portion of the body 120.

The air hole 122 vertically overlaps the substrate hole 113 formed in the substrate 112, the cover hole 143 formed in the lens cover 142, and the pad hole 153 formed in the heat radiation pad 150. It may be formed in communication.

The air hole 122 circulates the air by the temperature difference between the inside and the outside of the air hole 122, and the circulated air may accelerate the cooling of the heat dissipation fin 130 and the body 120.

In detail, the air hole 122 may be positioned to vertically overlap the center portion 131 of the heat dissipation fin 130, and the light emitting devices 111 may be positioned to vertically overlap the both ends 133 of the heat dissipation fin 130. .

More specifically, as shown in FIG. 3, the air hole 122 is formed long in the first direction (Z-axis direction) at the central portion of the body 120, and the light emitting devices 111 are the air holes 122. A plurality may be spaced apart along the longitudinal direction of the.

In this case, more than half of the light emitting elements 111 may be formed adjacent to the side formed in the longitudinal direction of the air hole 122. That is, a plurality of light emitting devices 111 are arranged in a first direction in two rows, and an air hole 122 is formed long in a first direction between rows of the light emitting devices 111, and a length direction of the air holes 122 is provided. More than half of the light emitting elements 111 may be adjacent to each other. Thus, effective heat transfer is possible. Of course, the substrate hole 113 may be formed to correspond to the shape of the air hole 122.

In addition, when viewed from above, the area of the air hole 122 may be 10% to 20% of the area of the body 120.

The air guide 122 may further include an air guide part 150 extending from the edge of the air hole 122 in the other surface direction (the opposite direction of the Y axis) and communicating with the air hole 122 to guide the air.

The air guide unit 150 may have a cylindrical shape having a space therein, and the edge may be positioned to overlap the edge of the air hole 122. That is, the air guide 150 may have a chimney shape surrounding the air hole 122.

The air guide 150 may be made of a material having excellent heat transfer efficiency. For example, the material of the air guide unit 150 may include at least one of aluminum (Al), nickel (Ni), copper (Cu), silver (Ag), and tin (Sn). In addition, the air guide 150 may be made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), photosensitive glass (PSG), poly It may be formed of at least one of amide 9T (PA9T), neogeotactic polystyrene (SPS), metal, sapphire (Al2O3), beryllium oxide (BeO), ceramic.

The air guide unit 150 may be connected to at least some of the plurality of heat dissipation fins 130, such that heat transferred from the light emitting element 111 to the heat dissipation fin 130 may be transferred to the air guide unit 150.

In addition, the body 120 may have a connector 190 for supplying power to the light emitting element 111 and a connector hole 124 penetrating therethrough.

Referring back to FIGS. 1 and 2, the module array 200 according to the embodiment may be formed by combining a plurality of light emitting device modules 100 as described above.

Specifically, the module array 200 may be arranged in a plurality of light emitting device modules 100 in a direction (XZ plane direction, hereinafter referred to as a horizontal direction) parallel to one surface of the body 120 of the light emitting device module 100. .

More specifically, in the module array 200, a plurality of light emitting device modules 100 may be arranged with a constant pitch. In addition, as shown in FIG. 2, in the module array 200, a plurality of light emitting device modules 100 may be arranged in a width direction and / or a length direction of the light emitting device module 100.

The module array 200 is formed in one surface (Y-axis direction, hereinafter referred to as a vertical direction) on one surface between the light emitting device modules 100 to form an air flow hole 210 through which air flows.

The air flow hole 210 is positioned between the light emitting device modules 100 to promote air circulation by a temperature difference between the inside and the outside of the air flow hole 210.

The inside of the air flow hole 210 is heated by the heat transmitted from the light emitting element 111 through the body 120, the heated air is raised to the top by buoyancy and is directed from the bottom of the air flow hole 210 upwards Create an air flow (the so-called chimney effect).

Therefore, the air flow hole 210 is formed between the light emitting device module 100, there is an effect that can effectively cool the heat generated in the light emitting device module 100.

For example, the air flow holes 210 may be formed between the bodies 120 of two light emitting device modules 100 adjacent to each other.

Specifically, the air flow hole 210 of the body 120 of the first light emitting device module 100-1 and the second light emitting device module 100-2 adjacent to the first light emitting device module 100-1. It may be located between the body (120).

More specifically, the side surfaces 127 of the bodies 120 of the two light emitting device modules adjacent to each other may form a partial region of the inner circumferential surface of the air flow hole 210. Here, the side surface 127 of the body 120 is a surface that forms a lateral outer surface of the body 120 to the surface perpendicular to one surface and the other surface.

Of course, the air flow hole 210 may be located between the first light emitting device module 100-1 and the second light emitting device module 100-2 arranged in the width direction, and the first light emitting device module 100. -1) and the third light emitting device module 100-3 arranged in the longitudinal direction.

The module array 200 may further include a connection member 220 connecting the light emitting device modules 100 adjacent to each other.

The connection member 220 may connect between the bodies 120 of the light emitting device modules 100 adjacent to each other.

The connection member 220 may be spaced apart from each other two.

Since the connection member 220 forms an edge of the air flow hole 210, it may be made of a material having excellent heat transfer.

The connection member 220 may include at least one of a material having excellent heat transfer, for example, aluminum (Al), nickel (Ni), copper (Cu), silver (Ag), and tin (Sn).

Specifically, referring to FIG. 2, the side surfaces 221 of the two connecting members 220 spaced apart from each other, and the side surfaces 127 of the body 120 of the light emitting device modules 100 adjacent to each other, may be formed of air flow holes ( An inner circumferential surface of 210 may be formed. Here, the side surface 221 of the connecting member 220 will mean a surface perpendicular to the X-Z axis plane.

For example, the cross-sectional shape of the air flow hole 210 may be formed of any one of a rectangle, a polygon, and a circle.

Particularly, when the cross-sectional shape of the air flow hole 210 is rectangular, the second light emitting device module 100-2 adjacent to the first light emitting device module 100-1 and the first light emitting device module 100-1 is formed. Side surface 127 of the body 120 of the two sides forming a rectangular facing both sides, two connecting members 220 for connecting the first light emitting device module 100-1 and the second light emitting device module 100-2 The sides 221 of) will form two sides facing each other.

In other words, the plurality of light emitting device modules 100 may be spaced apart from each other in a horizontal direction, and the light emitting device modules 100 may be connected by a plurality of connection members 220. In this case, an air flow hole 210 penetrates vertically by the side surface 127 of the body 120 of the light emitting device modules adjacent to the side surface 221 of the connection member 220.

In addition, the connection member 220 may be located adjacent to the edge of the side 127 of the body 120. As shown in FIG. 2, the connection member 220 may be positioned adjacent to an edge of the side surface 127 of the body 120 to increase the size of the air flow hole 210 and to increase the size of the air flow hole 210. It can further promote the air circulation between the inside and outside.

In addition, the connection member 220 may be integrally formed with the body 120 or may be formed separately from the body 120.

6 is a view showing the air flow rate distribution of the light emitting device module 100 in the embodiment.

Hereinafter, referring to FIG. 6, air flow and heat radiation of the light emitting device module will be described.

The light emitting device module 100 is generally installed so that the light emitting device 111 faces the gravity direction in order to illuminate an object on the ground.

When power is applied to the light emitting device 111, light is generated from the light emitting device 111, and heat is generated.

Heat generated from the light emitting device 111 is transferred to the substrate 112 and the heat dissipation pad 150, and is diffused into the body 120, the air guide 150, and the heat dissipation fin 130.

In particular, most of the heat generated in the light emitting device 111 will be transmitted to the body 120, the heat dissipation fin 130 and the air guide 150 having excellent heat transfer rate.

Therefore, a temperature difference is generated between the outside and the inside of the light emitting device module 100.

In particular, the inside of the air guide unit 150 and the air hole 122 has a higher temperature than the outside of the light emitting device module 100.

Therefore, the air in the air guide unit 150 and the air hole 122 is moved to the upper part under the buoyancy, and the cold air in the lower region of the outer region of the light emitting element 111 is introduced (chimney effect).

This, the circulation of the air can maximize the heat radiation effect of the outside air and the light emitting device (111).

In particular, as shown in FIG. 6, the flow rate of the air passing through the air hole 122 and the air guide part 150 is faster than the flow rate of other air.

Thus, embodiments may have the effect of cooling using a fan without using a separate fan.

In addition, when the air flow hole 210 is further formed between the light emitting device modules 100, the chimney effect occurs due to the temperature difference between the inside and the outside of the air flow hole 210, thereby promoting air circulation.

The air circulation promoted by the chimney effect cools the light emitting device module more effectively.

7 is a plan view of a module array according to another embodiment of the present invention.

Compared to the embodiment of FIG. 2, the module array 200A according to the embodiment has a difference in configuration of the connection member 220.

The connection member 220 according to the embodiment includes a slide groove 220A formed in the body 120 of any one light emitting device module (for example, the first light emitting device module 100-1), and one light emitting device. Slide protrusions formed on the body 120 of the other light emitting device module (for example, the second light emitting device module 100-2) adjacent to the device module 110-1 and slidably coupled to the slide groove 220A ( 220B).

The slide groove 220A provides a space in which the slide protrusion 220B is coupled and fixed.

The slide groove 220A may be formed to correspond to the shape of the slide protrusion 220B so as to slide and be fixed to the slide protrusion 220B.

Specifically, the slide groove 220A may have a shape in which the width thereof is narrowed from the inner side to the outer side.

The slide groove 220A may be formed in the body 120 of any one light emitting device module 100-1. It may be formed integrally or separately from the body 120.

Specifically, the slide groove 220A may be recessed in the horizontal direction on the side surface 127 of the body 120.

The slide protrusion 220B is slid and fixed to the slide groove 220A.

The slide protrusion 220B may be formed to correspond to the shape of the slide groove 220A to be slid and fixed with the slide groove 220A. In particular, for ease of assembly, the slide protrusion 220B may be inserted into the slide groove 220A in the vertical direction.

Specifically, the slide protrusion 220B may have a shape in which the width thereof is widened from the inner side to the outer side.

The slide protrusion 220B may be formed in the body 120 of any one light emitting device module 100-2. It may be formed integrally or separately from the body 120.

Specifically, the slide protrusion 220B may protrude in a horizontal direction from the side surface 127 of the body 120.

In order to improve the coupling force between the light emitting device modules 100, the slide groove 220A and the slide protrusion 220B may be coupled in an interference fit manner.

When the slide protrusion 220B and the slide groove 220A are used, convenience of assembly may be improved while forming the air flow holes 210 between the light emitting device modules 100.

In addition, the number of light emitting device modules included in the module array 200 may be easily adjusted in consideration of the lighting capacity and the space of the lighting device.

8 is a perspective view of a lighting device including the light emitting device module 100 of the present invention.

Referring to FIG. 8, the lighting device 1000 according to the embodiment provides a space in which the light emitting device module 100 is coupled and forms a space between the main body 1100 and a power supply unit coupled to one side of the main body to supply power to the main body. (Not shown) may include a connection part 1200 that is built-in and connects with the support part.

The lighting device 1000 of the embodiment may be installed indoors or outdoors. For example, the lighting device 1000 of the embodiment may be used as a street lamp.

In the main body 1100, a plurality of frames 1110 may be formed to enhance a space in which at least three light emitting device modules 100 are located.

The connection part 1200 has a power supply unit built therein and connects the support unit (not shown) and the main body to fix the main body to the outside.

Using the lighting device 1000 of the embodiment, it is possible to effectively cool the heat generated from the light emitting device module 100 due to the chimney effect, it has the effect of reducing the manufacturing cost without using a separate fan.

Although the above has been described with reference to the embodiments, these are merely examples and are not intended to limit the present invention. Those skilled in the art to which the present invention pertains do not exemplify the above without departing from the essential characteristics of the present embodiments. It will be appreciated that many variations and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

100: light emitting device module
120: body
110: light source
130: heat sink fin

Claims (17)

At least two light emitting device modules including a light source unit, a body on which a seating part on which the light source unit is seated is formed, a plurality of heat dissipation fins positioned on the other surface facing one surface of the body, and bodies of the light emitting device modules adjacent to each other; At least two connecting members for connecting between,
The light emitting device modules are arranged in a direction parallel to the one surface, and formed between the light emitting device modules in the direction of the other surface on the other surface to form an air flow hole through which air flows.
The two connection members are disposed to be spaced apart from each other, the side surfaces of the two connection members and the side of the body of the light emitting device modules adjacent to each other forms an inner circumferential surface of the air flow hole
The connecting member,
Slide groove formed in the body of any one of the light emitting device module,
A slide protrusion formed on a body of another light emitting device module adjacent to the one light emitting device module and slidably coupled to the slide groove;
An air hole formed through the body in the direction of the heat dissipation fin in the seating portion, and in which air flows;
And an air guide part extending from the edge of the air hole toward the other surface of the body and communicating with the air hole to guide the air. The method of claim 1,
The air flow hole,
Module array formed between the body of the two light emitting device modules adjacent to each other. The method of claim 2,
The connecting member,
A module array positioned adjacent a corner of the sides of the body. The method of claim 1,
The module member is formed integrally with the body. The method of claim 1,
And the slide groove and the slide protrusion are interfitted. delete The method of claim 1,
The light source unit,
A substrate seated on the seating part;
It includes a plurality of light emitting elements located on the substrate,
The substrate,
And a substrate hole in communication with the air hole. The method of claim 7, wherein
The plurality of light emitting devices are arranged to surround the substrate hole. The method of claim 7, wherein
And a plurality of lenses for shielding the light emitting device and refracting the light generated by the light emitting device. The method of claim 9,
The plurality of lenses are disposed in a lens cover formed to correspond to the substrate,
And a cover hole formed in the lens cover to communicate with the air hole. The method of claim 7, wherein
Further comprising a heat dissipation pad located between the substrate and the seating portion to improve heat transfer,
And a pad hole communicating with the air hole in the heat dissipation pad. The method of claim 1,
The seating unit is a module array formed by recessing one surface of the body. delete The method of claim 1,
The air guide unit is connected to at least some of the plurality of heat sink fins module array. The method of claim 1,
The heat dissipation fin is disposed long in the width direction of the body,
The center of the heat dissipation fin module array is recessed in the body direction than both ends of the heat dissipation fin. The method of claim 1,
The air hole is positioned to vertically overlap with the central portion of the heat dissipation fins,
And the light emitting devices are vertically overlapped with both ends of the heat dissipation fin. A lighting device comprising the module array of any one of claims 1 to 5, 7 to 12 and 14 to 16.

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