KR102016483B1

KR102016483B1 - Inductor

Info

Publication number: KR102016483B1
Application number: KR1020130113228A
Authority: KR
Inventors: 최운철; 이환수; 한진우
Original assignee: 삼성전기주식회사
Priority date: 2013-09-24
Filing date: 2013-09-24
Publication date: 2019-09-02
Also published as: KR20150033343A

Abstract

The present invention, the main body including the upper and lower cover layer; A coil support layer disposed between the upper and lower cover layers; It is formed on both sides of the coil support layer, and has a first and a second lead portion extending to expose through both end surfaces of the main body, respectively, the first and second lead portion having a first and second reinforcement portion vertically extended First and second conductor pattern portions; First and second external electrodes formed on both end surfaces of the main body and connected to the first and second lead portions, respectively; It provides an inductor comprising a.

Description

Inductor

The present invention relates to an inductor.

An inductor is one of the important passive elements that make up an electronic circuit together with resistors and capacitors.It is used for noise elimination or components forming an LC resonant circuit, and can be classified into winding type, stacked type and thin film type according to its structure. have.

The wound inductor may be formed by winding a coil on a ferrite core or the like.

In the wound inductor, stray capacitance may occur between coils. Therefore, when the number of windings of the coil is increased to obtain a high capacitance inductance, high frequency characteristics may deteriorate.

The multilayer inductor may be formed by stacking a plurality of ceramic sheets.

The multilayer inductor may have a coil-shaped metal pattern formed on each ceramic sheet, and the metal patterns may be sequentially connected by a plurality of conductive vias provided in the ceramic sheet.

These stacked inductors are suitable for high volume production and have excellent high frequency characteristics compared to wire wound inductors.

However, the multilayer inductor has a low saturation magnetization value of the material constituting the metal pattern, and when manufactured in a small size, there is a limit on the number of metal patterns stacked. Therefore, the DC inductance characteristic is low, and thus sufficient current cannot be obtained. Problems may arise.

The thin film inductor may not only be able to use a material having a high saturation magnetization value, but even when manufactured in a small size, the thin film inductor may easily form an internal circuit pattern when compared to a multilayer inductor.

When the thin film inductor is manufactured in a large size, the line width or the thickness of the coil may be increased, so that deterioration of product characteristics may not occur due to an increase in the series resistance value.

The thin film inductor has a lead portion formed at the end of the coil for connecting with an external electrode. The lead portion has resistance to two-dimensional external force due to its horizontal structure, but is vulnerable to three-dimensional external force including a vertical direction. There is a characteristic.

This external force acts largely under severe conditions such as crimping of the material. At this time, the lead portion corresponds to the limit of the resistive force in the horizontal direction. However, the external force in the vertical direction or other directions has a small bearing force, so that the coil cannot be held and bent. There was a problem that a defect may occur, such as a part of the coil is exposed on the cutting surface after the Singh.

In addition, even if a part of the coil is not a big defect appearing on the cut surface, even if a part of the coil is bent, this affects the magnetic field in a narrow space in the body made of magnetic material, thereby lowering the chip capacity or the DC bias.

In particular, since the chip size has recently been miniaturized at a high speed, whether the coil is in the right position as designed is a very important factor in terms of yield and chip characteristics.

The following Patent Documents 1 and 2 disclose a thin film type inductor, but do not disclose a configuration for improving the holding force of the lead portion of the conductor pattern portion.

Korean Patent Registration Publication No. 0167392 Japanese Laid-Open Patent Publication 2006-303405

In the art, a new method for improving the holding capacity of the lead portion of the conductor pattern portion against external forces in various directions has been demanded in the thin film type inductor.

One aspect of the invention, the main body including the upper and lower cover layer; A coil support layer disposed between the upper and lower cover layers; It is formed on both sides of the coil support layer, and has a first and a second lead portion extending to expose through both end surfaces of the main body, respectively, the first and second lead portion having a first and second reinforcement portion vertically extended First and second conductor pattern portions; First and second external electrodes formed on both end surfaces of the main body and connected to the first and second lead portions, respectively; It provides an inductor comprising a.

In an embodiment of the present disclosure, the first and second reinforcement parts may be formed by stacking at least one conductive layer in a vertical direction at the center of the upper and lower surfaces of the first and second lead parts.

In one embodiment of the present invention, the first and second reinforcement parts are formed by stacking at least one layer of conductive layers spaced apart in the width direction from both the upper and lower surfaces of the first and second lead parts in a vertical direction. Can be.

In an embodiment of the present disclosure, the first and second reinforcement parts may be formed by stacking at least one conductive layer in a vertical direction on both sides of the first and second lead parts.

In an embodiment of the present disclosure, first and second insulating layers may be formed on both surfaces of the coil support layer to cover the first and second conductor pattern portions.

In one embodiment of the present invention, the coil support layer may be composed of a substrate made of an insulating or magnetic material.

According to one embodiment of the present invention, by providing the first and second reinforcing portions respectively extended perpendicularly to the first and second lead portions of the first and second conductor pattern portion, three-dimensional including a plurality of directions, in particular a vertical direction It is possible to improve the bearing capacity against external force, and to prevent defects such as part of the coil appearing on the cutting surface after dicing, to prevent the bending of the coil and to position it in the design position, thereby reducing the capacity of the chip such as inductance, Chip characteristics such as DC bias can be maintained at a constant level.

1 is a perspective view of an inductor according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view taken along the line AA ′ of FIG. 1.
3 is a side view illustrating a cross section of the main body with the second external electrode removed from the inductor of FIG. 1.
4 is a side view illustrating another embodiment of the first and second reinforcement parts by removing the second external electrode from the inductor of FIG. 1 and showing a cross section of the main body.
FIG. 5 is a side view illustrating another embodiment of the first and second reinforcement parts by removing the second external electrode from the inductor of FIG. 1 and showing a cross section of the main body.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily implement the present invention.

However, embodiments of the present invention may be modified in various other forms, and the scope of the present invention is not limited to the embodiments described below.

Moreover, embodiment of this invention is provided in order to demonstrate this invention more completely to the person with average knowledge in the technical field.

Accordingly, the shape and size of elements in the drawings may be exaggerated for clarity, and the elements denoted by the same reference numerals in the drawings represent the same elements.

In addition, the same reference numerals are used throughout the drawings for parts having similar functions and functions.

In addition, "comprising" any component throughout the specification means that, unless specifically stated otherwise, it may further include other components without excluding other components.

In addition, in this embodiment, the limitation of "first" and "second" is only for distinguishing the object, and this invention is not restrict | limited by this order.

1 is a perspective view of an inductor according to an exemplary embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line AA ′ of FIG. 1.

In the following description, the "L direction" in FIG. 1 is set to the "length direction", the "W direction" is set to the "width direction", and the "T direction" to the "thickness direction".

1 and 2, an inductor 100 according to an embodiment of the present invention may include a main body 110, a coil support layer 140, first and second conductor pattern parts 121 and 122, and first and second parts. Second external electrodes 131 and 132 are included.

The main body 110 may be a rectangular parallelepiped and includes upper and lower cover layers 111 and 112 made of a magnetic material, and upper and lower cover layers 111 and 112.

The upper and lower cover layers 111 and 112 may be made of a magnetic material. The upper and lower cover layers 111 and 112 may be made of a paste made of a ferrite or a composite of a metal magnetic powder and a polymer, or may be made of a material including a magnetic material such as nickel-zinc-copper ferrite.

The upper and lower cover layers 111 and 112 may completely fill the first and second conductor pattern parts 121 and 122, so that the first and second conductor pattern parts 121 and 122 may be formed by external impact or an external material. It can serve to prevent the deterioration of the basic electrical characteristics.

The coil support layer 140 is disposed between the upper and lower cover layers 111 and 112, and is formed of a substrate made of an insulating material such as BT resin or a photosensitive polymer, or includes a magnetic material such as nickel-zinc-copper ferrite. It may be made of a substrate, the present invention is not limited thereto.

In this case, a glass substrate, a ceramic substrate, a semiconductor substrate, or a resin substrate may be used, for example, an FR4 substrate or a polyimide substrate, but the present invention is not limited thereto.

The first and second conductor pattern parts 121 and 122 may be formed on both surfaces of the coil support layer 140 by various methods such as an electroplating method or a screen printing method.

The first and second conductor pattern parts 121 and 122 preferably have a spiral structure, but the present invention is not limited thereto. For example, the first and second conductor pattern parts 121 and 122 may be polygonal, circular, elliptical, etc., such as a square, a pentagon, and a hexagon. It may be irregular in shape if necessary.

In addition, the first and second conductor pattern portions 121 and 122 may include one or more metals selected from the group consisting of gold, silver, platinum, copper, nickel, palladium, and alloys thereof, but the present invention is limited thereto. The first and second conductor pattern portions 121 and 122 of the present invention may be made of a material that can impart conductivity.

The first and second conductor pattern parts 121 and 122 may be electrically connected to each other by conductive vias (not shown). The conductive via may be formed by forming a through hole (not shown) in the coil support layer 140 in the thickness direction, and then filling the through hole with a conductive paste.

The first and second conductor pattern parts 121 and 122 may be drawn out through both end surfaces of the main body 110 at one end and electrically connected to the first and second external electrodes 131 and 132, respectively. Second lead portions 121a and 122a are extended.

Referring to FIG. 3, the first and second lead portions 121 and 122 have first and second reinforcement portions 123 and 124 vertically extended. The first and second reinforcement parts 123 and 124 improve the bearing capacity of the first and second lead parts 121 and 122 against external force in various directions, such that a part of the coil is exposed on the cutting surface after dicing. And the problem that the chip capacity and the DC bias are lowered by the bending of the conventional coil can be improved.

The first and second reinforcement parts 123 and 124 are ones selected from the group consisting of gold, silver, platinum, copper, nickel, palladium, and alloys thereof similar to the first and second conductor pattern parts 121 and 122. Although the present invention may include the above metal, the present invention is not limited thereto, and the first and second reinforcement parts 123 and 124 of the present invention may be made of a material capable of imparting conductivity.

The first and second reinforcement parts 123 and 124 may be formed in a “+” shape by stacking conductive layers in the vertical direction at the centers of the upper and lower surfaces of the first and second lead parts 121a and 122a. In FIG. 3, the first and second reinforcement parts 123 and 124 are formed by stacking three conductive layers, but the present invention is not limited thereto, and the conductive layers may be 1-2 or 4 or more. Can be laminated.

In addition, since the first and second reinforcement parts 123 and 124 are manufactured by changing a design in a photoresist process during anisotropic plating, additional manufacturing equipment and costs are not added.

In addition, as shown in FIG. 4, the first reinforcement part 123 ′ is formed by stacking at least one layer of conductive layers spaced apart in the width direction from both sides of the upper surface of the first lead part 121a in a vertical direction. It may be formed in the "H" shape. Since the second reinforcing parts located on the opposite side also have the same structure, detailed description thereof will be omitted to avoid duplication.

In addition, as illustrated in FIG. 5, the first reinforcement part 123 ″ may be formed by stacking at least one conductive layer in a vertical direction on both sides of the first lead part 121a. 2 Since the reinforcement is also the same structure, a detailed description thereof will be omitted to avoid duplication.

First and second insulating layers 151 and 152 may be formed on both surfaces of the coil support layer 140 to completely cover the first and second conductor pattern portions 121 and 122. The first and second insulating layers 151 and 152 may include not only the first and second conductor pattern portions 121 and 122, but also the first and second lead portions 121a and 122a and the first and second reinforcement portions 123. , 124 may also be formed to cover all of them.

The first and second insulating layers 151 and 152 are made of a material having insulating properties. For example, a polymer may be used, but the present invention is not limited thereto.

The first and second external electrodes 131 and 132 are formed at both end surfaces of the main body 110 and electrically connected to the first and second lead portions 121a and 122a, respectively.

The first and second external electrodes 131 and 132 are metals capable of imparting electrical conductivity, such as one or more metals selected from the group consisting of gold, silver, platinum, copper, nickel, palladium, and alloys thereof. Can be.

In this case, nickel-plating layers (not shown) or tin plating layers (not shown) may be further formed on the surfaces of the first and second external electrodes 131 and 132 as necessary.

The present invention is not intended to be limited by the above-described embodiments and the accompanying drawings, but is intended to be limited by the appended claims.

Accordingly, various forms of substitution, modification, and alteration may be made by those skilled in the art without departing from the technical spirit of the present invention described in the claims, which are also within the scope of the present invention. something to do.

100; Inductor 110; Body
111; Upper cover layer 112; Bottom cover layer
121, 122; First and second conductor pattern portions 121a and 122a; First and second lead parts
123, 123 ', 123 "; first reinforcement 124; second reinforcement
131, 132; First and second external electrodes 140; Coil support layer

Claims

A main body including an upper and lower cover layer;
A coil support layer disposed between the upper and lower cover layers;
It is formed on both sides of the coil support layer, and has a first and a second lead portion extending to expose through both end surfaces of the main body, respectively, the first and second lead portion having a first and second reinforcement portion vertically extended First and second conductor pattern portions; And
First and second external electrodes formed on both end surfaces of the main body and connected to the first and second lead portions, respectively; Including,
And the first and second reinforcement parts are formed in a + shape by stacking at least one conductive layer in a vertical direction at the centers of upper and lower surfaces of the first and second lead parts.

delete

The method of claim 1,
Inductors, characterized in that the first and second insulating film is formed on both sides of the coil support layer to cover the first and second conductor pattern portion.

The method of claim 1,
And the coil support layer is a substrate made of an insulating or magnetic material.