KR102012281B1 - Method for laminating shatter-proof film apply to transparent panel and transparent panel thereof - Google Patents

Method for laminating shatter-proof film apply to transparent panel and transparent panel thereof Download PDF

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KR102012281B1
KR102012281B1 KR1020180064181A KR20180064181A KR102012281B1 KR 102012281 B1 KR102012281 B1 KR 102012281B1 KR 1020180064181 A KR1020180064181 A KR 1020180064181A KR 20180064181 A KR20180064181 A KR 20180064181A KR 102012281 B1 KR102012281 B1 KR 102012281B1
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South Korea
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transparent substrate
pressure
film
transparent
sensitive adhesive
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KR1020180064181A
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Korean (ko)
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박희열
표중화
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유한회사 대구특수금속
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/412—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/08—Dimensions, e.g. volume
    • B32B2309/10—Dimensions, e.g. volume linear, e.g. length, distance, width
    • B32B2309/105—Thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2607/00—Walls, panels

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  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Laminated Bodies (AREA)

Abstract

The present invention relates to a transparent panel laminating method applied with an anti-scattering film. According to the present invention, a transparent substrate (16) made of one of glass and PMMA and an anti-scattering film (12) having an optical adhesive layer (14) are separately cut. A chamfered surface (18) is formed on an edge of the transparent substrate (16), and an adhesive leakage accommodating trench (17) is processed and formed on a portion of the inside of the transparent substrate (16) adjacent to the chamfered surface (18) along the edge. The adhesive leakage accommodating trench (17) is processed to have the depth (d) and the width (w) to be smaller than the thickness (x) of the anti-scattering film (12) and to be greater than the thickness (x) of the adhesive layer (14). The anti-spattering film (12) is prepared by being cut by a size of the transparent substrate (16) except for the chamfered surface (18) of the transparent substrate (16), and then a front surface of the transparent substrate (16) is covered with the anti-spattering film (12) to apply a laminating pressure for lamination, such that a transparent panel (10) in which the amount of an adhesive pushed by the laminating pressure is evacuated in the adhesive leakage accommodating trench (17) is obtained. Accordingly, an appearance defect problem due to the leakage of an optical adhesive generated at an edge of the transparent panel (10) caused by leaking an adhesive component of the optical adhesive layer (14) formed in the anti-scattering film (12) in all directions by the laminating pressure when the transparent substrate such as glass and PMMA and the anti-scattering film are laminated, is not to be generated. Also, the appearance can be improved and the dimension can be uniform since the leakage of the optical adhesive is not remained.

Description

비산방지필름 적용 투명패널 합지방법 및 그 투명패널{METHOD FOR LAMINATING SHATTER-PROOF FILM APPLY TO TRANSPARENT PANEL AND TRANSPARENT PANEL THEREOF} Transparent panel lamination method with scattering prevention film and the transparent panel {METHOD FOR LAMINATING SHATTER-PROOF FILM APPLY TO TRANSPARENT PANEL AND TRANSPARENT PANEL THEREOF}

본 발명은 투명패널 제조방법에 관한 것으로, 특히 제품의 투명패널에 비산방지필름을 합지시키는 방법의 개량에 관한 것이다. The present invention relates to a method for manufacturing a transparent panel, and more particularly, to an improvement of a method of laminating a scattering prevention film on a transparent panel of a product.

요즈음 휴대전화나 휴대게임기 제품, 생활가전제품, 차량의 계기명판이나 조작판, 헤드업 디스플레이(HUD) 등에는 디스플레이나 TSP(Touch Screen Panel) 용도로서, 강화유리와 같은 글라스(galss)재질이나 내광성 및 투명성이 좋은 PMMA(poly methylmethacrylate)재질 또는 PC(polycarbonate resin)재질 등을 많이 사용하고 있다. These days, for display and TSP (Touch Screen Panel), such as mobile phone, portable game console, home appliance, vehicle's name plate, operation panel, and head-up display (HUD), glass materials such as tempered glass (galss) and light resistance And PMMA (poly methylmethacrylate) material or PC (polycarbonate resin) material with good transparency is used a lot.

이러한 투명성을 갖는 글라스나 PMMA와 같은 투명기판에는 상대물과 결합해도 여전히 높은 투과율을 유지할 수 있으면서 기본적으로는 비산 방지 효과를 동시에 구현할 수 있고 또 필요에 따라서는 커버글라스 장식효과까지도 가능하도록 하는 비산 방지 필름(Anti-Scattering Film)을 합지하여 사용한다. Transparent substrates such as glass or PMMA, which have such transparency, can still maintain high transmittance even when combined with counterparts, and can basically achieve scattering prevention effect and cover glass decoration effect if necessary. Anti-Scattering Film is used by laminating.

비산 방지 필름은 글라스나 PMMA와 같은 투명패널이 물체와의 충돌이나 외부 충격으로 인하여 파손후 비산되는 것을 방지하기 위해 투명기판에 합지되며, 그에 따라 투명기판이 파손되더라도 인체에 상해를 입히거나 주변물을 손상시키는 것이 예방된다.Shatterproof film is laminated to a transparent substrate to prevent the transparent panel such as glass or PMMA from being scattered after being damaged due to collision with an object or an external impact, so that even if the transparent substrate is damaged, it may cause injury or damage to the human body. Damage is prevented.

비산방지필름이 적용된 투명패널은 글라스와 PMMA와 같은 투명기판과 일면에 광학용 점착제층이 형성된 비산방지필름을 필요만큼 각각 재단한 후 합지공정을 통해서 일체화시킴으로써 얻어진다. The transparent panel to which the anti-scattering film is applied is obtained by integrating the transparent substrates such as glass and PMMA and the anti-scattering film having an optical pressure-sensitive adhesive layer formed on one surface thereof as necessary and then laminating them.

그런데 이러한 합지공정에서는 도 1에 도시된 바와 같이, 글라스와 PMMA와 같은 투명기판(6)과 비산방지필름(2)을 합지시 그 합지압력에 의해서 비산방지필름(2)에 형성된 광학용 점착제층(4)의 성분이 사방측면으로 삐져 나오면서 투명패널의 테두리부에는 광학용 점착제의 삐져나온 누설물(8)이 생기게 된다. However, in this lamination process, as shown in FIG. 1, when the transparent substrate 6 such as glass and PMMA and the anti-scattering film 2 are laminated, the optical pressure-sensitive adhesive layer formed on the anti-scattering film 2 by the laminating pressure thereof. As the component (4) sticks out on all sides, the leaked substance 8 sticking out of the optical adhesive is formed on the edge of the transparent panel.

이렇게 광학용 점착제층(4)에서 삐져나온 누설물(8)은 투명패널 제품의 외관 불량을 야기시키며 더욱이 점착제 누설물에 이물질이 달라붙는 이차적인 문제까지도 야기시킨다. The leakage 8 protruding from the optical pressure-sensitive adhesive layer 4 causes a poor appearance of the transparent panel product, and also causes a secondary problem in which foreign matter adheres to the pressure-sensitive adhesive leakage.

국내 등륵특허공보 제10-0800168호 "유리 비산 방지 필름의 합지 방법 및 그 장치"Domestic Patent Publication No. 10-0800168 "Lamination method and apparatus thereof for preventing glass scattering film"

따라서 본 발명의 목적은 글라스와 PMMA와 같은 투명기판과 비산방지필름을 합지시 그 합지압력에 의해서 비산방지필름에 형성된 광학용 점착제층의 성분이 사방측면으로 삐져 나오면서 투명패널의 테두리부에 생기는 광학용 점착제의 누설물로 인해 야기되는 외관 불량이나 누설물에 이물질이 달라붙는 이차적 문제가 없도록 하는 비산방지필름 적용 투명패널 합지방법 및 그 투명패널을 제공함에 있다. Accordingly, an object of the present invention is that the optical adhesive layer formed on the scattering prevention film by the lamination pressure when the transparent substrate such as glass and PMMA and the scattering prevention film is laminated to the sides of the transparent optical The present invention provides a transparent panel laminating method and a transparent panel applied with a shatterproof film for preventing the appearance problem caused by the leakage of the pressure-sensitive adhesive or the secondary problem that foreign matters adhere to the leakage.

상기한 목적에 따른 본 발명의 제1 실시예에 따른 비산방지필름 적용 투명패널 합지방법은, 글라스와 PMMA중의 하나로 된 투명기판(16)과 광학용 점착제층(14)을 갖는 비산방지필름(12)을 각각 재단하되, 투명기판(16)의 테두리에는 면취가공면(18)을 형성하고 면취가공면(18)의 근접 내측 투명기판(16) 부분에 상기 테두리를 따라가며 점착제누설분 수용 도랑(17)을 가공 형성하되 점착제누설분 수용 도랑(17)은 깊이(d)와 폭(w)이 비산방지필름(12)의 두께(x)보다 적고 점착제층(14)의 두께(y)보다 크게 가공 형성하며, According to the above object, the scattering prevention film applying transparent panel laminating method according to the first embodiment of the present invention, the scattering prevention film 12 having a transparent substrate 16 and the optical pressure-sensitive adhesive layer 14 made of one of glass and PMMA. ), Each of which is cut, forming a chamfering surface 18 on the edge of the transparent substrate 16 and accommodating adhesive leakage powder along the edge on the inner side of the transparent substrate 16 near the chamfering surface 18 ( 17) process the adhesive leakage receiving groove 17 has a depth (d) and width (w) is less than the thickness (x) of the shatterproof film 12 and larger than the thickness (y) of the pressure-sensitive adhesive layer (14) Processing forming,

비산방지필름(12)은 투명기판(16)의 면취가공면(18)을 제외한 투명기판(16)의 사이즈로 재단하여 마련한 후, 투명기판(16)의 전면부 상에 비산방지필름(12)을 덮어 씌운후 합지 압력을 가해 합지하여서 합지 압력에 의해 밀린 점착제 분량이 점착제누설분 수용 도랑(17)으로 대피되어진 투명패널(10)을 얻음을 특징으로 한다. The shatterproof film 12 is cut and provided to the size of the transparent substrate 16 except for the chamfered surface 18 of the transparent substrate 16, and then the shatterproof film 12 is formed on the front surface of the transparent substrate 16. It is characterized in that the transparent panel 10 is obtained by applying the lamination pressure after covering the lamination, and the amount of the adhesive pushed by the lamination pressure is evacuated to the adhesive leakage-receiving groove 17.

그리고, 본 발명의 제1 실시예에 따른 비산방지필름 적용 투명패널은, 글라스와 PMMA중의 하나로 된 투명기판(16)과 광학용 점착제층(14)을 갖는 비산방지필름(12)을 각각 재단하고 합지하여 투명패널(10)을 구성하되, 투명기판(16)의 테두리에는 면취가공면(18)이 형성되고 면취가공면(18)에 근접된 내측 투명기판(16)상에 상기 테두리를 따라가며 점착제누설분 수용 도랑(17)이 가공형성되게 구성하며, 점착제누설분 수용 도랑(17)은 깊이(d)와 폭(w)이 비산방지필름(12)의 두께(x)보다 적고 점착제층(14)의 두께(y)보다 크게 구성하며, In addition, the anti-scattering film-applied transparent panel according to the first embodiment of the present invention cuts the anti-scattering film 12 having the transparent substrate 16 made of one of glass and PMMA and the optical adhesive layer 14, respectively. The transparent panel 10 is laminated to form a chamfered surface 18 at the edge of the transparent substrate 16, and the edge is formed on the inner transparent substrate 16 adjacent to the chamfered surface 18. The pressure-sensitive adhesive leakage receiving groove 17 is formed to be processed, and the pressure-sensitive adhesive leakage receiving groove 17 has a depth (d) and a width (w) smaller than the thickness (x) of the anti-scattering film 12 and the pressure-sensitive adhesive layer ( 14) greater than the thickness (y),

비산방지필름(12)은 투명기판(16)의 면취가공면(18)을 제외한 투명기판(16)의 사이즈로 재단되어서 투명기판(16)에 합지됨에 따라 합지 압력에 의해 밀린 점착제 분량이 투명기판(16)의 점착제누설분 수용 도랑(17)으로 대피되어진 투명패널(10)을 구성함을 특징으로 한다. The shatterproof film 12 is cut to the size of the transparent substrate 16 except for the chamfered surface 18 of the transparent substrate 16 and is laminated on the transparent substrate 16 so that the amount of pressure-sensitive adhesive pushed by the lamination pressure is transparent substrate. Characterized in that the transparent panel 10 evacuated to the pressure-sensitive adhesive leakage receiving groove (17) of (16).

또한 본 발명의 제2 실시예에 따른 비산방지필름 적용 투명패널 합지방법은, 글라스와 PMMA중의 하나로 된 투명기판(26)과 광학용 점착제층(24)을 갖는 비산방지필름(22)을 각각 재단하되, 투명기판(26)의 테두리에는 면취가공면(28)을 형성하고 면취가공면(28)에 근접되며 테두리를 따르는 내측 투명기판(26)상의 면적부에는 점착제누설분 수용 미세요철부(27)를 플라즈마 처리에 의한 표면개질로 형성하되 점착제누설분 수용 미세요철부(27)는 다수 요홈의 깊이(d)가 비산방지필름(12)의 두께(x)보다 적고 점착제층(24)의 두께(y)보다 크게 형성하며, In addition, in the method of laminating the anti-scattering film applied transparent panel according to the second embodiment of the present invention, the anti-scattering film 22 having the transparent substrate 26 and the optical adhesive layer 24 made of one of glass and PMMA is cut. However, the edge of the transparent substrate 26 forms a chamfered processing surface 28 and is close to the chamfering processing surface 28, the area portion on the inner transparent substrate 26 along the rim, the adhesive leakage-receiving uneven portion 27 Is formed by surface treatment by plasma treatment, but the pressure-sensitive adhesive leakage-receiving fine concave portion 27 has a depth d of a plurality of grooves less than the thickness x of the anti-scattering film 12 and the thickness of the pressure-sensitive adhesive layer 24 (y). Greater than)

비산방지필름(22)은 투명기판(26)의 면취가공면(28)을 제외한 투명기판(26)의 사이즈로 재단하여 마련한 후, After the shatterproof film 22 is cut and prepared to the size of the transparent substrate 26 except for the chamfered surface 28 of the transparent substrate 26,

투명기판(26)의 전면부 상에 비산방지필름(22)을 덮어 씌운후 합지 압력을 가하여 합지하여서 압력에 의해 밀린 점착제 분량이 점착제누설분 수용 미세요철부(27)로 대피되어진 투명패널(20)을 얻음을 특징으로 한다. The transparent panel 20 which covers the scattering prevention film 22 on the front surface of the transparent substrate 26 and is laminated by applying a lamination pressure and the amount of the adhesive pushed by the pressure is evacuated to the adhesive leakage-receiving fine concave portion 27. It is characterized by obtaining.

그리고, 본 발명의 제2 실시예에 따른 비산방지필름 적용 투명패널은, 글라스와 PMMA중의 하나로 된 투명기판(26)과 광학용 점착제층(24)을 갖는 비산방지필름(22)을 각각 재단하고 합지하여 투명패널(20)을 구성하되, 투명기판(26)의 테두리에는 면취가공면(28)이 형성되고 면취가공면(28)에 근접된 내측 투명기판(26)상에는 점착제누설분 수용 미세요철부(27)이 형성되게 구성하며, 점착제 누설분 수용 미세요철부(27)은 요홈깊이(d1)가 비산방지필름(22)의 두께(x)보다 적고 점착제층(24)의 두께(y)보다 크게 구성하며, In addition, the transparent film applying transparent panel according to the second embodiment of the present invention, cut the shatterproof film 22 having a transparent substrate 26 and the optical pressure-sensitive adhesive layer 24 made of one of glass and PMMA, respectively. Laminate to form a transparent panel 20, the chamfered surface 28 is formed on the edge of the transparent substrate 26, the pressure-receiving adhesive leakage on the inner transparent substrate 26 adjacent to the chamfering surface 28 (27) is formed, the pressure-sensitive adhesive leakage receiving fine concave portion 27 is less than the groove depth (d1) of the thickness (x) of the anti-scattering film 22 and larger than the thickness (y) of the pressure-sensitive adhesive layer (24) Make up,

비산방지필름(22)은 투명기판(26)의 면취가공면(28)을 제외한 투명기판(26)의 사이즈로 재단되어서 투명기판(26)에 합지됨에 따라 합지 압력에 의해 밀린 점착제 분량이 투명기판(26)의 점착제누설분 수용 미세요철부(27)로 대피되어진 투명패널(20)을 구성함을 특징으로 한다. The scattering prevention film 22 is cut to the size of the transparent substrate 26 except for the chamfered surface 28 of the transparent substrate 26 and laminated on the transparent substrate 26 so that the amount of pressure-sensitive adhesive pushed by the lamination pressure is transparent substrate. (26) characterized in that the transparent panel 20 evacuated to the adhesive leakage-receiving fine concave portion (27).

본 발명은 글라스와 PMMA와 같은 투명기판과 비산방지필름을 합지시 그 합지압력에 의해서 비산방지필름에 형성된 광학용 점착제층의 점착제 성분이 사방측면으로 삐져 나오면서 투명패널의 테두리부에 생기는 광학용 점착제의 누설물로 인한 외관 불량 문제가 발생되지 않도록 해주며, 합지 압력에 의해 밀린 점착제 분량이 점착제누설분 수용 도랑이나 점착제 누설분 수용 미세요철부로 대피하도록 해줌에 따라 광학용 점착제의 누설이 방지되므로 비산방지필름 적용한 투명패널의 외관 개선 및 치수 균일화가 가능하게 해준다. According to the present invention, when the transparent substrate such as glass and PMMA and the anti-scattering film are laminated, the pressure-sensitive adhesive component of the optical pressure-sensitive adhesive layer formed on the anti-scattering film is scattered to all sides by the laminating pressure, and thus the optical adhesive is formed on the edge of the transparent panel. It prevents the appearance defect problem caused by the leakage of the material, and the amount of pressure-sensitive adhesive pushed by the lamination pressure prevents leakage of the pressure-sensitive adhesive leakage or the leakage of the pressure-sensitive adhesive. It is possible to improve the appearance and uniformity of the transparent panel with the prevention film.

도 1은 종래기술에 따른 비산방지필름 합지공정 및 그 합지후 상태를 보여주는 도면,
도 2는 본 발명의 제1 실시예에 따른 비산방지필름 합지방법 및 그에 따라 합지된 비산방지필름 적용 투명패널의 단면 구성도,
도 3은 본 발명의 제2 실시예에 따른 비산방지필름 합지방법 및 그에 따라 합지된 비산방지필름 적용 투명패널의 단면 구성도.1 is a view showing a scattering prevention film lamination process and a post-lamination state according to the prior art,
2 is a cross-sectional configuration diagram of the scattering prevention film lamination method and the laminated scattering prevention film application transparent panel according to the first embodiment of the present invention,
Figure 3 is a cross-sectional configuration of the scattering prevention film lamination method according to the second embodiment of the present invention and the laminated scattering prevention film applied transparent panel according to the present invention.

이하 본 발명의 바람직한 실시 예들을 첨부한 도면을 참조하여 상세히 설명한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 2는 본 발명의 제1 실시예에 따른 비산방지필름 합지방법 및 그에 따라 합지된 비산방지필름 적용 투명패널(10)의 단면 구성도이다. 2 is a cross-sectional view of the scattering prevention film lamination method according to the first embodiment of the present invention and the laminated scattering prevention film applied transparent panel 10 according to the first embodiment of the present invention.

본 발명의 제1 실시 예에 따른 비산방지필름 적용 투명패널(10)의 합지방법을 도 2를 참조하여 설명한다. A method of laminating the transparent panel 10 to which the anti-scattering film is applied according to the first embodiment of the present invention will be described with reference to FIG. 2.

본 발명의 제1 실시 예에 따른 비산방지필름 적용 투명패널(10)을 제작하기 위해 먼저 도 2의 (a)에서와 같이 글라스와 PMMA(poly methylmethacrylate)중의 하나로 된 투명기판(16)과 광학용 점착제층(14)을 갖는 비산방지필름(12)을 마련하되, 투명기판(16)과 광학용 점착제층(14)을 갖는 비산방지필름(12)을 각각 재단한다. In order to fabricate the transparent panel 10 to which the anti-scattering film is applied according to the first embodiment of the present invention, first, the transparent substrate 16 made of one of glass and poly methylmethacrylate (PMMA) and optical materials, as shown in FIG. An anti-scattering film 12 having an adhesive layer 14 is provided, and the anti-scattering film 12 having the transparent substrate 16 and the optical adhesive layer 14 is cut out, respectively.

투명기판(16)의 재질중 글라스는 강화유리가 바람직하며, PMMA는 내광성 및 투명성이 우수하다. 투명기판(16)의 두께가 예컨대 1.1mm이면 광학용 점착제층(14)의 두께는 25㎛ 정도가 양호하다. Among the materials of the transparent substrate 16, glass is preferably tempered glass, and PMMA is excellent in light resistance and transparency. When the thickness of the transparent substrate 16 is, for example, 1.1 mm, the thickness of the optical pressure-sensitive adhesive layer 14 is preferably about 25 μm.

이렇게 재단된 투명기판(16)은 본 발명의 제1 실시예에 따라 면취가공하되 도 2의 (a)에 도시된 바와 같이 투명기판(16)의 면취깊이(c)가 투명기판 두께(t)의 20~40%로 형성하고 면취각도는 40~50°로 형성한다.The cut transparent substrate 16 is chamfered according to the first embodiment of the present invention, but as shown in (a) of FIG. 2, the chamfering depth (c) of the transparent substrate 16 is the thickness of the transparent substrate (t). Form 20 ~ 40% of chamfering angle and form 40 ~ 50 °.

더욱이 본 발명의 제1 실시예서는 도 2의 (a)에 도시된 바와 같이, 면취가공면(18)의 근접 내측 투명기판(16) 부분에 투명기판(16)의 테두리를 따라가는 점착제누설분 수용 도랑(17)을 가공 형성한다. 점착제누설분 수용 도랑(17)은 그 깊이(d)와 폭(w)이 비산방지필름(12)의 두께(x)보다 적고 광학용 점착제층(14)의 두께(y)보다 크게 가공 형성한다. In addition, according to the first embodiment of the present invention, as shown in FIG. 2 (a), the adhesive leakage powder accommodating the transparent substrate 16 along the edge of the transparent substrate 16 is located near the inner side of the chamfered surface 18. The groove 17 is processed and formed. The pressure-sensitive adhesive leakage accommodating groove 17 is formed to have a depth d and a width w smaller than the thickness x of the anti-scattering film 12 and larger than the thickness y of the optical pressure-sensitive adhesive layer 14. .

그리고 광학용 점착제층(14)이 형성된 비산방지필름(12)은 투명기판(16)의 면취가공면(18)을 제외한 투명기판(16)의 사이즈로 재단하여 마련한다. The shatterproof film 12 having the optical adhesive layer 14 formed thereon is cut to the size of the transparent substrate 16 except for the chamfered surface 18 of the transparent substrate 16.

이렇게 점착제누설분 수용 도랑(17)을 갖는 글라스나 PMMA(poly methylmethacrylate)재질의 투명기판(16)과 합지 대상으로서 광학용 점착제층(14)을 갖는 비산방지필름(12)을 각각 재단하여 마련한 다음에는, 합지공정에서 도 2의 (b)에서와 같이 투명기판(16)의 전면부 상에 비산방지필름(12)을 덮어 씌워 합지하되 합지용 프레스로 합지 압력(상부압력)을 가함으로써 투명기판(16)상에 비산방지필름(12)이 합지되게 한다. Thus, the shatterproof film 12 having the optical pressure-sensitive adhesive layer 14 as a lamination object and the transparent substrate 16 made of glass or PMMA (poly methylmethacrylate) material having the pressure-sensitive adhesive leakage-receiving groove 17 are prepared, respectively. In the lamination process, as shown in FIG. 2 (b), the shatterproof film 12 is covered and laminated on the front surface of the transparent substrate 16, but the lamination press is applied by applying a lamination pressure (upper pressure) to the transparent substrate. The scattering prevention film 12 is laminated on the 16.

이렇게 비산방지필름(12)이 투명기판(16)에 합지됨에 따라 합지 압력에 의해 밀린 점착제 분량이 도 2의 (c)에서와 같이, 투명기판(16)상 가장자리에 형성된 점착제누설분 수용 도랑(17)으로 대피되어지므로 투명패널(10)의 테두리 외곽으로는 점착제 누설분이 없는 투명패널(10)이 제작완성된다. As the scattering prevention film 12 is laminated on the transparent substrate 16, the amount of the pressure-sensitive adhesive pushed by the lamination pressure, as shown in (c) of FIG. 2, is formed on the transparent substrate 16. 17) is evacuated to the outer edge of the transparent panel 10, the transparent panel 10 without the adhesive leakage is completed.

즉 도 2와 같은 본 발명의 제1 실시예에 따른 비산방지필름 적용 투명패널(10)은, 글라스와 PMMA중의 하나로 된 투명기판(16)과 광학용 점착제층(14)을 갖는 비산방지필름(12)을 각각 재단하고 합지하여 투명패널(10)을 구성하되, 투명기판(16)의 테두리에는 면취가공면(18)이 형성되고 면취가공면(18)에 근접된 내측 투명기판(16)상에 상기 테두리를 따라가며 점착제누설분 수용 도랑(17)이 가공형성되게 구성하며, 점착제누설분 수용 도랑(17)은 깊이(d)와 폭(w)이 비산방지필름(12)의 두께(x)보다 적고 점착제층(14)의 두께(y)보다 크게 구성하며, That is to say, the transparent panel 10 to which the anti-scattering film is applied according to the first embodiment of the present invention as shown in FIG. 2 includes a transparent substrate 16 made of one of glass and PMMA and an optical adhesive layer 14. 12) each of the cutting and laminating to form a transparent panel 10, the chamfered surface 18 is formed on the edge of the transparent substrate 16, the inner transparent substrate 16 on the chamfered processing surface 18 The adhesive leakage receiving groove 17 is formed to be processed along the edges, and the adhesive leakage receiving groove 17 has a depth d and a width w of the thickness of the anti-scattering film 12 (x). Less than) and larger than the thickness y of the pressure-sensitive adhesive layer 14,

비산방지필름(12)은 투명기판(16)의 면취가공면(18)을 제외한 투명기판(16)의 사이즈로 재단되어서 투명기판(16)에 합지됨에 따라 합지 압력에 의해 밀린 점착제 분량이 투명기판(16)의 점착제누설분 수용 도랑(17)으로 대피되어진 구성을 갖는다. The shatterproof film 12 is cut to the size of the transparent substrate 16 except for the chamfered surface 18 of the transparent substrate 16 and is laminated on the transparent substrate 16 so that the amount of pressure-sensitive adhesive pushed by the lamination pressure is transparent substrate. (16) has a configuration evacuated to the pressure-sensitive adhesive leakage receiving groove (17).

이러한 본 발명의 제1 실시예에 따른 비산방지필름 적용 투명패널(10)은 합지 압력에 의해 밀린 점착제 분량이 투명기판(16)상 가장자리에 형성된 점착제누설분 수용 도랑(17)으로 대피하도록 해줌으로써 광학용 점착제의 외부 누설이 방지되므로 비산방지필름(12) 적용한 투명패널(10)의 외관 개선 및 치수 균일화가 가능하다. 또 광학용 점착제의 누설물로 인한 외관 불량 문제가 발생되지 않는다. The transparent panel 10 to which the anti-scattering film applied according to the first embodiment of the present invention allows the pressure-sensitive adhesive portion pushed by the lamination pressure to be evacuated to the pressure-sensitive adhesive leakage receiving groove 17 formed at the edge on the transparent substrate 16. Since external leakage of the optical adhesive is prevented, it is possible to improve the appearance and uniformity of the transparent panel 10 to which the scattering prevention film 12 is applied. In addition, the problem of appearance defects due to leakage of the optical adhesive does not occur.

도 3은 본 발명의 제2 실시예에 따른 비산방지필름(22)의 합지방법 및 그에 따라 합지된 비산방지필름(22) 적용 투명패널(20)의 단면 구성도이다. 3 is a cross-sectional configuration of the method of laminating the anti-scattering film 22 according to the second embodiment of the present invention and the transparent panel 20 to which the anti-scattering film 22 is applied accordingly.

본 발명의 제2 실시 예에 따른 비산방지필름 적용 투명패널(20)의 제작을 위한 합지방법을 도 3을 참조하여 설명한다.A lamination method for fabricating the scattering prevention film applying transparent panel 20 according to the second embodiment of the present invention will be described with reference to FIG. 3.

도 3을 참조하면, 본 발명의 제2 실시예에서는, 먼저 도 3의 (a)에서와 같이, 글라스와 PMMA중의 하나로 된 투명기판(26)과 광학용 점착제층(24)을 갖는 비산방지필름(22)을 각각 재단하되, 투명기판(26)의 테두리에는 면취가공면(28)을 형성한다.Referring to FIG. 3, in the second embodiment of the present invention, first, as shown in FIG. 3A, a scattering prevention film having a transparent substrate 26 made of one of glass and PMMA and an optical pressure-sensitive adhesive layer 24 is provided. Each of the cuts 22 is formed on the edge of the transparent substrate 26 to form a chamfered surface 28.

투명기판(26)의 면취가공면(28)의 면취깊이(c)가 투명기판 두께(t)의 20~40%로 형성하고 면취각도는 40~50°로 형성한다. Chamfering depth (c) of the chamfered surface 28 of the transparent substrate 26 is formed to 20 to 40% of the thickness of the transparent substrate (t) and the chamfering angle is formed to 40 to 50 °.

더욱이 본 발명의 제2 실시예서는 도 3의 (a)에 도시된 바와 같이, 면취가공면(28)의 근접 내측 투명기판(26) 부분에 투명기판(26)의 테두리를 따라가는 점착제누설분 수용 미세요철부(27)를 가공 형성한다. 점착제누설분 수용 미세요철부(27)는 그 요홈깊이(d1)이 비산방지필름(12)의 두께(x)보다 적고 광학용 점착제층(24)의 두께(y)보다 크게 가공 형성하며, 미세요철부(27)에는 이러한 요홈들이 다수개로 마련된다. Furthermore, according to the second embodiment of the present invention, as shown in FIG. 3 (a), the adhesive leakage powder accommodating the inner side of the chamfered processing surface 28 along the edge of the transparent substrate 26 is disposed on the inner side of the transparent substrate 26. The fine concave-convex part 27 is processed and formed. The pressure-sensitive adhesive leakage-receiving fine concave portion 27 is formed by processing the groove depth d1 smaller than the thickness x of the anti-scattering film 12 and larger than the thickness y of the optical adhesive layer 24. (27) is provided with a plurality of these grooves.

그리고 광학용 점착제층(24)이 형성된 비산방지필름(22)은 투명기판(26)의 면취가공면(28)을 제외한 투명기판(26)의 사이즈로 재단하여 마련한다. The shatterproof film 22 having the optical adhesive layer 24 formed thereon is cut to the size of the transparent substrate 26 except for the chamfered surface 28 of the transparent substrate 26.

이렇게 점착제누설분 수용 미세요철부(27)을 갖는 글라스나 PMMA(poly methylmethacrylate)재질의 투명기판(26)과 합지 대상으로서 광학용 점착제층(24)을 갖는 비산방지필름(22)을 각각 재단하여 마련한 다음에는, 합지공정에서 도 3의 (b)에서와 같이 투명기판(26)의 전면부 상에 비산방지필름(22)을 덮어 씌워 합지하되 합지용 프레스로 합지 압력(상부압력)을 가함으로써 투명기판(26)상에 비산방지필름(22)이 합지되게 한다. The shatterproof film 22 having the optical pressure-sensitive adhesive layer 24 is cut and prepared by laminating the glass or PMMA (poly methylmethacrylate) material having the pressure-sensitive adhesive leakage-receiving uneven portion 27. Next, in the lamination process, as shown in (b) of FIG. 3, the shatterproof film 22 is covered and laminated on the front surface of the transparent substrate 26, but is transparent by applying a lamination pressure (upper pressure) with a lamination press. The scattering prevention film 22 is laminated on the substrate 26.

이렇게 비산방지필름(22)이 투명기판(26)에 합지됨에 따라 합지 압력에 의해 밀린 점착제 분량이 도 3의 (c)에서와 같이, 투명기판(26)상 가장자리에 형성된 점착제누설분 수용 미세요철부(27)의 다수 요홈들로 대피되어지므로 투명패널(20)의 테두리 외곽으로는 점착제 누설분이 없는 투명패널(20)이 제작완성된다. As the scattering prevention film 22 is laminated on the transparent substrate 26, the amount of the pressure-sensitive adhesive pushed by the lamination pressure, as shown in FIG. 3 (c), is formed on the transparent substrate 26. Since the plurality of grooves of 27 are evacuated, the transparent panel 20 without adhesive leakage is completed on the outer edge of the transparent panel 20.

즉 도 3과 같은 본 발명의 제2 실시예에 따른 비산방지필름 적용 투명패널(20)은, 글라스와 PMMA중의 하나로 된 투명기판(26)과 광학용 점착제층(24)을 갖는 비산방지필름(22)을 각각 재단하고 합지하여 투명패널(20)을 구성하되, 투명기판(26)의 테두리에는 면취가공면(28)이 형성되고 면취가공면(28)에 근접된 내측 투명기판(26)상에는 점착제누설분 수용 미세요철부(27)이 형성되게 구성하며, 점착제 누설분 수용 미세요철부(27)은 요홈깊이(d1)가 비산방지필름(22)의 두께(x)보다 적고 점착제층(24)의 두께(y)보다 크게 구성하며, That is, the transparent panel 20 to which the anti-scattering film is applied according to the second embodiment of the present invention as shown in FIG. 3 includes a transparent substrate 26 made of one of glass and PMMA and an optical adhesive layer 24. 22) each of the cutting and laminating to form a transparent panel 20, the chamfered surface 28 is formed on the edge of the transparent substrate 26, and on the inner transparent substrate 26 adjacent to the chamfered processing surface 28 The pressure-sensitive adhesive leakage-receiving fine concave portion 27 is formed, and the pressure-receiving portion-receiving minute concave portion 27 of the pressure-sensitive adhesive leakage is less than the thickness (x) of the anti-scattering film 22 and the pressure-sensitive adhesive layer 24 Larger than the thickness (y),

비산방지필름(22)은 투명기판(26)의 면취가공면(28)을 제외한 투명기판(26)의 사이즈로 재단되어서 투명기판(26)에 합지됨에 따라 합지 압력에 의해 밀린 점착제 분량이 투명기판(26)의 점착제누설분 수용 미세요철부(27)로 대피되어진 투명패널(20)을 구성한 것이다. The scattering prevention film 22 is cut to the size of the transparent substrate 26 except for the chamfered surface 28 of the transparent substrate 26 and laminated on the transparent substrate 26 so that the amount of pressure-sensitive adhesive pushed by the lamination pressure is transparent substrate. The transparent panel 20 evacuated to the pressure-sensitive adhesive leakage-receiving uneven part 27 of (26) is comprised.

이러한 본 발명의 제2 실시예에 따른 비산방지필름 적용 투명패널(20)은 합지 압력에 의해 밀린 점착제 분량이 투명기판(26)상 가장자리에 형성된 점착제누설분 수용 미세요철부(27)로 대피하도록 해줌으로써 광학용 점착제의 외부 누설이 방지되므로 비산방지필름(22) 적용한 투명패널(20)의 외관 개선 및 치수 균일화가 가능하다. 또 광학용 점착제의 누설물로 인한 외관 불량 문제가 발생되지 않는다. The transparent panel 20 to which the anti-scattering film is applied according to the second embodiment of the present invention allows the pressure-sensitive adhesive portion pushed out by the lamination pressure to be evacuated to the pressure-sensitive adhesive leakage-receiving portion 27 formed on the edge on the transparent substrate 26. Therefore, since the external leakage of the optical adhesive is prevented, it is possible to improve the appearance and uniform the dimensions of the transparent panel 20 to which the scattering prevention film 22 is applied. In addition, the problem of appearance defects due to leakage of the optical adhesive does not occur.

상술한 본 발명의 설명에서는 구체적인 실시 예에 관해 설명하였으나, 여러 가지 변형이 본 발명의 범위에서 벗어나지 않고 실시할 수 있다. 따라서 본 발명의 범위는 설명된 실시 예에 의하여 정할 것이 아니고 특허청구범위 및 그 특허청구범위와 균등한 것에 의해 정해 져야 한다. In the above description of the present invention, specific embodiments have been described, but various modifications may be made without departing from the scope of the present invention. Therefore, the scope of the present invention should not be defined by the described embodiments, but should be defined by the claims and their equivalents.

(10)(20)-- 비산방지필름 적용 투명패널 (12)(22)--- 비산방지필름
(14)(24)-- 광학용 접착제층 (16)(26)-- 투명기판
(17)-- 점착제누설분 수용 도랑 (18)(28)-- 면취가공면
(27)-- 점착제누설분 수용 미세요철부(10) (20)-Transparent panel with shatterproof film (12) (22) --- Shatterproof film
(14) (24)-Optical adhesive layer (16) (26)-Transparent substrate
(17)-Adhesive leakage receiving groove (18) (28)-Chamfering surface
(27)-adhesive leakage

Claims (4)

비산방지필름 적용 투명패널 합지방법에 있어서,
글라스와 PMMA중의 하나로 된 투명기판(16)과 광학용 점착제층(14)을 갖는 비산방지필름(12)을 각각 재단하되, 투명기판(16)의 테두리에는 면취가공면(18)을 형성하고 면취가공면(18)의 근접 내측 투명기판(16) 부분에 상기 테두리를 따라가며 점착제누설분 수용 도랑(17)을 가공 형성하되 점착제누설분 수용 도랑(17)은 깊이(d)와 폭(w)이 비산방지필름(12)의 두께(x)보다 적고 점착제층(14)의 두께(y)보다 크게 가공 형성하며,
비산방지필름(12)은 투명기판(16)의 면취가공면(18)을 제외한 투명기판(16)의 사이즈로 재단하여 마련한 후,
투명기판(16)의 전면부 상에 비산방지필름(12)을 덮어 씌운후 합지 압력을 가해 합지하여서 합지 압력에 의해 밀린 점착제 분량이 점착제누설분 수용 도랑(17)으로 대피되어진 투명패널(10)을 얻음을 특징으로 하는 비산방지필름 적용 투명패널 합지방법.
In the transparent panel lamination method applying shatterproof film,
The shatterproof film 12 having the transparent substrate 16 and the optical pressure sensitive adhesive layer 14 made of one of glass and PMMA is cut, respectively, and a chamfered surface 18 is formed on the edge of the transparent substrate 16 and chamfered. The adhesive leakage-receiving groove 17 is formed by processing the adhesive leakage-receiving groove 17 along the edge of the inner side of the transparent substrate 16 near the processing surface 18, and the depth (d) and the width (w) are processed. Processed and formed less than the thickness (x) of the scattering prevention film 12 and larger than the thickness (y) of the pressure-sensitive adhesive layer 14,
After the shatterproof film 12 is cut and prepared to the size of the transparent substrate 16 except for the chamfered surface 18 of the transparent substrate 16,
The transparent panel 10 covered with the shatterproof film 12 on the front surface of the transparent substrate 16 and then laminated by applying a lamination pressure, and the amount of the adhesive pushed by the lamination pressure is evacuated to the adhesive leakage receiving groove 17. Transparent panel lamination method applied shatterproof film characterized in that the obtained.
비산방지필름 적용 투명패널에 있어서,
글라스와 PMMA중의 하나로 된 투명기판(16)과 광학용 점착제층(14)을 갖는 비산방지필름(12)을 각각 재단하고 합지하여 투명패널(10)을 구성하되, 투명기판(16)의 테두리에는 면취가공면(18)이 형성되고 면취가공면(18)에 근접된 내측 투명기판(16)상에 상기 테두리를 따라가며 점착제누설분 수용 도랑(17)이 가공형성되게 구성하며, 점착제누설분 수용 도랑(17)은 깊이(d)와 폭(w)이 비산방지필름(12)의 두께(x)보다 작고 점착제층(14)의 두께(y)보다 크게 구성하며,
비산방지필름(12)은 투명기판(16)의 면취가공면(18)을 제외한 투명기판(16)의 사이즈로 재단되어서 투명기판(16)에 합지됨에 따라 합지 압력에 의해 밀린 점착제 분량이 투명기판(16)의 점착제누설분 수용 도랑(17)으로 대피되어진 투명패널(10)을 구성함을 특징으로 하는 비산방지필름 적용 투명패널.
In the transparent panel applying shatterproof film,
A transparent panel 10 is formed by cutting and laminating the anti-scattering film 12 having the transparent substrate 16 made of glass and PMMA and the optical pressure-sensitive adhesive layer 14, respectively, on the edge of the transparent substrate 16. The chamfered processing surface 18 is formed and the pressure-sensitive adhesive leakage receiving groove 17 is formed on the inner transparent substrate 16 proximate to the chamfering processing surface 18 so as to form and process the pressure-sensitive adhesive leakage. The groove 17 has a depth d and a width w smaller than the thickness x of the shatterproof film 12 and larger than the thickness y of the pressure-sensitive adhesive layer 14.
The shatterproof film 12 is cut to the size of the transparent substrate 16 except for the chamfered surface 18 of the transparent substrate 16 and is laminated on the transparent substrate 16 so that the amount of pressure-sensitive adhesive pushed by the lamination pressure is transparent substrate. Transparent panel applying shatterproof film, characterized in that the transparent panel (10) evacuated to the pressure-sensitive adhesive leakage receiving groove (17) of (16).
비산방지필름 적용 투명패널 합지방법에 있어서,
글라스와 PMMA중의 하나로 된 투명기판(26)과 광학용 점착제층(24)을 갖는 비산방지필름(22)을 각각 재단하되, 투명기판(26)의 테두리에는 면취가공면(28)을 형성하고 면취가공면(28)에 근접되며 테두리를 따르는 내측 투명기판(26)상의 면적부에는 점착제누설분 수용 미세요철부(27)를 플라즈마 처리에 의한 표면개질로 형성하되 점착제누설분 수용 미세요철부(27)는 다수 요홈의 깊이(d)가 비산방지필름(12)의 두께(x)보다 작고 점착제층(24)의 두께(y)보다 크게 형성하며,
비산방지필름(22)은 투명기판(26)의 면취가공면(28)을 제외한 투명기판(26)의 사이즈로 재단하여 마련한 후,
투명기판(26)의 전면부 상에 비산방지필름(22)을 덮어 씌운후 합지 압력을 가하여 합지하여서 압력에 의해 밀린 점착제 분량이 점착제누설분 수용 미세요철부(27)로 대피되어진 투명패널(20)을 얻음을 특징으로 하는 비산방지필름 적용 투명패널 합지방법.
In the transparent panel lamination method applying shatterproof film,
A shatterproof film 22 having a transparent substrate 26 and an optical pressure sensitive adhesive layer 24 made of one of glass and PMMA is cut, respectively, and a chamfered surface 28 is formed on the edge of the transparent substrate 26 and chamfered. In the area portion on the inner transparent substrate 26 adjacent to the processing surface 28 and along the rim, the adhesive leakage-receiving fine concave portion 27 is formed by surface modification by plasma treatment, but the adhesive leakage-receiving fine concave portion 27 is The depth d of the plurality of grooves is formed smaller than the thickness (x) of the anti-scattering film 12 and larger than the thickness (y) of the pressure-sensitive adhesive layer 24,
After the shatterproof film 22 is cut and prepared to the size of the transparent substrate 26 except for the chamfered surface 28 of the transparent substrate 26,
The transparent panel 20 which covers the scattering prevention film 22 on the front surface of the transparent substrate 26 and is laminated by applying a lamination pressure and the amount of the adhesive pushed by the pressure is evacuated to the adhesive leakage-receiving fine concave portion 27. Transparent panel lamination method applied shatterproof film characterized in that the obtained.
비산방지필름 적용 투명패널에 있어서,
글라스와 PMMA중의 하나로 된 투명기판(26)과 광학용 점착제층(24)을 갖는 비산방지필름(22)을 각각 재단하고 합지하여 투명패널(20)을 구성하되, 투명기판(26)의 테두리에는 면취가공면(28)이 형성되고 면취가공면(28)에 근접된 내측 투명기판(26)상에는 점착제누설분 수용 미세요철부(27)이 형성되게 구성하며, 점착제 누설분 수용 미세요철부(27)은 요홈깊이(d1)가 비산방지필름(22)의 두께(x)보다 작고 점착제층(24)의 두께(y)보다 크게 구성하며,
비산방지필름(22)은 투명기판(26)의 면취가공면(28)을 제외한 투명기판(26)의 사이즈로 재단되어서 투명기판(26)에 합지됨에 따라 합지 압력에 의해 밀린 점착제 분량이 투명기판(26)의 점착제누설분 수용 미세요철부(27)로 대피되어진 투명패널(20)을 구성함을 특징으로 하는 비산방지필름 적용 투명패널.In the transparent panel applying shatterproof film,
A transparent panel 20 is formed by cutting and laminating the anti-scattering film 22 having the transparent substrate 26 and the optical pressure-sensitive adhesive layer 24 made of one of glass and PMMA, respectively, on the edge of the transparent substrate 26. The chamfered processing surface 28 is formed and the adhesive leakage-receiving micro-recessed portion 27 is formed on the inner transparent substrate 26 adjacent to the chamfering-processed surface 28. The groove depth d1 is smaller than the thickness x of the anti-scattering film 22 and larger than the thickness y of the pressure-sensitive adhesive layer 24,
The scattering prevention film 22 is cut to the size of the transparent substrate 26 except for the chamfered surface 28 of the transparent substrate 26 and laminated on the transparent substrate 26 so that the amount of pressure-sensitive adhesive pushed by the lamination pressure is transparent substrate. Transparent panel applying shatterproof film, characterized in that (26) comprises a transparent panel 20 evacuated to the adhesive leakage-receiving fine concave portion (27).
KR1020180064181A 2018-06-04 2018-06-04 Method for laminating shatter-proof film apply to transparent panel and transparent panel thereof KR102012281B1 (en)

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