KR102012280B1 - Method for laminating shatter-proof film apply to transparent panel and transparent panel thereof - Google Patents

Method for laminating shatter-proof film apply to transparent panel and transparent panel thereof Download PDF

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KR102012280B1
KR102012280B1 KR1020180064180A KR20180064180A KR102012280B1 KR 102012280 B1 KR102012280 B1 KR 102012280B1 KR 1020180064180 A KR1020180064180 A KR 1020180064180A KR 20180064180 A KR20180064180 A KR 20180064180A KR 102012280 B1 KR102012280 B1 KR 102012280B1
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transparent substrate
film
shatterproof film
transparent
shatterproof
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KR1020180064180A
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Korean (ko)
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박희열
표중화
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유한회사 대구특수금속
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/04—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by at least one layer folded at the edge, e.g. over another layer ; characterised by at least one layer enveloping or enclosing a material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0036—Heat treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/412—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
    • B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
    • B32B2310/0843—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2607/00—Walls, panels

Abstract

The present invention cuts a transparent substrate (16) made of one of glass and PMMA and a shatterproof film (12) having an optical adhesive layer (14), respectively. The shatterproof film (12) has a size cut to be longer by 70 to 91% size (s) of the thickness (t) of the transparent substrate (16). A chamfering surface (18) is formed on the transparent substrate (16), and the chamfering depth (c) is formed to be 7 to 14% of the thickness (t) of the transparent substrate. The shatterproof film (12) is covered on a front portion of the transparent substrate (16) and a thickness side wall portion of the transparent substrate (16) to form a lamination. A bent film at an edge is plastically deformed by laser heating to maintain a shape at a corner portion of the transparent substrate (16) on which the shatterproof film (12) is folded to be covered. It is possible to prevent an appearance problem due to leakage of an optical adhesive generated on the edge of a transparent panel (10) when adhesive of the optical adhesive layer (14) formed on the shatterproof film (12) sticks out to all sides by lamination pressure during lamination of the transparent substrate such as glass and PMMA, and the shatterproof film. In addition, appearance improvement and dimensional uniformity are possible by preventing the leakage of the optical adhesive from remaining.

Description

비산방지필름 적용 투명패널 합지방법 및 그 투명패널{METHOD FOR LAMINATING SHATTER-PROOF FILM APPLY TO TRANSPARENT PANEL AND TRANSPARENT PANEL THEREOF} Transparent panel lamination method with scattering prevention film and the transparent panel {METHOD FOR LAMINATING SHATTER-PROOF FILM APPLY TO TRANSPARENT PANEL AND TRANSPARENT PANEL THEREOF}

본 발명은 투명패널 제조방법에 관한 것으로, 특히 제품의 투명패널에 비산방지필름을 합지시키는 방법의 개량에 관한 것이다. The present invention relates to a method for manufacturing a transparent panel, and more particularly, to an improvement of a method of laminating a scattering prevention film on a transparent panel of a product.

요즈음 휴대전화나 휴대게임기 제품, 생활가전제품, 차량의 계기명판이나 조작판, 헤드업 디스플레이(HUD) 등에는 디스플레이나 TSP(Touch Screen Panel) 용도로서, 강화유리와 같은 글라스(galss)재질이나 내광성 및 투명성이 좋은 PMMA(poly methylmethacrylate)재질 또는 PC(polycarbonate resin)재질 등을 많이 사용하고 있다. These days, for display and TSP (Touch Screen Panel), such as mobile phone, portable game console, home appliance, vehicle's name plate, operation panel, and head-up display (HUD), glass materials such as tempered glass (galss) and light resistance And PMMA (poly methylmethacrylate) material or PC (polycarbonate resin) material with good transparency is used a lot.

이러한 투명성을 갖는 글라스나 PMMA와 같은 투명기판에는 상대물과 결합해도 여전히 높은 투과율을 유지할 수 있으면서 기본적으로는 비산 방지 효과를 동시에 구현할 수 있고 또 필요에 따라서는 커버글라스 장식효과까지도 가능하도록 하는 비산 방지 필름(Anti-Scattering Film)을 합지하여 사용한다. Transparent substrates such as glass or PMMA, which have such transparency, can still maintain high transmittance even when combined with counterparts, and can basically achieve scattering prevention effect and cover glass decoration effect if necessary. Anti-Scattering Film is used by laminating.

비산 방지 필름은 글라스나 PMMA와 같은 투명패널이 물체와의 충돌이나 외부 충격으로 인하여 파손후 비산되는 것을 방지하기 위해 투명기판에 합지되며, 그에 따라 투명기판이 파손되더라도 인체에 상해를 입히거나 주변물을 손상시키는 것이 예방된다.Shatterproof film is laminated to a transparent substrate to prevent the transparent panel such as glass or PMMA from being scattered after being damaged due to collision with an object or an external impact, so that even if the transparent substrate is damaged, it may cause injury or damage to the human body. Damage is prevented.

비산방지필름이 적용된 투명패널은 글라스와 PMMA와 같은 투명기판과 일면에 광학용 점착제층이 형성된 비산방지필름을 필요만큼 각각 재단한 후 합지공정을 통해서 일체화시킴으로써 얻어진다. The transparent panel to which the anti-scattering film is applied is obtained by integrating the transparent substrates such as glass and PMMA and the anti-scattering film having an optical pressure-sensitive adhesive layer formed on one surface thereof as necessary and then laminating them.

그런데 이러한 합지공정에서는 도 1에 도시된 바와 같이, 글라스와 PMMA와 같은 투명기판(6)과 비산방지필름(2)을 합지시 그 합지압력에 의해서 비산방지필름(2)에 형성된 광학용 점착제층(4)의 성분이 사방측면으로 삐져 나오면서 투명패널의 테두리부에는 광학용 점착제의 삐져나온 누설물(8)이 생기게 된다. However, in this lamination process, as shown in FIG. 1, when the transparent substrate 6 such as glass and PMMA and the anti-scattering film 2 are laminated, the optical pressure-sensitive adhesive layer formed on the anti-scattering film 2 by the laminating pressure thereof. As the component (4) sticks out on all sides, the leaked substance 8 sticking out of the optical adhesive is formed on the edge of the transparent panel.

이렇게 광학용 점착제층(4)에서 삐져나온 누설물(8)은 투명패널 제품의 외관 불량을 야기시키며 더욱이 점착제 누설물에 이물질이 달라붙는 이차적인 문제까지도 야기시킨다. The leakage 8 protruding from the optical pressure-sensitive adhesive layer 4 causes a poor appearance of the transparent panel product, and also causes a secondary problem in which foreign matter adheres to the pressure-sensitive adhesive leakage.

국내 등륵특허공보 제10-0800168호 "유리 비산 방지 필름의 합지 방법 및 그 장치"Domestic Patent Publication No. 10-0800168 "Lamination method and apparatus thereof for preventing glass scattering film"

따라서 본 발명의 목적은 글라스와 PMMA와 같은 투명기판과 비산방지필름을 합지시 그 합지압력에 의해서 비산방지필름에 형성된 광학용 점착제층의 성분이 사방측면으로 삐져 나오면서 투명패널의 테두리부에 생기는 광학용 점착제의 누설물로 인해 야기되는 외관 불량이나 누설물에 이물질이 달라붙는 이차적 문제가 없도록 하는 비산방지필름 적용 투명패널 합지방법 및 그 투명패널을 제공함에 있다. Accordingly, an object of the present invention is that the optical adhesive layer formed on the scattering prevention film by the lamination pressure when the transparent substrate such as glass and PMMA and the scattering prevention film is laminated to the sides of the transparent optical The present invention provides a transparent panel laminating method and a transparent panel applied with a shatterproof film for preventing the appearance problem caused by the leakage of the pressure-sensitive adhesive or the secondary problem that foreign matters adhere to the leakage.

상기한 목적에 따른 본 발명은, 비산방지필름 적용 투명패널 합지방법에 있어서, 글라스와 PMMA중의 하나로 된 투명기판(16)과 광학용 점착제층(14)을 갖는 비산방지필름(12)을 각각 재단하되 비산방지필름(12)은 투명기판(16) 전면부 사이즈에서 투명기판 두께(t)의 70~91% 크기만큼 더 크게 재단하고, 투명기판(16)의 테두리를 면취가공하되 면취깊이(c)가 투명기판 두께(t)의 7~14%로 면취가공하여 면취가공면(18)을 마련한 후, According to the present invention according to the above object, in the scattering prevention film application transparent panel lamination method, the scattering prevention film 12 having the transparent substrate 16 and the optical pressure-sensitive adhesive layer 14 made of one of glass and PMMA, respectively. However, the shatterproof film 12 is cut at a size larger than 70 to 91% of the thickness of the transparent substrate (t) in the size of the front surface of the transparent substrate 16, and the edge of the transparent substrate 16 is chamfered, but the chamfering depth (c ) Is chamfered to 7 to 14% of the transparent substrate thickness (t) to prepare the chamfered surface 18,

투명기판(16)의 전면부와 투명기판(16)의 두께측벽부에 비산방지필름(12)을 덮어 씌워 합지하되 합지 상부압력으로 전면부를 1차 합지하고 별도 마련된 상부금형으로 눌러서 모서리부분과 두께측벽부를 2차 합지하며, Cover the front part of the transparent substrate 16 and the thickness side wall of the transparent substrate 16 by covering the shatterproof film 12, and laminating. Second side lamination,

비산방지필름(12)이 꺾어지게 덮여진 투명기판(16)의 모서리부에는 레이저로 가열하여 모서리의 절곡부 필름이 형상 유지되게 형성하여서 투명패널(10)을 얻음을 특징으로 한다. At the corners of the transparent substrate 16 covered with the shatterproof film 12, the transparent panel 10 is obtained by forming a bent film at the corner by heating with a laser.

즉 본 발명은, 비산방지필름 적용 투명패널에 있어서, 글라스와 PMMA중의 하나로 된 투명기판(16)과 광학용 점착제층(14)을 갖는 비산방지필름(12)을 각각 재단하되 비산방지필름(12)은 투명기판(16) 전면부 사이즈에서 투명기판 두께(t)의 70~91% 크기만큼 더 길게 재단된 사이즈로 구성하고, 투명기판(16)에 면취가공면을 형성하되 면취깊이(c)가 투명기판 두께(t)의 7~14% 되게 형성하며, That is, according to the present invention, in the transparent panel to which the anti-scattering film is applied, the anti-scattering film 12 having the transparent substrate 16 made of one of glass and PMMA and the optical adhesive layer 14 is cut, respectively, but the anti-scattering film 12 ) Is formed in the size of the front portion of the transparent substrate 16 cut to a length of 70 to 91% longer than the thickness (t) of the transparent substrate, and form a chamfered surface on the transparent substrate 16, but the chamfering depth (c) Forms 7 to 14% of the thickness (t) of the transparent substrate,

투명기판(16)의 전면부와 투명기판(16)의 두께측벽부에 비산방지필름(12)을 덮어 씌워 합지 구성하되 비산방지필름(12)이 꺾어지게 덮여진 투명기판(16)의 모서리부에는 레이저 가열로 모서리의 절곡부 필름이 소성 변형되어서 형상 유지되게 구성함을 특징으로 한다. The front part of the transparent substrate 16 and the thickness side wall of the transparent substrate 16 cover the shatterproof film 12 to form a lamination, but the edges of the transparent substrate 16 covered with the shatterproof film 12 are bent. It characterized in that the bent portion film of the edge of the laser heating is configured to be plastically deformed and maintained in shape.

또한 본 발명의 다른 견지로서, 비산방지필름 적용 투명패널 합지방법에 있어서, 글라스와 PMMA중의 하나로 된 투명기판(26)과 광학용 점착제층(24)을 갖는 비산방지필름(22)을 각각 재단하되 투명기판(26)의 테두리에는 면취가공면(28)을 형성하되 면취깊이(c)가 투명기판 두께(t)의 20~40%로 형성하고 비산방지필름(22)은 투명기판(26)의 면취가공면(28)을 제외한 투명기판(26)의 사이즈로 재단하여 마련한 후, In another aspect of the present invention, in the method of laminating the anti-scattering film-applied transparent panel, the anti-scattering film 22 having the transparent substrate 26 and the optical pressure-sensitive adhesive layer 24 made of one of glass and PMMA may be cut. Chamfering processing surface 28 is formed on the edge of the transparent substrate 26, the chamfering depth (c) is formed of 20 to 40% of the thickness of the transparent substrate (t), shatterproof film 22 is formed of the transparent substrate 26 After cutting and preparing the size of the transparent substrate 26 except for the chamfering surface 28,

투명기판(26)의 전면부 상에 비산방지필름(22)을 덮어 씌워 합지하되 상부압력으로 전면부를 합지한 다음, 합지시 압력에 의해 비산방지필름(22)의 테두리부로부터 삐져나온 광학용 점착제 돌출부(24a)를 레이저로 용융 제거되게 하여서 투명패널(20)을 얻음을 특징으로 한다. Cover the shatterproof film 22 on the front surface of the transparent substrate 26 to be laminated, but laminated on the front part with the upper pressure, and then the optical pressure-sensitive adhesive protruding from the edge of the shatterproof film 22 by the pressure at the time of lamination. It is characterized in that the transparent panel 20 is obtained by melting and removing the protrusion 24a with a laser.

즉 본 발명의 다른 견지에 따른 비산방지필름 적용 투명패널은, 글라스와 PMMA중의 하나로 된 투명기판(26)과 광학용 점착제층(24)을 갖는 비산방지필름(22)을 각각 재단하되 투명기판(26)의 테두리에는 면취가공면(28)을 형성하되 면취깊이(c)가 투명기판 두께(t)의 20~40%로 형성하고 비산방지필름(22)은 투명기판(26)의 면취가공면(28)을 제외한 투명기판(26)의 사이즈로 재단하여 형성하며, In other words, in the transparent panel to which the anti-scattering film is applied according to another aspect of the present invention, the anti-scattering film 22 having the transparent substrate 26 and the optical pressure-sensitive adhesive layer 24 made of one of glass and PMMA is cut, respectively, but the transparent substrate ( A chamfered processing surface 28 is formed at the edge of 26, and the chamfering depth (c) is formed at 20 to 40% of the thickness of the transparent substrate (t), and the shatterproof film 22 is a chamfering processing surface of the transparent substrate 26. It is formed by cutting to the size of the transparent substrate 26, except (28),

투명기판(26)의 전면부 상에 비산방지필름(22)을 덮어 씌워 합지함에 따라 합지압력에 의해 비산방지필름(22)의 테두리부로부터 삐져나온 광학용 점착제 돌출부(24a)를 레이저로 용융 제거되게 하여 투명기판(26)의 두께벽면과 광학용 점착제층(24)의 커팅면이 동일면 형성되게 구성함을 특징으로 한다. By covering and scattering the shatterproof film 22 on the front surface of the transparent substrate 26, the optical pressure-sensitive adhesive protrusion 24a protruding from the edge of the shatterproof film 22 by the lamination pressure is removed by laser melting. The thickness of the transparent substrate 26 and the cutting surface of the optical pressure-sensitive adhesive layer 24 are formed to be the same surface.

또한 본 발명의 또 다른 견지에 따른 비산방지필름 적용 투명패널 합지방법에 있어서, 글라스와 PMMA중의 하나로 된 투명기판(36)을 재단하되 투명기판(36)의 테두리에는 면취가공면(38)을 형성하되 면취깊이(c)가 투명기판 두께(t)의 20~40%로 형성하여 마련하고, In addition, in the method of laminating the anti-scattering film applied transparent panel according to another aspect of the present invention, the transparent substrate 36 made of one of glass and PMMA is cut, but the chamfered processing surface 38 is formed on the edge of the transparent substrate 36. However, the chamfering depth (c) is formed to form 20 to 40% of the thickness (t) of the transparent substrate,

광학용 점착제층(34)을 갖는 비산방지필름(32)을 투명기판(36)에 덮어 씌워 합지하되 상부압력으로 전면부를 합지한 다음,Cover the transparent substrate 36 with the scattering prevention film 32 having the optical pressure-sensitive adhesive layer 34 to be laminated, but the front part is laminated at an upper pressure,

합지된 비산방지필름(32)을 레이저로 절단하되 투명기판(36)의 면취가공면(38)을 제외한 합지된 비산방지필름(32)이 남도록 레이저로 비산방지필름(32)의 외곽테두리 절단하여서 투명패널(30)을 얻음을 특징으로 한다. The laminated shatterproof film 32 is cut with a laser, but the outer edge of the shatterproof film 32 is cut with a laser to leave the laminated shatterproof film 32 except for the chamfering surface 38 of the transparent substrate 36. It is characterized in that the transparent panel 30 is obtained.

본 발명은 글라스와 PMMA와 같은 투명기판과 비산방지필름을 합지시 그 합지압력에 의해서 비산방지필름에 형성된 광학용 점착제층의 점착제 성분이 사방측면으로 삐져 나오면서 투명패널의 테두리부에 생기는 광학용 점착제의 누설물로 인한 외관 불량 문제가 발생되지 않도록 해주며, 광학용 점착제의 누설물이 잔류하지 않도록 하여 외관 개선 및 치수 균일화가 가능하게 해준다. According to the present invention, when the transparent substrate such as glass and PMMA and the anti-scattering film are laminated, the pressure-sensitive adhesive component of the optical pressure-sensitive adhesive layer formed on the anti-scattering film is scattered to all sides by the laminating pressure, and thus the optical adhesive is formed on the edge of the transparent panel. This prevents the appearance defects caused by the leakage of the adhesive and prevents the leakage of the optical adhesive so that the appearance can be improved and the dimensional uniformity is possible.

도 1은 종래기술에 따른 비산방지필름 합지공정 및 그 합지후 상태를 보여주는 도면,
도 2는 본 발명의 제1 실시예에 따른 비산방지필름 합지방법 및 그에 따라 합지된 비산방지필름 적용 투명패널의 단면 구성도,
도 3은 본 발명의 제2 실시예에 따른 비산방지필름 합지방법 및 그에 따라 합지된 비산방지필름 적용 투명패널의 단면 구성도,
도 4는 본 발명의 제3 실시예에 따른 비산방지필름 합지방법 및 그에 따라 합지된 비산방지필름 적용 투명패널의 단면 구성도. 1 is a view showing a scattering prevention film lamination process and a post-lamination state according to the prior art,
2 is a cross-sectional configuration diagram of the scattering prevention film lamination method and the laminated scattering prevention film application transparent panel according to the first embodiment of the present invention,
3 is a cross-sectional configuration diagram of the scattering prevention film stacking method and the laminated shatterproof film applied transparent panel according to a second embodiment of the present invention,
Figure 4 is a cross-sectional configuration of the scattering prevention film lamination method according to a third embodiment of the present invention and the laminated scattering prevention film applied transparent panel according to the present invention.

이하 본 발명의 바람직한 실시 예들을 첨부한 도면을 참조하여 상세히 설명한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 2는 본 발명의 제1 실시예에 따른 비산방지필름 합지방법 및 그에 따라 합지된 비산방지필름 적용 투명패널(10)의 단면 구성도이다. 2 is a cross-sectional view of the scattering prevention film lamination method according to the first embodiment of the present invention and the laminated scattering prevention film applied transparent panel 10 according to the first embodiment of the present invention.

본 발명의 제1 실시 예에 따른 비산방지필름 적용 투명패널(10)의 합지방법을 도 2를 참조하여 설명한다. A method of laminating the transparent panel 10 to which the anti-scattering film is applied according to the first embodiment of the present invention will be described with reference to FIG. 2.

본 발명의 제1 실시 예에 따른 비산방지필름 적용 투명패널(10)을 제작하기 위해 먼저 도 2의 (a)에서와 같이 글라스와 PMMA(poly methylmethacrylate)중의 하나로 된 투명기판(16)과 광학용 점착제층(14)을 갖는 비산방지필름(12)을 마련하되, 투명기판(16)과 광학용 점착제층(14)을 갖는 비산방지필름(12)을 각각 재단한다. In order to fabricate the transparent panel 10 to which the anti-scattering film is applied according to the first embodiment of the present invention, first, the transparent substrate 16 made of one of glass and poly methylmethacrylate (PMMA) and optical materials, as shown in FIG. An anti-scattering film 12 having an adhesive layer 14 is provided, and the anti-scattering film 12 having the transparent substrate 16 and the optical adhesive layer 14 is cut out, respectively.

투명기판(16)의 재질중 글라스는 강화유리가 바람직하며, PMMA는 내광성 및 투명성이 우수하다. 투명기판(16)의 두께가 예컨대 1.1mm이면 광학용 점착제층(14)의 두께는 25㎛ 정도가 양호하다. Among the materials of the transparent substrate 16, glass is preferably tempered glass, and PMMA is excellent in light resistance and transparency. When the thickness of the transparent substrate 16 is, for example, 1.1 mm, the thickness of the optical pressure-sensitive adhesive layer 14 is preferably about 25 μm.

이렇게 재단된 투명기판(16)은 본 발명의 제1 실시예에 따라 면취가공하되 도 2의 (a)에 도시된 바와 같이 투명기판(16)의 면취깊이(c)가 투명기판 두께(t)의 7~14%로 약한 면취가공을 하여서 면취가공면(18)을 마련한다. 이는 투명기판(16)의 모서리부분에 대한 면취가공을 최소로 하여 직각 절곡이 잘 이루어지도록 하기 위함이다. The cut transparent substrate 16 is chamfered according to the first embodiment of the present invention, but as shown in (a) of FIG. 2, the chamfering depth (c) of the transparent substrate 16 is the thickness of the transparent substrate (t). 7 to 14% of the weak chamfering process to prepare the chamfering surface (18). This is to minimize the chamfering processing of the corner portion of the transparent substrate 16 to make a right angle bending.

본 발명의 제1 실시예에 따른 비산방지필름(12)을 재단시에는 투명기판(16)의 사이즈에서 투명기판 두께(t)의 70~91% 크기(s) 만큼 더 크게 재단한다. 즉 제1 실시예에서는 비산방지필름(12)을 투명기판 두께(t)의 70~91% 크기(s) 만큼 더 큰 오버사이즈로 재단을 한다. At the time of cutting the scattering prevention film 12 according to the first embodiment of the present invention, the size of the transparent substrate 16 is cut by 70 to 91% of the size (s) of the transparent substrate thickness (t). In other words, in the first embodiment, the shatterproof film 12 is cut into an oversize larger by 70 to 91% of the size (s) of the transparent substrate thickness t.

이렇게 글라스나 PMMA(poly methylmethacrylate)와 같은 투명기판(16)과 광학용 점착제층(14)을 갖는 비산방지필름(12)을 각각 재단한 다음에는, 도 2의 (b)d에서와 같이 투명기판(16)의 전면부와 투명기판(16)의 두께측벽부에 비산방지필름(12)을 덮어 씌워 합지한다. After cutting the scattering prevention film 12 having the transparent substrate 16 such as glass or PMMA (poly methylmethacrylate) and the pressure sensitive adhesive layer 14, respectively, the transparent substrate as shown in (b) d of FIG. The shatterproof film 12 is covered with the front part of the part 16 and the thickness side wall part of the transparent substrate 16, and laminated.

합지공정에서의 합지시 우선은 합지용 프레스에 의한 상부압력으로 전면부를 1차 합지하고, 그 후에는 별도로 마련된 상부금형으로 모서리부분과 두께측벽부가 합지되도록 하는 2차 합지를 수행한다. At the time of lamination in the lamination process, first, the front part is first laminated by the upper pressure by the lamination press, and then the second lamination is performed so that the edge part and the thickness side wall part are laminated by the upper mold provided separately.

그 다음에는 본 발명의 제1 실시예에서는 비산방지필름(12)이 꺾어지게 덮여진 투명기판(16)의 모서리부에 레이저로 가열하여 모서리의 절곡부 필름이 형상 유지되게 형성함으로써 도 2의 (c)에서와 같은 투명패널(10)을 얻는다. Next, in the first exemplary embodiment of the present invention, the shatterproof film 12 is formed by heating the edge portion of the transparent substrate 16 covered with a bend to maintain the shape of the bent portion film of FIG. A transparent panel 10 as in c) is obtained.

즉 도 2와 같은 비산방지필름 적용 투명패널(10)은, 글라스와 PMMA중의 하나로 된 투명기판(16)과 광학용 점착제층(14)을 갖는 비산방지필름(12)을 각각 재단하되 비산방지필름(12)은 투명기판(16)의 사이즈에서 투명기판 두께(t)의 70~91% 크기(s) 만큼 더 길게 재단된 사이즈로 구성하고, 투명기판(16)에 면취가공면(18)을 형성하되 면취깊이(c)가 투명기판 두께(t)의 7~14% 되게 형성하며, 투명기판(16)의 전면부와 투명기판(16)의 두께측벽부에 비산방지필름(12)을 덮어 씌워 합지 구성하되 비산방지필름(12)이 꺾어지게 덮여진 투명기판(16)의 모서리부에는 레이저 가열로 모서리의 절곡부 필름이 소성변형되어서 형상 유지되게 구성한 것이다. That is, the transparent panel 10 to which the anti-scattering film is applied as shown in FIG. 2 cuts the anti-scattering film 12 having the transparent substrate 16 made of one of glass and PMMA and the optical adhesive layer 14, respectively. (12) consists of a size cut from the size of the transparent substrate 16 longer by 70-91% size (s) of the thickness (t) of the transparent substrate, and the chamfered surface 18 on the transparent substrate 16 Forming the chamfering depth (c) to 7 to 14% of the thickness (t) of the transparent substrate, and covering the shatterproof film 12 on the front side of the transparent substrate 16 and the thickness side wall of the transparent substrate 16. It is configured to cover the lamination, but the edge portion of the transparent substrate 16 covered with the shatterproof film 12 is folded to be configured to maintain the shape by plastic deformation of the bent portion of the corner by laser heating.

이러한 제1 실시예에 따른 비산방지필름 적용 투명패널(10)은 투명기판(16)의 두께측벽부까지 비산방지필름(12)이 덮여지므로 투명패널(10)의 전면부로의 점착제 누설이 방지된다. 그러므로 투명패널(10)의 테두리부에 생기는 광학용 점착제의 누설물로 인한 외관 불량 문제가 발생되지 않는다. In the transparent panel 10 to which the anti-scattering film is applied according to the first embodiment, the anti-scattering film 12 is covered up to the thickness side wall of the transparent substrate 16, thereby preventing adhesive leakage to the front portion of the transparent panel 10. . Therefore, the problem of appearance defects due to leakage of the optical adhesive generated on the edge of the transparent panel 10 does not occur.

도 3은 본 발명의 제2 실시예에 따른 비산방지필름(22)의 합지방법 및 그에 따라 합지된 비산방지필름(22) 적용 투명패널(20)의 단면 구성도이다. 3 is a cross-sectional configuration of the method of laminating the anti-scattering film 22 according to the second embodiment of the present invention and the transparent panel 20 to which the anti-scattering film 22 is applied accordingly.

본 발명의 제2 실시 예에 따른 비산방지필름 적용 투명패널(20)의 제작을 위한 합지방법을 도 3을 참조하여 설명한다.A lamination method for fabricating the scattering prevention film applying transparent panel 20 according to the second embodiment of the present invention will be described with reference to FIG. 3.

도 3을 참조하면, 본 발명의 제2 실시예에서는, 먼저 도 3의 (a)에서와 같이, 글라스와 PMMA중의 하나로 된 투명기판(26)과 광학용 점착제층(24)을 갖는 비산방지필름(22)을 각각 재단하되, 투명기판(26)의 테두리에는 면취가공면(28)을 형성한다.Referring to FIG. 3, in the second embodiment of the present invention, first, as shown in FIG. 3A, a scattering prevention film having a transparent substrate 26 made of one of glass and PMMA and an optical pressure-sensitive adhesive layer 24 is provided. Each of the cuts 22 is formed on the edge of the transparent substrate 26 to form a chamfered surface 28.

투명기판(26)의 면취가공면(28)의 면취깊이(c)가 투명기판 두께(t)의 20~40%로 형성하고 면취각도는 40~50°로 형성한다. 이때 비산방지필름(22)은 투명기판(26)의 면취가공면(28)을 제외한 투명기판(26)의 사이즈로 재단하여 마련한다. Chamfering depth (c) of the chamfered surface 28 of the transparent substrate 26 is formed to 20 to 40% of the thickness of the transparent substrate (t) and the chamfering angle is formed to 40 to 50 °. At this time, the shatterproof film 22 is prepared by cutting to the size of the transparent substrate 26 except for the chamfered surface 28 of the transparent substrate 26.

이렇게 글라스나 PMMA(poly methylmethacrylate)와 같은 투명기판(26)과 광학용 점착제층(24)을 갖는 비산방지필름(22)을 각각 재단하여 마련한 다음에는, 합지공정에서 도 3의 (b)에서와 같이 투명기판(26)의 전면부 상에 비산방지필름(22)을 덮어 씌워 합지하되 상부압력으로 전면부를 합지한다. Thus, after cutting and preparing the scattering prevention film 22 having the transparent substrate 26 such as glass or PMMA (poly methylmethacrylate) and the optical pressure-sensitive adhesive layer 24, respectively, in the lamination process as shown in FIG. As described above, the shatterproof film 22 is covered and laminated on the front surface of the transparent substrate 26, but the front surface is laminated with the upper pressure.

그 다음에는, 합지시 압력에 의해 비산방지필름(22)의 테두리부로부터 삐져나온 광학용 점착제 돌출부(24a)를 레이저로 용융 제거되게 함으로써 도 3의 (c)와 같은 투명패널(20)을 얻는다. Then, the optical pressure-sensitive adhesive protrusion 24a protruding from the edge of the scattering prevention film 22 by the lamination pressure is melted and removed by a laser to obtain a transparent panel 20 as shown in FIG. .

즉, 본 발명의 제2 실시예에 따른 비산방지필름 적용 투명패널(20)은, 글라스와 PMMA중의 하나로 된 투명기판(26)과 광학용 점착제층(24)을 갖는 비산방지필름(22)을 각각 재단하되 투명기판(26)의 테두리에는 면취가공면(28)을 형성하되 면취깊이(c)가 투명기판 두께(t)의 20~40%로 형성하고 면취각도는 40~50°로 형성하며 비산방지필름(22)은 투명기판(26)의 면취가공면(28)을 제외한 투명기판(26)의 사이즈로 재단하여 형성하며, 투명기판(26)의 전면부 상에 비산방지필름(22)을 덮어 씌워 합지함에 따라 합지압력에 의해 비산방지필름(22)의 테두리부로부터 삐져나온 광학용 점착제 돌출부(24a)를 레이저로 용융 제거되게 하여 투명기판(26)의 두께벽면과 광학용 점착제층(24)의 커팅면이 동일면 형성되게 구성한 것이다. That is, the anti-scattering film-applied transparent panel 20 according to the second embodiment of the present invention, the anti-scattering film 22 having a transparent substrate 26 and optical adhesive layer 24 made of one of glass and PMMA. Each is cut, but the chamfered processing surface 28 is formed at the edge of the transparent substrate 26, and the chamfering depth (c) is formed at 20 to 40% of the thickness of the transparent substrate (t) and the chamfering angle is formed at 40 to 50 °. Shatterproof film 22 is formed by cutting to the size of the transparent substrate 26 except for the chamfered surface 28 of the transparent substrate 26, the shatterproof film 22 on the front portion of the transparent substrate 26. As a result of covering and laminating, the optical pressure-sensitive adhesive protrusion 24a protruding from the edge of the scattering prevention film 22 by the lamination pressure is melted and removed by a laser to cover the thickness of the transparent substrate 26 and the optical pressure-sensitive adhesive layer ( The cutting surface of 24) is configured to be formed on the same surface.

이러한 제2 실시예에 따른 비산방지필름 적용 투명패널(20)은 투명기판(26)상에 합지된 비산방지필름(12)에서 삐져나온 광학용 점착제 돌출부(24a)가 제거되므로 즉 광학용 점착제의 누설물이 없으므로 그로 인한 외관 불량 문제가 발생되지 않는다. In the transparent panel 20 to which the anti-scattering film is applied according to the second embodiment, since the optical adhesive protrusions 24a protruding from the scattering preventing film 12 laminated on the transparent substrate 26 are removed, that is, the optical adhesive Since there is no leakage, the problem of appearance defects is not caused.

도 4는 본 발명의 제3 실시예에 따른 비산방지필름(32)의 합지방법 및 그에 따라 합지된 비산방지필름 적용 투명패널(30)의 단면 구성도이다. 4 is a cross-sectional view of the method of laminating the anti-scattering film 32 and the transparent panel 30 to which the anti-scattering film is applied according to the third embodiment of the present invention.

본 발명의 제3 실시 예에 따른 비산방지필름(32) 적용 투명패널(30)의 제작 방법을 도 4를 참조하여 설명한다. The manufacturing method of the transparent panel 30 to which the anti-scattering film 32 is applied according to the third embodiment of the present invention will be described with reference to FIG. 4.

도 4를 참조하면, 본 발명의 제3 실시예에서는, 먼저 도 4의 (a)에서와 같이 글라스와 PMMA중의 하나로 된 투명기판(36)을 재단하되 투명기판(36)의 테두리에는 면취가공면(38)을 형성하되 면취깊이(c)가 투명기판 두께(t)의 20~40%로 형성하고 면취각도는 40~50°로 형성하여 마련한다. Referring to FIG. 4, in the third embodiment of the present invention, first, the transparent substrate 36 made of one of glass and PMMA is cut as shown in FIG. 4 (a), but the chamfered surface is formed at the edge of the transparent substrate 36. (38) is formed, the chamfering depth (c) is formed to 20 to 40% of the thickness (t) of the transparent substrate and the chamfering angle is formed to form 40 to 50 °.

그리고, 본 발명의 제3 실시예에서는 광학용 점착제층(34)을 갖는 비산방지필름(32)은 맞춤재단하지 않고 합지공정후에 외곽테두리를 레이제로 절단하는 것이다. 즉 광학용 점착제층(34)을 갖는 비산방지필름(32)을 사전 재단하지 않는다. In the third embodiment of the present invention, the shatterproof film 32 having the optical adhesive layer 34 is cut to the outer edge with a laze after the lamination process without being tailored. In other words, the shatterproof film 32 having the optical adhesive layer 34 is not cut in advance.

이렇게 사전 재단되지 않은 비산방지필름(32)을 도 4의 (b)에서와 같이 투명기판(36)에 덮어 씌워 합지하되 합지용 프레스의 상부압력으로 전면부를 합지한다. The shatterproof film 32, which is not cut in advance, is covered with the transparent substrate 36 as shown in FIG. 4 (b) and laminated, but the front part is laminated with the upper pressure of the lamination press.

그 다음에는, 본 발명의 제3 실시예에서는 도 4의 (c)에서와 같이 글라스나 PMMA와 같은 투명기판(36)상에 합지된 비산방지필름(32)을 수치제어된 레이저로 절단하되, 투명기판(36)의 면취가공면(38)을 제외한 합지된 비산방지필름(32)이 남도록 수치제어된 레이저로 비산방지필름(32)의 외곽테두리 절단하여서 도 4의 (c)에 도시된 바와 같은 투명패널(30)을 얻는다. Next, in the third embodiment of the present invention, as shown in (c) of FIG. 4, the shatterproof film 32 laminated on the transparent substrate 36 such as glass or PMMA is cut with a numerically controlled laser. As shown in FIG. 4C, the outer edge of the scattering prevention film 32 is cut with a laser controlled to numerically control the laminated scattering prevention film 32 except for the chamfered surface 38 of the transparent substrate 36. The same transparent panel 30 is obtained.

상기와 같은 제3 실시예에 따른 비산방지필름 적용 투명패널(30)은 투명기판(26)상에 비산방지필름(32)이 합지된 후 불필요 부분이 수치제어된 레이저에 의해서 제거되므로 광학용 점착제의 누설물도 없고 그에 따라 광학용 점착제로 인한 외관 불량 문제도 발생되지 않는다. The transparent panel 30 to which the anti-scattering film is applied according to the third embodiment is optically adhesive since unnecessary parts are removed by a numerically controlled laser after the anti-scattering film 32 is laminated on the transparent substrate 26. There is no leakage and thus no problem of appearance defects due to the optical adhesive.

상술한 본 발명의 설명에서는 구체적인 실시 예에 관해 설명하였으나, 여러 가지 변형이 본 발명의 범위에서 벗어나지 않고 실시할 수 있다. 따라서 본 발명의 범위는 설명된 실시 예에 의하여 정할 것이 아니고 특허청구범위 및 그 특허청구범위와 균등한 것에 의해 정해 져야 한다. In the above description of the present invention, specific embodiments have been described, but various modifications may be made without departing from the scope of the present invention. Therefore, the scope of the present invention should not be defined by the described embodiments, but should be defined by the claims and their equivalents.

(10)(20)(30)-- 비산방지필름 적용 투명패널
(12)(22)(32)--- 비산방지필름
(14)(24)(34)-- 광학용 접착제층
(16)(26)(36)-- 투명기판
(18)(28)(38)-- 면취가공면(10) (20) (30)-Transparent panel with shatterproof film
(12) (22) (32) --- Shatterproof film
(14) (24) (34)-Optical adhesive layer
(16) (26) (36)-Transparent Substrate
(18) (28) (38)-Chamfering Surface

Claims (6)

비산방지필름 적용 투명패널 합지방법에 있어서,
글라스와 PMMA중의 하나로 된 투명기판(16)과 광학용 점착제층(14)을 갖는 비산방지필름(12)을 각각 재단하되 비산방지필름(12)은 투명기판(16)에서 투명기판 두께(t)의 70~91% 크기(s) 만큼 더 크게 재단하고, 투명기판(16)을 면취가공하되 면취깊이(c)가 투명기판 두께(t)의 7~14%로 면취가공하여 면취가공면(18)을 마련한 후,
투명기판(16)의 전면부와 투명기판(16)의 두께측벽부에 비산방지필름(12)을 덮어 씌워 합지하되 합지 상부압력으로 전면부를 1차 합지하고 별도 마련된 상부금형으로 눌러서 모서리부분과 두께측벽부를 2차 합지하며,
비산방지필름(12)이 꺾어지게 덮여진 투명기판(16)의 모서리부에는 레이저로 가열하여 모서리의 절곡부 필름이 형상 유지되게 형성하여서 투명패널(10)을 얻음을 특징으로 하는 비산방지필름 적용 투명패널 합지방법.
In the transparent panel lamination method applying shatterproof film,
The shatterproof film 12 having the transparent substrate 16 and the optical pressure sensitive adhesive layer 14 made of one of glass and PMMA is cut, respectively, but the shatterproof film 12 is the transparent substrate thickness t on the transparent substrate 16. Cut 70% to 91% larger than the size (s) and chamfer the transparent substrate 16, but the chamfering depth (c) is chamfered to 7-14% of the thickness of the transparent substrate (t). ),
Cover the front part of the transparent substrate 16 and the thickness side wall of the transparent substrate 16 by covering the shatterproof film 12, and laminating. Second side lamination,
Shatterproof film is applied to the edge portion of the transparent substrate 16 covered with the shatterproof film 12 bent to form a bent film of the corner by heating with a laser to obtain a transparent panel 10, characterized in that Transparent panel lamination method.
비산방지필름 적용 투명패널에 있어서,
글라스와 PMMA중의 하나로 된 투명기판(16)과 광학용 점착제층(14)을 갖는 비산방지필름(12)을 각각 재단하되 비산방지필름(12)은 투명기판(16)에서 투명기판 두께(t)의 70~91% 크기(s) 만큼 더 길게 재단된 사이즈로 구성하고, 투명기판(16)에 면취가공면을 형성하되 면취깊이(c)가 투명기판 두께(t)의 7~14% 되게 형성하며,
투명기판(16)의 전면부와 투명기판(16)의 두께측벽부에 비산방지필름(12)을 덮어 씌워 합지 구성하되 비산방지필름(12)이 꺾어지게 덮여진 투명기판(16)의 모서리부에는 레이저 가열로 모서리의 절곡부 필름이 소성 변형되어서 형상 유지되게 구성함을 특징으로 하는 비산방지필름 적용 투명패널.
In the transparent panel applying shatterproof film,
The shatterproof film 12 having the transparent substrate 16 and the optical pressure sensitive adhesive layer 14 made of one of glass and PMMA is cut, respectively, but the shatterproof film 12 is the transparent substrate thickness t on the transparent substrate 16. 70-91% of the size (s) longer than the cut size is formed, and the chamfered surface formed on the transparent substrate 16, the chamfering depth (c) is formed to be 7 ~ 14% of the thickness of the transparent substrate (t) ,
The front part of the transparent substrate 16 and the thickness side wall of the transparent substrate 16 cover the shatterproof film 12 to form a lamination, but the edges of the transparent substrate 16 covered with the shatterproof film 12 are bent. The transparent panel applied to the anti-scattering film, characterized in that the bent film at the corner of the laser heating is configured to maintain the plastic deformation.
비산방지필름 적용 투명패널 합지방법에 있어서,
글라스와 PMMA중의 하나로 된 투명기판(26)과 광학용 점착제층(24)을 갖는 비산방지필름(22)을 각각 재단하되 투명기판(26)의 테두리에는 면취가공면(28)을 형성하되 면취깊이(c)가 투명기판 두께(t)의 20~40%로 형성하고 비산방지필름(22)은 투명기판(26)의 면취가공면(28)을 제외한 투명기판(26)의 사이즈로 재단하여 마련한 후,
투명기판(26)의 전면부 상에 비산방지필름(22)을 덮어 씌워 합지하되 상부압력으로 전면부를 합지한 다음,
합지시 압력에 의해 비산방지필름(22)의 테두리부로부터 삐져나온 광학용 점착제 돌출부(24a)를 레이저로 용융 제거되게 하여서 투명패널(20)을 얻음을 특징으로 하는 비산방지필름 적용 투명패널 합지방법.
In the transparent panel lamination method applying shatterproof film,
Cut the shatterproof film 22 having the transparent substrate 26 and the optical pressure sensitive adhesive layer 24 made of one of glass and PMMA, respectively, and form a chamfered surface 28 at the edge of the transparent substrate 26, but chamfering depth (c) is formed at 20 to 40% of the thickness (t) of the transparent substrate, and the shatterproof film 22 is cut and provided to the size of the transparent substrate 26 except for the chamfered surface 28 of the transparent substrate 26. after,
Cover the shatterproof film 22 on the front part of the transparent substrate 26 to be laminated, and then laminate the front part with the upper pressure.
Transparent panel lamination method applied to the scattering prevention film, characterized in that to obtain a transparent panel 20 by melting and removing the optical pressure-sensitive adhesive projections (24a) protruding from the edge of the scattering prevention film 22 by the pressure at the time of lamination. .
비산방지필름 적용 투명패널에 있어서,
글라스와 PMMA중의 하나로 된 투명기판(26)과 광학용 점착제층(24)을 갖는 비산방지필름(22)을 각각 재단하되 투명기판(26)의 테두리에는 면취가공면(28)을 형성하되 면취깊이(c)가 투명기판 두께(t)의 20~40%로 형성하고 비산방지필름(22)은 투명기판(26)의 면취가공면(28)을 제외한 투명기판(26)의 사이즈로 재단하여 형성하며,
투명기판(26)의 전면부 상에 비산방지필름(22)을 덮어 씌워 합지함에 따라 합지압력에 의해 비산방지필름(22)의 테두리부로부터 삐져나온 광학용 점착제 돌출부(24a)를 레이저로 용융 제거되게 하여 투명기판(26)의 두께벽면과 광학용 점착제층(24)의 커팅면이 동일면 형성되게 구성함을 특징으로 하는 비산방지필름 적용 투명패널.
In the transparent panel applying shatterproof film,
Cut the shatterproof film 22 having the transparent substrate 26 and the optical pressure sensitive adhesive layer 24 made of one of glass and PMMA, respectively, and form a chamfered surface 28 at the edge of the transparent substrate 26, but chamfering depth (c) is formed 20 to 40% of the thickness (t) of the transparent substrate and the shatterproof film 22 is formed by cutting to the size of the transparent substrate 26 except for the chamfered surface 28 of the transparent substrate 26 ,
By covering and scattering the shatterproof film 22 on the front surface of the transparent substrate 26, the optical pressure-sensitive adhesive protrusion 24a protruding from the edge of the shatterproof film 22 by the lamination pressure is removed by laser melting. Transparent panel applied to the shatterproof film, characterized in that the thickness of the transparent substrate 26 and the cutting surface of the optical pressure-sensitive adhesive layer 24 is configured to be formed on the same surface.
비산방지필름 적용 투명패널 합지방법에 있어서,
글라스와 PMMA중의 하나로 된 투명기판(36)을 재단하되 투명기판(36)의 테두리에는 면취가공면(38)을 형성하되 면취깊이(c)가 투명기판 두께(t)의 20~40%로 형성하여 마련하고,
광학용 점착제층(34)을 갖는 비산방지필름(32)을 투명기판(36)에 덮어 씌워 합지하되 상부압력으로 전면부를 합지한 다음,
합지된 비산방지필름(32)을 레이저로 절단하되 투명기판(36)의 면취가공면(38)을 제외한 합지된 비산방지필름(32)이 남도록 레이저로 비산방지필름(32)의 외곽테두리 절단하여서 투명패널(30)을 얻음을 특징으로 하는 비산방지필름 적용 투명패널 합지방법.
In the transparent panel lamination method applying shatterproof film,
A transparent substrate 36 made of one of glass and PMMA is cut, and a chamfered surface 38 is formed at the edge of the transparent substrate 36, and the chamfering depth (c) is formed at 20 to 40% of the thickness of the transparent substrate (t). To arrange,
Cover the transparent substrate 36 with the scattering prevention film 32 having the optical pressure-sensitive adhesive layer 34 to be laminated, but the front part is laminated at an upper pressure,
The laminated shatterproof film 32 is cut with a laser, but the outer edge of the shatterproof film 32 is cut with a laser to leave the laminated shatterproof film 32 except for the chamfering surface 38 of the transparent substrate 36. Transparent panel lamination method applied to the shatterproof film, characterized in that to obtain a transparent panel (30).
제5항에 기재된 합지방법으로 얻어진 비산방지필름 적용 투명패널. A shatterproof film applied transparent panel obtained by the lamination method according to claim 5.
KR1020180064180A 2018-06-04 2018-06-04 Method for laminating shatter-proof film apply to transparent panel and transparent panel thereof KR102012280B1 (en)

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CN113547694A (en) * 2021-06-15 2021-10-26 江苏新泉模具有限公司 In-mold decoration process for automobile interior trim part product reverse packaging
CN113997127A (en) * 2020-12-31 2022-02-01 安徽金龙浩光电科技有限公司 Machining method for single-side chamfering-free cover plate glass

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Publication number Priority date Publication date Assignee Title
KR100800168B1 (en) 2006-01-23 2008-01-31 나노광학(주) Method for laminating a grass anti-scattering film and an apparatus thereof
KR20140123832A (en) * 2013-04-15 2014-10-23 삼성디스플레이 주식회사 Panel bonding appratus and method of driving the same
KR20160127983A (en) * 2015-04-28 2016-11-07 삼성전자주식회사 Lamination apparatus and lamination method using the same

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Publication number Priority date Publication date Assignee Title
KR100800168B1 (en) 2006-01-23 2008-01-31 나노광학(주) Method for laminating a grass anti-scattering film and an apparatus thereof
KR20140123832A (en) * 2013-04-15 2014-10-23 삼성디스플레이 주식회사 Panel bonding appratus and method of driving the same
KR20160127983A (en) * 2015-04-28 2016-11-07 삼성전자주식회사 Lamination apparatus and lamination method using the same

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Publication number Priority date Publication date Assignee Title
CN113997127A (en) * 2020-12-31 2022-02-01 安徽金龙浩光电科技有限公司 Machining method for single-side chamfering-free cover plate glass
CN113997127B (en) * 2020-12-31 2024-04-02 安徽金龙浩光电科技有限公司 Processing method for chamfering-free single side of cover plate glass
CN113547694A (en) * 2021-06-15 2021-10-26 江苏新泉模具有限公司 In-mold decoration process for automobile interior trim part product reverse packaging
CN113547694B (en) * 2021-06-15 2023-09-08 江苏新泉模具有限公司 In-mold decoration process for inverted packaging of automobile interior trim product

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