KR102002047B1 - Light emitting device package - Google Patents

Abstract

The light emitting device package according to the embodiment of the present invention, the package body; An electrode installed in the package body; A light emitting device disposed on the package body and connected to the electrode; And a molding member for molding the light emitting device, wherein the molding member includes resin and graphene.

Description

Light emitting device package {LIGHT EMITTING DEVICE PACKAGE}

The present invention relates to a light emitting device package.

Light emitting diodes (LEDs) are a type of semiconductor device that converts electrical energy into light. The light emitting diode has advantages of low power consumption, semi-permanent life, fast response speed, safety and environmental friendliness compared to conventional light sources such as fluorescent and incandescent lamps.

Accordingly, many researches have been conducted to replace the existing light source with light emitting diodes, and the use of light emitting diodes as a light source for lighting devices such as various lamps, liquid crystal displays, electronic signs, and street lamps that are used indoors and outdoors is increasing. to be.

The present invention is to provide a light emitting device package that can improve the reliability.

The light emitting device package according to the embodiment of the present invention, the package body; An electrode installed in the package body; A light emitting device disposed on the package body and connected to the electrode; And a molding member for molding the light emitting device, wherein the molding member includes resin and graphene.

The molding member may include a polymer material formed by polymerizing a graphene containing material including the resin and the graphene.

The resin has a substituent for nylon polymerization, and the graphene containing material may include graphene oxide.

The substituent for the nylon polymerization may include an amine group.

The amine group and the graphene may be bonded by a covalent bond.

The resin may include polyphthalamide (PPA).

The volume ratio of the graphene with respect to the entire molding member may be 0.5% to 10%.

The volume ratio of the graphene with respect to the entire molding member may be 1% to 3%.

In the light emitting device package according to the present embodiment, the molding member may include resins and graphenes to prevent problems such as decomposition, discoloration, and deterioration of the molding member due to high temperature and light. As a result, the reliability of the light emitting device package can be improved.

1 is a perspective view of a light emitting device package according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view of the light emitting device package of FIG. 1 taken along line II-II. FIG.
3 is a photograph when a color change occurs in a light emitting device package having a molding member according to the related art.
4 is an exploded perspective view illustrating an example of a display device including a light emitting device package according to an exemplary embodiment of the present invention.
5 is a cross-sectional view illustrating another example of a display device including a light emitting device package according to an exemplary embodiment of the present invention.
6 is an exploded perspective view showing an example of a lighting device including a light emitting device package according to an embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention; However, the present invention is not limited to these embodiments and may be modified in various forms.

In the drawings, illustrations of parts not related to the description are omitted in order to clearly and briefly describe the present invention, and the same reference numerals are used for the same or extremely similar parts throughout the specification. In the drawings, the thickness, the width, and the like are enlarged or reduced in order to clarify the description. The thickness, the width, and the like of the present invention are not limited to those shown in the drawings.

And when any part of the specification "includes" other parts, unless otherwise stated, other parts are not excluded, and may further include other parts. In addition, when a part of a layer, film, region, plate, etc. is said to be "on" another part, this includes not only the case where the other part is "just above" but also the other part located in the middle. When parts such as layers, films, regions, plates, etc. are "just above" another part, it means that no other part is located in the middle.

Hereinafter, a light emitting device package and an illumination system including the same according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view of a light emitting device package according to an exemplary embodiment of the present invention, and FIG. 2 is a cross-sectional view of the light emitting device package of FIG. 1 taken along line II-II.

1 and 2, the light emitting device package 100 according to the embodiment includes a package body 10, a package body 10, and first and second electrodes 41 and 42. The electrodes 41 and 42, a light emitting device 50 disposed on the package body 10 and connected to the electrodes 41 and 42, and a molding member 60 to mold the light emitting device 50. At this time, the molding member 69 includes a resin and graphene. This will be described in more detail as follows.

The body 10 may be made of a resin such as polyphthalamide (PPA), liquid crystal polymer (LCP), polyamide 9T (polyamid9T, PA9T), metal, photosensitive glass, sapphire (Al _2). O ₃ ), ceramics, and printed circuit boards (PCBs). However, the present embodiment is not limited to these materials.

The body 10 may have various shapes according to the use and design of the light emitting device package 100. For example, the planar shape of the body 10 may have various shapes such as a rectangle and a circle.

The body 10 is formed with a cavity 20 that is open at the top. In the drawing, the planar shape of the cavity 20 is illustrated in a circle, but is not limited thereto. Therefore, the cavity 20 may have a planar shape having a polygonal shape including a quadrangle.

Sides of the cavity 20 may be perpendicular or inclined to the bottom surface of the cavity 20. When the cavity 20 has an inclined side surface, an angle A formed between the side surface and the bottom surface of the cavity 20 may be 100 degrees to 170 degrees. At this time, the angle A is set to 120 degrees or more, so that the light emitted from the light emitting element 50 can be well reflected.

The body 10 having such a cavity 20 may be formed by stacking a plurality of layers, or may be formed through injection molding or the like. Of course, the body 10 may be formed in various other ways.

In the body 10, a first electrode 41 and a second electrode 42 electrically connected to the light emitting device 50 are disposed. The first electrode 41 and the second electrode 42 may be formed of a metal plate having a predetermined thickness, and another metal layer may be plated on this surface. The first electrode 41 and the second electrode 42 may be made of a metal having excellent conductivity. Such metals include titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), and the like. There is this.

A portion of the first electrode 41 and the second electrode 42 may be exposed through the cavity 20, and the rest of the first electrode 41 and the second electrode 42 may be exposed to the outside through the inside of the body 10. In the present embodiment, the first electrode 41 and the second electrode 42 are formed in contact with the bottom surface of the cavity 20, but are not limited thereto. Accordingly, the first electrode 41 and the second electrode 42 may be formed in contact with the upper surface of the body 10.

The light emitting device 50 is positioned in the cavity 20 while being electrically connected to the first electrode 41 and the second electrode 42. The light emitting device 50 may be electrically connected to the first electrode 41 and the second electrode 42 by wire bonding through the wire 52.

The light emitting device 50 may be configured as a horizontal chip in which two electrode layers (not shown) are exposed in an upward direction, or a vertical chip in which two electrode layers are opposite to the light emitting layer. In this case, the horizontal chip may be connected to the first electrode 41 and the second electrode 42 by the wire 52, respectively. The vertical chip may be formed in contact with each other on one of the first electrode 41 and the second electrode 42, and may be connected to the other electrode by a wire 52. 2 illustrates an example of a horizontal chip.

However, the embodiment is not limited thereto. That is, the light emitting device 50 and the first and second electrodes 41 and 42 may be electrically connected to each other by die bonding or flip chip in addition to wire bonding.

The light emitting device 50 may include a light emitting diode (LED), which may be implemented as a colored LED such as a red LED, a blue LED, a green LED, or an ultraviolet (UV) LED. The embodiment is not limited to the type and number of such LEDs. In addition, the body 10 may be equipped with a protection element (for example, a zener diode, a varistor) (not shown) for protecting the LED.

The molding member 60 is filled while sealing the light emitting device 50 in the cavity 20. In the present embodiment, the molding member 60 may include resin and graphene.

 The resin serves to seal the light emitting device 50. For example, the resin may include polyphthalamide (PPA). However, the present invention is not limited thereto and various other resins may be used.

Graphene serves to improve the physical and chemical properties of the molding member 60. More specifically, graphene can increase the glass transition temperature (Tg) and decomposition temperature and improve thermal conductivity than when the resin is used alone. Accordingly, Young's modulus and tensile strength can be improved. Graphene serves to complement the properties of the resin having gas permeability because it has barrier properties to all gases due to orientation and aspect ratio characteristics.

The volume ratio of graphene to the entirety of the molding member 60 may be 0.5% to 10%. When the volume ratio exceeds 10%, the amount of graphene is excessively increased, the cost may be increased, and the amount of the resin may be reduced, thereby lowering molding properties. If the volume ratio is less than 0.5%, the effect by graphene may not be sufficient. Considering all the effects, costs, and molding properties due to graphene, the volume ratio of graphene with respect to the entire molding member 60 may be 1% to 3%. However, the present invention is not limited to these numerical values.

The graphene included in the molding member 60 may be detected by component analysis such as X-ray diffraction (XRD) and infrared spectroscopy (FT-IR).

As described above, the graphene may improve thermal properties, chemical properties, mechanical properties, and the like to prevent decomposition of the resin and to suppress gas penetration into the molding member 60. This is explained in more detail.

When the molding member 60 is made of a resin as in the related art, the molding member 60 may be decomposed or discolored or deteriorated due to high temperature, light, or the like caused by light emission of the light emitting device 50. For example, when polyphthalamide (PPA) is used as the molding member 60, the molding member 60 is shown in FIG. 3 by aging for 1000 hours under conditions of 100 ° C and 100mA. It turns out that discoloration of happened.

On the other hand, in the present embodiment, the molding member 60 includes resin and graphene to improve the characteristics of the molding member 60 and prevent gas permeation, so that the molding member 60 is decomposed even when the temperature increases during the light emission of the light emitting device 50. This can prevent problems such as discoloration and discoloration. As a result, a highly reliable light emitting device package 100 may be implemented.

As such, the molding member 60 may include graphene to prevent the resin from being decomposed or discolored due to high temperature, light, or the like when the light emitting device 50 is driven.

Specifically, the molding member 60 may include a resin and a polymer material formed by polymerizing a graphene-containing material including graphene. Since graphene itself is not well dispersed in a solvent and does not easily polymerize with a resin, a graphene-containing material having high reactivity with the resin is added to bind with the resin. Such graphene-containing materials may include graphene oxide. The graphene oxide may be formed by an oxidation process, and an oxygen functional group such as a hydroxyl group (-OH) or a carboxyl group (-COOH) is formed at an end group of the graphene oxide prepared through the oxidation process. The oxygen functional group thus formed improves the dispersibility of graphene in the polar solvent and makes the covalent bond with the resin easy by the hydrophilic functional group.

And the resin may have a substituent for nylon polymerization for covalent bonding with graphene. In one example, the substituent for nylon polymerization may be an amine group (-NH ₂ ). Since polyphthalamide can be used as resin as mentioned above, polyphthalamide containing the substituent (for example, an amine group) for nylon superposition | polymerization can be used as resin.

Various methods may be used as the method of nylon polymerization using the resin and graphene oxide as described above. As an example, a solution blending method using a solution can be used. That is, a polymer having a graphene oxide represented by the formula (1) and a resin having an amine group represented by the formula (2) is added to ethanol and polymerized while applying ultrasonic waves.

[Formula 1]

[Formula 2]

NH ₂ -R

(Wherein, R may be a resin, for example, polyphthalamide.)

Then, the resin and the hydroxyl group (-OH) are bonded by hydrogen bonding, the resin and the carboxyl group (-COOH) are bonded by electrostatic interaction, and the amine group and the graphene of the resin are bonded by covalent bonds, as shown in Chemical Formula 3. .

[Formula 3]

When the heat treatment in this state, as shown in the formula (4), the bond due to hydrogen bonding and electrostatic interaction is removed and only the covalent bond by the amine group and graphene is present. The heat treatment may be carried out at a temperature capable of stabilizing the polymerization of the resin and graphene by removing hydrogen bonds and bonds due to electrostatic interaction. In one example, the heat treatment may be performed at 130 ° C to 180 ° C.

[Formula 4]

In addition, the molding member 60 may include a fluorescent material that absorbs light emitted from the light emitting device 50 and emits different wavelengths.

As described above, in the present embodiment, the molding member 60 may include resins and graphenes to prevent problems such as decomposition, discoloration, and deterioration of the molding member 60 due to high temperature and light. As a result, the reliability of the light emitting device package 100 may be improved.

The light emitting device package described above may be applied to various lighting systems. For example, the above-described light emitting device package may be applied to provide light to the display device, or may be applied to a lighting device such as a lighting lamp, a traffic light, a vehicle headlight, an electric lamp, and the like. Hereinafter, this will be described in detail with reference to FIGS. 4 to 6.

4 is an exploded perspective view illustrating an example of a display device including a light emitting device package according to an exemplary embodiment of the present invention.

Referring to FIG. 4, the display device 1000 according to the embodiment includes a light guide plate 1041, a light source module 1031 that provides light to the light guide plate 1041, and a reflective member 1022 under the light guide plate 1041. And a bottom cover 1011 that houses an optical sheet 1051 on the light guide plate 1041, a display panel 1061, a light guide plate 1041, a light source module 1031, and a reflective member 1022 on the optical sheet 1051. It may include, but is not limited thereto.

The bottom cover 1011, the reflective member 1022, the light guide plate 1041, and the optical sheet 1051 may be defined as the light unit 1050.

The light guide plate 1041 diffuses light to serve as a surface light source. The light guide plate 1041 is made of a transparent material, for example, an acrylic resin series such as polymethylmethacrylate (PMMA), polyethylene terephthalate (PET), polycarbonate (PC), It may include at least one of a cycloolefin copolymer (COC) and polyethylene naphthalate (PEN).

The light source module 1031 provides light to at least one side of the light guide plate 1041, and ultimately serves as a light source of the display device.

The light source module 1031 may include at least one, and may provide light directly or indirectly at one side of the light guide plate 1041. The light source module 1031 may include a substrate 1033 and the light emitting device package 1035 as described above, and the light emitting device package 1035 may be arranged on the substrate 1033 at predetermined intervals.

The substrate 1033 may be a printed circuit board (PCB) including a circuit pattern (not shown). However, the substrate 1033 may include not only a general printed circuit board but also a metal core printed circuit board (MCPCB), a flexible printed circuit board (FPCB), and the like. It is not limited to. The light emitting device package 1035 may be mounted on the side surface of the bottom cover 1011 or the heat dissipation plate, and in this case, the substrate 1033 may be removed. Here, a part of the heat dissipation plate may contact the upper surface of the bottom cover 1011.

In addition, the plurality of light emitting device packages 1035 may be mounted on the substrate 1033 such that an emission surface on which light is emitted is spaced apart from the light guide plate 1041 by a predetermined distance, but is not limited thereto. The light emitting device 1035 may directly or indirectly provide light to a light incident portion, which is one side of the light guide plate 1041, but is not limited thereto.

The reflective member 1022 may be disposed below the light guide plate 1041. The reflective member 1022 can improve the luminance of the light unit 1050 by reflecting light incident to the lower surface of the light guide plate 1041 and pointing upward. The reflective member 1022 may be formed of, for example, polyethylene terephthalate, polycarbonate, polyvinyl chloride, or the like, but is not limited thereto. The reflective member 1022 may be an upper surface of the bottom cover 1011, but is not limited thereto.

The bottom cover 1011 may accommodate the light guide plate 1041, the light source module 1031, the reflective member 1022, and the like. To this end, the bottom cover 1011 may be provided with an accommodating part 1012 having a box shape having an open upper surface, but is not limited thereto. The bottom cover 1011 may be combined with the top cover, but is not limited thereto.

The bottom cover 1011 may be formed of a metal material or a resin material, and may be manufactured using a process such as press molding or extrusion molding. In addition, the bottom cover 1011 may include a metal or non-metal material having good thermal conductivity, but is not limited thereto.

The display panel 1061 is, for example, a liquid crystal display panel, and includes a first and second substrates of transparent materials facing each other, and a liquid crystal layer interposed between the first and second substrates. A polarizing plate may be attached to at least one surface of the display panel 1061, but the polarizing plate is not limited thereto. The display panel 1061 displays information by light passing through the optical sheet 1051. The display device 1000 may be applied to various portable terminals, monitors of notebook computers, monitors of laptop computers, televisions, and the like.

The optical sheet 1051 is disposed between the display panel 1061 and the light guide plate 1041 and includes at least one light transmissive sheet. The optical sheet 1051 may include at least one of a sheet such as, for example, a diffusion sheet, a horizontal and vertical prism sheet, a brightness enhancement sheet, and the like. The diffusion sheet diffuses the incident light, the horizontal and / or vertical prism sheet focuses the incident light into the display area, and the brightness enhancement sheet reuses the lost light to improve the brightness. In addition, a protective sheet may be disposed on the display panel 1061, but is not limited thereto.

Here, the light guide plate 1041 and the optical sheet 1051 may be included as an optical member on the optical path of the light source module 1031, but the embodiment is not limited thereto.

5 is a cross-sectional view illustrating another example of a display device including a light emitting device package according to an exemplary embodiment of the present invention.

Referring to FIG. 5, the display device 1100 includes a bottom cover 1152, a substrate 1120 on which the light emitting device package 1124 is arranged, an optical member 1154, and a display panel 1155. do.

The substrate 1120 and the plurality of light emitting device packages 1124 arranged thereon may be defined as the light source module 1160. The bottom cover 1152, the at least one light source module 1160, and the optical member 1154 may be defined as the light unit 1150. The bottom cover 1152 may include an accommodating part 1153, but is not limited thereto.

Here, the optical member 1154 may include at least one of a lens, a light guide plate, a diffusion sheet, horizontal and vertical prism sheets, a brightness enhancement sheet, and the like. The light guide plate may be made of polycarbonate or polymethyl methacrylate. The light guide plate is not necessarily required, so the light guide plate may be removed. The diffusion sheet diffuses the incident light, the horizontal and vertical prism sheets focus the incident light onto the display area, and the brightness enhancement sheet reuses the lost light to improve the brightness.

The optical member 1154 may be disposed on the light source module 1160, and may convert the light emitted from the light source module 1160 into a surface light source, or perform diffusion or condensing.

6 is an exploded perspective view showing an example of a lighting device including a light emitting device package according to an embodiment of the present invention.

Referring to FIG. 6, the lighting apparatus according to the embodiment may include a cover 2100, a light source module 2200, a radiator 2400, a power supply 2600, an inner case 2700, and a socket 2800. Can be. In addition, the lighting apparatus according to the embodiment may further include any one or more of the member 2300 and the holder 2500. The light source module 2200 may include a light emitting device package 2210 according to an embodiment.

For example, the cover 2100 may have a bulb or hemisphere shape, and may be provided in a hollow shape and an open portion of the cover 2100. The cover 2100 may be optically coupled to the light source module 2200. For example, the cover 2100 may diffuse, scatter, or excite light provided from the light source module 2200. The cover 2100 may be a kind of optical member. The cover 2100 may be combined with the heat sink 2400. The cover 2100 may have a coupling portion coupled to the heat sink 2400.

The inner surface of the cover 2100 may be coated with a milky paint. The milky paint may include a diffuser to diffuse light. The surface roughness of the inner surface of the cover 2100 may be greater than the surface roughness of the outer surface of the cover 2100. This is for the light from the light source module 2200 to be sufficiently scattered and diffused and emitted to the outside.

The material of the cover 2100 may be glass, plastic, polypropylene (PP), polyethylene (PE), polycarbonate (PC), or the like. Here, polycarbonate is excellent in light resistance, heat resistance, and strength. The cover 2100 may be transparent so that the light source module 2200 is visible from the outside, and may be opaque. The cover 2100 may be formed through blow molding.

The light source module 2200 may be disposed on one surface of the heat sink 2400. Thus, heat from the light source module 2200 is conducted to the heat sink 2400. The light source module 2200 may include a light emitting device package 2210, a connection plate 2230, and a connector 2250.

The member 2300 is disposed on an upper surface of the heat sink 2400 and has a plurality of light emitting device packages 2210 and guide grooves 2310 into which the connectors 2250 are inserted. The guide groove 2310 corresponds to the board and the connector 2250 of the light emitting device package 2210.

The surface of the member 2300 may be coated or coated with a light reflecting material. For example, the surface of the member 2300 may be coated or coated with a white paint. The member 2300 is reflected on the inner surface of the cover 2100 to reflect the light returned to the light source module 2200 side again toward the cover 2100. Therefore, the light efficiency of the lighting apparatus according to the embodiment can be improved.

Member 2300 may be made of an insulating material, for example. The connection plate 2230 of the light source module 2200 may include an electrically conductive material. Thus, electrical contact may be made between the radiator 2400 and the connection plate 2230. The member 2300 may be made of an insulating material to block an electrical short between the connection plate 2230 and the heat sink 2400. The radiator 2400 receives heat from the light source module 2200 and heat from the power supply unit 2600 to radiate heat.

The holder 2500 blocks the accommodating groove 2719 of the insulating portion 2710 of the inner case 2700. Therefore, the power supply unit 2600 accommodated in the insulating unit 2710 of the inner case 2700 is sealed. Holder 2500 has guide protrusion 2510. The guide protrusion 2510 may include a hole through which the protrusion 2610 of the power supply 2600 passes.

The power supply unit 2600 processes or converts an electrical signal provided from the outside to provide the light source module 2200. The power supply unit 2600 is accommodated in the accommodating groove 2725 of the inner case 2700, and is sealed in the inner case 2700 by the holder 2500.

The power supply unit 2600 may include a protrusion 2610, a guide 2630, a base 2650, and a protrusion 2670.

The guide part 2630 has a shape protruding outward from one side of the base 2650. The guide part 2630 may be inserted into the holder 2500. A plurality of parts may be disposed on one surface of the base 2650. The plurality of components include, for example, a DC converter for converting an AC power provided from an external power source into a DC power source, a driving chip for controlling the driving of the light source module 2200, and an electrostatic discharge element for protecting the light source module 2200. (electrostatic discharge, ESD) protection element and the like, but may not be limited thereto.

The protrusion 2670 has a shape protruding outward from the other side of the base 2650. The protrusion 2670 is inserted into the connection portion 2750 of the inner case 2700 and receives an electrical signal from the outside. For example, the protrusion 2670 may be provided to be equal to or smaller than the width of the connection portion 2750 of the inner case 2700. Each end of the “+ wire” and the “− wire” may be electrically connected to the protrusion 2670, and the other end of the “+ wire” and the “− wire” may be electrically connected to the socket 2800.

The inner case 2700 may include a molding unit together with a power supply unit 2600 therein. The molding part is a part in which the molding liquid is hardened, so that the power supply part 2600 can be fixed inside the inner case 2700.

As described above, the illumination system may have excellent characteristics by including a highly reliable light emitting device package.

Features, structures, effects, and the like as described above are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. In addition, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, contents related to such combinations and modifications should be construed as being included in the scope of the present invention.

100: light emitting device package
10: package body
41: first electrode
42: second electrode
50: light emitting element
60: molding member

Claims (8)

Package body;
An electrode installed in the package body;
A light emitting device disposed on the package body and connected to the electrode; And
A molding member for molding the light emitting device;
The molding member includes a resin and graphene,
The molding member,
It includes a polymer material formed by polymerizing the resin and the graphene-containing material,
The volume ratio of the graphene with respect to the entire molding member is 0.5% to 10%,
The resin has a substituent for nylon polymerization,
The graphene containing material includes graphene oxide,
The substituent for the polymerization of nylon includes an amine group,
The light emitting device package in which the amine group and the graphene are bonded by a covalent bond. delete delete delete delete The method of claim 1,
The resin is a light emitting device package containing polyphthalamide (polyphthalamide, PPA). delete The method of claim 1,
The light emitting device package having a volume ratio of the graphene with respect to the entire molding member 1% to 3%.

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