KR101994734B1 - Multilayered electronic component and manufacturing method thereof - Google Patents

Abstract

[0001] The present invention relates to a laminated electronic component in which a shrinkage rate is matched, and a manufacturing method thereof, and more particularly to a laminated electronic component which can prevent delamination, diffusion and cracking which may occur in a heterojunction between a dielectric and a magnetic body, To an electronic component and a manufacturing method thereof. According to one embodiment of the present invention, there is provided a ceramic body including a ceramic body formed by stacking a plurality of magnetic body layers, a non-magnetic body layer disposed between the magnetic body layers, an inner coil portion disposed inside the ceramic body, And an outer electrode formed on an end surface of the ceramic body and connected to the inner coil part, wherein the nonmagnetic layer includes a Nb ₂ O ₅ -based dielectric material.

Description

Technical Field [0001] The present invention relates to a multilayered electronic component and a manufacturing method thereof,

The present invention relates to a multilayer electronic component and a manufacturing method thereof.

Electronic components using ceramic materials include capacitors, inductors, piezoelectric elements, varistors or thermistors.

Among these ceramic electronic components, an inductor is one of important passive elements forming an electronic circuit together with a resistor and a capacitor, and is used as a component which removes noise or constitutes an LC resonance circuit. The above ceramic electronic component is fabricated using a magnetic composition.

Depending on the structure, the inductors can be classified into various types such as stacked type, wire wound type and thin film type.

The winding-type inductor is formed by winding a coil on a ferrite core, for example, because a floating capacity, that is, a capacitance between the wires, is generated between coils. Therefore, if the number of windings is increased in order to obtain a high-capacity inductance, .

The multilayer inductor is manufactured in the form of a laminate in which ceramic sheets composed of a plurality of ferrites or dielectrics of low dielectric constant are stacked. On the ceramic sheet, a coil-shaped metal pattern is formed. The metal pattern is sequentially connected by the conductive vias formed in the respective ceramic sheets, and has a structure in which the metal patterns are overlapped with each other in the stacking direction.

The stacked inductor has a simple structure, miniaturization, and cost competitiveness compared to a wire-wound type, but has a disadvantage that the rate of change of the L value according to the DC bias is large. Therefore, if the nonmagnetic dielectric material is inserted in the middle of the inductor, the effective permeability is reduced, but the rate of change of the L value becomes very small, which makes it possible to fabricate a stacked type power inductor used at high currents.

Such a multilayer inductor is required to have a nonmagnetic dielectric material and a magnetic material bonded to each other and to be able to match the dielectric material with the magnetic material. Defects that may occur in heterogeneous junctions include delamination, diffusion and cracking, and magnetic body and inter-implant cleavage. Dillamination occurs at the time of cutting when the interlaminar bond strength is weak before firing. However, after firing, it is caused by the stress caused by the plastic shrinkage behavior difference between the insert part and the ceramic body. Cracks and interlayer cracks also occur in the process of firing or cooling after firing due to differences in internal stresses due to differences in plastic shrinkage behavior between the insert and the ceramic body.

For example, if the material of the magnetic layer is Zn-Cu ferrite, the material of the nonmagnetic layer may be (Zn, Cu) Ti2O4. The Zn-Cu ferrite-based material and (Zn, Cu) Ti 2 O 4 all have a spinel structure and contain Zn or Cu, which is the same element. Therefore, diffusion occurs at the interface between the magnetic layer and the non- do. However, since diffusion occurs between the magnetic body and the nonmagnetic layer, the thickness of the nonmagnetic layer is thinned, chip capacity or RDC is shifted, and the shrinkage behavior of the magnetic layer and the nonmagnetic layer is different, so that delamination or cracking may occur due to the thin non- .

Korean Patent Publication No. 2013-0076285

It is an object of one embodiment of the present invention to provide a laminated electronic component capable of preventing delamination, diffusion and cracking which may occur in a heterojunction between a dielectric and a magnetic body, which are nonmagnetic, and cracking between the magnetic body and the insert, and a manufacturing method thereof.

One embodiment of the present invention relates to a ceramic body including a plurality of magnetic layer layers; A nonmagnetic layer disposed between the magnetic layers; An inner coil part disposed in the ceramic body and disposed in at least one of the plurality of magnetic body layers and the nonmagnetic body layer and having a plurality of inner coil patterns electrically connected thereto; And an external electrode disposed on an end surface of the ceramic body and connected to the internal coil part, wherein the nonmagnetic body layer includes a Nb ₂ O ₅ based dielectric material.

The Nb ₂ O ₅ -based dielectrics include ZnO-Nb ₂ O ₅ , ZnO-TiO ₂ -Nb ₂ O ₅ , BaO-Nb ₂ O ₅ , BaO-TiO ₂ -Nb ₂ O ₅ and Bi ₂ O ₃ -Nb ₂ O ₅ < / RTI >

The non-magnetic layer may include V ₂ O ₅ .

The molar ratio of Nb ₂ O ₅ and V ₂ O ₅ contained in the non-magnetic layer may be 0.9: 0.1 to 0.6: 0.4.

The non-magnetic layer may contain 7 to 20 wt% glass frit.

The glass frit may include at least one of CaO and BaO.

The non-magnetic layer may be disposed inside the inner coil part.

A portion of the non-magnetic layer includes the dielectric, and the region not including the dielectric may be made of the same material as the material of the magnetic layer.

A portion of the non-magnetic layer includes the dielectric, and the region that does not include the dielectric may be empty.

According to another aspect of the present invention, there is provided a magnetic recording medium including: a plurality of magnetic sheet sheets; Providing a non-magnetic sheet including a single or plural Nb ₂ O ₅ -based dielectrics; Forming an inner coil pattern on at least one of the magnetic sheet and the non-magnetic sheet; And laminating the magnetic sheet and the nonmagnetic sheet to form an inner coil part and a ceramic body; And forming an external electrode on an end surface of the ceramic body to be connected to the internal coil part.

The Nb ₂ O ₅ -based dielectrics include ZnO-Nb ₂ O ₅ , ZnO-TiO ₂ -Nb ₂ O ₅ , BaO-Nb ₂ O ₅ , BaO-TiO ₂ -Nb ₂ O ₅ and Bi ₂ O ₃ -Nb ₂ O ₅ < / RTI >

The non-magnetic sheet may include V ₂ O ₅ .

The molar ratio of Nb ₂ O ₅ and V ₂ O ₅ contained in the non-magnetic sheet may be 0.9: 0.1 to 0.6: 0.4.

The non-magnetic sheet may contain 7 to 20 wt% glass frit.

The glass frit may include at least one of CaO and BaO.

The non-magnetic sheet may be formed inside the inner coil part.

A portion of the non-magnetic layer includes the dielectric, and the region not including the dielectric may be made of the same material as the material of the magnetic layer.

A portion of the non-magnetic layer includes the dielectric, and the region that does not include the dielectric may be empty.

According to the multilayer electronic component and the manufacturing method thereof according to the embodiment of the present invention, the firing and shrinking profiles of the magnetic layer and the nonmagnetic layer are made to coincide with each other to minimize the internal residual stress so that delamination, diffusion, peeling, cracking, It is possible to reduce defects.

1 is a perspective view of a multilayer electronic component according to an embodiment of the present invention.
2A is a cross-sectional view taken along the line A-A 'in FIG. 1 of the multilayer electronic component according to the first embodiment of the present invention.
2B is a cross-sectional view taken along the line A-A 'in FIG. 1 of the multilayer electronic component according to the second embodiment of the present invention.
2C is a cross-sectional view taken along the line A-A 'in FIG. 1 of the multilayer electronic component according to the third embodiment of the present invention.
FIG. 2D is a cross-sectional view taken along the line A-A 'in FIG. 1 of the multilayer electronic component according to the fourth embodiment of the present invention.
3A is an exploded perspective view of a multilayer electronic component according to a fifth embodiment of the present invention.
3B is an exploded perspective view of the multilayer electronic component according to the sixth embodiment of the present invention.
3C is an exploded perspective view of a multilayer electronic component according to a seventh embodiment of the present invention.
Fig. 3D is an exploded perspective view of a multilayer electronic component according to an eighth embodiment of the present invention.
4A is a cross-sectional view taken along line A-A 'of FIG. 1 of a multilayer electronic component according to a ninth embodiment of the present invention.
4B is a cross-sectional view taken along the line A-A 'in FIG. 1 of the multilayer electronic component according to the tenth embodiment of the present invention.
4C is a cross-sectional view taken along the line A-A 'in FIG. 1 of the multilayer electronic component according to the eleventh embodiment of the present invention.
Fig. 5A is a view showing a nonmagnetic layer according to a ninth embodiment of the present invention shown in Fig. 4A. Fig.
FIG. 5B is a view showing a nonmagnetic layer according to a tenth embodiment of the present invention shown in FIG. 4B. FIG.
FIG. 5C is a view showing a nonmagnetic layer according to an eleventh embodiment of the present invention shown in FIG. 4C. FIG.
6 is a graph showing the plastic shrinkage curves of the (Ni, Mn, Cu, Zn) Fe2O4 ferrite magnetic composition containing CuO in an amount of 9 mol% according to the calcination temperature and the holding time.
7 is a diagram showing the matching of the plastic shrinkage curve between the ferrite magnetic body composition and the dielectric according to the amount of glass frit added to Ba5 (Nb0.8V0.2) 4O15.

Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. The embodiments of the present invention are provided to enable those skilled in the art to more fully understand the present invention.

Accordingly, the shapes and sizes of the elements in the drawings may be exaggerated for clarity of description, and the elements denoted by the same reference numerals in the drawings are the same elements. It is to be understood that, although the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, Will be described using the symbols.

Throughout the specification, when an element is referred to as "comprising ", it means that it can include other elements as well, without excluding other elements unless specifically stated otherwise.

Laminated type  Electronic parts

Hereinafter, a multilayer electronic component according to an embodiment of the present invention will be described, but the present invention is not limited thereto.

FIG. 1 is a perspective view of a stacked electronic component 100 according to an embodiment of the present invention, and FIGS. 2 (a) to 2 (d) are sectional views of a stacked electronic component 100 according to another embodiment of the present invention. 3A to 3D are exploded perspective views of a multilayer electronic component 100 according to another embodiment of the present invention. 4 is a sectional view taken along the line A-A 'in Fig. 1 according to another embodiment of the present invention. 4A to 4C are different embodiments of the present invention. 5A to 5C are views showing the nonmagnetic layer 111 according to the embodiment of FIGS. 4A to 4C.

A multilayer electronic component 100 according to an embodiment of the present invention includes a ceramic body 110 formed by stacking a plurality of magnetic layers, a magnetic layer 111, an inner coil 120 disposed inside the ceramic body, And an external electrode 130 formed on an end surface of the ceramic body 110. The non-magnetic layer 112 is formed of a non-magnetic substance layer.

The plurality of magnetic layer 111 and the nonmagnetic layer 112 forming the ceramic body 110 are in a sintered state and the boundary between adjacent magnetic layers 111 is a scanning electron microscope It can be integrated so as to be difficult to confirm without using.

In order to clearly explain the embodiment of the present invention, when defining the direction of a hexahedron, L, W, and T shown in FIG. 1 indicate the longitudinal direction, the width direction, and the thickness direction .

The magnetic body used for manufacturing the magnetic substance layer 111 is not particularly limited and may include, for example, a ferrite material. Magnetic material layer 111 is typically _{Fe 2 O 3, ZnO, NiO} , CuO, MgO, may be of a composition such as _{MnO, CoO, MFe 2 O 4} (M: Zn, Ni, Cu, Mn, Mg) And a magnetic layer 111 having various magnetic permeability according to the composition ratio can be manufactured.

ZnO and CuO compositions in the composition of the magnetic substance layer 111 can be melted at a temperature of 1100 ° C or lower. The higher the amount of ZnO and CuO added to the magnetic substance layer 111 is, the more the composition of the magnetic substance layer 111 can be synthesized and sintered at a lower temperature. The content of ZnO and CuO contained in the magnetic substance layer 111 may be 15 to 36 mol%.

The higher the content of NiO in the magnetic layer, the higher the permeability.

6 is a graph showing the plastic shrinkage curves of the (Ni, Mn, Cu, Zn) Fe ₂ O ₄ ferrite magnetic composition containing CuO in an amount of 9 mol% according to the calcination temperature and the holding time.

6, firing the ferrite magnetic composition having a long holding time at a low temperature (780 ° C) has a higher grain boundary energy than firing a ferrite magnetic composition having a shorter holding time at a high temperature (900 ° C) It shrinks quickly at low temperatures.

Referring to FIG. 3, inner coil patterns 121 formed on a plurality of magnetic substance sheets 111 'may be electrically connected by via-electrodes to form inner coil sections 120. In addition, the inner coil part 120 may be formed including the inner coil pattern 121 formed on the nonmagnetic sheet 112 'stacked between the plurality of magnetic material sheets 111'.

The inner coil pattern 121 may be formed by printing a conductive paste containing a conductive metal. The conductive metal is not particularly limited as long as it is a metal having an excellent electrical conductivity. Examples of the conductive metal include silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti) Cu) or platinum (Pt), or the like.

A plurality of magnetic material sheets 111 'may be further laminated on the upper and lower portions of the inner coil part 120 to form upper and lower cover layers.

The non-magnetic layer 112 can minimize the internal residual stress by matching the firing and shrinkage profiles of the magnetic layer 111 and the non-magnetic layer 112 to reduce defects such as delamination, diffusion, peeling, cracking, And may be disposed inside the ceramic body 110 in order to enable the ceramic body 110 to be exposed.

2A, 2B, 3A, and 3B, the nonmagnetic layer 112 may be disposed singularly between the magnetic material layers 111, and may be arranged in plural.

Referring to Figures 2c, 2d, 3a, and 3b, the non-magnetic layer 112 may be disposed within the inner coil portion 120, may be disposed outside the inner coil portion 120, And may be disposed inside and outside portion 120.

Referring to Figures 4A-4C, the non-magnetic layer 112 may include a dielectric in some areas. The dielectric may be included in some areas of the non-magnetic layer 112 in various forms, and is not limited to the examples of Figs. 4A-4C. The dielectric material constituting the nonmagnetic layer 112 may be included in some regions as shown in FIG. 4A and linearly as shown in FIG. 4B. Also, it may be included in a region having a constant pattern as shown in FIG. 4C. In the case where a part of the non-magnetic layer 112 includes a dielectric, the area not including the dielectric may include the same material as the material constituting the magnetic layer 111 and may be empty.

The material of the nonmagnetic layer 112 can be differently selected according to the liquid phase sintering as a result of the superimposition in order to minimize defects caused by the hetero-bonding of the magnetic layer 111 and the nonmagnetic layer 112, 112 may be made of a material capable of being subjected to low-temperature sintering at the time of hetero-bonding, or a ceramic material having a structure similar to that of the magnetic layer 111 may be selected as the material of the nonmagnetic layer 112.

The non-magnetic layer 112 according to an embodiment of the present invention may include a Nb ₂ O ₅ (niobate) dielectric. By including the Nb ₂ O ₅ based dielectric material in the nonmagnetic layer 112, the diffusion between the magnetic layer 111 and the nonmagnetic layer 112 can be minimized, the internal residual stress can be minimized, and the magnetic layer 111 and the non- The firing shrinkage behavior of the adult layer 112 can be matched.

Nb ₂ O ₅ -based dielectrics include ZnO-Nb ₂ O ₅ , ZnO-TiO ₂ -Nb ₂ O ₅ , BaO-Nb ₂ O ₅ , BaO-TiO ₂ -Nb ₂ O ₅ , Bi ₂ O ₃ -Nb ₂ O ₅ Or a combination thereof. _{ZnO- Nb 2 O 5, ZnO-} TiO 2 - Nb 2 O 5, BaO- Nb 2 O 5, BaO- TiO 2 - Nb 2 O 5, Bi 2 O 3 - Nb 2 O 5 system 1200 by including a ceramic composition Lt; 0 > C or less.

A portion of Nb ₂ O ₅ contained in the nonmagnetic layer 112 may be replaced with V ₂ O ₅ . If the portion of Nb ₂ O ₅ contained in the non-magnetic layer 112 is replaced by V ₂ O ₅ , synthesis and sintering at a lower temperature becomes possible, and the profile of the plastic contraction curve of the magnetic layer 111 and the non- 112 can be made to match the profile of the plastic contraction curve. The substitution amount of Nb ₂ O ₅ to V ₂ O ₅ may be 0.1 to 0.4 mole. In this case, the composition ratio of Nb ₂ O ₅ and V ₂ O _{5 in} the non-magnetic layer 112 may be 0.9: 0.1 to 0.6: 0.4.

The nonmagnetic layer 112 may include a glass frit containing an alkaline earth oxide such as CaO or BaO. The glass frit contained in the nonmagnetic layer 112 can be used as a low temperature sintering agent. By including glass frit in the nonmagnetic layer 112, the sintering temperature can be lowered while suppressing interfacial diffusion, and the profile of the plastic contraction curve of the magnetic substance layer 111 of the inductor main body and the profile of the plastic contraction curve of the non- The profiles can be matched.

FIG. 7 shows the matching of the plastic shrinkage curve between the ferrite magnetic body composition and the dielectric according to the amount of glass frit added to Ba ₅ (Nb _{0 .8} V _{0 .2} ) ₄ O ₁₅ .

7, the profile of the plastic shrinkage curve of a dielectric material containing 10 wt% of Ca-borosicate glass frit in Ba ₅ (Nb _{0 .8} V _{0 .2} ) ₄ O ₁₅ is shown in the composition of the ferrite magnetic composition And the profile of the plastic contraction curve of Fig.

Table 1 relates to an embodiment of the present invention and is a graph showing the interfacial bonding properties and defects of the (Ni, Mn, Cu, Zn) Fe ₂ O ₄ magnetic body composition and the material of the nonmagnetic layer 112 which are the magnetic layer 111 .

When the magnetic sheet A and the non-magnetic sheet B having the same thickness of 30 mu m were molded and fired in the A-B-A structure and fired, the extent of delamination, cracking or cracking and interfacial diffusion was observed.

Nonmagnetic material Low-temperature sowing
Ca-borosilicate Interfacial bonding property of magnetic layer and defect occurrence Material wt% wt% Interfacial bonding Dil lamination Crack or crack diffusion Zn (Nb _{0 .9} V _{0 .1} ) ₂ O ₆ 100 - Good O O X Zn (Nb _{0 .9} V _{0 .1} ) ₂ O ₆ 93 7 Excellent X X X Zn (Nb _{0 .9} V _{0 .1} ) ₂ O ₆ 90 10 Excellent X X O _{Ba 4 (Nb 0 .8 V 0} .2) 4 O 15 93 7 Excellent X O X _{Ba 4 (Nb 0 .8 V 0} .2) 4 O 15 90 10 Excellent X X X _{Ba 4 (Nb 0 .7 V 0} .3) 4 O 15 93 7 Excellent X X X _{Ba 4 (Nb 0 .7 V 0} .3) 4 O 15 90 10 Excellent X X O Ba ₃ Ti ₄ (Nb _{0 .9} V _{0 .1} ) ₄ O ₂₁ 85 15 Good O O X Ba ₃ Ti ₄ (Nb _{0 .9} V _{0 .1} ) ₄ O ₂₁ 80 20 Excellent X O X _{Ba 3 Ti 4 (Nb 0 .8} V 0 .2) 4 O 21 85 15 Excellent X X X _{Ba 3 Ti 4 (Nb 0 .8} V 0 .2) 4 O 21 80 20 Excellent X X X Ba ₃ Ti ₄ (Nb _{0 .6} V _{0 .4} ) ₄ O ₂₁ 85 15 Excellent X X O Ba ₃ Ti ₄ (Nb _{0 .6} V _{0 .4} ) ₄ O ₂₁ 80 20 Excellent X O O ZnTiNb ₂ O ₈ 100 - Bed O O X ZnTiNb ₂ O ₈ 80 20 Good X O X ZnTi (Nb _{0 .9} V _{0 .1} ) ₂ O ₈ 85 15 Good X X O ZnTi (Nb _{0 .9} V _{0 .1} ) ₂ O ₈ 80 20 Excellent X X X _{ZnTi (Nb 0 .8 V 0 .2} ) 2 O 8 90 10 Excellent X X X _{ZnTi (Nb 0 .8 V 0 .2} ) 2 O 8 85 15 Excellent X X O BiNbO ₄ 93 7 Excellent X O X BiNbO ₄ 90 10 Excellent X X X BiNbO ₄ 85 15 Excellent X X O

When the V ₂ O ₅ substitution amount in the nonmagnetic layer 112 material is 0.4 mole or more, non-substitution V ₂ O ₅ is generated and diffusion occurs at the interface.

When the profile of the plastic shrinkage curve was inconsistent, delamination, cracking or cracking occurred.

When glass frit containing Ca ^{2 +} or Ba ^{2 +} alkaline earth as the low temperature sintering agent is applied, since Ni, Mn, Cu and Zn of the ferrite are all 2+ cations, Diffusion can be suppressed by precipitating a secondary phase at the interface.

However, since the bonding property at the interface becomes poor, it is understood that the glass frit should be added in an amount of 7 wt% to 20 wt% to improve the bonding property.

The external electrodes 130 may be formed on both end faces of the ceramic body 110 facing each other and connected to the internal coil part 120.

The external electrode 130 may be formed by extending at least one of both end faces in the thickness direction T of the ceramic body 110 and the width direction W. [

The outer electrode 130 may be formed of a metal having excellent electrical conductivity. For example, the outer electrode 130 may be made of Ni, Cu, Sn, Ag, .

Laminated type  Manufacturing method of electronic parts

8 is a process diagram showing a manufacturing method of the multilayer electronic component 100 according to an embodiment of the present invention.

Referring to FIG. 8, a plurality of magnetic sheet sheets can be provided.

The magnetic material used for manufacturing the magnetic sheet is not particularly limited. For example, a ferrite material. The magnetic sheet is generally composed of Fe ₂ O ₃ , ZnO, NiO, CuO, MgO, MnO, CoO, etc. to form a formula of MFe ₂ O ₄ (M: Zn, Ni, Cu, Mn, Mg) It is possible to manufacture a magnetic sheet having various magnetic permeability according to the composition ratio.

Next, a non-magnetic sheet can be provided.

The non-magnetic material used for the production of the nonmagnetic sheet may include a Nb ₂ O ₅ -based dielectric material. By including the Nb ₂ O ₅ based dielectric material in the nonmagnetic sheet, the diffusion between the magnetic layer 111 and the nonmagnetic layer 112 can be minimized, the internal residual stress can be minimized, and the magnetic layer 111 and the non- 112 can be matched with the plastic shrinkage behavior.

Nb ₂ O ₅ -based dielectrics include ZnO-Nb ₂ O ₅ , ZnO-TiO ₂ -Nb ₂ O ₅ , BaO-Nb ₂ O ₅ , BaO-TiO ₂ -Nb ₂ O ₅ , Bi ₂ O ₃ -Nb ₂ O ₅ Or a combination thereof. _{ZnO- Nb 2 O 5, ZnO-} TiO 2 - Nb 2 O 5, BaO- Nb 2 O 5, BaO- TiO 2 - Nb 2 O 5, Bi 2 O 3 - Nb 2 O 5 system 1200 by including a ceramic composition Lt; 0 > C or less.

A part of Nb ₂ O ₅ contained in the nonmagnetic sheet can be replaced with V ₂ O ₅ . When a portion of Nb ₂ O ₅ contained in the nonmagnetic sheet is replaced by V ₂ O ₅ , synthesis and sintering at a lower temperature becomes possible, and the profile of the plastic contraction curve of the magnetic layer 111 and the profile of the non- The profile of the plastic contraction curve can be matched. The substitution amount of Nb ₂ O ₅ to V ₂ O ₅ may be 0.1 to 0.4 mole. In this case, the composition ratio of Nb ₂ O ₅ and V ₂ O _{5 in} the nonmagnetic sheet may be 0.9: 0.1 to 0.6: 0.4.

The non-magnetic sheet may include a glass frit containing an alkaline earth oxide such as CaO or BaO. The glass frit contained in the nonmagnetic sheet can be used as a low temperature sintering agent. By including the glass frit in the nonmagnetic sheet, the sintering temperature can be lowered while suppressing the interfacial diffusion, and the profile of the plastic contraction curve of the magnetic substance layer 111 of the inductor body and the profile of the plastic contraction curve of the non- . By including the Nb ₂ O ₅ based dielectric material in the nonmagnetic sheet, the diffusion between the magnetic layer 111 and the nonmagnetic layer 112 can be minimized, the internal residual stress can be minimized, and the magnetic layer 111 and the non- 112 can be matched with the plastic shrinkage behavior.

Next, the inner coil pattern 121 may be formed on at least one of the magnetic sheet and the non-magnetic sheet.

The inner coil pattern 121 can be formed by applying a conductive paste containing a conductive metal onto a magnetic material sheet by printing or the like.

The conductive metal is not particularly limited as long as it is a metal having an excellent electrical conductivity. Examples of the conductive metal include silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), gold (Au) ) Or platinum (Pt), or the like.

The conductive paste may be printed by a screen printing method or a gravure printing method, but the present invention is not limited thereto.

Next, the magnetic substance sheet and the non-magnetic substance sheet may be laminated to form the inner coil section 120 and the ceramic body 110.

Referring to Figs. 2A and 2B, the non-magnetic sheet can be laminated singularly between the magnetic layer layers 111, and can be laminated in plural.

2C and 2D, the lamination process of the non-magnetic sheet can be performed in the middle of the process of forming the inner coil section 120 so that the non-magnetic sheet is laminated inside the inner coil section 120, And may be laminated before and after the inner coil part 120 forming process step so as to be laminated outside the inner coil part 120.

Referring to Figs. 4A to 4C, the non-magnetic sheet may include a dielectric in some regions. The dielectric material forming the nonmagnetic material sheet may be included in a part of the nonmagnetic sheet as shown in FIG. 4A, linearly as shown in FIG. 4B, or included in a region having a constant pattern as shown in FIG. 4C. In the case where a part of the nonmagnetic sheet includes a dielectric, the area not including the dielectric may include the same material as the material constituting the magnetic sheet and may be empty.

The external electrodes 130 may be formed on both end faces of the ceramic body 110 facing each other and connected to the internal coil part 120.

The external electrodes 130 may be formed by extending both the end faces of the ceramic body 110 in the thickness direction T and / or both end faces in the width direction W.

The outer electrode 130 may be formed of a metal having excellent electrical conductivity. For example, the outer electrode 130 may be made of Ni, Cu, Sn, Ag, .

The method of forming the external electrode 130 may be performed by not only printing but also dipping according to the shape of the external electrode.

It is to be understood that the present invention is not limited to the disclosed embodiments and that various substitutions and modifications can be made by those skilled in the art without departing from the scope of the present invention Should be construed as being within the scope of the present invention, and constituent elements which are described in the embodiments of the present invention but are not described in the claims shall not be construed as essential elements of the present invention.

100: Multilayer electronic component
110: Ceramic body
111: magnetic layer
112: nonmagnetic layer
120: internal coil part
121: inner coil pattern
130: external electrode

Claims (18)

A ceramic body including a plurality of magnetic layer layers;
A nonmagnetic layer disposed between the magnetic layers;
An inner coil part disposed in the ceramic body and disposed in at least one of the plurality of magnetic body layers and the nonmagnetic body layer and having a plurality of inner coil patterns electrically connected thereto; And
And an external electrode disposed in the ceramic body and connected to the internal coil part,
The nonmagnetic layer includes an Nb ₂ O ₅ -based dielectric material and V ₂ O ₅
Wherein the molar ratio of Nb ₂ O ₅ and V ₂ O ₅ contained in the non-magnetic layer is 0.9: 0.1 to 0.6: 0.4,
Multilayer electronic components.
The method according to claim 1,
The Nb ₂ O ₅ -based dielectrics include ZnO-Nb ₂ O ₅ , ZnO-TiO ₂ -Nb ₂ O ₅ , BaO-Nb ₂ O ₅ , BaO-TiO ₂ -Nb ₂ O ₅ and Bi ₂ O ₃ -Nb ₂ O ₅ layers.
delete delete The method according to claim 1,
Wherein the nonmagnetic layer includes 7 to 20 wt% glass frit.
6. The method of claim 5,
Wherein the glass frit includes at least one of CaO and BaO.
The method according to claim 1,
And the non-magnetic layer is disposed inside the inner coil part.
The method according to claim 1,
Wherein a portion of the non-magnetic layer includes the dielectric, and the region that does not include the dielectric includes the same material as the material of the magnetic layer.
The method according to claim 1,
Wherein a part of the non-magnetic layer includes the dielectric, and the area not including the dielectric is empty.
Providing a plurality of magnetic sheet sheets;
Providing a single or plurality of nonmagnetic sheets each including a Nb ₂ O ₅ -based dielectric and V ₂ O ₅ ;
Forming an inner coil pattern on at least one of the magnetic sheet and the non-magnetic sheet;
Laminating the magnetic sheet and the nonmagnetic sheet to form an inner coil part and a ceramic body;
And forming an external electrode on an end surface of the ceramic body to be connected to the internal coil part,
Wherein the molar ratio of Nb ₂ O ₅ and V ₂ O ₅ contained in the non-magnetic sheet is 0.9: 0.1 to 0.6: 0.4,
A method of manufacturing a multilayer electronic component.
11. The method of claim 10,
The Nb ₂ O ₅ -based dielectrics include ZnO-Nb ₂ O ₅ , ZnO-TiO ₂ -Nb ₂ O ₅ , BaO-Nb ₂ O ₅ , BaO-TiO ₂ -Nb ₂ O ₅ and Bi ₂ O ₃ -Nb ₂ O ₅ < / RTI >
delete delete 11. The method of claim 10,
Wherein the nonmagnetic sheet includes 7 to 20 wt% glass frit.
15. The method of claim 14,
Wherein the glass frit includes at least one of CaO and BaO.
11. The method of claim 10,
Wherein the non-magnetic sheet is disposed inside the inner coil part.
11. The method of claim 10,
Wherein a portion of the nonmagnetic sheet includes the dielectric, and the region not including the dielectric includes the same material as the material of the magnetic sheet.
11. The method of claim 10,
Wherein a portion of the nonmagnetic sheet includes the dielectric, and the region not including the dielectric is empty.

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