KR101994676B1 - Method of organic light emitting diode display device - Google Patents

Abstract

In the organic light emitting diode display device, an organic film layer is formed in advance on the cathode contact electrode so that the hole injection layer does not directly contact the cathode contact electrode, and the organic film layer is removed, can do.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an organic light emitting diode (OLED)

The present invention relates to a method of manufacturing an organic light emitting diode display.

2. Description of the Related Art Recently, various flat panel display devices capable of reducing weight and volume, which are disadvantages of cathode ray tubes (CRTs), have been developed. Such a flat panel display device includes a liquid crystal display (LCD), a field emission display (FED), a plasma display panel (PDP) And a light emitting device (Electroluminescence Device).

PDP has attracted attention as a display device that is most advantageous for large screen size but small size because of its simple structure and manufacturing process, but it has disadvantage of low luminous efficiency, low luminance and high power consumption. Thin Film Transistor LCD (TFT LCD) is the most widely used flat panel display device, but has a narrow viewing angle and low response speed. The electroluminescence device is divided into an inorganic light emitting diode display device and an organic light emitting diode display device according to the material of the light emitting layer. Of these organic light emitting diode display devices, self light emitting devices are self light emitting devices, There is a big advantage.

Meanwhile, the organic light emitting diode display device has an organic light emitting diode (OLED) device for self-emission. The organic light emitting diode (OLED) has an organic compound layer formed between the anode and the cathode. The organic compound layer includes a hole injection layer (HIL), a hole transport layer (HTL), an emission layer (EML), an electron transport layer (ETL), and an electron injection layer (EIL) Electron Injection layer). The driving principle of the organic light emitting diode device is that a driving voltage is applied to an anode and a cathode, electrons passing through the hole transport layer (HTL) and electrons passing through the electron transport layer (ETL) To form excitons, which emit visible light as they fall from the excited state to the ground state. The hole transport layer and the electron transport layer can improve the luminous efficiency by allowing the holes and the electrons to move efficiently. A manufacturing method of the organic light emitting diode display device will be described below.

1 is a plan view of an organic light emitting diode display device for explaining a conventional method of manufacturing an organic light emitting diode display device.

1, a hole injecting layer 2 is formed on a substrate 1, a hole transporting layer 3 is formed on the hole injecting layer 2, an organic light emitting layer 6 is formed on the hole transporting layer 3, An electron transport layer 12 may be formed on the organic light emitting layer 6 and an electron injection layer 13 may be formed on the electron transport layer 12.

FIGS. 2 and 3 are cross-sectional views of an organic light emitting diode display device for illustrating a method of manufacturing a conventional organic light emitting diode display device.

2, an anode electrode 5 and a cathode contact electrode 4 are formed on a substrate 1 and a hole injecting layer 2 and a hole transporting layer 3) may be formed. When the hole injection layer 2 and the hole transport layer 3 are formed on the entire upper surface of the substrate 1 as well as the anode electrode 5 and the cathode contact electrode 4, 2) and the hole transport layer 3 may be formed.

Referring to FIG. 3, the anode electrode 5 may be an anode and the cathode electrode (not shown) may be a cathode. When electricity is applied between the anode and the cathode, holes move in the cathode direction from the anode, electrons move in the anode direction from the cathode, and the organic light emitting layer (6) between the anode and the cathode Exitons can be formed and recombined to emit light. When the cathode electrode (not shown) is formed on the substrate 1, the electron injection layer 2 and the electron transport layer 3 are formed on the cathode contact electrode 4, And the cathode contact electrode 4 can not be directly connected to each other.

Therefore, in this case, it is necessary to remove the hole injection layer 2 and the hole transport layer 3 formed in the remaining region except for the anode electrode 5 through a dry etching process or the like. When the hole injection layer 2 and the hole transport layer 3 are removed through a dry etching process or the like, the entire manufacturing process of the organic light emitting diode display device is complicated and the yield is reduced. And the anode electrode 5 is damaged when the hole transport layer 3 is removed.

The organic film layer is formed in advance on the cathode contact electrode so that the hole injection layer or the like is not brought into direct contact with the cathode contact electrode and the organic film layer is subsequently removed so that the cathode electrode and the cathode contact electrode are in direct contact with each other .

Embodiments may include forming a first electrode and a second electrode contact electrode on a substrate; Forming an organic film layer on the substrate; Forming an organic compound layer on the substrate; And removing the organic film layer and the organic compound layer in a region corresponding to the second electrode-contacting electrode.

According to an embodiment of the present invention, there is provided a method of manufacturing an organic light emitting diode display device, wherein the organic film layer is a material that is cured by heat.

According to an embodiment of the present invention, an adhesive force between the organic film layer and the organic compound layer is greater than an adhesive force between the substrate and the organic film layer.

The forming of the organic film layer may include: coating the organic film layer, the heat absorbing layer and the film on the substrate; And irradiating a region of the film corresponding to the second electrode-contacting electrode with a laser to attach the organic film layer to the substrate.

According to an embodiment of the present invention, there is provided a method of manufacturing an organic light emitting diode display device in which the heat absorbing layer is made of a material that absorbs heat and expands in volume.

According to an embodiment of the present invention, the heat absorbing layer is formed of at least one of carbon black, metal oxide, and dye.

According to an embodiment of the present invention, there is provided a method of manufacturing an organic light emitting diode, further comprising forming a second electrode on the substrate and connecting the second electrode to the second electrode contact electrode.

According to an embodiment of the present invention, the first electrode is an anode and the second electrode is a cathode.

According to an embodiment of the present invention, the organic compound layer includes a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, and an electron injection layer.

A method of fabricating an organic light emitting diode according to an embodiment includes forming a first electrode and a second electrode contact electrode on a first substrate; Forming a second electrode on a second substrate opposite to the first substrate; Forming an organic film layer on the second substrate; Forming an organic compound layer on the second substrate; And removing the organic film layer and the organic compound layer in a region corresponding to the second electrode-contacting electrode.

According to an embodiment of the present invention, there is provided a method of manufacturing an organic light emitting diode display device, wherein the organic film layer is a material that is cured by heat.

According to an embodiment, an adhesive force between the organic film layer and the organic compound layer is greater than an adhesive force between the second electrode and the organic film layer.

According to an embodiment, the step of forming the organic film layer includes: coating the organic film layer, the heat absorbing layer and the film on the second substrate; And a step of irradiating a region of the film corresponding to the second electrode-contacting electrode with a laser to adhere the organic film layer onto the second electrode of the second substrate .

According to an embodiment of the present invention, there is provided a method of manufacturing an organic light emitting diode display device in which the heat absorbing layer is made of a material that absorbs heat and expands in volume.

According to an embodiment of the present invention, the heat absorbing layer is formed of at least one of carbon black, metal oxide, and dye.

According to an embodiment of the present invention, the first electrode is an anode and the second electrode is a cathode.

According to an embodiment of the present invention, the organic compound layer includes a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, and an electron injection layer.

In an embodiment, an organic film layer is formed in advance on the cathode contact electrode so that the hole injection layer does not directly contact the cathode contact electrode, and the organic film layer is subsequently removed, so that the cathode electrode and the cathode contact electrode come into direct contact . In this case, a separate dry etching process for removing the hole injection layer and the like is not necessary, so that the process can be simplified, damage to the anode electrode due to complicated processes can be prevented, and the yield can be improved.

1 is a plan view of an organic light emitting diode display device for explaining a conventional method of manufacturing an organic light emitting diode display device.
FIG. 2 and FIG. 3 are cross-sectional views of an organic light emitting diode display device for illustrating a method of manufacturing a conventional organic light emitting diode display device.
FIGS. 4 and 5 are cross-sectional views of an organic light emitting diode display device for explaining a method of manufacturing an organic light emitting diode display device according to a first embodiment of the present invention. FIG.
6A and 6B are cross-sectional views of an organic light emitting diode display device shown to illustrate organic film layer formation;
7 to 9 are sectional views of an organic light emitting diode display device for explaining a method of manufacturing an organic light emitting diode display device according to a first embodiment of the present invention.
10A to 10C are cross-sectional views of an organic light emitting diode display device for explaining a method of manufacturing an organic light emitting diode display device according to a second embodiment of the present invention.
11A to 11C are cross-sectional views of an organic light emitting diode display device for explaining a method of manufacturing an organic light emitting diode display device according to a third embodiment of the present invention.

Hereinafter, the organic light emitting diode display device according to the present invention will be described in detail with reference to the drawings. The following embodiments are provided by way of example so that those skilled in the art can fully understand the spirit of the present invention. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, the size and thickness of an apparatus may be exaggerated for convenience. Like reference numerals designate like elements throughout the specification.

FIGS. 4 and 5 are cross-sectional views illustrating an organic light emitting diode display device for explaining a method of manufacturing the organic light emitting diode display device according to the first embodiment of the present invention.

Referring to FIGS. 4 and 5, an active region 5 and a cathode contact electrode 4 may be formed on the substrate 1.

The active region 5 may include an anode electrode. (For convenience of explanation, the active region 5 is represented by an anode electrode.)

Although not shown in the figure, the active region 5 may include a thin film transistor. More specifically, a semiconductor layer including a source region, a channel region, and a drain region, a gate insulating film, a gate electrode, a source electrode, and a drain electrode are formed in a region where the thin film transistor is formed on the substrate 1. The source electrode and the drain electrode are connected to a source region and a drain region of the semiconductor layer through a contact hole formed through an interlayer insulating film formed on the gate electrode and a gate insulating film. A protective layer is formed on the source electrode and the drain electrode, and a contact hole exposing the drain electrode is formed in the protective layer. The exposed drain electrode is electrically connected to the connection electrode formed on the protection layer.

A planarization film is formed on the entire surface of the substrate 1 including the thin film transistor, and the planarization film is formed with a contact hole exposing the connection electrode. A first electrode of the organic light emitting diode (OLED) is formed on the exposed connection electrode. A bank pattern may be formed on the first electrode to expose the first electrode in units of pixel regions.

On the other hand, an organic compound layer is formed on the first electrode exposed in the active region 5, and a second electrode is formed on the organic compound layer. Further, since the organic compound layer is vulnerable to moisture or oxygen, a thin film encapsulation (TFE) may be formed on the second electrode to protect and seal the organic compound layer from moisture, gas, and the like.

An anode electrode 5 and a cathode contact electrode 4 are formed on the substrate 1 and then an organic film layer 7 is formed on the substrate 1 and an organic film layer 7 is formed on the organic film layer 7 A base film 9 may be formed on the heat absorbing layer 8 by forming a heat absorbing layer 8 on the heat absorbing layer 8.

When the laser 10 is irradiated to the region where the cathode contact electrode 4 is formed on the substrate 1, the organic film layer 7 is formed only in the region where the cathode contact electrode 4 is formed as shown in FIG. 5 .

When the hole injection layer 2 is formed on the substrate 1, the hole injection layer 2 may be formed in the region where the cathode contact electrode 4 is formed. In this case, the step is required to remove the hole injection layer 2, and the process becomes complicated. During the process of removing the hole injection layer 2, the anode electrode 5 can be damaged and the hole injection layer 2 ) May also be damaged. In the case where the hole injection layer 2 or the like is formed only in a region except for the region where the cathode contact electrode 4 is formed, the hole injection layer 2, the hole transport layer 3 ) Or the like must be formed, so that the manufacturing process can be complicated. The organic film layer 7 may be formed in the region where the cathode contact electrode 4 is formed before the hole injection layer 2 is formed so that the region where the cathode contact electrode 4 is formed and the anode electrode 5 may be formed and the hole injection layer 2 or the like may not be formed on the cathode contact electrode 4.

6A and 6B are cross-sectional views of an organic light emitting diode display device shown for explaining organic film layer formation.

6A and 6B, a method of forming the organic film layer 7 on the cathode contact electrode (not shown) will be described in detail.

6A and 6B, an organic film layer 7 is formed on the substrate 1 by a spin coating method, a slit coating method or a roll coating method, The layer 8 and the base film 9 may be formed and the organic film layer 7 may be cured by heat treatment. In the spin coating method, a photosensitive liquid is dropped on a substrate to rotate the substrate at a high speed to form a film having a uniform thickness. In the slit coating method, a long, narrow slit-shaped nozzle moves linearly on the substrate, And a film is formed by spraying. In the roll coating method, a photosensitive liquid developed on a roll is transferred onto a substrate. Since each method has advantages and disadvantages, it can be selected in consideration of the size, precision, etc. of the substrate to be used.

In the method of forming the organic film layer 7 on the cathode contact electrode (not shown) of the substrate, when the laser 10 is irradiated to the region where the cathode contact electrode (not shown) is formed, the base film 9 Passes the laser 10 through. The laser 10 having passed through the base film 9 is irradiated onto the heat absorbing layer 8. The heat absorbing layer 8 absorbs light energy by the laser 10 and excites the electrons in the heat absorbing layer 8 to an excited state and excites the excited electrons to a ground state. The energy is released in the form of heat.

Before the laser 10 is irradiated, the organic film layer 7 may be disposed on the front surface of the substrate 1, or may be disposed on only a part of the substrate. The organic film layer 7 is disposed on the front surface of the substrate 1, which can reduce the complexity of the process.

The heat absorbing layer 8 may have a larger area than the organic film layer 7 and the base film may have a larger area than the heat absorbing layer 8.

Referring to FIG. 6B, the kinetic energy of the internal molecules of the heat absorbing layer 8 may be increased by heat absorbed. As the kinetic energy of the molecule increases, the movement of the molecule becomes active. At the same time, the space occupied by the molecule can be widened, and the volume can expand like the A region. That is, the free volume, which is the volume of the void space around each molecule in the heat absorbing layer 8, can be increased.

Although the volume is expanded in the lower direction of the heat absorbing layer 8 in the drawing, the heat absorbing layer 8 can be bulged even in the upper and lower directions. On the other hand, the heat absorbing layer 8 may be lowered in the upward direction due to the base film 9 disposed on the upper portion, 8 in the lower direction. And can thereby be greatly expanded in the downward direction of the heat absorbing layer 8.

The organic film layer 7 is pressed toward the lower portion of the substrate 1 by the expansion region of the heat absorbing layer 8 while the volume of the A region is increased, So that it can be attached to the region of the contact electrode (not shown) together with the region B. That is, a part of the organic film layer 7 may be deposited on the substrate 1 by the pressure along the expansion region of the heat absorbing layer 8. When the heat absorbing layer 8 and the base film 9 are removed after a part of the organic film layer 7 is deposited on the cathode contact electrode (not shown) region, The organic film layer 7 can be formed only on the electrode 4 region.

The organic film layer 7 and the heat absorbing layer 8 are separated while the heat absorbing layer 8 is expanded so that the base film 9 and the heat absorbing layer 8 are separated from the organic film layer 7 Separating the base film 9 and the heat absorbing layer 8 can form an organic film layer 7 surrounding the cathode contact electrode 4 formed on the substrate 1 have.

The organic film layer 7 may be formed of a material that can be cured by heat and the heat absorbing layer 8 may be made of carbon black, metal oxide, dye, or the like. And may be made of a material that bulges as it absorbs and releases heat, but is not limited thereto. The base film 9 may be made of glass or plastic but is not limited thereto.

FIGS. 7 to 9 are cross-sectional views illustrating an organic light emitting diode display device for explaining a method of manufacturing an organic light emitting diode display device according to a first embodiment of the present invention.

Referring to FIG. 7, an anode electrode 5 may be formed on the substrate 1 and an organic film layer 7 may be formed on the cathode contact electrode 4. A hole injecting layer 2, a hole transporting layer 3, an organic light emitting layer 6, an electron transporting layer 12 and an electron injecting layer 13 may be sequentially formed on the substrate 1 have.

The organic compound layer may be formed by a patterning process, and the patterning process may be performed through a deposition process using a photolithography process, an inkjet printing process, a shadow mask, or the like. Here, the photolithography process does not require expensive equipment compared with other patterning processes, and thus has a merit that a production cost can be reduced and a precise pattern can be realized.

On the other hand, the organic film layer 7, the hole injecting layer 2, the hole transporting layer 3, the electron transporting layer 12, and the electron injecting layer 7, which are removed portions 71 formed on the cathode contact electrode 4, 13) can be removed. The removing unit 71 may remove the removing unit 71 by contacting the adhesive film to the removing unit 71 using a separation film or the like.

As a method of removing the removal portion 71, a separation film may be used. The separating film is formed by applying a substance having an adhesive property on a film made of polyethylene terephthalate (PET) or polyimide (PI), and the main raw material of the adhesive substance is methyl methacrylate (MMA), 2 2-ethylhexyl acrylate (2-EHA), butyl acrylate monomo (BAM), glycyl methacrylate (GMA), and ethyl acrylate (EA) But is not limited thereto.

The adhesive force between the hole injection layer 2, the hole transport layer 3, the organic light emitting layer 6, the electron transport layer 12, the electron injection layer 13, and the organic film layer 7, (7) and the substrate (1). That is, the energy required to separate the interface between the organic film layer 7 and the hole injection layer 2 is greater than the energy required to separate the interface between the organic film layer 7 and the substrate 1. The adhesive force of each of the hole injection layer 2, the hole transport layer 3, the organic light emitting layer 6, the electron transport layer 12, and the electron injection layer 13 is also strong. This is because the organic film layer 7 is slightly raised on the substrate 1 through the transfer of the laser 10, but in the case of the organic compound layer, the organic film layer 7 is coated on the substrate 1, The adhesion to the organic film layer 7 is much stronger. The hole injection layer 2, the hole transport layer 3, the organic light emitting layer 6, the electron transport layer 12, and the hole transport layer 3 are formed by attaching the separation film to the upper portion of the electron injection layer 13, , The electron injection layer (13) and the organic film layer (7) can be separated from the substrate (1).

On the other hand, when the separation film is attached onto the electron injection layer 13, it can be attached through a roll process. Also, when the separation film is removed, it can be removed through the roll process.

8 and 9, a cathode electrode 11 is formed on the upper surface of the substrate 1 so as to be opened above the cathode contact electrode 4 so that the cathode electrode 11 and the cathode contact electrode 4 are in contact with each other .

An organic film layer 7 is formed on the cathode contact electrode 4 and a hole injecting layer 2, a hole transporting layer 3, an electron transporting layer 12 and an electron injecting layer The hole transporting layer 3, the electron transporting layer 12 and the electron injecting layer 13 are formed on the cathode contact electrode 4, When the cathode electrode 11 is formed on the substrate 1, the cathode electrode 11 and the cathode contact electrode 4 may be directly connected to each other Contact with each other.

Meanwhile, the substrate 1 may be formed of plastic or glass. In particular, in the case of a bottom emission type in which light is transmitted through the substrate 1, the substrate 1 may be made of a transparent material.

The organic light emitting layer 6 may be a red, green, blue, or white light emitting material. The organic light emitting layer 6 may be formed on the hole transport layer 3 in the form of a bar and the organic light emitting layer 6 may be formed of red, And may be sequentially formed of red, green, blue, and white light emitting bodies. In addition, the organic light emitting layer 6 may be formed only of a white light emitting material. In this case, light generated in the white light emitting body may pass through the color filter to generate red, green, and blue light using a color filter.

Meanwhile, the characteristics of the blue light emitting body among the red, green, and blue light emitting materials may deteriorate as time passes. In this case, it may be difficult to generate white light due to the combination of the red, green and blue light emitting materials. Therefore, red, green, And a blue (Blue) light emitter, as well as a white light emitter.

 The anode electrode 5 may be an anode and the cathode electrode 11 may be a cathode. The cathode may be formed of a material alloyed with lithium such as aluminum (Al), silver (Ag), or the like, and may be formed of a conductive material having a small work function. The anode may be made of ITO (indium tin oxide), which is indium tin oxide, but is not limited thereto. The anode may be a conductive material having a high work function and may be made of a transparent material.

Meanwhile, the material of the hole transport layer 3 may be a metal oxide such as titanium dioxide (TiO 2), zinc oxide (SnO 2), and tin oxide (SnO 2), but is not limited thereto. The material of the electron transport layer 12 is an electron transporting material such as 8-hydroxyquinolino-aluminum (Alq3), benzoquinolinol complex (Bebq2), triazole derivative (TAZ), phenanthroline derivative (MEPHPH) (LiCF3SO3), lithium perchlorate (LiClO4), lithium tetrafluoroborate (LiBF4), lithium hexafluorophosphate (LiPF6), and lithium bistrifluoromethanesulfonylamide (LiN CF3SO2) 2), and the like, but is not limited thereto.

The first embodiment described with reference to the drawings has an anode electrode 5, a hole injecting layer 2, a hole transporting layer 3, an organic light emitting layer 6, an electron transporting layer 12, And the electron injection layer 13 and the cathode electrode 11 in this order. However, the present invention is not limited thereto and may have the second and third embodiments as follows.

10A to 10C are cross-sectional views illustrating an organic light emitting diode display device for explaining a method of manufacturing an organic light emitting diode display device according to a second embodiment of the present invention.

In the description of the second embodiment, the same reference numerals are assigned to the same functions and the same features as those of the first embodiment, and a detailed description thereof will be omitted.

10A to 10C, an anode electrode 5 and a cathode contact electrode 4 are formed on the first substrate 100 using first and second substrates 100 and 101, and the second substrate 101 The cathode electrode 11 can be formed. When the cathode electrode 11 is formed on the second substrate 101, the height of the region corresponding to the cathode contact electrode 4 of the first substrate 100 may be higher.

On the other hand, as shown in FIG. 10B, the organic film layer 7 can be formed in a region where the cathode contact electrode 4 is formed. The organic film layer 7 is formed on the first substrate 100 by using the organic film layer 7, the heat absorbing layer 8 and the base film 9 as described in the first embodiment, And the organic film layer 7 can be cured through heat. A laser (not shown) is irradiated onto a region where the cathode contact electrode 4 of the first substrate 100 is formed and the organic film layer 7 is irradiated with the laser light by the pressure accompanying the expansion of the heat absorbing layer 8, The organic film layer 7 surrounding the cathode contact electrode 4 on the first substrate 100 can be formed. Next, the hole injection layer 2, the hole transport layer 3, the organic light emitting layer 6, the electron transport layer 12 and the electron injection layer 13 are sequentially formed on the first substrate 100 The removal part 71 including the organic film layer 7 may be removed from the first substrate 100. The method of removing the removal portion 71 may be removed using a separation film as described in the first embodiment. The first substrate 100 and the second substrate 101 may be bonded together after the removal portion 71 is removed. In this case, the cathode contact electrode 4 on the first substrate 100 And the cathode electrode 11 on the second substrate 101 may be connected.

11A to 11C are sectional views of an organic light emitting diode display device for explaining a method of manufacturing an organic light emitting diode display device according to a third embodiment of the present invention.

In the description of the third embodiment, the same reference numerals are assigned to the same functions and the same features as those of the first and second embodiments, and a detailed description thereof will be omitted.

11A to 11C, an anode electrode 5 and a cathode contact electrode 4 are formed on the first substrate 100, a cathode electrode 11 is formed on the second substrate 101, The organic film layer 7 is formed on the region of the second substrate 101 corresponding to the cathode contact electrode 4 of the first substrate 100 as shown in FIG. After the electron injection layer 13, the electron transport layer 12, the organic light emitting layer 6, the hole transport layer 3 and the hole injection layer 2 are sequentially formed on the substrate 1, The first substrate 100 and the second substrate 101 are attached to each other to remove the removal agent 71 and connect the cathode contact electrode 4 and the cathode electrode 11 .

When the cathode electrode 11 is formed on the second substrate 101, the cathode electrode 11 is formed to be larger in a region corresponding to a region where the cathode contact electrode 4 formed on the first substrate 100 is formed can do. The electron injection layer 13, the electron transport layer 12, the organic light emitting layer 6, and the hole transport layer (not shown) are formed on the region of the second substrate 101 that does not correspond to the cathode contact electrode 4. [ 3 and the hole injection layer 2 are formed, the surface of the region where the cathode electrode 11 is formed larger and the surface of the hole injection layer 2 may be in the same plane.

In addition, although not shown in the drawing, the organic film layer is formed on the region where the cathode contact electrode is formed on the first substrate and on the region of the second substrate corresponding to the cathode contact electrode, Depositing a transfer layer, an organic light emitting layer, a hole transport layer, and a hole injection layer on the first substrate or the second substrate in order according to a process order, removing the organic film layer formed on the first and second substrates , And the first and second substrates may be bonded together to connect the cathode contact electrode and the cathode electrode.

It is not necessary to perform a separate process for removing the hole injection layer 2 and the hole transport layer 3 formed on the cathode contact electrode 4 in the conventional process of manufacturing the organic light emitting diode display device, And the problem that the anode electrode 5 is damaged while removing the hole injection layer 2 and the hole transport layer 3 can be solved.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be defined by the claims.

1. Substrate
2. Hole injection layer
3. hole transport layer
4. Cathode contact electrode
5. Anode electrode
6. Organic light emitting layer
7. Organic film layer
8. Heat absorbing layer
9. Base film
10. Laser
11. The cathode electrode
12. Electronic transfer layer
13. Electron injection layer
71. Removal section
100.
101. A liquid crystal display

Claims (19)

Forming a first electrode and a second electrode contact electrode on the substrate;
Forming an organic film layer on the substrate;
Forming an organic compound layer on the substrate; And
And removing the organic film layer and the organic compound layer in a region corresponding to the second electrode-contacting electrode. The method according to claim 1,
Wherein the organic film layer is a material that is cured by heat. The method according to claim 1,
Wherein the adhesive force between the organic film layer and the organic compound layer is greater than the adhesive force between the substrate and the organic film layer. The method according to claim 1,
Wherein forming the organic film layer comprises:
Coating the organic film layer, the heat absorbing layer and the film on the substrate;
And applying a laser to a region of the film corresponding to the second electrode-contacting electrode to attach the organic film layer to the substrate. 5. The method of claim 4,
Wherein the heat absorbing layer is made of a material that absorbs heat and expands in volume. 5. The method of claim 4,
The heat absorbing layer
Wherein the organic light emitting diode display device comprises at least one of carbon black, metal oxide, and dye. The method according to claim 1,
And forming a second electrode on the substrate and connecting the second electrode to the second electrode contact electrode. 8. The method of claim 7,
Wherein the first electrode is an anode and the second electrode is a cathode. The method according to claim 1,
The organic compound layer may be formed,
A hole transporting layer, an organic light emitting layer, an electron transporting layer, and an electron injection layer. Forming a first electrode and a second electrode contact electrode on a first substrate;
Forming a second electrode on a second substrate opposite to the first substrate;
Forming an organic film layer on the second substrate;
Forming an organic compound layer on the second substrate;
And removing the organic film layer and the organic compound layer in a region corresponding to the second electrode-contacting electrode. 11. The method of claim 10,
Wherein the organic film layer is a material that is cured by heat. 11. The method of claim 10,
Wherein the adhesive force between the organic film layer and the organic compound layer is greater than the adhesive force between the second electrode and the organic film layer. 11. The method of claim 10,
Wherein forming the organic film layer comprises:
Coating the organic film layer, the heat absorbing layer and the film on the second substrate;
And a step of irradiating a region of the film corresponding to the second electrode-contacting electrode with a laser to adhere the organic film layer onto the second electrode of the second substrate . 14. The method of claim 13,
Wherein the heat absorbing layer is made of a material that absorbs heat and expands in volume. 14. The method of claim 13,
The heat absorbing layer
Wherein the organic light emitting diode display device comprises at least one of carbon black, metal oxide, and dye. 11. The method of claim 10,
Wherein the first electrode is an anode and the second electrode is a cathode. 11. The method of claim 10,
The organic compound layer may be formed,
A hole transporting layer, an organic light emitting layer, an electron transporting layer, and an electron injection layer. The method according to claim 1,
Wherein the step of removing the organic film layer and the organic compound layer in a region corresponding to the second electrode-
Attaching a separation film having an adhesive force to the organic film layer and the organic compound layer in a region corresponding to the second electrode contact electrode; And
Removing the separation film to remove the organic film layer and the organic compound layer in the region corresponding to the second electrode-contacting electrode from the substrate. 11. The method of claim 10,
Wherein the step of removing the organic film layer and the organic compound layer in a region corresponding to the second electrode-
Attaching a separation film having an adhesive force to the organic film layer and the organic compound layer in a region corresponding to the second electrode contact electrode; And
Removing the separation film to remove the organic film layer and the organic compound layer in the region corresponding to the second electrode-contacting electrode from the second substrate.

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