KR101991451B1 - Tray for testing dual in-line memory module - Google Patents

Abstract

According to the present invention, a DIMM test tray (100) comprises: a frame (110) having a predetermined height and width and having an opened upper portion; a reinforcing member (120) fixed at a position, at which a space of the frame (110) is divided into two spaces, so as to reinforce the frame (110), and having an internal space and a hole for allowing the spaces of the frame (110) to communicate with each other; and a plurality of mother boards (130) each mounted in the bisected spaces of the frame (110) and capable of being docked to a cube, wherein the mother board (130) includes a plurality of test sockets (132) mounted on an upper surface of one side surface thereof and respectively having a plurality of sockets to which DIMMs are respectively loaded, and a CPU and circuit components disposed on a lower surface of the other side surface thereof to be positioned inside the frame (110). Thus, the DIMMs can be automatically tested for failure under mounting conditions.

Description

Tray for testing dual in-line memory module < RTI ID = 0.0 >

The present invention relates to a test tray of a dual in-line memory module (DIMM), and more particularly, to a DIMM test tray for automatically testing a plurality of DIMMs under a mounting condition .

Generally, a DIMM that has been subjected to a predetermined semiconductor manufacturing process is inspected through a test device whether the performance of the DIMM is properly demonstrated or by a mounting test that is mounted on a computer. However, since the mounting test test can more accurately confirm whether the DIMM is defective or not, the test is mainly performed on the mounting test.

In a conventional DIMM mounting test, a mother board in circulation is directly used or partially changed to inspect whether the DIMM is defective in a state in which DIMMs are manually mounted on the socket. That is, the operator inspects whether the DIMM is defective when the DIMM is mounted in the corresponding test socket. Therefore, it takes a lot of time and cost to inspect whether the DIMM is defective, and there is a problem that a good product and a defective product are mixed.

On the other hand, the motherboard used for the DIMM mounting test is configured such that the test socket, the CPU and related parts are all mounted on one surface. As a result, even if the arrangement of the corresponding parts in the motherboard is changed, the related parts such as the CPU are all located on one surface of the motherboard and the DIMM module socket for automation can not be installed due to its complicated structure, It was impossible to mount and detach it automatically.

Patent Registration No. 10-1410101

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a DIMM test tray which is capable of automatically testing whether a plurality of DIMMs are defective under mounting conditions .

In addition, the present invention simplifies the structure by configuring the motherboard in such a form that the test socket, CPU and related parts are disposed on both sides of the motherboard, so that the DIMM is automatically mounted and detached in the test socket, There are other purposes to provide a DIMM test tray as much as possible.

It is another object of the present invention to provide a DIMM test tray that can check whether a defect is caused under a temperature setting condition by using its own heat generated at the time of defect inspection of the DIMM.

According to an aspect of the present invention, there is provided a method of loading a plurality of dual in-line memory modules (DIMMs) using a handler and then transferring the dual in-line memory modules to a rack using a transfer device, DIMMs that test multiple DIMMs while docked in a cube and test them for defects and then move them back to the handler to automatically classify the DIMMs with good or defective products Test of dual inline memory modules used in equipment A tray, comprising: a frame having a predetermined height and width and having an open top; a frame fixed to a position where the space of the frame is equally divided to have a hole and an inner space for communicating the space of the frame with each other And a plurality of motherboards (Mother b), each of which is installed in the multi- The motherboard includes a plurality of test sockets, each having a plurality of sockets mounted on an upper surface of the motherboard, the plurality of sockets being respectively loaded with the DIMMs, and a plurality of test sockets And a CPU and circuit components located inside the frame.

In addition, according to the present invention, the frame further includes a plurality of socket supporting plates which are respectively installed at a lower portion where the test socket is located, and support the test socket.

According to the present invention, the frame further includes a lower cover for covering the lower portion thereof to protect the CPU and the circuit components, and the lower surface of the lower cover is slidable when the test tray is moved using the transfer device. And has a plurality of dimples so as to be easily positioned.

According to the present invention, the frame further includes a pair of cube guide bushes installed at a front end of the test tray in the conveying direction to determine an accurate position when the cube is docked.

According to the present invention, the reinforcing member includes a pair of handler guide bushes spaced apart from each other on the upper surface so as to accurately determine a docking position when the test tray is docked to the handler, And a pair of hook rollers respectively installed at the front end and the rear end of the test tray in the conveying direction of the test tray for pulling the hooks when the cube is docked.

According to the present invention, the motherboard is installed along both sides of the test socket, and guides the air supplied from the fan so that all the DIMMs mounted on the plurality of test sockets have a uniform temperature condition. DIMM wind direction plates.

According to the present invention, the motherboard is installed on the reinforcing member so as to surround the CPU in such a manner that both ends of the motherboard are opened, and is installed on the same line as a plurality of fans installed along both sides of the frame, And a CPU wind direction plate for smoothly discharging heat generated from the CPU to the outside to improve the cooling power of the CPU.

In addition, according to the present invention, when the test tray is docked to the cube, a mid board that plugs with a backplane and is automatically booted and starts a test, and transmits test results and information to the handler, .

The present invention is advantageous in that it is possible to automatically test whether a plurality of DIMMs are defective under a mounting condition.

In addition, the present invention simplifies the structure by configuring the motherboard in such a form that the test socket, CPU and related parts are disposed on both sides of the motherboard, so that the DIMM is automatically mounted and detached in the test socket, It is possible.

In addition, the present invention has an advantage in that it is possible to inspect whether or not a defect is caused under a temperature setting condition by using the heat generated at the time of inspecting the defect of the DIMM.

1 is a schematic perspective view of a DIMM mounting test equipment to which the present invention is applied,
FIGS. 2 and 3 are a top view and a side view of the test equipment shown in FIG. 1,
FIG. 4 is a plan perspective view showing a configuration of a DIMM test tray according to an embodiment of the present invention, which constitutes the test equipment shown in FIG. 1,
5 is a rear perspective view of the test tray shown in FIG. 4,
6 to 8 are respectively a planar perspective view of the test tray shown in FIG. 4 with the motherboard of the test tray removed,
FIG. 9 is a rear perspective view of the test tray shown in FIG. 5 with the lower cover removed;
FIG. 10 is an enlarged perspective view showing a part of the test tray shown in FIG. 8, enlarged and separated,
FIG. 11 is a perspective view showing the reinforcing member shown in FIG. 4,
FIGS. 12 to 15 are a plan view, a rear view, a front view, and a side view, respectively, showing the configuration of the cube constituting the test equipment shown in FIG.
Fig. 16 is an exploded perspective view of a backplane assembled in the cube shown in Fig. 14 and connected to one side of the test tray shown in Fig.

First, the DIMM mounting test equipment to which the present invention is applied will be briefly described.

FIG. 1 is a schematic perspective view of a DIMM mounting test equipment to which the present invention is applied, and FIGS. 2 and 3 are a plan view and a side view of the test equipment shown in FIG.

As shown in FIGS. 1 to 3, the DIMM mounting test equipment to which the present invention is applied includes a plurality of DIMMs loaded on a DIMM test tray according to the present invention using a handler, and a plurality of DIMMs The test tray is moved to a rack using a transferring device and docked on a cube to test a plurality of DIMMs at the same time to check for defects and then move the DIMMs to the handler again, As shown in FIG. Meanwhile, the DIMM mounting test equipment shown in FIGS. 1 to 3 is configured to simultaneously inspect whether a DIMM is defective while 500 DIMM test trays are mounted in a rack.

Hereinafter, a preferred embodiment of a DIMM test tray according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 4 is a plan perspective view showing a configuration of a DIMM test tray according to an embodiment of the present invention, and FIG. 5 is a rear perspective view of the test tray shown in FIG. 6 to 8 are respectively a plan perspective view of the test tray shown in FIG. 4 with the motherboard of the test tray removed, and FIG. 9 is a perspective view of the lower cover of the test tray shown in FIG. And FIG. FIG. 10 is an enlarged perspective view showing a part of the test tray shown in FIG. 8 enlarged and separated, and FIG. 11 is a perspective view showing the reinforcing member shown in FIG.

As shown in FIGS. 4 to 11, the DIMM test tray 100 of this embodiment includes a frame 110 having a predetermined height and width and opened at an upper portion, and a frame 110 fixed at a position bisecting the space of the frame 110 A reinforcing member 120 having a hole and an internal space for reinforcing the frame 110 and communicating the space of the frame 110 with each other, and a reinforcing member 120 for reinforcing the frame 110, And a plurality of mother boards 130 (Mother board) as much as possible. Here, the motherboard 130 includes a plurality of test sockets 132 (test sockets) 132 mounted on the upper surface of the motherboard 130, each socket having a plurality of sockets to which the DIMMs are respectively loaded, Lt; RTI ID = 0.0 > 110 < / RTI > In this embodiment, the frame 110 is divided into two halves, but it is also possible to decompose the frames 110 into three or more halves.

The frame 110 has a rectangular shape with upper and lower openings and has a predetermined height corresponding to a depth at which the CPU and the circuit components constituting the motherboard 130 can be accommodated, The motherboard 130 is configured to have a predetermined width capable of receiving and supporting the pair of motherboards 130 in a fixed state. On both sides of the frame 110, a plurality of fans 140 for discharging heat generated from the CPU of the motherboard 130 to the outside are installed. The frame 110 has a pair of cube guide bushes 112 for determining an accurate position when docking the cube 200 to the front of the test tray in the conveying direction.

The frame 110 further includes a plurality of socket supporting plates 114 installed at a lower portion where the test socket 132 is located to support the test socket 132 without bending and to fix the socket. Here, the socket support plate 114 is installed in such a manner that both end portions of the socket support plate 114 are fixed on the frame 110 and the reinforcement member 120, respectively.

In addition, the frame 110 is further configured to cover a lower portion thereof and further include a pair of lower covers 116 for protecting the CPU and circuit components constituting the motherboard 130. A plurality of handler clamp blocks 118 for fixing the test tray 100 to be stably positioned even after the test tray 100 is docked to the handler is installed in the lower portion of the frame 110 . That is, the plurality of handler clamp blocks 118 are fixed to be positioned on the upper surface of the lower cover 116, respectively, to clamp the handler docking member inserted into the handler docking hole formed on the side of the frame 110. The lower surface of the lower cover 116 is formed to have three dimples 116a so as to prevent slippage when the test tray 100 is moved by using the conveying device, (See FIG. 5). Here, the number of the dimples 116a may be less than three or more.

The reinforcing member 120 is installed along the center of the frame 110 and serves to reinforce the frame 110 while bisecting the space of the frame 110. The reinforcing member 120 includes an inner space in which a plurality of circuit lines connected to the motherboard 130 are located and air can flow, and a communication hole (not shown) that communicates the inner space and the space of the frame 110 with each other 122) on both sides thereof (see Fig. 11). Some of the plurality of communication holes 122 are formed in the same line as the plurality of fans 140 installed along both sides of the frame 110 so that the heat generated by the CPU can be smoothly discharged to the outside.

The reinforcing member 120 includes a pair of handler guide bushes 124 for accurately determining a docking position when the test tray 100 is docked to the handler and a pair of handler guide bushes 124 for docking the test tray 100 to the cube 200 And a pair of hook rollers 126 for pulling the hooks to the hooks. The pair of handler guide bushes 124 are installed on the upper surface of the reinforcing member 120 at regular intervals and the pair of hook rollers 126 are connected to the reinforcing member 120 (See Figs. 7 and 11).

The pair of motherboards 130 are respectively installed in a bisection space of the frame 110 and are fixed on the rim of the frame 110 and the reinforcement member 120. The motherboard 130 is configured such that a plurality of test sockets 132 are positioned on the upper surface of the motherboard 130 and a CPU and circuit components are positioned on the lower surface of the motherboard 130. Here, the test socket 132 is designed to be capable of automatically mounting and demounting a DIMM using a handler, and a CPU and circuit components are disposed on the lower surface of the motherboard 130 for automation.

That is, the motherboard 130 of this embodiment configures its upper surface so that only a plurality of test sockets 132 protrude upward, so that the DIMM can be automatically mounted on the test socket 132 Detachable. The CPU and the circuit components are installed on the lower surface of the motherboard 130 and the circuit wires for operating the same are placed in the inner space of the reinforcing member 120. The lower cover 116 covers all the components, The test tray 100 is entirely slimmed.

The motherboard 130 is installed along both sides of the test socket 132 and guides the air supplied from the corresponding fan so that all of the DIMMs mounted on the plurality of test sockets 132 have a uniform temperature condition A plurality of DIMM wind deflector plates 134 and a CPU wind direction plate 136 fixed to the reinforcement member 120 so as to surround the CPU in such a manner that both ends thereof are opened to improve the cooling power of the CPU.

The DIMM wind deflector 134 guides the air supplied from each fan to one end of the DIMM from one end to the other end of the DIMM so as to have uniform temperature conditions in all the DIMMs mounted on the plurality of test sockets 132 do. By providing the uniform temperature condition to all the DIMMs mounted on the plurality of test sockets 132 through the DIMM wind direction plate 134, it is possible to check whether the DIMM is defective under the specific temperature condition I can do it. At this time, a fan control board (FCB) (not shown) connected to a backplane 210 (to be described later) is used for providing a uniform temperature to all the DIMMs.

Here, the fan control board uses the self-heating of the DIMM, and reads the heat generated from each test socket 132 into the temperature sensor 220 installed in the cube 200, As shown in FIG. That is, each temperature sensor 220 collects the temperature generated in the test socket 132, controls the speed of the corresponding fan installed in the rack or the like using the information, and controls the controlled air to the DIMM wind direction plate 134, To allow all DIMMs to have the same temperature condition (see Figures 12-15).

The CPU wind direction plate 136 is installed on the same line as a plurality of fans 140 installed along both sides of the frame 110 to smoothly discharge the heat generated by the CPU to the outside, .

The DIMM test tray 100 of this embodiment may be further configured to have a mid board 150. Here, the mid board 150 is plugged with the backplane 210 when the test tray 100 is docked to the cube and is automatically booted and starts the test, and transmits the test result and information to the handler (FIG. 10 and FIG. 16). On the other hand, the backplane 210 is assembled in the cube and serves to transmit power and signals to the test tray 100.

Although the description of the DIMM test tray of the present invention has been described above with reference to the accompanying drawings, it is an exemplary description of the best preferred embodiment of the present invention. It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention as defined by the appended claims. Examples or modifications will also fall within the scope of the claims of this invention.

100: Test tray 110: Frame
112: Cube guide bushing 114: Socket support plate
116: lower cover 116a: dimple
118: Handler clamp block 120: Reinforcement member
122: communication hole 124: handler guide bush
126: Hook roller 130: Motherboard
132: Test socket 134: DIMM wind direction board
136: CPU wind direction plate 140: Fan
150: mid board 200: cube
210: backplane 220: temperature sensor

Claims (8)

A plurality of dual in-line memory modules (DIMMs) are loaded using a handler and then moved to a rack using a transfer device and docked to a plurality of DIMMs As a test tray for dual in-line memory modules used in DIMM-mounted test equipment that tests for defects and then moves them back to the handler to automatically classify DIMMs as good or bad,
A frame having a predetermined height and width,
A reinforcing member which is fixed at a position where the space of the frame is equally divided to reinforce the frame and has a hole and an inner space communicating the space of the frame with each other;
And a plurality of mother boards each installed in a multi-partition space of the frame and dockable to the cube,
The mother board includes a plurality of test sockets each having a plurality of sockets mounted on an upper surface of the mother board and each of which is loaded with the DIMMs, And a plurality of DIMM wind directions for guiding the air supplied from the corresponding fans so as to have uniform temperature conditions in all of the DIMMs installed on both sides of the test socket, Wherein the first and second in-line memory modules are connected to each other. The method according to claim 1,
Wherein the frame further comprises a plurality of socket support plates mounted on a lower portion of the test socket to support the test socket. The method of claim 2,
The frame further includes a lower cover for covering the lower portion thereof to protect the CPU and the circuit components,
Wherein the lower surface of the lower lid has a plurality of dimples so as to prevent slippage when the test tray is moved using the transfer device and to allow convenient positioning. Test tray. The method of claim 3,
Wherein the frame further comprises a pair of cube guide bushes installed at a front end in the conveying direction of the test tray to determine an accurate position when docking the cube. The method according to claim 1,
Wherein the reinforcing member includes a pair of handler guide bushes spaced apart from each other on the upper surface to accurately determine a docking position when the test tray is docked to the handler, Further comprising a pair of hook rollers installed at a front end and a rear end, respectively, in a conveying direction of the test tray to pull the test tray. delete The method according to claim 1,
The motherboard is mounted on the reinforcing member so as to surround the CPU in the form of opening both ends thereof. The motherboard is installed in the same line as a plurality of fans installed along both sides of the frame, Further comprising a CPU wind direction plate for smoothly discharging the cooling water to the CPU, thereby improving the cooling power of the CPU. The method according to claim 1,
Further comprising a mid board which is plugged with a backplane and docked to the cube to automatically boot up and start the test and transmit the test result and information to the handler when the test tray is docked to the cube. Test tray of inline memory module.

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