KR101987760B1 - Adhesive tape having antistatic function - Google Patents

Adhesive tape having antistatic function Download PDF

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KR101987760B1
KR101987760B1 KR1020170108730A KR20170108730A KR101987760B1 KR 101987760 B1 KR101987760 B1 KR 101987760B1 KR 1020170108730 A KR1020170108730 A KR 1020170108730A KR 20170108730 A KR20170108730 A KR 20170108730A KR 101987760 B1 KR101987760 B1 KR 101987760B1
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South Korea
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sensitive adhesive
silicone
pressure
antistatic
adhesive tape
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KR1020170108730A
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Korean (ko)
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KR20190023267A (en
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홍중기
최준혁
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(주)케이에프엠
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/04Carbon
    • C08K3/041Carbon nanotubes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24Electrically-conducting paints
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
    • C09J183/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04Polysiloxanes
    • C09J2201/602

Abstract

The present invention relates to a silicone adhesive tape having an antistatic function. More particularly, the present invention relates to a film which adheres to and protects the surface of a display, an electronic product, or a component, and more particularly, to a pressure sensitive adhesive tape comprising a silicone adhesive layer having antistatic function.

Description

Adhesive tape having antistatic function "

The present invention relates to a silicone adhesive tape having an antistatic function. More particularly, the present invention relates to a film which adheres to and protects the surface of a display, an electronic product, or a component, and more particularly, to a pressure sensitive adhesive tape comprising a silicone adhesive layer having antistatic function.

The present invention relates to an antistatic silicone adhesive tape, and more particularly, to an antistatic silicone adhesive tape which is used in a reflow process of a structural tape or an electronic component used for supporting and fixing an article or a product during processing and packaging of a display or an electronic component, To an adhesive tape used as a process tape to be peeled off later.

In recent years, industrial development of semiconductors, electric and electronic and display fields has been rapidly increasing, and as the use of synthetic resin or synthetic fiber in the above-mentioned fields is rapidly increasing, a problem of static electricity is greatly increased.

Therefore, also in the field of adhesive tapes including the pressure-sensitive adhesive layer, antistatic functions have been demanded. That is, in order to solve problems such as contamination caused by static electricity generated when the release film is separated from the pressure-sensitive adhesive layer for use of the pressure-sensitive adhesive tape or when the pressure-sensitive adhesive tape is used as a process tape and peeling off the pressure- An antistatic function is required.

In order to solve such a problem, the following method for obtaining an antistatic adhesive tape has been proposed.

(1) The adhesive tape base material is made to be antistatic.

(2) An antistatic layer is provided between the pressure-sensitive adhesive layer and the adhesive tape base material.

(3) Antistatic agent is used as an antistatic agent.

However, the method of (1) is limited in terms of usable substrates. In both methods (1) and (2), there is still a problem that peeling electrification can not be prevented when the pressure-sensitive adhesive is coated with a thick film and is excellent in electrical insulation.

On the other hand, it is also possible to add carbon black to the pressure-sensitive adhesive by the method (3) (JP 61-136573), blend a polyol (Japanese Patent Laid-Open Publication No. 2005-154491), or add an ionic antistatic agent of a lithium salt -2009-0004713), but all of them still have problems such as poor compatibility with the pressure-sensitive adhesive component and poor adhesion.

Japanese Patent Application Laid-open No. 61-136573 Japanese Patent Application Laid-Open No. 2005-154491 Korean Patent Publication No. 10-2009-0004713

Accordingly, an object of the present invention is to provide a silicone adhesive tape excellent in antistatic function.

And an antistatic pressure-sensitive adhesive layer containing an antistatic agent having a high miscibility with the silicone pressure-sensitive adhesive component of the pressure-sensitive adhesive layer and which does not hinder the adhesive force of the silicone pressure-sensitive adhesive.

According to an aspect of the present invention,

A base film; Antistatic coating layer; A silicon adhesive layer containing 1 to 10 wt% of carbon nanotubes; And an antistatic silicone adhesive tape in which release films are sequentially laminated.

Also, there is provided an antistatic silicone adhesive tape, wherein an antistatic coating layer is further laminated on the back surface of the antistatic coating layer of the base film.

INDUSTRIAL APPLICABILITY The silicone adhesive tape of the present invention has the effect of providing an adhesive tape excellent in antistatic properties by including an antistatic layer between a substrate and a pressure sensitive adhesive layer and containing carbon nanotubes in the pressure sensitive adhesive layer. Further, as the thickness of the adhesive layer becomes thick, it has an effect of preventing the antistatic function from deteriorating or disappearing.

In particular, the adhesive tape of the present invention has the effect of providing a pressure-sensitive adhesive tape which is simple in the manufacturing process and excellent in the antistatic property of the pressure-sensitive adhesive layer and also excellent in the adhesive property of the pressure-sensitive adhesive.

1 is an example of a silicone adhesive tape of the present invention.
2 is another example of the silicone adhesive tape of the present invention.

The present invention relates to a base film; Antistatic coating layer; A silicon adhesive layer containing 1 to 10 wt% of carbon nanotubes; And a releasing film sequentially laminated on an antistatic silicone adhesive tape. Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

1 shows an antistatic silicone adhesive tape of the present invention in which the base film 1, the antistatic coating layer 2, the silicon adhesive layer 3 including carbon nanotubes, and the release film 4 are sequentially laminated.

At the time of use, the release film 4 is removed from the adhesive tape of the present invention, and the silicone adhesive layer 3 is used by being adhered to the surface of a display or an electronic product.

The release film (4) may be a release film commonly used in the art. Preferably, a polyester film, a wax-treated polyester film, a silicone release film, or a fluorine-based silicone release film may be used.

The base film 1 may be any of plastic films commonly used in the art and is preferably polyethylene terephthalate (PET), polycarbonate (PC), polyvinyl chloride (PVC), polypropylene (PP) (PE) or the like may be used.

The base film 1 may be subjected to corona discharge or primer treatment before coating the antistatic layer.

The adhesive tape of the present invention includes an antistatic coating layer (2) on a base film to provide an antistatic function. The antistatic agent used in the antistatic coating layer is preferably a nano-fiber conductive material, conductive nano-organic particles. Conductive nanoparticles, conductive nanoparticles, conductive nanoparticles, conductive nanoparticles, conductive polymers, and ionic compounds may be used. More preferably, the conductive polymer is selected from poly (3,4-ethylenedioxythiophene, PEDOT) and poly (4-styrenesulfonate, PSS) It can be more than one. The thickness of the antistatic coating layer may be 0.1 to 1 占 퐉. When the thickness of the antistatic coating layer is the same as above, sufficient antistatic function can be performed without hindering the function of the pressure-sensitive adhesive tape.

The adhesive tape of the present invention includes a pressure-sensitive adhesive layer containing a silicon pressure-sensitive adhesive as a pressure-sensitive adhesive layer for adhering a detection tape to a display or a surface of an electronic product. The silicone pressure sensitive adhesive layer 3 is coated with a thick film having a thickness of 5 to 150 탆 in order to impart a sufficient adhesive force to a display or a surface of an electronic product and to give a sufficient supporting force in the process of an electronic product.

When the pressure-sensitive adhesive layer is coated with such a thick film, it is not easy to realize the antistatic performance of the entire pressure-sensitive adhesive tape with only the lower antistatic agent. That is, in the case of a release film in which the thickness of the silicone release coating is as thin as about 0.1 to 0.6 탆, antistatic agent is coated on the surface of the base film and silicone release coating is applied on the antireflection film, When the adhesive is coated with a thick film, there is a problem that the antistatic property can not be realized only by the antistatic layer coated on the surface of the base film because the silicone adhesive acts as an insulating material.

Accordingly, the present inventors have made efforts to develop a pressure-sensitive adhesive compounded with an antistatic agent in a silicon pressure-sensitive adhesive. As a result, when a carbon nanotube (CNT) and a silicon pressure-sensitive adhesive are used, they have good adhesion to the lower antistatic coating layer, It was confirmed that the pressure-sensitive adhesive layer was excellent, and the present invention was completed.

That is, the present invention provides a silicone adhesive tape comprising a silicon adhesive layer containing carbon nanotubes.

The silicone resin used in the silicone pressure-sensitive adhesive layer of the present invention is preferably a silicone resin of BPO Type Shin-Etsu XR-100, XR101-10, XR130, Dow Corning 7355, 7356, 7358, 7406, 7566, 7735, 7956, X-40-3270, X-40-3270, X-40-3291, X-40-3229, X-40-3270, X-40-3306, Corning 7626, 7627, 7637, 7645, 7646, 7651, 7652, 7654, 7655, 7656, 7657, 4580, 4587, 4600, more preferably at least one selected from Dow Corning Q2-7646 and Dow Corning 7652 . The silicone pressure-sensitive adhesive layer is coated to a thickness of 5 to 150 mu m.

The coating method of the silicone pressure-sensitive adhesive layer can be applied to any method used in the art, and gravure coaters, microgravure coaters, comma coaters or slot die coaters can be used, and in particular, when the silicone pressure- .

The carbon nanotubes of the present invention are contained in the silicone pressure sensitive adhesive layer in an amount of 1 to 10% by weight, preferably 2 to 7% by weight, more preferably 2 to 5% by weight. When the carbon nanotubes are contained in the above amount, sufficient antistatic function can be performed without deteriorating the adhesive strength of the pressure-sensitive adhesive layer.

2 shows another example of the present invention in which an antistatic layer 5 is further provided on the back surface (the surface opposite to the surface on which the pressure-sensitive adhesive layer is formed) of the base substrate. In this case, the antistatic function of the silicone adhesive tape can be further improved. The antistatic agent used in the antistatic coating layer 5 may be the same as or different from the antistatic agent used in the antistatic coating layer 2, as long as it is commonly used in the art.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which preferred embodiments of the invention are shown. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

Manufacturing example  1. A charged base film

60 g of PEDOT; PSS (manufactured by JSI), 600 g of polyester dispersion (manufactured by SOOYANGCHEMTEC), 1,000 g of isopropyl alcohol, and 300 g of distilled water are placed in a 6,000 L circular blending bottle and mixed for 40 minutes to prepare an antistatic agent.

The above antistatic agent is coated on the corona discharge or primer treated surface of the polyester base film having a thickness of 50 탆 at a coating amount of 4 g / sq and a coating temperature is set to 100 캜 or higher.

Production Example 2. Preparation of single-walled carbon nanotube dispersion

Single-wall carbon nanotubes JSI Co., Ltd. TC-100 (diameter: 1.3 to 1.5 nm, solid content: 0.5 to 0.7 wt%) and 0.1 kg were added to 10 kg of N-methyl-2-pyrrolidone solvent and primary stirring was performed for 40 minutes After adding 0.2 ~ 0.4wt% of Polyvinyl pyrrolidone solids and 0.5 ~ 0.7wt% of Polyethylene Glycol, ultrasonic wave (probe type ultrasonic) was applied for 30 ~ 60min to prepare single wall carbon nanotube dispersion.

Preparation Example 3. Preparation of multi-walled carbon nanotube dispersion

Multi-Walled Carbon Nanotubes Multi-walled carbon nanotube dispersions were prepared by adding 0.1 kg of JSI TC-200 (Multi-wall-CNT <5%, Additive 5%) to 10 kg of MEK solvent.

Property test of base film or silicone adhesive tape

Measuring conditions

1) A polyester base film or conductive tape having a width of 1,000 mm was measured from the left side to the right side at 10 points, and the average value was calculated

2) Measuring equipment is Trek 152-1, using SIMCO ST-4 model

Substrate and silicon Adhesive layer  Bond strength measurement

The tape was attached to SUS in a high-temperature and high-humidity environment (85 ° C, 85%, and 120 hours environment), and then measured for the transition and bonding force of the silicone tape. The evaluation was made by the measurement method of ASTM D3359.

Example  One. Single wall  Manufacture of conductive silicone adhesive tape with carbon nanotubes

A silicon adhesive tape was manufactured by varying the thickness of the conductive silicone adhesive layer including single wall carbon nanotubes.

1) conductive silicone pressure-sensitive adhesive composition

A conductive silicon pressure-sensitive adhesive composition containing 2.0 wt% to 3.0 wt% of carbon nanotubes was prepared using a silicone pressure-sensitive adhesive (DowCorning Q2-7646 60 parts by weight and Dow Corning 7652 100 parts by weight) and the single-walled carbon nanotube dispersion of Preparation Example 2 Respectively.

2) Conductive silicone pressure-sensitive adhesive composition coating

The silicon pressure-sensitive adhesive composition was applied to the charged surface of a polyester having a thickness of 50 탆 at a coating amount of 40 g / sq or 60 g / sq using a comma coater or slot die coater, and the coating was performed at a drying temperature of 130 캜 or higher .

The substrate coated with the silicone pressure-sensitive adhesive composition was passed through a dryer and dried at 130 ° C for 2 to 3 minutes to remove the organic solvent to form a conductive silicone pressure-sensitive adhesive layer having a coating thickness of 10 탆, 20 탆 and 50 탆 after drying, The conductive silicone adhesive tape was prepared by rewinding the film together with the releasing film, or by rewinding after press bonding with the releasing film using a roll laminator.

The results are shown in Table 1 below.

Single wall
Carbon nanotube
The average surface resistance (Ω / sq) of the polyester base film Silicon PSA Thickness (탆) Silicone tape
Surface resistance
(Ω / sq)
SUS Adhesion
(gf / in)
Bonding strength to substrate
Example 1-1 5.8 X 10 5 Ω / □ 10 3.3 X 10 6 Ω / □ 4 No transition Examples 1-2 6.2 X 10 5 Ω / □ 20 5.8 X 10 6 Ω / □ 6 No transition Example 1-3 4.0 X 10 5 Ω / □ 50 6.9 X 10 7 Ω / □ 9 No transition

Example 2. Production of conductive silicone adhesive tape including multi-walled carbon nanotubes

A silicon adhesive tape was manufactured by varying the thickness of the conductive silicone adhesive layer including multi-walled carbon nanotubes.

1) conductive silicone pressure-sensitive adhesive composition

A conductive silicon pressure-sensitive adhesive composition containing 3.0 wt% to 4.0 wt% of carbon nanotubes was prepared using a silicone pressure-sensitive adhesive (DowCorning Q2-7646 60 parts by weight and Dow Corning 7652 100 parts by weight) and the multi-walled carbon nanotube dispersion of Preparation Example 3 Respectively.

2) Conductive silicone pressure-sensitive adhesive composition coating

The conductive silicon pressure-sensitive adhesive composition containing the above-mentioned multi-walled carbon nanotubes was applied at a coating amount of 40 g / sq or 60 g / sq using a comma coater or slot die coater to the electrified surface of the polyester base film having a thickness of 50 탆, 1 to prepare a conductive silicone adhesive layer having coating thicknesses of 10 탆, 20 탆 and 50 탆 and rewinding it as it is with the release film or rewinding after crimping with the release film using a roll laminator Thereby producing a conductive silicone adhesive tape.

The results are shown in Table 2 below.

Multiwall
Carbon nanotube
The polyester base film
Average surface resistance
(Ω / sq)
Silicon PSA
Thickness (㎛)
Silicone tape
Surface resistance
(Ω / sq)
SUS Adhesion
(gf / in)
Bonding strength to substrate
Example 2-1 2.8 X 10 5 Ω / □ 10 2.9 X 10 6 Ω / □ 4 No transition Example 2-2 7.7 X 10 5 Ω / □ 20 4.1 X 10 6 Ω / □ 6 No transition Example 2-3 4.9 X 10 5 Ω / □ 50 1.4 X 10 7 Ω / □ 9 No transition

Example 3.

The content of single-walled carbon nanotubes was made different to produce a silicone adhesive tape.

1) Silicone pressure sensitive adhesive composition

1.0 wt.%, 2.0 wt.% 3.0 wt.%, 4 wt.% Of the carbon nanotubes were dispersed using the silicone pressure sensitive adhesive (DowCorning Q2-7646 60 weight parts and Dow Corning 7652 100 weight parts) , 0 wt%, 5.0 wt%, and 10 wt%, were prepared.

2) silicone pressure-sensitive adhesive composition coating

The silicone pressure-sensitive adhesive composition was applied at a coating amount of 40 g / sq or 60 g / sq using a comma coater or a slot die coater to the charged surface of a polyester base film having a thickness of 50 탆 and coating was performed at a drying temperature of 130 캜 or higher do.

The substrate coated with the silicone pressure-sensitive adhesive composition was passed through a dryer and dried at 130 ° C for 2 to 3 minutes to remove the organic solvent to form a conductive silicone pressure-sensitive adhesive layer having a coating thickness of 20 μm after drying, Or by rewinding after crimping with a releasing film using a roll laminator to prepare a conductive silicone adhesive tape.

The physical properties of the silicone adhesive tape thus produced are shown in Table 3 below.

Example 3 Surface resistance of polyester base film
(Ω / sq)
Silicon PSA Thickness
(탆)
Silicone tape
Surface resistance
(Ω / sq)
SUS Adhesion
(gf / in)
Bonding strength to substrate
0.0wt% 1.3 X 10 5 Ω / □ 20 9.3 X 10 12 Ω / □ 4 No transition 2.0wt% 2.4 X 10 5 Ω / □ 20 2.2 X 10 7 Ω / □ 4 No transition 3.0wt% 4.3 X 10 5 Ω / □ 20 1.9 X 10 6 Ω / □ 5 No transition 4.0wt% 3.1 X 10 5 Ω / □ 20 1.1 X 10 6 Ω / □ 5 No transition 5.0 wt% 3.3 X 10 5 Ω / □ 20 7.5 X 10 5 Ω / □ 8 No transition 10.0 wt% 2.9 X 10 5 Ω / □ 20 7.9 X 10 5 Ω / □ 8 Has transition

Example 4.

The content of the multi-walled carbon nanotubes was made different, thereby producing a silicone adhesive tape.

1) Silicone pressure sensitive adhesive composition

(100 parts by weight of Dow Corning Q2-7646 and 100 parts by weight of Dow Corning 7652) and a multi-walled carbon nanotube dispersion of Preparation Example 3 were mixed with 0.03 wt% of carbon nanotubes, 3.0 wt% of 4 wt% of carbon nanotubes, 5 wt% of carbon nanotubes, 10% by weight of a conductive silicone adhesive composition was prepared.

2) Coating of silicone pressure sensitive adhesive composition

The silicone pressure-sensitive adhesive composition was applied at a coating amount of 40 g / sq or 60 g / sq using a comma coater or a slot die coater to the charged surface of a polyester base film having a thickness of 50 탆 and coating was performed at a drying temperature of 130 캜 or higher do.

The substrate coated with the silicone pressure-sensitive adhesive composition was passed through a dryer and dried at 130 ° C for 2 to 3 minutes to remove the organic solvent to form a conductive silicone pressure-sensitive adhesive layer having a coating thickness of 20 μm after drying, Or by rewinding after crimping with a releasing film using a roll laminator to prepare a conductive silicone adhesive tape.

The results are shown in Table 4.

Example 4
The polyester base film
Surface resistance
(Ω / sq)
Silicon PSA Thickness
(탆)
Silicone tape
Surface resistance
(Ω / sq)
SUS Adhesion
(gf / in)
Bonding strength to substrate
0.0wt% 5.1 X 10 5 Ω / □ 20 > 10 13 Ω / □
(Measurement impossible)
5 No transition
2.0wt% 3.8 X 10 5 Ω / □ 20 3.9 X 10 10 Ω / □ 4 No transition 3.0wt% 3.1 X 10 5 Ω / □ 20 5.5 X 10 6 Ω / □ 5 No transition 4.0wt% 4.5 X 10 5 Ω / □ 20 4.1 X 10 6 Ω / □ 5 No transition 5.0 wt% 2.9 X 10 5 Ω / □ 20 8.7 X 10 5 Ω / □ 9 No transition 10.0 wt% 2.7 X 10 5 Ω / □ 20 8.5 X 10 5 Ω / □ 9 Has transition

Comparative Example 1

For comparison, a comparison was made using a silicon pressure-sensitive adhesive to which a conductive component was not added, on the polyester base film subjected to the charging treatment of Production Example 1. [

The silicone pressure-sensitive adhesive composition without the conductive component was prepared as follows.

1) Silicone pressure sensitive adhesive composition

60 parts by weight of a silicone pressure-sensitive adhesive (Dow Corning, Q2-7646) and 100 parts by weight of a silicone pressure-sensitive adhesive (Dow Corning. 7652) were uniformly stirred to prepare a silicone pressure-sensitive adhesive.

2) Coating of silicone pressure sensitive adhesive composition

Coated on the surface of the polyester base film having a thickness of 50 탆 at a coating amount of 40 g / sq or 60 g / sq using a comma coater or a slot die coater and setting the drying temperature at 130 캜 or higher.

The substrate coated with the silicone pressure-sensitive adhesive composition was passed through a dryer and dried at 130 ° C for 2 to 3 minutes to remove the organic solvent to form a conductive silicone pressure-sensitive adhesive layer having a coating thickness of 10 탆, 20 탆 and 50 탆 after drying, The conductive silicone adhesive tape was prepared by rewinding the film together with the releasing film, or by rewinding after press bonding with the releasing film using a roll laminator.

The results are shown in Table 5.

Comparative Example 1 Surface resistance of polyester base film
(Ω / sq)
Silicon PSA Thickness
(탆)
Silicone tape
Surface resistance
(Ω / sq)
SUS Adhesion
(gf / in)
Bonding strength to substrate
0.0wt% 4.9 X 10 5 Ω / □ 10 8.9 x 10 12 Ω / □ 4 No transition 0.0wt% 5.4 X 10 5 Ω / □ 20 > 10 13 Ω / □
(Measurement impossible)
4 No transition
0.0wt% 3.6 X 10 5 Ω / □ 50 > 10 13 Ω / □
(Measurement impossible)
4 No transition

Comparative Example 2

For comparison, a silicone adhesive tape was prepared using a conductive silicone adhesive composition containing 0.0 wt%, 2.0 wt%, 3.0 wt%, 4 wt%, 5 wt%, and 10 wt% of multi-walled carbon nanotubes on a polyester base film The physical properties were measured.

The results are shown in Table 6 below.

Comparative Example 2
(Not charged
Not listed)
Surface resistance of polyester base film
(Ω / sq)
Silicon PSA Thickness
(탆)
Silicone tape
Surface resistance
(Ω / sq)
SUS Adhesion
(gf / in)
Bonding strength to substrate
0.0wt% > 10 13 Ω / □
(Measurement impossible)
20 8.2 X 10 10 Ω / □ 5 No transition
2.0wt% > 10 13 Ω / □
(Measurement impossible)
20 1.2 X 10 10 Ω / □ 4 No transition
3.0wt% > 10 13 Ω / □
(Measurement impossible)
20 6.4 X 10 9 Ω / □ 5 No transition
4.0wt% > 10 13 Ω / □
(Measurement impossible)
20 8.3 X 10 8 Ω / □ 5 No transition
5.0 wt% > 10 13 Ω / □
(Measurement impossible)
20 5.5 X 10 7 Ω / □ 9 No transition
10.0 wt% > 10 13 Ω / □
(Measurement impossible)
20 4.2 X 10 6 Ω / □ 9 Has transition

Comparative Example 3

For the sake of comparison, a silicon pressure-sensitive adhesive to which an ionic conductive component other than carbon nanotubes was added was compared with the charged polyester-based film of Production Example 1.

1) Silicone pressure sensitive adhesive composition

60 wt% of a silicon pressure-sensitive adhesive (DowCorning, Q2-7646), and 0.07 wt%, 1.0 wt%, 2.0 wt 3.0 wt%, 4 wt%, 5 wt% of an ionic conductive component (LiBF 4) 10% by weight of a conductive silicone adhesive composition was prepared.

2) Coating of silicone pressure sensitive adhesive composition

Coated on the surface of the polyester base film having a thickness of 50 탆 at a coating amount of 40 g / sq or 60 g / sq using a comma coater or a slot die coater and setting the drying temperature at 130 캜 or higher.

The substrate coated with the silicone pressure-sensitive adhesive composition was passed through a dryer and dried at 130 ° C for 2 to 3 minutes to remove the organic solvent to form a conductive silicone pressure-sensitive adhesive layer having a coating thickness of 10 탆, 20 탆 and 50 탆 after drying, The conductive silicone adhesive tape was prepared by rewinding the film together with the releasing film, or by rewinding after press bonding with the releasing film using a roll laminator.

The results are shown in Table 7.

Comparative Example 3
(Ionic
Conductive component)
Surface resistance of polyester base film
(Ω / sq)
Silicon PSA Thickness
(탆)
Silicone tape
Surface resistance
(Ω / sq)
SUS Adhesion
(gf / in)
Bonding strength to substrate
0.0wt% 2.5 X 10 5 Ω / □ 20 > 10 13 Ω / □
(Measurement impossible)
5 No transition
2.0wt% 4.5 X 10 5 Ω / □ 20 > 10 13 Ω / □
(Measurement impossible)
4 No transition
3.0wt% 5.2 X 10 5 Ω / □ 20 > 10 13 Ω / □
(Measurement impossible)
5 No transition
4.0wt% 3.1 X 10 5 Ω / □ 20 > 10 13 Ω / □
(Measurement impossible)
5 No transition
5.0 wt% 4.9 X 10 5 Ω / □ 20 8.2 X 10 10 Ω / □ 9 No transition 10.0 wt% 2.9 X 10 5 Ω / □ 20 Unsiliconized silicone adhesive - -

Comparative Example 4

For comparison, a silicon pressure-sensitive adhesive to which a metallic conductive component (Cu) other than carbon nanotubes were added was compared with the polyester base film subjected to the charging treatment of Production Example 1.

1) Silicone pressure sensitive adhesive composition

60 wt% of a silicon pressure sensitive adhesive (Dow Corning, Q2-7646) and a silicone pressure sensitive adhesive (Dow Corning, 7652) A conductive silicone pressure-sensitive adhesive composition was prepared.

2) Coating of silicone pressure sensitive adhesive composition

Coated on the surface of the polyester base film having a thickness of 50 탆 at a coating amount of 40 g / sq or 60 g / sq using a comma coater or a slot die coater and setting the drying temperature at 130 캜 or higher.

The substrate coated with the silicone pressure-sensitive adhesive composition was passed through a dryer and dried at 130 ° C for 2 to 3 minutes to remove the organic solvent to form a conductive silicone pressure-sensitive adhesive layer having a coating thickness of 10 탆, 20 탆 and 50 탆 after drying, The conductive silicone adhesive tape was prepared by rewinding the film together with the releasing film, or by rewinding after press bonding with the releasing film using a roll laminator.

The results are shown in Table 8.

Comparative Example 4
(Metallic
Conductive component)
Surface resistance of polyester base film
(Ω / sq)
Silicon PSA Thickness
(탆)
Silicone tape
Surface resistance
(Ω / sq)
SUS Adhesion
(gf / in)
Bonding strength to substrate
0.0wt% 4.8 X 10 5 Ω / □ 20 > 10 13 Ω / □
(Measurement impossible)
5 No transition
2.0wt% 6.2 X 10 5 Ω / □ 20 > 10 13 Ω / □
(Measurement impossible)
4 No transition
3.0wt% 3.3 X 10 5 Ω / □ 20 > 10 13 Ω / □
(Measurement impossible)
5 No transition
4.0wt% 4.4 X 10 5 Ω / □ 20 9.4 X 10 10 Ω / □ 5 No transition 5.0 wt% 4.7 X 10 5 Ω / □ 20 Unsiliconized silicone adhesive - No transition 10.0 wt% 5.1 X 10 5 Ω / □ 20 Unsiliconized silicone adhesive - -

According to the above results, when the antistatic-treated base film is coated with a silicon pressure-sensitive adhesive containing 1 to 10 wt% of carbon nanotubes, the surface resistance of the contrast silicone tape is excellent. The surface resistivity is the same but the bond strength of the silicone adhesive layer is excellent and the transition is not observed in a high temperature and high humidity environment when the amount is less than 5 wt%.

1. Base film
2, 5. Antistatic coating layer
3. Silicone Adhesive Layer with Carbon Nanotubes
4. Release film

Claims (6)

  1. A base film; Antistatic coating layer; A silicon adhesive layer containing more than 2 wt% and less than 7 wt% carbon nanotubes; And a releasing film sequentially laminated on a substrate,
    Wherein the thickness of the carbon nanotube-containing silicon adhesive layer is 10 to 150 mu m,
    Wherein the antistatic coating layer comprises a conductive polymer.
  2. An antistatic silicone adhesive tape according to claim 1, further comprising an antistatic coating layer on the back side of the surface on which the silicone adhesive layer of the base film is laminated,
  3. delete
  4. delete
  5. delete
  6. The antistatic silicone adhesive tape according to claim 1, wherein the antistatic coating layer comprises at least one selected from poly (3,4-ethylenedioxythiophene, PEDOT) and poly (4-styrenesulfonate, PSS)
KR1020170108730A 2017-08-28 2017-08-28 Adhesive tape having antistatic function KR101987760B1 (en)

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002069395A (en) * 2000-08-28 2002-03-08 Fujimori Kogyo Co Ltd Adhesive tape for producing semiconductor

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8434291U1 (en) 1984-11-23 1986-03-27 Beiersdorf Ag, 2000 Hamburg, De
JP4539081B2 (en) 2003-11-21 2010-09-08 東洋インキ製造株式会社 Antistatic polyurethane adhesive and method for producing the same
JP5309714B2 (en) 2007-07-04 2013-10-09 信越化学工業株式会社 Silicone pressure-sensitive adhesive composition having antistatic properties and silicone pressure-sensitive adhesive tape
KR101371102B1 (en) * 2012-02-10 2014-03-10 도레이첨단소재 주식회사 Composition for Conductive Adhesive, Adhesive Film and Circuit Board Using the Same
KR20170055800A (en) * 2015-11-12 2017-05-22 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Mold release film
KR101824804B1 (en) * 2016-06-14 2018-02-01 삼지산업 주식회사 Film comprising antistatic layer and manufacturing method threrof

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002069395A (en) * 2000-08-28 2002-03-08 Fujimori Kogyo Co Ltd Adhesive tape for producing semiconductor

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