KR101983638B1 - 기판 홀딩장치 및 챔버장치 - Google Patents
기판 홀딩장치 및 챔버장치 Download PDFInfo
- Publication number
- KR101983638B1 KR101983638B1 KR1020170031301A KR20170031301A KR101983638B1 KR 101983638 B1 KR101983638 B1 KR 101983638B1 KR 1020170031301 A KR1020170031301 A KR 1020170031301A KR 20170031301 A KR20170031301 A KR 20170031301A KR 101983638 B1 KR101983638 B1 KR 101983638B1
- Authority
- KR
- South Korea
- Prior art keywords
- pole piece
- chuck plate
- base
- substrate
- holding
- Prior art date
Links
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/04—Arrangements of electric connections to coils, e.g. leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F7/00—Magnets
- H01F7/02—Permanent magnets [PM]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F7/00—Magnets
- H01F7/06—Electromagnets; Actuators including electromagnets
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020170031301A KR101983638B1 (ko) | 2017-03-13 | 2017-03-13 | 기판 홀딩장치 및 챔버장치 |
CN201810205964.8A CN108573909B (zh) | 2017-03-13 | 2018-03-13 | 基板保持装置以及腔室装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020170031301A KR101983638B1 (ko) | 2017-03-13 | 2017-03-13 | 기판 홀딩장치 및 챔버장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20180104798A KR20180104798A (ko) | 2018-09-27 |
KR101983638B1 true KR101983638B1 (ko) | 2019-05-30 |
Family
ID=63573917
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020170031301A KR101983638B1 (ko) | 2017-03-13 | 2017-03-13 | 기판 홀딩장치 및 챔버장치 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR101983638B1 (zh) |
CN (1) | CN108573909B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102364941B1 (ko) * | 2021-05-11 | 2022-02-17 | 최태광 | 자기력 제어 장치 및 이를 이용한 자성체 홀딩 장치 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001049422A (ja) * | 1999-08-09 | 2001-02-20 | Hitachi Ltd | メタルマスクの基板への保持固定構造、保持固定治具、その補助具、及びトレイ |
JP2003255297A (ja) * | 2002-02-22 | 2003-09-10 | Lg Phillips Lcd Co Ltd | 液晶表示素子用真空貼り合わせ装置及びその駆動方法 |
JP5192492B2 (ja) * | 2008-03-28 | 2013-05-08 | キヤノンアネルバ株式会社 | 真空処理装置、当該真空処理装置を用いた画像表示装置の製造方法及び当該真空処理装置により製造される電子装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100422487B1 (ko) * | 2001-12-10 | 2004-03-11 | 에이엔 에스 주식회사 | 전자석을 이용한 유기전계발광소자 제작용 증착장치 및그를 이용한 증착방법 |
KR100534580B1 (ko) * | 2003-03-27 | 2005-12-07 | 삼성에스디아이 주식회사 | 표시장치용 증착 마스크 및 그의 제조방법 |
CN103221179A (zh) * | 2010-09-20 | 2013-07-24 | 蔡达光 | 结合永久磁铁和电磁铁的磁体保持装置 |
KR101182848B1 (ko) * | 2011-12-27 | 2012-09-14 | 최태광 | 영구자석과 전자석을 결합한 자성체 홀딩장치 |
KR20130124680A (ko) * | 2012-05-07 | 2013-11-15 | (주) 테크노라이즈 | 유지보수가 용이한 영전자 척 |
KR101430383B1 (ko) * | 2014-03-26 | 2014-08-13 | 최태광 | 잔류 자기를 최소화한 자성체 홀딩 장치 |
KR101427066B1 (ko) * | 2014-04-08 | 2014-08-07 | 최태광 | 잔류 자기를 최소화한 자성체 홀딩 장치 |
US9905346B2 (en) * | 2014-12-26 | 2018-02-27 | Smc Corporation | Magnet chuck |
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2017
- 2017-03-13 KR KR1020170031301A patent/KR101983638B1/ko active IP Right Grant
-
2018
- 2018-03-13 CN CN201810205964.8A patent/CN108573909B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001049422A (ja) * | 1999-08-09 | 2001-02-20 | Hitachi Ltd | メタルマスクの基板への保持固定構造、保持固定治具、その補助具、及びトレイ |
JP2003255297A (ja) * | 2002-02-22 | 2003-09-10 | Lg Phillips Lcd Co Ltd | 液晶表示素子用真空貼り合わせ装置及びその駆動方法 |
JP5192492B2 (ja) * | 2008-03-28 | 2013-05-08 | キヤノンアネルバ株式会社 | 真空処理装置、当該真空処理装置を用いた画像表示装置の製造方法及び当該真空処理装置により製造される電子装置 |
Also Published As
Publication number | Publication date |
---|---|
CN108573909B (zh) | 2022-11-22 |
CN108573909A (zh) | 2018-09-25 |
KR20180104798A (ko) | 2018-09-27 |
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