KR101973286B1 - Method and apparatus of fabrating organic light emitting diode for illumination - Google Patents

Abstract

Disclosed are an apparatus and a method for fabricating an organic light emitting diode (OLED) for lighting. The manufacturing apparatus comprises a vapor deposition unit which moves, in a lateral direction, a strip-shaped substrate formed with holes at regular intervals on both ends in the width direction; and discharges a vaporizing material from a deposition source on one surface of the substrate to perform sequential vapor deposition as a plurality of rolling members and the substrate arranged at regular intervals move in accordance with the moving direction of the substrate. Meanwhile, on one surface of each rolling member, a plurality of protruding members are formed to move the substrate by being fitted into and released from the holes formed at both ends of the substrate in accordance with the rotation of the rolling members.

Description

TECHNICAL FIELD [0001] The present invention relates to an organic light emitting diode (OLED)

The present invention relates to a method for manufacturing an organic light emitting device for illumination and an apparatus for manufacturing the same.

An organic light emitting diode (OLED) is a self-luminous element that recombines electrons and holes in an organic light emitting layer to generate light. When an electric current is applied to an OLED device, recombination of molecular exits in the light emitting layer exists in the form of singlet excitons and triplet excitons. Here, 25% of the high-energy-state molecular excitons correspond to singlet term excitons, and triplet excitons are low-energy molecular excitons, 75%. Single-excitons and triplet excitons return to a low-energy ground state, where light (photons) is generated or released into heat and then quenched. At this time, a case where light is formed by a single-excited exciton is referred to as fluorescence, and a case where light is generated by a triplet exciton is referred to as phosphorescence. In the case of a fluorescent organic material, only 25% of the exciton contributes to the generation of light. When phosphorescent organic materials are used, light is generated by the triplet exciton corresponding to 75% of the exciton. The singleton excitons corresponding to the remaining 25% also transmit energy to the triplet excitons through the ISC (Intersystem Crossing) path, contributing to the generation of light, and 100% of the excitons contribute to the light energy.

Since the implementation of OLED in 1987, commercialization products have appeared in the display and illumination fields by developing organic materials, developing organic materials, improving charge transport, improving transparent electrodes, and developing light extraction structures. In particular, as regulations for the use of incandescent lamps and fluorescent lamps are being regulated due to measures for promoting energy saving, OLED light sources are in the spotlight. In addition, OLED light sources have the advantage of being environmentally friendly because heavy metals such as mercury and lead are not used.

In general, a vacuum deposition method or a coating method is known as a method of manufacturing such an OLED. Among them, a vacuum deposition method is mainly used in that the purity of a constituent layer forming material can be increased and an OLED having a long lifetime can be produced. In such a vacuum deposition method, a constituent layer is formed by performing vapor deposition using an evaporation source provided at a position facing the substrate in a vacuum chamber. Such OLED production processes have been made using flat glass substrates, which have increased the size of the equipment as the size of the substrate increases. This increases the cost of facilities such as devices, cleanrooms, and the like, thereby increasing the price. Because lighting products are key to price competitiveness, it is important to produce large quantities in a small cleanroom space. For this purpose The OLED production process employs a roll process. The roll process is a process in which a constituent layer is continuously deposited on a substrate while the substrate is being moved by continuously releasing the substrate wound in a roll form and re-winding the substrate unwound from the other side.

In the roll process, when the evaporation source is disposed above the substrate and the evaporation material is discharged downward from the evaporation source to form a constituent layer, foreign matter such as dust falls from the evaporation source and adheres to the substrate, It may be mixed into the device. If foreign matter is mixed in such an organic EL device, the light emission is adversely affected. Therefore, in order to suppress the inclusion of such foreign matter, an evaporation source is disposed below the substrate. However, since the organic light emitting element is formed by laminating a plurality of constituent layers, it is necessary to move the substrate so as to pass above all evaporation sources if all the constituent layers are to be formed sequentially by deposition from below. In this case, since a region passing through the evaporation source in the substrate becomes long, it becomes difficult to give sufficient tension to the substrate, and the substrate tends to bend or vibrate. If the vapor deposition surface of the substrate and the evaporation source come into contact with each other due to warping or vibration of the substrate, there is a possibility that the substrate and the constituent layer formed on the substrate are damaged. Further, if the distance between the substrate and the evaporation source changes, it becomes difficult to appropriately control the thickness of the constituent layer, and there is a fear that a constituent layer having desired luminescence characteristics can not be obtained. Further, when the amount of tension is increased to provide sufficient tension to the substrate, a stretching force acts on the substrate to cause a problem that the substrate is stretched in the case of a flexible substrate, causing deformation of the substrate, Problems can arise. In addition, when the roll process is performed using a thin glass, an excessive amount of tension may cause breakage of the substrate, and normal product manufacture may not be possible.

It is an object of the present invention to provide an apparatus and a method for manufacturing an organic light emitting diode in which quality deterioration is suppressed. It should be understood, however, that the technical scope of the present invention is not limited to the above-described technical problems, and other technical problems may exist.

According to an aspect of the present invention, there is provided an apparatus for manufacturing an organic light emitting diode (OLED) for illumination according to the first aspect of the present invention, A plurality of rolling members arranged at predetermined intervals in accordance with the moving direction of the substrate; and a plurality of rolling members arranged on one surface of the substrate, And a vapor deposition unit for performing vapor deposition in succession. At this time, on one surface of each rolling member, a plurality of protruding members are formed which are fitted and unfitted in the holes formed at both ends of the base material as the rolling member rotates, thereby moving the base material.

According to a second aspect of the present invention, there is provided a method of manufacturing an organic light emitting device for illumination, comprising: supplying a strip-shaped substrate having a predetermined hole at both ends in a width direction to a vapor deposition unit; And a plurality of rolling members arranged at predetermined intervals according to a moving direction of the substrate to move the substrate in a lateral direction, and as the substrate moves, a vaporizing material is discharged from an evaporation source onto one surface of the substrate, . At this time, the sequential deposition step is performed as the projecting member formed on one surface of the rolling member is fitted into the holes formed at both ends of the rolling member as the rolling member is rotated, and released from the hole, thereby moving the substrate.

According to the various embodiments as described above, it is possible to prevent the substrate from being warped or vibrated by giving sufficient tension to the substrate. Further, deterioration in quality due to contamination, stain, etc. of the substrate can be minimized by using the shield member and the substrate formed by including the magnetic material.

FIG. 1 shows an apparatus for manufacturing an organic light emitting diode for illumination according to an embodiment of the present invention.
2 shows a structure of a substrate according to an embodiment of the present invention.
Figure 3 shows a top view of a substrate according to an embodiment of the invention.
Figure 4 illustrates a side view of rolling elements disposed below the substrate in accordance with one embodiment of the present invention.
Fig. 5 shows the XY cross section of Fig. 3. Fig.
6 shows a configuration of an apparatus for manufacturing an organic light emitting diode for illumination according to another embodiment of the present invention.
7 shows the structure of a shield member and a substrate according to another embodiment of the present invention.
8 illustrates a method of manufacturing an organic light emitting device for illumination according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will be readily apparent to those skilled in the art. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and similar parts are denoted by like reference characters throughout the specification.

In the following description with reference to the drawings, the same reference numerals will be used to designate the same names, and the reference numerals are merely for convenience of description, and the concepts, features, and functions Or the effect is not limited to interpretation.

Throughout the specification, when a part is referred to as being "connected" to another part, it includes not only "directly connected" but also "electrically connected" with another part in between . Also, when an element is referred to as " including " an element, it is to be understood that the element may include other elements as well as other elements, And does not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Throughout the present specification, the term " organic " includes polymeric materials as well as small molecule organic materials that can be used to produce organic optoelectronic devices.

Throughout the specification of the present invention, when a part is referred to as " including " an element, it is understood that it may include other elements as well, without excluding other elements unless specifically stated otherwise. The terms " about ", " substantially ", etc. used to the extent that they are used throughout the present disclosure are used in their numerical value or in close proximity to their numerical values when the manufacturing and material tolerances inherent in the stated meanings are presented, Accurate or absolute numbers are used to prevent unauthorized exploitation by unauthorized intruders of the referenced disclosure. The word " step (or step) " or " step " used in the specification of the present invention does not mean " step for.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Fig. 1 shows an apparatus 10 for manufacturing an organic light emitting element for illumination according to an embodiment of the present invention. The manufacturing apparatus 10 according to the embodiment of the present invention is adapted to manufacture the organic light emitting element for illumination in the substrate 3 by vapor deposition while moving the strip-shaped substrate 3 in the lateral direction.

As shown in Fig. 1, the manufacturing apparatus 10 includes evaporation portions A, B and C for discharging a vaporizing material from an evaporation source in a transverse direction to perform vapor deposition sequentially, (5a to 5g, hereinafter referred to as " 5 ").

First, the base material 3 is formed in a band-like shape in which holes are formed at regular intervals at both ends in the width direction, and a plurality of layers are joined and formed by the base material supply unit 7 provided with the base material supply device. A to C). Here, the base material supply device may be, for example, an unwinder which unwinds the strip-shaped base material 3 wound in a roll shape. The description will be made in detail with reference to Fig. 2 and Fig.

The deposition portions A to C are provided with a deposition portion A for depositing an organic material and a deposition portion B for depositing a cathode material along the moving direction of the substrate 3 thin film encapsulation (TFE), or a vapor deposition unit (C) for depositing an encapsulating material according to a hybrid method. The deposition portions A to C are provided with evaporation sources 11a to 11g below the moving substrate 3. [ As the deposition surfaces of the substrate 3 are moved downward, the vapor deposition materials A are discharged from the vapor sources 11a to 11g to deposit them on the deposition surface.

The evaporation sources 11a to 11g may be arranged such that the openings of the evaporation sources are opposed to the evaporation face of the substrate 3. Each of the evaporation sources 11a to 11g includes a heating unit (not shown), and the heating unit heats and vaporizes the material accommodated in each evaporation source, and discharges the respective vaporized materials from the opening upward. The number of evaporation sources arranged in each of the evaporation units A to C may be one or more according to the layer to be formed and is not limited to the embodiment of Fig.

Although the evaporation sources 11a to 11g are shown as being disposed below the substrate 3 in FIG. 1, the evaporation source may be disposed above or beside the substrate 3, according to an embodiment. When the evaporation source is disposed on the side of the substrate 3, the substrate 3 can be realized so as to be moved laterally in the vertical standing state.

Further, although not shown in FIG. 1, the manufacturing apparatus 10 has a plurality of vacuum chambers. In each vacuum chamber, a substrate supplying portion 7, a vapor deposition portion A, a vapor deposition portion B, a vapor deposition portion C, and a rolling member 5 are disposed. Each of the vacuum chambers is evacuated by a vacuum generator to form a vacuum region in the vacuum chamber. Further, adjacent vacuum chambers communicate with each other through the openings while maintaining the vacuum state. Further, by driving the rolling member 5, the base material 3 can be sequentially moved from the base material supplying portion 7 through the opening portion. Specifically, the base material 3 unwound from the base material supplying portion 7 is moved to the vapor deposition portion A, the vapor deposition portion B, and the vapor deposition portion C.

Figure 2 shows the construction of a substrate 3 according to an embodiment of the invention. 2, the substrate 3 is formed by sequentially laminating a plurality of materials. Specifically, the substrate 3 is an anode (for example, ITO (Indium Tin Oxide) coating) glass (22), a support film (21) bonded to the top of the glass substrate (22) to support the glass substrate (22), and a plurality of shadows And shadow masks (23, 24, 25).

The plurality of shadow masks 23, 24 and 25 may include an encapsulation shadow mask 23 used in the deposition section C, a cathode shadow mask 23 used in the deposition section B, And an organic shadow mask 25 used in the deposition unit A. The shadow masks 23, 24 and 25 are disposed in the vicinity of the substrate 3 in the direction of movement of the substrate 3, Can be sequentially bonded to the base material 3 from a shadow mask (that is, the encapsulated shadow mask 23) to be used later.

The shadow masks 23, 24, and 25 are sequentially separated and collected by the mask recovery units 9a, 9b, and 9c provided with the mask recovery apparatuses disposed at the ends of the deposition units A to C, respectively. Here, the mask recovery device may be a winder, but is not limited thereto.

On the other hand, the width, thickness and length of the base material 3 can be variously set depending on the size of the substrate for an organic light emitting element formed on the base material 3 and the like.

Referring again to Fig. 1, holes 31a and 31b are formed in the base material 3 at both ends in the width direction at regular intervals. Fig. 3 shows a top view of such a substrate 3. Fig. And Fig. 4 shows a side view of the rolling elements arranged below the substrate 3. Fig. As shown in Figs. 3 and 4, a protruding member 41 protruding outward is formed on one surface of the rolling member 5, and is temporarily fitted in the hole of the base material 3. Fig. Each hole of the substrate 3 may be formed based on the spacing between the projecting members formed on each rolling member. That is, the longitudinal distance d1 between the two holes coincides with the circumferential distance d2 connecting the ends of the two protruding members. Therefore, as the rolling member 5 is driven, the projection member 41 formed on each rolling member 5 is repeatedly inserted into and released from the holes 31a and 31b of the substrate 3, .

The plurality of rolling members 5 are rotationally driven at the same angular velocity. The manufacturing apparatus 10 may include a driving unit 43 connected to one of the plurality of rolling members 5 to rotate the corresponding rolling member 45. At this time, the driving unit 43 may be a motor or the like.

The manufacturing apparatus 10 also includes a first connecting member 47 connecting the rolling members arranged in the longitudinal direction of the base material 3 and a second connecting member 47 connecting the two or more rolling members disposed at both ends in the width direction of the base material 3 And a second connecting member (see 51 in Fig. 5). Specifically, the rolling members arranged in the longitudinal direction of the base member 3 receive the driving force from the driving unit 43 connected to one rolling member 45 through the first connecting member 47, and are rotationally driven together. The rolling member disposed at one end of the substrate 3 is connected to the rolling member disposed at the other end of the base member 3 by the second connecting member 51 and is rotationally driven together. However, the present invention is not limited thereto, and the manufacturing apparatus 10 can be rotated and driven at the same angular velocity of each of the plurality of rolling members 5 by using two or more drive units.

The holes 31a and 31b are formed in the support film 21 and the plurality of shadow masks 23, 24, and 25 except for the glass substrate 22. Fig. 5 is a cross-sectional view taken along the line X-Y of Fig. 3, showing a shape temporarily fitted by the projecting member 51 formed on the rolling member 5. Fig. As shown in Fig. 5, the glass substrate 22 is formed to have a shorter width than the interval between the holes 31a and 31b formed at both ends of the substrate 3, and has a shorter width than the other layers. Illustratively, the glass substrate 22 is formed to have a width of about 20 mm shorter than the other layers. Through this, it is possible to prevent the deposition surface of the base material 3 from being damaged by forming the holes only on the non-deposition surface of the base material 3.

The holes 31a and 31b formed at both ends of the substrate 3 are aligned in the width direction of the base material 3 and the two rolling members 41a and 41b connected to the rotating shaft by the connecting member 51 The substrate 3 is moved in the lateral direction while being repeatedly inserted and unfolded. The substrate 3 moves in a state where it is aligned by the rolling members 41a and 41b connected by the connecting member 51 so that the operation for aligning the substrate 3 in each of the deposition portions A to C (For example, a work for winding up the substrate, unwinding the wound substrate again and supplying it to each of the evaporation units, etc.) can be omitted. Furthermore, since the plurality of rolling members 5 are arranged at regular intervals along the base material 3, sufficient tension is applied to the base material 3 to prevent the base material 3 from being bent or oscillated.

On the other hand, the manufacturing apparatus 10 may further include a striking portion (not shown) having a striking device for striking a hole on the substrate before the substrate is supplied to the vapor deposition portion A. A striking portion (not shown) is disposed at the front end of the substrate supplying portion 7, and both ends of the substrate 3 can be struck at regular intervals. At this time, the striking portion (not shown) may be formed by punching the substrate 3 to which all the layers are joined, or by removing the remaining layers except the glass substrate 22 (i.e., the support film 21 and the plurality of shadow masks 23 to 25) ) Can be presented individually. In the former case, the striking portion may be disposed at the rear end of a joint portion (not shown) for joining the respective layers of the base material 3, and in the latter case, the striking portion may be disposed at the front end after the joining.

6 shows a configuration of an apparatus 10a for manufacturing an organic light emitting diode for illumination according to another embodiment of the present invention.

6, the manufacturing apparatus 10a according to another embodiment of the present invention includes deposition units A to C, a plurality of rolling members 5 and a substrate supply unit 7, (61) disposed above the substrate (3) with a certain space therebetween in the deposition portions (A to C) in addition to the substrate (9). The shield member 61 is fixed to the deposition chamber (not shown) or the like so as to have a space (for example, a space of about 100 nm) between the substrate 3 and a certain distance, thereby preventing contamination or the like of the substrate 3. Further, the shield member 61 prevents the center portion of the substrate 3, which is not supported by the rolling member 5, from striking as the width of the substrate 3 increases, and prevents the material from being poorly deposited . Hereinafter, this will be described in detail with reference to FIG.

Fig. 7 shows the configuration of the shield member 61 and the base material 3 according to another embodiment of the present invention. 7, the shield member 61 and the base material 3 may be formed to include the magnetic substance materials 71 and 72. At this time, the magnetic material may include nickel (Ni), iron (Fe), cobalt (Co), and the like as a non-limiting example. In addition, the magnetic substance material 72 of the base material 3 may be formed in the support film 21. [ A control unit (not shown) provided in the manufacturing apparatus 10 controls the currents flowing in mutually different directions to flow through the shield member 61 and the magnetic substance materials 71 and 72 formed on the base material 3, 61 and the support film 21, as shown in Fig. At this time, the control unit (not shown) may adjust the intensity of the electric current so that the shield member 61 and the substrate 3 are kept in a constant space 73.

Alternatively, according to the embodiment, the shield member may be formed to include a magnetic material having a magnetic force so that the substrate 3 maintains a constant space in the shield member. In this case, by changing the amount of the magnet material (for example, the thickness of the shield member) included in the shield member, it is possible to maintain the space between the magnetic member and the base material 3 on which the magnetic material is formed.

Each of the magnetic substance materials 71 and 72 may be formed at a certain distance in the shield member 61 and the substrate 3 and partially formed at the central portion of the substrate 3.

As described above, the manufacturing apparatus 10a according to another embodiment of the present invention further includes the shield member 61, so that deterioration in quality due to contamination, stain, etc. of the substrate can be minimized.

FIG. 8 illustrates a method 80 of manufacturing an organic light emitting device for illumination according to an embodiment of the present invention. The manufacturing method 80 shown in Fig. 8 relates to the embodiments described in Figs. 1 to 7 described above. Therefore, the contents described above in FIGS. 1 to 7 can be applied to the manufacturing method 80 of FIG. 8, even if omitted below.

First, a substrate is formed (S1). Specifically, a support film may be bonded to an upper portion of the glass substrate to support the glass substrate through the bonding portion, and a plurality of shadow masks may be successively bonded to the lower portion of the glass substrate. At this time, the plurality of shadow masks can be successively bonded to the glass substrate from the shadow mask used most recently in accordance with the moving direction of the substrate.

Then, the substrates are fired at regular intervals on the bonded substrates to form holes at both ends of the substrates at regular intervals. At this time, the glass substrate is formed to have a width narrower than the interval of the holes formed at both ends of the substrate. Therefore, as shown in Fig. 5, no hole is formed in the glass substrate even if a hole is formed in the substrate.

However, the above-described S1 is not an essential element for the manufacturing method 80 according to the embodiment of the present invention, and may be omitted. In this case, the substrate formed according to the above-described method may be provided from the outside.

Thereafter, the substrate is supplied to the deposition unit (S2).

Thereafter, the base material is moved in the lateral direction through a plurality of rolling members arranged at predetermined intervals according to the moving direction of the base material. As the base material is moved, the vaporizing material is discharged from the vapor source on one surface of the base material, (S3). Specifically, a first deposition step (S31) for depositing an organic material, a second deposition step (S32) for depositing a cathode material, and a third deposition step (S33) for depositing an encapsulating material are sequentially performed. At this time, in each of the first to third deposition processes (S31 to S33), the shadow mask bonded to the lowermost portion of the substrate can be recovered.

The plurality of rolling members are interconnected by a connecting member, and are driven to rotate at a constant angular velocity by one of the plurality of rolling members, thereby moving the base material at a constant speed.

According to an embodiment of the present invention, each of the deposition processes (S31 to S33) includes a shield member disposed above the substrate with a certain space therebetween, and a control unit for controlling the current flowing in the direction opposite to the magnetic material contained in each of the substrates can do. This can be performed by a control unit (not shown) provided in the manufacturing apparatus 10a.

It will be understood by those skilled in the art that the foregoing description of the present invention is for illustrative purposes only and that those of ordinary skill in the art can readily understand that various changes and modifications may be made without departing from the spirit or essential characteristics of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.

The scope of the present invention is defined by the appended claims rather than the detailed description and all changes or modifications derived from the meaning and scope of the claims and their equivalents are to be construed as being included within the scope of the present invention do.

The foregoing description is merely illustrative of the technical idea of the present invention, and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention. It should be noted that the embodiments disclosed in the present invention are not intended to limit the scope of the present invention and are not intended to limit the scope of the present invention. Accordingly, the scope of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as being included in the scope of the present invention.

10: Manufacturing apparatus
3: Substrate 5 (5a to 5g): Rolling member
7: substrate supply part 9 (9a, 9b, 9c): mask recovery part
11a to 11g:
21: Support film 22: Glass substrate
23: bag shadow mask 24: cathode shadow mask
25: Organic shadow mask
41: protruding member 43:
47: first connecting member 51: second connecting member
10a: Manufacturing apparatus
61: shield member
71, 72: magnetic material

Claims (18)

1. A manufacturing apparatus for manufacturing an organic light emitting diode (OLED) for illumination,
A plurality of rolling members arranged at regular intervals along the moving direction of the base material, the band-shaped base material having holes formed at regular intervals at both ends in the width direction,
And a deposition unit for sequentially depositing a vaporizing material from a vapor source on one side of the substrate as the substrate moves,
A plurality of protruding members are formed on one surface of each of the rolling members, the protruding members being fitted and unfitted in the holes formed at both ends of the base as the rolling member is rotated,
The substrate
A support film laminated on top of the glass substrate to support the glass substrate; a glass substrate; and a plurality of shadow masks bonded to a lower portion of the glass substrate, Formed,
The deposition unit
And a third deposition section for depositing an encapsulation material, wherein the first deposition section deposits an organic material on the substrate, the second deposition section deposits a cathode material, and the third deposition section deposits an encapsulation material, And a mask recovery unit arranged to recover a shadow mask bonded to the lowermost portion of the substrate,
Wherein the plurality of shadow masks include an encapsulated shadow mask used in the third evaporation portion, a cathode shadow mask used in the second evaporation portion, and an organic shadow mask used in the first evaporation portion, Wherein the cathode shadow mask and the organic shadow mask are sequentially bonded to the substrate from the sealing shadow mask used for the last time in accordance with the moving direction of the substrate. The method according to claim 1,
The manufacturing apparatus
And a driving unit connected to one of the plurality of rolling members to rotate the one rolling member. 3. The method of claim 2,
The manufacturing apparatus includes:
A first connecting member connecting a plurality of rolling members arranged in the longitudinal direction of the base material; And
And a second connecting member for connecting rotational shafts of at least two rolling members disposed at both ends in the width direction of the base material. delete delete The method according to claim 1,
Wherein the glass substrate is formed to have a width narrower than an interval of holes formed at both ends of the substrate. The method according to claim 1,
The manufacturing apparatus
Further comprising a striking portion having a striking device for striking the hole on the substrate before the substrate is provided to the vapor deposition portion. The method according to claim 1,
The deposition unit
And a shield member disposed above the substrate with a predetermined space therebetween. 9. The method of claim 8,
Wherein each of the shield member and the base material is formed to include a magnetic substance material. 10. The method of claim 9,
Wherein the magnetic substance material is formed on the support film of the base material. 10. The method of claim 9,
The manufacturing apparatus
Further comprising a control unit for controlling the shield member and the substrate so that a current flows in a direction opposite to the shield member,
The control unit
And adjusts the intensity of the electric current so that the shield member and the substrate have a predetermined space therebetween. 9. The method of claim 8,
Wherein the shield member is formed to include a magnet material, and the substrate is formed to include a magnetic material. A manufacturing method for manufacturing an organic light emitting diode (OLED) for illumination,
Supplying a strip-shaped base material having a predetermined hole at both ends in the width direction to the vapor deposition unit; And
The substrate is moved in the lateral direction through a plurality of rolling members arranged at predetermined intervals according to the moving direction of the substrate and the vaporizing material is discharged from the vapor source on one surface of the substrate as the substrate is moved and is sequentially deposited ≪ / RTI >
The step of sequentially depositing
As the rolling member is rotated, a protruding member formed on one surface of the rolling member is inserted into the hole formed at both ends of the base member and is released from the base member to move the base member,
The step of sequentially depositing
A first deposition process for depositing an organic material, a second deposition process for depositing a cathode material, and a third deposition process for depositing an encapsulation material are sequentially performed along the moving direction of the substrate,
The shadow mask bonded to the lowermost portion of the base material is recovered in each of the first to third deposition processes,
Prior to supplying the substrate,
Bonding a support film to the top of the glass substrate to support the glass substrate; And
Sequentially bonding a plurality of shadow masks to a lower portion of the glass substrate,
Wherein the plurality of shadow masks include an encapsulated shadow mask used in the third deposition process, a cathode shadow mask used in the second deposition process, and an organic shadow mask used in the first deposition process, Wherein the cathode shadow mask and the organic shadow mask are sequentially bonded to the substrate from the sealing shadow mask used for the last time in accordance with the moving direction of the substrate. delete delete 14. The method of claim 13,
Wherein the glass substrate is formed to have a width narrower than an interval of holes formed at both ends of the substrate. 14. The method of claim 13,
In the above manufacturing method,
Prior to supplying the substrate,
Further comprising the step of applying the hole to the substrate. 14. The method of claim 13,
The step of sequentially depositing
Further comprising controlling a current in a direction opposite to the magnetic material contained in each of the shield member and the shield member disposed above the substrate with a predetermined space therebetween.

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