KR101965278B1 - Photosensitive resin composition, photosensitive resin layer using the same and color filter - Google Patents

Abstract

(A) quantum dots; (B) a binder resin; (C) a photopolymerizable monomer; (D) a photopolymerization initiator; And (E) a solvent, wherein the solvent comprises an amphoteric compound having both a polar group and a non-polar group, a photosensitive resin film produced using the same, and a color filter comprising the photosensitive resin film.

Description

TECHNICAL FIELD [0001] The present invention relates to a photosensitive resin composition, a photosensitive resin film and a color filter using the same. BACKGROUND ART < RTI ID = 0.0 >

The present invention relates to a photosensitive resin composition, a photosensitive resin film produced using the same, and a color filter comprising the photosensitive resin film.

Generally, a color filter applied to a display forms a desired pattern through an exposure process using a photoresist composition using a photosensitive resist composition, and forms a color filter through a patterning process in which an unexposed portion is dissolved and removed through a development process. The material for the color filter is alkali-soluble and requires high sensitivity, adhesion to the substrate, chemical resistance, and heat resistance. It is usual to use a pigment or a dye as a color material.

However, since the pigments are excellent in heat resistance and chemical resistance, they are not well dispersed in a solvent, and thus have poor color characteristics such as brightness. In the case of dyes, color characteristics are excellent, but durability is poor and heat resistance and chemical resistance are not excellent .

Accordingly, there is a continuing development of a novel self-luminous type photosensitive resin composition and a color filter material to which the present invention can overcome the technical limitations of a photosensitive resin composition using a pigment or a dye as a color material.

One embodiment of the present invention is to provide a photosensitive resin composition capable of improving the dispersibility of quantum dots, having excellent pattern characteristics, and minimizing a decrease in the light conversion rate as the color filter process proceeds.

Another embodiment is to provide a photosensitive resin film produced using the photosensitive resin composition.

Another embodiment is to provide a color filter comprising the photosensitive resin film.

One embodiment includes (A) a quantum dot; (B) a binder resin; (C) a photopolymerizable monomer; (D) a photopolymerization initiator; And (E) a solvent, wherein the solvent comprises an amphoteric compound having both a polar group and a non-polar group.

The polar group may be represented by the following formulas (1-1), (1-2), or (1-3).

[Formula 1-1]

In Formula 1,

R ¹ is a substituted or unsubstituted C1 to C20 alkyl group.

[Formula 1-2]

[Formula 1-3]

The non-polar group may be a substituted or unsubstituted C1 to C20 alkyl group or a substituted or unsubstituted C3 to C20 cycloalkyl group.

The amphoteric compound may be represented by the following formula (2-1), (2-2), or (2-3).

[Formula 2-1]

In Formula 2-1,

R ² is a substituted or unsubstituted C1 to C20 alkyl group or a substituted or unsubstituted C3 to C20 cycloalkyl group,

[Formula 2-2]

In Formula 2-2,

R ³ and R ⁴ are each independently a substituted or unsubstituted C 1 to C 20 alkyl group,

[Formula 2-3]

In Formula 2-3,

R ⁵ and R ⁶ are each independently a substituted or unsubstituted C 1 to C 20 alkyl group.

The amphoteric compound may be pentyl acetate, hexyl acetate, decyl acetate, dodecyl acetate, cyclohexyl acetate, isoamyl acetate, diethyl ether, dibutyl ether or methyl isobutyl ketone.

The amphoteric compound may be pentyl acetate, hexyl acetate, decyl acetate, dodecyl acetate or cyclohexyl acetate.

The solvent may further comprise a compound having a lower boiling point than the amphoteric compound.

The amphoteric compound and the compound having a lower boiling point than the amphoteric compound may be contained in a weight ratio of 6: 4 to 9: 1.

The quantum dots may include a quantum dot, or a combination thereof having the maximum fluorescence wavelength (fluorescence λ _em) on the quantum dot, 580nm to 700nm with a maximum fluorescence wavelength (fluorescence λ _em) at 450nm to 580nm.

The photosensitive resin composition may further comprise (F) a thiol-based additive.

The thiol-based additive may be included in an amount of 1 wt% to 10 wt% based on the total amount of the photosensitive resin composition.

The photosensitive resin composition may further comprise (G) a diffusing agent.

The diffusing agent may comprise barium sulphate, calcium carbonate, titanium dioxide, zirconia or combinations thereof.

The diffusing agent may be included in an amount of 0.5 wt% to 10 wt% based on the total amount of the photosensitive resin composition.

The photosensitive resin composition preferably contains 1% by weight to 30% by weight of the quantum dot (A) relative to the total amount of the photosensitive resin composition; 1 to 20% by weight of the binder resin (B); 1 to 20% by weight of the (C) photopolymerizable monomer; 0.1 to 5% by weight of the photopolymerization initiator (D); And (E) the solvent balance.

The photosensitive resin composition may include malonic acid; 3-amino-1,2-propanediol; Silane coupling agents; Leveling agents; A fluorine-based surfactant, or a combination thereof.

Another embodiment provides a photosensitive resin film produced using the photosensitive resin composition.

Another embodiment provides a color filter comprising the photosensitive resin film.

Other aspects of the present invention are included in the following detailed description.

The quantum dot-containing photosensitive resin composition according to one embodiment includes a solvent capable of dissolving all of the quantum dots and other photosensitive resin composition components to improve the dispersibility of the quantum dots and to provide coating, prebaking, exposure, developing, - reduction in the light conversion rate caused by the progress of the color filter manufacturing process such as baking can be minimized, and the photosensitive resin film produced using the photosensitive resin composition according to one embodiment has excellent pattern characteristics.

Figure 1 shows quantum dots surrounded by various organic ligands.
FIG. 2 is a photograph of a quantum dot solution taken immediately after dissolving the quantum dot in cyclohexyl acetate and chloroform.
FIGS. 3 and 4 are photographs of a quantum dot-binder resin mixed solution obtained by dissolving the quantum dots in cyclohexyl acetate and chloroform, respectively, and then injecting the binder resin and taking the solution several minutes later.
Figs. 5 to 7 are photographs of the pattern of the photosensitive resin film prepared using the photosensitive resin composition according to Example 1, respectively. Fig.
Figs. 8 to 10 are photographs of the pattern of a photosensitive resin film produced using the photosensitive resin composition according to Comparative Example 1 independently of each other.

Hereinafter, embodiments of the present invention will be described in detail. However, it should be understood that the present invention is not limited thereto, and the present invention is only defined by the scope of the following claims.

Unless otherwise specified herein, " alkyl group " means a C1 to C20 alkyl group, " alkenyl group " means a C2 to C20 alkenyl group, " cycloalkenyl group " means a C3 to C20 cycloalkenyl group Quot; means a C3 to C20 heterocycloalkenyl group, " an aryl group " means a C6 to C20 aryl group, an " arylalkyl group " means a C6 to C20 arylalkyl group, Refers to a C 1 to C 20 alkylene group, "arylene group" refers to a C6 to C20 arylene group, "alkylarylene group" refers to a C6 to C20 alkylarylene group, "heteroarylene group" refers to a C3 to C20 hetero Quot; means an arylene group, and the " alkoxysilylene group " means a C1 to C20 alkoxysilylene group.

Unless otherwise specified herein, "substituted" means that at least one hydrogen atom is replaced by a halogen atom (F, Cl, Br, I), a hydroxy group, a C1 to C20 alkoxy group, a nitro group, a cyano group, An ester group, an ether group, a carboxyl group or a salt thereof, a sulfonic acid group or a salt thereof, a phosphoric acid or a salt thereof, a C1-C10 alkyl group, a C1- A C2 to C20 alkenyl group, a C2 to C20 alkynyl group, a C6 to C20 aryl group, a C3 to C20 cycloalkyl group, a C3 to C20 cycloalkenyl group, a C3 to C20 cycloalkynyl group, a C2 to C20 heterocycloalkyl group, a C2 to C20 heterocycloalkyl group, To C20 heterocycloalkenyl groups, C2 to C20 heterocycloalkynyl groups, C3 to C20 heteroaryl groups, or combinations thereof.

Also, unless otherwise specified herein, "hetero" means that at least one heteroatom of N, O, S, and P is included in the formula.

&Quot; (Meth) acrylic acid " refers to both " acrylic acid " and " methacrylic acid " "It means both are possible.

&Quot; Combination " as used herein, unless otherwise specified, means mixing or copolymerization.

Unless otherwise defined in the chemical formulas in this specification, when no chemical bond is drawn at the position where the chemical bond should be drawn, it means that the hydrogen atom is bonded at the above position.

In the present specification, the cadmium resin means a resin in which at least one functional group selected from the group consisting of the following formulas (3-1) to (3-11) is contained in the main backbone of the resin.

Also, unless otherwise specified herein, " * " means the same or different atom or moiety connected to the formula.

The photosensitive resin composition according to one embodiment comprises (A) a quantum dot; (B) a binder resin; (C) a photopolymerizable monomer; (D) a photopolymerization initiator; And (E) a solvent, wherein the solvent comprises amphoteric compounds having both a polar group and a non-polar group.

In general, the photosensitive resin composition is composed of a pigment or a dye, a photopolymerizable monomer, a binder resin, a photopolymerization initiator, a solvent, an additive, etc. However, in the photosensitive resin composition according to one embodiment, I will enter. Since the color filter manufactured using the photosensitive resin composition according to one embodiment emits self-luminescence, the color reproduction ratio is improved as compared with the color filter manufactured using the conventional photosensitive resin composition, and in particular, the side luminance is increased, There is an advantage to have.

The quantum dots are surrounded by an organic ligand having a hydrocarbon chain terminal group whose surface is nonpolar by the synthesis or post-treatment, and can be dispersed in a hydrophobic organic solvent owing to the ligand, The surface can be well passivated to maintain light stability and can be used in many applications. Commonly used ligands include oleic acid, stearic acid, myristic acid, trioctyl phosphine, trioctyl amine, and dodecane thiol. (See Fig. 1)

The well known quantum dots are hexane, cyclohexane, toluene, chloroform, etc. Especially, toluene which has a relatively high boiling point and maintains the quantum efficiency of quantum dots and is easy to store has been used. However, since the above solvents are classified as harmful substances or regulated substances, they are not suitable as a solvent for a color filter process in which a complicated continuous process is performed. In particular, highly volatile solvents such as hexane and chloroform are also classified as carcinogens.

On the other hand, chloroform is uniquely used as a solvent capable of simultaneously dissolving components other than the quantum dots and quantum dots (binder resin, photopolymerizable monomer, photopolymerization initiator, thiol additive, dewaxing and other additives) The stability can not be ensured and bubbles can be formed on the surface or inside of the pattern during pattern formation, so that it can not be a fundamental solution.

In addition, a dispersant (an organic single molecule or a polymeric binder having an amine group, a thiol group, a carboxyl acid group or the like) may be used for forcibly dispersing a quantum dot in a polar solvent used as a solvent of a conventional photosensitive resin composition, It is not possible to ensure the quantitative efficiency and quantum efficiency stability of the quantum dots due to the increase of the dispersant use amount for improving the dispersibility and ultimately the pattern characteristics of the quantum dot containing photosensitive resin composition are inhibited.

However, according to one embodiment, it is possible to melt quantum dot inorganic particles and organic constituents other than the quantum dots (binder resin, photopolymerizable monomer, photopolymerization initiator, thiol additive, scrape and other additives) The pattern stability, the patterning property, and the optical property (light conversion rate) of the quantum dot-containing photosensitive resin composition can be improved by using a solvent capable of stably maintaining the optical characteristics of the quantum dot-containing photosensitive resin composition, that is, an amphoteric solvent having both a polar group and a non- Can be effectively maintained.

Specifically, by using the amphoteric solvent in place of the conventional chloroform, problems such as gelation and precipitation of the quantum dot-binder resin mixed solution, which may occur during the production of the quantum dot-containing photosensitive resin composition, Improvement and void problem can be solved.

Each component will be described in detail below.

(E) Solvent

The polar group may be represented by the following formulas (1-1), (1-2), or (1-3).

[Formula 1-1]

In Formula 1,

R ¹ is a substituted or unsubstituted C1 to C20 alkyl group.

[Formula 1-2]

[Formula 1-3]

The non-polar group may be a substituted or unsubstituted C1 to C20 alkyl group or a substituted or unsubstituted C3 to C20 cycloalkyl group.

The amphoteric compound may be represented by the following formula (2-1), (2-2), or (2-3).

[Formula 2-1]

In Formula 2-1,

R ² is a substituted or unsubstituted C1 to C20 alkyl group or a substituted or unsubstituted C3 to C20 cycloalkyl group,

[Formula 2-2]

In Formula 2-2,

R ³ and R ⁴ are each independently a substituted or unsubstituted C 1 to C 20 alkyl group,

[Formula 2-3]

In Formula 2-3,

R ⁵ and R ⁶ are each independently a substituted or unsubstituted C 1 to C 20 alkyl group.

For example, the amphoteric compound may be pentyl acetate, hexyl acetate, decyl acetate, dodecyl acetate, cyclohexyl acetate, isoamyl acetate, diethyl ether, dibutyl ether or methyl isobutyl ketone, Hexyl acetate, decyl acetate, dodecyl acetate or cyclohexyl acetate, more particularly cyclohexyl acetate.

For example, the amphoteric compound may be represented by the formula 2-1, and the amphoteric compound represented by the formula 2-1 may have a high boiling point. For example, an amphoteric compound represented by Formula 2-1, such as pentyl acetate (boiling point: 148 ° C), hexyl acetate (boiling point: 169 ° C), decyl acetate (boiling point: 248 ° C), dodecyl acetate ) Or cyclohexyl acetate (boiling point: 172 占 폚) may have a boiling point of 148 占 폚 to 250 占 폚, such as a boiling point of 148 占 폚 to 180 占 폚. At this time, the solvent may further contain a compound having a boiling point lower than that of the amphoteric compound, for example, propylene glycol monomethyl ether acetate (boiling point: 145 ° C).

The amphoteric compound and the compound having a lower boiling point than the amphoteric compound may be contained in a weight ratio of 6: 4 to 9: 1. When a compound having a lower boiling point than the amphoteric compound and the amphoteric compound is contained in the same weight ratio or a compound having a lower boiling point than the amphoteric compound is contained in an amount larger than that of the amphoteric compound, the quantum dots are precipitated, The conversion rate may be lowered. In addition, when the ampholytic compound is contained in an excessive amount, for example, 9 times or more the content of the compound having a lower boiling point than the amphoteric compound, the hardness of the coating film due to excessive solvent residue after the coating and prebaking process ) May be lowered.

The solvent may be contained in an amount of 30% by weight to 80% by weight, for example, 30% by weight to 70% by weight, based on the total amount of the photosensitive resin composition. When the solvent is contained within the above range, the photosensitive resin composition has an appropriate viscosity, and thus the processability in the production of the photosensitive organic film is excellent.

(A) Qdot

The quantum dot can absorb light in a wavelength range of 360 nm to 780 nm, for example, a wavelength range of 400 nm to 780 nm, and emit fluorescence in a wavelength range of 450 nm to 700 nm. That is, the quantum dot may have a maximum fluorescence emission wavelength (fluorescence? _Em ) at 450 nm to 700 nm.

Specifically, the quantum dot has a maximum fluorescence wavelength (fluorescence λ _em) quantum dot has a (e.g. green quantum dots), the maximum fluorescence wavelength (fluorescence λ _em) quantum dots (e. G. The red quantum dots) with at 580nm to 700nm from 450nm to 580nm or And combinations of these.

The green quantum dot may have an average particle diameter of 5 nm to 10 nm, and the red quantum dot may have an average particle diameter of 7 nm to 15 nm.

The quantum dot may have a full width at half maximum (FWHM) of 20 nm to 100 nm, for example, 20 nm to 80 nm, for example, 40 nm to 60 nm. When the quantum dots have a half width of the above range, the color purity is high when used as a color filter material as the color purity is high.

The quantum dot may be an organic material or an inorganic material or a hybrid of an organic material and an inorganic material.

The quantum dot may comprise a core and a shell surrounding the core. The core and the shell may each independently comprise a core, a core / shell, a core / a first shell / a second shell, , Alloys, alloys / shells, and the like, but the present invention is not limited thereto.

For example, the core may include at least one material selected from the group consisting of CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, HgS, HgSe, HgTe, GaN, GaP, GaAs, InP, InAs and alloys thereof , But is not limited thereto. The shell surrounding the core may include at least one material selected from the group consisting of CdSe, ZnSe, ZnS, ZnTe, CdTe, PbS, TiO, SrSe, HgSe and alloys thereof.

The structure of the quantum dot is not particularly limited, but in the case of quantum dots of the core / shell structure, the size (average particle size) of the entire quantum dot including the shell may be 1 nm to 15 nm, for example, 5 nm to 10 nm.

In order to improve the stability and dispersibility of the quantum dots, it is possible to stabilize quantum dots by substituting organic materials on the surface of the shell. The organic materials include thiol compounds, amine compounds, phosphine oxide compounds, acryl compounds, Si Compounds, and the like, but the present invention is not limited thereto.

In recent years, interest in the environment has greatly increased worldwide, and regulations on toxic substances have been strengthened. Therefore, instead of a luminescent material having a cadmium core, a quantum yield is lowered, but an environmentally friendly non-cadmium luminous material For example, InP / ZnS core / shell type quantum dots, InP / ZnSe / ZnS core / first shell / second shell type quantum dots However, it is not necessary to use a non-cadmium-based light emitting material.

For the dispersion stability of the quantum dot, the photosensitive resin composition according to one embodiment may further include a dispersant. The dispersant helps the quantum dots to be uniformly dispersed in the photosensitive resin composition, and both nonionic, anionic and cationic dispersants can be used. Specific examples thereof include polyalkylene glycols or esters thereof, polyoxyalkylene, polyhydric alcohol ester alkylene oxide adducts, alcohol alkylene oxide adducts, sulfonic acid esters, sulfonic acid salts, carboxylic acid esters, carboxylic acid salts, alkylamide alkylene oxides Adducts, alkylamines, and the like, which may be used alone or in admixture of two or more. The dispersant may be used in an amount of 0.1% by weight to 100% by weight, for example, 10% by weight to 20% by weight, based on the solid content of the quantum dot.

The quantum dot may be included in an amount of 1% by weight to 30% by weight based on the total amount of the photosensitive resin composition according to one embodiment. When the quantum dots are included within the above ranges, it is possible to prevent the development of the light conversion characteristic inherent to the quantum dots and the decrease in the light conversion efficiency.

(B) binder resin

The binder resin may include an acrylic binder resin, a cadmium binder resin, or a combination thereof.

The acrylic binder resin is a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable with the first ethylenically unsaturated monomer, and may be a resin containing at least one acrylic repeating unit.

The first ethylenically unsaturated monomer is an ethylenically unsaturated monomer containing at least one carboxyl group, and specific examples thereof include acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, or a combination thereof.

The first ethylenically unsaturated monomer may be included in an amount of 5% by weight to 50% by weight, for example, 10% by weight to 40% by weight based on the total amount of the acrylic binder resin.

The second ethylenically unsaturated monomer may be an aromatic vinyl compound such as styrene,? -Methylstyrene, vinyltoluene, or vinylbenzyl methyl ether; (Meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, benzyl (meth) acrylate, Unsaturated carboxylic acid ester compounds such as cyclohexyl (meth) acrylate and phenyl (meth) acrylate; Unsaturated carboxylic acid aminoalkyl ester compounds such as 2-aminoethyl (meth) acrylate and 2-dimethylaminoethyl (meth) acrylate; Carboxylic acid vinyl ester compounds such as vinyl acetate and vinyl benzoate; Unsaturated carboxylic acid glycidyl ester compounds such as glycidyl (meth) acrylate; A vinyl cyanide compound such as (meth) acrylonitrile; Unsaturated amide compounds such as (meth) acrylamide; These may be used singly or in combination of two or more.

Specific examples of the acrylic binder resin include polybenzyl methacrylate, (meth) acrylic acid / benzyl methacrylate copolymer, (meth) acrylic acid / benzyl methacrylate / styrene copolymer, (meth) acrylic acid / benzyl methacrylate / 2-hydroxyethyl methacrylate copolymer, and (meth) acrylic acid / benzyl methacrylate / styrene / 2-hydroxyethyl methacrylate copolymer, but not limited thereto, Or more may be used in combination.

The weight average molecular weight of the acrylic binder resin may be from 5,000 g / mol to 15,000 g / mol. 　 When the weight average molecular weight of the acrylic binder resin is within the above range, it has good adhesion with the substrate, good physical and chemical properties, and good viscosity.

The acid value of the acrylic binder resin may be 80 mgKOH / g to 130 mgKOH / g. When the acid value of the acrylic binder resin is within the above range, the resolution of the pixel pattern is excellent.

The cadmium binder resin may include a repeating unit represented by the following general formula (3).

(3)

In Formula 3,

R ¹¹ and R ¹² are each independently a hydrogen atom or a substituted or unsubstituted (meth) acryloyloxy group,

R ¹³ and R ¹⁴ are each independently a hydrogen atom, a halogen atom or a substituted or unsubstituted C1 to C20 alkyl group,

Z ¹ is a single bond, O, CO, SO ₂ , CR ¹⁷ R ¹⁸ , SiR ¹⁹ R ²⁰ (wherein R ¹⁷ to R ²⁰ are each independently a hydrogen atom or a substituted or unsubstituted C1 to C20 alkyl group) Is any one of the linking groups represented by formulas (3-1) to (3-11)

[Formula 3-1]

[Formula 3-2]

[Formula 3-3]

[Chemical Formula 3-4]

[Formula 3-5]

(In the above Formula 3-5,

R ^a is a hydrogen atom, an ethyl group, C ₂ H ₄ Cl, C ₂ H ₄ OH, CH ₂ CH = CH ₂ or a phenyl group.

[Chemical Formula 3-6]

[Chemical Formula 3-7]

[Chemical Formula 3-8]

[Chemical Formula 3-9]

[Chemical Formula 3-10]

[Formula 3-11]

Z ² is an acid anhydride residue,

t1 and t2 are each independently an integer of 0 to 4;

The weight average molecular weight of the cationic binder resin may be from 500 g / mol to 50,000 g / mol, such as from 1,000 g / mol to 30,000 g / mol. When the weight average molecular weight of the cationic binder resin is within the above range, pattern formation is good without residue during the production of the photosensitive organic film, no loss of film thickness during development, and good patterns can be obtained.

The cadmium binder resin may include a functional group represented by the following formula (4) in at least one of the two terminals.

[Chemical Formula 4]

In Formula 4,

Z ³ may be represented by the following formulas (4-1) to (4-7).

[Formula 4-1]

(Wherein R ^b and R ^c are each independently a hydrogen atom, a substituted or unsubstituted C1 to C20 alkyl group, an ester group or an ether group).

[Formula 4-2]

[Formula 4-3]

[Formula 4-4]

[Formula 4-5]

Wherein R ^d is O, S, NH, a substituted or unsubstituted C1 to C20 alkylene group, a C1 to C20 alkylamine group, or a C2 to C20 alkenylamine group.

[Formula 4-6]

[Formula 4-7]

Examples of the cationic binder resin include fluorene-containing compounds such as 9,9-bis (4-oxiranylmethoxyphenyl) fluorene; Benzene tetracarboxylic dianhydride, benzene tetracarboxylic acid dianhydride, naphthalene tetracarboxylic dianhydride, biphenyl tetracarboxylic dianhydride, benzophenone tetracarboxylic dianhydride, pyromellitic dianhydride, cyclobutanetetracarboxylic dianhydride, Anhydride compounds such as lyrenetetracarboxylic acid dianhydride, tetrahydrofuran tetracarboxylic acid dianhydride, and tetrahydrophthalic anhydride; Glycol compounds such as ethylene glycol, propylene glycol, and polyethylene glycol; Alcohol compounds such as methanol, ethanol, propanol, n-butanol, cyclohexanol and benzyl alcohol; Propylene glycol methyl ethyl acetate, and N-methyl pyrrolidone; Phosphorus compounds such as triphenylphosphine; And an amine or an ammonium salt compound such as tetramethylammonium chloride, tetraethylammonium bromide, benzyldiethylamine, triethylamine, tributylamine, benzyltriethylammonium chloride, or the like.

When the binder resin is a cadmium-based binder resin, the photosensitive resin composition containing the binder resin is excellent in developability, is excellent in sensitivity upon photo-curing, and is excellent in fine pattern formation.

The binder resin may be contained in an amount of 1 wt% to 20 wt%, for example, 3 wt% to 15 wt% based on the total amount of the photosensitive resin composition. When the binder resin is contained within the above range, excellent sensitivity, residual film ratio, developability, resolution and straightness of the pattern can be obtained.

(C) Photopolymerization  Monomer

The photopolymerizable monomer may be a monofunctional or polyfunctional ester of (meth) acrylic acid having at least one ethylenically unsaturated double bond.

Since the photopolymerizable monomer has the ethylenically unsaturated double bond, sufficient polymerization is caused during exposure in the pattern formation step, whereby a pattern having excellent heat resistance, light resistance and chemical resistance can be formed.

Specific examples of the photopolymerizable monomer include ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, neopentyl glycol Acrylate such as di (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, bisphenol A di (meth) acrylate, pentaerythritol di (Meth) acrylate, pentaerythritol tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, pentaerythritol hexa (meth) acrylate, dipentaerythritol di Acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, bisphenol A epoxy (meth) acrylate, ethylene glycol There may be mentioned furnace methyl ether (meth) acrylate, trimethylolpropane tri (meth) acrylate, tris (meth) acryloyloxyethyl phosphate, novolak epoxy (meth) acrylate, and the like.

A commercially available product of the photopolymerizable monomer is exemplified as follows. The (meth) acrylic acid is one example of a polyfunctional ester, such as doah Gosei Kagaku Kogyo's (primary)社Aronix M-101 ^®, the same M-111 ^®, the same M-114 ^®; KAYARAD TC-110S ^® and TC-120S ^{® from} Nihon Kayaku Co., Ltd.; Osaka yukki the like Kagaku Kogyo (main)社of ^{V-158 ®, V-2311} ®. The (meth) transfer function of an example esters of acrylic acid are, doah Gosei Kagaku Kogyo (Note)社of Aronix M-210 ^®, copper or the like M-240 ^®, the same M-6200 ^®; KAYARAD HDDA ^® , HX-220 ^® and R-604 ^{® from} Nihon Kayaku Corporation; Osaka yukki the like Kagaku Kogyo Co., Ltd. of ^{社V-260 ®, V-} 312 ®, V-335 HP ®. Examples of the tri-functional ester of (meth) acrylic acid, doah Gosei Kagaku Kogyo (Note)社of Aronix M-309 ^®, the same M-400 ^®, the same M-405 ^®, the same M-450 ^®, Dong M -7100 ^® , copper M-8030 ^® , copper M-8060 ^® and the like; Nippon Kayaku (Note)社of KAYARAD TMPTA ^®, copper DPCA-20 ^{®, ®} copper -30, -60 ^® copper, copper ^® -120 and the like; Osaka yukki Kayaku high (primary)社of V-295 ^®, copper ^® -300, -360 ^® copper, copper -GPT ^®, copper -3PA ^®, and the like copper -400 ^®. These products may be used alone or in combination of two or more.

The photopolymerizable monomer may be treated with an acid anhydride to give better developing properties.

The photopolymerizable monomer may be contained in an amount of 1 wt% to 20 wt%, for example, 1 wt% to 15 wt% based on the total amount of the photosensitive resin composition. When the photopolymerizable monomer is contained within the above range, the pattern is formed with sufficient curing during exposure in the step of pattern formation, so that the reliability is excellent, and the heat resistance, light resistance, chemical resistance, resolution and adhesion of the pattern are also excellent.

(D) Light curing Initiator

The photopolymerization initiator is an initiator generally used in a photosensitive resin composition, for example, an acetophenone compound, a benzophenone compound, a thioxanone compound, a benzoin compound, a triazine compound, a oxime compound, Etc. may be used.

Examples of the acetophenone-based compound include 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylpropiophenone, pt-butyltrichloroacetophenone, dichloro-4-phenoxyacetophenone, 2-methyl-1- (4- (methylthio) phenyl) -2-morpholinopropanone, p-butyldichloroacetophenone, 1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one.

Examples of the benzophenone compound include benzophenone, benzoyl benzoic acid, methyl benzoyl benzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4,4'-bis (dimethylamino) benzophenone, '-Bis (diethylamino) benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, and 3,3'-dimethyl-2-methoxybenzophenone.

Examples of the thioxanthone compound include thioxanthone, 2-methylthioxanthone, isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, 2- Chlorothioxanthone and the like.

Examples of the benzoin compound include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, and benzyl dimethyl ketal.

Examples of the triazine-based compound include 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis (trichloromethyl) -Dimethoxystyryl) -4,6-bis (trichloromethyl) -s-triazine, 2- (4'-methoxynaphthyl) -4,6-bis (trichloromethyl) (Trichloromethyl) -s-triazine, 2- (p-tolyl) -4,6-bis (trichloromethyl) (Trichloromethyl) -6-styryl-s-triazine, 2- (naphtho-1-yl) - 4,6-bis (trichloromethyl) -s-triazine, 2- (4-methoxynaphthol-1-yl) -Bis (trichloromethyl) -6- (4-methoxystyryl) -s-triazine, and the like. .

Examples of the oxime compounds include O-acyloxime compounds, 2- (O-benzoyloxime) -1- [4- (phenylthio) phenyl] -1,2-octanedione, 1- -1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl] ethanone, O-ethoxycarbonyl-a-oxyamino-1-phenylpropan- Can be used. Specific examples of the O-acyloxime-based compound include 1,2-octanedione, 2-dimethylamino-2- (4-methylbenzyl) -1- (4-morpholin- 2-oxime-O-benzoate, 1- (4-phenylsulfanylphenyl) -octane-1,2-dione -1-one oxime-O-acetate and 1- (4-phenylsulfanylphenyl) -butan-1-one oxime- O-acetate, and the like.

Examples of the aminoketone-based compound include 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone -1).

The photopolymerization initiator may be a carbazole compound, a diketone compound, a sulfonium borate compound, a diazo compound, an imidazole compound, or a nonimidazole compound in addition to the above compounds.

The photopolymerization initiator may be used in combination with a photosensitizer that generates a chemical reaction by absorbing light to be in an excited state and transferring its energy.

Examples of the photosensitizer include tetraethylene glycol bis-3-mercaptopropionate, pentaerythritol tetrakis-3-mercaptopropionate, dipentaerythritol tetrakis-3-mercaptopropionate and the like .

The photopolymerization initiator may be contained in an amount of 0.1 wt% to 5 wt%, for example, 0.3 wt% to 3 wt% with respect to the total amount of the photosensitive resin composition. When the photopolymerization initiator is contained within the above range, the photopolymerization initiator sufficiently undergoes curing during exposure in the pattern formation step, thereby obtaining excellent reliability, and is excellent in heat resistance, light resistance, chemical resistance, resolution and adhesion of the pattern, .

(F) Thiol system  additive

In order to improve stability and dispersibility of the quantum dot, the photosensitive resin composition according to one embodiment may further include a thiol-based additive.

The thiol-based additive is substituted on the surface of the shell of the quantum dots to improve the dispersion stability of the quantum dots with respect to the solvent and stabilize the quantum dots.

The thiol-based additive may have 2 to 10, for example, 2 to 4 thiol (-SH) at the terminal thereof depending on its structure.

For example, the thiol-based additive may include at least two functional groups represented by the following formula (5) at the terminal.

[Chemical Formula 5]

In Formula 5,

L ³ and L ⁴ each independently represents a single bond, a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C3 to C20 cycloalkylene group, a substituted or unsubstituted C6 to C20 arylene group, Lt; RTI ID = 0.0 > C2-C20heteroarylene < / RTI >

For example, the thiol-based additive may be represented by the following formula (6).

[Chemical Formula 6]

In Formula 6,

L ³ and L ⁴ each independently represents a single bond, a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C3 to C20 cycloalkylene group, a substituted or unsubstituted C6 to C20 arylene group, Lt; / RTI > is a C2 to C20 heteroarylene group,

n5 and n6 are each independently an integer of 0 or 1;

For example, in the above formulas (5) and (6), L ³ and L ⁴ may each independently be a single bond or a substituted or unsubstituted C1 to C20 alkylene group.

Specific examples of the thiol-based additive include pentaerythritol tetrakis (3-mercaptopropionate) represented by the following formula (7a), trimethylolpropane tris (3-mercaptopropionate) represented by the following formula Mercaptopropionate), pentaerythritol tetrakis (mercaptoacetate) represented by the following formula (7c), trimethylolpropane tris (mercaptoacetate) represented by the following formula (7c), trimethylolpropane tris (2-mercaptoacetate) represented by the following formula (7e), Glycol di-3-mercaptopropionate represented by the following formula (7e), and combinations thereof. One can be said.

[Formula 7a]

[Formula 7b]

[Formula 7c]

[Formula 7d]

[Formula 7e]

The thiol-based additive may be included in an amount of 1 wt% to 10 wt%, for example, 1 wt% to 5 wt% based on the total amount of the photosensitive resin composition. If the amount of the thiol-based additive is less than 1% by weight, it is difficult to maintain the stability of each quantum dot in each process. If the amount of the thiol-based additive is more than 10% by weight, patternability of the photosensitive resin composition may be deteriorated, .

(G) Diffuser  (or Diffuser  Dispersion)

The photosensitive resin composition according to one embodiment may further include a diffusing agent. For example, the photosensitive resin composition according to one embodiment may further include a dispersant dispersion in which the dispersant is dispersed. As the dispersion liquid in which the diffusion agent is dispersed, any organic solvent such as PGMEA can be used without any particular limitation.

For example, the diffusing material may include barium sulfate (BaSO _4), calcium carbonate (CaCO _3), titanium dioxide (TiO _2), zirconia (ZrO _2), or a combination thereof.

The diffusing agent reflects light that is not absorbed by the light conversion material described above, and allows the light conversion material to absorb the reflected light again. That is, the diffusing agent may increase the amount of light absorbed by the photo-conversion material, thereby increasing the light conversion rate of the quantum dot in the photosensitive resin composition. That is, it is possible to prevent a decrease in the blue light conversion rate as the color filter process proceeds.

The diffusing agent may have an average particle diameter (D ₅₀ ) of 150 nm to 250 nm, and more specifically, 180 nm to 230 nm. When the average particle diameter of the diffusing agent is within the above range, it is possible to have a better light diffusing effect and increase the light conversion efficiency.

The dispersing agent, specifically, the dispersant solid content may be included in an amount of 0.5% by weight to 10% by weight, for example, 1% by weight to 8% by weight based on the total amount of the photosensitive resin composition. When the amount of the dispersing agent is less than 0.5% by weight based on the total amount of the photosensitive resin composition, it is difficult to expect an effect of preventing a decrease in the photoconversion rate upon use of the dispersing agent. When the amount exceeds 10% by weight, The pattern characteristic of the film is deteriorated, and as a result, the light conversion rate is lowered. That is, the dispersion liquid may include 2.5 wt% to 50 wt%, for example, 5 wt% to 40 wt% of the total amount of the photosensitive resin composition.

(H) Other additives

The photosensitive resin composition according to one embodiment includes malonic acid; 3-amino-1,2-propanediol; Silane coupling agents; Leveling agents; A fluorine-based surfactant, or a combination thereof.

For example, the photosensitive resin composition may further include a silane-based coupling agent having a reactive substituent such as a vinyl group, a carboxyl group, a methacryloxy group, an isocyanate group or an epoxy group in order to improve adhesion with a substrate or the like.

Examples of the silane-based coupling agent include trimethoxysilylbenzoic acid,? -Methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane,? -Isocyanate propyltriethoxysilane,? -Glycine (3,4-epoxycyclohexyl) ethyltrimethoxysilane, etc. These may be used singly or in combination of two or more.

The silane coupling agent may be included in an amount of 0.01 to 10 parts by weight based on 100 parts by weight of the photosensitive resin composition. When the silane coupling agent is contained within the above range, the adhesion and storage stability are excellent.

The above-mentioned photosensitive resin composition may further contain a surfactant such as a fluorine-based surfactant for the purpose of improving coatability and preventing defect formation, if necessary.

The fluorine is a surfactant, the ^{BM Chemie社BM-1000 ®,} BM-1100 ® , and the like; Mechacup F 142D ^® , copper F 172 ^® , copper F 173 ^® , copper F 183 ^® and the like manufactured by Dainippon Ink & Chemicals Incorporated; Sumitomo M. (Note)社Pro rod FC-135 ^®, the same FC-170C ^®, copper FC-430 ^®, the same FC-431 ^®, and the like; Asahi Grass Co., Saffron S-112 ^® of社, such S-113 ^®, the same S-131 ^®, the same S-141 ^®, the same S-145 ^®, and the like; Toray silicone (Note)社SH-28PA ^{®, ®} -190 copper, copper ^{-193 ®, SZ-6032 ®,} SF-8428 ® , and the like; Fluorinated surfactants commercially available under the names F-482, F-484, F-478 and F-554 of DIC Co., Ltd. can be used.

The fluorine-based surfactant may be used in an amount of 0.001 part by weight to 5 parts by weight based on 100 parts by weight of the photosensitive resin composition. When the fluorosurfactant is contained within the above range, coating uniformity is ensured, no staining occurs, and wettability to the glass substrate is excellent.

In addition, a certain amount of other additives such as an antioxidant, a stabilizer and the like may be further added to the above photosensitive resin composition within a range that does not impair the physical properties.

Another embodiment provides a photosensitive resin film produced using the above-described photosensitive resin composition.

Another embodiment provides a color filter comprising the above-described photosensitive resin film. A method of manufacturing the color filter is as follows.

(1) Coating and Film Formation Step

The above-mentioned photosensitive resin composition is applied onto a predetermined pretreated substrate by a method such as spin or slit coat method, roll coating method, screen printing method, applicator method or the like to a desired thickness, for example, 9 to 10 탆 After coating, the solvent is removed by heating at a temperature of about 100 캜 for 1 minute to 10 minutes to form a coating film.

(2) Exposure step

In order to form a pattern necessary for the obtained coating film, a mask of a predetermined type is interposed therebetween and then an active line of 200 to 500 nm is irradiated. As the light source used for the irradiation, a low pressure mercury lamp, a high pressure mercury lamp, an ultra high pressure mercury lamp, a metal halide lamp, an argon gas laser, and the like can be used.

The exposure dose varies depending on the kind of each component of the photosensitive resin composition, the blending amount, and the dried film thickness. For example, when a high pressure mercury lamp is used, the exposure dose is 500 mJ / cm ² (By a 365 nm sensor).

(3) Development step

Following the above exposure step, an unnecessary portion is dissolved and removed by using an alkaline aqueous solution as a developing solution, so that only the exposed portion is left to form an image pattern.

(4) Post-treatment step

The image pattern obtained by the above-described development can be cured by heating again or by active ray irradiation or the like in order to obtain a pattern excellent in terms of heat resistance, light resistance, adhesion, crack resistance, chemical resistance, high strength and storage stability.

By using the above-described photosensitive resin composition, it is possible to minimize a decrease in the light conversion rate due to the application and coating film formation step, the exposure step, the development step, the post-treatment step, and the like.

Hereinafter, preferred embodiments of the present invention will be described. However, the following examples are only a preferred embodiment of the present invention, and the present invention is not limited by the following examples.

(Preparation of photosensitive resin composition)

Example  1 to Example  10 and Comparative Example  One

The photosensitive resin composition according to each of Examples 1 to 10 and Comparative Example 1 was prepared with the compositions shown in the following Table 1 by using the following components.

(1) A photopolymerization initiator is dissolved in an amphoteric solvent. Add a photopolymerizable monomer, a binder resin, a thiol-based additive, and a fluorine-based surfactant to dissolve them sufficiently. Thereafter, a diffusing agent (dispersant dispersion) is added and stirred until uniformly dispersed.

(2) The quantum dot powder and dispersant are dissolved in an amphoteric solvent and then mixed with a binder resin to form a quantum dot-binder; To prepare a mixed solution.

(The content of the dispersant is 15 wt% based on the solid content of the quantum dot)

(3) The solution of the above-mentioned (1) and the solution of the quantum dot-binder resin mixture of (2) were mixed thoroughly for 30 minutes and then filtered three times to remove impurities to prepare a photosensitive resin composition.

(A) Qdot

InP / ZnSe / ZnS quantum dots (fluorescence λ _em = 530 nm, FWHM = 40 nm to 60 nm, Green QD, Hansol Chemical Co.)

(B) binder resin

SM-400H (SMS社; M w = 7,000 g / mol)

(The weight average molecular weight of the binder resin was measured by gel permeation chromatography (GPC)).

(C) Photopolymerization  Monomer

Dipentaerythritol hexaacrylate (DPHA, Nippon Kayaku)

(D) Light curing Initiator

Oxime initiator (PBG-304, Tronyl)

(E) Solvent

(E-1) cyclohexyl acetate (amphoteric solvent)

(E-2) pentyl acetate (amphoteric solvent)

(E-3) hexyl acetate (amphoteric solvent)

(E-4) Dodecyl acetate (amphoteric solvent)

(E-5) Dibutyl ether (amphoteric solvent)

(E-6) methyl isobutyl ketone (amphoteric solvent)

(E-7) Chloroform

(E-8) Propylene glycol monomethyl ether acetate (PGMEA)

(F) Thiol system  additive

Glycol di-3-mercaptopropionate ^{(THIOCURE ® GDMP, BRUNO BOCK社} )

(G) Diffuser  Dispersion

Titanium dioxide dispersion (TiO ₂ solid content 20 wt% in PGMEA, average particle diameter: 200 nm, Aldrich)

(H) Other additives

Fluorine-based surfactant (F-554, DIC)

(Unit: wt%) Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 Example 9 Example 10 Comparative Example 1 (A) Quantum dot 18 18 18 18 18 18 18 18 18 18 18 (B) binder resin 3 3 3 3 3 3 3 3 3 3 3 (C) a photopolymerizable monomer 2 2 2 2 2 2 2 2 2 2 2 (D) a photopolymerization initiator 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 (E) Solvent (E-1) 53 - - - - - 32 47 27 48 - (E-2) - 53 - - - - - - - - - (E-3) - - 53 - - - - - - - - (E-4) - - - 53 - - - - - - - (E-5) - - - - 53 - - - - - - (E-6) - - - - - 53 - - - - - (E-7) - - - - - - - - - - 53 (E-8) - - - - - - 21 6 26 5 - (F) Thiol-based additives 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 (G) Diffusing agent dispersion 22 22 22 22 22 22 22 22 22 22 22 (H) Other additives 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 Total 100 100 100 100 100 100 100 100 100 100 100

Rating 1: Qdot - Evaluation of dispersion stability of binder resin mixture

Manufacturing example  One

The InP / ZnSe / ZnS quantum dots are dissolved in a cyclohexyl acetate solvent. The above-mentioned acrylic binder resin (SM-400H) was added and stirred for several minutes to prepare a quantum dot-binder resin mixed solution.

Manufacturing example  2

A quantum dot-binder resin mixture was prepared in the same manner as in Production Example 1, except that a chloroform solvent was used in place of the cyclohexyl acetate solvent.

Evaluation results

2, the quantum dot solution (Preparation Example 1; right side of FIG. 2) added to the cyclohexyl acetate solvent is more stable than the quantum dot solution (Production Example 2; left in FIG. 2) added to the chloroform solvent It can be confirmed that they are dispersed in the solvent. 3 and 4, the quantum dot-binder resin mixture solution (the right side of FIGS. 3 and 4) prepared by adding the acrylic binder resin to the quantum dot solution added to the cyclohexyl acetate solvent does not cause a heat generation phenomenon, The quantum dot-binder resin mixture (left in FIGS. 3 and 4) prepared by adding the acrylic binder resin to the quantum dot solution added to the chloroform solvent can be confirmed to be gelled with a sudden exothermic phenomenon. From this, it can be seen that the quantum dot-binder resin mixture solution (the right side of FIGS. 3 and 4) prepared by adding the acrylic binder resin to the quantum dot solution added to the cyclohexyl acetate solvent can be mixed well with the remaining constituents constituting the photosensitive resin composition However, it is expected that the quantum dot-binder resin mixture solution (left side in FIG. 3 and FIG. 4) prepared by adding the acrylic binder resin to the quantum dot solution added to the chloroform solvent will not be well mixed with the remaining components constituting the photosensitive resin composition .

Evaluation 2: Evaluation of pattern surface and section

Each of the photosensitive resin compositions prepared in Example 1 and Comparative Example 1 was coated with a thin film having a thickness of 10 탆 on a glass substrate using a spin coater (Mikasa, Opticoat MS-A150, 150 rpm) , The solvent was evaporated in a non-contact manner at 100 ° C for 1 minute, and then annealed by contact-type for 1 minute to complete the monolayer.

A monomolecular film was exposed using a negative type photomask under conditions of 50 mJ exposure and 250 m exposure gap.

The exposed monolayer was developed for a period of time using a KOH aqueous developer (diluted 100 to 143 times DI water with the stock solution) and an auto-spinning nozzle spray type developing machine.

The developed monolayer was left in an oven at 180 캜 for 30 minutes and post baked to prepare a specimen.

Evaluation results

The pattern surface state and cross-section of the test piece prepared using the photosensitive resin composition according to Example 1 were analyzed through an optical microscope and an electron microscope, and the results are shown in Figs. 5 to 7 (Fig. 5) From Fig. 5 to Fig. 7, when cyclohexyl acetate is used as the solvent, the pattern surface film quality is excellent, and the appearance of the cross-sectional image It can be confirmed that the pore is minimized.

On the other hand, the surface state and cross section of the pattern of the specimen produced using the photosensitive resin composition according to Comparative Example 1 were analyzed, and the results are shown in Figs. 8 to 10. (Fig. 8 is a pattern surface optical photograph, From FIG. 8 to FIG. 10, it can be seen from FIG. 8 to FIG. 10 that when chloroform is used as the solvent, the surface roughness of the optical image is increased and the surface roughness of the optical photographic image is increased, It can be seen that the pore appears as a whole, and its size is also turned on in the order of several micrometers. From this, it can be confirmed that the increase of roughness and the pore-clustering phenomenon are caused by using chloroform as a solvent.

Evaluation 3: Blue Photoconversion  Maintenance rate evaluation

Each of the photosensitive resin compositions prepared in Examples 1 to 10 and Comparative Example 1 was coated on a glass substrate with a thickness of 10 탆 using a spin coater (Mikasa, Opticoat MS-A150, 150 rpm) contact-type solvent for 1 minute at 100 ° C using a hot-plate, and then annealed by contact-type for 1 minute to complete the membrane.

A monomolecular film was exposed using a negative type photomask under conditions of 50 mJ exposure and 250 m exposure gap.

The exposed monolayer was left in an oven at 180 ° C for 30 minutes to perform first post baking and secondary post baking was performed at 230 ° C to simulate an organic planarization process (overcoat subsequent process). After this, the blue light conversion of the coating film was measured, and the degree of light conversion after the second post-baking was evaluated. The results are shown in Table 2 below.

Blue light conversion retention (%) Example 1 58 Example 2 57 Example 3 57 Example 4 57 Example 5 57 Example 6 56 Example 7 56 Example 8 57 Example 9 55 Example 10 55 Comparative Example 1 53

As shown in Table 2, the photosensitive resin compositions according to Examples 1 to 10 had a lower decrease in blue light conversion rate as the color filter process progressed, can confirm. From this, it can be seen that when an amphoteric solvent is used, the lowering of the blue light conversion ratio by the color filter process is prevented, and the light retention ratio can be effectively increased.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the following claims. As will be understood by those skilled in the art. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

Claims (17)

(A) quantum dots;
(B) a binder resin;
(C) a photopolymerizable monomer;
(D) a photopolymerization initiator; And
(E) Solvent
Lt; / RTI >
Wherein the solvent comprises an amphoteric compound having both a polar group and a nonpolar group.
The method according to claim 1,
Wherein the polar group is represented by the following formulas 1-1, 1-2 or 1-3:
[Formula 1-1]

In Formula 1,
R ¹ is a substituted or unsubstituted C1 to C20 alkyl group.
[Formula 1-2]

[Formula 1-3]

The method according to claim 1,
Wherein the non-polar group is a substituted or unsubstituted C1 to C20 alkyl group or a substituted or unsubstituted C3 to C20 cycloalkyl group.
The method according to claim 1,
Wherein the amphoteric compound is represented by the following Chemical Formula 2-1, Chemical Formula 2-2 or Chemical Formula 2-3:
[Formula 2-1]

In Formula 2-1,
R ² is a substituted or unsubstituted C1 to C20 alkyl group or a substituted or unsubstituted C3 to C20 cycloalkyl group,
[Formula 2-2]

In Formula 2-2,
R ³ and R ⁴ are each independently a substituted or unsubstituted C 1 to C 20 alkyl group,
[Formula 2-3]

In Formula 2-3,
R ⁵ and R ⁶ are each independently a substituted or unsubstituted C 1 to C 20 alkyl group.
5. The method of claim 4,
Wherein the amphoteric compound is pentyl acetate, hexyl acetate, decyl acetate, dodecyl acetate, cyclohexyl acetate, isoamyl acetate, diethyl ether, dibutyl ether or methyl isobutyl ketone.
The method according to claim 1,
Wherein the solvent further comprises a compound having a lower boiling point than the amphoteric compound.
The method according to claim 6,
Wherein the amphoteric compound and the compound having a lower boiling point than the amphoteric compound are contained in a weight ratio of 6: 4 to 9: 1.
The method according to claim 1,
The quantum dots are 450nm to 580nm at the maximum fluorescence wavelength (fluorescence λ _em) having a quantum dot, the quantum dot from 580nm to 700nm with a maximum fluorescence wavelength (fluorescence λ _em) or a photosensitive resin composition comprising a combination of the two.
The method according to claim 1,
The photosensitive resin composition further comprises (F) a thiol-based additive.
10. The method of claim 9,
Wherein the thiol-based additive is contained in an amount of 1% by weight to 10% by weight based on the total amount of the photosensitive resin composition.
The method according to claim 1,
The photosensitive resin composition further comprises (G) a diffusing agent.
12. The method of claim 11,
Wherein the diffusing agent comprises barium sulfate, calcium carbonate, titanium dioxide, zirconia or a combination thereof.
12. The method of claim 11,
Wherein the diffusing agent is contained in an amount of 0.5% by weight to 10% by weight based on the total amount of the photosensitive resin composition.
The method according to claim 1,
The above-mentioned photosensitive resin composition is characterized in that the total amount of the photosensitive resin composition
1 to 30% by weight of the quantum dot (A);
1 to 20% by weight of the binder resin (B);
1 to 20% by weight of the (C) photopolymerizable monomer;
0.1 to 5% by weight of the photopolymerization initiator (D); And
The amount of the solvent (E)
.
The method according to claim 1,
The photosensitive resin composition may include malonic acid; 3-amino-1,2-propanediol; Silane coupling agents; Leveling agents; A fluorine-based surfactant, or a combination thereof.
A photosensitive resin film produced by using the photosensitive resin composition of any one of claims 1 to 15.
A color filter comprising the photosensitive resin film of claim 16.

Images