KR101962194B1 - 유기전자장치 봉지재용 접착필름 및 이를 포함하는 유기전자장치용 봉지재 - Google Patents
유기전자장치 봉지재용 접착필름 및 이를 포함하는 유기전자장치용 봉지재 Download PDFInfo
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- KR101962194B1 KR101962194B1 KR1020170106046A KR20170106046A KR101962194B1 KR 101962194 B1 KR101962194 B1 KR 101962194B1 KR 1020170106046 A KR1020170106046 A KR 1020170106046A KR 20170106046 A KR20170106046 A KR 20170106046A KR 101962194 B1 KR101962194 B1 KR 101962194B1
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- C—CHEMISTRY; METALLURGY
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C—CHEMISTRY; METALLURGY
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H01L51/5246—
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- C09J2201/36—
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- C09J2201/622—
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Inorganic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020170106046A KR101962194B1 (ko) | 2017-08-22 | 2017-08-22 | 유기전자장치 봉지재용 접착필름 및 이를 포함하는 유기전자장치용 봉지재 |
| CN201810955205.3A CN109423220B (zh) | 2017-08-22 | 2018-08-21 | 有机电子设备封装材料用粘结膜及包括其的有机电子设备用封装材料 |
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| Application Number | Priority Date | Filing Date | Title |
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| KR1020170106046A KR101962194B1 (ko) | 2017-08-22 | 2017-08-22 | 유기전자장치 봉지재용 접착필름 및 이를 포함하는 유기전자장치용 봉지재 |
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| CN109837028B (zh) * | 2019-02-21 | 2021-11-26 | 宁波激智科技股份有限公司 | 一种透明漆面保护膜及其应用 |
| CN114670517B (zh) * | 2020-12-24 | 2024-01-26 | 利诺士尖端材料有限公司 | 有机电子装置用封装材料及包含其的有机电子装置 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR101693797B1 (ko) | 2015-12-29 | 2017-01-09 | 주식회사 이녹스 | 유기전자장치 봉지재용 점착필름 및 이를 포함하는 봉지재 |
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| KR20060030718A (ko) | 2004-10-06 | 2006-04-11 | 에스케이씨 주식회사 | 유기발광 다이오드 표시 소자 및 이의 봉지 방법 |
| US20120128966A1 (en) * | 2009-08-04 | 2012-05-24 | Jingjing Ma | Non-halogenated polyisobutylene-thermoplastic elastomer blend pressure sensitive adhesives |
| KR101474630B1 (ko) * | 2012-01-06 | 2014-12-19 | 주식회사 엘지화학 | 봉지용 필름 |
| WO2013137397A1 (ja) * | 2012-03-15 | 2013-09-19 | リンテック株式会社 | 粘着性組成物、及び粘着性シート |
| TWI647109B (zh) * | 2013-05-21 | 2019-01-11 | Ｌｇ化學股份有限公司 | 包封膜以及使用彼來包封有機電子裝置之方法 |
| JP5764687B1 (ja) * | 2014-03-31 | 2015-08-19 | 古河電気工業株式会社 | 有機電子デバイス素子封止用樹脂組成物、有機電子デバイス素子封止用樹脂シート、有機エレクトロルミネッセンス素子、及び画像表示装置 |
| KR102153560B1 (ko) * | 2014-10-15 | 2020-09-08 | 소켄 케미칼 앤드 엔지니어링 캄파니, 리미티드 | 점착제층, 점착제층 부착 편광판 및 적층체 |
| KR101561103B1 (ko) * | 2014-12-17 | 2015-10-19 | 주식회사 이녹스 | 유기전자장치용 접착필름 및 이를 포함하는 유기전자장치용 봉지재 |
| KR101936600B1 (ko) * | 2017-07-06 | 2019-01-09 | (주)이녹스첨단소재 | 유기전자장치용 접착필름 및 이를 포함하는 유기전자장치용 봉지재 |
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| KR101693797B1 (ko) | 2015-12-29 | 2017-01-09 | 주식회사 이녹스 | 유기전자장치 봉지재용 점착필름 및 이를 포함하는 봉지재 |
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| Publication number | Publication date |
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| KR20190021005A (ko) | 2019-03-05 |
| CN109423220A (zh) | 2019-03-05 |
| CN109423220B (zh) | 2021-06-22 |
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