KR101960418B1 - Method for sorting electronic parts, apparatus for sorting electronic parts, manufacturing apparatus for taping electronic parts - Google Patents

Abstract

It is possible to carry out sorting in consideration of demineralization treatment. The contact portions of the external electrodes 42 and 43 in contact with the measurement terminals T1 and T2 are brought into contact with the measurement terminals T1 and T2 to which the bias is applied to the external electrodes 42 and 43 of the electronic component 40, The impedance value of the electronic component 40 is measured through T1 and T2. The upper and lower limit threshold values and the lower limit threshold value corresponding to the electronic component 40 are compared with the measured impedance value to judge whether the electronic component 40 is positive or negative and to select the good electronic component 40. [ The upper limit selection threshold value and the lower limit selection threshold value are set based on the shipment upper and lower limit thresholds for shipment of the electronic component 40 and the shipment lower threshold value and the rate of change of the impedance of the electronic component 40,
Upper limit screening threshold = Shipment upper limit threshold × (1 +
Lower limit screening threshold = Shipment lower limit threshold × (1 +
.

Description

TECHNICAL FIELD [0001] The present invention relates to a method for selecting electronic components, a method for selecting electronic components, and a manufacturing apparatus for taping electronic components,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for sorting electronic components, an apparatus for sorting electronic components, and a manufacturing apparatus for taping electronic components.

Conventionally, electrodes of electronic parts such as chip inductors are electroplated. When electrolytic plating is performed on the electrode, a current flows between the electrodes, so that the electronic component may be magnetized. The magnetism of an electronic part affects the electrical characteristics of the electronic part. For this reason, various methods have been proposed for passing the annular solenoid to remove the magnetism of the electronic component (see, for example, Patent Documents 1 and 2).

Japanese Patent Laid-Open No. 4-239105 Japanese Patent Laid-Open No. 8-67329

In an electronic component including a magnetic body such as a chip inductor, the magnetic force in the magnetic body affects a characteristic value (for example, an impedance value). In a manufacturing process of an electronic component, characteristic values such as a resistance value and an impedance value are measured. There is also a case where the measurement terminal to which the bias is applied is brought into contact with the external electrode of the electronic component to clean the contact portion of the external electrode in contact with the measurement terminal, and the impedance value of the electronic component is measured through the measurement terminal. In this case as well, since a current flows between the electrodes, the electronic component may be magnetized. And the demagnetizing process is performed on the selected electronic component based on the measurement result. For this reason, it is required to sort the electronic components in consideration of the characteristic change in the demagnetizing process.

An object of the present invention is to provide an electronic part selection method, an electronic part selection device, and a taping part lead-in manufacturing device, which enable sorting in consideration of demineralization processing.

A method of selecting an electronic component that solves the above problems is a method of selecting an electronic component including a magnetic material, wherein the electronic component is subjected to a demagnetization process after being sorted, Measuring the impedance value of the electronic component through the measurement terminal, cleaning the contact portion of the external electrode in contact with the measurement terminal, measuring an impedance value of the electronic component through the measurement terminal, And a step of selecting the electronic component of the good product by comparing an impedance value of the electronic component with the upper limit threshold value and the lower limit threshold value to determine a shipment upper limit threshold value for shipment of the electronic component and A shipment lower limit threshold value and a shattering rate change rate at which the impedance value changes in the electronic component demagnetization Lt; / RTI >

Upper limit screening threshold = Shipment upper limit threshold × (1 +

Lower limit screening threshold = Shipment lower limit threshold × (1 +

.

According to this configuration, the electronic parts can be selected by considering the demagnetizing process by setting the upper limit threshold value and the lower limit threshold value on the basis of the rate of demagnetization according to the characteristic value changed by demagnetization.

The above electronic component selection method is characterized in that the electronic component change rate is determined based on an impedance value before and after the demagnetization,

Degradation rate = (pre-removal impedance value-impedance value after stripping) / impedance value after stripping

.

According to this configuration, it is possible to easily set the rate of change of defection by the impedance value changed by defection.

In the above electronic component selecting method, it is preferable that the electronic component is a laminated inductor including a coil conductor including a plurality of coil patterns stacked on one another, wherein the stacking direction of the coil patterns is a height direction T, In the case where the measurement step is performed on the LW surface defined by the width direction W in the parallel direction, the longitudinal direction L in the direction perpendicular to the height direction T and the width direction W, and the longitudinal direction L and the width direction W And the rate of change of the impedance value in the case of performing the above measuring process on the LT plane defined by the longitudinal direction L and the height direction T is referred to as the LT direction deviation amount Quot; change rate ", and the upper limit selection threshold and the lower limit threshold,

Upper limit screening threshold = Shipment upper limit threshold × (1 + LW direction deviation rate)

Lower limit screening threshold = Shipment lower limit threshold × (1 + LT change rate)

As shown in Fig.

According to this configuration, in the electronic component having the directionality in the measured value of the characteristic, the electronic part can be selected in consideration of the demagnetizing process by setting the demagnetizing rate according to the directionality.

The above electronic component selection method is characterized in that an impedance value before demagnetization measured by bringing the measurement terminal into contact with the external electrode on the LW surface is defined as Z1 and an impedance value after demagnetization is defined as Z2,

LW direction change-out rate of change = (Z1-Z2) / Z2

The impedance value before demagnetization measured by bringing the measuring terminal into contact with the external electrode of the LT surface is denoted by Z3 and the impedance value after demagnetization is denoted by Z4,

LT change-out rate = (Z3-Z4) / Z4

As shown in Fig.

According to this configuration, in the electronic component having the directionality in the measured value of the characteristic, the electronic part can be selected in consideration of the demagnetizing process by setting the demagnetizing rate according to the directionality.

It is preferable that the above-described method of selecting an electronic component includes a step of measuring a resistance value of the electronic component, and in the step of determining both parts of the electronic component, the determination is made based on the impedance value and the resistance value .

According to this configuration, both parts of the electronic part can be judged and selected based on the resistance value and the impedance value.

An electronic part sorting apparatus for solving the above problems is a sorting apparatus for an electronic part including a magnetic material, wherein the electronic part is demagnetized after being sorted, and a measuring terminal to which a bias is applied is connected to an external electrode of the electronic part A measurement unit for cleaning a contact portion of the external electrode in contact with the measurement terminal and measuring an impedance value of the electronic component through the measurement terminal, and a measurement unit for measuring an impedance value of the electronic component, And a selection unit for selecting the electronic component of the good product based on the determination result of the control unit, wherein the control unit is configured to select the electronic component based on the upper limit selection threshold and the lower limit And a shipment threshold value for shipment of the electronic component and a shipment upper limit threshold value and shipment lower limit threshold value for shipment of the electronic component, In the caret on the basis of the change rate at which the demagnetisation impedance value changes,

Upper limit screening threshold = Shipment upper limit threshold × (1 +

Lower limit screening threshold = Shipment lower limit threshold × (1 +

.

According to this configuration, the electronic parts can be selected by considering the demagnetizing process by setting the upper limit threshold value and the lower limit threshold value on the basis of the rate of demagnetization according to the characteristic value changed by demagnetization.

A manufacturing apparatus for a taping electronic component filament that solves the above problems is characterized by having a carrier tape having a plurality of receiving holes formed at intervals along a long side direction, an electronic component accommodated in the receiving hole, and a cover tape A tape forming apparatus for producing a taping electronic component lead, the apparatus comprising: a carrying section for carrying the electronic component to the carrier tape; and a transfer section provided in a conveying path of the electronic component in the carry section, And a contact portion of the external electrode in contact with the measurement terminal is cleaned, and a characteristic of the electronic component is measured through the measurement terminal An upper limit threshold value and a lower limit threshold value corresponding to the electronic component; And compares the measured impedance value controller for determining good or bad of the electronic component,

A sorting unit for sorting the electronic components of good products based on a result of the determination by the control unit; a winding unit for winding the tapping electronic component lead; and a demagnetizer disposed between the carry unit and the winding unit, Wherein the control unit sets the upper limit threshold value and the lower threshold value as a threshold value based on a shipment upper limit threshold value and a shipment lower threshold value for shipment of the electronic component and a shatter lower threshold value,

Upper limit screening threshold = Shipment upper limit threshold × (1 +

Lower limit screening threshold = Shipment lower limit threshold × (1 +

.

According to this configuration, the electronic parts can be selected by considering the demagnetizing process by setting the upper limit threshold value and the lower limit threshold value on the basis of the rate of demagnetization according to the characteristic value changed by demagnetization.

According to the electronic component sorting method, electronic component sorting apparatus, and taping component lead manufacturing apparatus of the present invention, it is possible to perform sorting in consideration of dematching treatment.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic plan view of a manufacturing apparatus for a taping electronic component lead. FIG.
2 is a schematic diagram of an apparatus for manufacturing a taping electronic component lead.
Fig. 3 (a) is a plan view of a part of the taping electronic component, and Fig. 2 (b) is a partial cross-sectional view of the taping component.
4 (a) and 4 (b) are explanatory diagrams of taping.
5 is a schematic perspective view of the demagnetizer.
6 (a) and 6 (b) are schematic perspective views of electronic components.
7 is an explanatory view of the operation of the demagnetizer.
8 (a) and 8 (b) are explanatory diagrams of the magnetic flux in the demagnetizer.
9 is an explanatory diagram of a magnetic flux applied to a tapped laminated inductor;
10 (a) to 10 (c) are schematic diagrams showing the measurement of characteristic values of an electronic part;
11 is a characteristic diagram showing an impedance value of an electronic part.
12 is an explanatory diagram showing the setting of a threshold value;
13 (a) and 13 (b) are schematic perspective views of electronic parts.
14 (a) to 14 (j) are perspective views showing other dematerial devices.

Hereinafter, an embodiment will be described.

In the drawings, the constituent elements are enlarged for ease of understanding. The dimensional ratio of the components may be different from that of the actual or other drawings. In the cross-sectional view, hatching of a part of components may be omitted in order to facilitate understanding.

As shown in Fig. 2, the manufacturing apparatus 10 for manufacturing taping electronic components has a transporting device 11, a taping device 12, a demagnetizing device 13, and a control device 14. [ The control device 14 drives and controls the transfer device 11, the taping device 12, and the demagnetizing device 13. In Fig. 2, one control device 14 is shown, but a control device may be provided in each device.

The transport apparatus 11 has three reel units 21, 22, and 23. The reel unit 21 feeds the carrier tape 31. The reel unit 22 feeds the cover tape 32.

The carrier tape 31 has a receiving hole for accommodating the electronic component. The taping device 12 accommodates the electronic component in the receiving hole of the carrier tape 31 and closes the receiving hole with the cover tape 32. [ As a result, a tapered electronic component lead (33) containing electronic components is formed in the receiving hole. The reel unit 23 winds the tapping electronic component lead 33. The reel unit 23 carries the taping electronic component lead 33. The reel unit 23 and the taping electronic component lead 33 constitute transport means for transporting the electronic component. The moving path of the electronic component is constituted by the taping electronic component lead 33 conveyed.

The demixing device 13 is disposed between the taping device 12 and the reel part 23. [ The demagnetizer 13 demagnetizes the electronic components housed in the tapering electronic component tangs 33 conveyed by the reel unit 23.

Electronic components will be described.

As shown in Fig. 6 (a), the electronic component 40 has the element body 41 and the external electrodes 42, 43. The component element body 41 has a substantially rectangular parallelepiped shape. For example, the element body 41 is approximately square-pillar-shaped. The " approximately rectangular parallelepiped " includes a rectangular parallelepiped having a corner portion or a ridge portion chamfered, and a rectangular parallelepiped having a corner portion or a ridge portion rounded.

In the present embodiment, the electronic component 40 is a laminated inductor. As shown in Fig. 6 (b), the element body 41 has a magnetic body portion 51 and a coil conductor (conductor portion) The coil conductor 52 is buried in the magnetic body portion 51. At both ends of the coil conductor 52, lead electrodes 53 and 54 are formed. The lead electrodes 53 and 54 are electrically connected to the external electrodes 42 and 43.

As the material of the magnetic body portion 51, for example, a ferrite material containing, as a main component, each component of iron (Fe), nickel (Ni), zinc (Zn) and copper (Cu) can be used. As the material of the coil conductor 52, for example, a conductive material containing Cu as a main component may be used. As the material of the external electrodes 42 and 43, a suitable conductive material such as Ni, Cu, Ag, Pd, Au or Ag-Pd alloy may be used.

The element body 41 is formed by laminating a plate-shaped magnetic body, for example. Specifically, after a sheet (for example, a green sheet) containing a magnetic material such as ferrite is formed and a via hole is formed at a predetermined position of the sheet, a conductive material such as copper (Cu) A coil pattern (conductor pattern) 52a is formed. A sheet on which a predetermined coil pattern 52a is formed and a sheet on which a coil conductor is not formed are laminated, pressed with a predetermined pressure, and cut to a predetermined size to obtain a laminate. This laminate is fired at a predetermined temperature (for example, 900 DEG C) to obtain the element body 41. [ A conductive material is applied to the both end faces of the element body 41 and the external electrodes 42 and 43 are formed by baking at a predetermined temperature (for example, 700 DEG C).

In the electronic component 40 thus formed, the direction in which the pair of external electrodes 42 and 43 are formed is referred to as " longitudinal direction L ". The direction perpendicular to the "longitudinal direction L" is referred to as "height direction T" and "width direction W". The electronic component 40 of the present embodiment has a coil conductor 52 formed by laminating sheets in one direction orthogonal to the longitudinal direction L. [ The direction (lamination direction) in which the plurality of coil patterns 52a constituting the coil conductor 52 are laminated is referred to as " height direction T ". The direction orthogonal to the "longitudinal direction L" and the "height direction T" is referred to as "width direction W". The laminated sheet surface and the plurality of coil patterns 52a are formed to extend along the " width direction W ".

As described above, the electronic component 40 is formed in a substantially rectangular parallelepiped shape (approximately square-column shape). The electronic component 40 includes side surfaces 40a and 40b facing each other in the height direction T and side surfaces 40c and 40d facing each other in the width direction W and end surfaces 40c and 40d facing each other in the length direction L 40e, and 40f.

The side surfaces 40a and 40b facing each other in the height direction T are parallel to the plane having the longitudinal direction L and the width direction W as axes. Therefore, these side surfaces 40a and 40b are referred to as LW surfaces. Likewise, the side surfaces 40c and 40d facing each other in the width direction W are parallel to the plane having the longitudinal direction L and the height direction T as axes. Therefore, these side surfaces 40c and 40d are referred to as the LT surface.

The taping electronic component lead 33 will be described.

3 (a) and 3 (b), the taping electronic component strip 33 includes a carrier tape 31 having a receiving hole 31a, A cover tape 32 which is made of a metal material, and electronic parts 40 accommodated in the respective receiving holes 31a. The carrier tape 31 of the present embodiment has a base tape 31b formed through a receiving hole 31a and a bottom tape 31c provided on a lower surface of the base tape 31b. It is also possible to use a carrier tape in which the base tape 31b and the bottom tape 31c are integrally formed.

3 (a) and 3 (b), the receiving holes 31a are spaced apart from each other in the longitudinal direction of the carrier tape 31 (the left-right direction in FIG. 3 (a)) Respectively. The receiving hole 31a is formed so as to extend in the width direction of the carrier tape 31 (vertical direction in Fig. 3 (a)). This taping electronic component lead 33 is transported in one direction in the long-side direction (for example, the left direction in Fig. 3 (a)). The receiving hole 31a is formed so as to extend in a direction perpendicular to the conveying direction of the tapping electronic component lead 33 as viewed from the main surface (upper surface) of the tapping electronic component lead 33. [

The taping device 12 will be described.

1, the taping device 12 has a ball feeder 61, a linear feeder 62, and a transport mechanism 63. As shown in Fig.

A plurality of electronic components (40) are accommodated in the ball feeder (61). The ball feeder 61 vibrates and sequentially supplies the electronic part 40 to the linear feeder 62. The linear feeder 62 vibrates to supply the electronic component 40 supplied from the ball feeder 61 to the transport mechanism 63. [

The transport mechanism 63 has a transport table 64 which rotates about the central axis C. The transport mechanism 63 transports the electronic component 40 to the carrier tape 31 by the transport table 64.

The transport table 64 has a plurality of concave portions 65. The conveyance table 64 is in the form of a disk and the plurality of recesses 65 are formed at the radially outer end of the conveyance table 64, respectively. The plurality of concave portions 65 are formed at intervals along the circumferential direction of the transport table 64. For example, the plurality of concave portions 65 are formed at equal intervals along the circumferential direction of the transport table 64. Each recess 65 extends from the outer circumferential surface of the transport table 64 toward the central axis C. Each concave portion 65 is formed in a rectangular shape in plan view (as viewed from the direction of the central axis C of the transport table 64). Each concave portion 65 is formed slightly larger than the electronic component 40.

The electronic part 40 is loaded from the linear feeder 62 to the concave portion 65 of the transport table 64 at the position P1. In the position P1, the electronic component 40 loaded in the concave portion 65 is conveyed along the circumferential direction about the center axis C by the rotation of the conveyance table 64. [ The electronic component 40 is transported to the position P5. The electronic part 40 is accommodated in the receiving hole 31a of the carrier tape 31 from the carrying table 64 at this position P5.

A resistance value measuring section 66 is provided at a position P2 located on the conveying path from the position P1 to the position P5. In this resistance value measuring section 66, the resistance value (DC resistance Rdc) of the electronic component 40 accommodated in the recessed portion 65 is measured. The resistance value of the measured electronic component 40 is outputted to the control device 14 shown in Fig.

In the conveying path, an impedance measuring unit 67 is provided at the position P3 located between the position P2 and the position P5. In the impedance measuring section 67, the impedance value of the electronic component 40 accommodated in the recess 65 is measured. The measured impedance value of the electronic component 40 is output to the control device 14 shown in Fig.

10 (a) is a schematic view showing a characteristic value measurement of the electronic component 40. Fig.

The characteristic values of the electronic component 40 are measured by bringing the measurement terminals T1 and T2 into contact with the external electrodes 42 and 43 of the electronic component 40 with a predetermined pressing force as shown in Fig. . At this time, an electric cleaning (ECM) is performed. The electrical cleaning is a process for stabilizing the contact properties between the measurement terminals T1 and T2 and the external electrodes 42 and 43 of the electronic component 40. [ The contact between the measurement terminals T1 and T2 and the external electrodes 42 and 43 becomes unstable if foreign substances are adhered to the surface of the measurement terminals T1 and T2 or on the surfaces of the external electrodes 42 and 43 or an oxide film. Therefore, when the measurement terminals T1 and T2 are brought into contact with the external electrodes 42 and 43 while the bias voltage is applied between the measurement terminals T1 and T2, A discharge phenomenon occurs. By this discharge phenomenon, a film (for example, a tin-plated oxide film) or foreign matter adhering to the surface is removed. As a result, the contact between the measurement terminals T1 and T2 and the external electrodes 42 and 43 is stabilized.

In Fig. 10A, two measurement terminals T1 and T2 are shown, but the number of measurement terminals is changed according to the characteristics to be measured. For example, in the resistance value measuring section 66, the resistance value is measured by the four-terminal method using four measuring terminals. The impedance measuring unit 67 measures the impedance value using the two measuring terminals T1 and T2 as shown in Fig. 10 (a).

The electronic component 40 of the present embodiment includes a coil conductor 52 formed by laminating a plurality of coil patterns 52a as shown in Fig. 6 (b). The electronic component 40 includes the LW surfaces 40a and 40b facing the stacking direction (the height direction T) of the coil pattern 52a and the LT surfaces 40a and 40b facing the coil pattern 52a in the direction (40c, 40d). 10 (b), when the measurement terminals T1 and T2 are brought into contact with the external electrodes 42 and 43 on the LT surface 40c of the electronic component 40, the measurement terminals T1 and T2 may be brought into contact with the external electrodes 42 and 43 on the LW surface 40a of the electronic component 40 as shown in Fig.

In the electronic component 40 of the present embodiment, the measurement values are different depending on the direction in which the measurement terminals T1 and T2 are brought into contact with each other due to the directionality of the plurality of coil patterns 52a stacked. For example, as shown in FIG. 10 (b), the case of measuring the characteristic value (impedance value) by the LT surface 40c of the electronic component 40 and the case of measuring the characteristic value There is a case in which the measurement terminals T1 and T2 are brought into contact with the LW surface 40a of the electronic component 40 to measure the characteristic value. The impedance value measured by contacting the measurement terminals T1 and T2 to the LT surface 40c is larger than the impedance value measured by contacting the measurement terminals T1 and T2 to the LW surface 40a. This is thought to be due to the residual stress in the manufacturing process of the electronic component 40 and the like.

As shown in Fig. 1, in the conveying path, the selector P8 is provided at the position P4 located between the position P3 and the position P5. The selector 68 is connected to the controller 14 shown in Fig. The selector 68 selects the electronic component 40 based on an instruction from the controller 14. [

The control device 14 determines both sides of the electronic component 40 based on the resistance value output from the resistance value measurement section 66 and the impedance value output from the impedance measurement section 67. [ Based on the determination result, the controller 14 selects the electronic component 40 judged as a good product by the selector 68 and continues to carry the electronic component 40 as it is, Is removed from the transport table 64 by the transport roller 68.

For example, the selector 68 has a suction pump (not shown). The suction pump is connected to a suction hole formed in the transport table 64. Thus, the transport table 64 adsorbs and holds the electronic component 40. The selector 68 continues the adsorption and maintenance of the electronic component 40 judged as a good product at the position P4. On the other hand, in the position P4, the selector 68 stops suction and holding of the electronic component 40 determined as a defective product, and applies a positive pressure to the suction hole. Thereby, the electronic component is excluded from the concave portion 65. Therefore, all of the electronic components 40 that have passed through the position P4 and are transported to the position P5 are determined to be good products.

In addition, the control device 14 stores a threshold value for selecting the electronic component 40. The threshold for selection includes a threshold value for the resistance value and a threshold value for the impedance value. In the control device 14, a range of the resistance value shipped as a good product is set. The range is set by the upper limit threshold and the lower limit threshold. The electronic component 40 to be a good product is within the range, that is, the resistance value (DC resistance) is equal to or less than the upper limit threshold value and is equal to or greater than the lower limit threshold value.

In addition, the range of the impedance value shipped as a good product to the electronic component 40 is set in the control device 14. The range is set by the upper limit threshold value and the lower limit threshold value. The electronic component to be a good product is within the range, that is, the impedance value is equal to or lower than the upper limit threshold value and equal to or lower than the lower limit threshold value. The electronic component 40 judged to be good in terms of the resistance value and the impedance value is shipped. The upper limit value and the lower limit value of the range of the impedance value for this shipment are referred to as " shipment upper limit threshold value " and " shipment lower limit threshold value,

The impedance value of the electronic component 40 is also changed by the magnetization by the electric cleaning (ECM) during measurement and by the demagnetizer 13 (see Fig. 1). Therefore, the controller 14 sets the rate of change of the impedance value in the demagnetized state (demagnetization rate). The control device 14 sets a threshold value for selection based on this out-of-change rate, the above-mentioned shipment upper limit threshold value, and shipment lower limit threshold value. Threshold values for selection include an upper threshold selection threshold and a lower threshold threshold. The controller 14 compares the upper limit threshold value and the lower limit threshold value with the following expression,

Upper limit screening threshold = Shipment upper limit threshold × (1 +

Lower limit screening threshold = Shipment lower limit threshold × (1 +

.

The shipment upper limit threshold and shipment lower limit threshold are set in accordance with the product standard of the electronic component 40, for example. For example, the shipment upper limit threshold value is made equal to the upper limit value of the product standard, and the lower shipping threshold value is made equal to the lower limit value of the product standard. In addition, the shipping upper limit threshold and the shipping lower limit threshold may be set in consideration of the selection margin at the time of selection for the product standard. The screening margin is set in consideration of factors such as the error of the characteristic value (impedance value) of the electronic component used for calibration of the measurement, the error of the calibration operation, and the error in the repeat accuracy of the measurement. Based on the selection margin, the shipment upper limit threshold value and the shipment lower limit threshold value are expressed by the following equations,

Shipment upper limit threshold = Product specification upper limit - Selection margin

Lower limit of shipment = Lower limit of product standard + Selection margin

.

As described above, the electronic component 40 of the present embodiment includes the coil conductor 52 formed by stacking a plurality of coil patterns 52a. The impedance value obtained by the measurement is different according to the measurement direction of the electronic component 40 (the direction of the side contacting the measurement terminals T1 and T2 shown in Fig. 10 (a)).

11 shows the distribution of the impedance values LTa and LTb measured by bringing the measurement terminals T1 and T2 into contact with the LT surface and the distribution of the impedance values LWa and LWb measured by bringing the measurement terminals T1 and T2 into contact with the LW surface. These distributions are the results of measuring a predetermined number (for example, 500) of the electronic components 40. 11, the impedance values LTa and LWa after demagnetization are shown on the left side, and the impedance values LTb and LWb before demagnetization are shown on the right side. For example, the impedance value after demagnetization is measured by contacting the measurement terminal with the LT surface and the LW surface after demagnetizing the electrically cleaned electronic component. The impedance value before demagnetization is measured by electrically cleaning and bringing the measurement terminal into contact with the LT surface and the LW surface, respectively. In each of the right and left characteristic diagrams, the abscissa indicates the number and the ordinate indicates the impedance value. In Fig. 11, the higher the impedance value is, the higher the impedance value is.

As shown in Fig. 11, the impedance values LTa and LWa after demagnetization and the distribution states of the impedance values LTb and LWb before demagnetization are substantially equal to each other. That is, for each electronic component, the impedance value is similarly changed. In the impedance values LWb and LWa measured by bringing the measuring terminals T1 and T2 into contact with the LW surface in comparison with the difference between the demagnetizing value and the demagnetizing value in the impedance values LTb and LTa measured by bringing the measuring terminals T1 and T2 into contact with the LT surface, The car before and after the demagnetization is large. That is, the impedance values LTa and LTb measured by contacting the measurement terminals T1 and T2 with the LT surface are larger than the impedance values LWa and LWb measured by bringing the measurement terminals T1 and T2 into contact with the LW surface.

The rate of change of the impedance value due to demagnetization is obtained by these impedance values. A characteristic value is measured with respect to the electronic component before demagnetization and an average value Z1 of impedance values of n (for example, 25) from the maximum impedance values and an average value Z2 of n impedance values from the minimum value are obtained from the measured impedance values. Likewise, characteristic values are measured for demagnetized electronic components, and an average value Z3 of n (for example, 25) impedance values from the maximum value and an average value Z4 of n impedance values from the minimum value are obtained from the measured impedance values . This is because the LT surface and the LW surface can not be distinguished in the characteristic value measurement. That is, the measurement result of the characteristic value includes the measurement result of contacting the measurement terminals T1 and T2 on the LT surface and the measurement result of contacting the measurement terminals T1 and T2 on the LW surface. As shown in Fig. 11, the plurality of (n) characteristic values from the maximum value have a very high probability that the measured values are obtained by bringing the measurement terminals T1 and T2 into contact with the LT surface, and a plurality of (n) , The probability that the measured values are obtained by bringing the measuring terminals T1 and T2 into contact with the LW surface is very high.

Then, by the average values Z1 to Z4, the LT direction deviation rate and the LW direction deviation rate are calculated by the following equations

LT change-out rate = (Z1-Z3) / Z3

LW direction change-out rate of change = (Z2-Z4) / Z4

Lt; / RTI > The upper limit screening threshold value and the lower limit screening threshold value are expressed by the following equations,

Upper limit screening threshold = Shipment upper limit threshold × (1 + LW direction deviation rate)

Lower limit screening threshold = Shipment lower limit threshold × (1 + LT change rate)

.

Fig. 12 schematically shows the setting of the upper limit threshold value and the lower threshold value.

As described above, the upper limit threshold value is set on the basis of the shipment upper limit threshold value and the LW direction demagnetization rate. By using the upper limit threshold value thus set, it is possible to reliably select the electronic components measured in the LT direction. That is, when the impedance value of the electronic component 40 determined as a good product by the upper limit screening threshold value is obtained by the measurement by the LT surface, the impedance value becomes a value smaller than the shipment upper limit threshold value after demagnetization. That is, even after demagnetization, the electronic component determined to be good is within a range where the impedance value becomes good.

Likewise, a lower limit threshold value is set based on the shipment lower limit threshold value and the LT direction de-autonomous change rate. By using the lower limit threshold value thus set, it is possible to reliably select the electronic component measured in the LW direction. That is, when the impedance value of the electronic component 40 determined as a good product by the lower limit screening threshold value is obtained by the measurement by the LW plane, the impedance value becomes larger than the lower shipping threshold value after demagnetization. That is, even after demagnetization, the electronic component determined to be good is within a range where the impedance value becomes good.

Further, in the case of the electronic component having no directivity due to the measurement surface in the measurement of the characteristic value or a small electronic component, it is possible to obtain the rate of change in the rate of out-of- That is, the characteristic value is measured for the electronic component before demagnetization, and the average value Z5 of the measured impedance value is obtained. Similarly, characteristic values are measured for the electronic components after demagnetization, and the average value Z6 of the measured impedance values is obtained. Then, by using these average values Z5 and Z6,

Degrowth change rate = (Z5-Z6) / Z6

Lt; / RTI >

13A and 13B, the electronic component 200 includes a coil conductor 201 (coil pattern 201a) formed by a plurality of sheets laminated in the longitudinal direction L Lt; / RTI > The electronic component 200 is an example of an electronic component having no or small directionality due to the measurement surface in the measurement of the characteristic value. This electronic component 200 is small enough that there is no difference in the characteristics (impedance value) between the LT surface and the LW surface or does not affect the selection. In the process of manufacturing such an electronic component, it is possible to select good products by setting the upper limit selection threshold and the lower limit threshold by using the rate of change of the degree of elimination obtained by the above formula.

The electronic component 40 transported by the transport table 64 is accommodated in the receiving hole 31a of the carrier tape 31 at the position P5. A plurality of receiving holes 31a are formed in the carrier tape 31 at intervals along the long side direction. The carrier tape 31 is positioned so that the concave portion 65 and the receiving hole 31a overlap when the concave portion 65 of the carrying table 64 is positioned at the position P5. The electronic component 40 is accommodated in the receiving hole 31a of the carrier tape 31 from the concave portion 65 of the transport table 64 in this state.

Thereafter, the carrier tape 31 is moved in the leftward direction in Fig. 1 along the long side direction, and another concave portion 65 in which the electronic component 40 is not accommodated is moved in the concave portion 65 So that the electronic component 40 is received in the receiving hole 31a. By repeating these processes, the electronic parts 40 are sequentially housed in the plurality of receiving holes 31a of the carrier tape 31. [

A magnet rail 69 is disposed under the carrier tape 31 to be transported. The magnet rail 69 sucks the electronic component 40 accommodated in the receiving hole 31a of the carrier tape 31 by magnetic force.

As shown in Fig. 4 (a), the electronic component 40 is magnetically attracted by the magnet rail 69 and brought into close contact with the bottom surface of the receiving hole 31a. That is, the magnet rail 69 stabilizes the posture of the electronic component 40 in the receiving hole 31a. In Fig. 4 (a), a transport cover 70 is disposed above the carrier tape 31. As shown in Fig. 4 (b), the posture of the electronic component 40 is not inclined, or the carrier tape 31 does not protrude from the receiving hole 31a and come into contact with the transport cover 70, . Further, the magnet rail 69 suppresses the movement of the electronic component 40 in the receiving hole 31a. This makes it possible to suppress the damage (damage) of the electronic component 40 and the carrier tape 31 and suppress the deterioration of the quality of the taping electronic component lead 33. [

Then, on the carrier tape 31, a cover tape 32 covering a plurality of receiving holes 31a is disposed. 1, the cover tape 32 is omitted in order to make the carrier tape 31 and the electronic component 40 easier to understand. The cover tape 32 is brought into close contact with the carrier tape 31 by, for example, heating. As a result, the carrier tape 31, the cover tape 32, and the taping electronic component lead 33 having the electronic component 40 accommodated in the receiving hole 31a are produced.

The carrier tape 31 to be conveyed passes above the demagnetizer 13 and is wound by the reel portion 23 shown in Fig. The demagnetizer 13 demagnetizes the electronic component 40 accommodated in the receiving hole 31a of the carrier tape 31. [ As described above, the element body 41 of the electronic component 40 has the magnetic body portion 51. [ The magnetic body portion 51 is magnetized by the electric current flowing in the element body 41 (see FIG. 6 (b)) by the electric cleaning in the above-mentioned measurement, the magnetic force of the magnet rail 69, The magnetization of the magnetic substance part 51, that is, the magnetic field remaining in the magnetic substance part 51 changes the characteristic (impedance value) of the electronic part 40. [ For example, in the multilayer inductor as the electronic component 40, the impedance value is lowered by the magnetization of the magnetic body portion 51. [ For example, if the magnetic field of the magnetic body part 51 is lowered by some factor after shipment, the impedance value becomes high. In other words, this causes a change in the characteristic (impedance value) of the electronic component 40. Therefore, the demagnetizing device 13 reduces the magnetic field of the magnetic body portion 51 and suppresses a change in characteristics (impedance value).

As shown in FIG. 5, the demagnetizer 13 has a core 81 and a coil 91. The core 81 is disposed below the taping electronic component lead 33 (carrier tape 31) to be transported. In Fig. 5, the cover tape is omitted for showing the electronic component 40. Fig. The core 81 has two magnetic poles 82, 83, and is formed, for example, in a U shape. Specifically, the core 81 has a pair of magnetic pole portions 84 and 85 extending in parallel to each other and a connecting portion 86 connecting the lower ends of the pair of magnetic pole portions 84 and 85. The coil 91 is wound around one of the magnetic pole portions 85 of the pair of magnetic pole portions 84 and 85. Further, the coil 91 may be wound around the magnetic pole portion 84. The distal end surfaces (upper end surfaces) of the pair of magnetic pole portions 84 and 85 serve as magnetic poles 82 and 83 of the core 81, respectively.

The core 81 is arranged so that two magnetic poles 82 and 83 are arranged in parallel along the conveying direction of the carrier tape 31. In the present embodiment, the core 81 is arranged such that the two magnetic poles 82, 83 are opposed to the main surface (lower surface) of the carrier tape 31. The distance between the magnetic poles 82 and 83 of the core 81 and the carrier tape 31 can be, for example, in the range of 5 to 10 mm. The distance between the two magnetic poles 82 and 83 (distance between centers of the magnetic poles 82 and 83) can be, for example, 70 mm.

A coil 91 is wound around the core 81. The coil 91 is connected to a power supply unit not shown, and an alternating current is supplied from the power supply unit. The coil 91 to which the AC current is supplied generates an alternating magnetic field between the two magnetic poles 82 and 83 of the core 81. The power supply apparatus is included in, for example, the control apparatus 14 shown in Fig. Further, a power supply device may be provided separately from the control device 14.

7, the two magnetic poles 82, 83 arranged corresponding to the carrier tape 31 are arranged in the order of the alternating magnetic field passing through the carrier tape 31 in the height direction of the carrier tape 31, (Vertical magnetic field, first magnetic field). The two magnetic poles 82 and 83 arranged at a predetermined distance from the carrier tape 31 form an alternating magnetic field (horizontal magnetic field, second magnetic field) parallel to the conveying direction of the carrier tape 31. [ That is, the demagnetizer 13 configured as described above forms an alternating magnetic field (vertical magnetic field) perpendicular to the carrier tape 31 and an alternating magnetic field (horizontal magnetic field) parallel to the carrier tape 31.

For example, a single phase 200 V, 60 Hz AC power source can be used as the power source device. With such an AC power source, the demagnetizer 13 generates a magnetic field having a magnetic flux density of 0 to 90 mT (milli-tesla). Further, it is preferable that the carrier tape 31 generate a magnetic field with a magnetic flux density in the range of 30 to 75 mT. It is preferable that the magnetic flux density is 45 mT or more, and it is more preferable that the magnetic flux density is 60 mT. The conveying speed of the carrier tape 31 may be, for example, 40 to 140 mm / sec.

(Action)

A threshold value for sorting is set based on a rate of change (an impedance value) and a threshold value for shipment, and the electronic component 40 is sorted based on the threshold value. Then, the electronic component 40 selected as a good product is demagnetized by the demagnetizing device 13. [ The characteristic value (impedance value) of the electronic component 40 after demagnetization falls within the range for shipment. As described above, the electronic components 40 are selected in consideration of the demagnetization process.

In the degreasing process, the characteristic value (impedance value) of the electronic component 40 becomes larger than the value before the demagnetization. That is, the property value of demagnetization is smaller than the lower threshold value for shipment. When sorting is performed using the lower limit threshold value for shipment, it is determined that the electronic component which is in the range for shipment due to the characteristic change (rise) is not a good product at the timing of selection. That is, as in the present embodiment, if the threshold value (lower limit threshold value) for selection is set based on the rate of change in thickness of the electronic component 40, the number of the electronic components 40 becomes good.

The electronic component 40 is a laminated inductor including a coil conductor 52 (coil pattern 52a) formed by a plurality of sheets stacked in the height direction T. In the measurement of the characteristic value (impedance value) of the electronic component 40, the measurement terminals (T1 and T2) are brought into contact with the measurement terminals (T1 and T2) A difference occurs in one measured value (impedance value), and the rate of change of the off-set is different for each. Therefore, the LT component demagnetizing factor and the LW demagnetizing factor are set, and the electronic component 40 is selected by using the lower limit threshold value and the upper limit threshold value set on the basis of the LT demagnetization factor and the LW demagnetization factor. The electronic component 40 selected as a good product falls within the range for shipment after demagnetization. Therefore, high precision can be obtained in selection of the electronic component 40 which is within the range for shipment.

The average value Z5 of the n impedance values from the maximum value and the average value Z6 of the n impedance values from the minimum value among the characteristic values (impedance values) of the plurality of electronic components 40 measured before demagnetization are obtained. Among the characteristic values measured for the electronic component 40 after demagnetization, the average value Z7 of the n impedance values from the maximum value and the average value Z8 of the n impedance values from the minimum value are obtained. Then, the LT change-out rate is set based on the average values Z5 and Z7, and the LW-direction change-over rate is set based on the average values Z6 and Z8. The measured value by the LT surface tends to be higher than the measured value by the LW surface. For this reason, the n impedance values from the maximum value are very likely to be the measurement results by the LT surface, and the n impedance values from the minimum value are very likely to be the measurement results by the LW surface. Therefore, it is easy to set the rate of change in the LT direction deviation amount and the rate of the LW direction deviation amount.

The demagnetizer 13 forms an alternating magnetic field horizontal to the alternating magnetic field perpendicular to the carrier tape 31. [

8 (a) and 8 (b) show the strength of the magnetic field generated by the demagnetizer 13 in the conveying direction of the carrier tape 31. Fig. 8A shows the strength of the alternating magnetic field formed horizontally with respect to the carrier tape 31 in the moving direction of the carrier tape 31. As shown in Fig. 8 (b) shows the strength of the alternating magnetic field formed perpendicular to the carrier tape 31 in the moving direction of the carrier tape 31. As shown in Fig.

8A and 8B, the strength of the alternating magnetic field is set such that two magnetic poles of the core 81 of the demixing device 13 along the conveying direction to the carrier tape 31 82, and 83 (indicated by vertical dashed lines in the drawing). As a result, the magnetic body 51 of the electronic component 40 is attenuated while repeating the inversion with the change of the alternating magnetic field.

Incidentally, in an electronic component including a plurality of conductor patterns stacked, as in the electronic component 40 of the present embodiment, the magnetic force passing through the electronic component differs depending on the stacking direction of the plurality of conductor patterns. For this reason, in the case of a demagnetizing device for passing an electronic component through an annular coil, there are cases in which magnetic force that affects the attitude of the electronic component differs and self-damping is difficult.

As shown in Fig. 9, the electronic part 40 is accommodated in the receiving hole 31a of the carrier tape 31. As shown in Fig. The electronic component 40 has a coil conductor 52 made of a stacked coil pattern 52a. In Fig. 9, the coil conductor 52 (coil pattern 52a) is shown by a straight line. The electronic component 40 shown on the left side in Fig. 9 has the receiving hole 31a so that the coil conductor 52 (the coil pattern 52a) follows the height direction of the carrier tape 31 (the up and down direction in Fig. 9) Respectively. On the other hand, the electronic component 40 shown on the right side in Fig. 9 is formed so that the coil conductor 52 (the coil pattern 52a) is in a direction parallel to the surface of the carrier tape 31 And is accommodated in the receiving hole 31a. In Fig. 9, the cover tape is omitted.

As described above, it is difficult to judge the height direction T and the width direction W in the electronic component 40 which is close to the square-column type or square-column type (the length in the height direction T and the length in the width direction W are substantially equal) It is difficult to accommodate the posture of the carrier tape 40 in the carrier tape 31 in unison.

As described above, the demagnetizer 13 of the present embodiment forms an alternating magnetic field perpendicular to the carrier tape 31 and an alternating magnetic field parallel to the carrier tape 31. [ That is, in each of the two electronic components 40 shown in Fig. 9, a magnetic field parallel to the coil conductor 52 and a magnetic field perpendicular to the coil conductor 52 are applied. Therefore, magnetic force is attenuated regardless of the attitude of the electronic component 40 housed in the carrier tape 31. Therefore, it is not necessary to align the posture with respect to the electronic component 40 whose influence is different depending on the posture, and it is possible to easily accommodate the electronic component 40 in the carrier tape 31, Can be generated.

As described above, according to the present embodiment, the following effects are exhibited.

(1) A threshold value for selection is set based on the rate of change of the characteristic value (impedance value) by the demagnetization (rate of demagnetization) and the threshold value for shipment, and the electronic component 40 is selected based on the threshold value Respectively. Then, the electronic component 40 selected as a good product is demagnetized by the demagnetizing device 13. [ The characteristic value (impedance value) of the electronic component 40 after demagnetization falls within the range for shipment. In this manner, the electronic component 40 can be selected considering the demagnetization process.

(2) In the demagnetizing process, the characteristic value (impedance value) of the electronic component 40 becomes larger than the value before demagnetization. That is, the property value of demagnetization is smaller than the lower threshold value for shipment. When sorting is performed using the lower limit threshold value for shipment, it is determined that the electronic component which is in the range for shipment due to the characteristic change (rise) is not a good product at the timing of selection. That is, as in the present embodiment, if the threshold value (lower limit threshold value) for selection is set on the basis of the rate of change of thickness of cutouts, the number of good electronic components 40 is increased and the yield of the electronic component 40 can be increased .

(3) The electronic component 40 of the present embodiment is a multilayer inductor including a coil conductor 52 (coil pattern 52a) formed by a plurality of sheets stacked in the height direction T. In the characteristic value measurement (impedance value measurement) of the electronic component 40, a difference occurs between the measurement result (impedance value) using the LT surface and the measurement result (impedance value) using the LW surface, It is different. Therefore, it is possible to set the demagnetizing factor in the LT direction and the demagnetizing factor in the LW direction, and sorting the electronic components 40 by using the lower limit threshold value and the upper limit threshold value set on the basis of the LT demagnetization factor and the LW demagnetization factor Respectively. As a result, the electronic component 40 selected as a good product falls within the range for shipment after demagnetization. Therefore, it is possible to improve the accuracy of sorting the electronic component 40 within the range for shipment.

(4) The average value Z5 of the n impedance values from the maximum value and the average value Z6 of the n impedance values from the minimum value among the characteristic values (impedance values) of the plurality of electronic components 40 measured before demagnetization are obtained. Among the characteristic values measured for the electronic component 40 after demagnetization, the average value Z7 of the n impedance values from the maximum value and the average value Z8 of the n impedance values from the minimum value are obtained. Then, the LT change-out rate is set based on the average values Z5 and Z7, and the LW-direction change-over-change rate is set based on the average values Z6 and Z8. The measured value by the LT surface tends to be higher than the measured value by the LW surface. For this reason, the n impedance values from the maximum value are very likely to be the measurement results by the LT surface, and the n impedance values from the minimum value are very likely to be the measurement results by the LW surface. Therefore, it is possible to easily set the LT change-out rate and the LW-direction change rate.

(5) The taping electronic component manufacturing apparatus 10 has the degaussing device 13 disposed between the taping device 12 and the transfer device 11 (the reel part 23). The taping device 12 receives the electronic component 40 in the receiving hole 31a of the carrier tape 31 and blocks the receiving hole 31a with the cover tape 32 to create the taping electronic component lead 33 do. The reel unit 23 carries the taping electronic component lead 33.

The demagnetizer 13 has a core 81 and a coil 91 wound around the core 81. An alternating current is supplied to the coil 91. [ The core 81 is disposed below the taping electronic component lead 33 (carrier tape 31) to be transported. The demagnetizer 13 forms an alternating magnetic field (a perpendicular magnetic field, a first alternating magnetic field) perpendicular to the carrier tape 31 and an alternating magnetic field (a horizontal magnetic field, a second alternating magnetic field) parallel to the carrier tape 31 do. Therefore, the first alternating magnetic field and the second alternating magnetic field orthogonal to the first alternating magnetic field are applied to the electronic component 40. As the electronic component 40 is conveyed, the magnetic forces of the first alternating magnetic field and the second alternating magnetic field are gradually lowered. In this way, alternating magnetic fields in two orthogonal directions are applied, and the magnetic force of the alternating magnetic field is gradually weakened in accordance with the conveyance, whereby the magnetism of the electronic component 40 is reduced irrespective of the attitude of the electronic component 40 .

(6) The core 81 of the demagnetizer 13 has a pair of magnetic poles 82 and 83 and a pair of magnetic poles 82 and 83 are arrayed along the conveying direction of the taping electronic component lead 33 . Therefore, when an alternating current is applied to the coil 91, an alternating magnetic field perpendicular to the tapping electronic component lead 33 is generated at each position of the pair of magnetic poles 82, 83, and a pair of magnetic poles 82, and 83, the alternating magnetic field parallel to the tapping electronic component lead 33 can be generated.

(7) The electronic component 40 has a coil conductor 52 formed by laminating a plurality of coil patterns (conductor patterns) 52a. This electronic component 40 is different in the magnetic force passing along the stacking direction of the coil conductor 52 (coil pattern 52a). An alternating magnetic field (vertical magnetic field and horizontal magnetic field) orthogonal to each other is applied to the electronic component 40. As a result, it is possible to reduce the magnetic force of the electronic component 40 with respect to the electronic component 40 having a directivity to the residual magnetic field and the passing magnetic field.

(Modified example)

The above embodiment may be embodied in the following forms.

In the above embodiment, the shape of the core may be appropriately changed.

Fig. 14A schematically shows the core 81 and the coil 91 of the embodiment. Fig. On the other hand, as shown in FIG. 14 (b), a pair of magnetic pole portions 102 and 103 and a connecting portion 104 connecting the magnetic pole portions 102 and 103, 101) may be used.

The coil 91 may be wound around the connecting portions 86 and 104 as shown in Figs. 14 (c) and 14 (d).

As shown in FIG. 14 (e), a V-shaped core 111 having a pair of magnetic pole portions 112 and 113 connected to each other and having no connection portion may be used.

Further, as shown in Figs. 14 (f) to 14 (j), cores 121 to 125 each having a round end face as a magnetic pole may be used. The end face to be a magnetic pole is not limited to a circular shape but may be a triangle or a polygonal shape having a pentagon or more.

In the above embodiment, the number of coils wound around the core may be two or more.

Although the demagnetizing device 13 is disposed below the tapping electronic component semiconductor chip 33 in the above embodiment, the demagnetizing device 13 may be disposed above the tapping electronic component semiconductor chip 33.

10: Manufacturing apparatus for taping electronic component lead
11:
12: taping device
13: demagnetizer
14: Control device
33: Taping electronic components
40: Electronic parts

Claims (8)

A method of selecting an electronic component including a magnetic material,
Wherein the electronic component is subjected to a demagnetization process after being sorted,
Cleaning a contact portion of the external electrode contacting the measurement terminal by bringing a measurement terminal applied with a bias voltage into contact with the external electrode of the electronic component and measuring an impedance value of the electronic component through the measurement terminal,
Comparing the upper limit selection threshold value and the lower limit selection threshold value corresponding to the electronic component with the measured impedance value to determine whether the electronic component is positive or negative and selecting the electronic component of the good product,
The upper limit selection threshold value and the lower limit selection threshold value are set based on a shipment upper limit threshold value and a shipment lower threshold value for shipment of the electronic component and a shattering lower threshold value for shipment of the electronic component,
Upper limit screening threshold = Shipment upper limit threshold × (1 +
Lower limit screening threshold = Shipment lower limit threshold × (1 +
In the electronic component. The method according to claim 1,
The rate of change of the rate of detachment is calculated based on the impedance value before and after the demagnetization,
/ RTI > of the electronic component is calculated based on the value of the rate of change of thickness / thickness after stripping (impedance before stripping - impedance after stripping) / impedance after stripping. The method according to claim 1,
Wherein the electronic component is a laminated inductor including a coil conductor including a plurality of coil patterns stacked on one another, the direction of stacking the coil patterns being a height direction T, the direction parallel to the coil pattern being a width direction W, A direction orthogonal to the height direction T and the width direction W is referred to as a length direction L,
The rate of change of the impedance value due to demagnetization in the LW plane defined by the longitudinal direction L and the width direction W when the above measuring process is performed is referred to as the LW direction demagnetization rate,
The rate of change of the impedance value due to demagnetization in the case of performing the above measuring process on the LT plane defined by the longitudinal direction L and the height direction T is referred to as the LT direction de-
The upper limit threshold value and the lower threshold value,
Upper limit screening threshold = Shipment upper limit threshold × (1 + LW direction deviation rate)
Lower limit screening threshold = Shipment lower limit threshold × (1 + LT change rate)
In the electronic component. 3. The method of claim 2,
Wherein the electronic component is a laminated inductor including a coil conductor including a plurality of coil patterns stacked on one another, the direction of stacking the coil patterns being a height direction T, the direction parallel to the coil pattern being a width direction W, A direction orthogonal to the height direction T and the width direction W is referred to as a length direction L,
The rate of change of the impedance value due to demagnetization in the LW plane defined by the longitudinal direction L and the width direction W when the above measuring process is performed is referred to as the LW direction demagnetization rate,
The rate of change of the impedance value due to demagnetization in the case of performing the above measuring process on the LT plane defined by the longitudinal direction L and the height direction T is referred to as the LT direction de-
The upper limit threshold value and the lower threshold value,
Upper limit screening threshold = Shipment upper limit threshold × (1 + LW direction deviation rate)
Lower limit screening threshold = Shipment lower limit threshold × (1 + LT change rate)
In the electronic component. The method of claim 3,
The impedance value before demagnetization measured by bringing the measuring terminal into contact with the external electrode on the LW surface is denoted by Z1, the impedance value after demagnetization is denoted by Z2,
The above-described LW-
LW direction deviation amount change rate = (Z1-Z2) / Z2,
An impedance value before demagnetization measured by bringing the measuring terminal into contact with the external electrode of the LT surface is denoted by Z3, an impedance value after demagnetization is denoted by Z4,
Wherein the LT direction de-
LT change-out rate = (Z3-Z4) / Z4. 6. The method according to any one of claims 1 to 5,
And a step of measuring a resistance value of the electronic component,
And judging, based on the impedance value and the resistance value, a judgment of both parts of the electronic component. 1. A sorting apparatus for an electronic part including a magnetic material,
Wherein the electronic component is subjected to a demagnetization process after being sorted,
A measuring unit for measuring the impedance value of the electronic component through the measurement terminal by contacting a measurement terminal to which the bias voltage is applied to the external electrode of the electronic component to clean the contact portion of the external electrode in contact with the measurement terminal, ,
A control section for comparing the upper limit selection threshold value and the lower limit threshold value corresponding to the electronic component with the measured impedance value to determine the positive or negative portion of the electronic component;
And a selection unit for selecting the electronic component of the good product based on the determination result of the control unit,
Wherein,
The upper limit selection threshold value and the lower limit selection threshold value are set based on a shipment upper limit threshold value and a shipment lower threshold value for shipment of the electronic component and a shattering lower threshold value for shipment of the electronic component,
Upper limit screening threshold = Shipment upper limit threshold × (1 +
Lower limit screening threshold = Shipment lower limit threshold × (1 +
And the electronic component is selected by the selection unit. A carrier tape having a plurality of receiving holes formed at intervals along a long side direction, an electronic component accommodated in the receiving hole, and a taping electronic component lead forming device for producing a taping electronic component lead having a cover tape covering the receiving hole as,
A carry section for carrying the electronic component to the carrier tape,
A bias voltage is applied between a pair of measurement terminals to be brought into contact with the electronic component in a conveying path of the electronic component in the carry section and is brought into contact with an external electrode of the electronic component, A measuring unit for cleaning a contact portion of the external electrode and measuring a characteristic of the electronic component through the measurement terminal,
A control section for comparing the upper limit selection threshold value and the lower limit threshold value corresponding to the electronic component with the measured impedance value to determine the positive or negative portion of the electronic component;
A selection unit for selecting the electronic component of the good product based on the determination result of the control unit;
A winding portion for winding the taping electronic component lead,
And a demagnetizer disposed between the carry section and the winding section,
Wherein,
The upper limit selection threshold value and the lower limit selection threshold value are set based on a shipment upper limit threshold value and a shipment lower threshold value for shipment of the electronic component and a shattering lower threshold value for shipment of the electronic component,
Upper limit screening threshold = Shipment upper limit threshold × (1 +
Lower limit screening threshold = Shipment lower limit threshold × (1 +
And the tapered electronic component lead is set by the tapered electronic component lead.

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