KR101957715B1 - Round type PION pin with improved contact yield - Google Patents

Abstract

The PION pin of the present invention includes a pad connecting pin which is in contact with a contact pad, a ball connecting pin which is in contact with the conductive ball, an elastic spring which is provided between the pad connecting pin and the ball connecting pin, And a multi-contact auxiliary pin in contact with the ball, forming a multi-contact point. According to the structure of the present invention as described above, it is possible to expect an improvement in the contact yield through the contact contact with the spherical conductive balls in a face-to-face manner.

Description

Round type PION pin with improved contact yield {Round type PION pin with improved contact yield}

[0001] The present invention relates to a PION pin having improved round-type contact yield, and more particularly to a PION pin for electrically connecting a conductive ball of a semiconductor device and a contact pad of a testing device The PION pin dividing the ball hook and the pad hook to be cross-connected into a waiting section and a connecting section and narrowing the gap to a round type in the connecting section in comparison with the waiting section so as to stably contact the ball hook. On the other hand, The present invention relates to a PION pin for opening a pad hook or providing an outer shape of the pad hook as a round type so as to smoothly return to a waiting section in a connection section after completion of a test.

In general, a ball grid array (BGA) type semiconductor device is finally subjected to characteristic measurement or defect inspection through various electrical tests by an inspection apparatus. At this time, a test socket is used to electrically connect the circuit pattern of the inspection printed circuit board provided in the inspection apparatus with the contact ball of the BGA type semiconductor apparatus.

In this test socket, a plurality of probe pins are installed in a predetermined rule in the housing. In recent years, as the number of parts increases and the number of probe pins gradually becomes finer for fast data processing and low power consumption, a conventional probe pin including a pogo pin does not actively respond to a fine pattern, .

Particularly, when the probe pin comes into contact with the conductive ball of the semiconductor device to be inspected, the pair of hooks move from the waiting section to the connection section, and after inspection, return to the waiting section again in the connection section. Is moved from the waiting section to the connection section, the contact is incomplete and the contact failure occurs, so that the smooth inspection can not be performed.

Particularly, since the one-side hook is slid in the rectangular groove of the other hook, a short may occur due to the gap. If no electrical contact is made between the hook and the hook and an electrical path is formed through the elastic spring interposed therebetween, the electrical path becomes longer and the resistance value increases by that much, which may interfere with the inspection.

In addition, the tip which contacts the conductive ball has a problem in that, despite the multi-contact points, the multiple contact points are arranged in a plane and face-to-face with the spherical conductive balls.

KR 10-2016-0042189

SUMMARY OF THE INVENTION Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and it is an object of the present invention to provide a PION pin which is structured as a round type of hook to improve the contact yield.

It is another object of the present invention to provide a PION pin which improves the resistance value so that an electrical signal is transmitted through the shortest path between the conductive ball and the contact pad and is not bypassed through the spring.

It is still another object of the present invention to provide a PION pin structured to change the contact points of the tips to face-to-face with spherical conductive balls.

According to an aspect of the present invention for achieving the above object, a PION pin of the present invention includes: a strip-shaped pad connecting pin in contact with a contact pad of a test apparatus; A ball connection pin in the form of a strip which is orthogonally coupled to the pin, and an elastic spring provided between the pad connection pin and the ball connection pin, wherein the pad connection pin includes a pad A pair of pad hooks having a tip and a round type pad groove in which a gap is gradually narrowed, wherein the ball connection pin includes a ball tip in contact with the conductive ball, and a pair of ball- Wherein the pad hook is inserted into the ball groove, the ball hook is inserted into the pad groove, and the ball hook is engaged with the gap of the round type, The yield is changed.

As described above, according to the configuration of the present invention, the following effects can be expected.

First, since the ball connection pin and the pad connection pin ensure a stable contact without a gap in the connection section, the shortest electrical path is formed between the conductive ball and the contact pad, the electrical signal is not transmitted through the elastic spring, Since the electrical signal is transmitted only through the pair of intersecting pins, it is expected that the contact efficiency is improved and the resistance value is improved.

Second, since the ball hook and the pad hook are fastened through the connection section when the pair of strips are cross-assembled by the hook method, the connection pins are not arbitrarily disengaged and the binding force is strengthened. After the test, The effect of returning smoothly to the initial state is expected by the elasticity of the elastic member.

Third, the electrical contact is strengthened despite the height difference of the conductive ball through the multi-contact edge contact. The multi-contact point is protruded more in the outer contact section than in the inner contact section or longer in the inner inclination section than in the outer contact section By gently forming, it is expected that the ball has a spherical ball-facing surface.

1 is an exploded perspective view showing a configuration of a PION pin according to an embodiment of the present invention;
2 and 3 are an exploded perspective view and a perspective view respectively showing the configuration of the PION pin according to another embodiment of the present invention.
4 is a front view showing a configuration of a round type pad hook according to the present invention.
Fig. 5 is a state of use showing a coupling operation of the pad hook according to the present invention; Fig.
6 is a state of use showing the recovery operation of the pad hook according to the present invention.
7 is a perspective view showing the configuration of an opened pad hook according to the present invention.
8 is a front view showing a configuration of a round type ball hook according to the present invention.
9 and 10 are a perspective view and an exploded perspective view, respectively, showing one configuration of the multi-contact PION pin according to the present invention.
11 and 12 are a perspective view and an exploded perspective view, respectively, showing another configuration of the multi-contact PION pin according to the present invention.

Brief Description of the Drawings The advantages and features of the present invention, and how to achieve them, will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. The dimensions and relative sizes of layers and regions in the figures may be exaggerated for clarity of illustration. Like reference numerals refer to like elements throughout the specification.

Embodiments described herein will be described with reference to plan views and cross-sectional views, which are ideal schematics of the present invention. Thus, the shape of the illustrations may be modified by manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention are not limited to the specific forms shown, but also include changes in the shapes that are produced according to the manufacturing process. Thus, the regions illustrated in the figures have schematic attributes, and the shapes of the regions illustrated in the figures are intended to illustrate specific types of regions of the elements and are not intended to limit the scope of the invention.

Hereinafter, preferred embodiments of the PION pin and the test socket including the same will be described in detail with reference to the accompanying drawings.

Pitch Innovation Pioneer (PION) pins are described for use in final test sockets for convenience of explanation, but are not limited to, and may be used in burn-in test sockets.

The test socket is used for electrically testing a semiconductor device such as a semiconductor integrated circuit device such as a package IC or an MCM or a wafer on which an integrated circuit is formed by connecting a connection terminal (for example, a conductive ball) (For example, a contact pad) of the semiconductor device and the test device.

The test socket includes an insulating lower housing, an upper housing, and a plurality of round-type PION pins coupled to the upper and lower housings. To this end, the upper and lower housings support a round-type PION pin at regular intervals, and a plurality of contact holes are formed to expose a part thereof.

Further, the upper and lower housings can be mounted on a window-shaped rectangular fixed frame. A protective film may be further attached to the upper and lower housings. Of course, a plurality of holes corresponding to the contact holes are also formed in the protective film.

1, the round-type PION pin 300 includes a pad connecting pin 310 for contacting a contact pad of a test apparatus, a ball connecting pin 320 for contacting a conductive ball of the semiconductor device, 310 and an elastic spring 340 installed between the ball connection pin 320 and the ball connection pin 320.

The pad connection pin 310 is in the form of a first strip of a predetermined thickness, which is narrow and long. The first strip has a plane of width (width) and an edge of a short width (thickness). The width of the plane is twice the width of the edge.

The ball connection pin 320 is also in the form of a second strip extending in length compared to the width, and its thickness substantially coincides with the pad connection pin 310.

The pad connection pin 310 can be used alone. However, in order to improve the contact performance, as shown in FIGS. 2 and 3, it may be used in combination with the multi-contact auxiliary pin 330. That is, when the ball connecting pin 320 is used in combination with the multi-contact auxiliary pin 330, it can be in three-dimensional contact with the conductive ball. At this time, the pad connecting pin 310 and the ball connecting pin 320 provide hook coupling in which the first plane and the second plane cross.

In the present invention, since the strips are formed in the form of a plate having a predetermined width and a predetermined thickness, they can be manufactured by using the MEMS process, and a pair of strips are cross- You can expect.

The pad connection pin 310 includes a pad tip 312 having a sharp end in contact with a contact pad at the bottom and a pad groove H1 provided between the pad tip 312 and the ball connection pin 320 And a pad hook 314. Meanwhile, the outer edge of the pad tip 312 may be provided with a pad stopper 316 whose width is extended to support the elastic spring 340.

4, a portion of the first plane is removed from the pad hook 314 to provide a pad groove H1. The pad groove H1 may be divided into a waiting section H1a and a connection section H1b. have. For example, the waiting zone H1a defines where the ball hook 324 is located before testing. Before the test, since the round type PION pin 300 is spaced apart from the conductive ball and the contact pad, the pad connecting pin 310 and the ball connecting pin 320 tend to move away from each other by the elastic spring 340 .

The connection section H1b, on the other hand, refers to where the ball hook 324 is located during the test. During the test, since the round type PION pin 300 is pressed between the conductive ball and the contact pad, the pad connection pin 310 and the ball connection pin 320 tend to be close to each other despite the elastic spring 340 .

5, the ball hook 324 moves from the waiting section H1a to the connection section H1b by the test, and the connection force is strengthened so that the contact is smoothly performed in the connection section H1b There is a reason. To this end, in the embodiment of the present invention, the pad groove H1 is deformed to narrow the gap in the connection section H1b as compared with the waiting section H1a.

That is, the gap L2 of the connection section H1b is made smaller than the gap L1 of the waiting section H1a, and the pad groove H1 has the round (R) type. More specifically, the both side waiting sections H1a are symmetrical about the center connection section H1b.

On the other hand, the outer edge shape of the pad hook 314 is also gradually rounded from the waiting section H1a to the connection section H1b so as to correspond to the change of the round (R) type pad groove H1 .

For example, during the test, the ball hook 324 is in contact with the pad hook 314 in the connection section H1b and then switched to the test waiting state again after the completion of the test. The ball connecting pin 320 and the pad connecting pin 310 must be restored to their original positions by the elastic spring 340. The ball hook H4 of the connection section H1b, It tends not to separate. Therefore, it is necessary to alleviate the rigidity thereof so that it is returned smoothly. For example, as shown in FIG. 6, both the inner pad groove and the outer edge of the pad hook 314 are of the round (R) type.

If the electrical path is not stably formed through the contact of the connection section H1b, the electrical path is formed long through the elastic spring 340, so that the electrical characteristics are deteriorated. In addition, since the outer edge is formed in the round (R) type, there is no possibility of coming into contact with the elastic spring 340, and no electrical path is formed through the elastic spring 340.

In other cases, referring to FIG. 7, the pad hook 314 may be changed from a closed state to an open state to assist return to the initial state after testing. For example, a portion of the pad hook 314 is removed and the pad groove H1 is opened, thereby increasing the degree of freedom of the pair of pad hooks 314. [

The ball connection pin 320 includes a ball tip 322 that is in direct contact with a conductive ball and a pair of ball hooks 324 that are selectively fastened to the pad groove H1. The ball hook 324 further includes a ball stopper 326 extending in its width.

On the other hand, referring to FIG. 8, in the case of the ball connection pin 320, the waiting section and the connection section may be provided to improve the contact yield.

Likewise, due to the round R type of the ball groove H2 that makes the gap L2 of the connection section H2b smaller than the gap L1 of the standby section H2a, the both side waiting sections H2a are positioned at the center And is symmetrical about the connection section H2b.

Referring to FIG. 2 again, the present invention is characterized in that the multi-contact auxiliary pin 330 is further coupled to the ball connection pin 320 to perform electrical inspection. The multi-contact auxiliary pin 330 is connected to the ball tip 322 In order to engage the ball tip 322, an auxiliary groove H3 may be further formed.

The multi-contact auxiliary pin 330 includes an auxiliary tip 332 connected to the conductive ball together with the ball tip 322 and a pair of left and right auxiliary hooks 334 formed to be hooked to the auxiliary groove H3 do. The auxiliary tip 332 has two or more contacts to provide stable contact characteristics despite the alignment tolerance that occurs in contact with the conductive balls.

The elastic spring 340 functions to extend the life of the test socket by absorbing the shock generated by the repetitive test in which a coil spring is used. Both ends of the elastic spring 340 are supported by the pad stopper 316 of the pad connecting pin 310 and the ball stopper 326 of the ball connecting pin 320, respectively.

 When the multi-contact edge contact PION pin 300 and the elastic spring 340 are used, when the conductive ball of the external device is connected to the contact pad of the test apparatus, Even when the size or height of the conductive balls is different, contact fingers do not occur.

The multi-contact assist tip 332 includes at least two (e.g., four) contacts. Similarly, the ball tip 322 also includes at least two contact points.

On the other hand, in the process of forming the conductive balls, a natural oxide film is applied to the surface. The natural oxide film is formed on the bump contact surface to interfere with conduction with the conductive balls of the semiconductor device. Therefore, the electrical inspection is not properly performed and the electrical performance is impaired. Such contact breaks the native oxide film and improves the contact properties with which the conductive balls can come into contact, and fundamentally prevents contact pads.

The multi-contact point is a prism shape in which bone and acid are repeated. Since a plurality of protruding regions are present by the acid and form a contact point, the contact flare can be minimized even if the height deviation of the conductive ball occurs.

Such multi-contact points are formed on both the ball tip 322 and the auxiliary tip 332, and their protruding directions are crossed orthogonally to each other, so that the contacts are formed in the entire area and are not tilted to one side. As a result, there is a stable contact effect such as a circular pillar-shaped pogo pin by crossing.

On the other hand, since the conductive balls are generally provided in a spherical shape, it is desirable that the overall shape is provided in the form of a concave groove while maintaining multi-contact to maintain a stable face-to-face contact with the spherical conductive balls.

9 and 10, the multi-contact assist tip 332 is further protruded in the outer contact section compared to the inner contact section.

Referring to FIGS. 11 and 12, when the multi-contact assistant tip 332 is formed of two pieces, the inner inclined section is formed longer and gentler than the outer inclined section.

The round type PION pin 300 may be formed of a metal such as gold (Au), silver (Ag), copper (Cu), tungsten (W), titanium (Ti), molybdenum (Mo), nickel (Ni) Be, aluminum (Al), or an alloy thereof.

While the present invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiments, In order to solve the problem, it is understood that the configuration is changed to the round type so that the gap is gradually reduced in the connection section where the gap occurs. Many other modifications will be possible to those skilled in the art, within the scope of the basic technical idea of the present invention.

300: PION pin
310: Pad connection pin 320: Ball connection pin
330: multi-contact auxiliary pin 340: elastic spring

Claims (10)

A strip connection pad in contact with the contact pad of the test apparatus;
A strip-shaped ball connecting pin which is in contact with the conductive ball of the semiconductor device and is perpendicular to the pad connecting pin; And
And an elastic spring provided between the pad connection pin and the ball connection pin,
Wherein the pad connecting pin
A pad tip in contact with the contact pad; And
And a pair of pad hooks having round type pad grooves in which a gap is gradually narrowed,
The ball connection pin
A ball tip in contact with the conductive ball; And
And a pair of ball hooks formed with a ball groove therebetween,
Wherein the pad hook is inserted into the ball groove, the ball hook is inserted into the pad groove, and the contact yield is changed according to the gap of the round type. The method according to claim 1,
A ball stopper is formed on an outer side of the ball hook to extend the width of the ball hook and a hook stopper is formed on an outer side of the pad tip to extend the width of the pad tip, And the PION pin is elastically supported on the stopper. The method according to claim 1,
The pad groove is divided into a waiting section and a connection section,
The waiting interval and the connection interval each define a place where the ball hook is located before and during the test,
And the gap of the round type decreases from the standby section to the connection section. The method according to claim 1,
Wherein the pad width of the pad hook is rounded to correspond to the change of the round type pad groove, and the thickness of the PION pin is constant. The method according to claim 1,
Wherein the pad hook is opened to form a pair of pad hooks with the pad groove therebetween. The method according to claim 1,
Wherein the ball groove is of a round type in which a gap is gradually narrowed. The method according to claim 1,
An auxiliary tip connected to the conductive ball with the ball tip; And
Further comprising an auxiliary pin constituted by a pair of auxiliary hooks hooked to the ball tip,
Wherein the auxiliary tip comprises a plurality of contacts formed by repeated bone and acid implantation. delete A pad connection pin in contact with the contact pad;
A ball connecting pin contacting the conductive ball;
An elastic spring installed between the pad connection pin and the ball connection pin; And
And a multi-contact auxiliary pin which is in contact with the ball and is in contact with the ball,
The multi-
An auxiliary tip connected to the conductive ball through the multi-contact point; And
And a pair of auxiliary hooks hooked to the ball connecting pin,
Wherein the multi-contact point further protrudes from the outer contact point section in comparison with the inner contact point section. A pad connection pin in contact with the contact pad;
A ball connecting pin contacting the conductive ball;
An elastic spring installed between the pad connection pin and the ball connection pin; And
And a multi-contact auxiliary pin which is in contact with the ball and is in contact with the ball,
The multi-
An auxiliary tip connected to the conductive ball through the multi-contact point; And
And a pair of auxiliary hooks hooked to the ball connecting pin,
Wherein the multi-contact point is formed to be longer and gentle in the inner slope section than the outer slope section.

Images