KR101945912B1 - Liquid crystalline resin composition - Google Patents

Abstract

A liquid crystalline resin composition having good moldability and low dielectric constant is provided.
The liquid crystalline resin composition according to the present invention contains (A) a liquid crystalline resin and (B) a hollow filler having an aspect ratio of not less than 1.15. (B) is preferably a glass balloon. It is preferable that the content of the component (A) is 60 mass% or more and 95 mass% or less, and the content of the component (B) is 5 mass% or more and 20 mass% or less. The liquid crystalline resin composition according to the present invention preferably further contains (C) a plate-like filler. (C) is preferably a mica. (B) is contained in an amount of 5 mass% or more and 20 mass% or less, and the content of the component (C) is in a range of 0 mass% or more and 20 mass% or less, the content of the component (A) being 60 mass% or more and less than 95 mass% desirable.

Description

Liquid crystalline resin composition

The present invention relates to a liquid crystalline resin composition.

Liquid crystalline resins represented by liquid crystalline polyester resins are widely used as high-performance engineering plastics because they have excellent mechanical strength, heat resistance, chemical resistance and electrical properties in a well-balanced manner and excellent dimensional stability. On the other hand, recent mobile phones; Wireless LAN; Significant technological developments are being made in the field of information and communication such as GPS, VICS (registered trademark), ITS technology such as ETC. Accordingly, the need for a high-performance, high-frequency-compatible electronic component that can be applied in a high frequency range such as a microwave or a milliwave has been strengthened. The materials constituting such electronic parts are required to have appropriate dielectric properties according to the design of the individual electronic parts.

For example, Patent Document 1 discloses a thermoplastic resin composition comprising 90 to 45% by weight of a wholly aromatic liquid-crystalline polyester having a melting point of 320 DEG C or more, 10 to 40% by weight of an inorganic spherical hollow body having an aspect ratio of 2 or less, To 15% by weight of a total aromatic liquid-crystalline polyester resin composition molded product having a dielectric constant of 3.0 or less and a dielectric loss tangent of 0.04 or less obtained by injection molding has excellent heat resistance such as solder reflow solder and excellent dielectric properties , A microwave, a milli-wave, or the like, which is used in a fixing or holding member of a transmitting / receiving part of an information communication device used in a high-frequency band.

[Patent Document 1] Japanese Unexamined Patent Publication No. 2004-27021

However, according to the investigations of the present inventors, it has been found that the conventional liquid crystalline resin composition containing a hollow filler such as an inorganic spherical hollow body has a remarkably high melt viscosity and poor fluidity. Here, the increase in the melt viscosity of the liquid crystalline resin composition does not mean an increase in the self-molecular weight of the liquid crystalline resin constituting the liquid crystalline resin composition and an improvement in heat resistance. Therefore, when the molding temperature is set to be high in accordance with the increase of the melt viscosity of the liquid crystalline resin composition, decomposition of the liquid crystalline resin is caused, and therefore, it is not preferable to improve the moldability of the liquid crystalline resin composition.

The present invention has been made in order to solve the above problems, and an object of the present invention is to provide a liquid crystalline resin composition having a good moldability and a low dielectric constant.

DISCLOSURE OF THE INVENTION The present inventors have conducted intensive studies in order to solve the above problems. As a result, it was found that by using a hollow filler having an aspect ratio of 1.15 or more, an increase in melt viscosity and deterioration in fluidity are suppressed, and a liquid crystalline resin composition having a low dielectric constant with good moldability is obtained. More specifically, the present invention provides the following.

(1) A liquid crystalline resin composition containing (A) a liquid crystalline resin and (B) a hollow filler having an aspect ratio of not less than 1.15.

(2) The composition according to (1), wherein component (B) is a glass balloon.

(3) The composition according to (1) or (2), wherein the content of the component (A) is 60 mass% or more and 95 mass% or less, and the content of the component (B) is 5 mass% or more and 20 mass% or less.

(4) A composition according to (1) or (2), further comprising (C) a flaky filler.

(5) The composition according to (4), wherein component (C) is a mica.

(6) The positive resist composition as described in the above item (1), wherein the content of the component (A) is 60% by mass or more and less than 95% by mass, the content of the component (B) is 5% by mass or more and 20% by mass or less, (4) or (5).

According to the present invention, it is possible to provide a liquid crystalline resin composition having a good moldability and a low dielectric constant.

1 (a) to 1 (c) are graphs showing the ratio (L / S) calculated for individual particles of the glass balloons 1 to 3 to be described later (where L is the maximum length of the longest portion on the particle projection plane And S represents a maximum vertical length S which is the length of the longest portion in the direction perpendicular to the maximum length L in the particle projection plane).
2 is a top view showing cut positions of test pieces for measurement of relative dielectric constant used in Examples and Comparative Examples.

Hereinafter, an embodiment of the present invention will be described. However, the present invention is not limited to the following embodiments.

<Liquid Crystalline Resin Composition>

The liquid crystalline resin composition according to the present invention contains (A) a liquid crystalline resin and (B) a hollow filler having an aspect ratio of not less than 1.15.

[(A) Liquid crystalline resin]

The liquid crystalline resin (A) used in the present invention refers to a melt processible polymer having properties capable of forming an optically anisotropic melt phase. The properties of the anisotropic molten phase can be confirmed by an ordinary polarization test using an orthogonal polarizer. More specifically, confirmation of the anisotropic molten phase can be carried out by observing a molten sample put on a Leitz hot stage at a magnification of 40 times under a nitrogen atmosphere using a Leitz polarization microscope. The liquid crystalline polymer which can be applied to the present invention exhibits optically anisotropic properties when examined between orthogonal polarizers, for example, in the case of the molten halt state, in which the polarized light is usually transmitted.

The kind of the liquid crystalline resin (A) is not particularly limited, and is preferably an aromatic polyester and / or an aromatic polyester amide. Also included are polyesters that partially contain an aromatic polyester and / or an aromatic polyester amide in the same molecular chain. The liquid crystalline resin (A) preferably has a logarithmic viscosity (IV) of at least about 2.0 dl / g, more preferably 2.0 to 10.0 dl / g when dissolved in pentafluorophenol at a concentration of 0.1 mass% ) Is preferably used.

The aromatic polyester or aromatic polyester amide (A) which can be applied to the present invention is particularly preferably at least one selected from the group consisting of aromatic hydroxycarboxylic acids, aromatic hydroxyamines, and aromatic diamines Is an aromatic polyester or an aromatic polyester amide having, as a constituent component, a constituent unit derived from one kind of compound.

More specifically,

(1) a polyester comprising a constitutional unit derived from at least one of mainly an aromatic hydroxycarboxylic acid and a derivative thereof;

(2) a structural unit derived from at least one of (a) an aromatic hydroxycarboxylic acid and a derivative thereof, (b) a structural unit derived from an aromatic dicarboxylic acid, an alicyclic dicarboxylic acid, A constituent unit derived from two or more kinds of monomers, and (c) a constituent unit derived from at least one or more kinds of aromatic diols, alicyclic diols, aliphatic diols and derivatives thereof;

(3) at least one structural unit derived from at least one of (a) an aromatic hydroxycarboxylic acid and a derivative thereof, (b) one or more kinds of aromatic hydroxamines, aromatic diamines, and derivatives thereof And (c) a constituent unit derived from one or more of aromatic dicarboxylic acid, alicyclic dicarboxylic acid, and derivatives thereof;

(4) a resin composition comprising a structural unit derived from at least one of (a) an aromatic hydroxycarboxylic acid and a derivative thereof, and (b) a structural unit derived from one or more kinds of aromatic hydroxamines, aromatic diamines, (C) a structural unit derived from at least one of an aromatic dicarboxylic acid, an alicyclic dicarboxylic acid, and derivatives thereof; (d) a structural unit derived from an aromatic diol, an alicyclic diol, an aliphatic diol , And a structural unit derived from at least one kind or two or more kinds of these derivatives. In addition, a molecular weight regulator may be used in combination with the above-mentioned components as needed.

Preferable examples of the specific compound constituting the liquid crystalline resin (A) applicable to the present invention include aromatic hydroxycarboxylic acids such as p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid, Dihydroxynaphthalene, 1,4-dihydroxynaphthalene, 4,4'-dihydroxybiphenyl, hydroquinone, resorcin, a compound represented by the following formula (I) Aromatic diols such as compounds to be displayed; Aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, 4,4'-diphenyldicarboxylic acid, 2,6-naphthalenedicarboxylic acid, and compounds represented by the following general formula (III); aromatic amines such as p-aminophenol, p-phenylenediamine, and 4-acetoxyaminophenol.

(X is a group selected from the group consisting of alkylene (C ₁ -C ₄ ), alkylidene, -O-, -SO-, -SO ₂ -, -S-, and -CO-)

(Y is a group selected from - (CH ₂ ) _n - (n = 1 to 4) and -O (CH ₂ ) _n O- (n = 1 to 4)

The liquid crystalline resin (A) used in the present invention can be prepared by a known method from the above-mentioned monomer compound (or mixture of monomers) directly using a polymerization method or an ester exchange method. Usually, A slurry polymerization method or the like is used. The above-mentioned compounds having an ester-forming ability can be used for polymerization in the form of the ester, and may be those modified from the precursor to the ester-forming derivative in the pre-polymerization stage. Diaryl tin oxide, titanium dioxide, alkoxytitanium silicates, titanium alcohols, alkali and alkaline earth metal salts of carboxylic acids, BF ₃ , and the like. And the like. The amount of the catalyst to be used is generally about 0.001 to 1 mass%, particularly about 0.01 to 0.2 mass%, based on the total mass of the monomer. If necessary, the polymer produced by these polymerization methods can be increased in molecular weight by solid state polymerization which is carried out under reduced pressure or in an inert gas.

The melt viscosity of the liquid crystalline resin (A) obtained by the above-mentioned method is not particularly limited. Generally, those having a melt viscosity at a molding temperature of 10 MPa or more and 600 MPa or less at a shear rate of 1000 sec ^-1 can be used. However, a very high viscosity per se is not preferable because the fluidity is extremely deteriorated. The liquid crystalline resin (A) may be a mixture of two or more liquid crystalline resins.

The content of the component (A) in the liquid crystalline resin composition according to the present invention is preferably 60% by mass or more and 95% by mass or less, more preferably 64% by mass or more and 93% by mass or less, still more preferably 69% Or more and 90 mass% or less. Particularly when the liquid crystalline resin composition according to the present invention contains (C) a plate-like filler, the content of the component (A) in the liquid crystalline resin composition according to the present invention is preferably 60% by mass or more and less than 95% More preferably 64 mass% or more and 93 mass% or less, further preferably 69 mass% or more and 90 mass% or less. When the content of the component (A) is 60 mass% or more, the fluidity of the composition during melting tends to be improved. When the content of the component (A) is 95% by mass or less or 95% by mass or less, the content of the component (B) becomes sufficient, and the obtained liquid crystalline resin composition tends to have a low dielectric constant.

[(B) Hollow filler having an aspect ratio of 1.15 or more]

(B) The hollow filler is generally called a balloon. Examples of the material of the hollow spheres include inorganic materials such as alumina, silica and glass; Organic materials such as urea resin and phenol resin; . Of these, glass is preferable from the viewpoint of heat resistance and strength. That is, as the hollow filler, a glass balloon is commonly used. The component (B) may be used alone or in combination of two or more.

(B) The hollow filler has an aspect ratio of 1.15 or more, so that the anisotropy is larger than that of the hollow filler having an aspect ratio of less than 1.15. Therefore, in the composition containing the hollow filler (B), it is presumed that the high molecular orientation property which exerts the good fluidity of the liquid crystalline resin is not easily disturbed, so that the increase of the melt viscosity and the deterioration of the fluidity are liable to be suppressed.

The aspect ratio of the hollow filler (B) is preferably 1.15 or more, more preferably 1.20 or more and 2.00 or less, more preferably 1.22 or more and 1.50 or less, from the viewpoints of increase in melt viscosity, And preferably 1.25 or more and less than 1.30.

In the present specification, as the aspect ratio, the maximum length (L), which is the length of the longest portion in the particle projection plane, and the longest length in the direction perpendicular to the maximum length (L) The maximum vertical length (S), which is the length of the portion, is measured for 3,000 particles and the measurement is repeated several times to take an average value of the calculated ratio (L / S) for each particle.

From the viewpoint of moldability, the average particle diameter of the component (B) is preferably 5 占 퐉 or more, more preferably 10 占 퐉 or more, and from the viewpoint of inhibition of breakage of the component (B) Is not more than 200 mu m, more preferably not more than 100 mu m, further preferably not more than 50 mu m. In the present specification, the average particle diameter of the component (B) is a value (D50) measured by a laser diffraction / scattering type particle size distribution measurement method.

The content of the component (B) in the liquid crystalline resin composition according to the present invention is preferably 5 mass% or more and 20 mass% or less, more preferably 7 mass% or more and 18 mass% or less, further preferably 10 mass% Or more and 15 mass% or less. When the content of the component (B) is 5 mass% or more, the resulting liquid crystalline resin composition tends to have a low dielectric constant. When the content of the component (B) is 20 mass% or less, the fluidity of the composition during melting tends to be improved.

[(C) Platelet Filler]

The liquid crystalline resin composition according to the present invention may optionally contain (C) a plate filler. (C) The plate-shaped filler acts as a warpage-suppressing filler in a molded article of the liquid crystalline resin composition. The component (C) may be used alone, or two or more kinds thereof may be used in combination.

According to the investigations of the present inventors, it has been found that the conventional liquid crystalline resin composition containing a hollow filler provides a molded product having a large warpage and that the antireflection filler such as a plate- It has been found that further addition to the composition causes the fluidity to gradually deteriorate. However, the liquid crystalline resin composition according to the present invention can be obtained by using (B) a hollow filler having an aspect ratio of not less than 1.15, and (C) even when a plate filler is added, warping of the molded product can be reduced And excellent dimensional stability.

The (C) plate-like filler preferably has an average particle diameter of 15 to 50 mu m. If the average particle diameter is 15 m or more, the necessary mechanical strength is easily ensured, and the effect of suppressing the warp of the molded article tends to be enhanced. When the average particle diameter is 50 m or less, the fluidity of the composition during melting tends to be improved. The average particle diameter is preferably 20 to 30 占 퐉. In this specification, the average particle diameter of the component (C) employs the value (MV) measured by the laser diffraction / scattering particle size distribution measurement method.

(C) The plate-like filler is not particularly limited, and examples thereof include mica, talc, glass flake, graphite, various metal foils (for example, aluminum foil, steel foil and copper foil). In the present invention, it is preferable to use mica as the component (C).

The content of the component (C) in the liquid crystalline resin composition according to the present invention is preferably not less than 0 mass% and not more than 20 mass%, more preferably not less than 5 mass% nor more than 18 mass%, further preferably not more than 10 mass% % To 16% by mass or less. If the content of the component (C) is more than 0% by mass, the required mechanical strength tends to be secured, and the effect of suppressing warping of the molded article tends to be enhanced. When the content of the component (C) is 20 mass% or less, the fluidity of the composition during melting tends to be improved.

[Other ingredients]

To the liquid crystalline resin composition according to the present invention may be added other polymers, other fillers, generally known additives added to synthetic resins, such as stabilizers such as antioxidants and ultraviolet absorbers, Colorants such as dyes and pigments, lubricants, release agents, crystallization accelerators, crystal nucleating agents and the like can be suitably added in accordance with required performance.

As the other polymer, for example, an epoxy group-containing copolymer may be mentioned. Other fillers refer to fillers other than (B) hollow fillers and (C) plate fillers, for example, fibrous fillers such as glass fibers; Particulate fillers such as silica; Carbon black.

[Preparation of liquid crystalline resin composition]

The preparation of the liquid crystalline resin composition according to the present invention is not particularly limited. For example, the component (A), the component (B), the optional component (C) and any other component are blended and melt-kneaded using a single screw or twin screw extruder to obtain a liquid crystalline resin composition Preparation is made.

[Liquid crystalline resin composition]

The liquid crystalline resin composition according to the present invention thus obtained has a melt viscosity of preferably 45 Pa · sec or less, more preferably 42 Pa · sec or less, and still more preferably 40 Pa · sec or less. The fact that the liquidity at the time of melting is high and the formability is excellent is one of the characteristics of the liquid crystalline resin composition according to the present invention. In this specification, the melt viscosity is a value obtained by a measurement method in accordance with ISO 11443 at a cylinder temperature and a shear rate of 1000 sec ^-1 , which is 10 to 30 ° C higher than the melting point of the liquid crystalline resin.

The liquid crystalline resin composition according to the present invention has a relative dielectric constant of preferably 3.2 or less, more preferably 3.1 or less, still more preferably 3.0 or less. The low dielectric constant is one of the characteristics of the liquid crystalline resin composition according to the present invention.

[ Example ]

Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited to these Examples.

<Liquid Crystalline Resin>

Liquid crystalline polyester amide resin (LCP1)

The following materials were charged into the polymerization vessel, the temperature of the reaction system was raised to 140 캜, and the reaction was carried out at 140 캜 for 1 hour. Thereafter, the temperature was further raised to 340 ° C. over a period of 4.5 hours, and thereafter, the pressure was reduced to 10 Torr (ie, 1330 Pa) over 15 minutes from there, and while the acetic acid, excess acetic anhydride and other low boiling components were distilled, Respectively. After the stirring torque reached a predetermined value, nitrogen was introduced to change the pressure from the reduced pressure state to the atmospheric pressure state. The polymer was discharged from the lower part of the polymerization vessel, and the strands were pelletized to obtain pellets. The obtained pellets were heat-treated at 300 DEG C for 2 hours in a nitrogen stream to obtain a desired polymer. The melting point of the obtained polymer was 334 ° C, and the melt viscosity at 350 ° C was 19.0 Pa · sec. The melt viscosity of the polymer was measured in the same manner as the melt viscosity measurement method described later.

(I) 4-hydroxybenzoic acid (HBA); 188.4 g (60 mol%)

(II) 2-hydroxy-6-naphthoic acid (HNA); 21.4 g (5 mol%)

(III) terephthalic acid (TA); 66.8 g (17.7 mol%)

(IV) 4,4'-dihydroxybiphenyl (BP); 52.2 g (12.3 mol%)

(V) 4-acetoxyaminophenol (APAP); 17.2 g (5 mol%)

Metal catalyst (potassium acetate catalyst); 15 mg

Acylating agent (acetic anhydride); 226.2 g

· Liquid crystalline polyester resin (LCP2)

The following materials were put into the polymerization vessel, the temperature of the reaction system was raised to 140 캜, and the reaction was carried out at 140 캜 for 1 hour. Then, the temperature was further raised to 360 ° C over 5.5 hours, from there, the pressure was reduced to 5 Torr (i.e., 667 Pa) over 30 minutes, and melt polymerization was carried out while distilling acetic acid, excess acetic anhydride and other low- After the stirring torque reached a predetermined value, nitrogen was introduced to change the pressure from the reduced pressure state to the atmospheric pressure state. The polymer was discharged from the lower part of the polymerization vessel, and the strands were pelletized to obtain pellets. The obtained pellets were heat-treated at 300 DEG C for 8 hours in a nitrogen stream to obtain the desired polymer. The melting point of the obtained polymer was 352 ° C and the melt viscosity at 380 ° C was 27.0 Pa · s. The melt viscosity of the polymer was measured in the same manner as the melt viscosity measurement method described later.

(I) 2-hydroxy-6-naphthoic acid (HNA); 166 g (48 mol%)

(II) terephthalic acid (TA); 76 g (25 mol%)

(III) 4,4'-dihydroxybiphenyl (BP); 86g (25 mol%)

(IV) 4-hydroxybenzoic acid (HBA); 5 g (2 mol%)

Metal catalyst (potassium acetate catalyst); 22.5 mg

Acylating agent (acetic anhydride); 191 g

&Lt; Materials other than the liquid crystalline resin &

Glass balloons 1: Y12000 (product of Seishin Co., Ltd., aspect ratio (average) 1.264, average particle diameter (D50) 35 占 퐉)

Glass balloons 2: S60HS (Sumitomo 3M Co., Ltd., aspect ratio (average) 1.091, average particle diameter (D50) 24 占 퐉)

Glass balloon 3: im30K (product of Sumitomo 3M Co., Ltd., aspect ratio (average) 1.072, average particle diameter (D50) 18 占 퐉)

Plate filler: AB-25S (mica, product of Yamaguchi Mica Co., average particle size (MV) 24 m)

Fiber filler: ECS03T-786H (glass fiber, fiber 10 μm, length 3 mm, strand made by Nippon Denshikarasu Co., Ltd.)

&Lt; Production of liquid crystalline resin composition >

The above components were melt-kneaded at the following cylinder temperature using a twin-screw extruder (TEX30? Type, manufactured by Nippon Steel Co., Ltd.) in the ratios shown in Table 1 to obtain liquid crystalline resin composition pellets.

[Manufacturing Conditions]

Cylinder temperature:

 350 占 폚: In the case of the liquid crystalline resin composition containing the liquid crystalline polyester amide resin (LCP1)

 370 DEG C: In the case of the liquid crystalline resin composition containing the liquid crystalline polyester resin (LCP2)

&Lt; Measurement of Aspect Ratio of Glass Balloons >

3,000 glass balloon particles were measured using a dynamic image analyzing method / particle state analyzer &quot; PITA-3 &quot; of Seishin Enterprise Co., Ltd. using the optical lens having a magnification of 4 times and equipped with the analytical system The maximum length L as the length of the long portion and the maximum vertical length S as the longest length in the direction perpendicular to the maximum length L in the projection plane of the particle were measured. These measurements were repeated several times to show the frequency distribution of the ratio (L / S) calculated for each particle in the histogram, and the average value of the ratio (L / S) was calculated and used as the aspect ratio of the glass balloon. In the measurement, the glass balloon was diluted with a diluting aqueous solution containing an appropriate amount of a surfactant, the concentration of the glass balloon was adjusted to 3.3 mg / mL, and the glass balloon was dispersed in the aqueous solution by ultrasonic cleaning to obtain a glass balloon dispersion , And such a glass balloon dispersion liquid was used as a measurement sample. 1 (a) to 1 (c) are histograms showing a frequency distribution of the ratio (L / S) and an accumulated frequency distribution calculated for the individual particles of the glass balloons 1 to 3, respectively.

&Lt; Melting point &

The melt viscosity of the liquid crystalline resin compositions of Examples and Comparative Examples was measured using the pellets. More specifically, by a capillary rheometer (Capilograph 1D: piston diameter 10 mm, manufactured by Toyo Seiki Seisakusho Co., Ltd.), the shear rate is 1000 sec ^-1 at a temperature 10 to 30 캜 higher than the melting point of the liquid crystalline resin Were measured according to ISO 11443. The results are shown in Table 1. &lt; tb &gt;&lt; TABLE &gt; For the measurement, an orifice having an inner diameter of 1 mm and a length of 20 mm was used. The specific measurement temperature was 350 占 폚 for the liquid crystalline resin composition containing the liquid crystalline polyester amide resin (LCP1) and 380 占 폚 for the liquid crystalline resin composition containing the liquid crystalline polyester resin (LCP2). The results are shown in Table 1.

&Lt; Floor Plan (Flatness) >

The pellets of Examples and Comparative Examples were molded under the following molding conditions using a molding machine ("SE-100 DU" manufactured by Sumitomo Heavy Industries, Ltd.) to produce five sheets of flat test pieces of 80 mm x 80 mm x 1 mm Respectively. The first plate-like test piece was placed on a horizontal plane, and the height from the horizontal plane was measured at nine places on the flat plate by using a CNC image measuring machine (model: QVBHU404-PRO1F) manufactured by Mitsutoyo Co., Ltd. , And the average height was calculated from the obtained measurement values. The position at which the height was measured was a square having a side of 74 mm on the principal plane of the flat test specimen so that the distance from each side of the main plane was 3 mm and the center of each square of this square, , And the position corresponding to the intersection of two diagonal lines of the square. A height from the horizontal plane being equal to the average height and a plane parallel to the horizontal plane being a reference plane. Among the heights measured at the nine places, the maximum height and the minimum height from the reference plane were selected and the difference between them was calculated. In the same manner, the above-mentioned difference was also calculated for the other four flat plate test pieces, and the obtained five values were averaged to obtain the flatness value. The results are shown in Table 1.

〔Molding conditions〕

Cylinder temperature:

350 占 폚: In the case of the liquid crystalline resin composition containing the liquid crystalline polyester amide resin (LCP1)

370 DEG C: In the case of the liquid crystalline resin composition containing the liquid crystalline polyester resin (LCP2)

Mold temperature: 80 ℃

Injection speed: 33mm / sec

Holding pressure: 60 MPa

<Relative dielectric constant>

The pellets of Examples and Comparative Examples were molded under the following molding conditions using a molding machine ("SE-100 DU" manufactured by Sumitomo Heavy Industries, Ltd.) to produce flat test specimens of 80 mm x 80 mm x 1 mm. As shown in Fig. 2, a specimen of 80 mm x 1 mm x 1 mm was cut from the center of the plate-like test piece in the direction perpendicular to the flow, and this was used as a test piece for measuring the relative permittivity. The dielectric constant of the test piece at 1 GHz was measured using a complex dielectric constant evaluation device of cavity resonance method of the following Kantou Electronics Application Development Co., Ltd.

Scalar Network Analyzer: Agilent Technologies 8757D

Frequency Synthesizer: Agilent Technologies 83650L Sweep CW Generator

Fixed Attenuator: Agilent Technologies 85025D Detector

Cavity resonator: KanTou electronics application development CP431

Measurement program: KanTou electronics application development CPMA-S2 / V2

〔Molding conditions〕

Cylinder temperature:

350 占 폚: In the case of the liquid crystalline resin composition containing the liquid crystalline polyester amide resin (LCP1)

370 DEG C: In the case of the liquid crystalline resin composition containing the liquid crystalline polyester resin (LCP2)

Mold temperature: 80 ℃

Injection speed: 33mm / sec

Holding pressure: 60 MPa

 As is clear from the results shown in Table 1, the liquid crystalline resin composition of the examples had good moldability and a low dielectric constant. In addition, the liquid crystalline resin composition of the examples maintained good moldability even when mica was added.

Claims (6)

A liquid crystal resin composition comprising (A) a liquid crystalline resin and (B) a hollow filler having an aspect ratio of not less than 1.15, and the component (B)
The aspect ratio is calculated by using a dynamic image analysis method and a particle state analyzer so that the maximum length L as the longest portion in the particle projection plane and the maximum length L in the direction perpendicular to the maximum length L (L / S) calculated for each particle by repeatedly measuring the maximum vertical length (S), which is the length of the particle,
And a melt viscosity of less than 45 Pa · sec. The method according to claim 1,
Wherein the content of the component (A) is 60 mass% or more and 95 mass% or less, and the content of the component (B) is 5 mass% or more and 20 mass% or less. The method according to claim 1,
(C) a plate filler. The method of claim 3,
(C) is a mica. The method according to claim 3 or 4,
Wherein the content of the component (A) is from 60 mass% to less than 95 mass%, the content of the component (B) is from 5 mass% to 20 mass%, and the content of the component (C) is from 0 mass% to 20 mass% . delete

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