KR101927695B1 - Method for correcting pose of transfer robot - Google Patents

Abstract

The present invention relates to a method of correcting the posture of a substrate carrying robot. A method of correcting the posture of the transfer robot includes a hand on which a substrate is placed, a first motor for rotating the hand about the X axis, a second motor for rotating the hand about the Y axis, The second motor, and the third motor in accordance with the measured value of the hand, and the third robot is provided with a third motor for correcting the posture of the hand, The hand is rotated by the motor to correct the posture of the hand. This allows automatic correction of the hand position to the correct position.

Description

[0001] The present invention relates to a method for correcting a posture of a transfer robot,

The present invention relates to a method of correcting the posture of a substrate carrying robot.

Various processes such as photolithography, etching, ashing, thin film deposition, and cleaning process are performed on the semiconductor device and the flat panel display panel. These processes are performed in various process chambers, and the carrying robot carries the substrates to the respective process chambers in accordance with the process sequence.

Generally, the carrying robot includes a hand for supporting a substrate. 1 is a perspective view showing a general hand. Referring to Figure 1, the hand has a seating surface on which the substrate rests. The hand can move linearly on each of the X, Y, and Z axes (three axes below), and can rotate based on each of the three axes.

However, a hand is a structure in which various parts are connected, and a supporting member for supporting a hand is also a structure in which various parts are connected. As a result, in the process of transporting the substrate, the parts may be aged and vibrated, and thus the hand may be out of the normal operation.

In the case where the substrate is transported in a state where the hand is out of the stationary state, the substrate can be seated at a position out of the correct position. This can cause the substrate to be tilted or to be dropped or damaged without being seated. Also, even if the substrate is seated on the supporting member, a process failure of the substrate may occur.

Accordingly, an attitude correcting operation capable of adjusting the substrate to the correct position is performed. The hand can be linearly moved in three axes and rotated in the Z axis by the driving member, but the rotational movement with respect to each of the X axis and the Y axis is moved by the bolt adjustment. Therefore, it is troublesome for the operator to adjust the height of the hand by adjusting the position and tightening strength of the bolt each time.

In addition, the criteria for setting the right price of a hand vary according to the worker, and a method for unification is required.

The present invention provides a method of automatically correcting a posture of a hand.

According to the embodiment of the present invention, there is provided a method of correcting an orientation of a substrate carrying robot. A method of correcting the posture of the transfer robot includes a hand on which a substrate is placed, a first motor for rotating the hand about the X axis, a second motor for rotating the hand about the Y axis, The second motor, and the third motor in accordance with the measured value of the hand, and the third robot is provided with a third motor for correcting the posture of the hand, The hand is rotated by the motor to correct the posture of the hand.

The measurement member includes a jig plate having the same shape as the substrate, and a light emitting member fixedly coupled to the jig plate and emitting a laser. Wherein the measuring member further comprises a light receiving member for receiving the laser, wherein the first motor, the second motor, and the third motor are connected to receive the measured information from the light receiving member, Can be controlled. The light emitting member emits the laser in a direction different from the Z axis, and correcting the posture of the hand may include correcting the height posture of the hand. The correction of the height posture of the hand may include an X-axis rotation operation for rotating the hand with respect to the X-axis in the state of emitting the laser, a Y-axis rotation operation for rotating the hand about the Y- And a Z-axis rotation operation for rotating the reference Z-axis. Wherein the light emitting member emits the laser in each of a height direction toward the Z axis and a horizontal direction different from the Z axis, and correcting the posture of the hand corrects the horizontal posture of the hand through the height direction, The height posture of the hand can be corrected through the direction.

In addition, correcting the horizontal posture of the hand may include an X-axis movement operation for linearly moving the hand on the X-axis in the state of emitting the laser, a Y-axis movement operation for linearly moving the hand on the Y- A Z-axis movement operation in which the hand is linearly moved in the Z-axis, and the Z-axis movement operation in which the hand is straightened in the Z- A Y axis rotation operation for rotating the hand about the Z axis, and a Z axis rotation operation for rotating the hand about the Z axis.

According to the embodiment of the present invention, the hand is capable of linear movement and rotational movement in three axes by the driving member. As a result, it is possible to automatically correct the hand posture to the normal position.

Further, according to the embodiment of the present invention, a jig plate on which the light emitting member is mounted is seated on the hand. The light emitting member irradiates the laser, receives the laser beam to be irradiated, and measures the position of the hand. Since the laser has a straightness, it can accurately measure the attitude of the hand and correct it to the correct posture.

1 is a perspective view showing a substrate placed on a general hand.
2 is a top view of a substrate processing apparatus according to an embodiment of the present invention.
Fig. 3 is a view of the equipment of Fig. 2 viewed from the direction AA.
Fig. 4 is a view of the equipment of Fig. 2 viewed from the BB direction. Fig.
Fig. 5 is a view of the equipment of Fig. 2 viewed from the CC direction.
FIG. 6 is a perspective view showing the substrate transport apparatus of FIG. 2. FIG.
7 is a plan view showing the carrying robot shown in Fig.
8 is a perspective view showing the jig plate seated on the hand of Fig. 7;
Fig. 9 is a side view showing a light receiving member for receiving the laser beam emitted from the light emitting member of Fig. 8; Fig.
10 is a sectional view showing the posture correcting process of the carrying robot of FIG.
11 is a cross-sectional view showing another embodiment of the posture correcting process of the carrying robot of FIG.

Hereinafter, embodiments of the present invention will be described in more detail with reference to FIGS. 2 to 11 attached hereto. The embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited to the following embodiments. This embodiment is provided to more fully describe the present invention to those skilled in the art. Thus, the shape of the elements in the figures has been exaggerated to emphasize a clearer description.

The facility of this embodiment is used to perform a photolithography process on a substrate such as a semiconductor wafer or a flat panel display panel. In particular, the apparatus of this embodiment is connected to an exposure apparatus and is used to perform a coating process and a developing process on a substrate. Hereinafter, a case where a wafer is used as a substrate will be described as an example.

FIG. 2 is a view of the substrate processing apparatus viewed from above, FIG. 3 is a view of the apparatus of FIG. 2 viewed from the direction AA, FIG. 3 is a view of the apparatus of FIG. 2 viewed from the BB direction, In the CC direction.

2 to 5, the substrate processing apparatus 1 includes a load port 100, an index module 200, a first buffer module 300, a coating and developing module 400, a second buffer module 500 An exposure pre- and post-processing module 600, and an interface module 700. The load port 100, the index module 200, the first buffer module 300, the application and development module 400, the second buffer module 500, the pre-exposure processing module 600, and the interface module 700, Are sequentially arranged in one direction in a single direction.

Hereinafter, the load port 100, the index module 200, the first buffer module 300, the coating and developing module 400, the second buffer module 500, the pre-exposure processing module 600, 700 are referred to as a first direction 12 and a direction perpendicular to the first direction 12 as viewed from above is referred to as a second direction 14 and a direction in which the first direction 12 and the second And a direction perpendicular to the direction 14 is referred to as a third direction 16.

The substrate W is moved in a state accommodated in the cassette 20. At this time, the cassette 20 has a structure that can be sealed from the outside. For example, as the cassette 20, a front open unified pod (FOUP) having a door at the front can be used.

Hereinafter, the load port 100, the index module 200, the first buffer module 300, the application and development module 400, the second buffer module 500, the pre-exposure processing module 600, 700 will be described in detail.

The load port 100 has a mounting table 120 on which the cassette 20 accommodating the substrates W is placed. A plurality of mounts 120 are provided, and the mounts 200 are arranged in a line along the second direction 14. [ In Fig. 1, four placement tables 120 are provided.

The index module 200 transfers the substrate W between the cassette 20 placed on the table 120 of the load port 100 and the first buffer module 300. The index module 200 has a frame 210, an index robot 220, and a guide rail 230. The frame 210 is provided generally in the shape of an inner rectangular parallelepiped and is disposed between the load port 100 and the first buffer module 300. The frame 210 of the index module 200 may be provided at a lower height than the frame 310 of the first buffer module 300 described later. The index robot 220 and the guide rail 230 are disposed within the frame 210. The index robot 220 is moved in the first direction 12, the second direction 14 and the third direction 16 so that the hand 221 that directly handles the substrate W can be moved and rotated in the first direction 12, the second direction 14, . The index robot 220 has a hand 221, an arm 222, a support 223, and a pedestal 224. The hand 221 is fixed to the arm 222. The arm 222 is provided with a stretchable structure and a rotatable structure. The support base 223 is disposed along the third direction 16 in the longitudinal direction. The arm 222 is coupled to the support 223 to be movable along the support 223. The support 223 is fixedly coupled to the pedestal 224. The guide rails 230 are provided so that their longitudinal direction is arranged along the second direction 14. The pedestal 224 is coupled to the guide rail 230 so as to be linearly movable along the guide rail 230. Further, although not shown, the frame 210 is further provided with a door opener for opening and closing the door of the cassette 20.

The first buffer module 300 has a frame 310, a first buffer 320, a second buffer 330, a cooling chamber 350, and a first buffer robot 360. The frame 310 is provided in the shape of an inner rectangular parallelepiped and is disposed between the index module 200 and the application and development module 400. The first buffer 320, the second buffer 330, the cooling chamber 350, and the first buffer robot 360 are located within the frame 310. The cooling chamber 350, the second buffer 330, and the first buffer 320 are sequentially disposed in the third direction 16 from below. The second buffer 330 and the cooling chamber 350 are located at a height corresponding to the coating module 401 of the coating and developing module 400 described later and the coating and developing module 400 at a height corresponding to the developing module 402. [ The first buffer robot 360 is spaced apart from the second buffer 330, the cooling chamber 350 and the first buffer 320 by a predetermined distance in the second direction 14.

The first buffer 320 and the second buffer 330 temporarily store a plurality of substrates W, respectively. The second buffer 330 has a housing 331 and a plurality of supports 332. The supports 332 are disposed within the housing 331 and are provided spaced apart from each other in the third direction 16. One substrate W is placed on each support 332. The housing 331 is constructed so that the index robot 220, the first buffer robot 360 and the developing robot 482 of the developing module 402 described later mount the substrate W on the support 332 in the housing 331 (Not shown) in the direction in which the index robot 220 is provided, in the direction in which the first buffer robot 360 is provided, and in the direction in which the developing robot 482 is provided, so that the developing robot 482 can carry it in or out. The first buffer 320 has a structure substantially similar to that of the second buffer 330. The housing 321 of the first buffer 320 has an opening in a direction in which the first buffer robot 360 is provided and in a direction in which the application unit robot 432 located in the application module 401 described later is provided. The number of supports 322 provided in the first buffer 320 and the number of supports 332 provided in the second buffer 330 may be the same or different. According to one example, the number of supports 332 provided in the second buffer 330 may be greater than the number of supports 322 provided in the first buffer 320.

The first buffer robot 360 transfers the substrate W between the first buffer 320 and the second buffer 330. The first buffer robot 360 has a hand 361, an arm 362, and a support base 363. The hand 361 is fixed to the arm 362. The arm 362 is provided in a stretchable configuration so that the hand 361 is movable along the second direction 14. The arm 362 is coupled to the support 363 so as to be linearly movable along the support 363 in the third direction 16. The support base 363 has a length extending from a position corresponding to the second buffer 330 to a position corresponding to the first buffer 320. The support member 363 may be provided longer in the upward or downward direction. The first buffer robot 360 may be provided so that the hand 361 is simply driven in two directions along the second direction 14 and the third direction 16.

The cooling chamber 350 cools the substrate W, respectively. The cooling chamber 350 has a housing 351 and a cooling plate 352. The cooling plate 352 has an upper surface on which the substrate W is placed and a cooling means 353 for cooling the substrate W. [ As the cooling means 353, various methods such as cooling with cooling water and cooling using a thermoelectric element can be used. In addition, the cooling chamber 350 may be provided with a lift pin assembly (not shown) for positioning the substrate W on the cooling plate 352. The housing 351 is provided with an index robot 220 so that the developing robot 482 provided in the index robot 220 and a developing module 402 to be described later can carry the substrate W into or out of the cooling plate 352 (Not shown) in the direction provided and the direction in which the developing robot 482 is provided. Further, the cooling chamber 350 may be provided with doors (not shown) for opening and closing the above-described opening.

The application and development module 400 performs a process of applying a photoresist on the substrate W before the exposure process and a process of developing the substrate W after the exposure process. The application and development module 400 has a generally rectangular parallelepiped shape. The coating and developing module 400 has a coating module 401 and a developing module 402. The application module 401 and the development module 402 are arranged so as to be partitioned into layers with respect to each other. According to one example, the application module 401 is located on top of the development module 402.

The application module 401 includes a process of applying a photosensitive liquid such as a photoresist to the substrate W and a heat treatment process such as heating and cooling for the substrate W before and after the resist application process. The application module 401 has an application chamber 410, a bake chamber 420, and a transfer chamber 430. The application chamber 410, the bake chamber 420, and the transfer chamber 430 are sequentially disposed along the second direction 14. [ Accordingly, the application chamber 410 and the bake chamber 420 are spaced apart from each other in the second direction 14 with the transfer chamber 430 therebetween. A plurality of application chambers 410 are provided, and a plurality of application chambers 410 are provided in the first direction 12 and the third direction 16, respectively. In the drawing, an example in which six application chambers 410 are provided is shown. A plurality of bake chambers 420 are provided in the first direction 12 and the third direction 16, respectively. In the drawing, six bake chambers 420 are provided. Alternatively, however, the bake chamber 420 may be provided in a greater number.

The transfer chamber 430 is provided with a substrate transfer apparatus 1000 for transferring a substrate. The substrate transfer apparatus 1000 includes the bake chambers 420, the application chambers 410, the first buffer 320 of the first buffer module 310 and the first buffer 320 of the second buffer module 510, (520). FIG. 6 is a perspective view showing the substrate transport apparatus of FIG. 2. FIG. 6, the substrate transfer apparatus 1000 includes robot transfer units 1100 and 1300, a transfer robot 1500, and a measurement member. The robot moving units 1100 and 1300 include a horizontal driving member 1100 and a vertical driving member 1300.

The horizontal driving member 1100 linearly moves the vertical driving member 1300 in the horizontal direction. For example, the vertical driving member 1300 can be moved in the first direction 12 by the horizontal driving member 1100. [ The horizontal driving member 1100 has an upper horizontal frame 1100a, a lower horizontal frame 1100b, and a supporting frame 1100c. The upper horizontal frame 1100a, the lower horizontal frame 1100b, and the support frame 1100c are provided so as to have a rectangular ring shape in combination with each other. The upper horizontal frames 1100a are positioned to face each other above the lower horizontal frame 1100b. Each of the upper horizontal frame 1100a and the lower horizontal frame 1100b has a longitudinal direction parallel to each other. For example, each of the upper horizontal frame 1100a and the lower horizontal frame 1100b may have a longitudinal direction toward the first direction 12. The support frame 1100c connects the upper horizontal frame 1100a and the lower horizontal frame 1100b so that they are fixed. The support frame 1100c has a longitudinal direction perpendicular to the upper horizontal frame 1100a. For example, the support frame 1100c may have a longitudinal direction toward the third direction. The support frame 1100c extends from both ends of each of the upper horizontal frame 1100a and the lower horizontal frame 1100b.

The vertical driving member 1300 guides the movement of the transport robot 1500 in the third direction 16. The vertical driving member 1300 includes a vertical frame 1320 and a driving member (not shown). The vertical frame 1320 is provided such that its longitudinal direction is directed to the third direction. The vertical frame 1320 is provided in plural to stably support the transportation robot 1500. The vertical frame 1320 may be provided as a first vertical frame 1320a and a second vertical frame 1320b that support both ends of the support frame 1520 of the transport robot 1500, respectively. Each of the first vertical frame 1320a and the second vertical frame 1320b is coupled to an upper horizontal frame 1100a at its upper end and coupled to a lower horizontal frame 1100b at its lower end. Each vertical frame 1320 is simultaneously moved along the longitudinal direction of the upper horizontal frame 1100a and the lower horizontal frame 1100b. A guide rail 1322 is formed on one side of each vertical frame 1320. The guide rail 1322 has a longitudinal direction toward the third direction 16. The driving member (not shown) moves the conveying robot 1500 in the longitudinal direction of the guide rail 1322. A driving member (not shown) is provided in the vertical frame 1320. For example, a driving member (not shown) may be provided as a belt and a pulley.

The transfer robot 1500 transfers the substrate W. The carrying robot 1500 is capable of linear movement and rotational movement. The linear movement of the conveying robot 1500 includes a linear movement toward each of the X axis, the Y axis, and the Z axis (hereinafter three axes). The rotational movement includes a roll about the X axis, a rotation about the Y axis (pitch), and a movement about the Y axis. Here, the linear movement of the X axis is defined as forward or backward movement of the hand 1700. The Y axis is defined as the direction perpendicular to the X axis when viewed from the top. The Z axis is defined as a direction perpendicular to the X axis and the Y axis, respectively. The linear movement of each of the three axes of the carrying robot and the rotational movement of each of the three axes are driven by driving members (not shown) which are different from each other. The driving member (not shown) may be a motor (not shown). The first motor (not shown) rotates the hand 1700 about the X axis, the second motor (not shown) rotates the hand 1700 about the Y axis, and the third motor May rotate the hand 1700 about the Z axis. 7 is a plan view showing the carrying robot shown in Fig. Referring to Fig. 7, the carrying robot 1500 includes a moving member 1600 and a hand 1700. Fig.

Moving member 1600 includes a support 1620, a body 1640, and a driving member (not shown). The support base 1620 is provided in a plate shape. Both ends of the support frame 1620 are connected to the first vertical frame 1300a and the second vertical frame 1300b, respectively. The support base 1620 is movable in the horizontal and vertical directions by the robot moving unit.

The body 1640 is positioned on the upper surface of the support 1620. The body 1640 is coupled to the support 1620 to enable Z-axis rotation. For example, the body 1640 may be pivotable about a third direction 16 relative to the support 1620. The body 1640 has a rectangular parallelepiped shape. The body 1640 has a longitudinal direction toward the horizontal direction. A plurality of guides are formed on one surface and the other surface of the body 1640. For example, one side and the other side of the body 1640 on which the guide is formed may be opposite sides. The guides are provided in the number corresponding one-to-one with the hand 1700. Each of the guides has a longitudinal direction parallel to the longitudinal direction of the body 1640. Each guide guides the moving direction of the hand 1700. A driving member (not shown) provides a driving force to move the hand 1700. The hand 1700 can move linearly along the X-axis direction along the longitudinal direction of the guide.

The hand 1700 supports the substrate W. The hand 1700 is provided on the guide and is provided so as to be movable in the forward or backward direction. The hands 1700 are provided in a plurality of, and are located at different heights. The hand 1700 includes an arm 1720, a base plate 1742, a seating plate 1744, and a suction pad 1746. The arm 1720 connects the base plate 1742 and the guide 1660. The arm 1720 extends from the rear end of the base plate 1742 and is connected to a guide 1660 located at one side of the body 1640. Observed from above, the arm 1720 is provided with a "taper" shape.

The base plate 1742 is provided in the shape of an annular ring with one side opened. And the other side opposite to the one side is provided to the rear end of the base plate 1742 on which the arm 1720 extends. For example, the base plate 1742 may be provided in a "U" shape. A through hole is formed in the base plate 1742.

A plurality of seating plates 1744 are provided. The seating plate 1744 is positioned to extend from the inner surface of the base plate 1742 toward the central axis of the base plate 1742. Each seating plate 1744 is located at the same height as each other. Each seating plate 1744 is located in a different area of the base plate 1742. According to one example, four seating plates 1744 may be provided. Alternatively, the number of seating plates 1744 may be three, five or more.

The measurement member 1800 measures the position of the hand 1700 or the position of the substrate that is seated in the hand 1700. The measuring member 1800 includes a jig plate J, a light emitting member 1820, and a light receiving member 1840. The jig plate J has a circular plate shape. The jig plate J has the same shape as the wafer.

The light emitting member 1820 irradiates a laser. The light emitting member 1820 may be a laser pointer 1820. According to one example, the laser may be provided in a linear or planar form. In the present embodiment, it is assumed that the laser has a linear shape. When the laser is provided in a point shape, it is difficult to determine the positional deviation of the hand 1700 when the laser is rotated about the X-axis direction. The light emitting member 1820 is fixedly coupled to the jig plate J. The light emitting member 1820 irradiates the laser in a direction different from the Z axis. According to one example, the jig plate J can be seated on the hand 1700 so that the light emitting member 1820 irradiates the laser in the X-axis direction.

The light receiving member 1840 receives the laser beam emitted from the light emitting member 1820. The light receiving member 1840 is capable of measuring the position of the laser. For example, the light receiving member 1840 may be a light receiving plate 1840 provided in a plate shape. When the laser is irradiated to the light-receiving plate 1840, position information of the irradiated laser is calculated on the light-receiving plate 1840.

The controller 1900 controls the first motor, the second motor, and the third motor based on the position information transmitted from the light receiving member 1840. The controller 1900 calculates the position shift amount of the hand 1700 based on the position information and controls each motor so that the hand 1700 is moved to the correct position to correct the posture of the hand 1700. [ The controller 1900 causes the light emitting member 1820 to perform at least one of rotation of the transport robot 1500 on the X axis, rotation on the Y axis, and rotation on the Z axis in a state in which the laser beam is irradiated. Accordingly, the light path of the laser is stored in the light receiving plate 1840, and the controller 1900 compares the movement path of the laser with the predetermined path, thereby correcting the carrier robot 1500 to the correct position.

Next, a method of correcting the height posture of the hand 1700 using the above-described apparatus will be described. 10 is a sectional view showing a process of correcting the posture of the carrying robot shown in Fig. Referring to Fig. 10, a jig plate J is seated on the hand 1700. Fig. The jig plate J is seated such that the irradiation direction of the laser is parallel to the X axis. The light emitting member 1820 irradiates the laser toward the light receiving plate 1840. With the laser irradiated, the transport robot 1500 rolls on the X axis, rotates about the Y axis, or rotates about the Z axis.

As the transport robot 1500 is rotated about the X axis, the laser beam irradiated to the light receiving plate 1840 is moved. The X-axis rotation path of the laser is compared with the pre-input X-axis setting path. When the X-axis rotation path and the X-axis setting path coincide with each other, it is determined that the hand 1700 for the rotation based on the X-axis is good and rotates the transportation robot 1500 on the Y-

The transport robot 1500 is rotated on the Y axis basis, and the laser beam irradiated to the light receiving plate 1840 is moved. The Y-axis rotation path of the laser is compared with the Y-axis set path input previously. When the Y-axis rotation path and the Y-axis setting path coincide, it is determined that the hand 1700 for the rotation based on the Y-axis is good and the transport robot 1500 is rotated about the Z-axis.

The transport robot 1500 is rotated on the Z-axis basis, and the laser beam irradiated to the light-receiving plate 1840 is moved. The Z-axis rotation path of the laser is compared with the Z-axis set path input previously. When the Z-axis rotation path and the Z-axis setting path coincide with each other, it is determined that the hand 1700 for rotation about the Z-axis is good and the posture correction ends.

A first motor, a second motor, and a second motor so as to determine a shift amount between a set path and a rotation path when one or more of the three or more axes are determined to be defective, Then, the height posture of the hand 1700 can be corrected by controlling the third motor.

In the above-described embodiment, rotation of the X-axis reference, rotation of the Y-axis, and rotation of the Z-axis reference are sequentially performed to correct the height and posture of the hand 1700. However, rotation about the X axis, rotation about the Y axis, and rotation about the Z axis can proceed at the same time.

Also, in the above-described embodiment, the carrying robot 1500 is rotationally moved about the three axes in order to correct the height attitude of the hand 1700. [ However, not only the height of the hand 1700 but also the posture correction for correcting the deviation with respect to the X axis or the Y axis can be further performed.

As shown in Fig. 11, the light emitting member 1820 can irradiate the lasers in two different directions, respectively. For example, the light emitting member 1820 can irradiate the laser in the direction different from the Z axis and in the direction toward the Z axis, respectively. The light receiving member 1840 may include a plurality of light receiving plates 1840. The light-receiving plate 1840 may be provided in a number corresponding to the number of directions for irradiating the laser. Each light receiving plate 1840 can be disposed at a position where the laser can be received. The light emitting member 1820 irradiates the laser in a direction different from the Z axis, and the transport robot 1500 rotates about each of the three axes to correct the height posture. Further, the light emitting member 1820 irradiates the laser in the direction toward the Z axis, and the carrying robot 1500 can linearly move in each of the three axes to correct the posture with respect to the horizontal plane.

2 to 5, the application chambers 410 all have the same structure. However, the kinds of the photoresist used in the respective application chambers 410 may be different from each other. As an example, a chemical amplification resist may be used as the photoresist. The resist coating chamber 410 applies a photoresist on the substrate W. [ The resist coating chamber 410 has a housing 411, a support plate 412, and a nozzle 413. The housing 411 has a cup shape with an open top. The support plate 412 is located in the housing 411 and supports the substrate W. [ The support plate 412 is rotatably provided. The nozzle 413 supplies the photoresist onto the substrate W placed on the support plate 412. The nozzle 413 has a circular tube shape and can supply photoresist to the center of the substrate W. [ Alternatively, the nozzle 413 may have a length corresponding to the diameter of the substrate W, and the discharge port of the nozzle 413 may be provided as a slit. In addition, the resist coating chamber 410 may further be provided with a nozzle 414 for supplying a cleaning liquid such as deionized water to clean the surface of the substrate W to which the photoresist is applied.

The bake chamber 420 heat-treats the substrate W. For example, the bake chambers 420 may include a prebake process for heating the substrate W to a predetermined temperature to remove organic matter and moisture on the surface of the substrate W before the process liquid is applied, A soft bake process is performed after coating the substrate W on the substrate W, and a cooling process for cooling the substrate W after each heating process is performed. The bake chamber 420 has a cooling plate 421 or a heating plate 422. The cooling plate 421 is provided with a cooling means 423 such as a cooling water or a thermoelectric element. The heating plate 422 is also provided with a heating means 424, such as a hot wire or a thermoelectric element. The cooling plate 421 and the heating plate 422 may be provided in a single bake chamber 420, respectively. Optionally, some of the bake chambers 420 may include only the cooling plate 421, and the other portions may include only the heating plate 422.

The developing module 402 includes a developing process for supplying a developing solution to obtain a pattern on the substrate W to remove a part of the photosensitive film and a heat treatment process such as heating and cooling performed on the substrate W before and after the developing process . The development module 402 has a development chamber 460, a bake chamber 470, and a transfer chamber 480. The development chamber 460, the bake chamber 470, and the transfer chamber 480 are sequentially disposed along the second direction 14. The development chamber 460 and the bake chamber 470 are positioned apart from each other in the second direction 14 with the transfer chamber 480 therebetween. A plurality of developing chambers 460 are provided, and a plurality of developing chambers 460 are provided in the first direction 12 and the third direction 16, respectively. In the drawing, six development chambers 460 are provided. A plurality of bake chambers 470 are provided in the first direction 12 and the third direction 16, respectively. In the drawing, six bake chambers 470 are provided. Alternatively, however, the bake chamber 470 can be provided in greater numbers.

The transfer chamber 480 is provided with a substrate transfer unit 482 for transferring the substrate W. [ The substrate transfer unit 482 includes bake chambers 470, development chambers 460, a second buffer 330 and a cooling chamber 350 of the first buffer module 310 and a second buffer module 510, And the second cooling chamber 540 of the second cooling chamber 540. The substrate transfer unit 482 of the development module 402 is located below the substrate transfer unit 1000 of the application module 401. [

The development chambers 460 all have the same structure. However, the types of developers used in the respective developing chambers 460 may be different from each other. The development chamber 460 removes a region of the photoresist on the substrate W where light is irradiated. At this time, the area of the protective film irradiated with the light is also removed. Depending on the type of selectively used photoresist, only the areas of the photoresist and protective film that are not irradiated with light can be removed.

The development chamber 460 has a housing 461, a support plate 462, and a nozzle 463. The housing 461 has a cup shape with an open top. The support plate 462 is located in the housing 461 and supports the substrate W. [ The support plate 462 is rotatably provided. The nozzle 463 supplies the developer onto the substrate W placed on the support plate 462. The nozzle 463 has a circular tube shape and can supply developer to the center of the substrate W. [ Alternatively, the nozzle 463 may have a length corresponding to the diameter of the substrate W, and the discharge port of the nozzle 463 may be provided with a slit. Further, the developing chamber 460 may further be provided with a nozzle 464 for supplying a cleaning liquid such as deionized water to clean the surface of the substrate W to which the developer is supplied.

The bake chamber 470 heat-treats the substrate W. For example, the bake chambers 470 may include a post-bake process for heating the substrate W before the development process is performed, a hard bake process for heating the substrate W after the development process is performed, And a cooling step for cooling the substrate. The bake chamber 470 has a cooling plate 471 or a heating plate 472. The cooling plate 471 is provided with a cooling means 473 such as a cooling water or a thermoelectric element. Or the heating plate 472 is provided with a heating means 474 such as a hot wire or a thermoelectric element. The cooling plate 471 and the heating plate 472 may be provided in one bake chamber 470, respectively. Optionally, some of the bake chambers 470 may have only a cooling plate 471, while the other may have only a heating plate 472. [

As described above, in the application and development module 400, the application module 401 and the development module 402 are provided to be separated from each other. In addition, the application module 401 and the development module 402 may have the same chamber arrangement as viewed from above.

The second buffer module 500 is provided as a path through which the substrate W is transferred between the coating and developing module 400 and the pre- and post-exposure processing module 600. The second buffer module 500 performs a predetermined process on the substrate W such as a cooling process or an edge exposure process. The second buffer module 500 includes a frame 510, a buffer 520, a first cooling chamber 530, a second cooling chamber 540, an edge exposure chamber 550, and a second buffer robot 560 I have. The frame 510 has a rectangular parallelepiped shape. The buffer 520, the first cooling chamber 530, the second cooling chamber 540, the edge exposure chamber 550, and the second buffer robot 560 are located within the frame 510. The buffer 520, the first cooling chamber 530, and the edge exposure chamber 550 are disposed at a height corresponding to the application module 401. The second cooling chamber 540 is disposed at a height corresponding to the development module 402. The buffer 520, the first cooling chamber 530, and the second cooling chamber 540 are sequentially arranged in a row along the third direction 16. The buffer 520 is disposed along the first direction 12 with the transfer chamber 430 of the application module 401. [ The edge exposure chamber 550 is spaced a certain distance in the second direction 14 from the buffer 520 or the first cooling chamber 530.

The second buffer robot 560 carries the substrate W between the buffer 520, the first cooling chamber 530, and the edge exposure chamber 550. A second buffer robot 560 is positioned between the edge exposure chamber 550 and the buffer 520. The second buffer robot 560 may be provided in a structure similar to that of the first buffer robot 360. The first cooling chamber 530 and the edge exposure chamber 550 perform a subsequent process on the substrates W that have been processed in the application module 401. The first cooling chamber 530 cools the substrate W processed in the application module 401. The first cooling chamber 530 has a structure similar to the cooling chamber 350 of the first buffer module 300. The edge exposure chamber 550 exposes its edge to the substrates W that have undergone the cooling process in the first cooling chamber 530. [ The buffer 520 temporarily stores the substrate W before the substrates W processed in the edge exposure chamber 550 are transported to a preprocessing module 601 described later. The second cooling chamber 540 cools the substrates W before the processed substrates W are transferred to the developing module 402 in the post-processing module 602 described later. The second buffer module 500 may further have a buffer added to the height corresponding to the development module 402. In this case, the substrates W processed in the post-processing module 602 may be temporarily stored in the added buffer and then conveyed to the developing module 402.

The pre- and post-exposure processing module 600 may process a process of applying a protective film for protecting the photoresist film applied to the substrate W during liquid immersion exposure, when the exposure apparatus 900 performs the liquid immersion exposure process. In addition, the pre- and post-exposure processing module 600 may perform a process of cleaning the substrate W after exposure. In addition, when the coating process is performed using the chemically amplified resist, the pre- and post-exposure processing module 600 can process the post-exposure bake process.

The pre-exposure post-processing module 600 has a pre-processing module 601 and a post-processing module 602. The pre-processing module 601 performs a process of processing the substrate W before the exposure process, and the post-process module 602 performs a process of processing the substrate W after the exposure process. The pre-processing module 601 and the post-processing module 602 are arranged so as to be partitioned into layers with respect to each other. According to one example, the preprocessing module 601 is located on top of the post-processing module 602. The preprocessing module 601 is provided at the same height as the application module 401. The post-processing module 602 is provided at the same height as the developing module 402. The pretreatment module 601 has a protective film application chamber 610, a bake chamber 620, and a transfer chamber 630. The protective film application chamber 610, the transfer chamber 630, and the bake chamber 620 are sequentially disposed along the second direction 14. The protective film application chamber 610 and the bake chamber 620 are positioned apart from each other in the second direction 14 with the transfer chamber 630 therebetween. A plurality of protective film application chambers 610 are provided and are arranged along the third direction 16 to form layers. Alternatively, a plurality of protective film application chambers 610 may be provided in the first direction 12 and the third direction 16, respectively. A plurality of bake chambers 620 are provided and are disposed along the third direction 16 to form layers. Alternatively, a plurality of bake chambers 620 may be provided in the first direction 12 and the third direction 16, respectively.

The transfer chamber 630 is positioned in parallel with the first cooling chamber 530 of the second buffer module 500 in the first direction 12. In the transfer chamber 630, a pre-processing robot 632 is located. The transfer chamber 630 has a generally square or rectangular shape. The preprocessing robot 632 is connected between the protective film application chambers 610, the bake chambers 620, the buffer 520 of the second buffer module 500 and the first buffer 720 of the interface module 700, The substrate W is transferred. The preprocessing robot 632 has a hand 633, an arm 634, and a support 635. The hand 633 is fixed to the arm 634. The arm 634 is provided with a retractable structure and a rotatable structure. The arm 634 is coupled to the support 635 so as to be linearly movable along the support 635 in the third direction 16.

The protective film applying chamber 610 applies a protective film for protecting the resist film on the substrate W during liquid immersion exposure. The protective film application chamber 610 has a housing 611, a support plate 612, and a nozzle 613. The housing 611 has a cup shape with its top opened. The support plate 612 is located in the housing 611 and supports the substrate W. [ The support plate 612 is rotatably provided. The nozzle 613 supplies a protective liquid for forming a protective film onto the substrate W placed on the supporting plate 612. The nozzle 613 has a circular tube shape and can supply the protective liquid to the center of the substrate W. [ Alternatively, the nozzle 613 may have a length corresponding to the diameter of the substrate W, and the discharge port of the nozzle 613 may be provided with a slit. In this case, the support plate 612 may be provided in a fixed state. The protective liquid includes a foamable material. The protective liquid may be a photoresist and a material having a low affinity for water. For example, the protective liquid may contain a fluorine-based solvent. The protective film application chamber 610 supplies the protective liquid to the central region of the substrate W while rotating the substrate W placed on the support plate 612.

The bake chamber 620 heat-treats the substrate W coated with the protective film. The bake chamber 620 has a cooling plate 621 or a heating plate 622. The cooling plate 621 is provided with a cooling means 623 such as a cooling water or a thermoelectric element. Or heating plate 622 is provided with a heating means 624, such as a hot wire or a thermoelectric element. The heating plate 622 and the cooling plate 621 may be provided in a single bake chamber 620, respectively. Optionally, some of the bake chambers 620 may have only the heating plate 622, while others may only have the cooling plate 621.

The post-processing module 602 has a cleaning chamber 660, a post-exposure bake chamber 670, and a delivery chamber 680. The cleaning chamber 660, the transfer chamber 680, and the post-exposure bake chamber 670 are sequentially disposed along the second direction 14. Accordingly, the cleaning chamber 660 and the post-exposure baking chamber 670 are positioned apart from each other in the second direction 14 with the transfer chamber 680 therebetween. A plurality of cleaning chambers 660 are provided and may be disposed along the third direction 16 to form layers. Alternatively, a plurality of cleaning chambers 660 may be provided in the first direction 12 and the third direction 16, respectively. A plurality of post-exposure bake chambers 670 are provided and may be disposed along the third direction 16 to form layers. Alternatively, a plurality of post-exposure bake chambers 670 may be provided in the first direction 12 and the third direction 16, respectively.

The transfer chamber 680 is positioned in parallel with the second cooling chamber 540 of the second buffer module 500 in the first direction 12 as viewed from above. The transfer chamber 680 has a generally square or rectangular shape. A post processing robot 682 is located in the transfer chamber 680. The post-processing robot 682 is connected to the cleaning chambers 660, post-exposure bake chambers 670, the second cooling chamber 540 of the second buffer module 500, and the second And transfers the substrate W between the buffers 730. The postprocessing robot 682 provided in the postprocessing module 602 may be provided with the same structure as the preprocessing robot 632 provided in the preprocessing module 601. [

The cleaning chamber 660 cleans the substrate W after the exposure process. The cleaning chamber 660 has a housing 661, a support plate 662, and a nozzle 663. The housing 661 has a cup shape with an open top. The support plate 662 is located in the housing 661 and supports the substrate W. [ The support plate 662 is rotatably provided. The nozzle 663 supplies the cleaning liquid onto the substrate W placed on the support plate 662. As the cleaning liquid, water such as deionized water may be used. The cleaning chamber 660 supplies the cleaning liquid to the central region of the substrate W while rotating the substrate W placed on the support plate 662. Optionally, while the substrate W is rotating, the nozzle 663 may move linearly or rotationally from the central region of the substrate W to the edge region.

The post-exposure bake chamber 670 heats the substrate W subjected to the exposure process using deep UV light. The post-exposure baking step heats the substrate W and amplifies the acid generated in the photoresist by exposure to complete the property change of the photoresist. The post-exposure bake chamber 670 has a heating plate 672. The heating plate 672 is provided with a heating means 674 such as a hot wire or a thermoelectric element. The post-exposure bake chamber 670 may further include a cooling plate 671 therein. The cooling plate 671 is provided with a cooling means 673 such as a cooling water or a thermoelectric element. Further, a bake chamber having only the cooling plate 671 may be further provided.

As described above, the pre-processing module 601 and the post-processing module 602 in the pre-exposure processing module 600 are provided to be completely separated from each other. The transfer chamber 630 of the preprocessing module 601 and the transfer chamber 680 of the postprocessing module 602 are provided in the same size and can be provided so as to completely overlap each other when viewed from above. Further, the protective film application chamber 610 and the cleaning chamber 660 may be provided to have the same size as each other and be provided so as to completely overlap with each other when viewed from above. Further, the bake chamber 620 and the post-exposure bake chamber 670 are provided in the same size, and can be provided so as to completely overlap each other when viewed from above.

The interface module 700 transfers the substrate W between the exposure pre- and post-processing module 600 and the exposure apparatus 900. The interface module 700 has a frame 710, a first buffer 720, a second buffer 730, and an interface robot 740. The first buffer 720, the second buffer 730, and the interface robot 740 are located within the frame 710. The first buffer 720 and the second buffer 730 are spaced apart from each other by a predetermined distance and are stacked on each other. The first buffer 720 is disposed higher than the second buffer 730. The first buffer 720 is positioned at a height corresponding to the preprocessing module 601 and the second buffer 730 is positioned at a height corresponding to the postprocessing module 602. The first buffer 720 is arranged in a line along the first direction 12 with the transfer chamber 630 of the preprocessing module 601 while the second buffer 730 is arranged in the postprocessing module 602, Are arranged in a line along the first direction 12 with the transfer chamber 630 of the transfer chamber 630. [

The interface robot 740 is spaced apart from the first buffer 720 and the second buffer 730 in the second direction 14. The interface robot 740 carries the substrate W between the first buffer 720, the second buffer 730 and the exposure apparatus 900. The interface robot 740 has a structure substantially similar to that of the second buffer robot 560.

The first buffer 720 temporarily stores the substrates W processed in the preprocessing module 601 before they are transferred to the exposure apparatus 900. The second buffer 730 temporarily stores the processed substrates W in the exposure apparatus 900 before they are transferred to the post-processing module 602. The first buffer 720 has a housing 721 and a plurality of supports 722. The supports 722 are disposed within the housing 721 and are provided spaced apart from each other in the third direction 16. One substrate W is placed on each support 722. The housing 721 is movable in the direction in which the interface robot 740 is provided and in the direction in which the interface robot 740 and the preprocessing robot 632 transfer the substrate W to and from the support table 722, 632 are provided with openings (not shown) in the direction in which they are provided. The second buffer 730 has a structure substantially similar to that of the first buffer 720. However, the housing 731 of the second buffer 730 has an opening (not shown) in the direction in which the interface robot 740 is provided and in a direction in which the postprocessing robot 682 is provided. Only the buffers and robots can be provided as described above without providing a chamber for performing a predetermined process on the substrate W in the interface module.

1500: conveying robot 1700: hand
1820: light emitting member 1840: light receiving member
J: Jig plate

Claims (10)

A first motor that rotates the hand about the X axis, a second motor that rotates the hand about the Y axis, a third motor that rotates the hand about the Z axis, and a measurement module The carrying robot corrects the posture of the hand,
Wherein the measurement module comprises:
A light emitting member provided on the hand side to emit a laser beam of a line or plane shape; And
Further comprising a light receiving member provided separately from the light emitting member for receiving the laser,
Receiving the position of the laser from the light receiving member and correcting the posture of the hand by rotating the hand with the first motor, the second motor, and the third motor so that the laser is moved to a predetermined fixed position A method of posture correction of a carrier robot. The method according to claim 1,
Wherein the measurement module comprises:
Further comprising a jig plate having the same shape as the substrate,
The light-
Wherein the jig plate is fixedly coupled to the jig plate. delete The method according to claim 1,
Wherein the measurement module comprises:
And a light receiving member for receiving the laser beam,
Wherein the first motor, the second motor, and the third motor are controlled such that the laser is moved to the correct position by receiving the measured information from the light receiving member. 5. The method of claim 4,
The light emitting member emits the laser in a direction different from the Z axis,
And correcting the posture of the hand includes correcting the height of the hand. 6. The method of claim 5,
In order to correct the height of the hand,
An X-axis rotation operation for rotating the hand about the X-axis in the state of emitting the laser, a Y-axis rotation operation for rotating the hand about the Y-axis, and a Z-axis rotation operation for rotating the hand about the Z- And performing at least one of the following operations. 5. The method of claim 4,
The light emitting member emits the laser in a height direction toward the Z axis and in a horizontal direction different from the Z axis,
Correcting the posture of the hand,
Correcting the horizontal posture of the hand through the height direction,
And corrects the height posture of the hand through the horizontal direction. 8. The method of claim 7,
To correct the horizontal posture of the hand,
An X-axis moving operation for linearly moving the hand on the X-axis in a state of emitting the laser, a Y-axis moving operation for linearly moving the hand on the Y-axis, and a Z-axis moving operation for straightening the hand on the Z- Perform at least one,
In order to correct the height posture of the hand,
An X-axis rotation operation for rotating the hand about the X-axis in the state of emitting the laser, a Y-axis rotation operation for rotating the hand about the Y-axis, and a Z-axis rotation operation for rotating the hand about the Z- And performing at least one of the following operations. A first motor that rotates the hand about the X axis, a second motor that rotates the hand about the Y axis, a third motor that rotates the hand about the Z axis, and a measurement module ,
Wherein the measurement module comprises:
A light emitting member provided on the hand side to emit a laser beam of a line or plane shape;
A light receiving member provided separately from the light emitting member and receiving the laser; And
A controller,
The controller comprising:
Receiving the position of the laser from the light receiving member and correcting the posture of the hand by rotating the hand with the first motor, the second motor, and the third motor so that the laser is moved to a predetermined fixed position Conveying robot. 10. The method of claim 9,
Wherein the measurement module further comprises a jig plate having the same shape as the substrate,
And the light emitting member is fixedly coupled to the jig plate.

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