KR101919628B1 - 계측용 와이드 프로세스 레인지 라이브러리 - Google Patents

계측용 와이드 프로세스 레인지 라이브러리 Download PDF

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Publication number
KR101919628B1
KR101919628B1 KR1020137023309A KR20137023309A KR101919628B1 KR 101919628 B1 KR101919628 B1 KR 101919628B1 KR 1020137023309 A KR1020137023309 A KR 1020137023309A KR 20137023309 A KR20137023309 A KR 20137023309A KR 101919628 B1 KR101919628 B1 KR 101919628B1
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KR
South Korea
Prior art keywords
library
process range
range
parameter
stitching
Prior art date
Application number
KR1020137023309A
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English (en)
Korean (ko)
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KR20140045919A (ko
Inventor
존 제이 헨치
웬 진
준웨이 바오
Original Assignee
케이엘에이-텐코 코포레이션
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Publication of KR20140045919A publication Critical patent/KR20140045919A/ko
Application granted granted Critical
Publication of KR101919628B1 publication Critical patent/KR101919628B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • General Factory Administration (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
KR1020137023309A 2011-02-11 2012-02-09 계측용 와이드 프로세스 레인지 라이브러리 KR101919628B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/025,654 US8381140B2 (en) 2011-02-11 2011-02-11 Wide process range library for metrology
US13/025,654 2011-02-11
PCT/US2012/024477 WO2012109441A2 (en) 2011-02-11 2012-02-09 Wide process range library for metrology

Publications (2)

Publication Number Publication Date
KR20140045919A KR20140045919A (ko) 2014-04-17
KR101919628B1 true KR101919628B1 (ko) 2018-11-16

Family

ID=46637897

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137023309A KR101919628B1 (ko) 2011-02-11 2012-02-09 계측용 와이드 프로세스 레인지 라이브러리

Country Status (7)

Country Link
US (1) US8381140B2 (zh)
EP (1) EP2673797A2 (zh)
JP (1) JP5969511B2 (zh)
KR (1) KR101919628B1 (zh)
CN (1) CN103443900B (zh)
TW (1) TWI525302B (zh)
WO (1) WO2012109441A2 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
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US8869081B2 (en) * 2013-01-15 2014-10-21 International Business Machines Corporation Automating integrated circuit device library generation in model based metrology
US20140242880A1 (en) * 2013-02-26 2014-08-28 Applied Materials, Inc. Optical model with polarization direction effects for comparison to measured spectrum
US20150095679A1 (en) 2013-09-30 2015-04-02 Sonos, Inc. Transitioning A Networked Playback Device Between Operating Modes
US9553033B2 (en) * 2014-01-15 2017-01-24 Kla-Tencor Corporation Semiconductor device models including re-usable sub-structures
US10648793B2 (en) * 2014-05-15 2020-05-12 Kla-Tencor Corporation Library expansion system, method, and computer program product for metrology
US10151986B2 (en) * 2014-07-07 2018-12-11 Kla-Tencor Corporation Signal response metrology based on measurements of proxy structures
US10190868B2 (en) * 2015-04-30 2019-01-29 Kla-Tencor Corporation Metrology system, method, and computer program product employing automatic transitioning between utilizing a library and utilizing regression for measurement processing
EP3480659A1 (en) * 2017-11-01 2019-05-08 ASML Netherlands B.V. Estimation of data in metrology

Citations (2)

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JP2005009941A (ja) * 2003-06-17 2005-01-13 Canon Inc ライブラリ作成方法
US20080077352A1 (en) * 2006-09-26 2008-03-27 Tokyo Electron Limited Methods and apparatus for using an optically tunable soft mask profile library

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JP3869554B2 (ja) * 1998-04-28 2007-01-17 株式会社日立製作所 検査データ作成方法及び装置及びこれを用いた部品実装基板外観検査装置
US6943900B2 (en) * 2000-09-15 2005-09-13 Timbre Technologies, Inc. Generation of a library of periodic grating diffraction signals
US7382447B2 (en) * 2001-06-26 2008-06-03 Kla-Tencor Technologies Corporation Method for determining lithographic focus and exposure
AT412032B (de) * 2001-12-19 2004-08-26 Riegl Laser Measurement Sys Verfahren zur aufnahme eines objektraumes
US6721691B2 (en) * 2002-03-26 2004-04-13 Timbre Technologies, Inc. Metrology hardware specification using a hardware simulator
JP2006521863A (ja) * 2003-03-31 2006-09-28 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 磁気共鳴血流画像化法
JP4282500B2 (ja) * 2004-01-29 2009-06-24 株式会社東芝 構造検査方法及び半導体装置の製造方法
US20060187466A1 (en) * 2005-02-18 2006-08-24 Timbre Technologies, Inc. Selecting unit cell configuration for repeating structures in optical metrology
US7421414B2 (en) 2005-03-31 2008-09-02 Timbre Technologies, Inc. Split machine learning systems
US7467064B2 (en) * 2006-02-07 2008-12-16 Timbre Technologies, Inc. Transforming metrology data from a semiconductor treatment system using multivariate analysis
US7523021B2 (en) * 2006-03-08 2009-04-21 Tokyo Electron Limited Weighting function to enhance measured diffraction signals in optical metrology
US7623978B2 (en) * 2006-03-30 2009-11-24 Tokyo Electron Limited Damage assessment of a wafer using optical metrology
US8666703B2 (en) * 2010-07-22 2014-03-04 Tokyo Electron Limited Method for automated determination of an optimally parameterized scatterometry model

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005009941A (ja) * 2003-06-17 2005-01-13 Canon Inc ライブラリ作成方法
US20080077352A1 (en) * 2006-09-26 2008-03-27 Tokyo Electron Limited Methods and apparatus for using an optically tunable soft mask profile library

Also Published As

Publication number Publication date
JP5969511B2 (ja) 2016-08-17
KR20140045919A (ko) 2014-04-17
WO2012109441A3 (en) 2012-12-06
US20120210289A1 (en) 2012-08-16
EP2673797A2 (en) 2013-12-18
TW201241400A (en) 2012-10-16
CN103443900B (zh) 2016-08-10
CN103443900A (zh) 2013-12-11
WO2012109441A2 (en) 2012-08-16
JP2014511565A (ja) 2014-05-15
TWI525302B (zh) 2016-03-11
US8381140B2 (en) 2013-02-19

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