KR101916946B1 - Apparatus for welding using laser-etching and method for welding using same - Google Patents

Abstract

One embodiment of the present invention relates to a bonding apparatus using laser-etching. According to an embodiment of the present invention, there is provided a chemical etching method comprising: And a laser part for irradiating a laser beam onto at least one surface of a metal object located in the chemical bath containing the etching solution to form a pattern including at least one groove part, A bonding apparatus using laser-etching is provided, in which a resin object is injected into the metal mold into which the metal object is inserted, and the injected resin object is injected into the pattern to bond the metal object and the resin object. do.

Description

TECHNICAL FIELD [0001] The present invention relates to a laser-etching bonding apparatus and a bonding method using the same. BACKGROUND ART [0002]

An embodiment of the present invention relates to a laser-etching bonding apparatus and a laser-etching bonding method using the same.

A metal-plastic combination body in which a metal member and a plastic member are firmly joined together is used in many fields of industry. For example, these metal-plastic assemblies are also used in parts of aircraft or housings of secondary batteries. The metal-plastic combined body is mainly manufactured by a method of bonding a metal member and a plastic member with an adhesive, and a method of molding a plastic member bonded to a metal member by performing insert molding while inserting the metal member into the metal mold .

Whether a method of bonding with an adhesive or a method of injecting an insert, a surface treatment process of a metal member is performed in order to enhance the bonding force between the metal member and the plastic member. However, the bonding method using only chemical etching has a complex process step and a low etching rate. The surface treatment of the known metal member is cumbersome, time consuming and costly, and the bonding strength is not so effective. In addition, a mask is required to form a bonding pattern, and when the mask is used, the entire temperature of the chemical bath must be increased.

Korean Patent Registration No. 10-1407238 (June, 2014)

Embodiments of the present invention provide a laser-etching bonding apparatus and a laser-etching bonding method using the same that can shorten complicated process steps to improve productivity.

The present invention also provides a laser-etching bonding apparatus capable of forming a bonding pattern without using a mask using a laser, and a laser-etching bonding method using the same.

It is another object of the present invention to provide a laser-etching bonding apparatus and a laser-etching bonding method using the laser-etching bonding apparatus which can increase the etching rate by using a laser.

It is another object of the present invention to provide a laser-etching bonding apparatus and a laser-etching bonding method using such a laser-etching bonding apparatus capable of controlling a shape structure of an etching region and an etching surface as desired.

The present invention also provides a laser-etching bonding apparatus and a laser-etching bonding method using the laser-etching bonding apparatus,

In addition, the present invention is to provide a laser-etching bonding apparatus and a laser-etching bonding method using the same, which are capable of micromachining technology for producing high-tech products having characteristics of ultra-light, ultra-thin and high capacity.

According to an embodiment of the present invention, there is provided a chemical etching method comprising: And a laser part for irradiating a laser beam onto at least one surface of a metal object located in the chemical bath containing the etching solution to form a pattern including at least one groove part, A bonding apparatus using laser-etching is provided, in which a resin object is injected into the metal mold into which the metal object is inserted, and the injected resin object is injected into the pattern to bond the metal object and the resin object. do.

At least one of the metal target and the resin target may include a three-dimensional shape.

The pattern may be etched by an etchant contained in the chemical bath, the shape of the pattern being determined by the laser unit in a chemical bath containing the etchant.

The laser unit includes a laser generating unit; A dynamic focusing module for adjusting a z-axis focal position of the laser beam; A scan head for adjusting focus positions of the x- and y-axes of the laser beam; And a light collecting part for irradiating the laser beam onto the metal object, wherein the scan head includes a galvanometer including an x-axis scan mirror and a y-axis scan mirror, and the laser beam , The pattern formed on the metal object may have a nano-sized width and pattern depth in micro size.

The laser generator may generate a laser beam of one of nanosecond, picosecond, or femtosecond using a pulsed laser beam source to form the pattern of nano-size or micro-size on the metal object .

And a controller for extracting x, y and z axis data of the metal object and controlling the scan head and the dynamic focusing module.

The control unit controls a dynamic focusing module that adjusts the z-axis focal position of the laser beam and a scan head that adjusts the focus position of the x and y axes to adjust at least one of the formation position, depth, .

The mold may include an upper mold and a lower mold, and may include an injection port formed in at least one of the upper mold and the lower mold.

The metal object on which the pattern is formed may be inserted into the upper mold or the lower mold where the injection port is not formed, and the resin object may be injected through the injection port.

The resin object injected into the mold is injected up to the pattern of the metal object so that the metal object and the resin object can be bonded.

At least one surface of the metal object located in the chemical tank containing the etching solution is irradiated with a laser beam by a laser part to form at least one pattern and is etched along the pattern formed on the metal object by the etching solution contained in the chemical bath , The metal object to which the pattern is formed is inserted into a metal mold, a resin object is injected into the metal mold into which the metal object is inserted, and the injected resin object is injected into the pattern so that the metal object and the resin object are jointed .

At least one of the metal target and the resin target may include a three-dimensional shape.

The pattern may be etched by an etchant contained in the chemical bath, the shape of the pattern being determined by the laser unit in a chemical bath containing the etchant.

The focal position of the laser beam formed by the laser generating unit is adjusted by the dynamic focusing module to adjust the focal position of the x-axis y-axis irradiated to the metal object by the scan head, The pattern formed on the metal object may have a width and a depth of nano-size in a micro size by the laser beam irradiated to the metal object through the light collecting part, The pattern can be formed on the metal object of the shape.

The laser generator may generate a laser beam of one of nanosecond, picosecond, or femtosecond using a pulsed laser beam source to form the pattern of nano-size or micro-size on the metal object .

The x, y, and z-axis data of the metal object are extracted by the control unit, and the scan head and the dynamic focusing module are controlled so as to correspond to the extracted data, so that the formation position and depth of the pattern formed on the surface of the metal object , Size, and width can be adjusted.

The mold includes an upper mold and a lower mold, and at least one of the upper mold and the lower mold may be provided with an injection port.

The metal object may be inserted into the upper mold or the lower mold where the injection port is not formed, and the resin object may be injected through the injection port.

The resin object injected into the mold is injected up to the pattern so that the metal object and the resin object can be bonded.

According to the embodiments of the present invention, it is possible to provide a laser-etching bonding apparatus and a laser-etching bonding method using the same that can shorten complicated process steps and improve productivity.

Also, a laser-etching bonding apparatus capable of forming a bonding pattern without using a mask using a laser and a laser-etching bonding method using the same can be provided.

Further, it is possible to provide a laser-etching bonding apparatus and a laser-etching bonding method using the same that can increase the etching rate by using a laser.

It is another object of the present invention to provide a laser-etching bonding apparatus and a laser-etching bonding method using such a laser-etching bonding apparatus capable of controlling a shape structure of an etching region and an etching surface as desired.

Further, it is possible to provide a laser-etching bonding apparatus and a laser-etching bonding method using the laser-etching bonding apparatus capable of irradiating only a local region to a laser-irradiated surface.

In addition, it is possible to provide a laser-etching bonding apparatus and a laser-etching bonding method using the laser-etching bonding apparatus capable of micromachining technology for producing a high-tech product having an ultra-lightweight, ultra-thin and high capacity.

1 is a view showing a chemical tank and a laser unit according to an embodiment of the present invention;
2 is a view illustrating a process of bonding a metal object and a resin object according to an embodiment of the present invention;
3 is a cross-sectional view of a mold according to an embodiment of the present invention;
4 is a cross-sectional view of a mold according to an embodiment of the present invention;

Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. However, this is merely an example and the present invention is not limited thereto.

In the following description, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. The following terms are defined in consideration of the functions of the present invention, and may be changed according to the intention or custom of the user, the operator, and the like. Therefore, the definition should be based on the contents throughout this specification.

The technical idea of the present invention is determined by the claims, and the following embodiments are merely a means for effectively explaining the technical idea of the present invention to a person having ordinary skill in the art to which the present invention belongs.

1 is a view showing a chemical tank and a laser unit according to an embodiment of the present invention.

Referring to FIG. 1, a laser-etching bonding apparatus according to an exemplary embodiment of the present invention includes a chemical tank 10 in which an etching solution S can be contained, and at least one groove (not shown) And a laser portion 20 forming a pattern 3. [

In one embodiment of the present invention, the metal object 1 and the resin target object 2 can be bonded by simultaneously applying a laser and a chemical etching method. The laser part 20 can form the pattern 3 on at least one surface of the metal object 1 in order to bond the metal object 1 and the resin object 2. [ The pattern 3 can be formed by placing the metal object 1 in the chemical bath 10 in which the etching liquid S is contained and irradiating the laser object 20 with the laser beam to the metal object 10. More specifically, the metal object 1 is placed in the chemical bath 10 containing the etching liquid S, and the laser part 20 is irradiated onto at least one surface of the metal object 1 immersed in the etching liquid S, The beam can be irradiated to form a pattern 3 comprising one or more grooves. Therefore, a separate mask for forming the pattern 3 is not required. In addition, the laser part 20 can form the pattern 3 on the metal object 10, and the pattern forming part can be etched. Therefore, since the etching is performed by the etching solution S and the laser part 10 contained in the chemical bath 10, the etching rate can be made faster than when etching is performed by only chemical etching.

The metal object 1 and the resin object 2 may be formed into a three-dimensional shape including a curved shape. The laser-etch bonding apparatus according to an embodiment of the present invention can join not only two-dimensional but also three-dimensional metal objects 1 and resin objects 2.

The chemical tank 10 has a size and a height sufficient to allow the metal object 1 to be placed and at the same time a metal object 1 is accommodated in the etchant S at a height And area.

The laser unit 20 may include a laser generating unit 21, a dynamic focusing module 23, a scan head 24, and a light collecting unit 25. Further, the laser section 20 may further include a beam expander 22.

The laser generating portion 21 can generate a laser beam for forming the pattern 3 including the grooves on at least one surface of the metal object 1. [ Specifically, the laser generating unit 21 can use a pulsed laser source. Thus, the laser generating unit 21 can generate one of a laser beam of nanosecond, picosecond, or femtosecond. For example, the femtosecond laser beam may be a microwave laser having a pulse duration of 1 to 1000 femtoseconds. Specifically, the laser generating portion 10 can generate a pulsed laser beam having a pulse duration within the femtosecond range. Here, the pulse repetition rate may be in the range of two to about three kHz, or in the range of MHz. The wavelength of the laser beam can be all of the laser wavelengths located in the ultraviolet region from the infrared region. The laser beam generated by the laser generating unit 21 may be a pulsed femtosecond laser beam and may be passed through a beam expander 22. [

The beam expander 22 can adjust the size of the laser beam generated by the laser generating unit 21. [ The beam expander 22 can enlarge or reduce the laser beam. Therefore, the laser beam generated by the laser generating unit 21 can be scaled up or down by way of the beam expander 22.

The laser section 20 may include a dynamic focusing module 23 and a scan head 24 to adjust the focus height and focus position of the laser beam that can be irradiated.

 The dynamic focusing module 23 adjusts the focus position of the laser beam by adjusting the focal position of the laser beam, and the scan head 24 adjusts the focal positions of the x and y axes of the laser beam, It is possible to adjust the focal position of the lens. It is possible to form a pattern 3 having a uniform width and depth in a three-dimensional metal object 1 having a height difference of several mm to several tens mm by adjusting the focal position of the z axis with the dynamic focusing module 23 . Further, the focus position of the z axis is adjusted by the dynamic focusing module 23 to form a pattern 3 of non-uniform width and depth on the three-dimensional metal object 1 having a height difference of several mm to several tens mm can do.

The dynamic focusing module 23 can adjust the focal position of the laser beam passing through the light collecting part 25 in accordance with the three-dimensional machining data of the metal object 1. [ Specifically, the dynamic focusing module 23 may include two lenses. That is, the dynamic focusing module 24 may include a first lens (not shown) and a second lens (not shown). The distance between the first lens and the second lens can be adjusted to control the divergence and convergence of the laser beam passing through the dynamic focusing module 23 so that the focus of the laser beam passing through the light collecting part 25 can be adjusted. In other words, the dynamic focusing module 23 can adjust the focal height of the laser beam, i.e., the z-axis position of the focus. The dynamic focusing module 23 can adjust the z-axis position of the laser beam, that is, the focal height of the laser beam, by adjusting the convergence and divergence of the laser beam via the beam expander 22.

The dynamic focusing module 23 can control the distance of the laser beam emitted to the scan head 24 by controlling the horizontal reciprocating motor (not shown). For example, when the motor makes a horizontal reciprocating movement, when the dynamic focusing module 23 moves to the left in the direction of the beam expander 22 in Fig. 1, the focus of the laser beam is moved away from the metal object 1 , The height of the laser beam can be shortened. On the other hand, when the dynamic focusing module 23 moves to the right side in the direction of the light condensing portion 25, the laser beam approaches the metal object 1, so that the height of the laser beam can be increased. Therefore, the focal position of the laser beam incident on the metal object 1 can be controlled in the z-axis direction.

It can be patterned along the height of the surface of the three-dimensional shape of the metal object 1 through the dynamic focusing module 23. When the metal object 1 includes a three-dimensional shape, it has a height difference of several millimeters to several tens of millimeters. At this time, the position at which the pattern 3 is to be formed by the laser beam may be different in height (i.e., z-axis) along the respective x-axis and y-axis. The z-axis position adjustment of the focus of the laser beam through the dynamic focusing module 23 can form various patterns 3 corresponding to different z-axis positions for each of the x-axis and y-axis coordinates. In addition, the pattern 3 can be formed in a nanoscale to micro-line width. The dynamic focusing module 23 can move the lenses of the optical system or the movement of the internal optical system. Therefore, the height of the laser beam can be controlled at high speed in real time, so that various pattern shapes on the surface of the metal object 1 including the three-dimensional shape can be processed, and productivity can be improved.

The x-axis and y-axis focal positions of the laser beam whose z-axis focal position is adjusted by the dynamic focusing module 23 can be adjusted by the scan head 24.

The scan head 24 is capable of adjusting the focus positions of the x and y axes of the metal object 1. The scan head 24 includes an x-axis scan mirror (not shown) and a y-axis scan mirror (not shown) to perform two-dimensional scanning. the laser beam can be finely controlled along the curved surface of the metal object 1 including the three-dimensional shape through the x-axis scan mirror and the y-axis scan mirror in the x- and y-axis directions.

The x-axis scan mirror and the y-axis scan mirror of the scan head 24 can reflect the laser beam in the direction for forming the pattern 3 to irradiate the laser beam to a desired position of the metal object 1 . The x-axis scan mirror and the y-axis scan mirror are composed of a pair of scan mirrors in the form of a galvanometer, each of which deflects the laser beam in one of the axes crossing the xy plane, .

Therefore, as described above, the dynamic focusing module 23 and the scan head 24 can adjust the focus height and focus position of the laser beam. The laser beam can be scaled up or down while being passed through the beam expander 20 and the laser beam passed through the beam expander 20 is adjusted by the dynamic focusing module 31 in the z- The x and y coordinates are adjusted by the head 32 so that the focal position of the laser beam can be adjusted so as to correspond to the metal object 1. [ Therefore, the metal object 1 can be formed with the pattern 3 including at least one groove portion for joining. The pattern 3 formed by the laser part 20 is etched by the etching solution S contained in the chemical bath 10 so that the groove part of the pattern 3 can be formed.

 The light collecting unit 25 can focus the laser beam having passed through the dynamic focusing module 23 and the scan head 24 to the metal object 1. The light collecting portion 25 can focus the laser beam. The light collecting section 25 can condense the laser beam and irradiate the laser beam to the metal object 1. [ The light collecting part 50 may include a telecentric F-theta lens or an F-theta lens. As a result, fine patterns of micro- or nano-sized units can be processed.

Therefore, the irradiation position of the laser beam, the focal distance, the pulse waveform of the laser beam to be output, the irradiation time, the laser power, the processing speed, the pattern of the laser beam to form the pattern for bonding to the metal object 1, Data, and the like. The pattern 3 formed on the metal object 1 by the laser beam irradiated by the laser part 20 can have a nano-sized width and pattern depth in micro size.

2 is a view illustrating a process of bonding a metal object and a resin object according to an embodiment of the present invention.

As described above, the metal body 1 can be formed with the pattern 3 including at least one groove portion by the chemical tank 10 and the laser portion 20.

The metal object 1 on which the pattern 3 is formed can be inserted into the mold 30. [ The resin object 2 is injected into the mold 30 in which the metal object 1 is inserted and the injected resin object 2 can be injected into the pattern 3 formed on the metal object 1. [ The metal target body 1 and the resin target body 2 can be bonded more firmly by injecting the resin target body 2 into the pattern 3. [ Particularly, the metal object 1 and the resin target body 2 can be firmly joined as the groove portion is more complicated, as the pattern 3 includes the concavo-convex shaped groove portion.

Referring to FIG. 2A, a pattern 3 including at least one groove portion may be formed on at least one surface of the metal object 1. In FIG. The pattern 3 may be formed on the surface of the metal object 1 to be bonded to the resin object 2. The pattern 3 may include one or more grooves (not shown). Preferably, the groove portion may be formed in plurality to increase the bonding strength between the metal object 1 and the resin object 2. [ Therefore, the number of the grooves can be determined according to the size or area of the metal object 1 and the resin target 2 to be bonded and the required bond strength. Further, concaves and convexes may be formed in the groove portion of the pattern 3. The metal object 1 and the resin object 2 can be bonded more firmly through the unevenness.

The pattern 3 may be formed on at least one surface of the metal object 1 by laser and chemical etching. Specifically, a metal object 1 is placed in a chemical tank 10 containing an etching solution S, and a desired pattern 3 is formed by irradiating the metal object 1 with a laser beam through the laser part 10 can do. The portion of the metal object 1 irradiated with the laser beam is etched by the etching liquid S so that the pattern 3 including the groove portion can be formed. Preferably, the pattern 3 may include a groove portion in a concavo-convex shape.

Referring to FIG. 2B, the metal object 1 having the pattern 3 formed thereon can be inserted into the metal mold 30. The mold 30 may include a lower mold 31, a top mold 32 and an injection port 33. [

One of the lower mold 31 and the upper mold 32 may be formed with an injection port 33. The metal object 1 having the pattern 3 formed thereon can be inserted into the upper mold 31 or the lower mold 32 in which the injection port 33 is not formed. The resin object 31 can be injected through the injection port 33 formed in the other upper mold 32 or the lower mold 31. [ Hereinafter, the case where the mold 1 is inserted into the lower mold 31 and the injection port 33 is formed in the upper mold 32 will be described.

The metallic object 1 with the pattern 3 formed thereon is inserted into the lower mold 31 and the injection port 33 through which the resinous object 32 can be injected into the upper mold 32 can be formed. The resin target body 32 can be injected into the injection space A existing in the upper mold 32 through the injection port 33. [

2C, the resin object 2 injected into the injection space A through the injection port 33 can be injected up to the pattern 3 formed on the metal object 1. Therefore, as shown in Fig. 2D, the metal object 1 and the resin object 2 can be bonded.

FIG. 3 and FIG. 4 are cross-sectional views illustrating a bonded cross-section of a mold according to an embodiment of the present invention.

3 and 4, at least one injection port 33 of the mold 30 may be formed. 3, the mold 30 includes a single injection port 33, and in the case of FIG. 4, the mold 30 may include a plurality of injection ports 33. In FIG.

A plurality of injection ports 33 into which the resin target body 2 is injected can be formed in order to shorten the process when the resin target body 2 is bonded to the large-area metal object 1. [ Therefore, the process for bonding the metal object 1 and the resin target object 2 through the plurality of injection ports 33 can be shortened.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, . Therefore, the scope of the present invention should not be limited to the above-described embodiments, but should be determined by equivalents to the appended claims, as well as the appended claims.

1: metal object
11: metal surface
2: Resin object
3: Pattern
10: chemical tank
20: laser part
21: laser generator
22: beam expander
23: Dynamic focusing module
24: scan head
25: Concentrator
30: Mold
31: Lower mold
32: HYPER
33: inlet
A: Injection space
S: Etching solution

Claims (19)

A chemical tank capable of containing an etching solution; And
And a laser part for irradiating a laser beam onto at least one surface of a metal object located in the chemical tank containing the etching solution to determine a shape of a pattern including a plurality of grooves,
Wherein the shape of the pattern is determined by the laser beam in the chemical tank while the etching of the pattern is performed by the etching liquid,
The metal object to which the pattern is formed is inserted into a mold, the resin object is injected into the metal mold into which the metal object is inserted, the injected resin object is injected into the pattern, and the metal object and the resin object are joined ,
Wherein the pattern includes grooves formed in directions intersecting with each other, the grooves being formed in a non-uniform width and depth,
Wherein the at least one groove portion includes a surface of a concavo-convex shape, and the metal object and the resin object are bonded to each other.
The method according to claim 1,
Wherein at least one of the metal object and the resin object includes a three-dimensional shape.
delete The method according to claim 1,
The laser unit includes:
A laser generator;
A dynamic focusing module for adjusting a z-axis focal position of the laser beam;
A scan head for adjusting focus positions of the x- and y-axes of the laser beam;
And a light collecting part for irradiating the laser beam onto the metal object,
Wherein the scan head comprises a galvanometer comprising an x-axis scan mirror and a y-axis scan mirror,
Wherein the pattern formed on the metal object by the laser beam irradiated by the laser part can have a width and a pattern depth of nano-size in micro size.
The method of claim 4,
Wherein the laser generating unit generates a laser beam of one of a nanosecond, a picosecond, or a femtosecond using a pulsed laser beam source to form a nano-sized or micro-sized pattern on the metal object, - Adhesion device using etching.
The method of claim 4,
And a control unit for extracting x, y and z axis data of the metal object and controlling the scan head and the dynamic focusing module.
The method of claim 6,
The control unit controls a dynamic focusing module that adjusts the z-axis focal position of the laser beam and a scan head that adjusts the focus position of the x and y axes to adjust at least one of the formation position, depth, A laser-etch bonding apparatus.
The method according to claim 1,
Wherein the mold includes an upper mold and a lower mold,
And an injection port formed in at least one of the upper and lower molds.
The method of claim 8,
Wherein the metal object having the pattern is inserted into the upper mold or the lower mold in which the injection port is not formed, and the resin object is injected through the injection port.
The method of claim 9,
Wherein the resin object injected into the mold is injected up to the pattern of the metal object, and the metal object and the resin object are bonded.
At least one surface of a metal object located in a chemical tank containing an etchant is irradiated with a laser beam to determine the shape of a pattern including a plurality of grooves crossing each other in the depth direction,
Wherein the etching solution is etched along a pattern formed on the metal object by the etching solution contained in the chemical bath,
The metal object to which the pattern is formed is inserted into a metal mold, a resin object is injected into the metal mold into which the metal object is inserted, the injected resin object is injected into the pattern, the metal object and the resin object are joined ,
Wherein the shape of the pattern of the metal object is determined by the laser beam in the chemical bath and etching of the pattern is performed by the etching liquid,
The laser beam is formed with a non-uniform width and depth by adjusting the focal position of the laser beam,
Wherein the plurality of grooves include a surface of a concavo-convex shape,
Wherein a bonding force between the metal target and the resin target is increased by the surface of the concavo-convex form and the groove formed in a direction intersecting each other.
The method of claim 11,
Wherein at least one of the metal object and the resin object includes a three-dimensional shape.
delete The method of claim 11,
The laser beam, which is formed by the laser generating portion,
The focus position of the z axis irradiated on the metal object is adjusted by the dynamic focusing module,
The focus position of the x-axis and y-axis irradiated on the metal object is adjusted by the scan head,
The laser beam is irradiated onto the metal object through the light collecting portion through which the laser beam passes,
The pattern formed on the metal object by the laser beam irradiated by the laser unit may have a width and a depth of nanosize in a micro size,
Wherein the pattern can be formed on the metal object having a three-dimensional shape.
15. The method of claim 14,
Wherein the laser generating unit generates a laser beam of one of a nanosecond, a picosecond, or a femtosecond using a pulsed laser beam source to form a nano-sized or micro-sized pattern on the metal object, - Bonding method using etching.
15. The method of claim 14,
The x, y and z axis data of the metal object is extracted by the control unit, the scan head and the dynamic focusing module are controlled so as to correspond to the extracted data,
Wherein at least one of formation position, depth, size, and width of a pattern formed on a surface of the metal object is controlled.
The method of claim 11,
Wherein the mold includes an upper mold and a lower mold,
Wherein an injection port is formed in at least one of the upper and lower molds.
18. The method of claim 17,
Wherein the metal object is inserted into the upper mold or the lower mold in which the injection port is not formed, and the resin object is injected through the injection port.
19. The method of claim 18,
Wherein the resin object injected into the mold is injected up to the pattern so that the metal object and the resin object are bonded.

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