KR101915946B1 - Flexible printed circuit boards - Google Patents

Abstract

A base film including a first surface and a second surface; a wiring pattern formed on the first surface of the base film; and a first ground pattern formed on the first surface so as to be adjacent to an end of the base film, And a first probe scan region moving sequentially while electrically contacting a plurality of wiring patterns arranged in parallel with each other, wherein the wiring pattern includes a first wiring connected to the first ground pattern, And is not formed in the first probe scan region.

Description

[0001] FLEXIBLE PRINTED CIRCUIT BOARDS [0002]

 The present invention relates to a flexible circuit board, and more particularly, to a flexible circuit board including a ground pattern for discharging static electricity on a wiring pattern formed on a substrate.

BACKGROUND ART [0002] In recent years, a chip on film (COF) package technology using a flexible circuit board has been used in electronic devices in accordance with the miniaturization trend. The flexible circuit board and the COF package technology using the flexible circuit board are used for a flat panel display (FPD) such as a liquid crystal display (LCD), an organic light emitting diode do.

Particularly, in the COF in which the driver IC for driving a flat panel display is mounted on the flexible circuit board, the degree of integration of the wiring pattern of the flexible circuit board increases with the increase in the resolution of the display.

A flexible circuit board on which highly integrated wiring patterns are formed may be susceptible to static electricity, and various methods have been proposed in order to secure reliability of operation of the flexible circuit board from static electricity. Among the proposed methods, there is a difficulty in the structure that connects the wiring pattern and the ground pattern because there is a possibility of signal distortion during operation inspection of the flexible circuit board.

SUMMARY OF THE INVENTION The present invention provides a flexible circuit board that prevents static electricity from being generated and reduces signal distortion during operation inspection of a flexible circuit board.

The technical objects of the present invention are not limited to the technical matters mentioned above, and other technical subjects not mentioned can be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, there is provided a flexible circuit board including a base film including a first side and a second side, a wiring pattern formed on the first side of the base film, Wherein the base film includes a first probe scan region that moves while electrically contacting a plurality of wiring patterns arranged in parallel on one surface in a sequential manner, And a first wiring connected to the first ground pattern, wherein the first wiring is not formed in the first probe scan region.

In some embodiments of the present invention, the semiconductor device further includes a second wiring pattern formed on the other surface of the base film, and a second ground pattern formed on the other surface of the base film so as to be adjacent to the end of the base film, Wherein the base film includes a second probe scan region moving sequentially while electrically contacting a plurality of wiring patterns arranged in parallel on the other surface of the base film, And a second wiring electrically connected to the first probe scan region and not formed on the second probe scan region.

In some embodiments of the present invention, the device further includes a via penetrating the base film, wherein the first ground pattern and the second ground pattern may be electrically connected through the vias.

In some embodiments of the present invention, the second ground pattern may overlap at least a portion of the first ground pattern.

In some embodiments of the present invention, the first ground pattern may be formed in an outer area surrounding the first wiring pattern of the base film.

In some embodiments of the present invention, the base film further includes a dummy pattern formed in the first probe scan region, wherein the dummy pattern is not connected to the first wiring pattern and the first ground pattern.

In some embodiments of the present invention, the first ground pattern comprises a first sub-pattern and a second sub-pattern spaced apart by the probe scan region, the dummy pattern comprising a first sub- And may be formed in the probe scan region between the patterns.

In some embodiments of the present invention, the first probe scan region and the first ground pattern may not overlap.

The details of other embodiments are included in the detailed description and drawings.

The flexible circuit board according to embodiments of the present invention includes a ground pattern connected to a ground voltage on a base film. The wiring pattern is electrically connected to the ground pattern to effectively discharge the static electricity generated on the wiring pattern, The reliability of the operation is improved.

On the other hand, when the open / short of the wiring pattern to be inspected by contact with the probe is checked, the ground pattern or the wiring connected thereto is not formed on the probe scan region where the probe moves, thereby improving the reliability of the contact inspection.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description of the claims.

1 and 2 are top plan views of one side and another side of a flexible circuit board according to an embodiment of the present invention, respectively.
3 is an enlarged view of an enlarged view of FIG.
4 is an enlarged view of a portion of a flexible circuit board according to another embodiment of the present invention.
FIG. 5A is an enlarged view of FIG. 1B.
5B is a cross-sectional view taken along line C-C 'in FIG. 5A.
6 is an enlarged view of a portion of a flexible circuit board according to another embodiment of the present invention.
FIG. 7 is an enlarged view of FIG. 2D.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and the manner of achieving them, will be apparent from and elucidated with reference to the embodiments described hereinafter in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. The dimensions and relative sizes of the components shown in the figures may be exaggerated for clarity of description. Like reference numerals refer to like elements throughout the specification and "and / or" include each and every combination of one or more of the mentioned items.

It is to be understood that when an element or layer is referred to as being "on" or " on "of another element or layer, All included. On the other hand, a device being referred to as "directly on" or "directly above " indicates that no other device or layer is interposed in between.

The terms spatially relative, "below", "beneath", "lower", "above", "upper" May be used to readily describe a device or a relationship of components to other devices or components. Spatially relative terms should be understood to include, in addition to the orientation shown in the drawings, terms that include different orientations of the device during use or operation. For example, when inverting an element shown in the figures, an element described as "below" or "beneath" of another element may be placed "above" another element. Thus, the exemplary term "below" can include both downward and upward directions. The elements can also be oriented in different directions, so that spatially relative terms can be interpreted according to orientation.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. The terms " comprises "and / or" comprising "used in the specification do not exclude the presence or addition of one or more other elements in addition to the stated element.

Although the first, second, etc. are used to describe various elements or components, it is needless to say that these elements or components are not limited by these terms. These terms are used only to distinguish one element or component from another. Therefore, it is needless to say that the first element or the constituent element mentioned below may be the second element or constituent element within the technical spirit of the present invention.

Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

1 and 2 are top plan views of one side and another side of a flexible circuit board according to an embodiment of the present invention, respectively.

1 and 2, a flexible circuit board according to an embodiment of the present invention includes a base film 10, a first wiring pattern 20, a second wiring pattern 120, a first ground pattern 40, , And a second ground pattern (140).

The base film 10 may be formed of a flexible material, and may be included as a base material on the flexible circuit board to bend or fold the flexible circuit board. The base film 10 may be, for example, a polyimide film. Alternatively, the base substrate 10 may be a PET film, a polyethylene naphthalate film, a polycarbonate film, or an insulating metal foil. In the flexible circuit board according to the embodiment of the present invention, the base film 10 is described as a polyimide film.

At least one probe scan region 100, 110, 200, 210 may be disposed in the base film 10. The probe scan regions 100, 110, 200 and 210 are connected to the base films 10 and 20 in a state where the probes are in contact with the wiring patterns 20 and 120 in order to perform a short / open test of the wiring patterns 20 and 120. [ ) Phase. The probes are sequentially brought into electrical contact while moving on the wiring patterns 20 and 120 arranged side by side on one side of the base film 10 to perform a probe scan and the probe can generate a probe scan signal.

In some embodiments of the present invention, a probe scan may be performed in the width direction of the base film 10 with respect to the front surface of the flexible circuit board. In this case, the probe scan regions 100, 110, 200 and 210 may be arranged to extend in the width direction of the base film 10 and to connect one end and the other end in the width direction of the base film 10.

Alternatively, the probe scan regions 100, 110, 200, and 210 may be formed in the longitudinal direction (vertical direction in FIG. 1) or the diagonal direction of the flexible circuit board.

In the flexible circuit board according to the embodiment of the present invention, the surface on the base film 10 on which the first wiring pattern 20 shown in FIG. 1 is formed is referred to as one surface for convenience of description, The surface on the base film 10 on which the pattern 120 is formed is described as the other surface.

1 and 2 illustrate two probe scan regions (100 and 110 in FIG. 1) arranged on one side of the base film 10 and two probe scan regions (200 in FIG. 2) , 210). Of course, the number of the probe scan regions 100, 110, 200, and 210 may be at least one probe scan region depending on the region where the shorting / opening test of the scanning method by the probe is performed in the flexible circuit board according to the embodiment of the present invention It will be apparent to those skilled in the art.

On the base film 10, for example, a mounting area 120 in which an integrated circuit (IC) chip can be mounted can be included. A part of the first wiring pattern 20 may extend to the mounting region 120 and function as a terminal portion for electrically connecting the integrated circuit chip mounted on the flexible circuit board and the flexible circuit board.

The first wiring pattern 20 may be formed on one side of the base substrate 10. The first wiring patterns 20 may be formed in a strip shape on the first surface of the base substrate 10 at regular intervals. The first wiring pattern 20 may include, for example, a conductive material such as copper, but the present invention is not limited thereto. Specifically, the first wiring pattern 20 may be made of a material having electrical conductivity such as gold, aluminum, or the like.

Since at least one portion of the first wiring pattern 20 overlaps with the probe scan regions 100 and 110 because probe scan regions 100 and 110 extending across both ends are disposed on one surface of the base film 10 .

The first ground pattern 40 may be formed on one side of the base film 10 so as to be adjacent to the end of the base film 10. The first ground pattern 40 may be connected to the ground voltage to ground at least a part of the first wiring pattern 40 of the flexible circuit board. In some embodiments of the present invention, the first ground pattern 40 may comprise a plurality of subpatterns 41, 45, 46. The plurality of sub patterns 41, 45 and 46 can constitute the first ground pattern 40 separated by the probe scan regions 100 and 110 across one surface of the base film 10.

In some embodiments of the present invention, the first ground pattern 40 may be disposed to surround the first wiring pattern 20. That is, the first ground pattern 40 is disposed adjacent to the end portion of the base film 10 and surrounding the outer film region of the base film 10, and the first wiring pattern 20 is formed as the first ground pattern 20 Can be disposed in the area on the enclosed base film (10).

The first wiring pattern 20 may include at least one first wiring 30, 31 connected to the first ground pattern 40. The first wirings 30 and 31 may not be formed on the probe scan regions 100 and 110. [ Hereinafter, the first wiring 30 will be described in more detail with reference to FIGS. 1 and 3. FIG.

3 is an enlarged view of an enlarged view of FIG.

The first wiring pattern 20 can be extended in various shapes on the base film 10 according to the design of the flexible circuit board. The first wiring pattern 20 may include a wiring 36 extending over the probe scan region 100, a wiring 37 extending from the mounting region 120 but not extending into the probe scan region 100, And wirings 37 extending across the probe scan region 100, and the like.

In the flexible circuit board according to the embodiment of the present invention, static electricity may be generated in the highly integrated and arranged first wiring pattern 20. The generated static electricity may cause noise on the flexible circuit board or may be transmitted to the integrated circuit chip mounted in the mounting area 120 through the first wiring pattern 20 to damage the integrated circuit chip.

In order to remove the static electricity generated in the flexible circuit board, the first ground pattern 40 and the area where static electricity is generated are electrically connected through the first wirings 30 and 31 so that the static electricity is transferred to the outside of the flexible circuit board Can be discharged. In particular, the first wiring 30 may extend to the region where the static electricity is generated.

On the other hand, the probe scan regions 100 and 110 move in one direction while the probes are in contact with the wiring patterns to test whether they are short-circuited or not. At this time, when the probes are brought into contact with the first wirings (30, 31) electrically connected to the first ground pattern (40) and connected to the ground voltage, distortion occurs in the probe scan signal, It may not be clearly inspected.

In the flexible circuit board according to the embodiment of the present invention, the first wiring 30 connected to the first ground pattern 40 does not overlap with the probe scanning region 100. Therefore, when the probe is scanned to check whether the wiring pattern is short-circuited or not, the first wiring 30 and the probe are not in contact with each other. Therefore, distortion may not occur in the probe scan signal due to the ground voltage.

4 is an enlarged view of a portion of a flexible circuit board according to another embodiment of the present invention.

Referring to FIG. 4, the flexible circuit board according to another embodiment of the present invention may further include a dummy pattern 50 formed in the probe scan region 100. The dummy patterns 50 disposed in the probe scan region 100 may not be electrically connected to the first wiring patterns 30. [

4, the wirings 35 and 37 included in the first wiring pattern 20 and the dummy pattern 50 not connected to the first wiring 30 are electrically connected to the probe scan region 100 . The dummy pattern 50 is not electrically connected to the ground pattern 40 because the dummy pattern 50 is not connected to the first wiring 30 and therefore the ground voltage is not provided in the dummy pattern 50. [ During probe scanning, the dummy pattern 50 may contact the probe.

4, the dummy pattern 50 may include a plurality of wirings extending in the longitudinal direction of the base film 10 in the probe scan region 100, but the present invention is not limited thereto. The dummy pattern 50 may be disposed in the probe scan region 100 at a predetermined angle in the width direction of the base film 10 so that a plurality of horizontal line patterns and a plurality of vertical line patterns cross each other, A pattern may be formed.

1 and 2, a second wiring pattern 120 is disposed on the other surface of the base film 10 and the second wiring pattern 120 is formed of a material substantially the same as the first wiring pattern 20 . ≪ / RTI > It will be apparent to those skilled in the art that the first wiring pattern 20 and the second wiring pattern 120 may have different wiring layouts according to the design intent of the flexible circuit board.

Although not shown, the first wiring pattern 20 and the second wiring pattern 120 may be electrically connected to each other by vias passing through the base film 10.

The second ground pattern 140 is formed on the other surface of the base film 10 so as to surround the second wiring pattern 120. The second ground pattern 140 may be electrically connected to the second wiring 130 included in the second wiring pattern 120. The second wiring 130 may ground the area where static electricity is generated on the other surface of the base film 10 and discharge the static electricity to the outside of the flexible circuit board as in the case of the first wiring 30.

The first ground pattern 40 and the second ground pattern 140 will be described with reference to Figs. 5A and 5B.

FIG. 5A is an enlarged view of FIG. 1B, and FIG. 5B is a cross-sectional view taken along line C-C 'of FIG. 5A. 5B, sub patterns 45 and 145 are shown that are part of the first ground pattern 40 and the second ground pattern 140, respectively.

In some embodiments of the present invention, as shown in FIGS. 5A and 5B, at least a portion of the first ground pattern 40 and the second ground pattern 140 may overlap. The first ground pattern 40 and the second ground pattern 140 are formed on both sides of the base film 10 and can be electrically connected by the vias 60 penetrating the base film 10.

That is, the via 60 penetrates the base film 10, and the first ground pattern 40 and the second ground pattern 140 are electrically connected to each other by the conductive material filling the via 60. By connecting the first ground pattern 40 and the second ground pattern 140 to each other, the two ground patterns 140 can provide the same ground voltage.

For example, the first ground pattern 40 may be configured so that a plurality of horizontal line patterns and a plurality of vertical line patterns are connected to each other, but the present invention is not limited thereto. Depending on the design intent, the shape of the first ground pattern 40 may be deformed to be formed on one side of the base film 10.

Also, although not shown in FIG. 5A, the second ground pattern 140 formed on the other surface of the base film 10 may also be formed by connecting a plurality of horizontal line patterns and a plurality of vertical line patterns, for example.

As described above, since the probe scanning signal may be distorted when the probe contact occurs when the first ground pattern 40 is formed in the probe scanning area 100, the first ground pattern 40 may be formed in the probe scanning area 100 are not formed. The second ground pattern 140 is not formed in the probe scanning areas 200 and 210 on the other surface of the base film 10 and the distortion of the probe scanning signal generated when scanning the probes on the other surface of the base film 10 .

6 is an enlarged view of a portion of a flexible circuit board according to another embodiment of the present invention.

Referring to FIG. 6, the flexible circuit board according to another embodiment of the present invention may include a dummy pattern 52 formed in the probe scanning area 100. Since the dummy pattern 52 is not electrically connected to the first ground pattern 45, no ground voltage is provided. Therefore, even when the dummy pattern 52 and the probe are in contact with each other during probe scanning, the probe signal generated may not be distorted.

As shown in FIG. 6, the dummy pattern 52 may be configured so that a plurality of horizontal line patterns and a plurality of vertical line patterns are connected to each other in the probe scan region 100, but the present invention is not limited thereto. The dummy pattern 52 may extend in one direction in the probe scan region 100 and may be configured such that a plurality of wiring patterns are spaced apart at regular intervals.

The probe scan region 100 and the first ground pattern 40 do not overlap. That is, as shown in FIG. 1, the first ground patterns 41 and 45 are divided by the probe scan region 100 connecting one end in the width direction of the base film 10 with the other end.

Likewise, the second ground pattern 140 and the probe scan region 200 do not overlap. The second ground pattern 140 can be divided into a plurality of ground patterns 141 and 145 by the probe scan region 200 extending in the width direction of the other surface of the base film 10. [

Also, a dummy pattern (not shown) may be formed between the plurality of ground patterns 141 and 145 separated by the probe scan region 200. [

2, at least one probe scan region 200, 210 is formed on the other surface of the base film 10 as described above, but this is merely an example, and a wiring pattern (not shown) formed on the other surface of the base film 10 It will be apparent to those skilled in the art that the number of probe scan regions may vary depending on the region in which the short / open test is performed.

FIG. 7 is an enlarged view of FIG. 2D.

7, a second wiring pattern 120 and a second wiring 230 connected to the second ground pattern 140 are shown. The reason why the second wiring 230 connected to the second ground pattern 140 is not formed on the second probe scanning area 210 is that the description of the first ground pattern 40 and the first wirings 30 and 31 same.

In some embodiments of the present invention, the second wiring 230 may be electrically connected to the first wiring 31 via a via (not shown) formed in the substrate. Also, the dummy wiring pattern may be formed on the second probe scanning region 210 so as to be spaced apart from the second wiring 230.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It is to be understood that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

10: base film 20: first wiring pattern
30, 31: first wiring 40: first ground pattern
41, 45, 46: Subpattern 60: Via
120: second wiring pattern 130, 230: second wiring
140: second ground pattern

Claims (8)

A base film including one side and the other side;
A first wiring pattern formed on the one surface of the base film; And
And a first ground pattern formed on the one surface so as to be adjacent to at least one end of the base film,
Wherein the base film includes a first probe scan region in which the probe sequentially moves in electrical contact with the first wiring pattern arranged side by side on one surface,
Wherein the first ground pattern is formed in an outer region surrounding the first wiring pattern of the base film and the first ground pattern comprises a first sub pattern spaced apart by the first probe scan region and a second sub pattern spaced apart by the first probe scan region, / RTI >
Wherein the first wiring pattern includes a first wiring branched from the first ground pattern, wherein the first wiring is not formed in the first probe scanning region. The method according to claim 1,
A second wiring pattern formed on the other surface of the base film,
And a second ground pattern formed on the other surface of the base film so as to be adjacent to the end of the base film,
Wherein the base film includes a second probe scan region in which the probe sequentially moves in electrical contact with the second wiring pattern arranged side by side on the other surface of the base film,
Wherein the second wiring pattern includes a second wiring electrically connected to the second ground pattern and not formed on the second probe scan region. 3. The method of claim 2,
Further comprising a via through the base film,
Wherein the first ground pattern and the second ground pattern are electrically connected through the via. 3. The method of claim 2,
Wherein the second ground pattern overlaps with at least a portion of the first ground pattern. delete The method according to claim 1,
And a dummy pattern formed in the first probe scan region on the base film,
Wherein the dummy pattern is not connected to the first wiring pattern and the first ground pattern. The method according to claim 6,
Wherein the dummy pattern is formed in the first probe scan region between the first sub pattern and the second sub pattern. The method according to claim 1,
Wherein the first probe scan region and the first ground pattern do not overlap.

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