KR101895098B1 - Method for manufacturing laminated body - Google Patents

Abstract

The present invention provides a method for producing a laminate by chamfering a side edge portion of a laminate block having a substrate and a reinforcing plate and a reinforcing plate having a resin layer and a supporting plate, Wherein the grinding surface of the grinding wheel is inclined with respect to an interface between the resin layer and the substrate and an interface between the resin layer and the support plate at an angle to the interface between the resin layer and the support plate To a method for producing a laminated body to be contacted.

Description

[0001] METHOD FOR MANUFACTURING LAMINATED BODY [0002]

The present invention relates to a method for producing a laminate.

Electronic devices such as display panels such as a liquid crystal display (LCD), a plasma display (PDP), and an organic EL display (OLED), solar cells and thin film secondary batteries are required to be thinned and lightweight. Thinning is progressing. If the rigidity of the substrate is lowered by thinning, the handling property of the substrate is deteriorated. In addition, if the thickness of the substrate is changed by thinning, it becomes difficult to manufacture an electronic device using existing equipment.

Therefore, a reinforcing plate is attached to the substrate to form a laminated block, a predetermined functional layer (for example, a conductive layer) is formed on the substrate of the laminated block, and then the reinforcing plate is peeled from the substrate of the laminated block (See, for example, Patent Document 1). According to the above method, handling properties of the substrate can be ensured, and a thin electronic device using existing equipment can be manufactured.

The reinforcing plate has a resin layer releasably coupled to the substrate and a support plate for supporting the substrate via the resin layer. The resin layer is formed by applying a resin composition having flowability onto a support plate and curing it. The resin composition is, for example, a silicone resin composition comprising a straight-chain polyorganosiloxane having a vinyl group and a methylhydrogenpolysiloxane having a hydrosilyl group, and is heat-cured in the presence of a platinum catalyst. The resin layer in which the resin composition includes a cured product is excellent in heat resistance and peelability.

Japanese Patent Application Laid-Open No. 2007-326358

6 is a side view of a conventional laminate block. The laminate block 111 has a substrate 112 and a reinforcing plate 113 for reinforcing the substrate 112. The reinforcing plate 113 has a resin layer 114 that is detachably coupled to the substrate 112 and a support plate 115 that supports the substrate 112 via the resin layer 114. For the purpose of improving the impact resistance of the laminate block 111, the side edge portion of the laminate block 111 is chamfered.

7 is a plan view showing a method of chamfering the side edge portion of the laminate block shown in Fig. 8 is a side view showing a method of chamfering the side edge portion of the laminate block shown in Fig.

The side edge portion 111a of the laminate block 111 is ground into the grindstone 121. [ The grindstone 121 is a disc-shaped rotating grindstone, and a grind groove 122 (FIG. 8) is formed on the entire circumference of the outer peripheral surface 121a. The grinding wheel 121 is rotated in the circumferential direction of the grinding wheel 121 (X direction in FIG. 7) in a state in which the wall surface 122a of the grinding groove 122 is in contact with the side edge portion 111a of the stacking block 111, The side edge portion 111a of the laminate block 111 is ground in the same shape as the shape of the grinding groove 122 by moving relative to the laminate block 111 (Y direction in FIG. 7).

The wall surface 122a as the grinding surface is vertically contacted with the resin layer 114 and the interface 116 of the substrate 112 and the interface 117 between the resin layer 114 and the support plate 115. [ In this case, at least one of the substrate 112 and the support plate 115 may be lacking in the vicinity of at least one of the interface 116 and the interface 117.

The abrasive grains contained in the wall surface 122a cause the micro cracks 118 to be generated on the side surfaces of the laminate block 111 and the micro cracks 118 reach at least one of the interface 116 and the interface 117 . The micro crack 118 tends to be obliquely extended with respect to the wall surface 122a as shown in Fig.

Fig. 9 is a side view of a laminate obtained by chamfering a side edge portion of the laminate block shown in Fig. 7; Fig. In Fig. 9, the state of the laminate block before grinding is indicated by a chain double-dashed line.

The laminate 131 obtained by grinding the side edge portion 111a of the laminate block 111 has the substrate 132 and the reinforcing plate 133 similarly to the laminate block 111 and the reinforcing plate 133 And has a resin layer 134 and a support plate 135. On the side surface of the layered product 131, a concave portion 139 is formed by microcracks 118 (FIG. 8) generated during grinding.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a method of manufacturing a laminate capable of reducing occurrence of cutting by grinding.

In order to solve the above object,

A side edge portion of a laminate block having a substrate and a reinforcing plate for reinforcing the substrate, the reinforcing plate having a resin layer releasably engaged with the substrate and a support plate for supporting the substrate via the resin layer is chamfered A method for producing a laminate,

And a grinding step of grinding the side edge portion of the laminate block with a grinding stone, wherein in the grinding step, the grinding surface of the grinding wheel is inclined at an angle between the interface between the resin layer and the substrate and the interface between the resin layer and the support plate A method for producing a laminated body to be contacted is provided.

INDUSTRIAL APPLICABILITY According to the present invention, it is possible to provide a method of manufacturing a laminate capable of reducing occurrence of cutting due to grinding.

1 is a side view of a laminated block used in a method of manufacturing a laminated body according to an embodiment of the present invention.
2 is a plan view showing a method of manufacturing a laminate according to an embodiment of the present invention.
3 is a side view showing a method of manufacturing a laminate according to an embodiment of the present invention.
4 is a side view of a laminate obtained by the method for producing a laminate according to one embodiment of the present invention.
5A is a side view showing an example of the relationship between the angle formed between the wall surface which is the grinding surface and the interface and the offset amount.
5B is a side view showing an example of the relationship between the angle formed between the wall surface which is the grinding surface and the interface and the offset amount;
5C is a side view showing an example of the relationship between the angle formed between the wall surface which is the grinding surface and the interface and the offset amount;
6 is a side view of a conventional laminate block.
Fig. 7 is a plan view showing a method of chamfering a side edge portion of the laminate block shown in Fig. 6; Fig.
Fig. 8 is a side view showing a method of chamfering the side edge portion of the laminate block shown in Fig. 7; Fig.
Fig. 9 is a side view of a laminate obtained by chamfering a side edge portion of the laminate block shown in Fig. 7; Fig.

Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. In the drawings, the same or corresponding constituent elements are denoted by the same or corresponding reference numerals, and a description thereof will be omitted.

(Laminated block)

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a side view of a laminate block used in a method of manufacturing a laminate according to an embodiment of the present invention; FIG.

As shown in Fig. 1, the laminate block 11 has a substrate 12 and a reinforcing plate 13 for reinforcing the substrate 12. The reinforcing plate 13 is composed of a resin layer 14 that is detachably coupled to the substrate 12 and a support plate 15 that supports the substrate 12 via the resin layer 14. The side surface of the substrate 12, the side surface of the resin layer 14, and the side surface of the support plate 15 are coplanar.

The laminate block 11 is processed by a processing method described later, and then used for manufacturing a product having the substrate 12 as a part of the product structure. The reinforcing plate 13 is peeled off the substrate 12 during the manufacturing process of the product, and does not become a part of the product structure. Examples of products include electronic devices such as display panels, solar cells, and thin film secondary batteries.

The laminate block 11 may have a thickness substantially equal to that of a conventional substrate in order to manufacture an electronic device using a processing equipment for processing a conventional substrate (a substrate not reinforced by a reinforcing plate). For example, if the current electronic device manufacturing process is designed to process a substrate having a thickness of 0.5 mm, and the sum of the thickness of the substrate 12 and the thickness of the resin layer 14 is 0.1 mm, The thickness is 0.4 mm. Hereinafter, each configuration will be described with reference to Fig.

(Board)

The substrate 12 is a substrate for an electronic device. On the surface of the substrate 12, a predetermined functional layer (for example, a conductive layer) is formed in the manufacturing process of the electronic device. The types of functional layers may be selected depending on the type of electronic device, and a plurality of functional layers may be sequentially stacked on the substrate 12. [

The type of the substrate 12 is not particularly limited, and examples thereof include a glass substrate, a ceramics substrate, a resin substrate, a metal substrate, and a semiconductor substrate. Among these, a glass substrate is preferable. This is because the glass substrate is excellent in chemical resistance and moisture permeability, and has a small linear expansion coefficient. If the coefficient of linear expansion is large, the manufacturing process of the electronic device often involves heat treatment, and therefore various problems are likely to occur. For example, when the substrate 12 on which the TFT (thin film transistor) is formed under cooling is cooled, the positional deviation of the TFT may be excessive due to the heat shrinkage of the substrate 12.

The glass substrate is obtained by melting a glass raw material and molding the molten glass into a plate shape. For example, a float method, a fusion method, a slot down-draw method, a pull-call method, a lubrication method, or the like is used. In particular, a glass substrate having a small thickness can be obtained by heating the glass molded into a plate shape at a moldable temperature, stretching it by stretching or the like and thinning it (lead-through method).

The glass of the glass substrate is not particularly limited, and examples thereof include alkali-free glass, borosilicate glass, soda lime glass, high silica glass, and oxide-based glass containing other silicon oxide as a main component. As the oxide-based glass, glass having a silicon oxide content of 40 to 90 mass% in terms of oxide is preferable.

As the glass of the glass substrate, it is preferable to adopt glass suitable for the kind of the electronic device and the manufacturing process thereof. For example, the glass substrate for a liquid crystal display preferably comprises glass (alkali-free glass) substantially not containing an alkali metal component. Thus, the glass of the glass substrate is appropriately selected based on the kind of electronic device to be applied and the manufacturing process thereof.

The resin of the resin substrate may be either a crystalline resin or an amorphous resin and is not particularly limited.

Examples of the crystalline resin include thermoplastic resins such as polyamide, polyacetal, polybutylene terephthalate, polyethylene terephthalate, polyethylene naphthalate, syndiotactic polystyrene and the like. In the thermosetting resin, polyphenylene sulfide , Polyether ether ketone, liquid crystal polymer, fluororesin, or polyether nitrile.

Examples of the amorphous resin include polycarbonate as a thermoplastic resin, modified polyphenylene ether, polycyclohexene, or polynorbornene-based resin. As the thermosetting resin, polysulfone, polyethersulfone, poly A polyamideimide, a polyetherimide, or a thermoplastic polyimide.

As the resin of the resin substrate, a thermoplastic resin is particularly preferable from the amorphous state.

The thickness of the substrate 12 is set according to the type of the substrate 12. For example, in the case of a glass substrate, it is preferably not more than 0.7 mm, more preferably not more than 0.3 mm, and even more preferably not more than 0.1 mm, in order to reduce the weight and thickness of the electronic device. If it is more than 0.7 mm, the demand for thinning and / or lightening of the glass substrate can not be satisfied. When the thickness is 0.3 mm or less, it is possible to impart good flexibility to the glass substrate. When the thickness is 0.1 mm or less, the glass substrate can be rolled up. The thickness of the glass substrate is preferably 0.03 mm or more for easy production of the glass substrate, easy handling of the glass substrate, and the like.

(Resin layer)

When the resin layer 14 adheres to the substrate 12, the positional deviation of the substrate 12 is prevented until the peeling operation is performed. The resin layer 14 is easily peeled off from the substrate 12 by the peeling operation. It is possible to prevent breakage of the substrate 12 and to prevent peeling at an unintended position (between the resin layer 14 and the support plate 15). In the present specification, adhesion refers to peelable bonding. The releasable coupling means that the substrate 12 is separated from the resin layer 14 without peeling the support plate 15 from the resin layer 14 when the substrate 12 is peeled from the resin layer 14 It means that it can peel off. That is, the bonding force between the support plate 15 and the resin layer 14 is greater than the bonding force between the substrate 12 and the resin layer 14. [

The resin layer 14 is formed such that the bonding force of the support plate 15 is relatively higher than the bonding force of the substrate 12 (details of the forming method will be described later). This makes it possible to prevent the laminate block 11 from peeling at an unintended position (between the resin layer 14 and the support plate 15) when the peeling operation is performed.

The initial peel strength between the resin layer 14 and the substrate 12 is set according to the manufacturing process of the electronic device. For example, when a polyimide film (Capton 200HV, manufactured by Toray DuPont) having a thickness of 0.05 mm is used for the substrate 12, the lower limit value of the initial peel strength in the following peeling test is 0.3 N / 25 mm, 0.5 N / 25 mm, and more preferably 1 N / 25 mm. The upper limit value of the initial peel strength is 10 N / 25 mm, preferably 5 N / 25 mm. Here, the " initial peel strength " refers to the peel strength immediately after the production of the laminate block 11, and refers to the peel strength measured at room temperature.

If the initial peel strength is 0.3 N / 25 mm or more, unintentional separation can be sufficiently restricted. On the other hand, if the initial peel strength is 10 N / 25 mm or less, peeling of the resin layer 14 from the substrate 12 becomes easy, for example, when the positional relationship between the resin layer 14 and the substrate 12 is corrected.

The peeling test is shown by the following measuring method.

A resin layer 14 is formed on the entire surface of a support plate 15 having a length of 25 mm and a width of 75 mm and a substrate 12 having a length of 25 mm and a width of 50 mm is placed on the support plate 15 and the substrate 12 The evaluation sample is obtained by laminating one of the vertical surfaces so as to coincide with each other. The surface of the evaluation sample on the side of the resin layer 14 side of the substrate 12 was fixed to the end of the test strip with a double-sided tape and then the central portion of the support plate (25 mm long by 25 mm wide) Using a digital force gauge, lift it vertically and measure the peel strength.

The peel strength after heating between the resin layer 14 and the substrate 12 is preferably 8.5 N / 25 mm or less in the peeling test, and is preferably 7.8 N / 25 mm or less, for example, Mm or less, and more preferably 4.5 N / 25 mm or less. Here, the "peeling strength after heating" refers to the peeling strength measured at room temperature after the resin layer 14 is heated at 350 ° C (corresponding to the formation temperature of the amorphous silicon layer constituting the thin film transistor).

If the peel strength after heating is 0.3 N / 25 mm or more, unintentional separation can be sufficiently restricted. On the other hand, if the peel strength after heating is 10 N / 25 mm or less, it is easy to peel the resin layer 14 from the substrate 12.

The resin of the resin layer 14 is not particularly limited. For example, examples of the resin of the resin layer 14 include acrylic resin, polyolefin resin, polyurethane resin, polyimide resin, silicone resin, and polyimide silicone resin. Several kinds of resins may be mixed and used. Among them, a silicone resin and a polyimide silicone resin are preferable from the viewpoint of heat resistance and releasability.

The thickness of the resin layer 14 is not particularly limited, but is preferably 1 to 50 占 퐉, more preferably 5 to 30 占 퐉, and still more preferably 7 to 20 占 퐉. Deformation of the substrate 12 can be suppressed when bubbles or foreign matter are mixed between the resin layer 14 and the substrate 12 by making the thickness of the resin layer 14 at least 1 mu m. On the other hand, if the thickness of the resin layer 14 is 50 m or less, the formation time of the resin layer 14 can be shortened and the resin of the resin layer 14 is not used more than necessary.

The resin layer 14 may be composed of two or more layers. In this case, the " thickness of the resin layer " means the total thickness of all the resin layers.

In the case where the resin layer 14 includes two or more layers, the types of resins forming the respective layers may be different.

(Support plate)

The support plate 15 supports and reinforces the substrate 12 with the resin layer 14 interposed therebetween. The support plate 15 prevents deformation, scratches, breakage, and the like of the substrate 12 in the manufacturing process of the electronic device.

The type of the support plate 15 is not particularly limited, and for example, a glass plate, a ceramic span, a resin plate, a semiconductor plate, a metal plate, a glass / resin composite plate and the like are used. Since the difference in thermal expansion between the support plate 15 and the substrate 12 is small if the type of the support plate 15 is the same as that of the type of the electronic device or the type of the substrate 12, It is possible to suppress the occurrence of warp caused by the warp.

The difference (the absolute value) of the average linear expansion coefficient between the support plate 15 and the substrate 12 is appropriately set according to the outer shape of the substrate 12 and the like, but is preferably 35 × 10 ^-7 / ° C or lower, for example. Here, the "average coefficient of linear expansion" refers to the average coefficient of linear expansion (JIS R 3102: 1995) in the temperature range of 50 to 300 ° C.

The thickness of the support plate 15 is not particularly limited, and it is preferable that the thickness of the support plate 15 is 0.7 mm or less in order to make the laminate block 11 suitable for existing processing equipment. In order to reinforce the substrate 12, the thickness of the support plate 15 is preferably 0.4 mm or more. The thickness of the support plate 15 may be thicker than that of the substrate 12, or may be thinner.

(Method for producing laminated block)

The laminate block 11 is manufactured by the steps of: (1) applying a resin composition having flowability onto the support plate 15 and curing the resin composition to form a resin layer 14; (2) a method of applying a resin composition having fluidity on a predetermined substrate and curing the resin layer 14 to form a resin layer 14, then peeling the resin layer 14 from a predetermined substrate, (3) a method in which a resin composition is sandwiched between a substrate 12 and a support plate 15 and the resin composition 14 is cured to form a resin layer 14 .

In the method (1), when the resin composition is cured, the resin composition interacts with the support plate 15, so that the bonding force between the support plate 15 and the resin layer 14 is higher than the bonding force between the resin layer 14 and the substrate 12 ). ≪ / RTI >

The method (2) is effective when the bonding force of the resin layer 14 after compression is lower than that of the substrate 12 and higher than that of the support plate 15. The surface of the substrate 12 or the support plate 15 may be subjected to a surface treatment before making contact with the resin layer 14 to cause a difference in bonding force between the resin layer 14 and the resin layer 14 after compression.

The method (3) is effective when the bonding force of the resin composition after curing is low with respect to the substrate 12 and high with respect to the support plate 15. The surface of the substrate 12 or the support plate 15 may be subjected to a surface treatment before contact with the resin composition to cause a difference in bonding force after curing of the resin composition.

In the above methods (1) to (3), the kind of the resin composition is not particularly limited. For example, the resin composition is classified into a condensation reaction type, an addition reaction type, an ultraviolet ray curable type, and an electron beam curable type according to a curing mechanism, but it can be used in all cases. Of these, the addition reaction type is preferable. This is because the curing reaction is easy and the degree of peelability is good when the resin layer 14 is formed and heat resistance is high.

Further, the resin composition is classified into a solvent type, an emulsion type, and a no-solvent type depending on the form, but it is all usable. Of these, no-solvent formulations are preferred. This is because productivity and environmental characteristics are excellent. The reason for this is that since bubbles are not contained during the curing of the resin layer 14, that is, at the time of heat curing, ultraviolet curing or electron beam curing, the bubbles remain in the resin layer 14 It is difficult to do.

As the silicone resin composition which is an addition reaction type and which is also a non-solvent type, there is one containing a straight-chain polyorganosiloxane having a vinyl group and a methylhydrogenpolysiloxane having a hydrosilyl group. The silicone resin composition is heated and cured in the presence of a platinum catalyst to form a silicone resin layer.

Examples of the application method of the resin composition include spray coating, die coating, spin coating, dip coating, roll coating, bar coating, screen printing, and gravure coating. These coating methods are appropriately selected depending on the kind of the resin composition.

The application amount of the resin composition is appropriately selected depending on the type of the resin composition and the like. For example, in the case of the silicone resin composition, it is preferably 1 to 100 g / m 2, more preferably 5 to 20 g / m 2.

The curing conditions of the resin composition are appropriately selected depending on the kind of the resin composition and the like. For example, when 2 parts by mass of the platinum-based catalyst is blended with 100 parts by mass of the total amount of the linear polyorganosiloxane and the methylhydrogenpolysiloxane as the silicone resin composition, 250 deg. C, preferably 100 deg. C to 200 deg. In this case, the reaction time is 5 to 60 minutes, preferably 10 to 30 minutes. If the curing conditions of the resin composition are in the range of the reaction time and the reaction temperature, the oxidative decomposition of the silicone resin does not occur at the same time, and the silicone component of low molecular weight is not produced and the silicone migration property is not increased.

In the above methods (1) and (2), it is preferable that the compression bonding is performed in an environment of high cleanliness. As a compression bonding method, there are a roll type, a press type and the like. The atmosphere in which the compression bonding is performed may be an atmospheric pressure atmosphere, but in order to suppress the incorporation of bubbles, a reduced pressure atmosphere is preferable. The temperature at which the compression bonding is performed may be a temperature higher than room temperature, but it is preferable that the temperature is room temperature in order to prevent deterioration of the resin layer 14.

(Method for producing laminate)

2 is a plan view showing a method of manufacturing a laminate according to an embodiment of the present invention. 3 is a side view showing a method of manufacturing a laminate according to an embodiment of the present invention. 4 is a side view of a laminate obtained by the method of producing a laminate according to an embodiment of the present invention. In Fig. 4, the state of the laminate block before machining is indicated by a chain double-dashed line.

The method of producing a laminate is a method of obtaining a laminate by chamfering the side edge portion 11a of the laminate block 11 in order to improve impact resistance. The side edge portion 11a of the laminate block 11 may be machined into, for example, a rounded shape. Specifically, at least a part of the cross-sectional shape after machining may be, for example, an arcuate portion, Or a curved surface shape including a parabolic shape portion. The sectional shape of the side edge portion 11a of the laminate block 11 after processing may be a polygonal shape.

The method for manufacturing the laminate includes a step of grinding the side edge portion 11a of the laminate block 11 into the grindstone 21. The grinding wheel 21 is a rotating grinding wheel formed into a disc shape and a grinding groove 22 (Fig. 3) is formed on the outer circumferential face 21a of the grinding wheel 21 over its entire periphery. The wall surface 22a of the grinding groove 22 is the grinding surface and the sectional shape of the side edge portion 11a of the laminate block 11 after machining is the same as the sectional shape of the grinding groove 22. [ The shape of the grinding wheel 21 is not limited to a disc shape but may be a cylindrical shape.

The grinding grooves 22 are formed so as to become deeper as they approach the inner side in the width direction of the grinding grooves 22 from the opposite end portions 22b and 22c in the width direction of the grinding grooves 22, for example. For example, the grinding grooves 22 are formed so as to be deeper as they approach the widthwise center portions 22d of the grinding grooves 22 from the widthwise end portions 22b and 22c.

The wall surface 22a of the grinding groove 22 has a bottom surface 22a-1 having a circular arc shape and two side surfaces 22a-1 extending from both end edges of the bottom surface 22a-1 to the outer peripheral surface 21a -2, and 22a-3. The two side surfaces 22a-2 and 22a-3 are smoothly connected to the bottom surface 22a-1.

The grinding wheel 21 is rotated in the circumferential direction of the grinding wheel 21 in the state that the wall surface 22a of the grinding groove 22 is in contact with the side edge portion 11a of the laminate block 11 2 in the X direction), the side edge portion 11a of the laminate block 11 is ground. As a result, the substrate 12, the resin layer 14, and the support plate 15 shown in Fig. 1 are reduced in side edge portions 12a, 14a, and 15a shown in Fig. 3, respectively, A resin layer 32, a resin layer 34, and a support plate 35. Therefore, the laminated body 31 obtained by chamfering the side edge portion 11a of the laminated body block 11 shown in Fig. 1 has the same structure as that of the laminated body block 11 except that the substrate 32 and the substrate 32 And a reinforcing plate 33 for reinforcement. The reinforcing plate 33 has a resin layer 34 that is detachably coupled to the substrate 32 and a support plate 35 that supports the substrate 32 via the resin layer 34.

It is preferable that the lamination direction of the laminate block 11 and the rotation axis direction of the grinding stone 21 are arranged substantially parallel to each other in the grinding process and that the lamination direction of the laminate block 11 along the circumferential direction of the side edge portion 11a And the grindstone 21 moves relatively (Y direction in Fig. 2). Therefore, the side edge portion 11a of the laminate block 11 is ground over the entire circumferential direction. Further, only a part of the side edge 11a in the circumferential direction may be ground. Further, the grinding wheel 21 side may move, the laminate block 11 side may move, or both sides may move.

The interface 16 between the resin layer 14 and the substrate 12 and the interface 17 between the resin layer 14 and the support plate 15 are located at the deepest portion of the grinding groove 22 (In the embodiment, the width direction center portion 22d). As a result, the interfaces 16 and 17 are obliquely contacted with the wall surface 22a, which is the grinding surface of the grinding wheel 21, not perpendicularly. The interfaces 16 and 17 are offset from one another in the width direction of the grinding grooves 22 with respect to the deepest portion of the grinding grooves 22.

However, when micro-cracks are generated on the side surface of the laminate block 11 due to the abrasive grains contained in the wall surface 22a, the micro-cracks tend to extend obliquely with respect to the wall surface 22a.

In this embodiment, since the interfaces 16 and 17 obliquely contact the wall surface 22a of the grinding wheel 21, micro cracks are obliquely extended from the side surface of the laminate block 11 toward the interfaces 16 and 17 Can be suppressed. Therefore, it is possible to reduce the occurrence of at least one corner cutting of the substrate 12 and the support plate 15 by grinding, and the layered product 31 having almost no concave portion on the side surface is obtained. This effect is remarkable when at least one of the substrate 12 and the support plate 15 is made of a brittle material. Examples of the brittle material include glass, ceramics, and metal silicon.

In this case, the outer circumferential surface 21a of the grinding wheel 21 is the grinding surface, and the grinding wheel 21 has the grinding recess 22 on the outer circumferential surface 21a, 17 are in contact with each other at an angle.

In the grinding process, the deepest portion (in the present embodiment, the widthwise central portion 22d) of the grinding groove 22 is brought into contact with the side edge portion 15a of the support plate 15 as shown in Fig. Therefore, after the grinding, as shown in Fig. 4, the support plate 35 protrudes outward from the substrate 32, so that damage to the substrate 32 as a product can be reduced.

In addition, in the grinding step, the interfaces 16 and 17 are brought into contact with the bottom surface 22a-1 having a circular arc shape as shown in Fig. Therefore, by adjusting the amount of the offset before grinding, the angle formed between the wall surface 22a as the grinding surface and the interfaces 16 and 17 can be adjusted.

5A is a side view when the offset amount is small, FIG. 5B is a side view when the offset amount is intermediate, FIG. 5A is a side view when the offset amount is small, FIG. 5C is a side view when the offset amount is large.

In Figs. 5A to 5C, T1 is the thickness of the substrate 12, and T2 is the thickness of the support plate 15. Fig. Since the thickness of the resin layer 14 is negligibly smaller than the thickness of the substrate 12 and the thickness of the support plate 15, (15) are bonded to each other. Incidentally, depending on the presence or absence of the resin layer 14, the calculation result (the relationship between? And D) to be described later hardly fluctuates. represents the angle between the joining face 18 (corresponding to the interfaces 16 and 17) of the substrate 12 and the support plate 15 and the wall face 22a of the grinding groove 22 on the substrate 12 side . And D represents the amount of offset of the joint surface 18 with respect to the deepest portion (in the present embodiment, the widthwise central portion 22d) of the grinding groove 22. R represents the radius of curvature of the bottom surface 22a-1.

For example, in the case where T1 = 0.3 mm, T2 = 0.4 mm and R = 0.4 mm, when D is increased stepwise to 0.05 mm (Fig. 5A), 0.15 mm (Fig. 5B), and 0.25 mm ? gradually decreases to 81.9 ° (FIG. 5A), 65.1 ° (FIG. 5B) and 45.4 ° (FIG. 5C).

Although only the bottom surface 22a-1 of the grinding groove 22 is formed in an arc shape in section in this embodiment, for example, even if the wall surface 22a of the grinding groove 22 is formed as a circular arc in cross section as a whole And the position of the section of the circular arc shape is not particularly limited.

Further, the laminate block 11 may be provided in the step of cutting the laminate block 11 to a predetermined dimension before the grinding step.

(Manufacturing Method of Electronic Device)

A method of manufacturing an electronic device includes a forming step of forming a predetermined functional layer (for example, a conductive layer) on at least a part of a region of the substrate 32 of the layered structure 31, And a peeling step of peeling the reinforcing plate 33 from one substrate 32. Further, the stacked body 31 may be provided in the step of polishing the substrate 32 before being provided to the manufacturing process of the electronic device.

In the forming step, for example, a photolithography method, an etching method, a vapor deposition method, or the like is used as a method of forming a predetermined functional layer on the substrate 32. In order to pattern the functional layer, a coating solution such as a resist solution is used.

Unlike the conventional laminate 131 shown in Fig. 9, the layered product 31 of the present embodiment can reduce occurrence of at least one corner cut out of the substrate 12 and the support plate 15 by grinding , It is easy to remove the coating liquid attached to the side surface of the layered product (31) when the coating liquid is applied on the substrate (32) because there is almost no concave portion on the side surface of the layered product (31). Therefore, it is possible to prevent the residue of the coating liquid from becoming an oscillation source in the process involving the heat treatment in the manufacturing process of the electronic device, and to improve the yield of the electronic device.

As a method for peeling the reinforcing plate 33 from the substrate 32 in the peeling step, for example, a method of inserting a razor blade or the like between the resin layer 34 constituting the reinforcing plate 33 and the substrate 32, A method of peeling off the substrate 32 side and the support plate 35 side is used.

The method of manufacturing an electronic device may further include the step of laminating another functional layer on the functional layer non-formation region or the already formed functional layer on the substrate 32 after the peeling process.

The electronic device is manufactured by assembling the electronic device using two stacked bodies 31 having a predetermined functional layer formed thereon and thereafter assembling the electronic devices from the substrate 32 of the two stacked bodies 31 And the reinforcing plate 33 may be peeled off.

Next, a specific example of a method of manufacturing an electronic device will be described.

A method of manufacturing a liquid crystal display (LCD) includes, for example, a TFT substrate manufacturing step of forming a TFT substrate by forming a thin film transistor (TFT) or the like on a substrate of a laminate, And a CF substrate manufacturing step of fabricating a CF substrate. Further, a manufacturing method of a liquid crystal display has an assembling step of sealing the liquid crystal material between the TFT substrate and the CF substrate, and a peeling step of peeling the reinforcing plate from the substrate of each stacked body.

In the TFT substrate fabrication process or the CF substrate fabrication process, for example, a photolithography method, an etching method, or the like is used as a method of forming TFTs or CFs. In addition, a resist solution is used as a coating liquid in order to form a pattern of TFT, CF, or the like.

Further, the substrate surface of the laminate may be cleaned before the TFT substrate fabrication process or the CF substrate fabrication process. As the cleaning method, well-known dry cleaning or wet cleaning is used.

In the assembling step, a liquid crystal material is injected between the TFT substrate and the CF substrate. As a method for injecting the liquid crystal material, there are a reduced pressure injection method or a dropwise injection method.

In the reduced pressure injection method, for example, first, a TFT substrate and a CF substrate are bonded to each other with a sealant and a spacer interposed therebetween to manufacture a large panel. At this time, a large panel is fabricated so that the TFTs or the CFs are arranged so as to face each other and cut into a plurality of cells. Subsequently, the interior of each cell becomes a reduced-pressure atmosphere, and the liquid crystal material is injected into each cell from the injection hole provided in the side surface of each cell, and then the injection hole is sealed. Subsequently, a polarizing plate is attached to each cell, and a backlight or the like is attached to each cell, thereby producing a liquid crystal display.

In the dropping injection method, for example, liquid crystal material is first dropped onto either the TFT forming surface of the TFT substrate or the CF forming surface of the CF substrate, and then the TFT substrate and the CF substrate are bonded to each other via the sealing material and the spacer material , A large-sized panel is produced. At this time, a large-size panel is manufactured so that the TFTs or the CFs are arranged to face each other. Thereafter, the large panel is cut into a plurality of cells. Subsequently, a polarizing plate is attached to the cell, and a backlight or the like is attached to the liquid crystal display.

The peeling process may be performed after the TFT substrate fabrication process or CF substrate fabrication process, before the assembling process, or during the assembling process. The peeling process may be performed during the assembly process by the low pressure injection method, after the large panel is manufactured, before the large panel is cut into a plurality of cells, or after the liquid crystal material is sealed in each cell, May be carried out before attachment. Further, the peeling process may be performed during the assembly process by the drop injection method, after the large panel is manufactured, before the large panel is cut into a plurality of cells, or after the large panel is cut into a plurality of cells, May be performed before attaching the polarizing plate to the polarizing plate.

The manufacturing method of the organic EL display (OLED) is, for example, an organic EL element forming step of forming an organic EL element on a substrate of a laminate, a bonding step of bonding the substrate on which the organic EL element is formed and the counter substrate, And a peeling step of peeling the reinforcing plate from the substrate of the sieve.

In the organic EL element formation step, for example, a photolithography method, a vapor deposition method, or the like is used as a method of forming the organic EL element. Further, in order to pattern the organic EL element, a resist solution is used as a coating liquid. The organic EL device includes, for example, a transparent electrode layer, a hole transporting layer, a light emitting layer, and an electron transporting layer.

Further, before the organic EL element forming step, if necessary, the substrate surface of the laminate may be cleaned. As the cleaning method, well-known dry cleaning or wet cleaning is used.

In the bonding step, the substrate on which the organic EL element is formed is cut into a plurality of cells, and the opposing substrate is attached to each cell, whereby the organic EL display is manufactured.

The peeling step may be performed after the organic EL element forming step, for example, before the bonding step, or may be performed during or after the bonding step.

The solar cell manufacturing method includes, for example, a solar cell element forming step of forming a solar cell element on a substrate of a laminate, and a peeling step of peeling the reinforcing plate from the substrate of the laminate.

In the solar cell element formation step, for example, a photolithography method, a deposition method, or the like is used as a method of forming a solar cell element. Further, in order to pattern the solar cell element, a resist solution is used as a coating liquid. The solar cell element includes, for example, a transparent electrode layer, a semiconductor layer, and the like.

The peeling process is performed, for example, after the solar cell element forming process.

Although the embodiment of the present invention has been described above, the present invention is not limited to the above embodiment. Various modifications and substitutions can be made without departing from the scope of the present invention.

This application is based on Japanese Patent Application No. 2011-139630 filed on June 23, 2011, the content of which is incorporated herein by reference.

11: Laminate block
12: substrate
13: reinforced plate
14: Resin layer
15: Support plate
16: Interface between resin layer and substrate
17: Interface between resin layer and support plate
21: Grinding stone
21a: outer peripheral surface
22: Grinding groove
22a: wall surface
22a-1:
22a-2: Side
22a-3: Side
22d:
31:

Claims (6)

A side edge portion of a laminate block having a substrate and a reinforcing plate for reinforcing the substrate, the reinforcing plate having a resin layer releasably engaged with the substrate and a support plate for supporting the substrate via the resin layer is chamfered A method for producing a laminate,
And a grinding step of grinding the side edge portion of the laminate block with a disk-shaped or cylindrical rotating wheel,
In the grinding step, the grinding surface of the grinding wheel is obliquely contacted with the interface between the resin layer and the substrate and the interface between the resin layer and the support plate,
A grinding groove is formed on an outer peripheral surface of the grinding wheel,
In the grinding step,
The grinding wheel is rotated in the circumferential direction of the grinding wheel in a state where the side face of the laminate block is in contact with the wall face of the grinding groove which is the grinding face,
The interface between the resin layer and the substrate and the interface between the resin layer and the support plate are offset from each other in the width direction of the grinding groove with respect to the deepest portion of the grinding groove and are obliquely contacted with the wall surface of the grinding groove ,
And the deepest portion of the grinding groove is in contact with the side edge portion of the support plate. delete delete The method according to claim 1,
Wherein the wall surface of the grinding groove has a circular arc-shaped portion,
In the grinding step,
Wherein the interface between the resin layer and the substrate and the interface between the resin layer and the support plate are in contact with the portion having the circular arc shape. The method according to claim 1 or 4,
Wherein at least one of the substrate and the support plate is made of a brittle material. A laminate having a substrate and a reinforcing plate for reinforcing the substrate, the reinforcing plate having a resin layer releasably engaged with the substrate and a support plate for supporting the substrate via the resin layer,
The grinding surface of the side edge portion of the laminate is obliquely intersected with the interface between the resin layer and the substrate and the interface between the resin layer and the support plate,
Wherein an angle at which the interface between the resin layer and the substrate intersects the side surface of the substrate is smaller than an angle at which the interface between the resin layer and the support plate intersects the side surface of the support plate.

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