KR101875752B1 - Process chamber - Google Patents

Abstract

The process chamber includes an upper chamber that can be raised and lowered, a lower chamber formed below the upper chamber and forming a processing space with the upper chamber, a plurality of supporters formed on the lower chamber to support the substrate, And a cover portion covering the gap between the upper chamber and the lower chamber which is generated when the upper chamber is raised.

Description

Process chamber {PROCESS CHAMBER}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a process chamber, and more particularly, to a process chamber provided in a substrate processing apparatus to perform a process.

In general, a substrate processing apparatus for manufacturing semiconductor devices, flat panel display panels, and the like includes a plurality of chambers. Such a substrate processing apparatus has a cluster system and an inline system according to the arrangement of a plurality of process chambers and at least one transfer chamber. Such a multi-chamber type substrate processing apparatus includes, for example, a process chamber for processing a substrate, a transfer chamber provided between each process chamber for transferring the substrate to the process chamber, a load lock chamber for supplying the substrate to the transfer chamber, and the like . Particularly, in the case of a process chamber for processing a substrate in a vacuum state, a pressure difference occurs inside and outside the chamber before and after the operation.

Many processes in the semiconductor manufacturing process proceed in a process chamber (i.e., a vacuum chamber) that is isolated from the outside and provided with a vacuum environment. For example, a typical substrate processing apparatus provides a substrate between a process chamber and a transfer chamber, which is provided as a vacuum chamber, using a transfer robot, in which the process chamber and the transfer chamber perform a process of passing between vacuum pressure and atmospheric pressure .

First, when the process starts, the process chamber is adjusted to atmospheric pressure and the substrate is transferred to the process chamber by the transfer robot of the transfer chamber. The process chamber is then adjusted to vacuum pressure to process the substrate. Thereafter, when the process is completed, the process chamber is again controlled to the atmospheric pressure, and the substrate taken out of the process chamber is transferred to the transfer chamber by the transfer robot. In this process, when the atmospheric pressure in the process chamber is regulated from atmospheric pressure to vacuum, and again from vacuum to atmospheric pressure, foreign substances outside the chamber may be swept into the chamber and introduced into the chamber, or fumes generated during the processing may leak out of the process chamber .

Such foreign matter or fumes may deteriorate the quality of the substrate to be treated or may affect the operation of the substrate processing apparatus. Accordingly, efforts have been made to solve the problems of foreign substances flowing into the process chamber and fumes flowing out.

Accordingly, a problem to be solved by the embodiments of the present invention is to provide a method and apparatus for removing fumes generated in a chemical liquid during foreign matter inflow and substrate processing in a process of changing atmospheric pressure, And to prevent a process chamber from being leaked to the process chamber.

According to an aspect of the present invention, there is provided a process chamber including: an upper chamber capable of being raised and lowered; a lower chamber formed below the upper chamber and forming a processing space together with the upper chamber; A plurality of supporters for supporting the substrate, and a cover opening and closing part that is openable and closable so that the substrate can be moved into and out of the processing space is formed. The cover, which covers the gap between the upper chamber and the lower chamber, .

According to an embodiment of the present invention, the cover opening / closing part may be opened by rotating and forming a hinge around one axis of a part connected to the lower chamber.

Since the process chamber according to the present invention includes the front, rear, and side covers, it is possible to raise the upper chamber to minimize the pressure difference between the work space in which the substrate in the chamber is accommodated and the outside, have.

In addition, since the front, rear, and side covers separate the processing space from the outside of the process chamber, inflow of external airflow and foreign matter can be blocked. In addition, it is possible to minimize the diffusion of fumes generated in the chemical solution during the process in the processing space to the outside of the facility.

Figure 1 is a top view of a process chamber in accordance with one embodiment of the present invention.
2 is a cross-sectional view taken along line I-I 'of the process chamber shown in FIG.
3 is a cross-sectional view taken along line II-II 'of the process chamber shown in FIG.
4 is a cross-sectional view illustrating the operation of the process chamber shown in FIG.
5 is a cross-sectional view illustrating the operation of the process chamber shown in FIG.
6 is a side view of a side cover of the process chamber shown in FIG.

Hereinafter, a chamber according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are enlarged to illustrate the invention, and are actually shown in a smaller scale than the actual dimensions in order to explain the schematic configuration. The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a part or a combination thereof is described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

On the other hand, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

Figure 1 is a top view of a process chamber in accordance with one embodiment of the present invention. 2 is a cross-sectional view taken along line I-I 'of the process chamber shown in FIG. 3 is a cross-sectional view taken along line II-II 'of the process chamber shown in FIG.

1 to 3, a process chamber 1000 according to an embodiment of the present invention includes an upper chamber 110, a lower chamber 120, a supporter 130, a cover opening / closing part 140, a side cover 142 And a rear cover 144. As shown in Fig.

The upper chamber 110 has a processing space formed therein and is moved up and down. The lower chamber 120 is fixed to a base frame (not shown) of the substrate processing apparatus.

The upper chamber 110 is lowered to engage with the lower chamber 120 to seal the processing space for processing. The lower chamber 120 may include an O-ring (not shown) along the periphery of the upper surface coupled to the upper chamber 110.

A plurality of supporters 130 are formed on the lower chamber 120. The supporters 130 support the substrate 10 and may be disposed on the lower chamber 120 in a suitable arrangement to stably support the substrate 10.

The cover opening and closing part 140 is formed adjacent to one side of the upper chamber 120 and the lower chamber 120 in a direction in which the substrate 10 enters and exits the process chamber 1000. Accordingly, the process chamber 1000 and the process chamber 1000 are shielded from the process chamber 1000 even when the upper chamber 110 is raised to the lower chamber 120. The cover opening and closing part 140 is opened and closed so that the substrate 10 can be moved into and out of the process chamber 1000. For example, the cover opening / closing part 140 may be opened and closed by rotating about one axis of a portion close to the lower chamber 120.

The rear cover 144 is formed facing the cover opening / closing part 140, adjacent to the other side opposite to the one side of the upper chamber 110 and the lower chamber 120. Therefore, the process chamber 1000 and the process chamber 1000 are blocked off even when the upper chamber 120 is lifted up relative to the lower chamber 120.

The side cover 142 is formed to surround the side surfaces of the upper chamber 110 and the lower chamber 120 adjacent to the cover opening and closing part 140 and the rear cover 1440. Accordingly, the process chamber 1000 and the process chamber 1000 are shielded from the process chamber 1000 even when the upper chamber 110 is raised to the lower chamber 120.

The cover opening and closing part 140 and the rear cover 144 are connected to the side cover 142 and the process chamber 1000 is opened even when the upper chamber 110 is raised upward relative to the lower chamber 120. [ The upper chamber 120 and the lower chamber 120 to block the process space of the process chamber 1000 and the process chamber 1000. [ At this time, since the upper chamber 110 can move up and down, the contact portions with the front, rear, and side covers 140, 144, and 142 may be formed of a material having a low frictional force. Alternatively, the front, rear, and side covers 140, 144, and 142 may be formed close to each other without contacting the upper chamber 120.

The processing space of the process chamber 1000 and the outer portion of the process chamber 1000 are connected to the front, rear, and side covers 140 (140), even when the upper chamber 110 is raised to the lower chamber 120 , 144, and 142, respectively. In the course of the process, foreign substances are introduced into the processing space in the process of controlling the atmospheric pressure from vacuum to vacuum, and fumes generated in the processing space are discharged to the outside of the process chamber 1000 .

Fig. 4 is a cross-sectional view illustrating the operation of the process chamber shown in Fig. 1 for entering and exiting the substrate. 5 is a cross-sectional view illustrating the operation of the process chamber shown in FIG. 1 for carrying out a process of a substrate.

4 and 5, when the upper chamber 110 is lifted upward, the cover opening / closing part 140 is opened and the substrate 10 is moved in the opening direction of the cover opening / (1000). ≪ / RTI >

When the substrate 10 is seated in the processing space, the cover opening / closing part 140 is closed and the upper chamber 110 is lowered to be in close contact with the lower chamber 120. The inside of the processing space can be vacuum-processed by a vacuum pump (not shown), and thus the substrate processing process in a vacuum state proceeds.

When the substrate processing process for the substrate 10 is completed, the upper chamber 110 is lifted upward. At this time, the pressure of the processing space is raised to atmospheric pressure, and foreign matter from the outside of the processing chamber 1000 is prevented from entering the processing space by the front, rear, and side covers 140, 144, and 142.

When the upper chamber 110 is raised and the atmospheric pressure in the processing space reaches atmospheric pressure, the cover opening / closing part 140 is opened and the substrate 10 is taken out.

6 is a side view of a side cover of a process chamber in accordance with one embodiment of the present invention.

Referring to FIG. 6, the process chamber according to the present embodiment is the same as the process chamber 1000 shown in FIG. 1 except that an exhaust hole 143 is formed in the side cover 142, do.

The side cover 142 is formed with the exhaust hole 143. The exhaust hole is connected to an exhaust pipe (not shown) capable of exhausting fumes generated during the process in the process space. Therefore, even when the fume is exhausted through the exhaust hole 142 and the cover opening and closing part 140 is opened and closed for the entrance and exit of the substrate 10, the fume can be prevented from flowing out of the process chamber.

The cover opening / closing part 140, the side cover 142, and the rear cover 144 form a cover part. The cover part opens the upper chamber 110, 1000 to prevent the fumes from flowing out or foreign matter from entering the work space.

Since the process chamber 1000 according to the present invention includes the front, back and side covers 140, 144 and 142, the upper chamber is raised so that even when the process chamber 1000 is opened, The pressure difference between the work space and the outside can be minimized.

In addition, since the front, rear, and side covers 140, 144, and 142 separate the processing space from the outside of the process chamber 1000, the inflow of external airflow and foreign matter can be blocked. In addition, it is possible to minimize the diffusion of fumes generated in the chemical solution during the process in the processing space to the outside of the facility.

The process chamber according to the present invention can be used in a process chamber, i.e., a vacuum chamber, which is provided in a substrate processing apparatus and is processed in a vacuum state. The process chamber includes front, rear, and side covers separating the process chamber from the outside of the process chamber, thereby separating the process space from the outside of the process chamber, so that the pressure difference between the work space and the outside can be minimized. In addition, the inflow of external airflow and foreign matter can be blocked. In addition, it is possible to minimize the diffusion of fumes generated in the chemical solution during the process in the processing space to the outside of the facility.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims. It can be understood that it is possible.

1000: process chamber 110: upper chamber
120: lower chamber 130: supporter
140: cover opening and closing part 142: side cover
143: Exhaust hole 144: Rear cover
10: substrate

Claims (4)

An upper chamber in which a processing space is formed and which can be raised and lowered;
A lower chamber formed at the lower portion of the upper chamber and forming the processing space together with the upper chamber as the upper chamber is lowered and brought into close contact therewith;
A plurality of supporters formed on the lower chamber to support the substrate; And
A cover opening / closing part formed on one side of the upper chamber and the lower chamber so that the processing space can be shut off from the outside even when the upper chamber is raised, a cover opening and closing part formed on one side of the upper chamber and the other side of the lower chamber And a cover portion formed of a side cover formed to surround the side surfaces of the upper chamber and the lower chamber adjacent to the cover opening and closing portion and the rear cover,
Wherein the cover opening / closing part is closed so that the processing space can be blocked from the outside even when the upper chamber is raised, and only when the atmospheric pressure in the processing space reaches the atmospheric pressure after the upper chamber is raised, Wherein said process chamber is open to allow said process chamber to be opened. The process chamber of claim 1, wherein the cover opening / closing part is rotated by opening a hinge around one axis of a part connected to the lower chamber. delete The process chamber of claim 1, wherein the side cover is formed with an exhaust hole capable of exhausting fumes generated during the process in the process space.

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