KR101869326B1 - Direct-contactable conductive adhesive tape using nanometal power and manufacturing method thereof - Google Patents

Abstract

A high performance conductive adhesive tape of a direct contact method using nanometal powder according to the present invention includes: a release film; a conductive nanometal wire which is formed by being printed on the rear surface of the release film; a conductive adhesive which is formed on the surface of the conductive nanometal wire; and a conductive base material which is formed by being laminated on the surface of the conductive adhesive. A manufacturing method of the high performance conductive adhesive tape of a direct contact method using nanometal powder according to the present invention includes: a step of preparing a film on which a release agent is coated; a step of preparing conductive nanoink by mixing nanometal powder with a polymer binder; a step of printing a circuit with the conductive nanoink on the release agent coating surface of the release film; a step of hardening the printed conductive nanoink; a step of coating the printed surface of the conductive nanoink with a conductive adhesive; a step of hardening the conductive adhesive; and a step of laminating the surface coated with the conductive adhesive with the conductive base material. The present invention is provided to maximize conductive performance and enable stable adhesion adjustment.

Description

TECHNICAL FIELD [0001] The present invention relates to a direct contact type conductive adhesive tape using a nano metal powder, and a method of manufacturing the same. [0002]

The present invention relates to a high-performance conductive adhesive tape and a method of manufacturing the same, and more particularly, to a direct contact type high-performance conductive adhesive tape using a nano-sized metal powder and a manufacturing method thereof.

Conventional conductive adhesive tapes may be formed by using a nonwoven fabric or a fabric cloth in which a metal foil or copper and nickel is plated on the upper side alone or a metal foil is used on the upper side and a nonwoven fabric or a fabric And a conductive adhesive is applied between the upper and lower layers. However, the conventional conductive adhesive tape composed of such a metal foil layer and the pressure-sensitive adhesive layer has a disadvantage that there is a limit to the change of the electric conductivity and the conductivity after adhering to the adherend.

The conventional conductive adhesive tape includes a sheet layer as a substrate, a first conductive metal paste coating layer coated on the upper side of the sheet, a second conductive metal paste coating layer coated on the lower side of the sheet, A first conductive pressure sensitive adhesive layer laminated on the first conductive metal paste coating layer, a second conductive pressure sensitive adhesive layer laminated on the second conductive metal paste coating layer, and a second conductive pressure sensitive adhesive layer laminated on the second conductive metal paste coating layer, Which is composed of a heterogeneous layer. Such a conductive adhesive tape has a problem that the thickness becomes thick and the manufacturing process becomes complicated.

As another conventional conductive adhesive tape type, as disclosed in Patent Document 2, a conductive adhesive material is spun by a base material and a spinning method, which are formed into a nanoweb having a plurality of pores by spinning a polymer material, And is formed of a conductive adhesive layer formed or lapped directly on one surface or both surfaces of the base material to make the thickness of the adhesive tape thin, to improve the adhesive force and to adhere precisely to the bending surface A conductive adhesive tape is disclosed.

However, the conductive adhesive tape of Patent Document 2 has a problem of deterioration of electrical conductivity after being adhered to the adherend.

Another conventional conductive adhesive tape type includes a conductive adhesive layer formed on one side or both sides of the substrate using a conductive material (a metal foil or a material plated with a metal) as a base material to form a conductive pressure- There is a method in which electric conduction is generated by direct or indirect connection between a metal powder (conductive powder having conductivity such as metal powder or carbon nanotube (CNT), graphite, graphene).

However, this method has a limitation in improvement of electric conductivity after adhesion to an adherend, and there is a problem that conductivity is affected by physical and environmental factors such as stress.

KR 20-0398477 KR 10-1511284

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above problems, and it is an object of the present invention to maximize the conductivity performance in the horizontal direction (XY axis) by contacting a fine metal wire directly to an adherend, It is possible to control the adhesive force in addition to the physical properties of the pressure-sensitive adhesive by adjusting the adhesive area attached to the adherend, and to increase the contactable area of the conductive material mixed in the binder in the pressure-sensitive adhesive and the gap with the upper and lower conductors, The present invention also provides a method of manufacturing a direct-contact high-performance conductive adhesive tape using the nano-metal powder.

In order to accomplish the objects of the present invention as described above and achieve the characteristic effects of the present invention described below, the characteristic structure of the present invention is as follows.

The high-performance conductive adhesive tape of the direct contact type using the nano-metal powder according to the present invention comprises a release film, a conductive nano metal wire printed on the back surface of the release film, a conductive adhesive formed on the surface of the conductive nano metal wire, And a conductive substrate which is formed in a laminated manner. In case where the conductivity in the vertical direction (Z-axis) is not required for the application of the product, the conductive powder may not be mixed in the pressure-sensitive adhesive, if necessary, so that the introduction of the conductive substance into the pressure-sensitive adhesive is not stipulated.

The conductive nano metal wire may be formed of a conductive nano ink in which at least one powder selected from the group consisting of nano-sized metals such as gold, silver, copper and aluminum is mixed with a polymer binder.

The polymeric binder may include at least one selected from the group consisting of melamine resin, urethane resin, acrylic resin, epoxy resin, silicone resin, alkyd resin, imide resin and unsaturated ester resin.

The conductive adhesive may include at least one selected from the group consisting of acryl, urethane, silicone, and synthetic rubber.

The conductive adhesive may include at least one selected from the group consisting of gold, silver, copper, nickel, aluminum, or a carbon-based material.

The conductive substrate may further include a light-shielding coating layer on the surface of which conductive black carbon is used.

When the product is not required to have vertical (Z-axis) conductivity in the application, it may further include a film having transparency or black color insulating properties as required.

A method for manufacturing a direct contact type high-performance conductive adhesive tape using the nano-metal powder according to the present invention comprises the steps of preparing a film coated with a release agent, preparing a conductive nano ink by mixing a nano metal powder and a polymer binder, Printing a circuit with the conductive nano ink on the releasing agent coated surface of the film, curing the printed conductive nano ink, coating a conductive adhesive on the surface of the printed conductive nano ink, curing the conductive adhesive And bonding the surface coated with the conductive adhesive to a conductive substrate.

The high-performance conductive adhesive tape using the nano-metal powder according to the present invention can maximally maximize the conductive performance in the horizontal direction (X-Y axis) by contacting the fine metal wire directly to the adherend.

In addition, the high-performance conductive adhesive tape using the nano-metal powder according to the present invention can control the conductivity by controlling the thickness of the conductive nano metal wire formed by printing with the conductive nano ink, It is possible to control the adhesive strength in addition to the physical properties of the pressure-sensitive adhesive by adjusting the adhesive area.

Further, the high-performance conductive adhesive tape using the nano-metal powder according to the present invention has the effect of increasing the contactable area of the conductive material mixed in the binder in the pressure-sensitive adhesive and narrowing the gap with the upper and lower conductors, Can be obtained simultaneously.

1 and 2 are sectional views of a direct contact type high-performance conductive adhesive tape using a nano-metal powder according to the present invention. FIG. 1 is a basic type of a high-performance conductive adhesive tape according to the present invention, It is a composite type of adhesive tape.
3 is a view showing a method of manufacturing a direct contact type high-performance conductive adhesive tape using the nano-metal powder according to the present invention.
4A is a cross-sectional view showing a conventional conductive adhesive tape, and FIG. 4B is an example of using a direct contact type high-performance conductive adhesive tape using the nano-metal powder according to the present invention. Fig.
Fig. 5 is a view showing a contact area of a conductive material in contact with an adherend, wherein (a) is a contact area in a conventional conductive adhesive tape, and (b) is a diagram showing a contact area in the conductive adhesive tape of the present invention .
Fig. 6 is a diagram showing an electrical resistance measurement test according to an embodiment of the present invention, wherein (a) is a horizontal (XY axis) electrical resistance measurement test, and (b) Fig.
FIG. 7 is a diagram showing a result of electric resistance measurement in the horizontal (XY axis) direction according to an embodiment of the present invention.
FIG. 8 is a diagram showing a measurement result of electric resistance in a vertical (Z-axis) direction according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and how to accomplish them, will become apparent by reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. Like reference numerals designate the same or functionally similar elements throughout the specification. Accordingly, although the same reference numerals or similar reference numerals are not mentioned or described in the drawings, they may be described with reference to other drawings. Further, even if the reference numerals are not shown, they can be described with reference to other drawings.

1 and 2 are cross-sectional views of a direct contact type high-performance conductive adhesive tape using a nano-metal powder according to the present invention. FIG. 1 is a basic type 100 of a high-performance conductive adhesive tape according to the present invention, Is a composite type (200) of high performance conductive adhesive tape. 1, the conductive adhesive tape of the present invention includes a release film 110, a conductive nano-metal wire 120 printed on the back surface of the release film, a conductive adhesive 130 formed on the surface of the conductive nano-metal wire, And a conductive base material 140 laminated on the surface of the conductive pressure-sensitive adhesive.

Referring to FIG. 2, the conductive adhesive tape may be formed by further forming a layer in addition to the basic type shown in FIG. 1 to form a composite adhesive tape. The conductive adhesive tape may further include a conductive adhesive layer and a conductive base layer.

The release film 110 is characterized in that a release agent such as fluorine, silicon, and waxes is coated on a film formed of at least one of polyester, polyethylene, polypropylene, polyimide, and paper. Preferably, a polyester film can be used in consideration of workability and manufacturing cost.

The conductive nano metal wire 120 is a mixture of a nano metal powder and a polymer binder. The nano metal powder is colorless and preferably has a particle size of 5 to 150 nm or less, more preferably 10 to 100 nm Nano-sized particles. If the particle size is less than 5 nm, there may be a problem that the particle size is too small, the dispersing ability is lowered, the aggregation results in deterioration of the conduction efficiency, and if it exceeds 150 nm, various physical properties as a nano- There is a limitation in the line width when the circuit is printed and a problem may arise in that it has elaborate conductivity. However, when the line width of the conductive nano-metal wire can be widely applied, the particle size is not defined since the larger size nanoparticles do not affect the printability.

The nano-metal powder is formed of a conductive nano ink by mixing at least one selected from the group consisting of nano-sized metals such as gold, silver, copper and aluminum into a polymer binder, wherein the polymer binder includes nano- Is uniformly dispersed and has a function of improving the printability. The polymer binder is preferably added in an amount of 10 to 100 parts by weight based on 100 parts by weight of the nano-metal powder, more preferably 20 to 80 parts by weight of the polymer binder based on 100 parts by weight of the nano- . If the addition amount is less than 10 parts by weight, the function of uniformly dispersing the nano-metal powder tends to fall off and the printing property is deteriorated. When the amount is more than 100 parts by weight, the proportion of the nano-metal powder is lowered, and the conductivity is deteriorated.

The polymer binder includes at least one selected from the group consisting of a melamine resin, a urethane resin, an acrylic resin, an epoxy resin, a silicone resin, an alkyd resin, an imide resin and an unsaturated ester resin. Apply different hardening methods accordingly.

The kind of the solvent used in the polymer binder is not particularly limited, and any solvent which can dissolve the polymer binder can be used. The polymeric binder may be included in an amount of 0.01 to 70 parts by weight based on 100 parts by weight of the solvent. When the binder weight is less than 0.01, it is difficult to obtain a uniform dispersing effect. When the weight is more than 70, there is a problem that it is difficult to print in the form of a circuit formed of nano ink and formed of lines or curves. If necessary, a dispersion stabilizer may be added for uniform dispersion of the nano-metal powder.

The conductive nano ink comprising the nano metal powder and the polymer binder is printed in the form of a line or a curved line so as to allow electric current to flow in the horizontal direction on the release agent coated surface of the release film to form the conductive nano metal wire 120 .

The conductive adhesive 130 is coated on the ink printed surface of the release film on which the conductive nano metal wire 120 is printed. The conductive adhesive 130 may be at least one selected from the group consisting of acryl, urethane, silicone, And at least one conductive material 150 selected from the group consisting of gold, silver, copper, nickel, aluminum, or a carbon-based material. If the vertical (Z-axis) conductivity is not required in the application of the product, the conductive material 150 may not be mixed in the pressure-sensitive adhesive, so that it is not stipulated that the conductive material is put into the pressure-sensitive adhesive.

The conductive substrate 140 may be formed of a metal foil, a plated fiber, or a plated nonwoven fabric, and is formed by laminating on the surface of the conductive adhesive 130. The conductive substrate may further include a light-shielding coating layer on the surface of which conductive black carbon is used. When the product is not required to have a conductivity in the vertical (Z-axis) direction, it may further include a film having transparency or color insulating property such as black as necessary.

3 is a view showing a method of manufacturing a direct contact type high-performance conductive adhesive tape using the nano-metal powder according to the present invention. Referring to FIG. 3, a method of manufacturing a direct contact type high performance conductive adhesive tape using a nano metal powder includes the steps of preparing a film coated with a release agent (S310), mixing a nano metal powder and a polymer binder to prepare a conductive nano ink A step S330 of printing a circuit with the conductive nano ink on the releasing agent coating surface of the release film; (S340) of curing the conductive nano metal wire printed with the conductive nano ink (S340), coating a conductive adhesive on the surface of the printed conductive nano metal wire (S350), curing the conductive adhesive agent (S360) (S370) bonding the coated surface with the conductive substrate.

When the conductive nano ink is printed on the releasing agent coating surface of the release film in step S330, the shape is not specified but may be continuously connected with a line or a curved line. That is, it is possible to form the circuit as a whole by thin lines such as triangular, square, circular, polygonal, or irregular shapes.

At this time, the difference between the thickness of the printed line and the area of the unprinted empty space directly affects the adhesive force and conductivity of the completed conductive adhesive tape, and therefore, the adhesive force and the conductivity required are taken into consideration. The thickness of the conductive nano-metal wire printed with conductive nano ink is generally between 0.05 and 5 mm. When the line width of the conductive nano-metal wire is less than 0.05 mm, the direct contact area between the nano-metal powder and the adherend is narrowed and the conduction efficiency is lowered. When the width exceeds 5 mm, the contact area of the adhesive with the adherend is small, have.

When the printed conductive nano-metallic wire 120 is cured in the step S340, the curing may be performed by room temperature curing, thermal curing or UV curing depending on the binder and the curing system used.

When the coated conductive adhesive 130 is cured in step S360, the type of curing may be room temperature curing, thermal curing or UV curing depending on the binder and curing system. In addition, the coated conductive adhesive may further include a step of further laminating the release film to protect the adhesive surface after curing.

4A is a cross-sectional view showing a conventional conductive adhesive tape, and FIG. 4B is an example of using a direct contact type high-performance conductive adhesive tape using the nano-metal powder according to the present invention. Fig. 4 (a), the conductive adhesive tape of the related art is transferred to the upper conductive base material 140 through the conductive material 150 in the conductive adhesive 130 after the adhesive is applied to the adherend 300, The conductive material 150 is transferred to the lower part through the conductive material 150. In this process, the conductive material 150 has a problem in that the conductive efficiency is deteriorated due to the loss of conductivity due to the direct and indirect movement of the conductive material 150.

Referring to FIG. 4 (b), the conductive adhesive tape of the present invention can be applied to the adherend 300 without any loss along the circuit horizontally connected by the conductive nano metal wire 120 printed with conductive nano ink And the conductive material 150 is transferred to the upper conductive substrate 140 through the conductive adhesive 150 to be horizontally transferred to the lower portion through the conductive material 150. At this time, So that the conduction efficiency becomes high.

Fig. 5 is a diagram showing a contact area of a conductive material in contact with an adherend after adhering to an adherend, in which (a) is a contact area in a conventional conductive adhesive tape, and (b) Fig.

Referring to FIG. 5, the conventional conductive adhesive tape conducts electricity through a fine contact portion to deteriorate conduction efficiency. However, the conductive adhesive tape of the present invention includes a conductive nano metal wire printed with a conductive nano-ink using a conductive nano metal powder , And the conductive performance in the horizontal direction (XY axis) can be maximized by directly contacting the adherend with conductive nano-metal wires continuously connected to the lines or curves as a whole. By controlling the thickness of the conductive nano-metal wire, the distance between the patterns can be adjusted to control the area of the adhesive adhered to the adherend. Thus, it is possible to stably adjust the adhesive force in addition to the adhesive force attributed to the physical properties of the conductive adhesive. Further, it is possible to increase the contactable area of the conductive material mixed in the binder in the conductive pressure-sensitive adhesive, thereby narrowing the gap with the upper and lower conductors, thereby enhancing the conductivity performance in the vertical direction (Z-axis) at the same time.

Therefore, the direct contact type high-performance conductive adhesive tape using the nano-metal powder according to the present invention can exhibit reliable and excellent electric conductivity as compared with the conductive adhesive tape using the conventional mixing of the conductive material. It is difficult to obtain sufficient reliability of electrical connection because a structure in which a pressure sensitive adhesive mixed with a conventional conductive material is coated on a porous substrate such as a nonwoven fabric or a membrane is contacted with a very narrow portion. However, the conductive adhesive tape according to the present invention, The conductive nano-metal wire including the powder improves the conduction efficiency by direct contact with the adherend, and the contact area between the conductive materials is enlarged to obtain excellent electrical conductivity.

In addition, it can be manufactured with a thin thickness, and can stably secure electric conductivity and adhesion, and can be used on the curved surface of the adherend. (X-Y axis) and the thickness (Z axis) of the pressure-sensitive adhesive by virtue of a structure capable of achieving noise reduction effect with high efficiency because of high electrical conductivity and a configuration capable of conducting in all directions.

Accordingly, the conductive adhesive tape according to the present invention can be manufactured not only in terms of excellent electrical conductivity and noise damping effect but also in a thin thickness, so that it is lightweight and has flexibility.

Hereinafter, the present invention will be described by way of examples, but the present invention is not limited thereto.

Example

Example 1

Conductive nano ink was prepared by mixing nano - size copper powder with urethane resin. At this time, 100 parts by weight of the nano-copper powder was mixed at a mixing ratio of 50 parts by weight of the urethane resin. The conductive nano ink was printed on the surface of the polyester film having a thickness of 50 탆 in a manner that the conductive nano ink was entirely connected with a line or a curved line on the surface where the silicon release processing was performed. The conductive nano ink was formed so as to have a line width of 120 탆 and a pattern interval of 180 탆 Respectively. And then cured by a UV curing method using a xenon flash lamp. The conductive adhesive was prepared by mixing 15 parts by weight of nickel with respect to 100 parts by weight of the acrylic resin, and then coated on the cured conductive nano-metal wire, followed by curing by a heat curing method. The thickness of the dried acrylic conductive pressure-sensitive adhesive was adjusted to 25 m. A copper foil having a thickness of 25 占 퐉 was prepared as a conductive base material and lapped on the adhesive surface. The surface of the copper foil was coated with conductive black carbon to prevent light leakage.

Comparative Example 1

Acrylic adhesive was mixed with 15 parts by weight of nickel to prepare an electrically conductive pressure-sensitive adhesive. After coating the surface of the polyester film having a thickness of 50 占 퐉 with the silicone release treatment, the conductive pressure-sensitive adhesive was dried to a thickness of 25 占 퐉, And cured by a heat curing method. A copper foil having a thickness of 25 占 퐉 was prepared as a conductive base material and lapped on the adhesive surface. The surface of the copper foil was coated with conductive black carbon to prevent light leakage.

Experimental Example

Experimental Example 1. Horizontal (X-Y axis) direction resistance test result

FIG. 6 is a view showing an electrical resistance measurement test according to an embodiment of the present invention, wherein FIG. 6 (a) is a diagram showing a horizontal (X-Y) electrical resistance measurement test.

The conductive adhesive tape according to Example 1 and Comparative Example 1 of the present invention was cut to a width of 5 mm and a length of 45 mm to remove the release film and a copper adherend (10 mm x 50 mm ). Ten specimens were made (n = 10) and the measurements were performed according to the Truss Test Method (see Fig. 6), and the average values were calculated. Measurement results The following table 1 and FIG. 7 show the average resistance value in the horizontal (XY axis) direction of Example 1 according to the present invention is about 16 times lower than the average resistance value of Comparative Example 1 which is a conventional conductive adhesive tape , And high conduction efficiency.

One 2 3 4 5 6 7 8 9 10 medium
(Ω) Comparative Example 1 0.18 0.19 0.23 0.19 0.21 0.25 0.23 0.25 0.23 0.24 0.22 Example 1 0.012 0.008 0.014 0.014 0.013 0.014 0.014 0.017 0.014 0.014 0.0134

Experimental Example 2. Results of vertical (Z-axis) resistance test

FIG. 6 is a view showing an electrical resistance measurement test according to an embodiment of the present invention, and FIG. 6 (b) is a diagram showing a vertical (Z-axis) electrical resistance measurement test.

The conductive adhesive tape according to Example 1 and Comparative Example 1 of the present invention was cut to a width of 25 mm and a length of 25 mm to remove the release film and a copper plate was attached to the lower surface of a 25 mm x 25 mm (1 kg) of the same area. Ten specimens were made (n = 10) and the measurements were performed according to the Truss Test Method (see Fig. 6), and the average values were calculated. Measurement results In the following Tables 2 and 8, the average resistance value in the vertical (Z-axis) direction of Example 1 according to the present invention is about 1.5 times lower than the average resistance value of Comparative Example 1 which is a conductive adhesive tape of the related art , And high conduction efficiency.

One 2 3 4 5 6 7 8 9 10 medium
(Ω) Comparative Example 1 0.012 0.012 0.011 0.012 0.012 0.011 0.012 0.012 0.012 0.012 0.0118 Example 1 0.008 0.008 0.008 0.008 0.007 0.008 0.008 0.008 0.008 0.007 0.0078

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of limitation, A method in which a conductive pressure-sensitive adhesive layer is formed first and then a circuit is formed by offset printing with a conductive nano ink on the pressure-sensitive adhesive surface of the conductive pressure-sensitive adhesive, or the like. It is therefore to be understood that the above-described embodiments are illustrative and not restrictive in every respect.

Accordingly, the spirit of the present invention should not be construed as being limited to the above-described embodiments, and all of the equivalents or equivalents of the claims, as well as the claims set forth below, belong to the scope of the present invention will be.

100: Basic type 110: Release film
120: conductive nano metal wire 130: conductive adhesive
140: conductive base material 150: conductive material
200: composite type 300: adherend

Claims (10)

Release film;
A conductive nano metal wire printed on the back surface of the release film;
A conductive pressure-sensitive adhesive formed on a surface of the release film on which a conductive nano-metal wire is formed; And
And a conductive substrate laminated on the surface of the conductive pressure-sensitive adhesive,
Wherein the conductive nano metal wire has a line width of 0.05 to 5 mm and is formed of a conductive nano ink in which 20 to 80 parts by weight of a polymer binder is mixed with 100 parts by weight of the nano metal powder. Conductive adhesive tape.
delete The method according to claim 1,
Wherein the polymeric binder comprises at least one selected from the group consisting of melamine resin, urethane resin, acrylic resin, epoxy resin, alkyd resin, imide resin and unsaturated ester resin. Conductive adhesive tape.
The method according to claim 1,
Wherein the conductive adhesive agent comprises at least one selected from the group consisting of acrylic, urethane, silicone, and synthetic rubber.
5. The method of claim 4,
Wherein the conductive adhesive comprises at least one conductive material selected from the group consisting of metals and carbon-based materials.
The method according to claim 1,
Wherein the conductive substrate further comprises an antireflection coating layer having conductive black carbon on the surface thereof.
(a) preparing a release film coated with a releasing agent;
(b) preparing a conductive nanoink by mixing 20 to 80 parts by weight of a polymer binder with respect to 100 parts by weight of the nano-metal powder;
(c) printing a circuit having a line width of 0.05 to 5 mm with the conductive nano ink on the release agent coating surface of the release film;
(d) thermally curing or UV curing the conductive nano-metallic wire printed with the conductive nano ink;
(e) coating a conductive adhesive on the surface of the release film on which the conductive nano-metal wire is formed;
(f) curing the conductive pressure-sensitive adhesive; And
(g) bonding the surface coated with the conductive adhesive to a conductive substrate, wherein the conductive adhesive is coated on the surface of the conductive adhesive.
delete 8. The method of claim 7,
Wherein the coated conductive adhesive of step (f) is cured by room temperature curing, thermal curing, or UV curing.
8. The method of claim 7,
The method of manufacturing a conductive adhesive tape of direct contact type using a nano metal powder, wherein a release film is additionally formed to protect the adhesive surface after curing the coated conductive adhesive in the step (f).

Images