KR101862864B1 - Display device - Google Patents

Abstract

A display device is started. The display device includes a light source; A wavelength conversion member disposed adjacent to the light source; And a heat transfer member disposed between the light source and the wavelength conversion member.

Description

Display device {DISPLAY DEVICE}

The embodiment relates to a display device.

Among display devices, there is a device that requires a backlight unit capable of generating light in order to display an image. The backlight unit is a device for supplying light to a display panel including a liquid crystal or the like and includes a light emitting device and means for effectively transmitting the light output from the light emitting device to the liquid crystal side.

As a light source of such a display device, an LED (Light Emitted Diode) or the like can be applied. Further, in order that the light output from the light source is effectively transmitted to the display panel side, a light guide plate and an optical sheet may be laminated and used.

At this time, an optical member that changes the wavelength of light generated from the light source and causes white light to enter the light guide plate or the display panel can be applied to such a display device. Particularly, in order to change the wavelength of light, a quantum dot or the like can be used.

The quantum dot has a particle size of 10 nm or less and has unique electrical and optical characteristics depending on its size. For example, when the approximate size is 55 to 65 Å, it can emit red, 40 to 50 Å to green, and 20 to 35 Å to blue. Yellow has medium size of red and green quantum dots. As the spectrum of light changes from red to blue, the size of the quantum dots varies from 65 Å to 20 Å, which may be slightly different.

In order to form the optical member including the quantum dots, the quantum dots emitting RGB or RYGB, which are three primary colors of light, can be formed by spin coating or printing on a transparent substrate such as glass. Here, when a quantum dot emitting yellow (Y) is further included, white light closer to natural light can be obtained. The matrix (medium) in which the quantum dots are dispersed can apply an inorganic substance or a polymer having excellent transmittance with respect to light in the visible light region and the ultraviolet region (including Far UV) or in the visible light region. For example, it may be inorganic silica, polymethylmethacrylate (PMMA), polydimethylsiloxane (PDMS), poly lactic acid (PLA), silicon polymer or YAG. In particular, such quantum dots and media can be denatured or damaged by heat.

A display device to which such a quantum dot is applied is disclosed in Korean Patent Laid-Open Publication No. 10-2011-0012246.

The embodiment intends to provide a display device having improved reliability and durability.

A display device according to an embodiment includes a light source; A wavelength conversion member disposed adjacent to the light source; And a heat transfer member disposed between the light source and the wavelength conversion member.

A display device according to an embodiment includes a light guide plate; A plurality of light emitting diodes disposed on a side surface of the light guide plate; A wavelength conversion member interposed between the light emitting diodes and the light guide plate; And a heat transfer member disposed adjacent to the light emitting diodes and having a plurality of through holes corresponding to the light emitting diodes, respectively.

The display device according to the embodiment can effectively emit heat generated from the light source by using the heat transfer member and the heat emitting portion. In particular, the heat transfer member is interposed between the park and the wavelength conversion member, and can absorb heat emitted from the light source toward the wavelength conversion member.

That is, the heat transfer member may transfer the heat emitted from the light source to the wavelength conversion member to the heat emission unit. Further, the display device according to the embodiment can emit heat generated in the wavelength conversion member by the heat transfer member and the heat radiation portion by the light emitted from the light source.

Accordingly, the display device according to the embodiment can prevent the wavelength conversion member from being deteriorated or denatured by heat. In particular, the display device according to the embodiment can prevent the host and / or the wavelength conversion particles included in the wavelength conversion member from being denatured by heat. Therefore, the display device according to the embodiment can have improved reliability and durability.

Further, the display device according to the embodiment can effectively lower the temperature of the wavelength converting member. Accordingly, the display device according to the embodiment can reduce the performance deterioration of the wavelength converting particles due to the temperature rise, and can have an improved color reproduction rate.

1 is an exploded perspective view showing a liquid crystal display device according to an embodiment.
FIG. 2 is a cross-sectional view showing a section cut along AA 'in FIG. 1; FIG.
3 is a perspective view showing the wavelength conversion member according to the embodiment.
FIG. 4 is a cross-sectional view showing a section cut along BB 'in FIG. 3; FIG.
5 is a perspective view illustrating light emitting diodes, a heat transfer member, a wavelength converting member, and a light guide plate.
6 is a cross-sectional view showing a light emitting diode, a flexible printed circuit board, a heat transfer member, a wavelength converting member, a light guide plate, and the like.
7 is a plan view showing a flexible printed circuit board.
8 is a cross-sectional view illustrating a light emitting diode, a flexible printed circuit board, a heat transfer member, a wavelength conversion member, a light guide plate, and the like according to another embodiment.

In the description of the embodiments, it is described that each substrate, frame, sheet, layer or pattern is formed "on" or "under" each substrate, frame, sheet, In this case, "on" and "under " all include being formed either directly or indirectly through another element. In addition, the upper or lower reference of each component is described with reference to the drawings. The size of each component in the drawings may be exaggerated for the sake of explanation and does not mean the size actually applied.

1 is an exploded perspective view showing a liquid crystal display device according to an embodiment. 2 is a cross-sectional view showing a section taken along the line A-A in Fig. 3 is a perspective view showing the wavelength conversion member according to the embodiment. Fig. 4 is a cross-sectional view showing a section cut along the line B-B 'in Fig. 3; Fig. 5 is a perspective view illustrating light emitting diodes, a heat transfer member, a wavelength converting member, and a light guide plate. 6 is a cross-sectional view showing a light emitting diode, a flexible printed circuit board, a heat transfer member, a wavelength converting member, a light guide plate, and the like. 7 is a plan view showing a flexible printed circuit board.

1 to 7, a liquid crystal display according to an embodiment includes a mold frame 10, a backlight assembly 20, and a liquid crystal panel 30.

The mold frame 10 receives the backlight assembly 20 and the liquid crystal panel 30. The mold frame 10 has a rectangular frame shape. Examples of the material used for the mold frame 10 include plastic or reinforced plastic.

In addition, a chassis supporting the mold frame 10 and supporting the backlight assembly 20 may be disposed below the mold frame 10. The chassis may be disposed on a side surface of the mold frame 10.

The backlight assembly 20 is disposed inside the mold frame 10 and emits light toward the liquid crystal panel 30. The backlight assembly 20 includes a reflective sheet 100, a light guide plate 200, a light source, for example, light emitting diodes 300, a wavelength conversion member 400, a heat transfer member 700, A plurality of optical sheets 500, and a flexible printed circuit board (FPCB) 600.

The reflective sheet 100 reflects light generated from the light emitting diodes 300 upward.

The light guide plate 200 is disposed on the reflective sheet 100 and receives light emitted from the light emitting diodes 300 and reflects the light upward through reflection, refraction and scattering.

The light guide plate 200 includes an incident surface facing the light emitting diodes 300. That is, the surface of the light guide plate 200 facing the light emitting diodes 300 is an incident surface.

The light emitting diodes 300 are disposed on the side surfaces of the light guide plate 200. More specifically, the light emitting diodes 300 are disposed on the incident surface.

The light emitting diodes 300 are light sources for generating light. In more detail, the light emitting diodes 300 emit light toward the wavelength converting member 400.

The light emitting diodes 300 generate the first light. For example, the first light may be blue light. That is, the light emitting diodes 300 may be blue light emitting diodes for generating blue light. The first light may be primarily blue light having a wavelength band between about 430 nm and about 470 nm. In addition, the light emitting diodes 300 may generate ultraviolet rays.

The light emitting diodes 300 are mounted on the flexible printed circuit board 600. The light emitting diodes 300 are disposed under the flexible printed circuit board 600. The light emitting diodes 300 are driven by receiving a drive signal through the flexible printed circuit board 600.

The wavelength converting member 400 is interposed between the light emitting diodes 300 and the light guide plate 200. The wavelength converting member 400 is bonded to the side surface of the light guide plate 200. In more detail, the wavelength conversion member 400 is attached to the incident surface of the light guide plate 200. In addition, the wavelength conversion member 400 may be bonded to the light emitting diodes 300.

The wavelength converting member 400 receives the light emitted from the light emitting diodes 300 and converts the wavelength. For example, the wavelength conversion member 400 may convert the first light emitted from the light emitting diodes 300 into the second light and the third light.

Here, the second light may be red light, and the third light may be green light. That is, the wavelength converting member 400 may convert a portion of the first light to red light having a wavelength band between about 630 nm and about 660 nm, and may transmit a different portion of the first light to about 520 nm to about 560 nm Green light having a wavelength band between the wavelengths.

Accordingly, the first light passing through the wavelength conversion member 400 and the second light and the third light converted by the wavelength conversion member 400 may be mixed with each other to form white light. That is, the first light, the second light, and the third light may be mixed, and white light may be incident on the light guide plate 200.

2 to 4, the wavelength converting member 400 includes a tube 410, a sealing member 420, a plurality of wavelength converting particles 430, and a matrix 440.

The tube 410 receives the sealing member 420, the wavelength converting particles 430, and the matrix 440. That is, the tube 410 is a container for accommodating the sealing member 420, the wavelength converting particles 430, and the matrix 440. In addition, the tube 410 has a shape elongated in one direction.

The tube 410 may have the shape of a rectangular tube 410. That is, the cross section perpendicular to the longitudinal direction of the tube 410 may have a rectangular shape. Further, the width of the tube 410 may be about 0.6 mm, and the height of the tube 410 may be about 0.2 mm. That is, the tube 410 may be a capillary tube.

The tube 410 is transparent. Examples of the material used for the tube 410 include glass and the like. That is, the tube 410 may be a glass capillary tube.

The sealing member 420 is disposed inside the tube 410. The sealing member 420 is disposed at an end of the tube 410. The sealing member (420) seals the inside of the tube (410). The sealing member 420 may include an epoxy resin.

The wavelength converting particles 430 are disposed inside the tube 410. More specifically, the wavelength converting particles 430 are uniformly dispersed in the matrix 440, and the matrix 440 is disposed inside the tube 410.

The wavelength converting particles 430 convert the wavelength of the light emitted from the light emitting diodes 300. The wavelength converting particles 430 receive the light emitted from the light emitting diodes 300 and convert wavelengths. For example, the wavelength conversion particles 430 may convert blue light emitted from the light emitting diodes 300 into green light and red light. That is, some of the wavelength converting particles 430 convert the blue light into green light having a wavelength band of about 520 nm to about 560 nm, and another part of the wavelength converting particles 430 converts the blue light Can be converted to red light having a wavelength band between about 630 nm and about 660 nm.

Alternatively, the wavelength converting particles 430 may convert ultraviolet rays emitted from the light emitting diodes 300 into blue light, green light, and red light. That is, a part of the wavelength converting particles 430 converts the ultraviolet ray into blue light having a wavelength range of about 430 nm to about 470 nm, and another part of the wavelength converting particles 430 converts the ultraviolet It can be converted into green light having a wavelength range of 520 nm to 560 nm. Further, another part of the wavelength converting particles 430 may convert the ultraviolet ray into red light having a wavelength band of about 630 nm to about 660 nm.

That is, when the light emitting diodes 300 are blue light emitting diodes that generate blue light, the wavelength conversion particles 430 that convert blue light into green light and red light, respectively, may be used. Alternatively, when the light emitting diodes 300 are UV light emitting diodes that generate ultraviolet rays, the wavelength conversion particles 430 may be used to convert ultraviolet light into blue light, green light, and red light, respectively.

The wavelength conversion particles 430 may be a plurality of quantum dots (QDs). The quantum dot may include core nanocrystals and shell nanocrystals surrounding the core nanocrystals. In addition, the quantum dot may include an organic ligand bound to the shell nanocrystal. In addition, the quantum dot may include an organic coating layer surrounding the shell nanocrystals.

The shell nanocrystals may be formed of two or more layers. The shell nanocrystals are formed on the surface of the core nanocrystals. The quantum dot may convert the wavelength of the light incident on the core core crystal into a long wavelength through the shell nanocrystals forming the shell layer and increase the light efficiency.

The quantum dot may include at least one of a group II compound semiconductor, a group III compound semiconductor, a group V compound semiconductor, and a group VI compound semiconductor. More specifically, the core nanocrystals may include Cdse, InGaP, CdTe, CdS, ZnSe, ZnTe, ZnS, HgTe or HgS. The shell nanocrystals may include CuZnS, CdSe, CdTe, CdS, ZnSe, ZnTe, ZnS, HgTe or HgS. The diameter of the quantum dot may be 1 nm to 10 nm.

The wavelength of the light emitted from the quantum dot can be adjusted according to the size of the quantum dot. The organic ligand may include pyridine, mercapto alcohol, thiol, phosphine, phosphine oxide, and the like. The organic ligands serve to stabilize unstable quantum dots after synthesis. After synthesis, a dangling bond is formed on the outer periphery, and the quantum dots may become unstable due to the dangling bonds. However, one end of the organic ligand is in an unbonded state, and one end of the unbound organic ligand bonds with the dangling bond, thereby stabilizing the quantum dot.

Particularly, when the quantum dot has a size smaller than the Bohr radius of an exciton formed by electrons and holes excited by light, electricity or the like, a quantum confinement effect is generated to have a staggering energy level and an energy gap The size of the image is changed. Further, the charge is confined within the quantum dots, so that it has a high luminous efficiency.

Unlike general fluorescent dyes, the quantum dots vary in fluorescence wavelength depending on the particle size. That is, as the size of the particle becomes smaller, it emits light having a shorter wavelength, and the particle size can be adjusted to produce fluorescence in a visible light region of a desired wavelength. In addition, since the extinction coefficient is 100 to 1000 times higher than that of a general dye, and the quantum yield is also high, it produces very high fluorescence.

The quantum dot can be synthesized by a chemical wet process. Here, the chemical wet method is a method of growing particles by adding a precursor material to an organic solvent, and the quantum dots can be synthesized by a chemical wet method.

The matrix 440 surrounds the wavelength converting particles 430. That is, the matrix 440 uniformly disperses the wavelength converting particles 430 therein. The matrix 440 may be comprised of a polymer. The matrix 440 is transparent. That is, the matrix 440 may be formed of a transparent polymer.

The matrix 440 is disposed within the tube 410. That is, the matrix 440 is entirely filled in the tube 410. The matrix 440 may be in close contact with the inner surface of the tube 410.

An air layer 450 is formed between the sealing member 420 and the matrix 440. The air layer 450 is filled with nitrogen. The air layer 450 performs a buffer function between the sealing member 420 and the matrix 440.

The wavelength converting member 400 may be formed by the following method.

First, the wavelength converting particles 430 are uniformly dispersed in the resin composition. The resin composition is transparent. The resin composition may have photocurability.

Thereafter, the inside of the tube 410 is depressurized, and the inlet of the tube 410 is locked in the resin composition in which the wavelength converting particles 430 are dispersed, and the pressure around the tube 410 is raised. Accordingly, the resin composition in which the wavelength converting particles 430 are dispersed is introduced into the tube 410.

Thereafter, a part of the resin composition flowing into the tube 410 is removed, and the inlet portion of the tube 410 is emptied.

Thereafter, the resin composition flowing into the tube 410 is cured by ultraviolet rays or the like, and the matrix 440 is formed.

Then, the epoxy resin composition flows into the inlet of the tube 410. Thereafter, the introduced epoxy resin composition is cured, and the sealing member 420 is formed. The process of forming the sealing member 420 proceeds in a nitrogen atmosphere so that an air layer 450 containing nitrogen can be formed between the sealing member 420 and the matrix 440.

The heat transfer member 700 is interposed between the light emitting diodes 300 and the wavelength conversion member 400. More specifically, the heat transfer member 700 may be disposed adjacent to the light emitting diodes 300. The heat transfer member 700 may be in direct contact with the light emitting diode 400.

The heat transfer member 700 is connected to the heat radiation unit 800. The heat transfer member 700 may be directly or indirectly connected to the heat emitting portion 800. The thickness T of the heat transfer member 700 may be about 1 μm to about 1 mm.

The heat transfer member 700 has a high thermal conductivity. The heat transfer member 700 may have a thermal conductivity of about 22 Kcal / m · hr · ° C to about 400 Kcal / m · hr · ° C. The heat transfer member 700 may have a higher thermal conductivity than the tube 410.

As the heat transfer member 700, a metal or a ceramic having a high thermal conductivity may be used. More specifically, examples of the metal used as the heat transfer member 700 include copper, silver, aluminum, iron, stainless steel, gold, and the like. In addition, the heat transfer member 700 may be made of an alloy of the metal or the like. Further, a thermoelectric material or the like may be used as the heat transfer member 700. Examples of the thermoelectric material include Skutterudites. As the thermoelectric material, a glass material or the like can be used.

In addition, the heat transfer member 700 is opposed to the wavelength conversion member 400. The heat transfer member 700 extends in the same direction as the wavelength converting member 400. The heat transfer member 700 may be substantially parallel to the wavelength conversion member 400. [ In addition, the heat transfer member 700 and the wavelength conversion member 400 may be spaced apart from each other by a predetermined distance.

The heat transfer member 700 may include a plurality of through holes 701. The transmission holes 701 correspond to the light emitting diodes 300, respectively. More specifically, the transmission holes 701 correspond to the emission surfaces of the light emitting diodes 300, respectively. More specifically, the transmission holes 701 expose the exit surface of the light emitting diodes.

The light emitted from the light emitting diodes 300 is incident on the wavelength conversion member 400 via the transmission holes 701, respectively. That is, the transmissive holes 701 are transmissive portions through which light emitted from the light emitting diodes 300 is transmitted.

The size of the transmission holes 701 may correspond to the size of the emission surface of the light emitting diodes 300 or may be larger. The planar shape of the transmission holes 701 may correspond to a planar shape of an emission surface of the light emitting diodes 300. More specifically, the outer peripheries of the transmission holes 701 can surround the periphery of the outgoing surface of the emitting surface of the light emitting diodes 300.

Since the heat transfer member 700 is disposed adjacent to the light emitting diodes 300, the heat generated from the light emitting diodes 300 can be effectively transmitted to the heat emitting unit 800. In particular, since the heat transfer member 700 is interposed between the light emitting diodes 300 and the wavelength conversion member 400, the heat transfer member 700 absorbs heat emitted to the wavelength conversion member 400, 800). Accordingly, the phenomenon that the temperature of the wavelength conversion member 400 is raised can be suppressed.

The heat discharging part 800 is connected to the heat transmitting member 700. More specifically, the heat releasing part 800 may be connected to the heat transmitting member 700 directly or indirectly. The heat discharging unit 800 discharges heat transmitted from the heat transmitting member 700.

Referring to FIGS. 1, 6, and 7, the heat emitting unit 800 includes a first heat emitting unit 810 and a second heat emitting unit 820.

The first heat emitting portion 810 is disposed on the flexible printed circuit board 600. More specifically, the first heat emitting portion 810 is disposed in the flexible printed circuit board 600. The first heat emitting portion 810 may be included in the flexible printed circuit board 600. That is, the first heat emitting portion 810 may be a part of the flexible printed circuit board 600.

The first heat emitting portion 810 may be disposed on the wavelength converting member 400. In addition, the first heat emitting portion 810 may extend in a direction in which the wavelength converting member 400 extends. The first heat emitting portion 810 is connected to the heat transfer member 700. More specifically, the first heat emitting portion 810 may be in direct contact with the heat transfer member 700. [

A material having a high thermal conductivity may be used for the first heat emitting portion 810. For example, a metal such as copper may be used for the first heat emitting portion 810.

6, the first heat emitting portion 810 includes a contact portion 811, a connecting via 812, and a heat radiating pad 813.

The contact portion 811 is directly or indirectly contacted with the heat transfer member 700. The thermal via is connected to the contact portion 811 and the heat radiation pad 813. That is, the connection via 812 connects the contact portion 811 and the heat radiation pad 813 to each other.

The heat dissipation pad 813 is connected to the connection via 812. The heat-radiating pad 813 may be exposed to the outside. The heat dissipation pad 813 may function to discharge the heat transferred from the heat transfer member 700 to the outside, particularly into the air.

The second heat emitting portion 820 is disposed below the wavelength converting member 400. More specifically, the second heat emitting portion 820 may be disposed below the light emitting diodes 300. The second heat discharging portion 820 is connected to the heat transmitting member 700. More specifically, the second heat releasing portion 820 may be in direct contact with the heat transfer member 700. [

The second heat emitting portion 820 may have a shape extending in a direction in which the wavelength converting member 400 extends. For example, the second heat emitting portion 820 may have a bar shape or a band shape extending in a direction in which the wavelength converting member 400 extends.

A material having a high thermal conductivity may be used for the second heat emitting portion 820. For example, a metal such as aluminum or copper may be used for the second heat emitting portion 820.

The second heat discharging unit 820 may discharge the heat transferred from the heat transmitting member 700 to the outside, especially into the air.

The heat shielding portion 900 is interposed between the heat transfer member 700 and the wavelength conversion member 400. More specifically, the heat shielding portion 900 may be in close contact with the heat transfer member 700 and the wavelength conversion member 400.

More specifically, the heat shielding portion 900 may be in close contact with the incident surface 401 of the wavelength conversion member 400. The heat shielding portion 900 may also be in close contact with the upper surface 402 of the wavelength conversion member 400 and / or the lower surface 403 of the wavelength conversion member 400. The heat shielding part 900 may be in close contact with the light guide plate 200. That is, the heat shielding portion 900 may be in close contact with the exit surface 404 of the wavelength conversion member 400 and the incident surface of the light guide plate 200. In addition, the heat shielding portion 900 may be disposed in the transmission holes 701. The heat shielding portion 900 may be in close contact with the light emitting surface of the light emitting diodes 300.

The heat interrupter 900 may have a lower thermal conductivity than the heat transfer member 700. For example, the thermal conductivity of the heat interceptor 900 may be about 0.1 x ^10-4 cal / sec · cm · ° C to about 1.0 x ^10-4 cal / sec · cm · ° C.

In addition, the heat shielding part 900 may be transparent. The refractive index of the heat shielding portion 900 may be between the refractive index of the filler of the light emitting diodes 300 and the refractive index of the tube 410 of the wavelength conversion member 400. A resin including a plurality of pores may be used for the heat shielding portion 900. In addition, a silicone resin or the like may be used for the heat shielding part 900.

The heat interrupter 900 blocks heat generated from the light emitting diodes 300. That is, the heat shielding unit 900 prevents the heat generated from the light emitting diodes 300 from being transmitted to the wavelength conversion member 400.

Accordingly, the liquid crystal display according to the present embodiment reduces heat transmitted to the wavelength converting member 400 using the heat shielding unit 900, and the heat transmitting member 700 and the heat emitting unit 800 ), The heat can be effectively released.

The optical sheets 500 are disposed on the light guide plate 200. The optical sheets 500 improve the characteristics of light passing therethrough.

The flexible printed circuit board 600 is electrically connected to the light emitting diodes 300. The light emitting diodes 300 may be mounted. The flexible printed circuit board 600 is a flexible printed circuit board 600 and is disposed inside the mold frame 10. The flexible printed circuit board 600 is disposed on the light guide plate 200.

Referring to FIG. 6, the flexible printed circuit board 600 may include the first heat emitting portion 810. The flexible printed circuit board 600 may include a support layer 610, a first wiring layer 620, a second wiring layer 630, a first protective layer 640, and a second protective layer 650.

The support layer 610 supports the first wiring layer 620, the second wiring layer 630, the first protective film 640, and the second protective film 650. The supporting layer 610 is an insulating layer. The support layer 610 may be flexible. Examples of the material used for the support layer 610 include polymers such as polyimide resins and the like.

The first wiring layer 620 is disposed on the supporting layer 610. The first wiring layer 620 may be disposed directly on the upper surface of the support layer 610. Examples of the material used for the first wiring layer 620 include copper and the like.

The second wiring layer 630 is disposed under the support layer 610. The second wiring layer 630 may be disposed directly on the lower surface of the supporting layer 610. Examples of the material used for the second wiring layer 630 include copper and the like. The first wiring layer 620 and the second wiring layer 630 may be connected to each other through vias passing through the support layer 610. [

The second wiring layer 630 is connected to the light emitting diodes 300. In more detail, the light emitting diodes 300 may be electrically connected to the second wiring layer 630 through solder or bumps.

The first protective layer 640 is disposed on the first wiring layer 620. The first protective layer 640 covers the first wiring layer 620. The first protective layer 640 protects the first wiring layer 620. The first protective layer 640 may be an insulator such as a polymer.

The second protective film 650 is disposed under the second wiring layer 630. The second protective film 650 covers the second wiring layer 630. The second protective layer 650 protects the second wiring layer 630. The second protective layer 650 may be an insulator such as a polymer.

The first heat emitting portion 810 may be included in the flexible printed circuit board 600. That is, the heat dissipation pad 813 may be formed on the same layer as the first wiring layer 620. Also, the connection via 812 may penetrate the support layer 610. Further, it may be formed in the same layer as the second wiring layer 630. The first protective layer 640 may include a first open region OR1 for exposing an upper surface of the heat radiation pad 813 to the outside. The second protective layer 650 may include a second open region OR2 for exposing the contact portion 811 to the heat transfer member 700. [

The mold frame 10 and the backlight assembly 20 constitute a backlight unit. That is, the backlight unit includes the mold frame 10 and the backlight assembly 20.

The liquid crystal panel 30 is disposed inside the mold frame 10 and disposed on the optical sheets 500.

The liquid crystal panel 30 displays an image by adjusting the intensity of light passing through the liquid crystal panel 30. That is, the liquid crystal panel 300 is a display panel for displaying an image. The liquid crystal panel 30 includes a TFT substrate, a color filter substrate, a liquid crystal layer interposed between the two substrates, and polarizing filters.

As described above, the liquid crystal display according to the embodiment can efficiently emit heat generated from the light emitting diodes 300 using the heat transfer member 700 and the heat emitting unit 800. Particularly, the heat transfer member 700 is interposed between the light emitting diodes 300 and the wavelength conversion member 400, so that heat emitted from the light emitting diodes 300 toward the wavelength conversion member 400 .

That is, the heat transfer member 700 may transmit heat, which is emitted from the light emitting diodes 300 to the wavelength conversion member 400, to the heat emitting unit 800. Further, in the liquid crystal display according to the embodiment, the heat generated in the wavelength conversion member 400 is emitted by the heat transfer member 700 and the heat emission unit 800 by the light emitted from the light source .

Accordingly, the liquid crystal display apparatus according to the embodiment can prevent the wavelength conversion member 400 from being deteriorated or denatured by heat. In particular, the liquid crystal display according to the embodiment can prevent the matrix 440 and / or the wavelength conversion particles 430 from being denatured by heat. Therefore, the liquid crystal display according to the embodiment can have improved reliability and durability.

In addition, the liquid crystal display device according to the embodiment can effectively lower the temperature of the wavelength conversion member 400. Accordingly, the liquid crystal display according to the embodiment can reduce the performance degradation of the wavelength converting particles 430 due to a rise in temperature, and can have an improved color reproduction rate.

8 is a cross-sectional view illustrating a light emitting diode, a flexible printed circuit board, a wavelength conversion member, a light guide plate, and the like according to another embodiment. In the description of the present embodiment, the description of the liquid crystal display device will be referred to, and the transparent heat transferring unit will be further described. The description of the foregoing embodiments can be essentially combined with the description of the present embodiment except for the changed portions.

Referring to FIG. 8, the liquid crystal display according to the present embodiment includes a plurality of transparent heat transfer parts 720. The transparent heat transfer parts 720 are disposed in the plurality of through holes 701, respectively. The transparent heat transferring portions 720 may be in close contact with the exit surface of the light emitting diodes 300, the heat transfer member 700, and the heat shielding portion 900. In particular, the transparent heat transfer portion 720 may be in direct contact with the emission surface of the light emitting diodes 300 and the inner surface of the transmission holes 701.

The transparent heat transfer portion 720 may have a higher thermal conductivity than the thermal cut-off portion 900. The transparent heat transfer unit 720 transfers heat generated from the light emitting diodes 300 to the heat transfer member 700.

Examples of the material used for the transparent heat transfer part 720 include inorganic materials such as silicon oxide and magnesium fluoride, and organic materials such as epoxy resin.

Accordingly, the liquid crystal display device according to the present embodiment can efficiently emit heat generated from the light emitting diodes 300 using the transparent heat transfer portion 720.

In addition, the features, structures, effects and the like described in the embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects and the like illustrated in the embodiments can be combined and modified by other persons skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Claims (12)

Light source;
A wavelength conversion member disposed adjacent to the light source; And
And a heat transfer member disposed between the light source and the wavelength conversion member,
The light source includes a plurality of light emitting diodes,
Wherein the heat transfer member includes a plurality of through holes corresponding to the light emitting diodes,
And a transparent heat transfer portion disposed in the transmission holes. The display device according to claim 1, comprising a heat releasing portion connected to the heat transmitting member. The display device according to claim 1, wherein the heat transfer member comprises a metal or a ceramic. The display device according to claim 1, wherein the heat transfer member comprises a thermoelectric material. The method according to claim 1,
Wherein the wavelength conversion member comprises a matrix and quantum dots dispersed in the matrix. The display device according to claim 1, wherein the light emitting diodes emit light to the wavelength conversion member through the transmission holes. The method according to claim 1,
Wherein the transparent heat transfer portion is in direct contact with an emitting surface of the light emitting diodes and an inner surface of the through holes. The display device according to claim 1, further comprising a heat blocking portion interposed between the heat transfer member and the wavelength conversion member and having a lower thermal conductivity than the heat transfer member. A light guide plate;
A plurality of light emitting diodes disposed on a side surface of the light guide plate;
A wavelength conversion member interposed between the light emitting diodes and the light guide plate; And
And a heat transfer member disposed adjacent to the light emitting diodes and having a plurality of through holes corresponding to the light emitting diodes,
And a transparent heat transfer portion disposed in the transmission holes. The display device according to claim 9, wherein the heat transfer member is opposed to the wavelength conversion member. The display device according to claim 9, wherein the heat transfer member extends in the same direction as the wavelength conversion member. 10. The heat exchanger according to claim 9, further comprising a heat releasing portion connected to the heat transmitting member,
Wherein the wavelength conversion member, the heat transfer member, and the heat radiation portion extend in the same direction.

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