KR101856558B1 - Method for splitting brittle substrate - Google Patents
Method for splitting brittle substrate Download PDFInfo
- Publication number
- KR101856558B1 KR101856558B1 KR1020167033459A KR20167033459A KR101856558B1 KR 101856558 B1 KR101856558 B1 KR 101856558B1 KR 1020167033459 A KR1020167033459 A KR 1020167033459A KR 20167033459 A KR20167033459 A KR 20167033459A KR 101856558 B1 KR101856558 B1 KR 101856558B1
- Authority
- KR
- South Korea
- Prior art keywords
- line
- brittle substrate
- trench line
- trench
- crack
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The edge 51 is slid on the surface SF1 of the brittle substrate 4 to generate plastic deformation to form a trench line TL having a groove shape. Immediately below the trench line TL, the brittle substrate 4 is continuously connected. Next, the member 11 is provided on the surface SF1. The member 11 has portions separated from each other through the trench line TL. Next, the crack line CL is formed by extending a crack of the brittle substrate 4 in the thickness direction DT along the trench line TL. The brittle substrate 4 is disconnected continuously in the direction crossing the trench line TL immediately below the trench line TL by the crack line CL. The brittle substrate 4 is divided along the crack line CL.
Description
The present invention relates to a method of breaking a brittle substrate.
In the production of electric devices such as a flat display panel or a solar cell panel, it is often necessary to separate a brittle substrate such as a glass substrate. First, a scribe line is formed on the substrate, and then the substrate is divided along the scribe line. For example, Japanese Laid-Open Patent Publication No. 9-188534 discloses a method of forming a scribe line by a glass cutter wheel. As the glass cutter rolls on the substrate, a trench due to plastic deformation is formed on the substrate, and a vertical crack is formed immediately below the trench. Thereafter, a stress imparting called a braking process is applied. By progressing the cracks completely in the thickness direction by the breaking process, the substrate is divided.
The step of dividing the substrate is often performed immediately after the step of forming the scribe line on the substrate. However, it has also been proposed to perform a step of forming any member on the substrate between the step of forming the scribe line and the step of breaking.
For example, according to the technique of International Publication No. 2002/104078, in the method of manufacturing an organic EL display, a scribe line is formed on a glass substrate for each region to be an organic EL display before mounting a sealing cap. Therefore, when the scribe line is formed on the glass substrate after the sealing cap is formed, contact between the sealing cap and the glass cutter can be avoided.
(Patent Document 1): JP-A-9-188534
(Patent Document 2): International Publication No. 2002/104078
According to the above conventional technique, a step of forming a sealing cap (member) on a glass substrate (brittle substrate) is performed after formation of the scribe line. Therefore, by using this technique, a brittle substrate can be divided with a narrow region between members as a boundary. On the other hand, since a vertical crack already exists in the process of forming the sealing cap on the brittle substrate, a new extension in the thickness direction of the vertical crack is likely to occur unintentionally. Therefore, the brittle substrate which should be integrated in this process may be unintentionally divided.
SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and an object of the present invention is to provide a brittle substrate, which avoids unintentional division of a brittle substrate during a step of forming a member on a brittle substrate, A method of dividing a brittle substrate by which a substrate can be divided.
A method for separating a brittle substrate according to the present invention includes the steps of preparing a brittle substrate having a surface and having a thickness direction perpendicular to the surface, a step of pushing a blade tip onto the surface of the brittle substrate, And forming a trench line having a groove shape by causing plastic deformation on the surface of the brittle substrate by sliding the edge pressed by the brittle substrate on the surface of the brittle substrate. The step of forming the trench line is performed so as to obtain a crackless state in which the brittle substrate is continuously connected in the direction crossing the trench line immediately below the trench line. The method of breaking a brittle substrate of the present invention further comprises a step of forming a member on the surface after the step of forming the trench line. The member has portions separated from each other through the trench line on the surface. The breaking method of the brittle substrate according to the present invention further includes a step of forming a crack line by extending a crack of the brittle substrate in the thickness direction along the trench line after the step of disposing the member. The brittle substrate is disconnected continuously in a direction crossing the trench line immediately below the trench line by the crack line. The breaking method of the brittle substrate of the present invention further includes a step of breaking the brittle substrate along the crack line.
The above-mentioned "pushing the edge of the blade onto the surface" means pushing the edge of the blade at an arbitrary position on the "surface", which means that the edge of the blade is pushed against the edge of the "surface".
According to the present invention, as a line defining the position where the brittle substrate is divided, a trench line having no crack is formed immediately below the line. The crack line to be used as a direct gauge of division is formed by self-aligning the crack along the trench line. Therefore, the brittle substrate after the formation of the trench line and before the formation of the crack line is in a stable state in which the division is not easily caused because the cracked line is not yet formed, while the divided position is defined by the trench line. Since the step of forming the member on the brittle substrate is performed in this stable state, it is avoided that the brittle substrate is unintentionally divided during this step. Also, since this process is performed after formation of the trench line, the movement of the edge of the trench for forming the trench line is not disturbed by the member. Accordingly, the arrangement of the trench lines and the arrangement of the members can be set freely mutually. Therefore, it is possible to obtain a structure in which the trench line passes through a narrow region between the members. Thereafter, a crack line is formed by using the trench line, and then the brittle substrate is divided, whereby the brittle substrate can be divided with a narrow region between the members as a boundary. As described above, it is possible to separate the brittle substrate with the narrow region between the members as the boundary while avoiding the unintentional division of the brittle substrate during the process of forming the member on the brittle substrate.
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a top plan view schematically showing a method for dividing a brittle substrate according to a first embodiment of the present invention ((A) to (E)).
Fig. 2 is a schematic sectional view (A) along the line IIA-IIA in Fig. 1 (A), a schematic cross-sectional view (B) along the line IIB-IIB in Fig. A schematic sectional view (D) taken along line IID-IID in FIG. 1 (D) and a schematic sectional view (E) taken along line IIE-IIE in FIG. 1 (E).
3 is a cross-sectional view (A) schematically showing the configuration of a trench line formed in the brittle substrate breaking method according to Embodiment 1 of the present invention, and a cross-sectional view (B) schematically showing the configuration of a crack line.
4 is a flow chart schematically showing a configuration of a brittle substrate cutting method according to the first embodiment of the present invention.
Fig. 5 is a side view (A) schematically showing the structure of a mechanism used in the method of dividing a brittle substrate according to Embodiment 2 of the present invention, and Fig. 5 is a side view (B) schematically shown at the time point of FIG.
6 is a top view ((A) and (B)) schematically showing a dividing method of a brittle substrate according to Embodiment 2 of the present invention.
7 is a top view ((A) and (B)) schematically showing a dividing method of a brittle substrate according to a first modification of the second embodiment of the present invention.
8 is a top view schematically showing a method of dividing a brittle substrate according to a second modification of the second embodiment of the present invention.
Fig. 9 is a top view schematically showing a breaking method of a brittle substrate according to a third modification of the second embodiment of the present invention. Fig.
10 is a top view schematically showing a first step of a brittle substrate breaking method according to Embodiment 3 of the present invention.
11 is a top view schematically showing the second step of the brittle substrate breaking method according to the third embodiment of the present invention.
12 is a top view schematically showing a third step of the brittle substrate cutting method according to the third embodiment of the present invention.
13 is a top view ((A) and (B)) schematically showing a dividing method of a brittle substrate according to a first modification of the third embodiment of the present invention.
Fig. 14 is a top view schematically showing a breaking method of a brittle substrate according to a second modification of the third embodiment of the present invention. Fig.
15 is a top view ((A) and (B)) schematically showing a dividing method of a brittle substrate according to
16 is a top view ((A) and (B)) schematically showing a breaking method of a brittle substrate according to a fifth embodiment of the present invention.
17 is a top view schematically showing a breaking method of a brittle substrate according to a modification of the fifth embodiment of the present invention.
Fig. 18 is a side view (A) schematically showing the structure of a mechanism used in the method of dividing a brittle substrate according to Embodiment 6 of the present invention, and Fig. 18 is a side view (B) schematically shown at the time point of FIG.
(Mode for carrying out the invention)
Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, the same or corresponding parts are denoted by the same reference numerals, and description thereof will not be repeated.
(Embodiment Mode 1)
A method of dividing the brittle substrate of the present embodiment will be described below.
1 (A) and Fig. 2 (A), a glass substrate 4 (brittle substrate) is first prepared (Fig. 4: step S10). The
Next, the
1 (B) and Fig. 2 (B), plastic deformation is generated on the upper surface SF1 of the
The crackle state is maintained for the required time (Fig. 4: step S40). In order to maintain the cracked state, an operation of applying an excessive stress to the
Referring to Figs. 1 (C) and 2 (C), after formation of the trench line TL, the laminated material 11 (member) is provided on the upper surface SF1 while the crackle state is maintained. The step of providing the laminate 11 can be performed, for example, by joining members prepared in advance or by depositing a raw material.
The
The laminate 11 is preferably formed such that the trench line TL protrudes from between the
The
1 (D) and 2 (D), the cracks of the
Formation of the crack line CL is started by applying stress to the
1 (E) and Fig. 2 (E), the
According to the present embodiment, the trench line TL having no crack is formed directly below the line defining the position where the
Further, since this process is performed after the formation of the trench line TL, the movement of the edge of the trench for forming the trench line TL is not disturbed by the
As described above, while the
According to the present embodiment, the width W between the
This embodiment is particularly advantageous when the laminate 11 includes a material having a low heat resistance, for example, a synthetic resin. This is because, in such a case, it is difficult to use the technique of scribing with laser light having a narrow width corresponding to a narrow gap between the lamination materials in place of the method of the present embodiment, considering thermal adverse effects on the lamination material .
The process of forming the crack line CL in this embodiment is essentially different from the so-called break process. In the breaking process, the already formed crack is further extended in the thickness direction to completely separate the substrate. On the other hand, the step of forming the crack line CL causes a change from a crackle state obtained by forming the trench line TL to a state having a crack. It is considered that this change is caused by the opening of the internal stress of the crackle state. The plastic deformation state at the time of formation of the trench line TL and the state such as the magnitude and direction of the internal stress generated by the formation of the trench line TL are the same as in the case where the rotation of the rotary blade is used, It is considered that the sliding is used in the case where the sliding of the nose end is used, and when sliding of the nose end is used, the crack is likely to occur in the wider scribe condition. Further, it is considered that what kind of instrument is required to open the internal stress, and the occurrence of cracks on the trench line TL due to application of stress from outside as described above acts as such an instrument. Details of a suitable formation method of the trench line TL and the crack line CL will be described in the following second to sixth embodiments.
(Embodiment 2)
First, the blade edge used in the breaking method of the brittle substrate in the present embodiment will be described below.
5A and 5B, a plurality of surfaces surrounding the top surface SD1 (first surface) and the top surface SD1 are formed on the
The
Further, a diamond other than a single crystal may be used. For example, a polycrystalline diamond synthesized by a CVD (Chemical Vapor Deposition) method may be used. Alternatively, a sintered diamond obtained by bonding polycrystalline diamond particles sintered from fine graphite or non-graphitized carbon, which does not contain a binding material such as an iron family element, with a binding material such as an iron family element may be used.
The
3 (A)) is formed on the upper surface SF1 of the
The trench line TL and the crack line CL (Fig. 3 (B)) are formed at the same time, and only the trench line TL is formed by sliding the
Next, the method of dividing the
Referring to Fig. 6 (A), in step S10 (Fig. 4), the
Next, in step S20 (Fig. 4), the
Next, in step S30 (Fig. 4), a plurality of trench lines TL (five lines in the figure) are formed on the upper surface SF1. The formation of the trench line TL is performed between the position N1 (first position) and the position N3. A position N2 (second position) is located between the positions N1 and N3. Therefore, the trench line TL is formed between the positions N1 and N2 and between the positions N2 and N3.
The positions N1 and N3 may be located apart from the edge of the upper surface SF1 of the
The position N1 of the positions N1 and N2 is closer to the side ED1 and the position N2 of the positions N1 and N2 is closer to the side ED2. 6A, the position N1 is close to the side ED1 of the sides ED1 and ED2 and the position N2 is close to the side ED2 of the sides ED1 and ED2, Both of the nodes N1 and N2 may be located near either of the sides ED1 or ED2.
When the trench line TL is formed, in this embodiment, the
Referring to Fig. 6 (B), next, the crackle state (Fig. 3 (a)) described in the first embodiment is maintained for a desired time. In the meantime, as step S40 (Fig. 4), the
Next, in the step S50 (Fig. 4), the thickness direction DT (see Fig. 3B) from the position N2 to the position N1 (see the broken line arrow in the figure) along the trench line TL The crack line CL is formed by expanding the cracks of the
The crack line CL is hardly formed in the direction from the position N2 to the position N3 in comparison with the direction from the position N2 to the position N1. In other words, there is a direction dependency in easiness of extension of the crack line CL. Therefore, a phenomenon may occur that the crack line CL is formed between the positions N1 and N2 and not between the positions N2 and N3. This embodiment aims at the division of the
Next, in step S60 (Fig. 4), the
As a result, the
Next, the first to third modified examples of the dividing method will be described below.
7A, the first modification is such that the intersection of the assist line AL and the trench line TL is insufficient as an opportunity to start the formation of the crack line CL (Fig. 6B) Quot; 7B, the
7 (A), the assist line AL is formed on the upper surface SF1 of the
In the first modified example, the distortion of the internal stress in the vicinity of the trench line TL is released by the separation of the
8, in the second modified example, the
9, in the third modified example, when the trench line TL is formed in step S30 (FIG. 4), the
According to the present embodiment, the crack line CL can be more reliably formed from the trench line TL.
Unlike the third embodiment described later, in this embodiment, the assist line AL is not yet formed at the point of time when the trench line TL is formed (Fig. 6 (A)). Therefore, the crackle state can be more stably maintained without the influence from the assist line (AL). 7A in which the assist line AL is formed instead of the state shown in Fig. 6A in which the assist line AL is not formed, when the stability in the cracked state does not matter, The
(Fourth Embodiment)
The method of dividing the brittle substrate in the present embodiment will be described below with reference to Figs. 10 to 12. Fig.
Referring to Fig. 10, in this embodiment, the assist line AL is formed before the formation of the trench line TL. The method of forming the assist line AL itself is the same as that of Fig. 6B (Embodiment 2).
11, next, the
Next, referring to Fig. 12, a
The configuration other than the above is almost the same as the configuration of the second embodiment described above.
Referring to Fig. 13 (A), in the first modification, the assist line AL is formed on the lower surface SF2 of the
14, in the second modified example, when the trench line TL is formed in step S30 (FIG. 4), the
(Fourth Embodiment)
15 (A), in the method of dividing the brittle substrate according to the present embodiment, in the step S30 (FIG. 4), the position ED2 is reached from the position N1 via the position N2 A trench line TL is formed.
Referring to Fig. 15 (B), a
Concretely as the application of the stress, in the area between the position N2 and the edge ED2 (the area between the broken line and the edge ED2 in the figure) on the upper face SF1, Lt; / RTI > This sliding is performed until the side ED2 is reached. The
As a modified example, in order to add stress between the position N2 and the side ED2, in place of the above-described sliding of the
The configuration other than the above is almost the same as the configuration of the second embodiment described above.
(Embodiment 5)
16A, in the method of dividing a brittle substrate according to the present embodiment, the position N2 is moved from the position N1 to the position N2 in the step S30 (Fig. 4) , The trench line TL is formed away from the edge of the upper surface SF1. The formation method of the trench line TL itself is almost the same as that of Fig. 6A (Embodiment 2).
Referring to Fig. 16 (B), the
17, as a modification of the process of Fig. 16A, in the formation of the trench line TL, the
The configuration other than the above is almost the same as the configuration of the second embodiment described above.
(Embodiment 6)
18 (A) and 18 (B), in each of the above-described embodiments, a
In each of the above embodiments, the first and second sides of the edge of the glass substrate are rectangular short sides, but the first and second sides may be rectangular long sides. Further, the shape of the edge is not limited to the rectangular shape, and may be square, for example. In addition, the first and second sides are not limited to straight lines but may be curved lines. In each of the above embodiments, the surface of the glass substrate is flat, but the surface of the glass substrate may be curved.
A glass substrate is used as the brittle substrate particularly suitable for the above-described separation method, but the brittle substrate is not limited to the glass substrate. The brittle substrate may be made of, for example, ceramics, silicon, compound semiconductor, sapphire, or quartz in addition to glass.
The present invention can freely combine the embodiments of the present invention within the scope of the invention, or appropriately modify or omit the embodiments.
4: Glass substrate (brittle substrate)
11: laminated material (member)
50:
51, 51v: end point
52: Shank
AL: assist line
CL: crack line
ED1: side (first side)
ED2: side (second side)
N1: Position (first position)
N2: position (second position)
SF1: upper surface (surface)
SF2: when
TL: Trench line
PP, PPv:
PS, PSv: Side
Claims (5)
A step of pushing a blade tip onto the surface of the brittle substrate,
Forming a trench line having a groove shape by causing plastic deformation on the surface of the brittle substrate by sliding the edge pressed by the pressing step on the surface of the brittle substrate, The step of forming the line is carried out so as to obtain a crackle state in a state in which the brittle substrate is continuously connected in the direction crossing the trench line immediately below the trench line,
And forming a member on the surface after the step of forming the trench line, the member having a portion separated from each other through the trench line on the surface,
And a step of forming a crack line by extending a crack of the brittle substrate in the thickness direction along the trench line after the step of disposing the member so as to form a crack line, Wherein the brittle substrate is continuously disconnected in a direction crossing the trench line,
And dividing the brittle substrate along the crack line.
Wherein the step of forming the member is performed so that the trench line protrudes from between the portions separated from each other on the surface.
Wherein in the step of forming the member, the portion is disposed on the surface of the brittle substrate through the trench line at an interval of 100 mu m or less.
Wherein in the step of preparing the brittle substrate, the brittle substrate is made of glass.
Wherein in the step of preparing the brittle substrate, the surface is surrounded by the edges including the first and second sides facing each other,
Wherein the blade edge has a protruding portion and a side portion extending from the protruding portion and having a convex shape, and the step of pressing the blade edge is characterized in that the side edge of the blade edge on the surface of the brittle substrate The second side being disposed so as to be disposed between the protrusion and the second side,
In the step of forming the trench line, the trench line is formed between a first position and a second position closer to the second side than the first position,
Wherein the step of forming the crack line is carried out by extending a crack of the brittle substrate in the thickness direction from the second position to the first position along the trench line.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014112648 | 2014-05-30 | ||
JPJP-P-2014-112648 | 2014-05-30 | ||
PCT/JP2015/062223 WO2015182298A1 (en) | 2014-05-30 | 2015-04-22 | Method for splitting brittle substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20160147982A KR20160147982A (en) | 2016-12-23 |
KR101856558B1 true KR101856558B1 (en) | 2018-05-10 |
Family
ID=54698639
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020167033459A KR101856558B1 (en) | 2014-05-30 | 2015-04-22 | Method for splitting brittle substrate |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6288260B2 (en) |
KR (1) | KR101856558B1 (en) |
CN (1) | CN106715347B (en) |
TW (1) | TWI647080B (en) |
WO (1) | WO2015182298A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6760641B2 (en) * | 2016-06-29 | 2020-09-23 | 三星ダイヤモンド工業株式会社 | Method of dividing a brittle substrate |
JP7095471B2 (en) * | 2018-08-03 | 2022-07-05 | 日本電気硝子株式会社 | Tubular glass cutting method |
JP7425966B2 (en) * | 2020-03-12 | 2024-02-01 | 日本電気硝子株式会社 | Glass plate manufacturing method and its manufacturing device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100549099B1 (en) * | 2001-06-14 | 2006-02-02 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | Production device for organic el display and production method for organic el display |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3074143B2 (en) | 1995-11-06 | 2000-08-07 | 三星ダイヤモンド工業株式会社 | Glass cutter wheel |
JP2007331983A (en) * | 2006-06-15 | 2007-12-27 | Sony Corp | Scribing method for glass |
JP2008201629A (en) * | 2007-02-21 | 2008-09-04 | Epson Imaging Devices Corp | Manufacturing method of electrooptical device, separating method of substrate, and substrate separating device |
JP5210356B2 (en) * | 2010-06-14 | 2013-06-12 | 三星ダイヤモンド工業株式会社 | Method for scribing a brittle material substrate |
KR101247571B1 (en) * | 2010-06-14 | 2013-03-26 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | Method for scribing brittle material substrate |
TWI498293B (en) * | 2011-05-31 | 2015-09-01 | Mitsuboshi Diamond Ind Co Ltd | Scribe method, diamond point and scribe apparatus |
-
2015
- 2015-04-22 WO PCT/JP2015/062223 patent/WO2015182298A1/en active Application Filing
- 2015-04-22 JP JP2016523384A patent/JP6288260B2/en not_active Expired - Fee Related
- 2015-04-22 CN CN201580028975.8A patent/CN106715347B/en not_active Expired - Fee Related
- 2015-04-22 KR KR1020167033459A patent/KR101856558B1/en active IP Right Grant
- 2015-04-28 TW TW104113587A patent/TWI647080B/en not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100549099B1 (en) * | 2001-06-14 | 2006-02-02 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | Production device for organic el display and production method for organic el display |
Also Published As
Publication number | Publication date |
---|---|
JP6288260B2 (en) | 2018-03-07 |
TWI647080B (en) | 2019-01-11 |
JPWO2015182298A1 (en) | 2017-04-20 |
KR20160147982A (en) | 2016-12-23 |
CN106715347A (en) | 2017-05-24 |
TW201601889A (en) | 2016-01-16 |
WO2015182298A1 (en) | 2015-12-03 |
CN106715347B (en) | 2019-08-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101844312B1 (en) | Method for splitting brittle substrate | |
KR101847921B1 (en) | Method for cutting brittle-material substrate | |
KR20160037076A (en) | Method of fabricating liquid crystal display panel | |
KR101856558B1 (en) | Method for splitting brittle substrate | |
KR20160000412A (en) | dividing method of brittle substrate and manufacturing method of display panel | |
JP6555354B2 (en) | Method for dividing brittle substrate | |
KR101901631B1 (en) | Method for cutting brittle substrate | |
KR101856556B1 (en) | Method for splitting brittle substrate | |
KR20160026706A (en) | Method of manufacturing liquid crystal display panel | |
JP2017065007A (en) | Method of segmenting brittle substrate | |
KR20170038149A (en) | Method for dividing brittle substrate |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant |