KR101856110B1 - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus and a substrate processing method that perform substrate processing.
The present invention relates to a vacuum processing apparatus comprising a vacuum chamber for forming a closed processing space; A substrate handling part for supporting the substrate such that the substrate processing is performed while the substrate processing surface of the substrate is inclined toward the ground; And a substrate processing module installed in the vacuum chamber for performing substrate processing on the substrate.

Description

[0001] DESCRIPTION [0002] Substrate processing apparatus and substrate processing method [

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus and a substrate processing method that perform substrate processing.

A flat panel display is typically a liquid crystal display, a plasma display panel, or an organic light emitting diode.

Of these, organic light emitting devices have advantages such as fast response speed, lower power consumption than conventional liquid crystal display devices, high brightness and light weight, and the advantage of being able to be made ultra thin by not requiring a separate back light device And has been attracting attention as a next-generation display device.

On the other hand, as a general method for forming a thin film on a substrate of a flat panel display device, evaporation, physical vapor deposition (PVD) such as ion plating and sputtering, And chemical vapor deposition (CVD). Among them, a vapor deposition method can be used for forming a thin film such as an organic material layer, an inorganic material layer, etc. of an organic light emitting device.

The substrate processing apparatus for performing the substrate processing for forming a thin film on the substrate as described above can be variously configured according to the process, and includes a vacuum chamber for forming a closed processing space, a vacuum chamber provided in the vacuum chamber, And an evaporation source that forms an evaporation source.

In the conventional substrate processing apparatus, when the substrate processing is performed by evaporation of the deposition material, the substrate processing is performed while transferring the substrate with the substrate processing surface oriented toward the ground, that is, toward the lower side.

However, when the substrate processing is performed in a state that the substrate processing surface faces downward, deflection occurs due to the weight of the substrate, and the distance from the evaporation source is not constant, so that uniform substrate processing can not be performed.

In particular, when a mask is installed for patterned deposition, deflection of the mask occurs together, resulting in a problem that a uniform substrate processing can not be performed. Such a problem is maximized at the time of substrate processing for a large substrate.

In order to solve the above problems, a substrate processing apparatus has been proposed in which a substrate processing process is performed while a substrate process surface is perpendicular to the paper surface.

However, in the conventional substrate processing apparatus for performing the substrate processing in a state where the substrate processing surface is perpendicular to the paper surface, the particles in the upper portion of the substrate processing surface or the upper portion of the substrate processing surface flow downward due to their own weight, There is a problem that the substrate is damaged, such as formation of stains in the lower part of the substrate.

It is an object of the present invention to provide a substrate processing apparatus and a substrate processing method which can prevent a particle from being adhered to a substrate processing surface in order to solve the problems as described above.

The present invention has been made in order to achieve the above-mentioned object of the present invention, and it is an object of the present invention to provide a vacuum processing apparatus, A substrate handling part for supporting the substrate such that the substrate processing is performed while the substrate processing surface of the substrate is inclined toward the ground; And a substrate processing module installed in the vacuum chamber for performing substrate processing on the substrate.

The substrate processing module may include one or more evaporation sources through which the evaporation material to be evaporated onto the substrate processing surface is evaporated into the processing space.

The evaporation source may be installed so as to be movable in parallel with the substrate processing surface.

The plurality of evaporation sources may have a constant length with respect to the substrate processing surface in a state where the substrate processing surface of the substrate is inclined toward the ground.

The substrate handling unit may directly or indirectly tilt the substrate such that the substrate processing surface of the substrate introduced into the vacuum chamber is tilted toward the ground.

The substrate handling unit may include a support installed in the vacuum chamber and directly or indirectly supporting at least one of an upper portion and a lower portion of the substrate introduced in an upright state, Or a tilting portion for indirectly tilting.

The supporting portion may include a plurality of lower rollers for directly or indirectly supporting a lower portion of the substrate, and the tilting portion may include a linear driving portion for horizontally moving the lower rollers perpendicularly to the introduction direction in which the substrate is introduced.

Wherein the supporting portion includes an upper supporting portion for supporting an upper portion of the substrate and a lower supporting portion for supporting a lower portion of the substrate, wherein the tilting portion moves at least one of the upper supporting portion and the lower supporting portion to face the substrate- The substrate can be tilted directly or indirectly to form an inclination.

The upper support portion and the lower support portion may guide the transfer of the substrate in the vacuum chamber.

It is preferable that the inclination angle between the reference line perpendicular to the ground and the substrate processing surface is 1 deg. To 10 deg..

The vacuum chamber is provided with a mask, and the mask may be installed parallel to the substrate processing surface in a state where the substrate processing surface of the substrate is inclined toward the ground.

The substrate may be directly supported in the vacuum chamber to be subjected to a substrate treatment or indirectly supported by a substrate tray to be subjected to a substrate treatment.

The present invention also discloses a substrate processing method characterized in that substrate processing is performed in a state in which the substrate processing side of the substrate is inclined toward the ground in a vacuum chamber forming an enclosed processing space.

The substrate processing method comprising: a substrate introducing step of introducing a substrate in a standing state into the vacuum chamber; A method for processing a substrate, comprising the steps of: evaporating a deposition material to form a thin film on a substrate processing surface, wherein the substrate processing surface has a surface before the substrate introduction step, or before the substrate introduction step and before the deposition step And a substrate tilting step of tilting the substrate so as to be inclined toward the substrate.

The substrate can be transported with the substrate-treated surface of the substrate inclined toward the ground.

Wherein the step of introducing a substrate directly or indirectly supports at least one of an upper end and a lower end of the substrate by a supporting part to introduce the substrate into the vacuum chamber and the substrate tilting step moves the supporting part supporting the substrate, The substrate can be directly or indirectly tilted so as to be inclined toward the ground.

The substrate processing method may further include a mask adhesion step of bringing the mask into close contact with the substrate processing surface of the substrate before or after the substrate tilting step.

The mask adhering step may include an aligning step of aligning the substrate and the mask, and an adhesion step of adhering the mask to the substrate processing surface.

The substrate tilting step may be performed before the substrate introduction step, and a mask adhesion step may be performed after the substrate introduction step, wherein the mask is brought into close contact with the substrate processing surface of the substrate.

In the substrate processing method, it is preferable that an inclination angle formed by the substrate processing surface and a reference line perpendicular to the sheet surface during the substrate processing is 1 to 10 degrees.

The substrate may be directly supported to perform the substrate processing, or may be indirectly supported by the substrate tray to perform the substrate processing.

The substrate processing apparatus and the substrate processing method according to the present invention can advantageously prevent the substrate from being damaged due to the falling of the particles by performing the substrate processing in the vacuum chamber by inclining the substrate processing surface toward the ground, have.

Further, the substrate processing apparatus and the substrate processing method according to the present invention minimize substrate deflection due to its own weight by performing the substrate processing by inclining the substrate processing surface in the vacuum chamber toward the ground, that is, downwardly inclining, There is an advantage that the substrate damage due to the flow of the particles or the evaporation material can be prevented.

1 is a vertical sectional view of a substrate processing apparatus showing a substrate processing apparatus according to the present invention, and is a sectional view showing a state in which a substrate processing surface is perpendicular to a paper surface.
FIG. 2 is a vertical sectional view of the substrate processing apparatus of FIG. 1, and is a sectional view showing a state in which the substrate processing surface is tilted so as to be inclined toward the ground;
FIG. 3 is a vertical cross-sectional view of the substrate processing apparatus of FIG. 1, showing a state in which the substrate processing surface is tilted by another method so as to be inclined toward the ground.
4 is a flowchart showing an example of a substrate processing method according to the present invention.

Hereinafter, a substrate processing apparatus and a substrate processing method according to the present invention will be described in detail with reference to the accompanying drawings.

As shown in FIGS. 1 and 2, the substrate processing apparatus according to the present invention includes a vacuum chamber 100 forming a closed processing space S; A substrate handling unit for directly or indirectly supporting the substrate so that the substrate processing is performed in a state where the substrate processing surface of the substrate 10 is inclined toward the ground; And a substrate processing module 390 installed in the vacuum chamber 100 for performing substrate processing on the substrate 10.

Here, the substrate 10, which is an object of the substrate processing, forms a thin film by evaporation of a deposition material on a substrate-processed surface such as a liquid crystal display, a plasma display panel, and an organic light emitting diode Any object can be made as long as it can be done.

The substrate 10 may be transported directly into the vacuum chamber 100 or may be transported in the substrate tray 20, as shown in FIGS. 2 and 3.

The substrate tray 20 may have various configurations as a structure for receiving the substrate 10 and transporting the substrate 10.

The vacuum chamber 100 may have any structure as long as it can form a processing space S for performing substrate processing. Here, the vacuum chamber 100 may be formed with an exhaust port (not shown) connected to an exhaust pipe (not shown) connected to a vacuum pump (not shown) for forming a vacuum pressure for performing substrate processing and exhausting the vacuum chamber.

1 and 2, the first chamber member 110 and the second chamber member 120 are detachably coupled to each other to form a process space S, And may have various shapes and structures according to the division method of the vacuum chamber 100. [

The first chamber member 110 and the second chamber member 120 are substantially perpendicular to the paper surface so that the substrate 10 is conveyed in a vertical or inclined (upright) And may be formed by dividing the chamber 100. At least one of the first chamber member 110 and the second chamber member 120 is provided with a sealing member (not shown) such as an O-ring for sealing the processing space S on the coupled surface.

The first chamber member 110 is fixedly installed on the support frame 210, and a space formed in the second chamber member 120, which will be described later, is formed.

When the first chamber member 110 is fixed and installed in the vacuum chamber 100, one or more gates 121 through which the substrate 10 is input and output for smooth introduction and discharge of the substrate 10 .

The reason why the gate 121 is formed in the first chamber member 110 is that a gate valve (not shown) for opening and closing the gate 121 and a guide rail (not shown) coupled to the vacuum chamber 100 It is preferable that the gate 121 connected thereto is also formed in the first chamber member 110 fixed in position.

In addition, a guide rail (not shown) for transferring the substrate 10 may be installed in the first chamber member 110.

The second chamber member 120 is detachably coupled to the first chamber member 110 fixed on the support frame 210 by horizontal movement to form the processing space S. The first chamber member 110, Is formed.

The second chamber member 120 may include a substrate processing module 390, which will be described later, and may be configured in various ways according to substrate processing such as a sputtering target source, an evaporation source, and the like.

As an example, the substrate processing module 390 may be a module for performing the substrate processing, and may include one or more evaporation sources (not shown) in which the evaporation material to be deposited on the substrate processing surface is evaporated.

The evaporation source may include various types of evaporation materials depending on the kind of the evaporation material and the substrate processing, and may include a container (not shown) and a heater (not shown) for heating the evaporation material contained in the container.

In addition, the evaporation source may include one or more nozzles (not shown), etc., through which the vapor evaporated in the vessel is ejected into the processing space S, and the like.

Since the evaporation source needs to be relatively moved relative to the substrate 10 in order to uniformly deposit the evaporation source and the substrate 10 on the substrate processing surface, One can be configured to be fixed and the other to be moved.

At this time, when the substrate processing surface of the substrate 10 is tilted toward the ground, the surface parallel to the substrate processing surface is assumed to be a virtual moving surface, and the evaporation source is preferably moved in the virtual moving surface. In other words, the evaporation source is preferably provided so as to be movable in parallel with the substrate processing surface.

When a plurality of evaporation sources are provided, the plurality of evaporation sources are preferably arranged such that a normal distance from the substrate processing surface in a state in which the substrate processing surface of the substrate 10 is inclined toward the ground is constant. Here, when a line is perpendicular to a plane and a point for distance measurement passes, the line is referred to as a normal line, and a distance from a plane to a point is defined as a normal line distance.

That is, as shown in FIG. 2 and FIG. 3, the evaporation source maintains a constant distance from the substrate processing surface, thereby enabling uniform substrate processing.

Meanwhile, the substrate processing module 390 may be installed in at least one of evaporative sources, point sources, surface sources, and line type sources.

In particular, when the substrate processing module 390 is constituted by a line-type evaporation source, the evaporation source may be arranged in a vertical direction. In this case, the evaporation source may be tilted or tilted when the substrate 10 is tilted, It is possible to maintain the distance and to perform uniform substrate processing.

The substrate handling part supports the substrate directly or indirectly so that the substrate processing surface of the substrate 10 is inclined toward the ground, and can be variously configured according to the transporting method of the substrate 10 .

The substrate handling part directly clamps and supports a part of the edge of the substrate 10 in supporting the substrate 10 or indirectly clamps the substrate 10 by clamping a substrate tray (not shown) on which the substrate 10 is mounted Can support.

The substrate tray 10 is introduced into the vacuum chamber 100 and the substrate 10 is clamped by the substrate handling unit and then discharged to the outside of the vacuum chamber 100 and then introduced again after the process, So that the substrate 10 can be discharged to the outside.

The transfer of the substrate 10, such as the introduction and discharge of the substrate 10 into and out of the vacuum chamber 100, is performed by the substrate processing surface of the substrate 10 tilting toward the ground It can be transported in an established state.

In this case, the substrate handling part may include at least one supporting part for supporting the substrate 10 and for guiding the movement of the substrate 10.

The supporting portion may have various configurations such as one or more rollers, a magnet for utilizing magnetic force, or the like depending on the conveying method of the substrate 10.

When the substrate 10 is introduced into or out of the vacuum chamber 100 from the outside of the vacuum chamber 100, the substrate 10 is transported in an upright or horizontal state relative to the surface of the substrate. When the substrate 10 is introduced into the vacuum chamber 100, 10 may be tilted so as to be inclined toward the ground.

In this case, as shown in FIG. 2, the substrate handling part may be configured such that the substrate 20 is introduced into the vacuum chamber 100 in a state in which the substrate 10 stands upright or horizontally with respect to the paper surface, 2 and 3, the substrate 10 may be tilted to tilt the substrate-processed surface of the substrate 10 toward the ground.

The substrate handling unit may be any structure as long as it can tilt the substrate 10. For example, the substrate handling unit may be disposed in the vacuum chamber 100, One or more supports 310 and 320 for supporting the substrate 10 indirectly through the substrate tray 20 when the substrate 10 is placed and transported, and the substrate 10 directly or indirectly supported so as to be inclined toward the surface of the substrate 10 And a tilting unit 330 for tilting the tilting unit 330.

The support portions 310 and 320 are configured to support the substrate 10 and may have various structures according to the transporting method of the substrate 10. The support portions 310 and 320 may be formed by directly or indirectly supporting at least one of the upper portion and the lower portion of the substrate 10. [ As shown in FIG. Here, the support portions 310 and 320 may be formed separately from the guide portion for conveying the substrate 10 in the vacuum chamber 100, or may be configured as at least a part of the configuration of the guide portion.

The support portions 310 and 320 may include an upper support portion 320 for supporting the upper portion of the substrate 10 and a lower support portion 310 for supporting the lower portion of the substrate 10. [

As shown in FIGS. 2 and 3, the lower support part 320 may support the lower part of the substrate 10 directly or indirectly, and may be moved And a plurality of lower rollers 311 for guiding the lower rollers 311.

The lower roller 311 may have a curved surface for supporting the substrate 10 for smooth tilting of the substrate 10 by a tilting part 330 described later.

2 and 3, when the substrate processing surface is tilted toward the ground, the lower roller 311 is moved in the direction of the substrate 10 (or substrate Tray 20) is concave, the tilting of the substrate 10 is smooth.

Here, the lower end of the substrate 10 (or the substrate tray 20) supported by the lower roller 311 is also convexly formed corresponding to the concave support surface of the lower roller 311.

Meanwhile, the lower support portion 310 supporting the lower portion of the substrate 10 among the support portions 310 and 320 may have any structure as long as it can support the substrate 10 in addition to the rollers.

The upper support part 320 is not always required to be supported according to the supporting and transporting type of the substrate 10 and is not in contact with the substrate 10 (or the substrate tray 20) It can be installed in a state where it is not installed.

More specifically, the upper support part 320 may include at least one member (not shown) provided so that the opposite pole faces the magnetic pole of the first magnet (not shown) installed on the substrate tray 20 or the substrate 10 on which the substrate 10 is mounted. 2 magnets.

The second magnet can support the first magnet mounted on the upper side of the substrate 10 by magnetic force, and can guide the transfer of the substrate 10 in a non-contact state.

The tilting unit 330 may be configured to tilt the substrate directly or indirectly so that the substrate processing surface of the substrate 10 tilts toward the ground.

1 to 3, the tilting unit 330 moves the supporting units 310 and 320 supporting the substrate 10 to move the substrate-processed surface of the substrate 10 toward the ground, The substrate may be tilted directly or indirectly.

More specifically, the tilting unit 330 may include any one of the upper support unit 320 and the lower support unit 310 when the upper support unit 320 and the lower support unit 310 include the support units 310 and 320, And the substrate 10 is tilted so that the substrate-processed surface of the substrate 10 is tilted toward the ground.

1 and 2, the tilting unit 330 includes a lower holding unit 310 for holding a lower portion of the substrate 10, that is, lower rollers 311, And may be configured to move in a direction perpendicular to the transport direction.

The lower portion of the substrate 10 supported by the lower roller 311 is moved by the lower roller 311 in a direction perpendicular to the direction in which the lower roller 311 is conveyed by the tilting portion 330, So that the substrate 10 is tilted so that the substrate 10 is tilted toward the ground. Of course, when the lower roller 311 is moved to the opposite side of the tilting part 330, the substrate 10 returns to the state for introduction / discharge.

The tilting unit 330 may include a linear driving unit for horizontally moving the lower rollers 311 perpendicularly to the direction in which the substrate 10 is introduced.

That is, when the substrate 10 supported by the linear driving unit is moved in a direction perpendicular to the conveying direction of the substrate 10, the substrate 10 is inclined toward the substrate surface Tilting.

3, which is different from the embodiment shown in FIG. 2, in which the tilting part 330 moves the lower holding part 310, the tilting part 330 has a second tilting part 330 for supporting the upper part of the substrate 10, And may be configured to move the support portion 320 in a direction perpendicular to the conveying direction of the substrate 10. Of course, if the tilting part 330 moves the upper support part 320 in a direction perpendicular to the conveying direction of the substrate 10, the substrate 10 is returned to the state for introduction / ejection.

When the upper support part 320 includes a second magnet for supporting the substrate 10 by a magnetic force, the tilting part 330 may be a linear type of moving the second magnet in a direction perpendicular to the direction of transfer of the substrate 10 And may include a driving unit.

In order to prevent the substrate 10 from being excessively moved forward and backward of the substrate processing surface in consideration of supporting the substrate 10 by the noncontact, the tilting portion 330 may be formed on either one of the substrate- One or more stoppers (not shown) may be installed to limit the excessive movement of the motor.

The stopper is installed at a predetermined distance from the substrate processing surface so that the tilting of the substrate 10 by the tilting part 330 can be performed.

It is preferable that the tilting portion 330 tilts the substrate 10 and the inclination angle? Formed by the substrate processing surface and the reference line perpendicular to the ground surface is 1 to 10 degrees.

When the inclination angle? Is excessively small, there is almost no tilting effect, and the problem that the particles flow down to the lower side of the substrate processing surface to cause damage can not be solved.

If the inclination angle? Is excessively large, the substrate 10 may be deflected due to its own weight. In order to enable the tilting of the substrate 10, the internal volume of the processing space of the vacuum chamber 10 is increased There is a problem that the manufacturing cost of the apparatus is increased.

On the other hand, the substrate 10 is transported vertically or horizontally with respect to the ground from the outside of the vacuum chamber 100, and is tilted outside the vacuum chamber 100 such that the substrate-treated surface of the substrate 10 is tilted toward the ground The substrate 10 which has been introduced into the vacuum chamber 100 and has undergone the substrate processing in the vacuum chamber 100 can be tilted so as to be perpendicular or horizontal to the ground after being discharged out of the vacuum chamber 100.

The substrate handling part is coupled to the outside of the vacuum chamber 100 and is tilted so that the substrate processing surface of the substrate 10 tilts toward the ground surface before being introduced into the vacuum chamber 100, When the substrate 10 having undergone the substrate processing in the vacuum chamber 100 is discharged to the outside of the vacuum chamber 100, the substrate 10 may be tilted so as to be vertical or horizontal to the ground.

Here, the substrate handling portion can be tilted before introduction into the vacuum chamber 100 and after ejection from the vacuum chamber 100 can have any configuration such as the configuration shown in Figs. 2 and 3.

The introduction and discharge of the substrate 10 are performed through the gate 121 formed in the vacuum chamber 100 and are performed through one gate 121 or the substrate 10 is transferred in one direction, Thus, the substrate 10 can be introduced and discharged through a pair of gates formed in the vacuum chamber 100, respectively.

Meanwhile, the vacuum chamber 100 may be provided with a mask 340 for patterned deposition on the substrate-processed surface.

The mask 340 may be installed in the vacuum chamber 100 together with the substrate 10 or may be installed in the vacuum chamber 100 in various ways.

The mask 340 may have a variety of configurations in which at least one patterned opening is formed on the substrate-processed surface of the substrate 10 so as to form a patterned deposition, and is closely attached to the substrate-processed surface.

At this time, as described above, the substrate 340 is processed in a state in which the substrate-processed surface of the substrate 10 is inclined toward the ground, and the mask 340 adhered to the substrate-processed surface is also required to be inclined toward the ground .

2 and 3, the mask 340 may be tilted together with the rotation of the substrate 10, or may be tilted with the rotation of the substrate 10, or the substrate processing surface of the substrate 10 may be inclined toward the ground, As shown in FIG.

The vacuum chamber 100 includes an aligner device 350 for aligning the mask 340 and the substrate 10 so that the opening pattern of the mask 340 is positioned in a pattern to be formed on the substrate- Respectively.

The aligner device 350 may be configured so as to be capable of aligning the mask 340 and the substrate 10 such that the opening pattern of the mask 340 is positioned in the pattern to be formed on the substrate- It is also possible.

For example, the aligner device 350 includes a plurality of position adjusting pins, one end of which is connected to the mask 340, and the other end of the position adjusting pins are connected to move the position adjusting pins to move the substrate 10 and the mask 340 And a driving device for aligning the image.

Hereinafter, one embodiment of the substrate processing method by the substrate processing apparatus according to the present invention will be described in detail.

The substrate processing method according to the present invention performs substrate processing in a state in which the substrate processing surface of the substrate 10 is tilted toward the ground in the vacuum chamber 100 forming the closed processing space S, .

Here, the substrate processing surface of the substrate 10 in the vacuum chamber 100 can be defined as a tilted state, that is, a state in which the substrate processing surface is tilted toward the ground, that is, a downward tilted state.

The substrate 10 is transported in a tilted state as well as transported between the chambers including the vacuum chamber 100 as well as the substrate processing. Alternatively, the substrate 10 is transported before the substrate processing, that is, in the vacuum chamber 100, or after introduction into the vacuum chamber 100, the substrate may be tilted through a tilting step.

As shown in FIG. 4, the substrate processing method of the present invention for performing the above-described substrate processing includes a substrate introducing step of introducing the substrate 10 into the vacuum chamber 100, S10); (S30) of evaporating the deposition material after the substrate rotation step (S20) to form a thin film on the substrate processing surface, and also includes a step of " before the substrate introduction step (S10) The substrate processing apparatus may further include a substrate tilting step (S20) of tilting the substrate so that the substrate processing surface is inclined toward the ground before the step " S30 ".

The substrate introducing step S10 is a step of introducing the substrate 10 into the vacuum chamber 100 and may be carried out in various manners depending on the transferring method of the substrate 10 and at least one of the upper and lower ends of the substrate 10 May be directly or indirectly supported by the supports 310 and 320 to introduce the substrate into the vacuum chamber 100.

The substrate tilting step S20 may be performed in various manners in accordance with the tilting of the substrate 10 and may be performed by moving the supporting portions 310 and 320 supporting the substrate 10 and moving the substrate processing surface of the substrate 10 toward the ground The substrate 10 can be tilted directly or indirectly so as to form an inclination.

Specifically, the substrate tilting step S20 linearly moves the upper or lower end of the substrate 10 toward the substrate processing module 390 so that the substrate processing surface of the substrate 10 as a whole is tilted toward the ground, Can be directly or indirectly tilted.

Meanwhile, the substrate tilting step (S20) may be performed at various positions such as being performed outside the vacuum chamber 100 or in the vacuum chamber 100.

In particular, the substrate tilting step S20 may be performed at various positions such as a buffer chamber (not shown) or the like when a buffer chamber (not shown) is installed in the vacuum chamber 100.

When the substrate tilting step S20 is performed outside the vacuum chamber 100, the substrate 10 may be retracted again after being discharged from the vacuum chamber 100 so as to be vertical or horizontal to the ground.

Meanwhile, when the substrate processing is performed with the mask 340 installed, the mask 340 is closely contacted with the substrate-processed surface of the substrate 10 so that patterned deposition may be performed before or after the substrate tilting step S20 And may further include step S21.

The mask adhering step S21 may include an aligning step for aligning the substrate 10 and the mask 310, and an adhesion step for adhering the mask 310 to the substrate processing surface. At this time, the substrate tilting step S20 may be performed after the adhesion step.

The mask adhering step S21 may include an aligning step of aligning the substrate 10 and the mask 310 and an adhesion step of bringing the mask 310 into close contact with the substrate processing surface, May be performed after the substrate tilting step S20.

The mask adhering step S21 may be performed at various positions such as outside the vacuum chamber 100, a separate buffer chamber, and the inside of the vacuum chamber 100, similar to the substrate tilting step S20.

For example, the substrate tilting step S20 is performed before the substrate introduction step S20. After the substrate introduction step S20, the mask 310 is brought into close contact with the substrate processing surface of the substrate 10 ) Can be performed.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. It is to be understood that both the technical idea and the technical spirit of the invention are included in the scope of the present invention.

10: substrate 20; Substrate tray
100: vacuum chamber 310, 320: support

Claims (21)

A vacuum chamber for forming a closed processing space;
A substrate handling unit for supporting the substrate such that substrate processing is performed while the substrate processing surface of the substrate standing with respect to the ground is inclined downward toward the ground with respect to a reference line perpendicular to the ground;
And a substrate processing module installed in the vacuum chamber for performing substrate processing on the substrate,
Wherein the substrate handling unit includes a support for directly or indirectly supporting at least one of an upper portion and a lower portion of the substrate and guiding the movement of the substrate when the substrate is introduced into the vacuum chamber,
Wherein the substrate is introduced into the vacuum chamber in a downwardly inclined state and is downwardly inclined when the substrate is processed. The method according to claim 1,
Wherein the substrate processing module includes at least one evaporation source through which the evaporation material to be deposited on the substrate processing surface evaporates into the processing space. The method of claim 2,
Wherein the evaporation source is installed so as to be movable in parallel with the substrate processing surface. The method of claim 2,
The evaporation sources are installed in a plurality,
Wherein the plurality of evaporation sources have a constant normal length to a substrate processing surface in a state where the substrate processing surface of the substrate is inclined toward the ground. delete A vacuum chamber for forming a closed processing space;
A substrate handling unit for supporting the substrate such that substrate processing is performed while the substrate processing surface of the substrate standing with respect to the ground is inclined downward toward the ground with respect to a reference line perpendicular to the ground;
And a substrate processing module installed in the vacuum chamber for performing substrate processing on the substrate,
The substrate handling unit may include a support installed in the vacuum chamber and directly or indirectly supporting at least one of an upper portion and a lower portion of the substrate introduced in a standing state with respect to the ground and guiding the movement of the substrate when the vacuum chamber is introduced into the vacuum chamber,
And a tilting unit that directly or indirectly tilts the substrate so that the substrate-processed surface of the substrate is inclined downward toward the ground during substrate processing. The method of claim 6,
The support portion includes a plurality of lower rollers for directly or indirectly supporting the lower portion of the substrate,
Wherein the tilting unit includes a linear driving unit for horizontally moving the lower rollers perpendicularly to an introduction direction in which the substrate is introduced. The method of claim 6,
The support portion includes an upper support portion for supporting an upper portion of the substrate, and a lower support portion for supporting a lower portion of the substrate,
Wherein the tilting portion moves at least one of the upper support portion and the lower support portion to tilt the substrate directly or indirectly so as to be inclined toward the surface of the substrate. The method of claim 8,
Wherein the upper support portion and the lower support portion guide the transfer of the substrate in the vacuum chamber. The method according to any one of claims 1 to 4 and 6 to 9,
Wherein the inclined angle between the reference line perpendicular to the ground and the substrate processing surface is 1 to 10 degrees. The method of claim 10,
Wherein the vacuum chamber is provided with a mask, and the mask is disposed parallel to the substrate processing surface in a state where the substrate processing surface of the substrate is inclined toward the ground. The method according to any one of claims 1 to 4 and 6 to 9,
Wherein the substrate is directly supported in the vacuum chamber to be subjected to a substrate treatment or indirectly supported by a substrate tray to perform a substrate treatment. The substrate processing step is performed while the substrate processing surface of the substrate standing with respect to the paper in the vacuum chamber forming the closed processing space is inclined downward toward the ground with respect to the reference line perpendicular to the ground surface, A substrate introducing step of introducing the substrate into the chamber; And a deposition step of evaporating the deposition material to form a thin film on the substrate processing surface,
Further comprising a substrate tilting step of tilting the substrate such that the substrate processing surface standing with respect to the sheet is inclined downward toward the ground in "before the substrate introduction step ",or" before the substrate introduction step and before the deposition step &
Wherein the step of introducing the substrate directly or indirectly supports at least one of an upper end and a lower end of the substrate by a supporting part, guides the movement of the substrate, and introduces the substrate into the vacuum chamber,
Wherein the substrate tilting step moves the substrate supporting the substrate so that the substrate is directly or indirectly tilted so that the substrate processing surface of the substrate is inclined downward toward the ground. delete delete 14. The method of claim 13,
Further comprising a mask adhering step of bringing the mask into close contact with the substrate processing surface of the substrate before or after the substrate tilting step. 18. The method of claim 16,
The mask tightening step
An aligning step of aligning the substrate and the mask, and an adhesion step of bringing the mask into close contact with the substrate processing surface. 14. The method of claim 13,
Wherein the substrate tilting step is performed before the step of introducing the substrate, and after the step of introducing the substrate, a mask adhering step for adhering the mask to the substrate processing surface of the substrate is performed,
Wherein the mask adhering step includes an aligning step of aligning the substrate and the mask, and an adhesion step of bringing the mask into close contact with the substrate processing surface. 14. The method of claim 13,
Wherein the substrate is transferred while the substrate-treated surface of the substrate is inclined toward the ground. The method according to any one of claims 13 and 16 to 19,
Wherein the inclination angle between the base line perpendicular to the ground and the substrate processing surface during the substrate processing is in the range of 1 to 10 degrees. The method according to any one of claims 13 and 16 to 19,
Wherein the substrate is directly supported and subjected to a substrate process or indirectly supported by a substrate tray to perform a substrate process.

Images