KR101849383B1 - 고온에서 기계적 클램프 성능을 포함하는 가열된 정전 척 - Google Patents

고온에서 기계적 클램프 성능을 포함하는 가열된 정전 척 Download PDF

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Publication number
KR101849383B1
KR101849383B1 KR1020137000376A KR20137000376A KR101849383B1 KR 101849383 B1 KR101849383 B1 KR 101849383B1 KR 1020137000376 A KR1020137000376 A KR 1020137000376A KR 20137000376 A KR20137000376 A KR 20137000376A KR 101849383 B1 KR101849383 B1 KR 101849383B1
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KR
South Korea
Prior art keywords
workpiece
clamping
selectively
electrostatic clamp
electrostatic
Prior art date
Application number
KR1020137000376A
Other languages
English (en)
Korean (ko)
Other versions
KR20130082143A (ko
Inventor
페리 제이.아이. 저스티센
알란 디. 위드
윌리암 다비스 이
아쉬빈 푸로히트
개리 엠. 쿡
로버트 라트멜
Original Assignee
액셀리스 테크놀러지스, 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 액셀리스 테크놀러지스, 인크. filed Critical 액셀리스 테크놀러지스, 인크.
Publication of KR20130082143A publication Critical patent/KR20130082143A/ko
Application granted granted Critical
Publication of KR101849383B1 publication Critical patent/KR101849383B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020137000376A 2010-06-08 2011-06-08 고온에서 기계적 클램프 성능을 포함하는 가열된 정전 척 KR101849383B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US35255410P 2010-06-08 2010-06-08
US61/352,554 2010-06-08
PCT/US2011/001033 WO2011155986A1 (en) 2010-06-08 2011-06-08 Heated electrostatic chuck including mechanical clamp capability at high temperature

Publications (2)

Publication Number Publication Date
KR20130082143A KR20130082143A (ko) 2013-07-18
KR101849383B1 true KR101849383B1 (ko) 2018-04-16

Family

ID=44343838

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137000376A KR101849383B1 (ko) 2010-06-08 2011-06-08 고온에서 기계적 클램프 성능을 포함하는 가열된 정전 척

Country Status (4)

Country Link
JP (1) JP5881686B2 (zh)
KR (1) KR101849383B1 (zh)
CN (1) CN102934218B (zh)
WO (1) WO2011155986A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102169595B1 (ko) * 2013-07-29 2020-10-26 삼성디스플레이 주식회사 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR102398067B1 (ko) 2014-11-05 2022-05-13 삼성디스플레이 주식회사 정전 척
US10186446B2 (en) * 2016-09-30 2019-01-22 Axcelis Technology, Inc. Adjustable circumference electrostatic clamp

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004055585A (ja) * 2002-07-16 2004-02-19 Tokyo Electron Ltd プラズマ処理装置およびプラズマ処理方法
US20050076531A1 (en) * 2000-12-22 2005-04-14 Lam Research Corporation Wafer backside plate for use in a spin, rinse, and dry module and methods for making and implementing the same

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2617044B2 (ja) * 1991-03-28 1997-06-04 日本碍子株式会社 ウエハー保持装置およびその制御方法
JPH0866071A (ja) * 1994-08-19 1996-03-08 Sony Corp 静電吸着装置
JP3586931B2 (ja) * 1995-06-09 2004-11-10 日新電機株式会社 静電チャック
US5793192A (en) * 1996-06-28 1998-08-11 Lam Research Corporation Methods and apparatuses for clamping and declamping a semiconductor wafer in a wafer processing system
US5885428A (en) * 1996-12-04 1999-03-23 Applied Materials, Inc. Method and apparatus for both mechanically and electrostatically clamping a wafer to a pedestal within a semiconductor wafer processing system
US6313469B1 (en) * 1998-03-13 2001-11-06 Ebara Corporation Substrate handling apparatus and ion implantation apparatus
JP4490539B2 (ja) * 2000-02-15 2010-06-30 東京エレクトロン株式会社 ウエハチャック及び半導体ウエハの検査方法
US6483690B1 (en) * 2001-06-28 2002-11-19 Lam Research Corporation Ceramic electrostatic chuck assembly and method of making
US6737663B2 (en) * 2002-05-22 2004-05-18 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for detecting tilt angle of a wafer platform
US7296777B2 (en) * 2004-03-24 2007-11-20 Nikon Corporation Acceleration clamp assist
JP2007048986A (ja) * 2005-08-10 2007-02-22 Hitachi High-Technologies Corp プラズマ処理装置およびプラズマ処理方法
JP4622890B2 (ja) * 2006-03-02 2011-02-02 セイコーエプソン株式会社 ウエハ処理装置
KR100885180B1 (ko) * 2006-12-27 2009-02-23 세메스 주식회사 기판 지지유닛, 그리고 상기 기판 지지유닛을 구비하는기판처리장치 및 방법
JP2008311351A (ja) * 2007-06-13 2008-12-25 Hitachi High-Technologies Corp 荷電粒子線装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050076531A1 (en) * 2000-12-22 2005-04-14 Lam Research Corporation Wafer backside plate for use in a spin, rinse, and dry module and methods for making and implementing the same
JP2004055585A (ja) * 2002-07-16 2004-02-19 Tokyo Electron Ltd プラズマ処理装置およびプラズマ処理方法

Also Published As

Publication number Publication date
WO2011155986A1 (en) 2011-12-15
JP2013531374A (ja) 2013-08-01
JP5881686B2 (ja) 2016-03-09
CN102934218A (zh) 2013-02-13
KR20130082143A (ko) 2013-07-18
CN102934218B (zh) 2016-05-04

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