KR101834944B1 - 프로세싱 동안 기판의 분광 모니터링의 이용에 의한 연마 속도들의 조정 - Google Patents

프로세싱 동안 기판의 분광 모니터링의 이용에 의한 연마 속도들의 조정 Download PDF

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KR101834944B1
KR101834944B1 KR1020167028827A KR20167028827A KR101834944B1 KR 101834944 B1 KR101834944 B1 KR 101834944B1 KR 1020167028827 A KR1020167028827 A KR 1020167028827A KR 20167028827 A KR20167028827 A KR 20167028827A KR 101834944 B1 KR101834944 B1 KR 101834944B1
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sequence
polishing
spectra
function
polishing rate
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KR20160124915A (ko
Inventor
제프리 드루 데이비드
도미닉 제이. 벤베그누
해리 큐. 리
보구슬라우 에이. 스웨덱
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어플라이드 머티어리얼스, 인코포레이티드
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • H01L21/304—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
KR1020167028827A 2008-09-04 2009-09-03 프로세싱 동안 기판의 분광 모니터링의 이용에 의한 연마 속도들의 조정 Active KR101834944B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US9437908P 2008-09-04 2008-09-04
US61/094,379 2008-09-04
PCT/US2009/055935 WO2010028180A2 (en) 2008-09-04 2009-09-03 Adjusting polishing rates by using spectrographic monitoring of a substrate during processing

Related Parent Applications (1)

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KR1020117007774A Division KR101668675B1 (ko) 2008-09-04 2009-09-03 프로세싱 동안 기판의 분광 모니터링의 이용에 의한 연마 속도들의 조정

Related Child Applications (1)

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KR1020187005672A Division KR101944325B1 (ko) 2008-09-04 2009-09-03 다중 스펙트럼들을 이용한 화학 기계적 연마에서의 종료점 검출

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KR20160124915A KR20160124915A (ko) 2016-10-28
KR101834944B1 true KR101834944B1 (ko) 2018-03-06

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KR1020167028827A Active KR101834944B1 (ko) 2008-09-04 2009-09-03 프로세싱 동안 기판의 분광 모니터링의 이용에 의한 연마 속도들의 조정
KR1020187005672A Active KR101944325B1 (ko) 2008-09-04 2009-09-03 다중 스펙트럼들을 이용한 화학 기계적 연마에서의 종료점 검출
KR1020117007774A Active KR101668675B1 (ko) 2008-09-04 2009-09-03 프로세싱 동안 기판의 분광 모니터링의 이용에 의한 연마 속도들의 조정

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KR1020187005672A Active KR101944325B1 (ko) 2008-09-04 2009-09-03 다중 스펙트럼들을 이용한 화학 기계적 연마에서의 종료점 검출
KR1020117007774A Active KR101668675B1 (ko) 2008-09-04 2009-09-03 프로세싱 동안 기판의 분광 모니터링의 이용에 의한 연마 속도들의 조정

Country Status (4)

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US (2) US8369978B2 (https=)
JP (1) JP5675617B2 (https=)
KR (3) KR101834944B1 (https=)
WO (1) WO2010028180A2 (https=)

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Also Published As

Publication number Publication date
US8369978B2 (en) 2013-02-05
WO2010028180A3 (en) 2010-05-20
JP5675617B2 (ja) 2015-02-25
KR101944325B1 (ko) 2019-01-31
WO2010028180A2 (en) 2010-03-11
US20100056023A1 (en) 2010-03-04
KR101668675B1 (ko) 2016-10-24
JP2012502484A (ja) 2012-01-26
KR20110065501A (ko) 2011-06-15
US9346146B2 (en) 2016-05-24
US20130204424A1 (en) 2013-08-08
KR20180030209A (ko) 2018-03-21
KR20160124915A (ko) 2016-10-28

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