JP5675617B2 - 加工時における基板の分光モニタリングを使用した研磨速度の調整 - Google Patents

加工時における基板の分光モニタリングを使用した研磨速度の調整 Download PDF

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JP5675617B2
JP5675617B2 JP2011526204A JP2011526204A JP5675617B2 JP 5675617 B2 JP5675617 B2 JP 5675617B2 JP 2011526204 A JP2011526204 A JP 2011526204A JP 2011526204 A JP2011526204 A JP 2011526204A JP 5675617 B2 JP5675617 B2 JP 5675617B2
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sequence
spectrum
spectra
determining
current
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JP2012502484A5 (https=
JP2012502484A (ja
Inventor
ジェフリー ドリュ デイヴィッド，
ジェフリー ドリュ デイヴィッド，
ドミニク ジェイ． ベンヴェニュ，
ドミニク ジェイ． ベンヴェニュ，
ハリー キュー． リー，
ハリー キュー． リー，
ボグスロー エー． スウェデク，
ボグスロー エー． スウェデク，
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Applied Materials Inc
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Applied Materials Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP2011526204A 2008-09-04 2009-09-03 加工時における基板の分光モニタリングを使用した研磨速度の調整 Active JP5675617B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US9437908P 2008-09-04 2008-09-04
US61/094,379 2008-09-04
PCT/US2009/055935 WO2010028180A2 (en) 2008-09-04 2009-09-03 Adjusting polishing rates by using spectrographic monitoring of a substrate during processing

Publications (3)

Publication Number Publication Date
JP2012502484A JP2012502484A (ja) 2012-01-26
JP2012502484A5 JP2012502484A5 (https=) 2014-05-01
JP5675617B2 true JP5675617B2 (ja) 2015-02-25

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JP2011526204A Active JP5675617B2 (ja) 2008-09-04 2009-09-03 加工時における基板の分光モニタリングを使用した研磨速度の調整

Country Status (4)

Country Link
US (2) US8369978B2 (https=)
JP (1) JP5675617B2 (https=)
KR (3) KR101834944B1 (https=)
WO (1) WO2010028180A2 (https=)

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Also Published As

Publication number Publication date
KR101834944B1 (ko) 2018-03-06
US8369978B2 (en) 2013-02-05
WO2010028180A3 (en) 2010-05-20
KR101944325B1 (ko) 2019-01-31
WO2010028180A2 (en) 2010-03-11
US20100056023A1 (en) 2010-03-04
KR101668675B1 (ko) 2016-10-24
JP2012502484A (ja) 2012-01-26
KR20110065501A (ko) 2011-06-15
US9346146B2 (en) 2016-05-24
US20130204424A1 (en) 2013-08-08
KR20180030209A (ko) 2018-03-21
KR20160124915A (ko) 2016-10-28

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