KR101831774B1 - Lighting source module, and fabrication method therefor - Google Patents

Abstract

The light source module according to the present invention includes at least one light source for providing light; A body for supporting the light source, the body including a heat sink for absorbing heat from the light source and emitting the light to the outside; An insulating layer having electrical insulation properties provided on at least a part of the surface of the heat sink; And a conductive layer provided on the insulating layer to allow a current to flow therethrough, the conductive layer being provided with a conductive region for providing a passage region for applying electricity to the light source; And a heat radiation conductive layer for diffusing heat caused by the light source. According to the present invention, it is possible to obtain an effect of quick manufacturing process, low manufacturing cost, ease of mass production, improvement of product yield, and resolution of heat radiation problem. Furthermore, it is needless to say that various effects that can be understood by the respective constitutions shown in the specific embodiments of the invention can be obtained.

Description

[0001] The present invention relates to a light source module and a fabrication method thereof,

The present invention relates to a light source module and a method of manufacturing the light source module.

As indoor or outdoor lighting equipment, incandescent lamps and fluorescent lamps are widely used. The incandescent lamps and fluorescent lamps have a short lifetime and therefore require frequent replacement. The fluorescent lamp can use a longer time than an incandescent lamp, but has a problem of being harmful to the environment, and deterioration may occur over time, and the illuminance may gradually decrease.

As a light source that solves the above problems, a light emitting diode (LED) capable of realizing excellent controllability, fast response speed, high electricity / light conversion efficiency, long life, small power consumption, high brightness, Was introduced. Various types of lighting modules and lighting devices employing the light emitting diodes have been developed.

The light emitting diode (LED) is a type of semiconductor device that converts electrical energy into light. The light emitting diode has advantages such as low power consumption, semi-permanent lifetime, quick response speed, safety, and environmental friendliness compared to conventional light sources such as fluorescent lamps and incandescent lamps. Accordingly, much research has been conducted to replace an existing light source with a light emitting diode, and a light emitting diode has already been used as a light source for various liquid crystal display devices, an electric signboard, and a streetlight.

The light emitting element (hereinafter, the light emitting element mainly refers to a light emitting diode, but is not limited thereto) is used in a form in which a plurality of light emitting diodes are integrated for high luminance implementation. Therefore, the light emitting device is fabricated in the form of a light source module in order to protect from the convenience of assembly, external impact and moisture. In the light source module, since a plurality of light emitting devices are integrated at a high density, higher luminance can be realized, but there is a problem that high heat is generated due to a side effect. Researches for effectively releasing the heat have been conducted.

As a conventional technique for solving the heat dissipation problem under such a background, the registration number 10-1472403 in which the applicant of the present invention is patented is exemplified.

In the light source module according to the present invention, a printed circuit board having a plurality of light emitting devices mounted thereon is coupled to a heat sink. However, since such a manufacturing process requires a plurality of processes, it takes a long time to manufacture and a large cost is required. In addition, a thermal pad is further inserted between the printed circuit board and the heat sink to increase the heat radiation efficiency. However, since the heat transfer of the printed circuit board itself is not excellent, the heat can not be effectively transferred to the heat sink, and the problem of heat dissipation to the light source module with high luminance can not be solved. Further, since the thermal pad must be inserted separately, there is a problem that it takes more time and cost.

It is important that the lighting device be able to emit brighter light. However, as the light source module provides brighter light, more heat is generated, and if the heat is not emitted, the life of the lighting device is lowered.

2 of Korean Patent Registration No. 10-1472403 and related description

The present invention proposes a light source module and a method of manufacturing a light source module that can solve the above-described problems and can be realized with a rapid manufacturing process and a low manufacturing cost.

The present invention proposes a light source module and a method of manufacturing a light source module that can solve the heat dissipation problem while realizing high brightness.

The present invention proposes a light source module and a method of manufacturing a light source module that can solve the problem of product yield that may occur due to a short circuit, a disconnection, a component dropout, or the like.

The present invention proposes a light source module and a method of manufacturing a light source module that can be implemented in a process suitable for mass production.

The light source module according to the present invention includes at least one light source for providing light; And a body for supporting the light source, wherein the body absorbs heat from the light source and emits the heat to the outside; A first metal layer thinly provided on a surface of the heat sink body; An insulating layer having electrical insulation property provided on at least a surface of the first metal layer; A depression for depressing the insulating layer; And a conductive layer provided in the depression to allow current to flow therethrough, wherein the conductive layer includes a copper material layer which is in contact with the bottom of the depression and made of copper; And a nickel material layer made of nickel provided on the copper material layer. INDUSTRIAL APPLICABILITY According to the present invention, it is possible to obtain an effect of preventing peeling of the heat sink and the softened layer.

The copper material layer includes a second metal layer in contact with the bottom of the depression; And a third metal layer on the second metal layer. According to this, the process efficiency of the plating process can be improved and the deposition of the plating layer can be performed stably.

The fifth metal layer is provided to be thinnest as compared with other metal layers in the conductive layer, so that the manufacturing cost can be saved and the bonding efficiency by nickel can be improved.

The interface between the third metal layer and the fourth metal layer is rough compared to the interface between the other metal layers, so that the bonding performance of the dissimilar metals can be improved.

The first plating layer is provided at the thinnest portion as compared with the other metal layers, so that the resin bonding property can be improved and the peeling of the insulating layer can be prevented.

The second metal layer is provided thinner than the third metal layer, so that the use of the high-concentration plating solution can be suppressed to the utmost, and plating unevenness can be prevented.

According to the present invention, since the conductive layer that applies electricity to the light source and the heat radiation conductive layer that diffuses heat are provided on the conductive layer, the heat generating performance can be increased even if the insulating layer is provided.

According to the present invention, by providing the heat radiation conductive layer as a whole, the diffusion of heat can be performed more effectively.

According to the present invention, since the neck portion is included in the portion to which the conductive layer and the light source are connected, it is possible to prevent a product defect due to the light source bonding. In addition, the yield of the product can be improved in a mass production process.

According to the present invention, an island provided integrally with the insulating layer in the inner region of the conductive layer is included, so that the peeling phenomenon caused by use of the product can be prevented. In addition, the reliability of the product can be improved.

According to the present invention, by thinly applying an insulating layer made of a resin to at least a part of the surface of a heat sink, providing a metal bonding surface to the insulating layer, and providing at least two conductive layers spaced apart from each other on the metal bonding surface, A rapid manufacturing process can be performed. In addition, it is possible to solve the problem of lack of thermal diffusion.

That is, according to the present invention, it is possible to obtain an effect of speedy manufacturing process, low manufacturing cost, ease of mass production, improvement of product yield, and resolution of heat radiation problem. Furthermore, it is needless to say that various effects that can be understood by the respective constitutions shown in the specific embodiments of the invention can be obtained.

1 is a perspective view of a light source module according to an embodiment.
2 is an exploded perspective view of the light source module.
3 is a front view of the light source module.
4 is a side view of the light source module.
5 is a bottom view of the light source module.
6 is a cross-sectional view taken along line A-A 'in Fig.
FIG. 7 is an enlarged view of a portion where the light source is placed in FIG. 6; FIG.
8 to 12 are views sequentially showing a manufacturing method of the light source module.
FIG. 13 is a plan view of the light source module of FIG. 13;
FIG. 14 is an enlarged view of a part of the light source in FIG. 13; FIG.
15 is a sectional view taken along the line B-B 'in Fig.
16 is a perspective view of a lighting apparatus including a light source module.
17 is a cross-sectional view of the periphery of the conductive layer provided by the above-described manufacturing method.
18 is a flowchart illustrating a method of manufacturing a light source module.
19 is a view for explaining a method of manufacturing a heat sink in detail;
20 is a flow chart illustrating a process of forming a pattern on the surface of an insulating layer;
21 is a flow chart for providing a conductive layer;

Hereinafter, specific embodiments of the present invention will be described in detail with reference to the drawings. However, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims, It will be easily understood that the present invention is not limited thereto.

The drawings attached to the following embodiments are embodiments of the same invention. However, in order to facilitate understanding of the invention within the scope of the invention, And a specific portion may not be displayed in accordance with the drawings, or may be exaggerated in accordance with the drawings.

FIG. 1 is a perspective view of a light source module according to an embodiment, and FIG. 2 is an exploded perspective view of a light source module.

Referring to FIGS. 1 and 2, the light source module 100 according to the embodiment may include at least one light source 11 for generating light, and a body for supporting the light source 11.

The light source 11 may include all means for generating light by receiving electrical energy. For example, the light source 11 may include a light source in the form of a point light source. Specifically, the light source 11 may include any one of a light emitting diode and a laser diode. Also, the light source 11 may emit light of a different color or a white color by intermingling a plurality of point light sources emitting different colors.

The body is provided as a part that allows the physical and electrical action of the light source 11 so that the light source 11 can be stably operated. The body can effectively dissipate the heat generated by the light source 11. The body may be electrically connected to the light source 11 to supply power to the light source 11.

The body may include a heat sink 120. The light source 11 may be fastened or directly fastened to the heat sink 120 through another member. Preferably, the light source 11 may be fastened to the heat sink 120 for physical coupling, such as supporting its own weight. However, the light source 11 may be fastened to the heat sink 120 with a predetermined insulation layer interposed therebetween in order to insulate the heat sink 120 from the heat sink 120.

A mounting portion 121 on which the light source 11 is mounted may be provided on one surface of the heat sink 120. The heat generated by the light source 11 is rapidly absorbed into the heat sink 120 by the seating part 121. The heat sink 120 may transmit the heat generated by the light source 11 and the light emitted from the light source to the heat dissipation fin 130 when the heat dissipation fin 130 is connected to the other surface of the heat sink 120. [ Of course, the heat dissipation fin 130 can rapidly dissipate heat to the outside. Also, the heat sink 120 itself can quickly release heat to the outside.

The heat sink 120 may be formed of a metal material or a resin material having excellent heat radiation and heat transfer efficiency. It is not limited thereto. For example, the heat sink 120 may be formed of a metal such as Al, Au, Ag, Cu, Ni, Sn, Zn, And iron (Fe). For example, the heat sink 120 may be made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum nitride (AlN), photo sensitive glass (PSG), polyamide 9T PA9T), syndiotactic polystyrene (SPS), metal materials, sapphire (Al2O3), beryllium oxide (BeO), ceramics. The heat sink 120 may be formed by injection molding, etching, or the like. It is not limited thereto.

The heat sink 120 may have a plate shape and a planar shape may be a square shape. In detail, the seating part 121 may be formed by recessing one surface (for example, an upper surface) of the heat sink 120. The lens cover 142 may be seated on the seating part 121. The seating part 121 may be provided in a watertight structure by the outside and the lens cover 142. The light source 11 can be protected against the external environment by the combination of the seating part 121 and the lens cover 142.

A coupling hole 126 through which the coupling member passes may be formed at an edge of the heat sink 120 when the light source module is coupled to an illumination device or the like.

The body may include a heat dissipation fin 130 for improving the heat dissipation efficiency of the heat sink 120. The radiating fin 130 may have a shape for maximizing an area of contact with the air. The heat dissipation fin 130 may receive heat from the heat sink 120 and exchange heat with the ambient air. In detail, the heat radiating fin 130 may be provided in a plurality of plate shapes extending further downward from the other surface (bottom surface) of the heat sink 120. More specifically, the heat radiating fins 130 may be disposed at a plurality of positions with a constant pitch. The width of the heat dissipation fin 130 may be equal to or the same as the width of the heat sink 120 so that the heat of the heat sink 120 can be effectively transmitted. The radiating fin 130 may be formed as one body with the heat sink 120, or may be manufactured as a separate component. The radiating fin 130 may include at least one of a material having excellent heat transfer properties such as aluminum (Al), nickel (Ni), copper (Cu), silver (Ag), and tin (Sn). Preferably, the heat radiating fins 130 may be integrally provided with the same material as the heat sink 120.

3 is a front view of the light source module, and FIG. 4 is a side view of the light source module.

Referring to FIGS. 3 and 4, the heat radiating fins 130 may be arranged long in the width direction (short corner direction) of the heat sink 120. Also, the heat radiating fins 130 may have a predetermined pitch in the longitudinal direction (long edge direction) of the heat sink 120, and a plurality of heat radiating fins 130 may be installed. The central portion 131 of the heat dissipation fin 130 may be recessed toward the heat sink 120 more than the both end portions 133 of the heat dissipation fin 130. [ The light source 11 may be positioned so as to overlap the both ends 133 of the heat radiating fin 130 in the vertical direction. Both end portions 133 of the radiating fin 130 may be formed higher than the center portion 131 of the radiating fin 130. [ According to this structure, the portion where the high heat is transmitted among the various portions of the heat dissipation fin 130 can contact the more air, thereby improving the heat radiation efficiency. In addition, the central portion 131 of the radiating fin 130 can save manufacturing costs.

An air hole 122 may be formed in the heat sink 120. The air hole 122 may be formed to penetrate the heat sink 120 in a vertical direction. Specifically, the air hole 122 may be formed through the heat sink 120 in the direction of the heat dissipation fin 130 from the seating part 121. With this configuration, it is possible to provide a space in which air flows. The air holes 122 may be formed long in the longitudinal direction of the heat sink 120 at a central portion of the heat sink 120. The air holes 122 overlap the cover holes 143 formed in the lens cover 142 in the vertical direction and can communicate with each other.

The light source 11 may be positioned around the air hole 122. Specifically, the light source 11 may be disposed adjacent to the air hole 122 on one side of the heat sink 120 forming the periphery of the air hole 122. Therefore, the air holes 122 can be heated first by the heat generated in the light source 11. [ The air hole 122 can circulate the air by the temperature difference between the inside and the outside of the air hole 122. This circulated air can accelerate the cooling of the heat radiating fin 130 and the heat sink 120. Specifically, the air hole 122 may be vertically overlapped with the central portion 131 of the heat dissipation fin 130. The light source 11 may be positioned so as to be vertically overlapped with both ends 133 of the heat radiating fin 130.

5 is a bottom view of the light source module.

5, the air conditioner further includes an air guide 160 extending downward from the rim of the air hole 122 and communicating with the air hole 122 to guide the air . The air guide 160 may be provided in a columnar shape having a space therein. In other words, the rim of the air guide part 160 may be configured to overlap with the rim of the air hole 122. In other words, the air guide part 160 may have a shape of a chimney surrounding the air hole 122. The air guide 160 may have a substantially rectangular cross section. The vertex portion of the rectangle may be provided in a curved shape.

The air guide unit 160 may be made of a material having a high heat transfer efficiency. For example, the material of the air guide 160 may include at least one of aluminum (Al), nickel (Ni), copper (Cu), silver (Ag), and tin (Sn). The air guide 160 may be formed of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), liquid crystal polymer Amide 9T (PA9T), syndiotactic polystyrene (SPS), metal material, sapphire (Al2O3), beryllium oxide (BeO), ceramics. The air guide 160 may be integrally provided with the same material as the heat sink 120 and the radiating fin 130 by the same process. A die casting process may be applied to the manufacturing process of the parts.

The outer surface of the air guide 160 may be connected to at least a part of the plurality of radiating fins 130. The heat transmitted from the light source 11 to the heat sink 120 and the heat dissipation fin 130 may be transmitted to the air guide 160 through the outer surface of the air guide 160. The air guide portion 160 can further accelerate the air flowing into the air hole 122. A connector hole (see 124 in FIG. 2) through which the connector 190 for supplying power to the light source 11 passes may be formed in the heat sink 120.

6 is a cross-sectional view taken along line A-A 'in Fig. 6 is a cross-sectional view of the portion where the light source 11 is placed, specifically, the portion where the light source is applied with power.

Referring to FIG. 6, an insulating layer 20 may be provided on the surface of the heat sink 120. The insulating layer 20 may be provided over the entire surface of the heat sink 120, but may be provided only partially, but not limited to now. When the heat radiating fin 130 and the air guiding portion 160 are provided as one body with the heat sink 120, an insulating layer 20 is provided on the surface of the heat radiating fin 130 and the air guiding portion 160 . At this time, the entire surface of each component may be provided with an insulating layer or only a part thereof.

According to a preferred embodiment, the heat sink 120, the radiating fin 130, and the heat sink 120 may be provided together by a die casting method, and then an insulating layer 20 may be provided .

The insulating layer 20 may be applied by powder coating. The powder coating method can be carried out by any one of an electrostatic spraying method, an electrostatic brushing method, and a fluidized deposition method. Therefore, the insulating layer 20 may be referred to as a coating insulating layer or a coating insulating layer. According to this, the process can be performed quickly and inexpensively and the yield of the product is increased.

The insulating layer 20 may insulate the heat sink 120 from the conductive layer 40 to be described later. The conductive layer 40 is electrically conductive and may be electrically connected to the light source 11. The conductive layer 40 may be a path for supplying electricity to the light source 11. Also, the conductive layer 40 may perform a function of rapidly diffusing heat. For this, the conductive layer 40 may be formed of a metal material. For example, at least one of Ag (silver), Au (gold), Cu (copper), and Ni (nickel). Here, Ag (silver) and Au (gold) can be used as the outermost layer of the conductive layer 40 because oxidation can be prevented even if they are exposed to the outside. The same is true in the case of the embodiment.

 The light source 11 may be provided as a vertical type light emitting diode in which two electrodes are formed below. 6 that one electrode is connected to the light source 11 and it is easily anticipated that one electrode is provided below the ground or above the ground. When the vertical light emitting diode is mounted on the conductive layer 40, wire bonding is not necessary.

The conductive layer 40 may be provided in a depression 21 previously provided at a position where the conductive layer 40 is to be provided. The recesses 21 may be provided by etching the insulating layer 20 by laser direct structuring (LDS). The depressed portion 21 may be provided with at least a bottom surface of the inner region with a rough surface having a metal nucleus. The depressions 21 may be spaced apart from one another by the conductive layers 40 connected to the light sources 11. In other words, in order to prevent a short circuit between the electrodes connected to the light source 11, a pair of conductive layers 40 to be provided with a pair of electrodes may be placed inside different depressions 21 .

The depression 21 may be provided with a conductive layer 40. The conductive layer 40 may be provided by performing at least two or more plating processes repeatedly. In the embodiment, Cu (copper), Ni (nickel), and Au (gold) are successively laminated as the conductive layer 40 to form the first plating layer 41, the second plating layer 42, (43).

As a method of providing the insulating layer 20, the depressions 21 and the conductive layer 40, a conductive material such as copper is sputtered on the insulating layer 20 and a conductive material such as electrolytic / electroless plating And then forming a conductive film thereon and etching it. At this time, the depressed portion 21 may be provided to the insulating layer 20 in advance to prevent a short circuit or the like. It is not limited in any way. However, a laser direct structuring process can be more preferably considered because it is possible to realize an inexpensive manufacturing ratio, perform a rapid and precise process, and is suitable for mass production using laser equipment.

The light source 11 may further include a plurality of lenses 141 for shielding the light source 11 and refracting the light generated by the light source 11. The lens 141 can diffuse the light generated by the light source 11. The diffusion angle of the light generated by the light source 11 can be determined according to the shape of the lens 141. For example, the lens 141 can mold the light source 11 in a convex shape. Specifically, the lens 141 may include a material that transmits light. For example, the lens 141 may be formed of transparent silicone, epoxy, and other resin materials. In addition, the lens 141 may be disposed so as to surround the light source 11 so that the light source 11 is isolated from the outside so as to protect the light source 11 from external moisture and impact.

More specifically, for ease of assembly, the lens 141 may be provided on the lens cover 142 formed to correspond to the insulating layer 20. The lens cover 142 may be formed on the upper surface of the insulating layer 20 to correspond to the insulating layer 20. The lens 141 located in the lens cover 142 may be disposed at a position overlapping with the light source 11. [ The lens cover 142 is inserted and seated in the seating part 121, and the light source 11 and the outside can be watertight.

A cover hole 143 communicating with the air hole 122 may be formed in the lens cover 142. Specifically, the cover hole 143 may be formed through the lens cover 142 in the vertical direction.

The insulating layer 20 may include a material capable of efficiently reflecting light. In this case, the light emitted from the light source 11 and the light reflected from the lens cover 142 including the lens 141 may be reflected to the outside to further increase the light utilization efficiency. In addition, a high cooling efficiency can be achieved by reducing the light lost by heat.

Hereinafter, an insulating layer, a depression, and a method of providing a conductive layer which can be included in the embodiment will be described in more detail.

FIG. 7 is an enlarged view of a portion where the light source is placed in FIG. 6. FIG.

Referring to FIG. 7, a metal bonding surface 22 may be formed on the inner surface of the depressed portion 21. It can be said that the metal bonding surface 22 is processed into a surface having a property suitable for the surface of the insulating layer 20 to be laminated with the conductive layer. The metal bonding surface may be provided by irradiating a laser to an area where a conductive layer is provided.

The metal bonding surface 22 may be provided with a metal nucleus to which the metal of the conductive layer 40 may adhere. Further, the surface of the metal bonding surface can be provided by being processed into a lattice-like trench. The metal bonding surface 22 may include at least the bottom surface of the depression 21. The trenches may be provided irregularly. By providing the metal nuclei in the insulating layer, it is possible to further promote the effect of promoting heat transfer through the insulating layer.

A conductive layer 40 may be laminated on the metal bonding surface 22. At least one plating layer may be laminated on the conductive layer 40. For example, the first plating layer 41 made of copper, the second plating layer 42 made of nickel, and the third plating layer 43 made of gold or silver may be included. The first plating layer 41 may be deposited to a thickness of 10 to 20 micrometers. The second plating layer 42 may be deposited to a thickness of 5 to 15 micrometers. The third plating layer 43 may be deposited to a thickness of about 0.1 to 0.01 micrometer. The third plating layer 43 may cause an increase in material cost and may not be stacked. However, it is preferable that the third plating layer 43 is provided as a thin film for preventing oxidation and protection.

The first plating layer 41 located on the lowermost side of the conductive layer 40 serves as an electrically conductive role layer for reducing the electric resistance to reduce the amount of heat generated. For this, the first plating layer 41 may be made of copper. The first plating layer 41 can be made thickest among the plating layers so as to secure sufficient electric conduction characteristics. In addition to copper, metals with high electrical conductivity may be used.

The second plating layer 42 lying in the middle of the conductive layer 40 serves as a soldering role layer for improving the quality of soldering. For soldering, the molten solder is well spread over the entire surface of the base material and the solder must diffuse well on the surface of the base material. Nickel can be used as a metal for securing the characteristics of the soldering.

The outermost third plating layer 43 of the conductive layer 40 functions as a protective role layer for protecting the plating layers 41 and 42 therein. The third plating layer 43 may use gold that is not oxidized or discolored. In the case of silver, there is a risk of discoloration, which is undesirable because it can penetrate into the silver LED package later and chemically react with the internal parts of the light emitting portion to lower the luminous efficiency. Since the third plating layer 43 performs the function of protection, it can be provided as the thinnest layer. It is possible to provide only the third plating layer 43 without providing the second plating layer 42, but it is not preferable from the viewpoint of cost. Since the third plating layer 43 is provided in a very thin layer, the second plating layer 42 does not interfere with the third plating layer 43 during soldering.

The third plating layer 43 may be provided with a resin. In this case, the resin may be laminated in a manner other than plating. The resin is not covered with the soldered portion, so that the soldering can be prevented from being hindered.

The gold, silver, and resin provided to the third plating layer are layers for protecting the metals inside. Therefore, the third plating layer 43 may be called a protective layer.

A bonding layer 50 may be provided on the conductive layer 40. The light source 11 may be disposed on the bonding layer 50. The bonding layer 50 may be a low temperature solder paste which can be soldered at a low temperature. For example, the OM525 can be used. The bonding layer may be formed by passing a reflow machine in a state where the light emitting device is mounted on the upper side to which the low temperature solder paste is applied. Soldering at a low temperature can prevent peeling between the heat sink 120 and the insulating layer 20 and peeling between the insulating layer 20 and the conductive layer 40. Accordingly, the reliability of the product and the yield of the product are improved, and deterioration of the material due to use over a long period of time can be prevented.

8 to 12 are views for explaining the manufacturing method of the light source module in detail in order.

Referring to FIG. 8, the insulating layer 20 may be provided on a body manufactured by way of example, a die-casting method. The insulating layer 20 may be applied by powder coating. The insulating layer may be provided as a resin-containing material after the molding is completed. The powder coating method can be carried out in more detail by any one of electrostatic spraying method, electrostatic brush method, and fluidized deposition method. Therefore, the insulating layer 20 may be referred to as a coating insulating layer or a coating insulating layer. The thickness of the coating insulation layer may be 60 to 80 micrometers. However, the thickness is not limited to this, and various values can be selected according to the insulation performance, heat radiation performance, and process variables. In the embodiment, the light source is a light-emitting diode, a commercial power source is connected, and insulation and heat dissipation are secured in a case where the light source is suitably used in an external environment.

The insulating layer 20 may be subjected to a laser direct structuring process to laminate the conductive layer 40 on at least a part of its surface. The direct laser structuring process may be performed before the plating step, and may be performed by irradiating a laser beam onto the surface of the insulating layer 20 where the conductive layer is to be plated. The area to be plated on the surface of the resin molded article is modified by the laser irradiation, and it can have properties suitable for plating. For this purpose, the insulating layer 20 may contain a nucleating agent for direct laser structuring (hereinafter, simply referred to as a nucleating agent) capable of forming metal nuclei by a laser, A predetermined pattern may be formed in order to provide a plating layer on the inner surface of the substrate.

First, a case where a nucleating agent is contained in the insulating layer 20 will be described.

The resin molding providing the insulating layer 20 may contain a nucleating agent. When the nucleating agent receives the laser, the nucleating agent decomposes and the metal nucleus can be generated. Further, the area to be plated to which the laser is irradiated may have a rough surface. Due to the presence of such metallic nuclei and surface roughness, the area to be plated which is laser modified can be adapted for plating. The metal nucleus may refer to a nucleus to which the metal is attached in a subsequent plating step.

As the nucleating agent, a metal oxide having a spinel structure, a heavy metal complex oxide spinel such as copper chromium oxide spinel, a copper salt such as copper hydroxide, phosphate, copper sulfate, copper sulfate or cuprous thiocyanate can be used . As the material of the insulating layer 20, a polyester-based resin may be used. This is because the heat sink 120, the insulating layer 20, and the conductive layer (not shown), which can be generated by the heat applied in the bonding process of the light source 11, 40 can be prevented from being peeled off.

Next, a case where a predetermined pattern is formed on the inner surface of the depression 21 will be described. Even if the resin structure providing the insulating layer does not contain a nucleating agent, the conductive layer 40 is formed in the insulating layer 20 by forming a trench line in a predetermined pattern exemplified by a lattice pattern in the region to be plated . The trench line can effectively promote adhesion of the metal to the plating target region on the surface of the resin structure, and can perform the plating process. The trench line may be provided with at least two types of intersecting trenches.

The step of forming a trench line of a predetermined pattern by irradiating a laser beam onto a region to be plated on the surface of the insulating layer 20 may be performed by irradiating a laser beam onto a region to be plated on the surface of the insulating layer.

9 is a view showing that the depression is provided in the insulating layer.

Referring to FIG. 9, as described above, a laser may be used as a means for providing the depression 21 in the insulating layer 20. For example, YAG (yttrium aluminum garnet), YVO4 (yttrium or thovanadate), YB (ytterbium), CO ₂ , etc. may be used as the medium for providing the laser. The wavelength of the laser may be, for example, 532 nm, 1064 nm, 1090 nm, 9.3 μm, 10.6 μm, or the like. An algorithm for recognizing and processing a three-dimensional shape when machining with a laser can be used. For example, at least a body including the heat sink 120 may be recognized as a three-dimensional recognition program, and the processing height of the laser may be controlled by dividing the body into several steps according to the height. The output value of the laser may be, for example, about 2W to about 30W.

As described above, the metal bonding surface 22 processed by the laser has at least one of a metal core, a rough surface, and a trench so that the conductive layer 40 can be plated in a subsequent process.

10 is a view showing that the conductive layer is provided in the depression.

Referring to FIG. 10, a step of plating the metal on the metal bonding surface 22 in an electroless manner to provide the conductive layer 40 may be performed. Of course, other plating methods may be performed. The conductive layer 40 may be copper, nickel, gold, silver, or a combination thereof. The conductive layer may be a single layer or a laminated structure. In the laminated structure, each layer may be a different metal or may be the same metal. In the examples, copper, nickel, and gold were sequentially laminated.

As an example, a case where a first plating layer 41 provided with copper is provided will be described in detail.

The heat sink 120 provided with the metal bonding surface 22 is immersed in the electroless copper plating solution. At this time, the radiating fin 130 and the air guide 160 can be immersed together. For example, the aqueous electroless plating solution for electroless copper may contain, based on 1 liter of deionized water, about 55 ml to about 65 ml of copper bath / supplements, about 55 ml to about 65 ml of alkali supplement, about 15 ml 20 ml, stabilizer about 0.1 ml to about 0.2 ml, and formaldehyde about 8 ml to about 10 ml.

From about 6 parts by weight to about 12 parts by weight of copper sulfate, from about 1 part by weight to about 1.5 parts by weight of polyethylene glycol, from about 0.01 to about 0.02 part by weight of stabilizer, and from about 78 parts by weight of water, To about 80 parts by weight.

The alkali supplements may contain, for example, from about 40 parts by weight to about 50 parts by weight of sodium hydroxide, from about 0.01 part by weight to about 0.02 part by weight of stabilizer, and from about 50 parts by weight to about 60 parts by weight of water.

The complexing agent may contain, for example, from about 49 to about 50 parts by weight of sodium hydroxide, from about 0.01 to about 0.02 part by weight of stabilizer, and from about 50 to about 51 parts by weight of water.

The stabilizer may include, for example, from about 0.2 parts by weight to about 0.3 parts by weight of potassium selenocyanate, from about 5 parts by weight to about 6 parts by weight of potassium cyanide, from about 0.3 to about 0.4 parts by weight of sodium hydroxide, Parts by weight to about 93 parts by weight.

For example, in order to provide the first plated layer 410 made of copper, the catalyst-imparted resin structure is coated on the electroless copper plating solution at a temperature of about 41 degrees to about 55 degrees, It can be washed with water after soaking at a deposition rate of 10 min.

Thereafter, the plating process can be further performed by repeatedly providing another plating layer with a plating solution.

The conductive layer 40 may be deposited to a depth exceeding the depth of the depression 21. According to this, it is possible to reduce the resistance of the conductive layer 40 by increasing the area to be energized, and reduce the amount of heat generated by the resistance. Of course, the scope of the present invention is not limited to such a configuration.

11 is a view showing that the bonding layer is provided.

Referring to FIG. 11, the bonding layer 50 may be coated with a low-temperature solder paste on the conductive layer 40. Also, it can be provided by placing the light source 11 at a position where electrodes are aligned on the low-temperature solder paste, and then passing the reflow machine. During the reflow process, unnecessary portions of the low-temperature solder paste are removed, and conductive components remain, so that the conductive layer 40 and the light source 11 can be energized.

As the low-temperature solder paste, OM525 which can be used at about 160 degrees can be used. A relatively low-temperature atmosphere is formed during the reflow process, so that the peeling of the insulating layer 20 and the heat sink 120 and the peeling of the conductive layer 40 and the insulating layer 20 can be suppressed. This can improve product yield and reliability.

12 shows that a lens is further provided on the upper side of the light source.

A lens 141 is provided above the light source 11. The lens 141 shields the light source 11 and can refract and diffuse the light generated by the light source 11. The diffuse angle of the light generated by the light source 11 can be determined according to the shape of the lens 141. For example, the lens 141 can mold the light source 11 in a convex shape. Specifically, the lens 141 may include a material that transmits light. For example, the lens 141 may be formed of transparent silicone, epoxy, and other resin materials. The lens 141 may be arranged so as to surround the light source 11 so that the light source 11 is isolated from the external environment so as to protect the light source 11 from external moisture and impact.

More specifically, for ease of assembly, the lens 141 may be disposed on the lens cover 142 formed to correspond to the insulating layer 20. The lens cover 142 may be formed on the upper surface of the insulating layer 20 to correspond to the insulating layer 20. The lens 141 located in the lens cover 142 may be disposed at a position overlapping with the light source 11. [ The lens cover 142 is seated inside the seat part 121 and can tightly seal the light source 11 and the outside.

13 is a plan view of the light source module. 13 shows the planar structure of the conductive layer which is shown without the lens cover 142 and which is not shown in the other drawings in more detail.

Referring to FIG. 13, as described above, the light source module 100 according to the embodiment may be provided with a conductive layer 40. As described above, the conductive layer 40 plays a role of a path for applying electricity to the light source 11, and the conductive layer 40 according to the embodiment diffuses heat to enhance the effect of heat emission. Can be performed. According to this technical idea, the heat radiation efficiency of the light source module can be further improved, and even when the insulating layer 20 is provided thick, heat radiation performance can be prevented from being a problem.

In detail, the conductive layer 40 is provided with a conductive conductive layer 45 through which electricity can flow along the path of the light source 11, And a heat dissipation conductive layer 44 that can enhance the heat dissipation effect.

The conductive conductive layer 45 may provide a path through which electricity is externally applied. The conductive unit body 49 (see FIG. 14), which can connect the light sources 11 to each other, can play a role of connecting between the light sources 11. The conductive unit body 49 may function as a single unit that connects the connector and the light source to each other. In addition, the conductive unit body 49 may be provided with a predetermined thickness and width to provide a passage through which electricity flows.

The heat dissipation conductive layer 44 may serve to rapidly diffuse the heat generated by the light source 11 along the surface of the heat sink 120, The insulating layer 20 is provided as a resin molded body and may have insulating properties. The insulating layer 20 may be lower in electrical conductivity as well as in heat transfer compared to metal. Even in this case, the heat can be diffused along the heat radiation conductive layer 44 in order to release the heat quickly. The same effect can be obtained in the heat radiation conductive layer 44 as well as the heat diffusion.

The heat dissipation conductive layer 44 may include an external heat dissipation conductive layer 442 disposed outside the conductive conductive layer 45 and an internal heat dissipation conductive layer 441 disposed inside the conductive conductive layer 45 . The internal heat-dissipating conductive layer 441 and the external heat-dissipating conductive layer 442 may be connected to each other by a bridge 46 to further enhance heat diffusion and heat dissipation. The external heat-dissipating conductive layer 442 may be provided as a single structure in which the entire external heat-dissipating conductive layers 442 are connected to each other. The internal heat-dissipating conductive layer 441 may be provided as a single structure in which all of the internal heat-dissipating conductive layers 441 are connected to each other. According to this, there is an advantage that diffusion of heat can be promoted. The external heat radiation conductive layer 442 and the internal heat radiation conductive layer 441 may be connected to each other by a bridge. Therefore, unlike the conductive conductive layer 45, the heat-radiating conductive layer 44 can be connected to each other as a single structure. According to this, diffusion of heat generated in the light source 11 can be further promoted. In other words, it is possible to obtain the effect of promoting the diffusion of heat to a certain hot position, for example, the adjacent position of the light source 11, to any cold position, for example, the adjacent position of the air hole 122. It can be easily predicted that the effect of heat emission is correspondingly enhanced if diffusion of heat is promoted.

The heat radiation conductive layer 44 may be provided substantially on the entire surface of the heat sink 120, except for the space between the heat radiation conductive layer 44 and the conductive conductive layer 45. Accordingly, the heat absorbing effect of the heat sink 120, which may be caused by the insulating layer 20 made of a resin material, and the phenomenon of deterioration of the heat releasing effect can be improved.

FIG. 14 is an enlarged view of a part of the light source in FIG. 13; FIG.

Referring to Fig. 14, one end of one of the conductive unit bodies 49 may face the other end of the other conductive unit body 49 with the bridge 46 interposed therebetween. Here, the meaning of confronting may include meaning that the light source 11 is correspondingly positioned to supply current to different electrodes.

The conductive unit body 49 is provided with an extension 452 extending in a direction to connect between the pair of light sources 11 so that the ends of the conductive unit body 49 can face each other, And a neck portion 453 provided between the connecting portion 451 and the extending portion 452. The connecting portion 451 is connected to the electrode of the first electrode 451 in a state of being energized. The neck portion 453 can be defined as a portion where the groove 454 is formed to be concave by reducing the width of the extended portion 452. The neck portion 453 can prevent a problem such as a short circuit due to flow of a fluid material such as solder paste during the connection process of the light source 11 and the connection portion 451. [ This is advantageous in that the yield reduction of the product, which may occur due to the reflow process in which the light source 11 is mounted on the heat sink 120, can be prevented in advance.

The width w1 of the connecting portion 451 may be wider than the width w2 of the extending portion 452. [ The width w3 of the neck portion 453 may be narrower than the width of the extending portion 452. [

The largest width of the connection portion 451 can prevent the connection failure between the light source 11 and the conductive unit body 49. In addition, considering that the connecting portion between the parts induces a high resistance, it is possible to achieve the effect of reducing the heat generation amount as much as possible.

The neck portion 453 can prevent the solder paste applied to the bonding layer 50 from flowing through the conductive layer 40 during the application process or during the reflow process. As a result, performance deterioration of the conductive layer 40 can be prevented. In addition, the bonding of the bonding layer 50 can be secured by intensively bonding to the lower side of the light source 11. Further, the solder paste can be prevented from being transferred to the heat radiation conductive layer 44, thereby preventing a short circuit.

The conductive layer 40 and the insulating layer 20 may be bonded to each other by the action of the metal bonding surface 22. [ However, the conductive layer 40 can be peeled off from the insulating layer 20 due to factors such as high temperature environment applied during the reflow process, inadequate process conditions, and severe use environment. In this case, there is a problem that the heat radiation efficiency drops sharply. As a means for solving this problem, in the embodiment, a plurality of islands 47 which are spaced apart from each other can be provided on the conductive layer provided in a wide plane. The island 47 can prevent peeling between the conductive layer 40 and the insulating layer 20 and between the insulating layer 20 and the heat sink 120 to improve product yield and prolong life.

15 is a sectional view taken along the line B-B 'in Fig.

Referring to FIG. 15, a conductive layer 40 may be provided where the depression 21 is formed. The conductive layer 40 is not provided at the portion where the depression 21 is not provided and may protrude upward relative to the depression 21 as a relative concept as compared with the depression 21. The upwardly protruding region may be referred to as an island 47. The islands 47 may be interspersed in the inner region of the depression 21 when viewed in plan. The island 47 is a region in which a conductive layer is not provided in the conductive layer 40 which can be defined as an inner region of a closed curve when the insulating layer 20 is exposed to the outside, As shown in FIG.

The reason why the peeling phenomenon of the heat sink 120 and the insulating layer 20 and the peeling of the insulating layer 20 and the conductive layer 40 are prevented by the island 47 will be described in more detail do.

In the reflow process, even at low temperatures, the atmosphere reaches several hundreds of degrees. At this time, the conductive layer 40 expands according to a predetermined thermal expansion rate. Therefore, when viewed in a two-dimensional plane, the area of the conductive layer 40 increases. Even if the area of the conductive layer is increased, the conductive layer 40 is not bent sideways or bent downward, so that the conductive layer 40 is lifted upwards, that is, Direction. This force can be called the peeling force.

The peeling force is applied to both the first contact surface between the conductive layer 40 and the insulating layer 30 and the second contact surface of the insulating layer 30 and the heat sink 120. [ When the contact force between the first contact surface and the second contact surface is smaller than the peeling force, any corresponding contact surface can be peeled off.

The inventors of the present invention closely observed such mechanism and studied a method of solving the peeling force. As a result, it has been found that if the conductive layer 40 is allowed to accommodate the expansion of the conductive layer 40 when it expands, the peeling force can be reduced.

In detail, when the conductive layer 40 thermally expands, the island 47 contracts to accommodate the extended area of the conductive layer 40. Then, when viewed in one dimension, the elongated length of the conductive layer 40 between a pair of the islands 47 can be accommodated by the shrinkage deformation of the island 47 provided to the resin material, Can be reduced.

The peeling force applied to the first contact surface between the conductive layer 40 and the insulating layer 30 and the second contact surface between the insulating layer 30 and the heat sink 120 is reduced . Therefore, the peeling of the conductive layer 40 and the insulating layer 30 and the peeling of the insulating layer 30 and the heat sink 120 can all be reduced.

The island 47 may be provided anywhere, if it is the conductive layer 40. For example, any of the conductive conductive layer 45 and the heat radiation conductive layer 44 may be provided. In addition, the islands 47 may be provided in the form of polygons such as triangles, squares, and pentagons. In the examples, a cross section of a rectangle is shown as a preferred form.

If the size of the island 47 is large and the interval between the islands 47 is small, there is a problem that the thermal diffusion ability through the conductive layer 40 is lowered and the electrical resistance of the conductive layer 40 is increased. If the size of the island 47 is large and the interval between the islands 47 is large, the heat spreading ability of the conductive layer 40 is improved and the electric resistance is small, but the peeling force still has a problem. Therefore, the size of the island 47 is small and the interval between the islands 47 is small, so that the heat spreading ability is improved, the electric resistance is reduced, and the peeling force is reduced, .

16 is a perspective view of a lighting apparatus including a light source module.

Referring to FIG. 16, the lighting apparatus 1000 of the embodiment includes a main body 1100 for providing a space in which the light source module 100 is coupled and forming an outer appearance, a power source unit coupled to one side of the main body, (Not shown), and may include a connection portion 1200 connecting to the support portion. The lighting apparatus 1000 of the embodiment can be installed indoors or outdoors. For example, the lighting apparatus 1000 of the embodiment can be used as a street lamp. The main body 1100 may be formed with a plurality of frames 1110 capable of providing space in which at least two light source modules 100 are located. The connection unit 1200 has a built-in power supply unit, and connects the support unit (not shown) for fixing the main unit to the main unit.

The use of the lighting apparatus 1000 of the embodiment can effectively cool the heat generated in the light source module 100 due to the chimney effect and does not use a separate fan, thereby reducing the manufacturing cost.

Hereinafter, a manufacturing method of the light source module will be described in more detail. For convenience of explanation, different reference numerals are given to explain them, but it is to be understood that the functions of the detailed configurations and portions mentioned above are the same.

In manufacturing the light source module, it is necessary to prevent peeling of each layer in the light source module according to the embodiment provided in the thin film process. The peeling of each film includes peeling between the heat sink and the insulating layer and peeling of the insulating layer and the plating layer. The manufacturing method capable of suppressing the peeling and improving the yield of the product and the structure of the light source module manufactured by such a method will be described in detail.

18 is a flowchart illustrating a manufacturing method of the light source module.

Referring to Fig. 18, first, a helix (1200 in Fig. 17) is fabricated (S1). The heat sink may be made of aluminum and die cast. An insulating layer 200 is formed on the surface of the heat sink 1200 (S2). The insulating layer may be provided thin so that the heat of the light source can be well transmitted to the heat sink. The insulating layer 200 is made of resin so that electricity applied to the light source does not flow to the heat sink. The insulating layer is provided with a pattern having a predetermined structure (S3). The pattern includes the conductive unit, and can be said to be observed by the depression 21. The pattern may be provided with an electrically conductive layer (S4). The conductive layer may be provided with a conductive layer through which electricity flows. The conductive layer may be provided with a heat-radiating conductive layer through which heat flows. The pattern may be provided by laser processing to remove the insulating layer to a predetermined depth. Thereafter, the conductive layer may be laminated on the pattern. The conductive layer may be provided in such a manner that the metal film is laminated only on the pattern by a plating method and is not laminated on the insulating layer.

The manufacturing method of the light source module will be described in more detail.

First, Fig. 19 is a view for explaining the manufacturing method of the heat sink in detail.

Referring to FIG. 19, the heat sink manufactured by the die casting method is washed (S11). During the cleaning process, the heat sink may be immersed in an alkaline water tank so that oil components such as oil and the like attached to the surface of the heat sink can be removed. The process of removing the oil component may be performed by other methods. The cleaned heat sink is cleaned to remove the alkaline components (12). A chromate treatment is performed on the surface of the cleaned heat sink to increase the adhesive force of the insulating layer 200 in a subsequent step to form a first metal layer (see 201 in FIG. 17) (S13).

The chromate treatment is also referred to as a chromate treatment, in which the heat sink 1200 is immersed in a chromate so that a film of hydrous chrome oxide is formed on the surface. Since the coating film has no pores, further peeling of the insulating layer 200 provided on the coating film can be prevented. Further, the adhesion of the paint formed on the coating film can be improved. Therefore, the first metal layer 201 may contain chromium as a main component.

The first metal layer 201 may be a thin layer provided on the surface of the heat sink 1200 to have a thickness of about 0.1 탆 and can be interpreted as a part of the heat sink 1200. It is understood that the heat sink 1200 is provided with the first metal layer 201 in a heat sink body different from the first metal layer 201. Thus, for the sake of convenience, both the state in which the first metal layer 201 is provided and the state in which the first metal layer 201 is not provided may be referred to as a heat sink, but the heat sink in a state where the first metal layer 201 is not provided is called a heat sink body It is possible.

Thereafter, it is washed (S14) and dried (S15). The first drying step (S15) is performed for about 20 minutes at 180 degrees, which is for removing moisture and air from the pores on the surface of the heat sink (more specifically, the first metal layer).

Thereafter, the coating material is applied (S16). The powder coating method can be applied to the paint application step (S16). The powder coating method is resistant to heat since high temperature treatment is performed. Therefore, it is possible to prevent the insulating layer from being damaged even in a high temperature environment in the bonding step. If the soldering process is performed at a low temperature, a liquid coating method or a conductive epoxy bonding may be performed. At this time, the thickness of the insulating layer may be 80 to 120 탆.

The insulating layer 200 may be provided on a part of the surface of the first metal layer 201 because the manufacturing cost is high. Since the first metal layer 201 is formed by a plating process, the first metal layer 201 may be provided on the entire surface of the heat sink 1200.

Thereafter, the second drying step (S17) is performed. The second drying process may be performed at the same temperature as the first drying process. This is because, when the second drying process is performed at a higher temperature than the first drying process, a gas that can not be discharged in the first drying process is further generated, which may interfere with the adhesive force of the insulating layer 200.

20 is a flowchart illustrating a process of forming a pattern on the surface of the insulating layer.

Referring to FIG. 20, the heat sink provided with the insulating layer 200 is fixed to the jig (S31). Laser processing is performed on the fixed heat sink 1200 to form a pattern (S32). At this time, the lasers can be overlapped and irradiated. That is, the laser irradiated portion can be irradiated again. It is possible to alleviate the problem caused by the non-uniform etching depending on the energy density of the laser spot.

In the embodiment, an output of 7 W, a frequency of 50 kHz, and a hearing of 50% are used.

Thereafter, the insulating layer may be provided on the surface of the heat sink through the cleaning (S33) and the drying (S34).

21 is a flow chart for providing a conductive layer.

First, the conductive layer is provided in a plating process, and the conductive layer is provided as a plurality of plating layers.

More specifically, the heat sink (not to mention the insulating layer on the surface of the heat sink) transferred from the laser process first undergoes the degreasing step (S41) and the water washing step (S42). This process is to purify the surface of the heat sink which may be present during the transfer process, thereby eliminating the problems that arise in the plating process.

Thereafter, the first copper plating (S43), the water wash (S44), the second copper plating (S45), and the water wash (S46) are performed to provide a plating layer through which electricity flows. The first copper plating (S43) is performed in a plating solution containing high-concentration copper so that copper particles adhere well to metal nuclei or trenches inside the depression (21). The film provided by the first copper plating (S43) may be referred to as a second metal layer (see 202 in Fig. 17).

After the copper particles are plated in the depression 21 by the first copper plating S43, the secondary copper plating S45 is performed in the plating solution having a lower concentration than that of the first primary copper alloy S43 . Since the second copper plating (S45) is additionally plated on the second metal layer (202), it can be performed in a plating solution having a lower concentration than the first copper plating (S43). This allows a third metal layer (see 203 in FIG. 17) to be provided. The second and third metal layers 202 and 203 correspond to the first plating layer 41.

Thereafter, a process of surface-modifying the third metal layer 203 is performed (S47). The surface modification is a process for allowing nickel to be well plated on the copper surface.

The surface modification is also referred to as sensitizing, and includes a step of making the surface of the third metal layer 203 roughened with hydrochloric acid or the like, and then dipping the surface of the third metal layer 203 in a solution containing tin ions to adsorb tin, Palladium < / RTI > solution. Thereby, nickel can be plated well on the surface of the third metal layer 203.

After the water washing step (S48), the nickel plating step (S49) is performed. A fourth metal layer 204 may then be provided on the third metal layer 203. It has been already described that the nickel of the fourth metal layer 204 is intended to facilitate soldering. And the fourth metal layer 204 corresponds to the second plating layer 42.

Thereafter, after the water washing step (S50), gold is plated with a thin film (S51), and the water washing step is performed. The fifth metal layer 203 may be provided by the gold plating step S51. The fifth metal layer 205 may be provided at 0.05 [mu] m. The fifth plating layer 205 corresponds to the third plating layer 43.

The light source module can be completed by soldering the light source 10 to the heat sink as a finished product through the above-described manufacturing process, connecting the electric wires, and then tightening the lens cover.

17 is a cross-sectional view of the periphery of the conductive layer provided by the above-described manufacturing method.

A first metal layer 201 mainly composed of chromium is provided on the surface of the heat sink 1200 and an insulating layer 200 is provided on the surface of the first metal layer 201. A recessed portion 21 is provided in the insulating layer 200 by laser processing and a second metal layer 202 and a third metal layer 203 selectively constituting the copper only in the recessed portion 21, .

The surface of the third metal layer 203 is roughly processed by a surface modification process. A fourth metal layer 204 made of nickel is laminated on the rough surface of the third metal layer 203 and a fourth metal layer 204 made of gold is laminated on the surface of the fourth metal layer 204.

According to the present invention, it is possible to expect many advantages in the production of a lighting device owing to the effect of a rapid manufacturing process, an inexpensive manufacturing cost, an ease of mass production, and an improvement of a product yield, Therefore, it is possible to provide an instrument widely contributing to the diffusion of a lighting apparatus using a light emitting diode.

11: Light source
40: conductive layer
44: heat radiating conductive layer
45: Conducting conductive layer
120, 1200: Heat sink
201: first metal layer
202: second metal layer
203: third metal layer
204: fourth metal layer

Claims (18)

At least one light source for providing light; And
And a body for supporting the light source,
In the body,
A heat sink body that absorbs heat from the light source and emits the heat to the outside;
A first metal layer thinly provided on a surface of the heat sink body;
An insulating layer having electrical insulation property provided on at least a surface of the first metal layer;
A depression for depressing the insulating layer; And
A conductive layer provided in the depression and capable of flowing an electric current,
In the conductive layer,
A copper material layer contacting the bottom of the depression and made of copper; And
And a nickel material layer made of nickel provided on the copper material layer,
In the copper material layer,
A second metal layer contacting the bottom of the depression; And
And a third metal layer on the second metal layer. delete The method according to claim 1,
The nickel material layer is a fourth metal layer,
And a fifth metal layer made of gold and provided on the fourth metal layer. The method of claim 3,
Wherein the fifth metal layer is thinner than other metal layers in the conductive layer. 5. The method of claim 4,
Wherein the interface between the third metal layer and the fourth metal layer is roughened as compared with an interface between the third metal layer and the fourth metal layer. The method according to claim 1,
Wherein the first metal layer is thinner than the other metal layers. The method according to claim 1,
Wherein the second metal layer is thinner than the third metal layer. The method according to claim 1,
Wherein the first metal layer comprises at least chromium. Providing a heat sink body of a first material;
Providing a first metal layer of a second material on the surface of the heat sink body;
Applying an insulating layer of a resin material to at least a part of the surface of the first metal layer;
Providing a predetermined pattern in which the insulating layer is recessed;
Laminating a conductive layer on the pattern; And
And electrically connecting the light source to the conductive layer,
To provide the conductive layer,
Providing a first plating layer of copper on the bottom surface of the pattern;
Modifying a surface of the first plating layer; And
And providing the second plating layer to the first plating layer having been surface-modified. 10. The method of claim 9,
To provide the conductive layer,
A method of manufacturing a light source module, comprising: stacking at least two different metal layers made of different kinds of metals. 10. The method of claim 9,
Wherein the first metal layer is provided on the entire surface of the heat sink. delete 10. The method of claim 9,
In providing the first plating layer,
Plating the second metal layer;
Washing; And
And plating the third metal layer. At least one light source for providing light;
A body supporting the light source; And
A lens cover coupled to an upper surface of the body so as to transmit light emitted from the light source,
A heat sink that absorbs heat from the light source and emits the heat to the outside;
A first metal layer having a material different from that of the inside provided on the surface of the heat sink;
An insulating layer provided on the surface of the heat sink and having electrical insulation properties; And
And a conductive layer provided at least at a recessed portion of the insulating layer and provided at least in a passage region for applying electricity to the light source,
In the conductive layer,
A first plating layer contacting at least the bottom of the depression and made of copper;
A second plating layer made of nickel provided on the first plating layer; And
And a protective layer provided on the second plating layer. 15. The method of claim 14,
Wherein the first plated layer and the second plated layer are surface-modified. 15. The method of claim 14,
Wherein the first plating layer includes a second metal layer and a third metal layer that are sequentially plated. Providing a heat sink body of a first material;
Providing a first metal layer of a second material on the surface of the heat sink body;
Washing the heat sink provided with the first metal layer;
Performing a first drying step of drying the washed water of the heat sink main body;
Applying an insulating layer of a resin material to at least a part of the surface of the first metal layer;
Performing a second drying step of drying the insulating layer;
Degreasing the heat sink provided with the insulating layer;
Providing a predetermined pattern in which the insulating layer is recessed;
Laminating a conductive layer on the pattern; And
And electrically connecting the light source to the conductive layer. 18. The method of claim 17,
Wherein the temperature of the first drying step is higher than the temperature of the second drying step.

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