KR101841341B1 - Lighting source module, fabrication method therefor, and lighting device comprising the same - Google Patents

Abstract

The light source module according to the present invention includes at least one light source for providing light; A body for supporting the light source, the body including a heat sink for absorbing heat from the light source and emitting the light to the outside; An insulating layer having electrical insulation properties provided on at least a part of the surface of the heat sink; And a conductive layer provided on the insulating layer to allow a current to flow therethrough, the conductive layer being provided with a conductive region for providing a passage region for applying electricity to the light source; And a heat radiation conductive layer for diffusing heat caused by the light source. According to the present invention, it is possible to obtain an effect of quick manufacturing process, low manufacturing cost, ease of mass production, improvement of product yield, and resolution of heat radiation problem. Furthermore, it is needless to say that various effects that can be understood by the respective constitutions shown in the specific embodiments of the invention can be obtained.

Description

TECHNICAL FIELD [0001] The present invention relates to a light source module, a method of manufacturing a light source module, and a lighting device including the same,

The present invention relates to a light source module, a method of manufacturing a light source module, and a lighting device including the same.

As indoor or outdoor lighting equipment, incandescent lamps and fluorescent lamps are widely used. The incandescent lamps and fluorescent lamps have a short lifetime and therefore require frequent replacement. The fluorescent lamp can use a longer time than an incandescent lamp, but has a problem of being harmful to the environment, and deterioration may occur over time, and the illuminance may gradually decrease.

As a light source that solves the above problems, a light emitting diode (LED) capable of realizing excellent controllability, fast response speed, high electricity / light conversion efficiency, long life, small power consumption, high brightness, Was introduced. Various types of lighting modules and lighting devices employing the light emitting diodes have been developed.

The light emitting diode (LED) is a type of semiconductor device that converts electrical energy into light. The light emitting diode has advantages such as low power consumption, semi-permanent lifetime, quick response speed, safety, and environmental friendliness compared to conventional light sources such as fluorescent lamps and incandescent lamps. Accordingly, much research has been conducted to replace an existing light source with a light emitting diode, and a light emitting diode has already been used as a light source for various liquid crystal display devices, an electric signboard, and a streetlight.

The light emitting element (hereinafter, the light emitting element mainly refers to a light emitting diode, but is not limited thereto) is used in a form in which a plurality of light emitting diodes are integrated for high luminance implementation. Therefore, the light emitting device is fabricated in the form of a light source module in order to protect from the convenience of assembly, external impact and moisture. In the light source module, since a plurality of light emitting devices are integrated at a high density, higher luminance can be realized, but there is a problem that high heat is generated due to a side effect. Researches for effectively releasing the heat have been conducted.

As a conventional technique for solving the heat dissipation problem under such a background, the registration number 10-1472403 in which the applicant of the present invention is patented is exemplified.

In the light source module according to the present invention, a printed circuit board having a plurality of light emitting devices mounted thereon is coupled to a heat sink. However, since such a manufacturing process requires a plurality of processes, it takes a long time to manufacture and a large cost is required. In addition, a thermal pad is further inserted between the printed circuit board and the heat sink to increase the heat radiation efficiency. However, since the heat transfer of the printed circuit board itself is not excellent, the heat can not be effectively transferred to the heat sink, and the problem of heat dissipation to the light source module with high luminance can not be solved. Further, since the thermal pad must be inserted separately, there is a problem that it takes more time and cost.

It is important that the lighting device be able to emit brighter light. However, as the light source module provides brighter light, more heat is generated, and if the heat is not emitted, the life of the lighting device is lowered.

2 of Korean Patent Registration No. 10-1472403 and related description

The present invention proposes a light source module, a method of manufacturing a light source module, and a lighting device that can solve the above-described problems and can be realized with a rapid manufacturing process and an inexpensive manufacturing cost.

The present invention proposes a light source module, a method of manufacturing a light source module, and a lighting device capable of solving a heat radiation problem while realizing a high luminance.

The present invention proposes a light source module, a method of manufacturing a light source module, and a lighting device which can solve the problem of product yield which may be caused by problems such as short circuit, disconnection, and dropout of parts.

The present invention proposes a light source module, a method of manufacturing a light source module, and a lighting device that can be implemented in a process suitable for mass production.

A light source module according to the present invention includes a heat sink for emitting heat from a light source, an insulating layer provided on a surface of the heat sink, and a conductive layer provided on the insulating layer and flowing a current, A conductive conductive layer for providing a passage region for applying electricity to the light source, and a heat radiation conductive layer for diffusing heat. According to this, even if an insulating layer is provided, the heat generating performance can be improved.

The term " conductive " in the conductive conductive layer is referred to as electric current. On the other hand, the term " conductive " in the above-mentioned heat-radiating conductive layer means that heat is conducted and heat is transmitted or flowed. Electricity does not flow through the heat radiation conductive layer.

The heat dissipation conductive layer may include an internal heat dissipation conductive layer, an external heat dissipation conductive layer, and a bridge connecting the internal heat dissipation conductive layer and the external heat dissipation conductive layer. According to this, since the heat radiation conductive layer is provided as a whole body, heat diffusion can be more effectively performed.

The conductive conductive layer may provide a path through which an external current may flow. The conductive unit connecting the light sources to each other can perform an action of connecting between the light sources. The conductive unit may function as one unit connecting the connector and the light sources to each other. In addition, the conductive unit may be provided to have a predetermined thickness and width, which provides a path for allowing electrical current flow.

In the light source module according to the present invention, a bonding layer is included on a connection surface between the conductive layer and the light source, and a connection portion to which the conductive layer and the light source are connected is connected to the connection portion between the conductive layer and the light source, And a neck portion having a width smaller than that of the extended portion. According to this, defective products due to light source bonding can be prevented. In addition, the yield of the product can be improved in a mass production process.

Each conductive unit may have one end and the other end. Each end may include a connection. These may have connections for the two terminals of the light source. The connection portion may be provided in a substantially T shape having two legs extending in opposite directions. The extending extensions may extend between two adjacent light sources. In other words, the pair of light sources can extend in the direction in which they are connected to each other. The neck portion may be provided at each end of the conductive unit body between the connection portion and the extension portion. The neck portion may be defined as a groove or recessed portion which is contracted when compared with the extension portion and the connection portion. The grooves may be concave provided that the width of the extension gradually decreases. When the light source and the connection portion are connected to each other, the neck portion can prevent a short circuit caused by flowing of a fluid such as a solder paste. Therefore, it is possible to prevent a decrease in yield of a product that may occur when reflow is performed while the light source is placed on the heat sink.

As will be described later, the heat-radiating conductive layer is provided between the outermost heat-radiating conductive layer (that is, the outer heat-radiating conductive layer) between the outermost portion of the conductive portion of the conductive layer and the outer end of the body ) And an inner (inner) radiating conductive layer (that is, the inside radiating conductive layer is located inside the innermost corner of the conductive portion of the conductive layer) lying on the inner side of the conductive conductive layer. The internal heat-dissipating conductive layer and the external heat-dissipating conductive layer may be connected to each other by bridges in order to increase thermal diffusion and heat dissipation. Therefore, the external heat-radiating conductive layer, the internal heat-radiating conductive layer, and the conductive conductive layer can be aligned to the same vertical height of the device.

The external heat-dissipating conductive layer is provided as a plurality of components, but may be connected to each other by a single structure. The internal heat-dissipating conductive layer is also provided as a plurality of components, but they may be connected to each other by a single structure. Thus, thermal diffusion can be enhanced. The external heat-dissipating conductive layer and the internal heat-dissipating conductive layer may be connected to each other by a single body by one or more bridges. Therefore, unlike the conductive conductive layer, all the components of the heat conductive conductive layer can be connected to each other with a single structure. Thus, diffusion of heat due to the light source can be further accelerated. In other words, thermal diffusion of a hot spot (e.g., from a light source, e.g., a point adjacent to an air hole) can be accelerated. As the thermal diffusion accelerates, it can be easily understood that the effect of heat emission is enhanced corresponding to the acceleration of the thermal diffusion.

The heat radiation conductive layer may be substantially provided on substantially the entire surface of the heat sink except for a predetermined gap or width between the heat radiation conductive layer and the conductive conductive layer. Therefore, it is possible to prevent heat absorption and heat emission of the heat sink caused by the insulating layer of the resin material.

The light source module according to the present invention is characterized in that an inner region of the conductive layer includes at least one island provided integrally with the insulating layer and in contact with the conductive layer. According to this, it is possible to prevent the peeling phenomenon caused by the use of the product and to improve the reliability of the product.

The island may be interspersed in an inner region of a portion where the insulating layer is recessed when viewed from a plane. When viewed in a two-dimensional planar structure, the island may be an area of the insulating layer that lies outside the conductive layer, which may be defined as the inner region of the closed curve, and does not have a conductive layer therein. The island may be provided with a predetermined interval. Thus, the connecting region between the conductive layer and the island becomes large, and the bonding force between the conductive layer and the island can be increased.

The island may be provided in all regions where the conductive layer is formed. For example, the island may be provided in all regions where the conduction conductive layer and the heat radiation conductive layer are formed. Additionally, the islands may be provided as polygons such as triangles, squares, and pentagons. The island may have a shape that can increase the bond strength between the island and the conductive layer. In an embodiment, it may be provided as a square.

The insulating layer may be formed on the surface of the heat sink. The insulating layer may be formed on the entire surface of the heat sink. Alternatively, the insulating layer may be formed only on a part of the entire surface. The insulating layer may be provided as a thin film. Therefore, the heat dissipation efficiency of the heat sink can be increased.

The light source module may include a metal bonding surface on a surface where the conductive layer and the insulating layer are in contact with each other.

The metal bonding surface may comprise at least one of a metal nucleus or a trench. The metal bonding surface may be provided in a depression recessed into the insulating layer. The metal bonding surface may be provided on a bottom surface of a depression recessed downward from an upper surface of the insulating layer.

The conductive layer may be provided as a single layer which is preferably selected from among metals selected from the group consisting of copper, nickel, silver, and gold. The conductive layer may be provided by plating the same metal or other metals in multiple layers. The material may preferably be selected from among gum consisting of copper, nickel, silver, and gold. In the case of a multilayer, copper may be provided as a lower layer of the conductive layer, and nickel may be provided as an upper side of the conductive layer.

The conductive layer may further protrude from the upper surface of the insulating layer.

The insulating layer has electrical insulation properties. However, it has no or low thermal insulation properties.

In a preferred embodiment, the body is further provided with a radiating fin and an air guide, and the insulating layer is provided on the surface of the radiating fin and the air guide. When the heat radiating fins and the air guiding portion are formed together with the heat sink as a unit body, the insulating layer may also be formed on the surface of the radiating fin and the air guiding portion. In this case, the insulating layer may be formed on all surfaces of each component, and may be formed on only a part of the entire surface.

The conductive layer may be provided at a depression at which the insulating layer is recessed at a position where the conductive layer is to be provided. The conductive layer may be stacked to a range exceeding the depth of the depression. Therefore, the resistance of the conductive layer can be reduced by increasing the area of the conductive layer through which the current flows. Therefore, the amount of heat generated by the resistor can be reduced.

A method of manufacturing a light source module according to the present invention includes: applying a thin insulating resin layer to at least a part of a surface of a heat sink; providing a metal bonding surface to the insulating layer; Characterized in that it comprises the provision of two conductive layers. Thus, various effects of the present invention can be obtained.

The light source module according to the present invention can be used in a lighting apparatus to obtain a larger industrial advantage.

According to the present invention, since the conductive layer that applies electricity to the light source and the heat radiation conductive layer that diffuses heat are provided on the conductive layer, the heat generating performance can be increased even if the insulating layer is provided.

According to the present invention, by providing the heat radiation conductive layer as a whole, the diffusion of heat can be performed more effectively.

According to the present invention, since the neck portion is included in the portion to which the conductive layer and the light source are connected, it is possible to prevent a product defect due to the light source bonding. In addition, the yield of the product can be improved in a mass production process.

According to the present invention, an island provided integrally with the insulating layer in the inner region of the conductive layer is included, so that the peeling phenomenon caused by use of the product can be prevented. In addition, the reliability of the product can be improved.

According to the present invention, by thinly applying an insulating layer made of a resin to at least a part of the surface of a heat sink, providing a metal bonding surface to the insulating layer, and providing at least two conductive layers spaced apart from each other on the metal bonding surface, A rapid manufacturing process can be performed. In addition, it is possible to solve the problem of lack of thermal diffusion.

That is, according to the present invention, it is possible to obtain an effect of speedy manufacturing process, low manufacturing cost, ease of mass production, improvement of product yield, and resolution of heat radiation problem. Furthermore, it is needless to say that various effects that can be understood by the respective constitutions shown in the specific embodiments of the invention can be obtained.

1 is a perspective view of a light source module according to an embodiment.
2 is an exploded perspective view of the light source module.
3 is a front view of the light source module.
4 is a side view of the light source module.
5 is a bottom view of the light source module.
6 is a cross-sectional view taken along line A-A 'in Fig.
FIG. 7 is an enlarged view of a portion where the light source is placed in FIG. 6; FIG.
8 to 12 are views sequentially showing a manufacturing method of the light source module.
FIG. 13 is a plan view of the light source module of FIG. 13;
FIG. 14 is an enlarged view of a part of the light source in FIG. 13; FIG.
15 is a sectional view taken along the line B-B 'in Fig.
16 is a perspective view of a lighting apparatus including a light source module.

Hereinafter, specific embodiments of the present invention will be described in detail with reference to the drawings. However, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims, It will be easily understood that the present invention is not limited thereto.

The drawings attached to the following embodiments are embodiments of the same invention. However, in order to facilitate understanding of the invention within the scope of the invention, And a specific portion may not be displayed in accordance with the drawings, or may be exaggerated in accordance with the drawings.

FIG. 1 is a perspective view of a light source module according to an embodiment, and FIG. 2 is an exploded perspective view of a light source module.

Referring to FIGS. 1 and 2, the light source module 100 according to the embodiment may include at least one light source 11 for generating light, and a body for supporting the light source 11.

The light source 11 may include all means for generating light by receiving electrical energy. For example, the light source 11 may include a light source in the form of a point light source. Specifically, the light source 11 may include any one of a light emitting diode and a laser diode. Also, the light source 11 may emit light of a different color or a white color by intermingling a plurality of point light sources emitting different colors.

The body is provided as a part that allows the physical and electrical action of the light source 11 so that the light source 11 can be stably operated. The body can effectively dissipate the heat generated by the light source 11. The body may be electrically connected to the light source 11 to supply power to the light source 11.

The body may include a heat sink 120. The light source 11 may be fastened or directly fastened to the heat sink 120 through another member. Preferably, the light source 11 may be fastened to the heat sink 120 for physical coupling, such as supporting its own weight. However, the light source 11 may be fastened to the heat sink 120 with a predetermined insulation layer interposed therebetween in order to insulate the heat sink 120 from the heat sink 120.

A mounting portion 121 on which the light source 11 is mounted may be provided on one surface of the heat sink 120. The heat generated by the light source 11 is rapidly absorbed into the heat sink 120 by the seating part 121. The heat sink 120 may transmit the heat generated by the light source 11 and the light emitted from the light source to the heat dissipation fin 130 when the heat dissipation fin 130 is connected to the other surface of the heat sink 120. [ Of course, the heat dissipation fin 130 can rapidly dissipate heat to the outside. Also, the heat sink 120 itself can quickly release heat to the outside.

The heat sink 120 may be formed of a metal material or a resin material having excellent heat radiation and heat transfer efficiency. It is not limited thereto. For example, the heat sink 120 may be formed of a metal such as Al, Au, Ag, Cu, Ni, Sn, Zn, And iron (Fe). For example, the heat sink 120 may be made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum nitride (AlN), photo sensitive glass (PSG), polyamide 9T PA9T), syndiotactic polystyrene (SPS), metal materials, sapphire (Al2O3), beryllium oxide (BeO), ceramics. The heat sink 120 may be formed by injection molding, etching, or the like. It is not limited thereto.

The heat sink 120 may have a plate shape and a planar shape may be a square shape. In detail, the seating part 121 may be formed by recessing one surface (for example, an upper surface) of the heat sink 120. The lens cover 142 may be seated on the seating part 121. The seating part 121 may be provided in a watertight structure by the outside and the lens cover 142. The light source 11 can be protected against the external environment by the combination of the seating part 121 and the lens cover 142.

A coupling hole 126 through which the coupling member passes may be formed at an edge of the heat sink 120 when the light source module is coupled to an illumination device or the like.

The body may include a heat dissipation fin 130 for improving the heat dissipation efficiency of the heat sink 120. The radiating fin 130 may have a shape for maximizing an area of contact with the air. The heat dissipation fin 130 may receive heat from the heat sink 120 and exchange heat with the ambient air. In detail, the heat radiating fin 130 may be provided in a plurality of plate shapes extending further downward from the other surface (bottom surface) of the heat sink 120. More specifically, the heat radiating fins 130 may be disposed at a plurality of positions with a constant pitch. The width of the heat dissipation fin 130 may be equal to or the same as the width of the heat sink 120 so that the heat of the heat sink 120 can be effectively transmitted. The radiating fin 130 may be formed as one body with the heat sink 120, or may be manufactured as a separate component. The radiating fin 130 may include at least one of a material having excellent heat transfer properties such as aluminum (Al), nickel (Ni), copper (Cu), silver (Ag), and tin (Sn). Preferably, the heat radiating fins 130 may be integrally provided with the same material as the heat sink 120.

3 is a front view of the light source module, and FIG. 4 is a side view of the light source module.

Referring to FIGS. 3 and 4, the heat radiating fins 130 may be arranged long in the width direction (short corner direction) of the heat sink 120. Also, the heat radiating fins 130 may have a predetermined pitch in the longitudinal direction (long edge direction) of the heat sink 120, and a plurality of heat radiating fins 130 may be installed. The central portion 131 of the heat dissipation fin 130 may be recessed toward the heat sink 120 more than the both end portions 133 of the heat dissipation fin 130. [ The light source 11 may be positioned so as to overlap the both ends 133 of the heat radiating fin 130 in the vertical direction. Both end portions 133 of the radiating fin 130 may be formed higher than the center portion 131 of the radiating fin 130. [ According to this structure, the portion where the high heat is transmitted among the various portions of the heat dissipation fin 130 can contact the more air, thereby improving the heat radiation efficiency. In addition, the central portion 131 of the radiating fin 130 can save manufacturing costs.

An air hole 122 may be formed in the heat sink 120. The air hole 122 may be formed to penetrate the heat sink 120 in a vertical direction. Specifically, the air hole 122 may be formed through the heat sink 120 in the direction of the heat dissipation fin 130 from the seating part 121. With this configuration, it is possible to provide a space in which air flows. The air holes 122 may be formed long in the longitudinal direction of the heat sink 120 at a central portion of the heat sink 120. The air holes 122 overlap the cover holes 143 formed in the lens cover 142 in the vertical direction and can communicate with each other.

The light source 11 may be positioned around the air hole 122. Specifically, the light source 11 may be disposed adjacent to the air hole 122 on one side of the heat sink 120 forming the periphery of the air hole 122. Therefore, the air holes 122 can be heated first by the heat generated in the light source 11. [ The air hole 122 can circulate the air by the temperature difference between the inside and the outside of the air hole 122. This circulated air can accelerate the cooling of the heat radiating fin 130 and the heat sink 120. Specifically, the air hole 122 may be vertically overlapped with the central portion 131 of the heat dissipation fin 130. The light source 11 may be positioned so as to be vertically overlapped with both ends 133 of the heat radiating fin 130.

5 is a bottom view of the light source module.

5, an air guide portion 160 extending downward from the heat sink 120 at an edge of the air hole 122 and communicating with the air hole 122 to guide air may be further included have. Here, the lower side assumes that the light source is on and the heat sink fins are on the bottom of the light source. Generally, the air guide extends from the side having the light source to the side having the radiating fin, regardless of the directionality of the light source module.

The air guide 160 may be provided in a columnar shape having a space therein. In other words, the rim of the air guide part 160 may be configured to overlap with the rim of the air hole 122. In other words, the air guide part 160 may have a shape of a chimney surrounding the air hole 122. The air guide 160 may have a substantially rectangular cross section. The vertex portion of the rectangle may be provided in a curved shape.

The air guide unit 160 may be made of a material having a high heat transfer efficiency. For example, the material of the air guide 160 may include at least one of aluminum (Al), nickel (Ni), copper (Cu), silver (Ag), and tin (Sn). The air guide 160 may be formed of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), liquid crystal polymer Amide 9T (PA9T), syndiotactic polystyrene (SPS), metal material, sapphire (Al2O3), beryllium oxide (BeO), ceramics. The air guide 160 may be integrally provided with the same material as the heat sink 120 and the radiating fin 130 by the same process. A die casting process may be applied to the manufacturing process of the parts.

The outer surface of the air guide 160 may be connected to at least a part of the plurality of radiating fins 130. The heat transmitted from the light source 11 to the heat sink 120 and the heat dissipation fin 130 may be transmitted to the air guide 160 through the outer surface of the air guide 160. The air guide portion 160 can further accelerate the air flowing into the air hole 122. A connector hole (see 124 in FIG. 2) through which the connector 190 for supplying power to the light source 11 passes may be formed in the heat sink 120.

6 is a cross-sectional view taken along line A-A 'in Fig. 6 is a cross-sectional view of the portion where the light source 11 is placed, specifically, the portion where the light source is applied with power.

Referring to FIG. 6, an insulating layer 20 may be provided on the surface of the heat sink 120. The insulating layer 20 may be provided over the entire surface of the heat sink 120, but may be provided only partially, but not limited to now. When the heat radiating fin 130 and the air guiding portion 160 are provided as one body with the heat sink 120, an insulating layer 20 is provided on the surface of the heat radiating fin 130 and the air guiding portion 160 . At this time, the entire surface of each component may be provided with an insulating layer or only a part thereof.

According to a preferred embodiment, the heat sink 120, the radiating fin 130, and the heat sink 120 may be provided together by a die casting method, and then an insulating layer 20 may be provided .

The insulating layer 20 may be applied by powder coating. The powder coating method can be carried out by any one of an electrostatic spraying method, an electrostatic brushing method, and a fluidized deposition method. Therefore, the insulating layer 20 may be referred to as a coating insulating layer or a coating insulating layer. According to this, the process can be performed quickly and inexpensively and the yield of the product is increased.

The insulating layer 20 may electrically (not thermally) insulate between the heat sink 120 and the conductive layer 40 to be described later. The conductive layer 40 is electrically conductive and may be electrically connected to the light source 11. The conductive layer 40 may be a path for supplying electricity to the light source 11. Also, the conductive layer 40 may perform a function of rapidly diffusing heat. For this, the conductive layer 40 may be formed of a metal material. For example, at least one of Ag (silver), Au (gold), Cu (copper), and Ni (nickel). Here, Ag (silver) and Au (gold) can be used as the outermost layer of the conductive layer 40 because oxidation can be prevented even if they are exposed to the outside. The same is true in the case of the embodiment.

 The light source 11 may be provided as a vertical type light emitting diode in which two electrodes are formed below. 6 that one electrode is connected to the light source 11 and it is easily anticipated that one electrode is provided below the ground or above the ground. When the vertical light emitting diode is mounted on the conductive layer 40, wire bonding is not necessary.

The conductive layer 40 may be provided in a depression 21 previously provided at a position where the conductive layer 40 is to be provided. The recesses 21 may be provided by etching the insulating layer 20 by laser direct structuring (LDS). The depressed portion 21 may be provided with at least a bottom surface of the inner region with a rough surface having a metal nucleus. The depressions 21 may be spaced apart from one another by the conductive layers 40 connected to the light sources 11. In other words, in order to prevent a short circuit between the electrodes connected to the light source 11, a pair of conductive layers 40 to be provided with a pair of electrodes may be placed inside different depressions 21 .

The depression 21 may be provided with a conductive layer 40. The conductive layer 40 may be provided by performing at least two or more plating processes repeatedly. In the embodiment, Cu (copper), Ni (nickel), and Au (gold) are successively laminated as the conductive layer 40 to form the first plating layer 41, the second plating layer 42, (43).

As a method of providing the insulating layer 20, the depressions 21 and the conductive layer 40, a conductive material such as copper is sputtered on the insulating layer 20 and a conductive material such as electrolytic / electroless plating And then forming a conductive film thereon and etching it. At this time, the depressed portion 21 may be provided to the insulating layer 20 in advance to prevent a short circuit or the like. It is not limited in any way. However, a laser direct structuring process can be more preferably considered because it is possible to realize an inexpensive manufacturing ratio, perform a rapid and precise process, and is suitable for mass production using laser equipment.

The light source 11 may further include a plurality of lenses 141 for shielding the light source 11 and refracting the light generated by the light source 11. The lens 141 can diffuse the light generated by the light source 11. The diffusion angle of the light generated by the light source 11 can be determined according to the shape of the lens 141. For example, the lens 141 can mold the light source 11 in a convex shape. Specifically, the lens 141 may include a material that transmits light. For example, the lens 141 may be formed of transparent silicone, epoxy, and other resin materials. In addition, the lens 141 may be disposed so as to surround the light source 11 so that the light source 11 is isolated from the outside so as to protect the light source 11 from external moisture and impact.

More specifically, for ease of assembly, the lens 141 may be provided on the lens cover 142 formed to correspond to the insulating layer 20. The lens cover 142 may be formed on the upper surface of the insulating layer 20 to correspond to the insulating layer 20. The lens 141 located in the lens cover 142 may be disposed at a position overlapping with the light source 11. [ The lens cover 142 is inserted and seated in the seating part 121, and the light source 11 and the outside can be watertight.

A cover hole 143 communicating with the air hole 122 may be formed in the lens cover 142. Specifically, the cover hole 143 may be formed through the lens cover 142 in the vertical direction.

The insulating layer 20 may include a material capable of efficiently reflecting light. In this case, the light emitted from the light source 11 and the light reflected from the lens cover 142 including the lens 141 may be reflected to the outside to further increase the light utilization efficiency. In addition, a high cooling efficiency can be achieved by reducing the light lost by heat.

Hereinafter, an insulating layer, a depression, and a method of providing a conductive layer which can be included in the embodiment will be described in more detail.

FIG. 7 is an enlarged view of a portion where the light source is placed in FIG. 6. FIG.

Referring to FIG. 7, a metal bonding surface 22 may be formed on the inner surface of the depressed portion 21. It can be said that the metal bonding surface 22 is processed into a surface having a property suitable for the surface of the insulating layer 20 to be laminated with the conductive layer. The metal bonding surface may be provided by irradiating a laser to an area where a conductive layer is provided.

The metal bonding surface 22 may be provided with a metal nucleus to which the metal of the conductive layer 40 may adhere. Further, the surface of the metal bonding surface can be provided by being processed into a lattice-like trench. The metal bonding surface 22 may include at least the bottom surface of the depression 21. The trenches may be provided irregularly. By providing the metal nuclei in the insulating layer, it is possible to further promote the effect of promoting heat transfer through the insulating layer.

The metal bonding surface 22 will be described in detail below. According to the embodiment, the insulating layer is in contact with the heat sink, the conductive layer is in contact with the insulating layer, and the metal bonding surface is provided in the surface in contact with the insulating layer and the conductive layer. Can be improved.

A conductive layer 40 may be laminated on the metal bonding surface 22. At least one plating layer may be laminated on the conductive layer 40. For example, the first plating layer 41 made of copper, the second plating layer 42 made of nickel, and the third plating layer 43 made of gold or silver may be included. The first plating layer 41 may be deposited to a thickness of 10 to 20 micrometers. The second plating layer 42 may be deposited to a thickness of 5 to 15 micrometers. The third plating layer 43 may be deposited to a thickness of about 0.1 to 0.01 micrometer. The third plating layer 43 may cause an increase in material cost and may not be stacked. However, it is preferable that the third plating layer 43 is provided as a thin film for preventing oxidation and protection.

The first plating layer 41 located on the lowermost side of the conductive layer 40 serves as an electrically conductive role layer for reducing the electric resistance to reduce the amount of heat generated. For this, the first plating layer 41 may be made of copper. The first plating layer 41 can be made thickest among the plating layers so as to secure sufficient electric conduction characteristics. In addition to copper, metals with high electrical conductivity may be used.

The second plating layer 42 lying in the middle of the conductive layer 40 serves as a soldering role layer for improving the quality of soldering. For soldering, the molten solder is well spread over the entire surface of the base material and the solder must diffuse well on the surface of the base material. Nickel can be used as a metal for securing the characteristics of the soldering.

The outermost third plating layer 43 of the conductive layer 40 functions as a protective role layer for protecting the plating layers 41 and 42 therein. The third plating layer 43 may use gold that is not oxidized or discolored. In the case of silver, there is a risk of discoloration, which is undesirable because it can penetrate into the silver LED package later and chemically react with the internal parts of the light emitting portion to lower the luminous efficiency. Since the third plating layer 43 performs the function of protection, it can be provided as the thinnest layer. It is possible to provide only the third plating layer 43 without providing the second plating layer 42, but it is not preferable from the viewpoint of cost. Since the third plating layer 43 is provided in a very thin layer, the second plating layer 42 does not interfere with the third plating layer 43 during soldering.

The third plating layer 43 may be provided with a resin. In this case, the resin may be laminated in a manner other than plating. The resin is not covered with the soldered portion, so that the soldering can be prevented from being hindered.

A bonding layer 50 may be provided on the conductive layer 40. The light source 11 may be disposed on the bonding layer 50. The bonding layer 50 may be a low temperature solder paste which can be soldered at a low temperature. For example, the OM525 can be used. The bonding layer may be formed by passing a reflow machine in a state where the light emitting device is mounted on the upper side to which the low temperature solder paste is applied. Soldering at a low temperature can prevent peeling between the heat sink 120 and the insulating layer 20 and peeling between the insulating layer 20 and the conductive layer 40. Accordingly, the reliability of the product and the yield of the product are improved, and deterioration of the material due to use over a long period of time can be prevented.

8 to 12 are views for explaining the manufacturing method of the light source module in detail in order.

Referring to FIG. 8, the insulating layer 20 may be provided on a body manufactured by way of example, a die-casting method. The insulating layer 20 may be applied by powder coating. The insulating layer may be provided as a resin-containing material after the molding is completed. The powder coating method can be carried out in more detail by any one of electrostatic spraying method, electrostatic brush method, and fluidized deposition method. Therefore, the insulating layer 20 may be referred to as a coating insulating layer or a coating insulating layer. The thickness of the coating insulation layer may be 60 to 80 micrometers. However, the thickness is not limited to this, and various values can be selected according to the insulation performance, heat radiation performance, and process variables. In the embodiment, the light source is a light-emitting diode, a commercial power source is connected, and insulation and heat dissipation are secured in a case where the light source is suitably used in an external environment.

The insulating layer 20 may be subjected to a laser direct structuring process to laminate the conductive layer 40 on at least a part of its surface. The direct laser structuring process may be performed before the plating step, and may be performed by irradiating a laser beam onto the surface of the insulating layer 20 where the conductive layer is to be plated. The area to be plated on the surface of the resin molded article is modified by the laser irradiation, and it can have properties suitable for plating. For this purpose, the insulating layer 20 may contain a nucleating agent for direct laser structuring (hereinafter, simply referred to as a nucleating agent) capable of forming metal nuclei by a laser, A predetermined pattern may be formed in order to provide a plating layer on the inner surface of the substrate.

First, a case where a nucleating agent is contained in the insulating layer 20 will be described.

The resin molding providing the insulating layer 20 may contain a nucleating agent. When the nucleating agent receives the laser, the nucleating agent decomposes and the metal nucleus can be generated. Further, the area to be plated to which the laser is irradiated may have a rough surface. Due to the presence of such metallic nuclei and surface roughness, the area to be plated which is laser modified can be adapted for plating. The metal nucleus may refer to a nucleus to which the metal is attached in a subsequent plating step.

As the nucleating agent, a metal oxide having a spinel structure, a heavy metal complex oxide spinel such as copper chromium oxide spinel, a copper salt such as copper hydroxide, phosphate, copper sulfate, copper sulfate or cuprous thiocyanate can be used . As the material of the insulating layer 20, a polyester-based resin may be used. This is because the heat sink 120, the insulating layer 20, and the conductive layer (not shown), which can be generated by the heat applied in the bonding process of the light source 11, 40 can be prevented from being peeled off.

Next, a case where a predetermined pattern is formed on the inner surface of the depression 21 will be described. Even if the resin structure providing the insulating layer does not contain a nucleating agent, the conductive layer 40 is formed in the insulating layer 20 by forming a trench line in a predetermined pattern exemplified by a lattice pattern in the region to be plated . The trench line can effectively promote adhesion of the metal to the plating target region on the surface of the resin structure, and can perform the plating process. The trench line may be provided with at least two types of intersecting trenches.

The step of forming a trench line of a predetermined pattern by irradiating a laser beam onto a region to be plated on the surface of the insulating layer 20 may be performed by irradiating a laser beam onto a region to be plated on the surface of the insulating layer.

9 is a view showing that the depression is provided in the insulating layer.

Referring to FIG. 9, as described above, a laser may be used as a means for providing the depression 21 in the insulating layer 20. For example, YAG (yttrium aluminum garnet), YVO4 (yttrium or thovanadate), YB (ytterbium), CO ₂ , etc. may be used as the medium for providing the laser. The wavelength of the laser may be, for example, 532 nm, 1064 nm, 1090 nm, 9.3 μm, 10.6 μm, or the like. An algorithm for recognizing and processing a three-dimensional shape when machining with a laser can be used. For example, at least a body including the heat sink 120 may be recognized as a three-dimensional recognition program, and the processing height of the laser may be controlled by dividing the body into several steps according to the height. The output value of the laser may be, for example, about 2W to about 30W.

As described above, the metal bonding surface 22 processed by the laser has at least one of a metal core, a rough surface, and a trench so that the conductive layer 40 can be plated in a subsequent process.

Fig. 10 is a view showing the provision of the conductive layer in the depression. In the embodiment, the conductive layer 40 has three layers 41, 42 and 43 which are laminated.

Referring to FIG. 10, a step of plating the metal on the metal bonding surface 22 in an electroless manner to provide the conductive layer 40 may be performed. Of course, other plating methods may be performed. The conductive layer 40 may be copper, nickel, gold, silver, or a combination thereof. The conductive layer may be a single layer or a laminated structure. In the laminated structure, each layer may be a different metal or may be the same metal. In the embodiment, three layers of copper, nickel, and gold are sequentially laminated.

As an example, a case where a first plating layer 41 provided with copper is provided will be described in detail.

The heat sink 120 provided with the metal bonding surface 22 is immersed in the electroless copper plating solution. At this time, the radiating fin 130 and the air guide 160 can be immersed together. For example, the aqueous electroless plating solution for electroless copper may contain, based on 1 liter of deionized water, about 55 ml to about 65 ml of copper bath / supplements, about 55 ml to about 65 ml of alkali supplement, about 15 ml 20 ml, stabilizer about 0.1 ml to about 0.2 ml, and formaldehyde about 8 ml to about 10 ml.

From about 6 parts by weight to about 12 parts by weight of copper sulfate, from about 1 part by weight to about 1.5 parts by weight of polyethylene glycol, from about 0.01 to about 0.02 part by weight of stabilizer, and from about 78 parts by weight of water, To about 80 parts by weight.

The alkali supplements may contain, for example, from about 40 parts by weight to about 50 parts by weight of sodium hydroxide, from about 0.01 part by weight to about 0.02 part by weight of stabilizer, and from about 50 parts by weight to about 60 parts by weight of water.

The complexing agent may contain, for example, from about 49 to about 50 parts by weight of sodium hydroxide, from about 0.01 to about 0.02 part by weight of stabilizer, and from about 50 to about 51 parts by weight of water.

The stabilizer may include, for example, from about 0.2 parts by weight to about 0.3 parts by weight of potassium selenocyanate, from about 5 parts by weight to about 6 parts by weight of potassium cyanide, from about 0.3 to about 0.4 parts by weight of sodium hydroxide, Parts by weight to about 93 parts by weight.

For example, in order to provide the first plated layer 410 made of copper, the catalyst-imparted resin structure is coated on the electroless copper plating solution at a temperature of about 41 degrees to about 55 degrees, It can be washed with water after soaking at a deposition rate of 10 min.

Thereafter, the plating process can be further performed by repeatedly providing another plating layer with a plating solution.

The conductive layer 40 may be deposited to a depth exceeding the depth of the depression 21. According to this, it is possible to reduce the resistance of the conductive layer 40 by increasing the area to be energized, and reduce the amount of heat generated by the resistance. Of course, the scope of the present invention is not limited to such a configuration.

11 is a view showing that the bonding layer is provided.

Referring to FIG. 11, the bonding layer 50 may be coated with a low-temperature solder paste on the conductive layer 40. Also, it can be provided by placing the light source 11 at a position where electrodes are aligned on the low-temperature solder paste, and then passing the reflow machine. During the reflow process, unnecessary portions of the low-temperature solder paste are removed, and conductive components remain, so that the conductive layer 40 and the light source 11 can be energized.

As the low-temperature solder paste, OM525 which can be used at about 160 degrees can be used. A relatively low-temperature atmosphere is formed during the reflow process, so that the peeling of the insulating layer 20 and the heat sink 120 and the peeling of the conductive layer 40 and the insulating layer 20 can be suppressed. This can improve product yield and reliability.

12 shows that a lens is further provided on the upper side of the light source.

A lens 141 is provided above the light source 11. The lens 141 shields the light source 11 and can refract and diffuse the light generated by the light source 11. The diffuse angle of the light generated by the light source 11 can be determined according to the shape of the lens 141 (see FIG. 12). For example, the lens 141 can mold the light source 11 in a convex shape. Specifically, the lens 141 may include a material that transmits light. For example, the lens 141 may be formed of transparent silicone, epoxy, and other resin materials. The lens 141 may be disposed so as to surround the light source 11 so as to be isolated from the external environment so as to protect the light source 11 from external moisture and impact.

More specifically, for ease of assembly, the lens 141 may be disposed on the lens cover 142 formed to correspond to the insulating layer 20. The lens cover 142 (see FIG. 6) may be formed on the upper surface of the insulating layer 20 to correspond to the insulating layer 20. The lens 141 located in the lens cover 142 may be disposed at a position overlapping with the light source 11. [ The lens cover 142 is seated inside the seat part 121 and can tightly seal the light source 11 and the outside.

13 is a plan view of the light source module. 13 shows the planar structure of the conductive layer which is shown without the lens cover 142 and which is not shown in the other drawings in more detail.

Referring to FIG. 13, as described above, the light source module 100 according to the embodiment may be provided with a conductive layer 40. As described above, the conductive layer 40 plays a role of a path for applying electricity to the light source 11, and the conductive layer 40 according to the embodiment diffuses heat to enhance the effect of heat emission. Can be performed. According to this technical idea, the heat radiation efficiency of the light source module can be further improved, and even when the insulating layer 20 is provided thick, heat radiation performance can be prevented from being a problem.

In detail, the conductive layer 40 is provided with a conductive conductive layer 45 through which electricity can flow along the path of the light source 11, And a heat dissipation conductive layer 44 that can enhance the heat dissipation effect.

The conductive conductive layer 45 may provide a path through which electricity is externally applied. The conductive unit body 49 (see FIG. 14), which can connect the light sources 11 to each other, can play a role of connecting between the light sources 11. The conductive unit body 49 may function as a single unit that connects the connector and the light source to each other. In addition, the conductive unit body 49 may be provided with a predetermined thickness and width to provide a passage through which electricity flows.

The heat dissipation conductive layer 44 may serve to rapidly diffuse (transfer) the heat generated by the light source 11 along the surface of the heat sink 120, rather than providing a path through which electricity flows. The insulating layer 20 is provided as a resin molded body and may have insulating properties. The insulating layer 20 may be lower in electrical conductivity as well as in heat transfer compared to metal. Even in this case, the heat can be diffused along the heat radiation conductive layer 44 in order to release the heat quickly. The same effect can be obtained in the heat radiation conductive layer 44 as well as the heat diffusion.

The heat radiation conductive layer 44 is provided with an external heat radiation conductive layer 442 which is placed outside the conductive layer 45 (more precisely, between the outermost portion of the conductive portion of the conductive layer 45 and the external end portion of the body) And an internal heat-radiating conductive layer 441 placed inside the conductive conductive layer 45 (more precisely, inside the innermost angle of the conductive portion of the conductive layer 45). The internal heat-dissipating conductive layer 441 and the external heat-dissipating conductive layer 442 may be connected to each other by a bridge 46 to further enhance heat diffusion and heat dissipation. The external heat-radiating conductive layer 442 has a plurality of individual components, but may be provided as a single structure that is connected to each other. The internal heat-radiating conductive layer 441 has a plurality of individual components, but may be provided as a single structure connected to each other. According to this, there is an advantage that diffusion of heat can be promoted. The external heat-radiating conductive layer 442 and the internal heat-radiating conductive layer 441 may be connected to each other by one or more bridges 46. Therefore, unlike the conductive conductive layer 45, the entire heat conductive conductive layer 44 can be connected to each other as a single structure. According to this, diffusion of heat generated in the light source 11 can be further promoted. In other words, the effect of promoting the diffusion of heat to any cold position, for example, the adjacent position of the air hole 122, at a certain hot position, for example, the position of the light source 11, can be obtained. It can be easily predicted that the effect of heat emission is correspondingly enhanced if diffusion of heat is promoted.

The heat radiation conductive layer 44 may be provided substantially on the entire surface of the heat sink 120, except for a gap with respect to the conductive conductive layer 45 or a distance in the width direction. Accordingly, the heat absorbing effect of the heat sink 120, which may be caused by the insulating layer 20 made of a resin material, and the phenomenon of deterioration of the heat releasing effect can be improved.

FIG. 14 is an enlarged view of a part of the light source in FIG. 13; FIG.

Referring to Fig. 14, one end of one of the conductive unit bodies 49 may face the other end of the other conductive unit body 49 with the bridge 46 interposed therebetween. Here, the meaning of confronting may include meaning that the light source 11 is correspondingly positioned to supply current to different electrodes. 14 shows a gap or a widthwise distance between the heat-radiating conductive layers 44 surrounding the conductive-conductive layer 45. Fig. In other words, there is no contact between the heat radiation conductive layer 44 surrounding the conductive conductive layer 45.

The conductive unit body 49 has one end and the other end. 14, two different conductive units 49 are shown. However, since Fig. 14 is a partially enlarged view, one end of each conductive unit is shown. Each end may include a connection portion 451 and connection portions 451 of the conductive unit bodies 49 facing each other. They form a connection for the two terminals of the light source. As shown in Fig. 14, the connection portion 451 may be provided in a substantially T shape having two legs extending in opposite directions.

The conductive unit body 49 includes an extension 452 extending in a direction connecting the pair of light sources 11 so that the ends of the conductive unit body 49 can face each other. A neck portion 453 provided at an end of the conductive unit body 49 may be included between the connection portion 451 and the extension portion 452. [ The neck portion 453 may be defined as a portion formed with recesses or grooves 454 provided with depressions or grooves having a width that gradually decreases as compared with the extension portions 452 or the connection portions 451. The neck portion 453 can prevent a problem such as a short circuit due to flow of a fluid material such as solder paste during the connection process of the light source 11 and the connection portion 451. [ This is advantageous in that the yield reduction of the product, which may occur due to the reflow process in which the light source 11 is mounted on the heat sink 120, can be prevented in advance.

The width w1 of the connecting portion 451 may be wider than the width w2 of the extending portion 452. [ The width w3 of the neck portion 453 may be narrower than the width of the extending portion 452. [

The largest width of the connection portion 451 can prevent the connection failure between the light source 11 and the conductive unit body 49. In addition, considering that the connecting portion between the parts induces a high resistance, it is possible to achieve the effect of reducing the heat generation amount as much as possible.

The neck portion 453 can prevent the solder paste applied to the bonding layer 50 from flowing through the conductive layer 40 during the application process or during the reflow process. As a result, performance deterioration of the conductive layer 40 can be prevented. In addition, the bonding of the bonding layer 50 can be secured by intensively bonding to the lower side of the light source 11. Further, the solder paste can be prevented from being transferred to the heat radiation conductive layer 44, thereby preventing a short circuit.

The conductive layer 40 and the insulating layer 20 may be bonded to each other by the action of the metal bonding surface 22. [ However, the conductive layer 40 can be peeled off from the insulating layer 20 due to factors such as high temperature environment applied during the reflow process, inadequate process conditions, and severe use environment. In this case, there is a problem that the heat radiation efficiency drops sharply. As a means for solving this problem, in the embodiment, a plurality of islands 47 which are spaced apart from each other can be provided on the conductive layer provided in a wide plane. The island 47 can prevent peeling between the conductive layer 40 and the insulating layer 20 and between the insulating layer 20 and the heat sink 120 to improve product yield and prolong life.

15 is a sectional view taken along the line B-B 'in Fig.

Referring to FIG. 15, a conductive layer 40 may be provided where the depression 21 is formed. The conductive layer 40 is not provided at the portion where the depression 21 is not provided and may protrude upward relative to the depression 21 as a relative concept as compared with the depression 21. The upwardly protruding region may be referred to as an island 47. The islands 47 may be interspersed in the inner region of the depression 21 when viewed in plan. The island 47 is a region in which a conductive layer is not provided in the conductive layer 40 which can be defined as an inner region of a closed curve when the insulating layer 20 is exposed to the outside, As shown in FIG.

The reason why the peeling phenomenon of the heat sink 120 and the insulating layer 20 and the peeling of the insulating layer 20 and the conductive layer 40 are prevented by the island 47 will be described in more detail do.

In the reflow process, even at low temperatures, the atmosphere reaches several hundreds of degrees. At this time, the conductive layer 40 expands according to a predetermined thermal expansion rate. Therefore, when viewed in a two-dimensional plane, the area of the conductive layer 40 increases. Even if the area of the conductive layer is increased, the conductive layer 40 is not bent sideways or bent downward, so that the conductive layer 40 is lifted upwards, that is, Direction. This force can be called the peeling force.

The peeling force is applied to both the first contact surface between the conductive layer 40 and the insulating layer 30 and the second contact surface of the insulating layer 30 and the heat sink 120. [ When the contact force between the first contact surface and the second contact surface is smaller than the peeling force, any corresponding contact surface can be peeled off.

The inventors of the present invention closely observed such mechanism and studied a method of solving the peeling force. As a result, it has been found that if the conductive layer 40 is allowed to accommodate the expansion of the conductive layer 40 when it expands, the peeling force can be reduced.

In detail, when the conductive layer 40 thermally expands, the island 47 contracts to accommodate the extended area of the conductive layer 40. Then, when viewed in one dimension, the elongated length of the conductive layer 40 between a pair of the islands 47 can be accommodated by the shrinkage deformation of the island 47 provided to the resin material, Can be reduced.

The peeling force applied to the first contact surface between the conductive layer 40 and the insulating layer 30 and the second contact surface between the insulating layer 30 and the heat sink 120 is reduced . Therefore, the peeling of the conductive layer 40 and the insulating layer 30 and the peeling of the insulating layer 30 and the heat sink 120 can all be reduced.

The island 47 may be provided anywhere, if it is the conductive layer 40. For example, any of the conductive conductive layer 45 and the heat radiation conductive layer 44 may be provided. In addition, the islands 47 may be provided in the form of polygons such as triangles, squares, and pentagons. In the examples, a cross section of a rectangle is shown as a preferred form.

If the size of the island 47 is large and the interval between the islands 47 is small, there is a problem that the thermal diffusion ability through the conductive layer 40 is lowered and the electrical resistance of the conductive layer 40 is increased. If the size of the island 47 is large and the interval between the islands 47 is large, the heat spreading ability of the conductive layer 40 is improved and the electric resistance is small, but the peeling force still has a problem. Therefore, the size of the island 47 is small and the interval between the islands 47 is small, so that the heat spreading ability is improved, the electric resistance is reduced, and the peeling force is reduced, .

16 is a perspective view of a lighting apparatus including a light source module.

Referring to FIG. 16, the lighting apparatus 1000 of the embodiment includes a main body 1100 for providing a space in which the light source module 100 is coupled and forming an outer appearance, a power source unit coupled to one side of the main body, (Not shown), and may include a connection portion 1200 connecting to the support portion. The lighting apparatus 1000 of the embodiment can be installed indoors or outdoors. For example, the lighting apparatus 1000 of the embodiment can be used as a street lamp. The main body 1100 may be formed with a plurality of frames 1110 capable of providing space in which at least two light source modules 100 are located. The connection unit 1200 has a built-in power supply unit, and connects the support unit (not shown) for fixing the main unit to the main unit.

The use of the lighting apparatus 1000 of the embodiment can effectively cool the heat generated in the light source module 100 due to the chimney effect and does not use a separate fan, thereby reducing the manufacturing cost.

According to the present invention, it is possible to expect many advantages in the production of a lighting device owing to the effect of a rapid manufacturing process, an inexpensive manufacturing cost, an ease of mass production, and an improvement of a product yield, Therefore, it is possible to provide an instrument widely contributing to the diffusion of a lighting apparatus using a light emitting diode.

11: Light source
40: conductive layer
44: heat radiating conductive layer
45: Conducting conductive layer
120: Heat sink

Claims (17)

At least one light source for providing light;
And a body for supporting the light source,
In the body,
A heat sink that absorbs heat from the light source and emits the heat to the outside;
An insulating layer provided on at least a part of the surface of the heat sink and having an electrically insulating property including a resin material; And
A conductive layer provided on the insulating layer and capable of flowing a current,
In the conductive layer,
A conduction conductive layer for providing a passage region for applying electricity to the light source; And
And a heat radiation conductive layer for diffusing heat caused by the light source,
The conductive layer is placed in a depression provided with the insulating layer being recessed
Wherein at least one island is included in the interior region of the depression,
The island And provided so as to protrude upward from the inner region of the depression,
And a side surface of the island is in contact with a side surface of the conductive layer. The method according to claim 1,
And a metal bonding surface provided on a surface where the conductive layer and the insulating layer are in contact with each other. The method according to claim 1,
In the heat radiation conductive layer,
An external heat radiation conductive layer placed outside the conductive conductive layer; And
And an internal heat-dissipating conductive layer disposed inside the conductive conductive layer. The method of claim 3,
And a bridge connecting the external heat-dissipating conductive layer and the internal heat-dissipating conductive layer. The method according to claim 1,
Wherein the conductive conductive layer comprises at least two or more conductive unit pieces spaced apart from each other. 6. The method of claim 5,
In the conductive unit,
An extension extending in a direction to connect the light sources that are spaced apart from each other;
A connecting portion which is placed at an end of the extending portion and connected to the light source; And
And a neck portion provided concavely adjacent to the connection portion. The method according to claim 6,
Wherein the connecting portion is larger in width than the extending portion and the neck portion. The method according to claim 1,
Wherein the conductive layer comprises at least two plated layers stacked. delete delete At least one light source for providing light;
And a body for supporting the light source,
In the body,
A heat sink that absorbs heat from the light source and emits the heat to the outside;
An insulating layer of electrically insulating property of a resin material provided on a surface of the heat sink; And
And a conductive layer provided on the insulating layer and providing a path for applying electricity to at least the light source,
Wherein the conductive layer includes at least one island integrally provided with the insulating layer and in contact with a side surface of the conductive layer and being shrunk and deformed upon expansion of the conductive layer. 12. The method of claim 11,
Wherein the conductive layer comprises a conductive unit,
In the conductive unit,
An extension extending in a direction to connect the light sources that are spaced apart from each other;
A connection part which is placed at an end of the extended part and connected to the terminal of the light source; And
And a neck portion provided concavely adjacent to the connection portion. At least one light source for providing light;
And a body for supporting the light source,
In the body,
A heat sink that absorbs heat from the light source and emits the heat to the outside;
An insulating layer provided on the surface of the heat sink and having electrical insulation properties;
A conductive layer provided at a depressed portion of the insulating layer and provided at least in a passage region for applying electricity to the light source; And
And a bonding layer interposed between the conductive layer and the light source,
Wherein at a portion of the conductive layer that is connected to the light source,
A connection portion to which the conductive layer and the light source are connected;
An extension extending to connect a pair of the light sources; And
And a neck portion provided between the extension portion and the connection portion and narrower in width than the extension portion and the connection portion and preventing flow of the bonding layer during manufacturing. 14. The method of claim 13,
And an inner region of the conductive layer includes at least one island provided integrally with the insulating layer and in contact with the conductive layer. 14. The method of claim 13,
Wherein the connecting portion is larger in width than the extending portion. A lighting device in which the light source module of any one of claims 1 to 8, and 11 to 15 is used. Providing a heat sink;
Applying an insulating layer of a resin material to at least a portion of the surface of the heat sink;
Providing the insulating layer with a metal bonding surface by laser machining;
Providing at least two conductive layers spaced apart from each other on the metal bonding surface;
Applying a solder paste to the conductive layer; And
Placing a light source on the conductive layer, passing the light source through a reflow machine, and fastening the light source to the conductive layer,
In the provision of the metal bonding surface, the inner region of the conductive layer is processed to include at least two islands projecting upward from the metal bonding surface.

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