KR20180037750A - Lighting source module, and lighting device comprising the same - Google Patents

Abstract

A light source module according to the present invention comprises: a light source providing light; a heat sink supporting the light source on one surface thereof, and absorbing heat from the light source to emit the heat to the outside; and a pin extending from the other surface of the heat sink. The pin includes: at least two first pins provided at a rear part of the heat sink, and having a predetermined pitch in the longitudinal direction of the heat sink; and at least two second pins provided at a front part of the heat sink, and having the predetermined pitch in the longitudinal direction of the heat sink. An opening part which allows an air flow through a space between the first pin and the second pin is further included by opening a space part between the first pin and the second pin. The light source module according to the present invention enhances a cooling effect.

Description

[0001] The present invention relates to a light source module and a lighting device including the same,

The present invention relates to a light source module and a lighting device including the same.

As indoor or outdoor lighting equipment, incandescent lamps and fluorescent lamps are widely used. The incandescent lamps and fluorescent lamps have a short lifetime and therefore require frequent replacement. The fluorescent lamp can use a longer time than an incandescent lamp, but has a problem of being harmful to the environment, and deterioration may occur over time, and the illuminance may gradually decrease.

As a light source that solves the above problems, a light emitting diode (LED) capable of realizing excellent controllability, fast response speed, high electricity / light conversion efficiency, long life, small power consumption, high brightness, Was introduced. Various types of lighting modules and lighting devices employing the light emitting diodes have been developed.

The light emitting diode (LED) is a type of semiconductor device that converts electrical energy into light. The light emitting diode has advantages such as low power consumption, semi-permanent lifetime, quick response speed, safety, and environmental friendliness compared to conventional light sources such as fluorescent lamps and incandescent lamps. Accordingly, much research has been conducted to replace an existing light source with a light emitting diode, and a light emitting diode has already been used as a light source for various liquid crystal display devices, an electric signboard, and a streetlight.

The light emitting element (hereinafter, the light emitting element mainly refers to a light emitting diode, but is not limited thereto) is used in a form in which a plurality of light emitting diodes are integrated for high luminance implementation. Therefore, the light emitting device is fabricated in the form of a light source module in order to protect from the convenience of assembly, external impact and moisture. In the light source module, since a plurality of light emitting devices are integrated at a high density, higher luminance can be realized, but there is a problem that high heat is generated due to a side effect. Researches for effectively releasing the heat have been conducted.

As a conventional technique for solving the heat dissipation problem under such a background, the light emitting device module of Patent Registration No. 10-1472403 filed by the applicant of the present invention is exemplified.

In the light source module according to the present invention, a printed circuit board having a plurality of light emitting devices mounted thereon is coupled to a heat sink. However, since such a manufacturing process requires a plurality of processes, it takes a long time to manufacture and a large cost is required.

In addition, a thermal pad is further inserted between the printed circuit board and the heat sink to increase the heat radiation efficiency. However, since the heat transfer of the printed circuit board itself is not excellent, the heat can not be effectively transferred to the heat sink, and the problem of heat dissipation to the light source module with high luminance can not be solved. Further, since the thermal pad must be inserted separately, there is a problem that it takes more time and cost.

Also, the light source module according to the above cited invention has a problem that the pin obstructs the flow path. For example, there is a problem that the fin is elongated in the width direction to prevent the outside air from flowing in the longitudinal direction of the heat sink, thereby hindering heat radiation effect at the center of the heat sink.

In addition, the light source module according to the cited invention interferes with the air flow to the air guide portion, thereby hindering the convection cooling of the fin.

Korean Patent No. 10-1472403

The present invention proposes a light source module capable of enhancing a cooling effect through a heat sink.

The present invention proposes a light source module in which heat of a light source can be uniformly cooled through a heat sink.

The present invention proposes a light source module capable of reducing the manufacturing cost.

A fin extending from the other surface of the heat sink is provided in order to dissipate heat from the light source in order to increase the cooling effect of the light source module. The fin provided on a rear portion of the heat sink, At least two first pins having a pitch of; And at least two second pins provided at a front portion of the heat sink and having a predetermined pitch in the longitudinal direction of the heat sink.

The gap between the first pin and the second pin is opened, allowing the air flow through the gap between the first pin and the second pin. According to this, it is possible to increase the turbulence at the surface of the heat sink and the fin, so that the cooling can be performed more smoothly.

The fin extends in the width direction of the heat sink. According to this, a vertical flow collision can be caused so that turbulence can be generated more strongly.

The first fin and the second fin are positioned in correspondence to the front and rear sides of the heat sink with respect to the opening portion so that a sufficient cooling action can be performed for each light source corresponding to the front and rear.

The opening may be provided in the entire area in the longitudinal direction of the heat sink to obtain a cooling effect for the entire area of the heat sink.

By providing the first pin or the second fin in ten, the heat of the light source can be uniformly cooled, and the manufacturing cost can be reduced.

The heat sink may be cut to form a long air hole in the longitudinal direction of the heat sink, so that cooling of the center portion can be performed smoothly.

The opening portion can improve the surface cooling effect of the heat sink with a part of the bottom surface of the heat sink as a boundary.

At least two first fins provided on one side of the heat sink so as to enhance the cooling effect of the light source module; And at least two second pins provided on the other side of the surface of the heat sink and spaced apart from the first pin. Also, the heat sink includes an air hole through which the heat sink is cut and is provided long in the longitudinal direction of the heat sink, through which the outside air passes. According to this, the cooling effect on the central portion of the heat sink which lacks the flow can be maximized.

An opening portion in which an interval between the first pin and the second fin is opened is provided to maximize the flow of outside air to the center of the heat sink.

And a protrusion provided on the other surface of the heat sink and placed on an outer circumference of the air hole and spaced apart from the fin.

An insulating layer having electrical insulation properties provided on at least a part of the surface of the heat sink; And a conductive layer provided on the insulating layer to allow a current to flow therethrough, thereby promoting thermal diffusion to the entire area of the heat sink, thereby further increasing the cooling effect.

According to the present invention, since the entire surface of the heat sink can be subjected to an air flow, the cooling effect can be maximized.

According to the present invention, since one light source is designed to have a pair of fins corresponding to each other, an equal cooling effect can be obtained, thereby preventing local heat concentration.

According to the present invention, since the heat sink can be made small due to efficient cooling, the manufacturing cost can be reduced.

1 is a perspective view of a light source module according to an embodiment.
2 is an exploded perspective view of a light source module according to an embodiment.
3 is a front view of the light source module according to the embodiment;
4 is a right side view of a light source module according to an embodiment.
5 is a plan view of the light source module with the cover removed.
6 is a bottom perspective view of the light source module.
7 is a sectional view taken along the line A-A 'in Fig.
8 is a sectional view taken along the line B-B 'in Fig. 2;
9 to 13 are views for explaining the manufacturing method of the light source module in detail in order.
14 is a diagram illustrating thermal diffusion along a heat sink surface according to provision of a conductive layer in comparison with the prior art;
Fig. 15 is a bottom view of the heat sink, and shows a cutaway portion of the heat sink; Fig.
Figs. 16 and 17 are temperature distributions of the respective air, the heat sink and the fin observed along the cutting line of Fig. 15. Fig.
FIGS. 18 and 19 show the respective air flow velocity distributions and the air flow velocity vectors observed along the cutting line in FIG.
FIG. 20 is a view showing a cut portion of the heat sink accurately; FIG.
Fig. 21 is a temperature distribution diagram of each air observed along the cutting line in Fig. 20; Fig.
FIGS. 22 and 23 show the temperature flow velocity distribution and air flow velocity vector of each air observed along the cutting line of FIG.
Fig. 24 is a view showing the cutting position of the heat sink accurately. Fig.
25 and 26 are temperature distributions of respective air and heat sinks and fins observed along the line A-A 'in Fig.
27 is an air flow velocity vector observed along the cutting line of Fig.
Fig. 28 is a view showing the cutting position of the heat sink accurately. Fig.
29 and 30 are temperature distributions of respective air, heat sinks, and fins observed along the line A-A 'in Fig.
31 shows the temperature flow velocity distribution of each air observed along the cutting line of Fig.
32 is a view showing a cut portion of the heat sink accurately;
Fig. 33 is a temperature distribution diagram of each air observed along the cutting line A-A 'in Fig. 32; Fig.
Fig. 34 is a graph showing the temperature flow velocity distribution of each of the air observed along the cutting line of Fig. 32; Fig.
FIG. 35 is a view showing a cut portion of the heat sink accurately; FIG.
FIG. 36 is a temperature distribution diagram of each air observed along the cutting line A-A 'in FIG. 35; FIG.
37 is an air flow velocity vector observed along the cutting line of Fig.
38 is a perspective view of a lighting apparatus according to an embodiment.

Hereinafter, specific embodiments of the present invention will be described in detail with reference to the drawings. However, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims, It will be easily understood that the present invention is not limited thereto.

The drawings attached to the following embodiments are embodiments of the same invention. However, in order to facilitate understanding of the invention within the scope of the invention, And a specific portion may not be displayed in accordance with the drawings, or may be exaggerated in accordance with the drawings.

FIG. 1 is a perspective view of a light source module according to an embodiment, and FIG. 2 is an exploded perspective view of a light source module.

1 and 2, a light source module 100 according to an embodiment of the present invention includes at least one light source 11 for generating light, a body 12 for supporting the light source 11, (Not shown).

The light source 11 may include all means for generating light by receiving electrical energy. For example, the light source 11 may include a light source in the form of a point light source. Specifically, the light source 11 may include any one of a light emitting diode and a laser diode. Also, the light source 11 may emit light of a different color or a white color by intermingling a plurality of point light sources emitting different colors.

The body 12 is provided as a part allowing the physical and electrical action of the light source 11 so that the light source 11 can be stably operated. The body 12 may effectively dissipate the heat generated by the light source 11. The body 12 may supply power to the light source 11 by electrically connecting the light source 11.

The body 12 may include a heat sink 120. The light source 11 may be fastened or directly fastened to the heat sink 120 through another member. Preferably, the light source 11 may be fastened to the heat sink 120 for physical coupling, such as supporting its own weight. However, the light source 11 may be fastened to the heat sink 120 with a predetermined insulation layer interposed therebetween in order to insulate the heat sink 120 from the heat sink 120.

A mounting portion 121 on which the light source 11 is mounted may be provided on one surface of the heat sink 120. The seating portion 121 allows the heat generated from the light source 11 to be quickly absorbed by the heat sink 120. When the fin 130 is provided on the other surface of the heat sink 120, the heat sink 120 generates heat generated by the light emitted from the light source 11 and the light source, . Of course, the fin 130 can quickly emit heat to the outside. Also, the heat sink 120 itself can quickly release heat to the outside.

The heat sink 120 may be formed of a metal material or a resin material having excellent heat radiation and heat transfer efficiency. It is not limited thereto. For example, the heat sink 120 may be formed of a metal such as Al, Au, Ag, Cu, Ni, Sn, Zn, And iron (Fe). For example, the heat sink 120 may be made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum nitride (AlN), photo sensitive glass (PSG), polyamide 9T PA9T), syndiotactic polystyrene (SPS), metal materials, sapphire (Al2O3), beryllium oxide (BeO), ceramics. The heat sink 120 may be formed by injection molding (e.g., die casting), etching, or the like. It is not limited thereto.

The heat sink 120 may have a plate shape and a planar shape may be a square shape. In detail, the seating part 121 may be formed to be slightly depressed on one side (for example, the upper side) of the heat sink 120.

The cover 142 may be seated on the seating part 121. The seating portion 121 may be provided in a watertight structure by an outer portion and a cover 142. The light source 11 may be waterproof against the external environment by the combination of the seating part 121 and the cover 142.

A coupling hole 126 through which the coupling member passes may be formed at an edge of the heat sink 120 when the light source module is coupled to an illumination device or the like.

The body (12) may be provided with a fin (130) for improving the heat radiation efficiency of the heat sink (120). The fin 130 may have a shape for maximizing an area in contact with air. The fin 130 receives heat from the heat sink 120 and can exchange heat with the outside air.

The fin 130 may be provided in a plurality of plate shapes extending further downward from the other surface (lower surface) of the heat sink 120. More specifically, the pins 130 may be arranged at a plurality of positions with a constant pitch. The width of the fin 130 may be a function to effectively receive the heat of the heat sink 120 and to prevent the outside air from flowing into the heat sink 120 when the heat sink 120 is used as a reference , The first pin (see 1301 in Fig. 4) and the second pin (see 1302 in Fig. 4) on the rear side can be separated from each other.

An opening portion 600 is provided to open the gap between the first fin and the second fin so that the outside air can flow in the longitudinal direction of the heat sink 120.

The first pin 1301 and the second pin 1302 are each provided for ten, and each light source 11 may correspond to a space between the pair of pins vertically. The fin 130 may be formed as one body with the heat sink 120, or may be manufactured as a separate component.

The fin 130 may include at least one of a material having excellent heat transfer property, for example, aluminum (Al), nickel (Ni), copper (Cu), silver (Ag), and tin (Sn). Preferably, the fins 130 may be integrally provided with the same material as the heat sink 120.

A connector 190 is placed on one side of the seating part 121 so that the electric wire can be fastened. A wire hole 124 is provided at an inlet side of the connector 190 so that an electric wire can be drawn upward from a lower side of the heat sink 120.

The light source 11 may further include a plurality of lenses 141 for shielding the light source 11 and refracting the light generated by the light source 11. The lens 141 can diffuse the light generated by the light source 11. The diffusion angle of the light generated by the light source 11 can be determined according to the shape of the lens 141.

For example, the lens 141 can accommodate the light source 11 in a convex shape. Specifically, the lens 141 may include a material that transmits light. For example, the lens 141 may be formed of transparent silicone, epoxy, and other resin materials. In addition, the lens 141 may be disposed so as to surround the light source 11 so that the light source 11 is isolated from the outside so as to protect the light source 11 from external moisture and impact.

For the convenience of assembly, the lens 141 may be provided on the cover 142. Fig. The lens 141 may be disposed at a position overlapping the light source 11.

The cover 142 may be formed with a cover hole 143 communicating with the air hole 122. Specifically, the cover hole 143 may be formed through the cover 142 in the vertical direction.

3 is a front view of the light source module, and FIG. 4 is a right side view of the light source module.

3 and 4, the fin 130 may extend in the width direction of the heat sink 120 (in the direction of a short edge). The pins 130 may have a predetermined pitch in the longitudinal direction (long edge direction) of the heat sink 120, and a plurality of, preferably ten, heat sinks may be disposed.

The light sources 111, 112 and 113 may correspond to each other through the heat sink 120 in an interval between the pair of fins 130. Accordingly, the heat generated in any one of the light sources can be dissipated through the pair of adjacent fins 130. For example, the first light source 111 positioned at the center can perform the main cooling action by the two fins positioned at the center, and the light sources outside can also be cooled by the corresponding pair of fins 130, Action can be performed.

Air can be introduced into the heat sink in the direction of the heat sink by the opening portion 600 located between the first fin 1301 and the second fin 1302 to increase the convective cooling efficiency. Of course, in comparison with the prior art, the material cost for manufacturing the heat sink 120 and the fin 130 can be saved by the opening portion 600.

An air hole 122 may be formed in the heat sink 120. The air hole 122 may be formed to penetrate the heat sink 120 in a vertical direction. The air hole 122 may be formed through the heat sink 120 in the direction of the pin 130 from the seating part 121. [ With this configuration, it is possible to provide a space in which air flows. The air holes 122 are vertically overlapped with the cover holes 143 formed in the cover 142 and can communicate with each other.

Although it will be described later in more detail, the cooling action differs depending on the position of the light source. More specifically, the outside light source 113 is disposed in a space defined by the outside air flowing through the opening portion 600 and the outside air flowing into the heat sink in the width direction (i.e., the flow passing through the space between the adjacent pair of fins) The cooling can be performed together. The light source 111 at the center can be cooled together by the outside air flowing through the air hole 122 and the outside air flowing in the width direction of the heat sink. The light source 112 therebetween can be performed by mixing the two functions with each other.

And the electric wire 125 can be inserted upward from the lower side through the electric wire hole 124. The electric wire passing through the wire hole 124 may be bent in the lateral direction, that is, the direction of the connector 190, and connected to the connector 190. In Fig. 3, the arrow indicates the insertion direction of the wire.

A protrusion 500 may be provided on the bottom surface of the heat sink along the periphery of the air hole 122. The projecting portion 500 may be provided to reinforce the strength of the peripheral portion of the inner seating groove by providing an inner seating groove (see 128 in FIG. 7). This is also intended to prevent defects that may occur during injection molding.

The openings 600 can be virtually bounded by the inner edges of the pins 1301 and 1302, the bottom surface of the heat sink, and the bottom surface of the protrusion 500. With this configuration, it is preferable to allow the outside air to flow in through a wide area as much as possible.

5 is a plan view of the light source module with the cover removed.

Referring to FIG. 5, a conductive layer 40 may be provided on the surface of the seating part 121. The conductive layer 40 is provided with a conductive conductive layer 45 through which electricity can flow along a path through which the light source 11 is connected to the conductive layer 40. The conductive conductive layer 40 diffuses heat quickly along the surface of the heat sink 120, A heat dissipation conductive layer 44 may be included.

The conductive conductive layer 45 may provide a path through which electricity is externally applied. The conductive conductive layer 45 may serve to connect the light sources 11 by providing a conductive unit capable of connecting the light sources 11 to each other. The conductive unit body 49 may function as a single unit that connects the connector and the light source to each other. In addition, the conductive unit body 49 may be provided with a predetermined thickness and width to provide a passage through which electricity flows.

The heat dissipation conductive layer 44 may serve to rapidly diffuse the heat generated by the light source 11 along the surface of the heat sink 120, The same effect can be obtained in the heat radiation conductive layer 44 as well as the heat diffusion.

The heat dissipation conductive layer 44 may include an external heat dissipation conductive layer 442 disposed outside the conductive conductive layer 45 and an internal heat dissipation conductive layer 441 disposed inside the conductive conductive layer 45 . The internal heat-dissipating conductive layer 441 and the external heat-dissipating conductive layer 442 may be connected to each other by a bridge 46 to further enhance heat diffusion and heat dissipation.

The external heat-dissipating conductive layer 442 may be provided as a single structure in which the entire external heat-dissipating conductive layers 442 are connected to each other. The internal heat-dissipating conductive layer 441 may be provided as a single structure in which all of the internal heat-dissipating conductive layers 441 are connected to each other. According to this, there is an advantage that diffusion of heat can be promoted. Unlike the conductive conductive layer 45, the heat-radiating conductive layer 44 may be connected to each other as a single structure. According to this, diffusion of heat generated in the light source 11 can be further promoted. In other words, it is possible to obtain the effect of promoting the diffusion of heat to a certain hot position, for example, the adjacent position of the light source 11, to any cold position, for example, the adjacent position of the air hole 122. It can be easily predicted that the effect of heat emission is correspondingly enhanced if diffusion of heat is promoted.

The heat radiation conductive layer 44 may be provided substantially on the entire surface of the heat sink 120, except for the space between the heat radiation conductive layer 44 and the conductive conductive layer 45. Accordingly, the heat absorbing effect of the heat sink 120, which may be caused by the insulating layer 20 made of a resin material, and the phenomenon of deterioration of the heat releasing effect can be improved.

6 is a bottom perspective view of the light source module.

Referring to FIG. 6, ten first pins 1301 and ten second pins 1302 are provided at a predetermined pitch in the longitudinal direction of the heat sink at the bottom surface of the heat sink 120. Experiments show that 9 pins can not achieve sufficient cooling performance, and 11 pins cause unnecessarily large cooling, resulting in only a rise in manufacturing costs. Thus, ten pins were provided at predetermined intervals.

The reason why sufficient cooling effect can be obtained in this way is that it is caused by the diffusion and release action of heat by the conductive layer 40 and the increase of the cooling action efficiency on the surface of the heat sink 120, . The reason for this is that convection cooling can be performed on substantially the entire substantially entire surface of the heat sink by the rapid diffusion of heat.

The gap between the first pin 1301 and the second pin 1302 is open. Accordingly, the outside air can flow in the longitudinal direction of the heat sink 120 along the lower surface of the heat sink 120 through the opening portion 600. It goes without saying that the outside air flows through the air hole 122 as well. It goes without saying that the outside air flows along the width direction of the heat sink 120, that is, along the lateral extending direction of the fin 130. [

It is expected that the convection cooling is promoted on the entire surface of the heat sink by the interaction of the three flows.

7 is a cross-sectional view taken along the line A-A 'in Fig.

7, the cover 142 is fastened to the upper side of the heat sink 120. At this time, the heat sink 120 and the lens cover 142 are firmly fixed by the hook 145 and the hooking part 122, .

The electric wire 125 is drawn through the electric wire hole 124 which is vertically opened in the heat sink 120. The electric wire 125 may be fastened to the connector 190 adjacent to the electric wire hole 124. Of course, they may be respectively connected to the pair of conductive units in a soldering manner. A sealing member may be inserted into the electric wire hole 124 after the electric wire 125 passes through the electric wire hole 124 to block foreign substances from entering the electric wire hole 124.

The connector 190 may be provided with a connector body 195, a handle 191 capable of hinging with respect to the connector body 195, and a lead-in hole 196. According to the above configuration, insertion of the electric wire 125 through the inlet hole 196, and fixing and electrical connection of the electric wire 125 by rotating the handle 191 can be performed. Of course, a portion of the electric wire 125 contacting the end portion may be electrically connected to the conductive unit body.

Accordingly, the light source module 100 and the electric wire 125 can be easily fastened. The inlet hole 196 extends in parallel to the seating part 121 so that the internal volume required for the electric wires accommodated in the connector 190 and the cover 142 can be reduced.

The ribs 144 and the seating grooves 129 are provided on the inside and the outside of the cover 142 so as to have a concave-convex structure corresponding to each other so that they can be engaged with each other to seal foreign matter from the outside. A sealer 126 is interposed in the contact surface between the rib 144 and the seating groove 129, so that the introduction of foreign matter through the contact surface can be completely blocked.

The seating groove 129 may include an outer seating groove 127 and an inner seating groove 128 to maintain the inner and outer portions of the conductive conductive layer 45 in water tightness.

8 is a cross-sectional view taken along the line B-B 'in FIG. 2, illustrating a portion where the light source is placed.

Referring to FIG. 8, an insulating layer 20 may be provided on the surface of the heat sink 120. The insulating layer 20 may be provided over the entire surface of the heat sink 120, but may be provided only partially, but not limited to now. When the fin 130 and the air guide 160 are provided as one body with the heat sink 120, an insulating layer 20 is provided on the surface of the fin 130 and the air guide 160. . At this time, the entire surface of each component may be provided with an insulating layer or only a part thereof.

According to a preferred case, the heat sink 120 and the fins 130 may be provided together by injection molding, illustratively die casting, and then the insulating layer 20 may be provided.

The insulating layer 20 may be applied by powder coating. The powder coating method can be carried out by any one of an electrostatic spraying method, an electrostatic brushing method, and a fluidized deposition method. Therefore, the insulating layer 20 may be referred to as a coating insulating layer or a coating insulating layer. According to this, the process can be performed quickly and inexpensively and the yield of the product is increased.

The insulating layer 20 may insulate the heat sink 120 from the conductive layer 40 to be described later. The conductive layer 40 is electrically conductive and may be electrically connected to the light source 11. The conductive layer 40 may be a passage for supplying electricity to the light source 11. Also, the conductive layer 40 may perform a function of rapidly diffusing heat. For this, the conductive layer 40 may be formed of a metal material. For example, at least one of Ag (silver), Au (gold), Cu (copper), and Ni (nickel). Here, Ag (silver) and Au (gold) can be used as the outermost layer of the conductive layer 40 because oxidation can be prevented even if they are exposed to the outside. The same is true in the case of the embodiment.

 The light source 11 may be provided as a vertical type light emitting diode in which two electrodes are formed below. 8 shows that one electrode is connected to the light source 11 and it is easily anticipated that one electrode is provided below the ground or on the ground. When the vertical light emitting diode is mounted on the conductive layer 40, wire bonding is not necessary.

The conductive layer 40 may be provided in a recess 21 previously provided at a position where the conductive layer 40 is to be provided. The recesses 21 may be provided by etching the insulating layer 20 by laser direct structuring (LDS). The depressed portion 21 may be provided with at least a bottom surface of the inner region with a rough surface having a metal nucleus. The depressions 21 may be spaced apart from one another by the conductive layers 40 connected to the light sources 11. In other words, in order to prevent a short circuit between the electrodes connected to the light source 11, a pair of conductive layers 40 to be provided with a pair of electrodes may be placed inside different depressions 21 .

The conductive layer 40 may be provided by performing at least two or more plating processes repeatedly. In the embodiment, Cu (copper), Ni (nickel), and Au (gold) are successively laminated as the conductive layer 40 to form the first plating layer 41, the second plating layer 42, (43).

As a method of providing the insulating layer 20, the depressions 21 and the conductive layer 40, a conductive material such as copper is sputtered on the insulating layer 20 and a conductive material such as electrolytic / electroless plating And then forming a conductive film thereon and etching it. At this time, the depressed portion 21 may be provided to the insulating layer 20 in advance to prevent a short circuit or the like. It is not limited in any way. However, a laser direct structuring process can be more preferably considered because it is possible to realize an inexpensive manufacturing ratio, perform a rapid and precise process, and is suitable for mass production using laser equipment.

The insulating layer, the depression, and the manner in which the conductive layer is provided will be described in more detail.

The insulating layer 20 is etched to provide a depression 21. A metal joint surface 22 can be machined on the inner surface of the depression 21. It can be said that the metal bonding surface 22 is processed into a surface having a property suitable for the surface of the insulating layer 20 to be laminated with the conductive layer. The metal bonding surface may be provided by irradiating a laser to an area where a conductive layer is provided.

The metal bonding surface 22 may be provided with a metal nucleus to which the metal of the conductive layer 40 may adhere. Further, the surface of the metal bonding surface can be provided by being processed into a lattice-like trench. The metal bonding surface 22 may include at least the bottom surface of the depression 21. The trenches may be provided irregularly. By providing the metal nuclei in the insulating layer, it is possible to further promote the effect of promoting heat transfer through the insulating layer.

A conductive layer 40 may be laminated on the metal bonding surface 22. At least one plating layer may be laminated on the conductive layer 40. For example, the first plating layer 41 made of copper, the second plating layer 42 made of nickel, and the third plating layer 43 made of gold or silver may be included. The first plating layer 41 may be deposited to a thickness of 10 to 20 micrometers. The second plating layer 42 may be deposited to a thickness of 5 to 15 micrometers. The third plating layer 43 may be deposited to a thickness of about 0.1 to 0.01 micrometer. The third plating layer 43 may cause an increase in material cost and may not be stacked. However, it is preferable that the third plating layer 43 is provided as a thin film for preventing oxidation and protection.

The first plating layer 41 located on the lowermost side of the conductive layer 40 serves as an electrically conductive role layer for reducing the electric resistance to reduce the amount of heat generated. For this, the first plating layer 41 may be made of copper. The first plating layer 41 can be made thickest among the plating layers so as to secure sufficient electric conduction characteristics. In addition to copper, metals with high electrical conductivity may be used.

The second plating layer 42 lying in the middle of the conductive layer 40 serves as a soldering role layer for improving the quality of soldering. For soldering, the molten solder is well spread over the entire surface of the base material and the solder must diffuse well on the surface of the base material. Nickel can be used as a metal for securing the characteristics of the soldering.

The outermost third plating layer 43 of the conductive layer 40 functions as a protective role layer for protecting the plating layers 41 and 42 therein. The third plating layer 43 may use gold that is not oxidized or discolored. In the case of silver, there is a risk of discoloration, which is undesirable because it can penetrate into the silver LED package later and chemically react with the internal parts of the light emitting portion to lower the luminous efficiency. Since the third plating layer 43 performs the function of protection, it can be provided as the thinnest layer. It is possible to provide only the third plating layer 43 without providing the second plating layer 42, but it is not preferable from the viewpoint of cost. Since the third plating layer 43 is provided in a very thin layer, the second plating layer 42 does not interfere with the third plating layer 43 during soldering.

The third plating layer 43 may be provided with a resin. In this case, the resin may be laminated in a manner other than plating. The resin is not covered with the soldered portion, so that the soldering can be prevented from being hindered.

A bonding layer 50 may be provided on the conductive layer 40. The light source 11 may be disposed on the bonding layer 50. The bonding layer 50 may be a low temperature solder paste which can be soldered at a low temperature. For example, the OM525 can be used. The bonding layer may be formed by passing a reflow machine in a state where the light emitting device is mounted on the upper side to which the low temperature solder paste is applied. Soldering at a low temperature can prevent peeling between the heat sink 120 and the insulating layer 20 and peeling between the insulating layer 20 and the conductive layer 40. Accordingly, the reliability of the product and the yield of the product are improved, and deterioration of the material due to use over a long period of time can be prevented.

9 to 13 are views for explaining the manufacturing method of the light source module in detail in order.

Referring to FIG. 9, the insulating layer 20 may be provided on a body manufactured by a die casting method. The insulating layer 20 may be applied by powder coating. The insulating layer may be provided as a resin-containing material after the molding is completed. The powder coating method can be carried out in more detail by any one of electrostatic spraying method, electrostatic brush method, and fluidized deposition method. Therefore, the insulating layer 20 may be referred to as a coating insulating layer or a coating insulating layer. The thickness of the coating insulation layer may be 60 to 80 micrometers. However, the thickness is not limited to this, and various values can be selected according to the insulation performance, heat radiation performance, and process variables.

In the embodiment, the light source is a light-emitting diode, a commercial power source is connected, and insulation and heat dissipation are secured in a case where the light source is suitably used in an external environment.

The insulating layer 20 may be subjected to a laser direct structuring process to laminate the conductive layer 40 on at least a part of its surface. The direct laser structuring process may be performed before the plating step, and may be performed by irradiating a laser beam onto the surface of the insulating layer 20 where the conductive layer is to be plated. The area to be plated on the surface of the resin molded article is modified by the laser irradiation, and it can have properties suitable for plating. For this purpose, the insulating layer 20 may contain a nucleating agent for direct laser structuring (hereinafter, simply referred to as a nucleating agent) capable of forming metal nuclei by a laser, A predetermined pattern may be formed in order to provide a plating layer on the inner surface of the substrate.

First, a case where a nucleating agent is contained in the insulating layer 20 will be described.

The resin molding providing the insulating layer 20 may contain a nucleating agent. When the nucleating agent receives the laser, the nucleating agent decomposes and the metal nucleus can be generated. Further, the area to be plated to which the laser is irradiated may have a rough surface. Due to the presence of such metallic nuclei and surface roughness, the area to be plated which is laser modified can be adapted for plating. The metal nucleus may refer to a nucleus to which the metal is attached in a subsequent plating step.

As the nucleating agent, a metal oxide having a spinel structure, a heavy metal complex oxide spinel such as copper chromium oxide spinel, a copper salt such as copper hydroxide, phosphate, copper sulfate, copper sulfate or cuprous thiocyanate can be used . As the material of the insulating layer 20, a polyester-based resin may be used. This is because the heat sink 120, the insulating layer 20, and the conductive layer (not shown), which can be generated by the heat applied in the bonding process of the light source 11, 40 can be prevented from being peeled off.

Next, a case where a predetermined pattern is formed on the inner surface of the depression 21 will be described. Even if the resin structure providing the insulating layer does not contain a nucleating agent, the conductive layer 40 is formed in the insulating layer 20 by forming a trench line in a predetermined pattern exemplified by a lattice pattern in the region to be plated . The trench line can effectively promote adhesion of the metal to the plating target region on the surface of the resin structure, and can perform the plating process. The trench line may be provided with at least two types of intersecting trenches.

The step of forming a trench line of a predetermined pattern by irradiating a laser beam onto a region to be plated on the surface of the insulating layer 20 may be performed by irradiating a laser beam onto a region to be plated on the surface of the insulating layer.

10 is a view showing that the depression is provided in the insulating layer.

Referring to FIG. 10, as described above, a laser may be used as means for providing the depression 21 in the insulating layer 20. For example, YAG (yttrium aluminum garnet), YVO4 (yttrium or thovanadate), YB (ytterbium), CO ₂ , etc. may be used as the medium for providing the laser. The wavelength of the laser may be, for example, 532 nm, 1064 nm, 1090 nm, 9.3 μm, 10.6 μm, or the like. An algorithm for recognizing and processing a three-dimensional shape when machining with a laser can be used. For example, at least a body including the heat sink 120 may be recognized as a three-dimensional recognition program, and the processing height of the laser may be controlled by dividing the body into several steps according to the height. The output value of the laser may be, for example, about 2W to about 30W.

As described above, the metal bonding surface 22 processed by the laser has at least one of a metal core, a rough surface, and a trench so that the conductive layer 40 can be plated in a subsequent process.

11 is a view showing that the conductive layer is provided in the depression.

Referring to FIG. 11, a step of plating the metal on the metal bonding surface 22 in an electroless manner to provide the conductive layer 40 may be performed. Of course, other plating methods may be performed. The conductive layer 40 may be copper, nickel, gold, silver, or a combination thereof. The conductive layer may be a single layer or a laminated structure. In the laminated structure, each layer may be a different metal or may be the same metal. In the examples, copper, nickel, and gold were sequentially laminated.

As an example, a case where a first plating layer 41 provided with copper is provided will be described in detail.

The heat sink 120 provided with the metal bonding surface 22 is immersed in the electroless copper plating solution. At this time, the pin 130 and the air guide 160 can be immersed together. For example, the aqueous electroless plating solution for electroless copper may contain, based on 1 liter of deionized water, about 55 ml to about 65 ml of copper bath / supplements, about 55 ml to about 65 ml of alkali supplement, about 15 ml 20 ml, stabilizer about 0.1 ml to about 0.2 ml, and formaldehyde about 8 ml to about 10 ml.

From about 6 parts by weight to about 12 parts by weight of copper sulfate, from about 1 part by weight to about 1.5 parts by weight of polyethylene glycol, from about 0.01 to about 0.02 part by weight of stabilizer, and from about 78 parts by weight of water, To about 80 parts by weight.

The alkali supplements may contain, for example, from about 40 parts by weight to about 50 parts by weight of sodium hydroxide, from about 0.01 part by weight to about 0.02 part by weight of stabilizer, and from about 50 parts by weight to about 60 parts by weight of water.

The complexing agent may contain, for example, from about 49 to about 50 parts by weight of sodium hydroxide, from about 0.01 to about 0.02 part by weight of stabilizer, and from about 50 to about 51 parts by weight of water.

The stabilizer may include, for example, from about 0.2 parts by weight to about 0.3 parts by weight of potassium selenocyanate, from about 5 parts by weight to about 6 parts by weight of potassium cyanide, from about 0.3 to about 0.4 parts by weight of sodium hydroxide, Parts by weight to about 93 parts by weight.

For example, in order to provide the first plated layer 410 made of copper, the catalyst-imparted resin structure is coated on the electroless copper plating solution at a temperature of about 41 degrees to about 55 degrees, It can be washed with water after soaking at a deposition rate of 10 min.

Thereafter, the plating process can be further performed by repeatedly providing another plating layer with a plating solution.

The conductive layer 40 may be deposited to a depth exceeding the depth of the depression 21. According to this, it is possible to reduce the resistance of the conductive layer 40 by increasing the area to be energized, and reduce the amount of heat generated by the resistance. Of course, the scope of the present invention is not limited to such a configuration.

12 is a view showing that the light source is bonded by the bonding layer.

Referring to FIG. 12, the bonding layer 50 may be coated with a low-temperature solder paste on the conductive layer 40. Also, it can be provided by placing the light source 11 at a position where electrodes are aligned on the low-temperature solder paste, and then passing the reflow machine. During the reflow process, unnecessary portions of the low-temperature solder paste are removed, and conductive components remain, so that the conductive layer 40 and the light source 11 can be energized.

As the low-temperature solder paste, OM525 which can be used at about 160 degrees can be used. A relatively low-temperature atmosphere is formed during the reflow process, so that the peeling of the insulating layer 20 and the heat sink 120 and the peeling of the conductive layer 40 and the insulating layer 20 can be suppressed. This can improve product yield and reliability.

13 shows that a lens is further provided on the upper side of the light source.

A lens 141 is provided above the light source 11. The lens 141 shields the light source 11 and can refract and diffuse the light generated by the light source 11. The diffuse angle of the light generated by the light source 11 can be determined according to the shape of the lens 141. For example, the lens 141 can mold the light source 11 in a convex shape. Specifically, the lens 141 may include a material that transmits light. For example, the lens 141 may be formed of transparent silicone, epoxy, and other resin materials. The lens 141 may be arranged so as to surround the light source 11 so that the light source 11 is isolated from the external environment so as to protect the light source 11 from external moisture and impact.

More specifically, for ease of assembly, the lens 141 may be disposed on the cover 142 formed to correspond to the insulating layer 20. The cover 142 may be formed to correspond to the insulating layer 20 on the upper surface of the insulating layer 20. The lens 141 positioned in the cover 142 may be disposed at a position overlapping with the light source 11. [ The cover 142 is seated inside the seating part 121 and can tightly seal the light source 11 and the outside.

According to the configuration of the conductive layer described above, the heat generated in the light source 11 can be quickly diffused along the conductive layer 40. Therefore, the entire surface of the heat sink 120 can perform the convection cooling action by the outside air.

14 is a view for explaining the thermal diffusion along the surface of the heat sink according to the provision of the conductive layer in comparison with the prior art.

Fig. 14 (a) is a surface temperature distribution chart of a heat sink according to a comparative example (cited invention, comparative example is the same hereinafter). Fig. 14 (b) is a surface temperature distribution chart of the heat sink according to the embodiment. The other conditions such as the light source are all the same. In the comparative example, the temperature distribution of 65.0 to 67.5 degrees is shown, and the example shows the temperature distribution of 64.4 to 66.9 degrees.

Particularly noteworthy is that the heat is diffused more quickly in the middle light source 111 when comparing the comparative example and the embodiment. This can be attributed to the action of the conductive layer 40. Further, in the embodiment, the light source 113 on the outside can be seen to be rapidly cooling by rapid thermal diffusion to the edge or fin 130 of the heat sink.

Thus, it can be seen that the configuration of the embodiment is more effective than the prior art in thermal diffusion and heat dissipation. Thus, there is no need to increase the number of pins to forcibly release the heat. Therefore, in the embodiment, the first pin 1301 and the second pin 1302 are all ten, and the first pin and the second pin are spaced apart from each other in front and rear, thereby reducing the material cost and the machining cost.

In addition, since the heat sink 120 and the fins 130 can be positively used as the cooling source of the convection cooling as a whole, it is preferable to actively induce the air flow for the convection cooling to the fins 130 and the heat sink 120 as much as possible . To this end, an opening portion 600 is provided at an interval between the first fin 1301 and the second fin 1302. [ In addition, the dead zones that disturb the flow were removed at various locations.

Hereinafter, comparative examples and comparative examples are presented to show various advantages of the embodiments.

Fig. 15 is a bottom view of the heat sink, and shows a cut portion of the heat sink. Fig. Figs. 16 and 17 are temperature distributions of the respective air, the heat sink and the fin observed along the cutting line A-A 'in Fig. Each of (a) is a comparative example, and (b) is the same as the following.

16 and 17, in the central portion of the heat sink, the outside air (outside air 1) flowing in the longitudinal direction of the heat sink at both side ends of the heat sink 120 through the opening portion 600, (Outside air 2) can be introduced through the outdoor unit 122. The outside air 1 and the outside air 2 can generate turbulence at the intersection point to improve the convection cooling effect at the surface portion of the fin 130 and the heicink 120. [

Therefore, the temperature distribution of the surface of the heat sink and the fin was comparable to 64.2 to 65.3 degrees, while the temperature of the examples was 63.8 to 65.0 degrees.

Figs. 18 and 19 are the air flow velocity distributions and the air flow velocity vectors observed along the cut line in Fig.

Referring to FIGS. 18 and 19, in the region indicated by A in the comparative example, a low-velocity flow portion in which the air velocity is slow is provided, whereas in the region indicated by B in the embodiment, You can see what you can do.

FIG. 20 is a view showing a cut portion of the heat sink accurately. FIG. 21 is a temperature distribution diagram of each air observed along the cutting line A-A 'in FIG. 20; FIG.

Referring to FIG. 21, it can be seen that the temperature range is from 25 to 66 degrees, and when comparing the 66 degree isotherm of B with the 66 degree isotherm of A, it can be seen that the temperature of the pin and the heat sink is comparatively high have. This is presumably because the air flow is not smooth at the center portion of the heat sink and the surface of the heat sink and the fin can not be cooled when the comparative example and the example are compared with each other.

More specifically, in the embodiment, it can be judged that the air flow through the opening portion 600 and the smooth air flow through the air hole 122 facilitate the convective cooling action on the surface of the heat sink and the fin.

Figs. 22 and 23 are the temperature flow velocity distribution and the air flow velocity vector of each air observed along the cut line in Fig.

Referring to FIG. 22, it can be seen that the constant velocity line A of the embodiment is formed in the end region of the entire fin 130 at the same flow velocity distribution (0 to 0.5 m / s). On the contrary, in the comparative example, it can be seen that the constant velocity line is not uniform in the end region of the fin and the low speed region B is generated. This is because, in the case of the comparative example, the flow is not smooth and the convection cooling does not occur smoothly.

Accordingly, it can be judged that providing the opening portion 600 and the air hole 122 without the air guide portion provided in the comparative example is more efficient for cooling.

Referring to FIG. 23, it can be seen that turbulence is generated in region A of the comparative example. On the contrary, in the example A, it can be seen that uniform flow occurs, and turbulence occurs in the regions B, C, and D. This is because the air flow through the opening and the air flow along the extension direction of the pin cause turbulence (B region and D region), and the air flow through the opening and the air flow along the extension direction of the fin and the air flow through the air hole (C region) to generate turbulence with each other.

Thus, it can be seen that in the case of the embodiment, turbulence is generated at the surface of the heat sink and the fin, thereby enhancing the convective cooling. As a result, the cooling efficiency is of course increased.

Fig. 24 is a view showing the cutting position of the heat sink accurately. 25 and 26 are temperature distributions of the respective air, the heat sink, and the fin observed along the cutting line A-A 'in FIG.

Referring to Fig. 25, in comparison with Fig. 21, in the region where the fins are provided (in contrast to the middle portion of the heat sink where the fins are not provided), the turbulence generating portion A in the comparative example has the heat sink and the fins Is formed in the outer region deviating from the outer region. On the contrary, in the embodiment, it is found that the equal flow portion B is provided to the outside of the fin even in the region where the fin is provided, and turbulence is formed in the portion where the fin is provided.

This description is understandable as the heat of the heat sink and the fin is concentratedly discharged to only a part.

On the other hand, in the example C, the isotherm of 66 degrees is convex, and the isotherm is convex upward and the middle portion is substantially uniform. This is because ten fins are provided and the light source is placed in the space between the pair of fins so that the heat of the light source can be cooled uniformly by the pair of fins. On the other hand, further cooling of the pin located on the outer side is possible because additional cooling can be performed by the edge portion of the heat sink.

Referring to Fig. 26, in the embodiment, the light source 111 at the central portion and the light source 112 outside the rectilinear portion of the fin exhibit substantially similar temperatures (see Isotherm A). In contrast, in the comparative example, the temperature is concentrated in the center region. This is because the heat is concentrated in the light source due to the uneven placement of the fins in each light source, and the temperature is increased in the light source.

According to this experiment, it is preferable to use a pair of pins as a cooling means for one light source. This is because the heat is concentrated at a certain point depending on the arrangement of the light sources, and the temperature becomes excessively high, so that the specification of the light source module can be exceeded.

On the other hand, it should be noted that the temperature scale of FIG. 26 is 63.6 to 65.5 degrees in the case of the comparative example, and 62.9 to 65.1 degrees in the case of the embodiment, and the cooling is efficient in the case of the embodiment.

27 is an air flow velocity vector observed along the cutting line of Fig.

Referring to FIG. 27, it can be seen that in the case of the comparative example, the turbulent flow generating portion A is formed at both ends and the flow mixing portion B is formed at the middle portion. It can be seen that the turbulent flow generating portion A is caused by mixing the air flow sideways of the heat sink and the air flowing through the fin. This is because the flow mixing portion B mixes the air passing through the fin and the air flow passing through the long air guide portion in the outer region of the fin.

On the contrary, in the case of the embodiment, the collision of the respective air flows occurs in the region where the heat sink and the pin are laid, thereby forming the turbulent flow generating portion A. Thereafter, the flow that has passed through the turbulent flow generating section A may form an equal flow section B.

According to such a constitution, the convection cooling effect is increased by the turbulent flow component, and a synergy effect of the cooling efficiency can be obtained.

Fig. 28 is a view showing the cutting position of the heat sink accurately. Fig. 29 and 30 are temperature distributions of the respective air, the heat sink, and the fin observed along the cutting line A-A 'in FIG.

Referring to FIG. 29, in the case of the comparative example, a small amount of air is used for the cooling action because air flows along the air guide portion. On the contrary, in the case of the embodiment, the air (upward flow) passing through the air hole 122 and the air (rightward moving flow) moving along the fin collide with each other to form the turbulent flow generating portion B . And then moves upward together to form a large-capacity airflow portion A in which a large amount of airflow occurs.

By such an action, more effective cooling can be performed.

Referring to FIG. 30, it can be seen that in the temperature distribution of the fins, the temperature difference between the left side and the right side is hardly observed in the entire region of the pin in the embodiment, but in the case of the comparative example, . This suggests that cooling through the air guide of the comparative example is inefficient.

Further, in the case of the embodiment, it can be seen that cooling through the air hole 122 is rapid. In detail, when observing the distribution, etc., the heat of the light source diffuses into the air holes 122, diffuses toward the fin, and is cooled. In the case of the comparative example, the range of 64.0 to 67.8 degrees is observed in the temperature range of the comparative example, but in the case of the embodiment, it can be understood more clearly with reference to the lower range of 63.4 to 65.1 degrees.

In the comparative example, since heat dissipation is not rapid, heat concentration may occur at the point where the light source is placed, which may cause a failure.

31 is a temperature flow velocity distribution of each air observed along the cutting line of Fig.

Referring to FIG. 31, it can be seen more clearly that the large-capacity airflow portion A is generated. In addition, although the cutting line shown in FIG. 28 is a cutting line passing through the inside of the pin for the occurrence of turbulent flow, it is not clear, but it is also possible that a turbulence effect occurs due to the grooves on both sides of the protruding portion 500.

Fig. 32 is a view showing the cutting position of the heat sink accurately. Fig. 33 is a temperature distribution diagram of each air observed along the cutting line A-A 'in Fig.

Referring to FIG. 33, it can be seen that in the comparative example, a dead zone A of air flow is formed on the left side of the air guide 300. The dead zone A is a region where the flow of air stagnates. The dead zone A is a region where the outside air horizontally moved along the surface of the heat sink does not flow, and heat exchange is hardly performed. Therefore, the cooling effect can not be expected.

On the contrary, in the embodiment, the air flowing through the air hole 122 and the air flowing along the surface of the heat sink 120 collide with each other to generate a turbulent flow. Therefore, sufficient turbulence can be generated on the surface of the heat sink and the fin and the cooling action can be performed. Therefore, a high cooling effect can be expected.

According to the embodiment, when the isotherm B of the air is observed, it can have an isothermal curve having symmetrical structure with the edge of the fin as an end.

Fig. 34 is a temperature flow velocity distribution of each air observed along the cutting line in Fig. 32. Fig.

Referring to FIG. 34, in the comparative example, the dead zone A is formed, whereas in the embodiment, it is confirmed that the turbulent flow generation portion B generates a large amount of heat exchange action. Thus, it is easily understood that a strong convective cooling effect can be obtained.

Fig. 35 is a view showing the cut portion of the heat sink accurately. Fig. 36 is a temperature distribution diagram of each air observed along the cutting line A-A 'in Fig.

Referring to FIG. 35, in the embodiment, even in a portion where the air hole 122 is not provided, the outside air flowing through the opening portion 600 collides with the outside air flowing along the fin 130, A) is formed. The coarse black line indicates that the cooling is faithfully performed by the turbulence sufficiently generated as the isotherm.

On the contrary, in the comparative example, only the air flowing in one direction, that is, the air flowing through the space between the fins, is provided, so that the performance of the heat exchange is inferior.

37 is an air flow velocity vector observed along the cutting line in Fig.

Referring to FIG. 37, the same turbulence generating portion A as the turbulence generating portion A of FIG. 36 occurs, which can be clearly understood to be due to the collision of the air flows having different inflow directions. As a result, it is also clear that a stronger cooling action can be performed.

According to the above description, it can be seen that the effect of convective cooling can be maximized by various configurations for guiding the flow of the outside air in the embodiment. Thereby, it is possible to use a smaller amount of raw material, and to ensure that sufficient heat dissipation is performed even if the size is small.

38 is a perspective view of a lighting apparatus according to the embodiment.

Referring to FIG. 38, the lighting apparatus 1000 of the embodiment includes a body 1100 providing a space to which the light source module 100 is coupled and forming an outer appearance, a power source unit coupled to one side of the body to supply power to the body (Not shown), and may include a connection portion 1200 connecting to the support portion. The lighting apparatus 1000 of the embodiment can be installed indoors or outdoors. For example, the lighting apparatus 1000 of the embodiment can be used as a street lamp. The body 1100 may be formed with a plurality of frames 1110 capable of providing space in which at least two light source modules 100 are located. The connection unit 1200 includes a power unit therein, and connects the body with a support unit (not shown) for fixing the bike to the outside.

The use of the lighting apparatus 1000 of the embodiment has an advantage in that a sufficient cooling effect is induced and the fan is not used, and the material cost of the light source module 100 is reduced, thereby reducing the manufacturing cost.

600: opening portion

Claims (12)

A light source for providing light;
A heat sink which supports the light source on one surface thereof and absorbs heat from the light source and emits heat to the outside; And
And a fin extending from the other surface of the heat sink,
The pin
At least two first pins provided at a rear portion of the heat sink and having a predetermined pitch in the longitudinal direction of the heat sink; And
At least two second fins provided at a front portion of the heat sink and having a predetermined pitch in the longitudinal direction of the heat sink,
Wherein an interval between the first pin and the second pin is opened so that the first pin and the second pin further allow an air flow through the gap. The method according to claim 1,
Wherein the fin extends in the width direction of the heat sink. The method according to claim 1,
Wherein the first fin and the second fin are positioned in correspondence to the front and rear sides of the heat sink with respect to the opening. The method according to claim 1,
Wherein the opening passes through the heat sink in the longitudinal direction. The method according to claim 1,
Wherein the first pin or the second pin is 10 light source modules. The method according to claim 1,
Wherein the heat sink includes an air hole formed in a central portion of the heat sink in a longitudinal direction of the heat sink. The method according to claim 1,
And the opening part has a bottom surface of the heat sink as a boundary. A light source for providing light;
A heat sink supporting the light source on one surface thereof;
At least two first pins provided on one side of the other side of the heat sink;
At least two second pins provided on the other surface of the heat sink and spaced apart from the first pin; And
Wherein the heat sink is cut and includes an air hole that is elongated in the longitudinal direction of the heat sink to allow the outside air to pass therethrough. 9. The method of claim 8,
And an opening portion in which an interval between the first fin and the second fin is opened. 9. The method of claim 8,
And a protrusion provided on the other surface of the heat sink and located on an outer periphery of the air hole and spaced apart from the fin. 11. The method according to any one of claims 1 to 10,
An insulating layer having electrical insulation properties provided on at least a part of the surface of the heat sink; And
And a conductive layer provided on the insulating layer and capable of flowing a current. A lighting device having the light source module according to any one of claims 1 to 10.

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