KR101829186B1 - Ｚ 동작 및 관절 아암을 갖는 선형 진공 로봇 - Google Patents

Ｚ 동작 및 관절 아암을 갖는 선형 진공 로봇 Download PDF

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Publication number
KR101829186B1
KR101829186B1 KR1020100105257A KR20100105257A KR101829186B1 KR 101829186 B1 KR101829186 B1 KR 101829186B1 KR 1020100105257 A KR1020100105257 A KR 1020100105257A KR 20100105257 A KR20100105257 A KR 20100105257A KR 101829186 B1 KR101829186 B1 KR 101829186B1
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KR
South Korea
Prior art keywords
pulley
coupled
arm
chamber
magnetically
Prior art date
Application number
KR1020100105257A
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English (en)
Korean (ko)
Other versions
KR20110052462A (ko
Inventor
지 선 호이
테리 블럭
호앙 휘 부
지민 류
Original Assignee
인테벡, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 인테벡, 인코포레이티드 filed Critical 인테벡, 인코포레이티드
Publication of KR20110052462A publication Critical patent/KR20110052462A/ko
Application granted granted Critical
Publication of KR101829186B1 publication Critical patent/KR101829186B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/0009—Constructional details, e.g. manipulator supports, bases
    • B25J9/0021—All motors in base
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020100105257A 2009-11-10 2010-10-27 Ｚ 동작 및 관절 아암을 갖는 선형 진공 로봇 KR101829186B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US25992809P 2009-11-10 2009-11-10
US61/259,928 2009-11-10

Publications (2)

Publication Number Publication Date
KR20110052462A KR20110052462A (ko) 2011-05-18
KR101829186B1 true KR101829186B1 (ko) 2018-02-14

Family

ID=44174749

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100105257A KR101829186B1 (ko) 2009-11-10 2010-10-27 Ｚ 동작 및 관절 아암을 갖는 선형 진공 로봇

Country Status (4)

Country Link
JP (1) JP5984036B2 (zh)
KR (1) KR101829186B1 (zh)
CN (1) CN102110633B (zh)
TW (1) TWI458612B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5434990B2 (ja) * 2011-08-31 2014-03-05 株式会社安川電機 ロボットのアーム構造およびロボット
JP6213079B2 (ja) * 2013-09-09 2017-10-18 シンフォニアテクノロジー株式会社 Ｅｆｅｍ
US10014196B2 (en) 2015-10-20 2018-07-03 Lam Research Corporation Wafer transport assembly with integrated buffers
CN105583854A (zh) * 2016-03-11 2016-05-18 深圳市康明发机器人有限公司 一种机器人用多工位交换装置
CN109994358B (zh) * 2017-12-29 2021-04-27 中微半导体设备(上海)股份有限公司 一种等离子处理系统和等离子处理系统的运行方法
JP7181068B2 (ja) * 2018-11-30 2022-11-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
US11565402B2 (en) 2020-03-09 2023-01-31 Applied Materials, Inc. Substrate transfer devices, systems and methods of use thereof
CN117506964B (zh) * 2024-01-08 2024-03-22 江苏骠马智能工业设计研究有限公司 用于配电柜的操作机器人的分体式地刀结构

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009071180A (ja) * 2007-09-14 2009-04-02 Intevac Inc 基板を搬送及び処理する装置並びに方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4951601A (en) * 1986-12-19 1990-08-28 Applied Materials, Inc. Multi-chamber integrated process system
JPH0825151B2 (ja) * 1988-09-16 1996-03-13 東京応化工業株式会社 ハンドリングユニット
JPH0446781A (ja) * 1990-06-11 1992-02-17 Seiko Instr Inc 真空内磁気浮上搬送ロボット
US6121743A (en) * 1996-03-22 2000-09-19 Genmark Automation, Inc. Dual robotic arm end effectors having independent yaw motion
JP2001518710A (ja) * 1997-09-30 2001-10-16 セミトウール・インコーポレーテツド 直線状のコンベアシステムを有する半導体処理装置
JP2002066976A (ja) * 2000-08-28 2002-03-05 Assist Japan Kk 基板搬送用真空ロボット
US7988398B2 (en) * 2002-07-22 2011-08-02 Brooks Automation, Inc. Linear substrate transport apparatus
JP4283559B2 (ja) * 2003-02-24 2009-06-24 東京エレクトロン株式会社 搬送装置及び真空処理装置並びに常圧搬送装置
JP3935883B2 (ja) * 2004-01-06 2007-06-27 コリア インスティテュート オブ サイエンス アンド テクノロジー 可撓性ネジ駆動式高さ調節装置
US9524896B2 (en) * 2006-09-19 2016-12-20 Brooks Automation Inc. Apparatus and methods for transporting and processing substrates

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009071180A (ja) * 2007-09-14 2009-04-02 Intevac Inc 基板を搬送及び処理する装置並びに方法

Also Published As

Publication number Publication date
JP5984036B2 (ja) 2016-09-06
TWI458612B (zh) 2014-11-01
KR20110052462A (ko) 2011-05-18
CN102110633B (zh) 2016-08-24
CN102110633A (zh) 2011-06-29
JP2011103463A (ja) 2011-05-26
TW201124245A (en) 2011-07-16

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