KR101827541B1 - Device for test socket having crown-type surface-treated pad and method for manufacturing the same - Google Patents
Device for test socket having crown-type surface-treated pad and method for manufacturing the same Download PDFInfo
- Publication number
- KR101827541B1 KR101827541B1 KR1020150181178A KR20150181178A KR101827541B1 KR 101827541 B1 KR101827541 B1 KR 101827541B1 KR 1020150181178 A KR1020150181178 A KR 1020150181178A KR 20150181178 A KR20150181178 A KR 20150181178A KR 101827541 B1 KR101827541 B1 KR 101827541B1
- Authority
- KR
- South Korea
- Prior art keywords
- crown
- particles
- nickel
- tungsten
- conductive
- Prior art date
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
A method of manufacturing a test socket of the present invention includes the steps of: processing a connection pad in the form of a crown bump on an FPCB land; and performing a surface treatment on the crown bump to enhance the hardness of the connection pad and prevent natural oxidation . According to the structure of the present invention as described above, the contact characteristics with the conductive balls are enhanced through the roughness.
Description
The present invention relates to a test socket having a crown shape and a surface roughness and a method of manufacturing the same, and more particularly, to a test socket for inspecting electrical characteristics before a semiconductor device manufactured through a semiconductor package manufacturing process is shipped .
In general, semiconductor devices manufactured through complicated processes are inspected for their characteristics and defects through various electrical tests.
Specifically, in the electrical inspection of semiconductor devices such as semiconductor integrated circuit devices such as a package IC and an MCM, and wafers on which integrated circuits are formed, in order to electrically connect the terminals formed on one surface of the semiconductor device to be inspected and the pads of the test device to each other , A test socket is disposed between the semiconductor device and the test apparatus.
However, the test socket is provided with a conductive connector (wire or spring, etc.) for contacting the terminals provided in the test instrument.
However, in order to carry out the test, the terminal (e.g., the conductive pad) of the test instrument must be in contact with the connection terminal (e.g., conductive ball) of the semiconductor device. At this time, since the height of the plurality of conductive balls is not constant, there are conductive pads which are in easy contact with the solder balls, but there are other conductive pads. The height variation causes contact failures.
Since the conductive pads are generally flat and formed of copper (Cu), the surface of the conductive pads is slippery, and the conductive balls are likely to disengage arbitrarily after connection. There is a problem that electrical contact characteristics are deteriorated due to the inability to pass through the native oxide film of the conductive balls due to the ductility of copper itself. It also does not prevent corrosion of copper (Cu) itself, which is continuously exposed to air.
These problems significantly deteriorate the contact characteristics between the conductive balls and the conductive pads, which is a cause of deterioration of inspection yield.
SUMMARY OF THE INVENTION Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and it is an object of the present invention to provide a test socket in which a contact pad is not generated due to a flat shape and a soft nature of a conductive pad, will be.
Another object of the present invention is to provide a test socket in which a conductive pad has a surface roughness and a hardness capable of passing through a natural oxide film of a conductive ball, and a method of manufacturing the same.
According to an aspect of the present invention, there is provided a test socket comprising: an FPCB connected to an external conductive ball through a plurality of connection pads; an insulating silicone rubber bonded to an upper portion of the FPCB; A test socket comprising a conductive connector elastically supported by a silicone rubber and electrically connected to the connection pad, the conductive connector comprising a conductive wire or a conductive silicone rubber, the connection pad being provided in a crown bump type do.
According to another aspect of the present invention, there is provided a method of manufacturing a test socket, comprising the steps of: processing a connection pad in the form of a crown bump on an FPCB land; and hardening the hardness of the connection pad on the crown bump, And a surface treatment step of preventing surface roughness.
As described above, according to the configuration of the present invention, the following effects can be expected.
First, after the outer conductive ball is seated on the connection pad, there is no fear that it will be disengaged arbitrarily due to the crown shape tapering in the center direction. Particularly, the edges or corners of the crowns divided into a plurality of protrusions are rounded to facilitate seating and enhance contact properties.
Second, the metal particles are sprayed and deposited on the surface of the crown bumps to have a predetermined roughness, so that the conductive balls do not slip and are not arbitrarily removed, and can pass through the natural oxide film, thereby enhancing the contact characteristics.
Thirdly, there is an effect that silver (Au) is plated enough to cover nickel particles on the surface of copper which is easy to corrode, so that the progress of natural oxidation is suppressed and particles deposited are integrated with the connection pad.
1 is a perspective view showing a configuration of a test socket according to an embodiment of the present invention;
Fig. 2 is a perspective view showing a configuration of a test socket by round processing in Fig. 1; Fig.
3 is a sectional view taken along the line A-A 'in Fig. 1;
4 is a cross-sectional view showing a configuration in which metal particles are sprayed on the connection pad of Fig. 3; Fig.
Fig. 5 is a cross-sectional view showing a configuration in which the connection pad of Fig. 4 is metal-plated. Fig.
Brief Description of the Drawings The advantages and features of the present invention, and how to achieve them, will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. The dimensions and relative sizes of layers and regions in the figures may be exaggerated for clarity of illustration. Like reference numerals refer to like elements throughout the specification.
Embodiments described herein will be described with reference to plan views and cross-sectional views, which are ideal schematics of the present invention. Thus, the shape of the illustrations may be modified by manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention are not limited to the specific forms shown, but also include changes in the shapes that are produced according to the manufacturing process. Thus, the regions illustrated in the figures have schematic attributes, and the shapes of the regions illustrated in the figures are intended to illustrate particular types of test socket regions and are not intended to limit the scope of the invention.
Hereinafter, a preferred embodiment of a test socket including the crown-type connection pad having the above-described structure according to the present invention will be described in detail with reference to the accompanying drawings.
1 and 2, a
The FPCB 110 is a rigid printed circuit board (PCB) formed by printing copper (Cu) on an epoxy or phenol resin or a polyimide film having excellent ductility, A flexible printed circuit board (Flexible PCB) that forms various circuit patterns by copper (Cu), gold (Ag), and other conductive materials may be used. Here, a flexible printed circuit board is used for convenience.
The conductive connector may include an OWR-type bonding wire or an OPR-type conductive silicone rubber.
First, the conductive connector may include a conductive wire that is wire-bonded on the
As the conductive silicone rubber, silicone rubber, urethane rubber, epoxy rubber or other elastic rubber can be used. However, the conductive particles to be magnetically arranged may be mixed here. The conductive particles may be composed of iron, nickel, cobalt, other magnetic metal, or two or more alloys. Or a mixed type in which the above-mentioned conductive particles are plated on an insulating core. Or a compound in which a filler such as carbon (C) or the like is overfilled.
The conductive silicone rubber may be an unaligned conductive connector formed by including a conductive powder and a platinum (Pt) catalyst in a silicone rubber resin. In addition, the above-mentioned conductive powder among the unaligned conductive connectors may be a single metal of magnetic silver (Ag), iron (Fe), nickel (Ni), or cobalt (Co) .
The insulating
Here, the
Referring to FIG. 3, the
Therefore, the conductive balls can be stably mounted on the multiple projections. It can be seen that the overall contact is improved because the edges of the protruding portion and the recessed boundary region break or pierce the natural oxide film and are in contact with the conductive balls 104.
In addition, there is a possibility that the
Further, the conductive balls are mounted on the
The surface treatment method primarily provides roughness. Nickel (Ni) or tungsten (W) is thermally sprayed on the
The surface-treated
Since the
Hereinafter, a method of manufacturing a test socket having a crown-shaped connection pad according to the present invention will be described.
The
Surface roughening can be performed on the crown-processed bumps.
Referring to FIG. 4, a nickel (Ni) particle or a tungsten (W) particle is thermally sprayed on a copper (Cu)
Referring to FIG. 5, silver (Au) is plated to a predetermined thickness on copper (Cu) in two steps. The above-described particles can be further fixed on the
As described above, according to the present invention, in order to prevent the conductive ball from falling off after being seated on the connection pad, the shape of the connection pad is formed into a crown shape protruding from the periphery of the center pad, tapered so as to be pressed in the center direction, It is a technical idea to construct a structure in which nickel (Ni) particles having hardness on an easy surface are sprayed to strengthen the contact and silver (Au) for preventing natural oxidation is coated on copper (Cu) . Many other modifications will be possible to those skilled in the art, within the scope of the basic technical idea of the present invention.
100: Test socket
102: connection pad
110: FPCB
120: Insulated silicone rubber
Claims (10)
An insulative silicone rubber bonded to the top of the FPCB; And
And a conductive connector elastically supported by the insulating silicone rubber and electrically connected to the connection pad,
Wherein the conductive connector comprises a conductive wire or a conductive silicone rubber,
The connection pad is provided in a crown bump type,
Wherein the crown bump has a surface roughness and thermal spraying of the second hardness metal particles through the surface treatment larger than the crown bumps of the first hardness,
The nickel (Ni) particles or the tungsten (W) particles having the second hardness are sprayed on the copper (Cu) surface having the first hardness,
The upper surface of the nickel (Ni) particle or the tungsten (W) particle is coated with silver (Au) having higher electrical conductivity than the copper (Cu), nickel (Ni), and tungsten (W) Wherein the nickel (Ni) particles or tungsten (W) particles form irregularities in the lower part to realize the surface roughness.
Wherein the crown bump has a height and includes a concave portion having a first height and a convex portion having a second height higher than the first height.
Wherein the convex portion surrounds the concave portion, the convex portion is divided into a plurality of portions, and an edge or a corner of the divided block portion is rounded.
And the second height of the convex portion is a tapered shape gradually becoming lower toward the concave portion.
And a surface treatment step of strengthening the hardness of the connection pad on the crown bump and preventing natural oxidation,
Depositing nickel (Ni) particles or tungsten (W) particles on the crown bumps made of copper (Cu) by thermal spraying, and
And plating silver (Au) on the copper (Cu) so as to cover at least the particles,
The upper surface of the nickel (Ni) particle or the tungsten (W) particle is coated with silver (Au) having higher electrical conductivity than the copper (Cu), nickel (Ni), and tungsten (W) Wherein the nickel (Ni) particles or the tungsten (W) particles form irregularities at the bottom to realize surface roughness.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150181178A KR101827541B1 (en) | 2015-12-17 | 2015-12-17 | Device for test socket having crown-type surface-treated pad and method for manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150181178A KR101827541B1 (en) | 2015-12-17 | 2015-12-17 | Device for test socket having crown-type surface-treated pad and method for manufacturing the same |
Publications (2)
Publication Number | Publication Date |
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KR20170072693A KR20170072693A (en) | 2017-06-27 |
KR101827541B1 true KR101827541B1 (en) | 2018-02-08 |
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KR1020150181178A KR101827541B1 (en) | 2015-12-17 | 2015-12-17 | Device for test socket having crown-type surface-treated pad and method for manufacturing the same |
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Families Citing this family (1)
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KR101974931B1 (en) * | 2018-05-03 | 2019-05-03 | 주식회사 티에프이 | Test socket module for semiconductor package |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4140593B2 (en) * | 2004-09-21 | 2008-08-27 | 住友電気工業株式会社 | Metallized substrate |
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Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4140593B2 (en) * | 2004-09-21 | 2008-08-27 | 住友電気工業株式会社 | Metallized substrate |
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