KR101821227B1 - Arrayed Resistance Element Package Manufacturing system Using a Laser Beam and Method for the same - Google Patents

Abstract

The present invention relates to a system and method to manufacture an array type resistor package by using laser. The system includes: a lead bonder for the combination of a fuse element, forming an array type lead wire package by thermally bonding a plurality of fuse elements to a side of a plurality of elements for lead wires by emitting a laser beam; and a resistor bonder forming an array type resistor package including a fuse element fused in the case of heat emission on a line forming the lead wires of each of the fuse elements by emitting a laser beam to a tip of a resistor wire, which is formed in a side of each of the resistors, and thermally bonding the lead wires, combined with the fuse elements of the array type lead wire package, one to one. Accordingly, the present invention is capable of improving the productivity of a resistor including a fuse element fused in the case of heat emission on a line of a lead wire by including the lead bonder for the combination of a fuse element, forming the array type lead wire package, and the resistor bonder forming the array type resistor package.

Description

[0001] The present invention relates to an array resistive element package manufacturing system using a laser,

The present invention relates to a system and a method for manufacturing an array resistor package using a laser, and more particularly, to an array resistor package having an array type thermal fuse lead wire element and an array type resistor lead wire element having a lead wire adapter for a thermal fuse and a resistor- The present invention relates to an array type resistor package manufacturing system and a method of manufacturing an array type resistor package using a laser, which can increase the productivity of an array type resistor package including a thermal fuse that is heated on a lead wire line by laser welding.

Generally, electric circuits of large electronic products such as LCD TV and PDP TV are equipped with a fuse resistor at the power input terminal of the electric circuit to prevent a malfunction caused by inrush current, internal temperature rise, A protection element such as a thermal fuse resistor is provided to protect the power supply circuit.

These fuse resistors first have a resistor and a thermal fuse, and the resistor and the thermal fuse are connected in series with each other through a lead wire.

In addition, the fuse resistor is packaged with a resistor and a thermal fuse as a case so that other electronic components are not affected by fragments generated during melting of the package.

The end of the lead wire extends to extend out of the case, and the conventional fuse resistor is installed on the printed circuit board such that the end of the lead wire is connected to the printed circuit board and the resistor and the thermal fuse are installed.

Therefore, when the inrush current flows into the fuse resistor, the resistor is used to limit the fuse resistor to a predetermined current. When the overcurrent flows into the fuse resistor, the heat generated by the resistor is transferred to the thermal fuse By shorting, the electric circuit of the appliance is protected.

On the other hand, a fuse resistor has a structure in which a resistor and a thermal fuse are connected in series by using lead wires, and then a resistor and a thermal fuse are received in a state where an end of the lead wire is drawn out, , A resistor and a thermal fuse can be manufactured in a state in which they are disposed inside the case.

However, in the manufacturing process of the conventional fuse resistor according to the related art, the manufacturing process of connecting the thermal fuse in series on the lead line of the resistor according to the prior art is performed by the operator manually connecting the thermo- There is a problem that the production time is increased and the product is defective due to the product defects.

Therefore, there is a need for a practical and applicable technology for manufacturing technology that can reduce manufacturing time and product defect rate in a process of connecting a resistor and a thermal fuse in series using a lead wire.

A public utility model publication No. KR 20-2014-0000664 (publication date 2014.02.03.)

SUMMARY OF THE INVENTION The present invention has been conceived in order to solve the problems described above, and it is an object of the present invention to provide a thermal fuse lead wire adapter and a resistor resistor adapter, in which an array type thermal fuse lead wire element and an array type resistor lead wire element are thermally bonded There is provided a system for manufacturing an array resistor package using a laser and a method thereof, which can increase the productivity of an array resistor package having a thermal fuse blown upon heating on a lead wire line.

The array type resistor package manufacturing system using the laser according to the embodiment of the present invention is a system for manufacturing an array type resistor package using a laser, which irradiates a laser beam to one end of a plurality of solenoid bodies to thermally connect the plurality of solenoid bodies to one side of each of the plurality of temperature fuse lead wires, A lead wire adapter for a thermal fuse forming an array type thermal fuse lead wire element having a soluble body coupled thereto; And a plurality of thermal fuse lead wires constituting the array type thermal fuse lead wire element are arranged in a one-to-one correspondence with one side of the array type resistor lead wire element having a plurality of resistors so that the plurality of heating elements are located, And the thermal fuse lead wire element and the array type resistor lead wire element are thermally joined to each other by irradiating a laser beam at the other end with a laser beam to form a thermal fuse And a resistor lead wire adapter forming the array resistor package.

The lead fuse attachment device includes a plurality of winders and an element supply part for supplying a fuse element wire in a wire winding manner; An element cutting portion that cuts a fusible element element wire supplied by the element supply portion to a predetermined length corresponding to a fusible element used in the thermal fuse lead adjuster to form a fusible element element; An element transferring unit for supplying a usable body element wire supplied from the element supplying unit to the element cutting unit and sucking and transferring the usable body element cut by the element cutting unit with a vacuum gripper; An element jig having an element mounting groove on an upper surface thereof for mounting a movable element transferred by a vacuum gripper of the element transferring unit; A lead wire jig having a lead wire mounting groove on an upper surface thereof for mounting a body of the thermal fuse lead wire arranged corresponding to the fusible element; And a plurality of probes for pressing and fixing the temperature fuse lead wires, respectively, when the temperature fuse lead wires are more than one, are arranged at one side of the lower side of the main body, ; And a laser part for irradiating a laser through a laser penetrating hole opened in an upper part of the main body of the clamping part to thermally join an end of the soluble element fixed to the element jig to one end of the thermal fuse lead wire have.

Wherein the element cutting portion includes an element guide having a plurality of horizontal through holes through which a plurality of usable element wire supplied from the element supplying portion passes at a predetermined interval; A stepping motor for controlling the plurality of usable element wire wires passing through the horizontal through holes of the element guide to be exposed to a predetermined length; An element cutting plate for simultaneously cutting a plurality of usable body element wires exposed in a predetermined length by the stepping motor in a vertical direction to form a plurality of usable body elements; And a cutting vertical cylinder for guiding vertical up and down linear reciprocating motion of the element cutting plate.

Wherein the element cutting portion includes a pair of urethane rollers for simultaneously supporting the plurality of soluble element wire wires in the body mounted on the front side of the element guide at the upper and lower sides with a predetermined tension and for passing the horizontal through holes .

Wherein the element transferring portion includes a direction changing roller bearing formed on one side for switching the traveling direction of the plurality of usable element elements supplied from the winder of the element supplying portion to a plurality of horizontal through holes formed in the element guide of the element cutting portion, part; And a vacuum gripper for sucking the plurality of usable body elements cut in the element cutting unit by an air cylinder method and transferring the plurality of usable body elements to a plurality of element mounting grooves formed on the upper surface of the element jig.

Wherein the element transferring portion comprises: a linear horizontal transferring portion for guiding the front and rear linear reciprocating of the vacuum gripper; And a linear vertical transfer unit for guiding the upper and lower linear reciprocating of the vacuum gripper.

The vacuum gripper may have a generally rectangular parallelepiped shape and may have a plurality of element absorption grooves corresponding to the plurality of element mounting grooves on the bottom surface thereof.

Wherein the element jig includes: an element jig guide portion for mounting a plurality of the movable element elements; A jig vertical cylinder portion for guiding vertical up and down reciprocation of the element jig guide portion in the vertical direction; And a jig horizontal cylinder portion for maintaining a linear reciprocation in the horizontal direction of the element jig guide portion.

The element jig guide portion includes a plurality of element mounting grooves arranged at regular intervals to mount a plurality of the free element elements on one side of the upper surface; A plurality of welding lead wire mounting grooves arranged at regular intervals to receive a part of one side of a plurality of thermal fuse lead wires corresponding to the fusible element elements on the other side of an upper surface; And a laser welding groove having a V-shaped cross section between the plurality of element mounting grooves and the plurality of welding lead wire mounting grooves.

The lead wire jig includes: a jig main body; A floating joint portion disposed on the upper side of the jig main body to guide upward and downward linear reciprocating movements of the clamping portion by coupling a plurality of guide shafts formed on both sides in the longitudinal direction of the clamping portion upward; And a plurality of temperature fuse lead wires which are detachably arranged in a direction perpendicular to the upper surface of the jig main body and which are partly exposed at one side of the temperature fuse lead wires corresponding to the usable element mounted on the element jig, A lead wire jig guide having lead wire mounting grooves; And a receiving portion for receiving the lead wire jig guide on an upper surface thereof and disposed on an upper surface of the jig main body, wherein when the laser portion irradiates a laser beam, a left and right linear reciprocating motion of the lead wire jig guide is induced, And a jig guide horizontal transfer unit operable to receive the soluble element for two consecutive times.

The laser unit may be a scanner system capable of adjusting the laser irradiation direction to a left or right within a predetermined range when the soluble element and the thermal fuse lead wire are thermally bonded to each other by irradiating a laser.

Wherein the resistor-type resistor comprises: a resistor-fused junction jig in which the array-type thermal fuse-lead wire elements are spaced apart from each other on the same line line on the upper side of the array-type resistor lead wire element; A resistor jig accommodating portion accommodating the resistor jig portion and having a linear actuator of a stepping motor type to support left and right linear reciprocating motion of the resistor jig portion; A push transfer section for performing a pushing operation toward the array type thermal fuse lead wire element side to bring the opposite ends of the array type resistor fuse lead wire element into contact with the array type resistor fuse lead wire element; And a laser part for irradiating a laser beam to the resistor-resistor adductor in a pressing operation of the push-to-send part to heat-couple the opposing ends of the array type resistor lead wire element and the array type thermal fuse lead wire element.

The resistor jigs are provided with resistors constituting the arrayed resistor lead wire element and a first resistor jig guide formed by arranging a plurality of fixing grooves for fixing the resistor lead wires at regular intervals; A second resistor jig guide formed by arranging a plurality of mounting grooves for allowing the heating element and the thermal fuse lead wires constituting the array type thermal fuse lead wire element to flow on the line; And an array type resistor formed in a longitudinal direction on an upper surface of the semiconductor chip and integrally formed with a through hole for sequentially and continuously passing the laser beam in correspondence with a pressing operation of the push- And a clamping jig for simultaneously fixing the lead wire element and the array type thermal fuse lead wire element mounted on the mounting groove of the second resistor jig guide.

Wherein the push-to-send unit includes: a push housing having a plurality of inner fins arranged at predetermined intervals in front to sequentially perform a pressing operation on the other end of the plurality of thermal fuse rod wires constituting the array type thermal fuse lead wire element; And a cylinder-type push drive unit for driving the front and rear linear reciprocating movements before and after the pushing operation of the push housing.

A method of manufacturing an array resistor package using a laser according to an embodiment of the present invention includes the steps of: stacking a semi-finished array type thermal fuse lead wire element on a lined wire jig of a thermal fuse lead wire adapter; Cutting the soluble element wire supplied from the element supply portion of the lead wire adapter for the thermal fuse to a predetermined length in the element cutting portion to form a first usable element; Mounting the primary fuse element on the element jig of the lead wire adapter for the thermal fuse by sucking it with a vacuum gripper; Fixing the first usable body element and the semi-finished array type thermal fuse lead wire element using the clamping portion of the thermal fuse lead wire adapter; Thermally fusing the soluble element to a right side of the array type thermal fuse lead wire element in the semi-product state by irradiating a laser to a thermal fuse lead wire in a range corresponding to half of the total quantity; Horizontally transporting the lead wire jig of the lead wire adapter for the thermal fuse to the right; Cutting the fusible element wire supplied from the element supplying portion of the lead wire adapter for the thermal fuse to a predetermined length in the element cutting portion to form a second fusible element; Placing the secondary fuse element on the element jig of the lead wire adapter for the thermal fuse by sucking it with a vacuum gripper; Fixing the secondary fuse element and the semi-finished array fuse lead wire element using the clamping portion of the lead wire adapter for the thermal fuse; And the second fuse lead wire is thermally bonded to the left side of the array type thermal fuse lead wire element in the semi-product state to a left side of the thermal fuse lead wire in a range corresponding to half of the total quantity, Type thermal fuse lead wire element; Stacking an array type resistor lead wire element having a plurality of resistors in a semi-finished product state and an array type thermal fuse lead wire element having the soluble body coupled thereto in a resistor junction jig portion of a resistor lead wire adapter; A plurality of inner fins arranged in front of a push housing constituting a push transfer portion of the resistor lead wire adapter sequentially perform a pressing operation to the right side of the half-finished product array resistor wire element, And thermally fusing the array type thermal fuse lead wire element in the semi-finished product state; And a plurality of inner pins arranged in front of a push housing constituting a push transfer portion of the resistor lead wire adapter are horizontally moved to the right and the resistor jig jig portion of the resistor lead wire adapter is sequentially pushed, The array type resistor fuse lead wire element is thermally bonded to the left side of the array type resistor lead wire element by laser irradiation in a range corresponding to half of the total quantity to form an array resistor package having a thermal fuse ; ≪ / RTI >

As described above, according to the present invention, a thermal fuse lead wire adapter and a resistor-type resistor are provided, and the array type thermal fuse lead wire element and the array type resistor lead wire element are thermally joined to each other by laser welding to generate heat on the lead wire line There is provided an array type resistor package manufacturing system and method thereof using a laser capable of increasing the productivity of an array type resistor package having a thermal fuse to be melted.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing an overall configuration of an array resistor package manufacturing system using a laser according to an embodiment of the present invention; FIG.
FIG. 2 is a view for explaining an element supply portion of the lead wire adapter for the thermal fuse shown in FIG. 1. FIG.
3 is a view for explaining an element cutting portion of the lead wire adapter for the thermal fuse shown in FIG.
4 is a view for explaining an element transferring portion of the lead wire adapter for the thermal fuse shown in FIG.
5 is a view for explaining an element jig of the lead wire adapter for the thermal fuse shown in FIG.
6 is a view for explaining a lead wire jig of the lead wire adapter for the thermal fuse shown in FIG.
7 is a view for explaining a clamping part of the lead wire adapter for the thermal fuse shown in FIG.
8 is a view for explaining the laser part of the lead wire adapter for the thermal fuse shown in Fig.
9 is a view of an arrayed thermal fuse lead wire element formed by the lead wire adapter for the thermal fuse shown in FIG.
10 is a view for explaining a resistor junction jig, a resistor jig receiving portion, and a push transfer portion constituting the resistor lead wire adapter shown in FIG. 1;
11 is a view for explaining the resistor-joined jig shown in FIG. 10 in detail.
FIG. 12 is a diagram for explaining the operation of the push transmission shown in FIG. 10; FIG.
13 is a view for explaining a lens portion of the resistor lead wire adapter shown in Fig.
14 is a view for explaining an array type resistor package having a thermal fuse completed by the resistor lead wire adapter shown in Fig.
15 is a flowchart schematically showing a method of manufacturing an array resistor package using a laser according to an embodiment of the present invention.

The description of the present invention is merely an example for structural or functional explanation, and the scope of the present invention should not be construed as being limited by the embodiments described in the text. That is, the embodiments are to be construed as being variously embodied and having various forms, so that the scope of the present invention should be understood to include equivalents capable of realizing technical ideas.

Meanwhile, the meaning of the terms described in the present invention should be understood as follows.

The terms "first "," second ", and the like are intended to distinguish one element from another, and the scope of the right should not be limited by these terms. For example, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

It is to be understood that when an element is referred to as being "connected" to another element, it may be directly connected to the other element, but there may be other elements in between. On the other hand, when an element is referred to as being "directly connected" to another element, it should be understood that there are no other elements in between. On the other hand, other expressions that describe the relationship between components, such as "between" and "between" or "neighboring to" and "directly adjacent to" should be interpreted as well.

It should be understood that the singular " include "or" have "are to be construed as including a stated feature, number, step, operation, component, It is to be understood that the combination is intended to specify that it does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

In each step, the identification code (e.g., a, b, c, etc.) is used for convenience of explanation, the identification code does not describe the order of each step, Unless otherwise stated, it may occur differently from the stated order. That is, each step may occur in the same order as described, may be performed substantially concurrently, or may be performed in reverse order.

All terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, unless otherwise defined. Commonly used predefined terms should be interpreted to be consistent with the meanings in the context of the related art and can not be interpreted as having ideal or overly formal meaning unless explicitly defined in the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing an overall configuration of an array resistor package manufacturing system using a laser according to an embodiment of the present invention; FIG.

As shown in FIG. 1, an array type resistor package manufacturing system using a laser according to an embodiment of the present invention includes a lead wire adapter 100 for a thermal fuse and a resistor lead wire adapter 200.

More specifically, referring to FIG. 9 to be described later, the lead wire adapter 100 for a thermal fuse has a structure in which a plurality of solar cells 10 are irradiated with a laser beam by irradiating one end of a plurality of solar cells 10, The thermal fuse lead wire element 300 is thermally bonded to one side of each of the plurality of thermal fuse lead wires 20 to form an array type thermal fuse lead wire element 300 in which the useable element 10 is coupled to one side.

14, which will be described later, the resistor lead wire adapter 200 has a structure in which the plurality of the usable bodies 10 are disposed at one side of the arrayed resistor lead wire element 400 having a plurality of resistors 30 A plurality of thermal fuse lead wires 20 constituting the array type thermal fuse lead wire element 300 are arranged so as to correspond one to one to irradiate the other end of the plurality of thermal fuse lead wires 300 with the laser beam, Type thermal fuse lead wire element 300 and the array type resistor lead wire element 400 are thermally joined to each other to form an arrayed resistor lead wire element 400 having a thermal fuse Type resistor package 500 can be formed.

In this case, in the embodiment of the present invention, the thermal fuse may indicate the movable body 10 which is heated when the over-current is applied to the resistor 30.

Here, the fuse 10 constituting the thermal fuse is made of a metal such as lead, tin, and a tin alloy, and is fused when heated so as to block the electrical connection.

In addition, in the embodiment of the present invention, the resistor 30 protects the internal resistance line (not shown) and improves the explosion-proof characteristic, though not shown in the figure, by coating silicon thinly on the surface of the resistance line Coating layer. That is, by including a coating layer on the resistor 30, even if the resistor 30 is exploded due to an abnormal current, part of the shock or noise can be absorbed to improve the explosion resistance of the product.

As shown in the figure, the thermal fuse lead wire adapter 100 and the resistor lead wire adapter 200 according to the embodiment of the present invention may include an upper control box 1 on the upper side, And a lower control box 4 on the lower side.

Here, the control touch panel 2 is disposed on the front surface of the upper control box 1, and the laser control panel 3 can be separately mounted on the frame. An emergency stop switch 5 may be formed on a vertical support for supporting the upper control box 1 and both hands of the lower control box 4 may be operated simultaneously A plurality of positive operation buttons 6 may be provided.

Next, referring to FIGS. 2 to 9, the thermal fuse lead wire adapter shown in FIG. 1 according to an embodiment of the present invention will be described in detail.

1, the lead wire adapter 100 for a thermal fuse described above includes an element supply unit 110, an element cutting unit 120, an element transfer unit 130, an element jig 140, A jig 150, a clamping unit 160, and a laser unit 170.

2 is a view for explaining an element supplying portion of a lead wire adapter for a thermal fuse shown in FIG. 1, wherein the element supplying portion 110 A wire feeding roller unit 112 for feeding the movable element wire in a wire winding manner with a plurality of winders 111 and for feeding the wires wound on the plurality of winders 111 downwardly, .

In the embodiment of the present invention, as shown in the figure, on the left and right sides of the main body of the lead wire adapter 100 for a thermal fuse, an element supply base plate 113 ), It can be seen that 20 usable element element wires are supplied through the element supply part 110 as a whole when operating in one operation.

3 is a view for explaining an element cutting portion of the lead wire adapter for the thermal fuse shown in FIG.

As shown in the figure, the element cutting portion 120 is formed by cutting a fusible element element wire supplied by the element supply portion 110 into a fusible element 10 used in the thermal fuse lead adapter 100 So that the soluble element can be formed.

More specifically, the element cutting portion 120 may include an element guide 121, a stepping motor 122, an element cutting plate 123, a cutting vertical cylinder 124, and a urethane roller 125 have.

The element guide 121 may include a plurality of horizontal through holes 121-1 through which a plurality of soluble element wires supplied from the element supplying unit 110 are passed at regular intervals, 20 holes may be formed at regular intervals corresponding to 20 element wires supplied from the element supplying unit 110. [

The stepping motor 122 can control a plurality of usable element wire wires passing through the horizontal through hole 121-1 of the element guide 121 to be exposed at a predetermined length. The horizontal through hole 121 -1 can be limited to the length corresponding to the movable body 10.

In addition, the element cutting plate 123 can simultaneously form a plurality of usable element elements by simultaneously cutting a plurality of usable element wire exposed by a certain length by the stepping motor 122 in the vertical direction, And a cutting plate guide 123-1 for guiding a path in the vertical direction may be provided downward.

The cutting vertical cylinder 124 is provided to guide the vertical upward and downward reciprocating motion of the element cutting plate 123 in a vertical and downward direction, and a cylinder bracket 124-1 for operating in an air cylinder manner can do.

The urethane roller 125 supports the plurality of soluble element wires at the same time in the upper and lower sides of the main body 120-1 in which the element guide 121 is mounted at the front, And a pair of spring bushes 126 for applying a repulsive force to the upper urethane roller may be installed to maintain the tension.

4 is a view for explaining an element transferring part of the lead wire adapter for a thermal fuse shown in FIG. 1, wherein the element transferring part 130 includes a movable element element wire 110, which is supplied from the element supplying part 110, To the element cutting unit 120, and the cutable element cut at the element cutting unit 120 may be sucked and transported by the vacuum gripper.

Here, the element transferring unit 130 may include a direction changing roller bearing 131 and a vacuum gripper 132, as shown in the figure.

More specifically, the direction-changing roller bearing part 131 switches the traveling direction of a plurality of usable element elements supplied from the winder 111 of the element supplying part 110 to move the element cutting part 120, May be formed at one side of the element transferring part 130 to guide the element transferring part 130 to a plurality of horizontal through holes 121-1 formed in the element guide 121 of the element transferring part 130. [

That is, the usable element element wire supplied from the element supply portion 110 disposed on the side of the lead wire adapter 100 for the thermal fuse is first wound on the wire feed roller portion 100 described in Fig. 2, And the entirety of the plane is supplied through one diagonal line of the direction changing roller bearing portion 131 having an inverted triangle shape, and the sheet is fed through the direction changing roller bearing portion 131 And may be supplied in a straight line with respect to the horizontal through hole 121-1 formed in the element guide 121 of the element cutting portion 120. [

In addition, the vacuum gripper 132 may be formed by sucking a plurality of usable body elements cut in the element cutting portion 120 by an air cylinder method to form a plurality of element jigs 140 formed on the upper surface of the element jig 140 shown in FIG. And can be transferred to the element mounting groove 141-1.

At this time, the vacuum gripper 132 has a plurality of suction grooves 132-1 on the lower surface corresponding to the usable body elements, and an air suction hole is formed in the center of the suction glow plug 132-2 .

4, the element transferring unit 130 includes a linear horizontal transfer unit 133 for guiding the front and rear linear reciprocation of the vacuum gripper 132, And a linear vertical transfer unit 134 for guiding upper and lower linear reciprocating motion of the vertical transfer unit 132.

At this time, the vacuum gripper 132 has a rectangular parallelepiped shape as a whole. Although not shown in the drawing, the vacuum gripper 132 has a plurality of element adsorption grooves (not shown) corresponding to the plurality of element entry grooves 141-1 can do.

5 is a view for explaining an element jig of the lead wire adapter for the thermal fuse shown in FIG.

In the embodiment of the present invention, the element jig 140 of the lead wire adapter for the thermal fuse has an element mount (not shown) for mounting the fusible element transferred by the vacuum gripper 132 of the element transferring unit 130 And the groove 141-1 may be provided on the upper surface.

The element jig 140 may include an element jig guide portion 141, a jig vertical cylinder portion 142, and a jig horizontal cylinder portion 143, as shown in the drawing.

More specifically, the element jig guide portion 141 includes a plurality of element mounting grooves 141-1 arranged at regular intervals so as to mount a plurality of the movable element elements on one side of the upper surface, A plurality of welding lead wire mounting grooves 141-2 arranged at regular intervals to receive a part of one side of the plurality of thermal fuse lead wires 20 corresponding to the flexible element, And a laser welding groove 141-3 having a V-shaped cross section between the plurality of welding lead wire fixing grooves 141-1 and 141-2.

The jig vertical cylinder portion 142 operates in an air cylinder manner to induce vertical up and down reciprocation of the element jig guide portion 141 in the vertical direction and the jig horizontal cylinder portion 143 operates in an air cylinder manner It is possible to induce a linear reciprocation in the horizontal direction of the element jig guide portion 141.

6 is a view for explaining a lead wire jig of the lead wire adapter for the thermal fuse shown in FIG.

In the embodiment of the present invention, the lead wire jig 150 may be provided on the upper surface with a lead wire mounting groove 153-1 for mounting the body of the thermal fuse lead wire disposed corresponding to the soluble element.

More specifically, the lead wire jig 150 may include a jig main body 151, a floating joint portion 152, a lead wire jig guide 153, and a jig guide horizontal transfer portion 154.

Here, the floating joint part 152 is formed by coupling a plurality of guide shafts 161 formed on both sides in the longitudinal direction of the clamping part 160 shown in FIG. 7, which will be described later, to the upper side of the clamping part 160 And may be disposed on the upper side of the jig main body 151. [

The lead wire jig guide 153 is detachably installed in the vertical direction of the upper surface of the jig main body 151 and is connected to the fuse lead wire of the thermal fuse corresponding to the usable element placed on the element jig 140. [ A plurality of lead wire mounting grooves 153-n that can mount the thermal fuse lead wires 20 in a double number as compared with the number of the usable element elements that are mounted on the element jig 140 in a state where a part of one side portion is exposed to the outside, 1).

The jig guide horizontal transfer unit 154 is provided on the upper surface of the jig main body 151 with a receiving portion 154-1 for receiving the lead wire jig guide 153 on its upper surface, When the laser is irradiated by the laser unit 170 shown in FIG. 8 to be described later, it is possible to induce the left and right linear reciprocating motion of the lead wire jig guide 153, have.

FIG. 7 is a view for explaining the clamping part of the lead wire adapter for the thermal fuse shown in FIG. 1, and FIG. 8 is a view for explaining the laser part of the lead wire adapter for the thermal fuse shown in FIG.

As shown in the figure, in the embodiment of the present invention, the clamping part 160 has a punch part 163 for pushing and fixing at the same time when one or more of the free body elements is disposed on one side of the lower part of the main body, A plurality of probes 164 for individually pressing and fixing the thermal fuse lead wires may be disposed.

The laser unit 170 irradiates a laser beam passing through the laser through hole 162 opened in the upper portion of the main body of the clamping unit 160 so that the tip of the usable body element, The thermal fuse can be thermally bonded to one end of the lead wire.

At this time, the laser unit 170 may be a scanner system that can adjust the laser irradiation direction to a left or right in a certain range when the soluble element and the thermal fuse lead wire are thermally bonded to each other by irradiating the laser.

That is, in the embodiment of the present invention, the laser part 170 may be positioned at the center of the plurality of usable elements held in the element jig 140, and the laser may be irradiated.

The laser unit 170 according to an embodiment of the present invention includes an adjustment handle 172 on the laser top panel 171 to adjust the intensity of the laser beam when the laser is irradiated, A linear guide shaft 174 may be additionally provided.

9 is a view of an arrayed thermal fuse lead wire element formed by the lead wire adapter for the thermal fuse shown in FIG.

As shown in the drawing, a lead wire adapter for a thermal fuse according to an embodiment of the present invention is a semiconductor device in which a laser beam is irradiated to one end of a plurality of movable bodies 10 The plurality of heating elements 10 may be thermally bonded to one side of each of the plurality of thermal fuse lead wires 20 to form an array type thermal fuse lead wire element 300 having an available body 10 coupled to one side thereof .

10 is a view for explaining a resistor junction jig, a resistor jig receiving portion, and a push transfer portion constituting the resistor lead wire adapter shown in FIG. 1;

Referring to FIGS. 1 and 10, the resistor lead wire adapter 200 according to the embodiment of the present invention includes a resistor jig 210, a resistor jig receiving part 220, a push transfer section 230, and a resistor laser section 240.

As shown in the drawing, the resistor-fused junction jig 210 is arranged such that the array-type thermal fuse lead wire elements 400 are arranged at regular intervals on the same line line on the upper side of the arrayed resistor lead wire element 300 .

The resistor jig receiving portion 220 includes a linear actuator 221 that receives the resistor jigs 210 and is a stepping motor type so as to support the left and right linear reciprocating motion of the resistor jigs 210 can do.

The push-type transfer unit 230 performs a pushing operation to the other side of the array-type thermal fuse lead wire element 300 so that the array-type resistor fuse lead wire element 300 and the array- So that the opposite end of the contact surface can be brought into contact with each other.

Here, the resistor-body junction jig 210 will be described with reference to FIG.

FIG. 11 is a view for explaining in detail the resistor-joined jig shown in FIG. 10, and FIG. 12 is a view for explaining the operation of the push-connect unit shown in FIG.

The resistor jigs 210 may include a first resistor jig 211, a second resistor jig 212, and a clamping jig 213, as shown in FIG.

The first resistor jig 211 includes a plurality of fixing grooves 211-1 for fixing the resistor 30 and the resistor lead wire 40 constituting the arrayed resistor lead wire element 400, May be arranged at regular intervals.

The second resistive element jig guide 212 may be formed in a manner to allow the movable body 10 and the thermal fuse lead wire 20 constituting the array type thermal fuse lead wire element 300 to flow- A plurality of mounting grooves 212-1 may be arranged at regular intervals. Meanwhile, in the embodiment of the present invention, the second resistor jig 212 may be replaced with the lead wire jig guide 153 described in Fig.

The clamping jig 213 has an integral through-hole, which is formed in the upper surface of the clamping jig 213, for longitudinally and continuously penetrating the laser beam in response to a pressing operation of the push- The array type resistor lead wire element 400 mounted on the fixing groove 211-1 of the second resistor jig guide and the array type thermal fuse lead wire element 300 mounted on the mounting groove 212-1 of the second resistor jig guide are simultaneously Can be fixed.

11, first, the array resistor lead wire element 400 is loaded in the fixing groove 211-1 of the first resistor jig guide, and then the mounting groove 212-1 of the second resistor jig guide The thermal fuse lead wire element 300 is loaded and finally fixed by the clamping jig 213. [

In addition, as shown in the drawings, in the embodiment of the present invention, the push transfer section 230 may include a push housing 231 and a push drive section 232.

Here, the push housing 231 includes a plurality of inner fins 231-i to sequentially perform a pressing operation on the other end of the plurality of thermal fuse rod wires 20 constituting the array type thermal fuse lead wire element 300, 1) can be arranged at regular intervals in front.

In addition, the push drive unit 232 can guide the forward and backward linear reciprocating motion in a cylinder manner before and after the pushing operation of the push housing 231.

12, the inner pins 231-1 mounted on the push transfer portion 230 are mounted with 20 of the 40 resistor lead wires 40 constituting the arrayed resistor lead wire element 400, And requires two consecutive operations at the time of laser irradiation by the lens unit described later.

More specifically, although not shown in the drawing, the plurality of inner pins 231-1 sequentially perform the pressing operation to open the lead wires disposed in the right region of the resistor jigs jig guide portion 211 And the lead wires, which are disposed in the left region after the resistor jig jig guide portion 211 is moved horizontally to the right, can be thermally bonded by the sequential pressing operation of the inner pins 231-1.

13 is a view for explaining a lens portion of the resistor lead wire adapter shown in Fig.

The resistor laser unit 240 according to the embodiment of the present invention irradiates a laser beam to the resistor 200 during the pushing operation of the push transfer unit 230 to apply the laser beam to the arrayed resistor lead wire element 400, Type thermal fuse lead wire element 300 can be thermally bonded to each other, and the configuration of the thermal fuse lead wire element 300 is the same as that of the laser part described above with reference to FIG. 8, and a description thereof will be omitted.

14 is a view for explaining an array type resistor package having a thermal fuse completed by the resistor lead wire adapter shown in Fig.

As shown in the figure, according to an embodiment of the present invention, the resistor lead wire adapter 200 includes an arrayed resistor lead wire element 400 having a plurality of resistors 30, A plurality of thermal fuse lead wires 20 constituting the array type thermal fuse lead wire element 300 are disposed in a one-to-one correspondence with each other so that a plurality of thermal fuse lead wire elements So that the array type resistor fuse lead wire element 300 and the array type resistor lead wire element 400 are thermally bonded to each other to form a thermal fuse for heating on the line line constituting the array type resistor lead wire element 400 Thereby forming the array resistor package 500 having the resistor.

15 is a flowchart schematically showing a method of manufacturing an array resistor package using a laser according to an embodiment of the present invention.

As shown in the drawings, a method of manufacturing an array resistor package using a laser according to an embodiment of the present invention includes the steps of loading an array type thermal fuse lead wire element in a semi-product state into a lined wire jig of a lead wire adapter for a thermal fuse (S20) cutting the fusible element wire supplied from the element supply portion of the lead wire adapter for the thermal fuse to a predetermined length in the element cutting portion to form a first fusible element, (S30) a step of sucking a soluble body element by a vacuum gripper and mounting the element on the element jig of the thermal fuse lead wire adapter, and using the clamping part of the thermal fuse lead wire adapter, (S40) of fixing the array type thermal fuse lead wire element, (S50) of thermally fusing the soluble element to the right side of the array type thermal fuse lead wire element in the semi-product state to the right side of the thermal fuse lead wire in a range corresponding to half of the total quantity, (S60), and the fuse element wire supplied from the element supply portion of the lead wire adapter for the thermal fuse is cut to a predetermined length at the element cutting portion to form a second fuse element (S80), the second fuse element is sucked by a vacuum gripper and is mounted on the element jig of the lead wire adapter for the thermal fuse (S80), and the step The second usable body element and the semi-manufactured array-type thermal fuse lead wire (S90), a laser is irradiated to irradiate the left side of the array type thermal fuse lead wire element of the semi-finished product to the temperature fuse lead wire in a range corresponding to half of the total quantity to the left side, Forming an array type thermal fuse lead wire element having a plurality of resistors; and forming an array type thermal fuse lead wire element having an array type thermal fuse lead wire element having a plurality of resistors, A plurality of inner pins arranged in front of a push housing constituting a push transfer section of the resistor lead wire adapter sequentially carry out a pressing operation of the inner lead of the resistor lead wire adapter, Arrayed Resistors in Semi-Finished Product On the right side of the lead wire element (S120) of thermally bonding the array type thermal fuse lead wire element to the half-finished product by irradiating a laser to a range corresponding to half of the total quantity of the resistor fuse lead wire element And a plurality of inner fins arranged in front of the push housing constituting the push transfer portion of the resistor lead wire adapter sequentially perform a pressing operation to the left side of the half-finished product array resistor wire element, (S130) of forming an array type resistor package having a thermal fuse by thermally bonding the array type thermal fuse lead wire element of the semi-product state by irradiating a laser beam to a range of the array type thermal fuse lead wire element.

As described above, according to the present invention, a thermal fuse lead wire adapter and a resistor resistor adapter are provided, and the array type thermal fuse lead wire element and the array type resistor lead wire element are thermally joined to each other by laser welding to form a lead wire line. There is provided an array type resistor package manufacturing system and method thereof using a laser capable of increasing the productivity of an array type resistor package having a thermal fuse.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of limitation, It is within the scope of the present invention that component changes to such an extent that they can be coped evenly within a range that does not deviate from the scope of the present invention.

10: Solenoid 20: Thermal fuse lead wire
30: Resistor 40: Resistor lead wire
100: lead wire adapter for thermal fuse 110: element feeder
111: Winder 112: Wire feed roller part
113: element supply base plate 120: element cutting portion
120-1: cutting unit main body 121: element guide
121-1: Horizontal through hole 122: Stepping motor
123: Element Cutting Plate 123-1: Cutting Plate Guide
124: Cutting vertical cylinder 124-1: Cylinder bracket
125: Urethane roller 126: Spring Bush
130: element transferring part 131: direction changing roller bearing part
132: Vacuum gripper 133: Linear horizontal conveyance
134: linear vertical feeding part 140: element jig
141-1: Element mounting groove 141-2: Welding lead wire mounting groove
141-3: laser welding groove 141: element jig guide
142: jig vertical cylinder part 143: jig horizontal cylinder part
150: lead wire jig 151: jig body
152: floating joint part 153: lead wire jig guide
153-1: lead wire mounting groove 154: jig guide horizontal transmission
160: clamping part 161: guide shaft
162: laser through hole 163: punch portion
164: Pro part 170: Laser part
200: Resistor lead wire adapter 210: Resistor junction jig
211: first resistor jig guide 211-1: fixing groove
212: second resistor jig guide 212-1: mounting groove
213: clamping jig 220: resistor jig receiving part
221: Linear actuator 230: Push transmission
231-1: Inner pin 240: Resistor laser part
300: Arrayed thermal fuse lead wire element
400: Arrayed Resistor Lead Wire Element
500: Array type resistor package

Claims (15)

A thermal fuse for forming an array type thermal fuse lead wire element in which a plurality of thermal fuse lead wires are thermally joined to one side of each of the plurality of thermal fuse lead wires by irradiating a laser beam to one end of a plurality of fusible bodies, Lead wire adapters; And
A plurality of thermal fuse lead wires constituting the array type thermal fuse lead wire element are arranged in a one-to-one correspondence so that the plurality of soluble elements are located on one side of the arrayed resistor lead wire element having a plurality of resistors, Wherein the thermal fuse lead wire element and the array type resistor lead wire element are thermally joined to each other by irradiating a laser beam at an end thereof with a laser beam to thermally bond the array type thermal fuse lead wire element and the array type resistor lead wire element, And a resistor lead wire adapter forming an array resistor package.
The thermal fuse according to claim 1,
An element supply unit including a plurality of winders and supplying the soluble element wires in a wire winding manner;
An element cutting portion that cuts the fusible element element wire supplied by the element supply portion to a predetermined length corresponding to a fusible element used in the thermal fuse lead wire adapter to form a fusible element element;
An element transferring unit for supplying a usable body element wire supplied from the element supplying unit to the element cutting unit and sucking and transferring the usable body element cut by the element cutting unit with a vacuum gripper;
An element jig having an element mounting groove on an upper surface thereof for mounting a movable element transferred by a vacuum gripper of the element transferring unit;
A lead wire jig having a lead wire mounting groove on an upper surface thereof for mounting a body of the thermal fuse lead wire arranged corresponding to the fusible element;
And a plurality of probes for pressing and fixing the temperature fuse lead wires, respectively, when the temperature fuse lead wires are more than one, are arranged at one side of the lower side of the main body, ; And
And a laser part for irradiating a laser through a laser through hole opened in an upper part of the main body of the clamping part to thermally join an end of a soluble element immobilized on the element jig to one end of the thermal fuse lead wire. Array type resistor package manufacturing system using laser
[3] The apparatus of claim 2,
An element guide having a plurality of horizontal through holes through which a plurality of soluble element wires supplied from the element supply unit are passed at a constant interval;
A stepping motor for controlling the plurality of usable element wire wires passing through the horizontal through holes of the element guide to be exposed to a predetermined length;
An element cutting plate for simultaneously cutting a plurality of usable body element wires exposed in a predetermined length by the stepping motor in a vertical direction to form a plurality of usable body elements; And
And a cutting vertical cylinder for guiding vertical up and down reciprocating motion of the element cutting plate.
[4] The apparatus of claim 3,
And a pair of urethane rollers for simultaneously supporting the plurality of soluble element wire wires at the upper side and the lower side with a predetermined tension and passing the horizontal through holes inside the body mounted with the element guide at the front side Array type resistor package manufacturing system using laser
[3] The apparatus according to claim 2,
A direction changing roller bearing portion formed at one side for switching a traveling direction of a plurality of usable element elements supplied from a winder of the element supplying portion to guide the wire into a plurality of horizontal through holes formed in an element guide of the element cutting portion; And
And a vacuum gripper for sucking the plurality of usable body elements cut by the element cutting unit by an air cylinder method and transferring the plurality of usable body elements to a plurality of element mounting grooves formed on the upper surface of the element jig. Package manufacturing system
[6] The apparatus according to claim 5,
A linear horizontal transfer unit for guiding the front and rear linear reciprocating of the vacuum gripper; And
And a linear vertical transfer unit for guiding the vacuum gripper to reciprocate up and down in a straight line direction.
The vacuum gripper according to claim 6,
And a plurality of element suction grooves corresponding to the plurality of element mounting grooves are formed on the bottom surface of the substrate,
[3] The apparatus according to claim 2,
An element jig guide portion for mounting a plurality of the available-body elements;
A jig vertical cylinder portion for guiding vertical up and down reciprocation of the element jig guide portion in the vertical direction; And
And a jig horizontal cylinder part for holding a linear reciprocating in the horizontal direction of the element jig guide part.
9. The apparatus of claim 8,
A plurality of element mounting grooves arranged at regular intervals to mount a plurality of the available element elements on one side of an upper surface;
A plurality of welding lead wire mounting grooves arranged at regular intervals to receive a part of one side of a plurality of thermal fuse lead wires corresponding to the fusible element elements on the other side of an upper surface; And
And a laser welding groove having a V-shaped cross section between the plurality of element mounting grooves and the plurality of welding lead wire mounting grooves.
3. The lead wire jig according to claim 2,
A jig body;
A floating joint portion disposed on the upper side of the jig main body to guide upward and downward linear reciprocating movements of the clamping portion by coupling a plurality of guide shafts formed on both sides in the longitudinal direction of the clamping portion upward;
And a plurality of temperature fuse lead wires which are detachably arranged in a direction perpendicular to the upper surface of the jig main body and which are partly exposed at one side of the temperature fuse lead wires corresponding to the usable element mounted on the element jig, A lead wire jig guide having lead wire mounting grooves; And
Wherein the lead wire jig guide is provided on an upper surface thereof with a receiving portion for receiving the lead wire jig guide and is disposed on an upper surface of the jig main body and guides the left and right linear reciprocating motion of the lead wire jig guide when the laser portion irradiates laser, And a jig guide horizontal transfer unit operable to continuously supply the jig element to the array type resistor package manufacturing system
[Claim 11] The apparatus according to claim 10,
And the laser irradiation direction can be adjusted to a left or right within a predetermined range when the soluble element and the thermal fuse lead wire are thermally bonded to each other by irradiating a laser beam.
The resistive lead wire adapter of claim 1,
Wherein the array type thermal fuse lead wire element is arranged on the same line line on the upper side of the array type resistor lead wire element so that the array type thermal fuse lead wire element is spaced apart from the array line type thermal fuse lead wire element by a predetermined distance;
A resistor jig accommodating portion accommodating the resistor jig portion and having a linear actuator of a stepping motor type to support left and right linear reciprocating motion of the resistor jig portion;
A push transfer section for performing a pushing operation toward the array type thermal fuse lead wire element side to bring the opposite ends of the array type resistor fuse lead wire element into contact with the array type resistor fuse lead wire element; And
And a resistor laser part for irradiating a laser beam during a pushing operation of the push-to-send part to thermally join the opposite ends of the array type resistor lead wire element and the opposite ends of the array type thermal fuse lead wire element. Array Resistor Package Manufacturing System
[12] The semiconductor device according to claim 12,
A first resistor jig guide formed by arranging a plurality of fixing grooves for fixing a resistor lead wire and a resistor constituting the arrayed resistor lead wire element at regular intervals;
A second resistor jig guide formed by arranging a plurality of mounting grooves for allowing the heating element and the thermal fuse lead wires constituting the array type thermal fuse lead wire element to flow on the line; And
And a plurality of through holes formed in the upper surface in the longitudinal direction in correspondence with the pushing operation of the push-to-carry portion to allow the laser beam to pass sequentially and continuously, And a clamping jig for simultaneously fixing the wire element and the array type thermal fuse lead wire element placed in the mounting groove of the second resistor jig guide.
14. The push-to-talk communication system according to claim 13,
A push housing having a plurality of inner fins arranged at predetermined intervals in front to sequentially perform a pressing operation on the other end of the plurality of thermal fuse rod wires constituting the array type thermal fuse lead wire element; And
And a cylinder-type push drive unit for driving the front and rear linear reciprocating movements before and after the pushing operation of the push housing.
Loading an arrayed thermal fuse lead wire element in a semi-finished state on a lined wire jig of a thermal fuse lead wire adapter;
Cutting the soluble element wire supplied from the element supply portion of the lead wire adapter for the thermal fuse to a predetermined length in the element cutting portion to form a first usable element;
Mounting the primary fuse element on the element jig of the lead wire adapter for the thermal fuse by sucking it with a vacuum gripper;
Fixing the first usable body element and the semi-finished array type thermal fuse lead wire element using the clamping portion of the thermal fuse lead wire adapter;
Thermally fusing the soluble element to a right side of the array type thermal fuse lead wire element in the semi-product state by irradiating a laser to a thermal fuse lead wire in a range corresponding to half of the total quantity;
Horizontally transporting the lead wire jig of the lead wire adapter for the thermal fuse to the right;
Cutting the fusible element wire supplied from the element supplying portion of the lead wire adapter for the thermal fuse to a predetermined length in the element cutting portion to form a second fusible element;
Placing the secondary fuse element on the element jig of the lead wire adapter for the thermal fuse by sucking it with a vacuum gripper;
Fixing the secondary fuse element and the semi-finished array fuse lead wire element using the clamping portion of the lead wire adapter for the thermal fuse;
And the second fuse lead wire is thermally bonded to the left side of the array type thermal fuse lead wire element in the semi-product state to a left side of the thermal fuse lead wire in a range corresponding to half of the total quantity, Type thermal fuse lead wire element;
Stacking an array type resistor lead wire element having a plurality of resistors in a semi-finished product state and an array type thermal fuse lead wire element having the soluble body coupled thereto in a resistor junction jig portion of a resistor lead wire adapter;
A plurality of inner fins arranged in front of a push housing constituting a push transfer portion of the resistor lead wire adapter sequentially perform a pressing operation to the right side of the half-finished product array resistor wire element, And thermally fusing the array type thermal fuse lead wire element in the semi-finished product state; And
A plurality of inner fins arranged in front of a push housing constituting a push transfer portion of the resistor lead wire adapter are horizontally transported horizontally to a resistor jig jig portion of the resistor lead wire adapter, Forming an array resistor package having a thermal fuse by thermally bonding the array type thermal fuse lead wire element to the left side of the resistor wire lead wire by irradiating laser to a range corresponding to half of the total quantity; A method of manufacturing an array type resistor package using a laser, characterized by comprising the steps of:

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