KR101809070B1 - Apparatus for manufacturing the OLED lighting module and method thereof - Google Patents

Abstract

The present invention relates to an OLED lighting module manufacturing apparatus which bonds and connects an OLED panel and a flexible circuit board through a conductive paste and an OLED lighting module manufacturing method using the same. More specifically, the OLED lighting module manufacturing apparatus applies a conductive adhesive substance to the stepped surface formed to recess from the edges of a surface of the OLED panel, arranges the flexible circuit substrate on the upper surface of the conductive adhesive substance to be parallel, presses the conductive adhesive substance disposed between the stepped surface and the flexible circuit substrate by pressing the flexible circuit substrate, and cures the conductive flexible circuit substrate by heating the conductive flexible circuit substrate with laser beams, thereby bonding and connecting the OLED panel and the flexible circuit board through the conductive adhesive substance.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an OLED lighting module manufacturing method,

The present invention relates to an apparatus for manufacturing an OLED lighting module and a method of manufacturing an OLED lighting module using the same. More particularly, the present invention relates to a manufacturing apparatus for an OLED lighting module for bonding an OLED panel and a flexible circuit board And a manufacturing method of an OLED lighting module using the same.

OLED (Organic Light Emitting Diode), called organic light emitting diode (OLED), is a display made by using the self-luminous phenomenon that emits light when current flows through three organic phosphor compounds of red, green and blue having self- Is an emissive display using a phenomenon in which electrons (electrons) injected in the organic material and positively charged particles combine in the organic material and emit light by themselves.

OLEDs have a picture quality response speed 1,000 times faster than ultra-thin liquid crystal displays (TFT-LCDs), and can not only sense the same picture quality in any direction, but also eliminate the need for backlighting Since it can be driven at a low voltage, it has an advantage that it can be designed as ultra thin and low power.

The field of OLED lighting that applies these OLEDs is attracting attention. OLED lighting modules, along with LED (Light Emitting Diode) lighting modules, are recognized as promising next generation light sources.

The LED lighting module has a very high brightness, a long life, and a high external light efficiency. However, since the LED lighting module requires a large heat dissipation device due to a high heat generation, it is difficult to make a diffused light by snowing, , Additional components and processes are required to make the surface light source.

OLED lighting modules, on the other hand, are very thin, light and bendable, flexible design allows for innovative designs, is produced in panel form, is itself a surface light source, diffuse light, reduces eye fatigue, There is an advantage that it is suitable as indoor lighting. In addition, it is a next-generation environment-friendly lighting with a positive-polarized surface light source, which does not use heavy metals such as mercury, lead, and eco-friendly organic materials. It is replacing.

Such an OLED lighting module requires a process of electrically and physically joining a flexible printed circuit board (FPCB) in order to supply power to the electrodes arranged on the stepped surface of the OLED panel. Generally, an anisotropic conductive film (ACF ) Bonding apparatus, an OLED panel and a flexible circuit board (FPCB) were bonded via an anisotropic conductive film.

The anisotropic conductive film is a double-sided tape-like material obtained by mixing an adhesive cured by heat and fine conductive particles (conductive balls) therein. The anisotropic conductive film is mass produced in a certain standard. Therefore, when the shape of the OLED lighting module is changed, It is necessary to perform ACF bonding (including pre-bonding for reducing the cold-rolling phenomenon and main bonding for bonding the OLED panel and the flexible circuit board with higher heat and pressure) for bonding the anisotropic conductive film to the OLED panel, The steps are complicated, and the equipment cost required for this is small.

Also, in the bonding of the OLED panel and the flexible circuit board, a hot bar was used as a heat source. Due to the characteristics of the thermosetting resin used as the adhesive, the anisotropic conductive film was required to be supplied with a constant temperature, , It is difficult to uniformize the temperature of the entire hot bar and the thermal efficiency is lowered due to the high heat dissipation in addition to the connection site and the bonding quality is lowered due to the impact generated while pressing the hot bar flexible circuit board .

In addition, in the case of bonding a flexible circuit board to a plurality of OLED panels arranged on a large-area raw substrate, it is possible to separately attach an anisotropic conductive film to a plurality of OLED panels and to mount a plurality of flexible circuit boards on a plurality of OLED panels It was necessary to carry out a process of adhering to the panel, so that the efficiency of the process was inferior.

In addition, since the anisotropic conductive film having a higher cost than the conductive adhesive material is used, there is a problem that the manufacturing cost of the OLED lighting module is increased.

Korean Registered Patent No. 10-1408384 (published on Apr. 17, 201, entitled OLED Lighting Module)

Accordingly, it is an object of the present invention to solve the above-mentioned problems of the prior art, and it is an object of the present invention to provide an OLED lighting module, a method of manufacturing the same, And a manufacturing method of an OLED lighting module using the OLED lighting module.

In order to accomplish the above object, an OLED lighting module manufacturing apparatus according to the present invention includes: an electrode section arranged on a stepped surface which is recessed on one edge of an OLED panel; A printer unit for applying the ink; A substrate transferring part for arranging a flexible circuit board (FPCB) having connection terminals at positions corresponding to the electrode parts on the top surface of the conductive adhesive material; A pressing portion disposed on the flexible circuit board so as to face the flexible circuit board; and a lifting and driving unit for lifting the pressing plate toward the stepped surface; And a laser irradiating unit for irradiating the conductive adhesive material with a laser beam, wherein the flexible circuit board is pressed by the pressing plate that is lowered in accordance with driving of the elevation driving unit, and between the flexible circuit board and the step surface And the conductive adhesive material is heated and cured by the laser beam irradiated by the laser irradiation unit so that the OLED panel and the flexible circuit board are electrically connected to each other through the conductive adhesive material, So as to be joined.

In the apparatus for manufacturing an OLED lighting module according to the present invention, the pressing plate and the flexible circuit board are made of a light-transmitting material, and the laser beam irradiated from the laser irradiation unit sequentially passes through the pressing plate and the flexible circuit board Thereby heating the conductive adhesive material.

In the apparatus for manufacturing an OLED lighting module according to the present invention, the laser irradiating unit may include a laser output unit for outputting a laser beam irradiated on the conductive adhesive material, and the laser beam may be transmitted to the laser And a moving unit moving the irradiation unit or moving the OLED panel such that the conductive adhesive material is moved based on the laser beam while the laser beam is in a fixed state.

In the apparatus for manufacturing an OLED lighting module according to the present invention, the laser irradiation unit may include a laser output unit for outputting a laser beam irradiated on the conductive adhesive material, and a line beam converter for converting the laser beam into a linear line beam And a moving unit moving the laser irradiation unit such that the line beam is moved along the conductive adhesive material.

In an apparatus for manufacturing an OLED lighting module according to the present invention, the conductive adhesive material is a conductive paste, and the conductive paste may be any one of an aluminum paste, a silver paste, and an anisotropic conductive adhesive material mixed with a solvent and a binder .

In the apparatus for manufacturing an OLED lighting module according to the present invention, the printer unit may include: a body part that moves linearly along a direction in which the conductive paste is applied, the conductive part being spaced apart from the stepped surface; And a blade portion to be applied to the step surface.

In the apparatus for manufacturing an OLED lighting module according to the present invention, the conductive adhesive material is a conductive ink, and the conductive ink may be any one of an aluminum ink, a silver ink, and a copper ink mixed with a solvent and a binder.

In the apparatus for manufacturing an OLED lighting module according to the present invention, the printer section may include a nozzle cap forming an outer shape and a nozzle section surrounded and enclosed within the nozzle cap, wherein the conductive ink supplied to the inside of the nozzle section It can be continuously discharged in the form of droplets on the stage surface.

An apparatus for manufacturing an OLED lighting module according to the present invention includes: a laser controller for controlling an output of a laser beam output from the laser output unit; An elevation driving unit controller for controlling a pressing force of the elevation driving unit; And a control unit for controlling the laser controller and the elevation driving unit controller so that the output of the laser beam and the pressing force of the elevation driving unit are simultaneously raised or lowered.

According to an aspect of the present invention, there is provided a method of manufacturing an OLED lighting module using an apparatus for manufacturing an OLED lighting module, the method comprising: forming a conductive adhesive material on a step surface of an OLED panel, Applying a conductive adhesive material to be applied; A flexible circuit board mounting step of disposing the flexible circuit board on the top surface of the conductive adhesive material such that the connection terminals and the electrode sections correspond to the flexible printed circuit board (FPCB); A conductive adhesive material adhering step of heating the conductive adhesive material by applying a laser beam to the conductive adhesive material in a state in which the conductive adhesive material placed between the flexible circuit substrate and the step difference surface is pressed by pressing the flexible circuit substrate ; And curing the conductive adhesive material to cure the conductive adhesive material for a predetermined period of time.

In the manufacturing method of an OLED lighting module using an apparatus for manufacturing an OLED lighting module according to the present invention, the conductive face adhering step may include pressing the flexible circuit board to a first pressure, heating the conductive adhesive material to a first temperature And a bonding step of pressing the flexible circuit board to a second pressure higher than the first pressure and heating the conductive bonding material to a second temperature higher than the first temperature.

According to the OLED lighting module manufacturing method of the present invention and the OLED lighting module manufacturing method using the OLED lighting module, the manufacturing cost of the OLED lighting module can be lowered, and even if the shape of the OLED lighting module is changed, Can be formed.

In addition, according to the OLED lighting module manufacturing method of the present invention and the OLED lighting module manufacturing method using the OLED lighting module, the entire pattern shape of the conductive adhesive material applied to the step surface can be precisely formed, Quality can be improved.

In addition, according to the OLED lighting module manufacturing method of the present invention and the OLED lighting module manufacturing method using the OLED lighting module, the discharge straightness of the conductive adhesive material can be obtained and the accuracy of the landing position of the liquid droplet can be improved.

In addition, according to the OLED lighting module manufacturing method of the present invention and the OLED lighting module manufacturing method using the OLED lighting module, the conductive adhesive material can be applied to the step surface without additional burden even if the shape of the OLED lighting module is changed.

In addition, according to the OLED lighting module manufacturing method of the present invention and the OLED lighting module manufacturing method using the same, the conductive adhesive material is directly heated by the laser beam, so that the thermal efficiency can be increased and the time required for the process can be greatly reduced.

In addition, according to the OLED lighting module manufacturing method of the present invention and the OLED lighting module manufacturing method using the same, the conductive adhesive material can be uniformly heated using the line beam, and the bonding between the OLED panel and the flexible circuit board The quality can be further improved.

According to the OLED lighting module manufacturing method of the present invention and the OLED lighting module manufacturing method using the OLED lighting module, the conductive adhesive material is applied to the step surfaces of a plurality of OLED panels arranged in a large- By continuously irradiating the beam, the yield of the process can be improved.

According to the OLED lighting module manufacturing method of the present invention and the OLED lighting module manufacturing method using the OLED lighting module, the pressing and heating of the conductive adhesive material are sequentially performed to prevent the refrigerant phenomenon occurring between the OLED panel and the flexible circuit board .

1 is a side view schematically showing an apparatus for manufacturing an OLED lighting module according to an embodiment of the present invention,
Fig. 2 is a front view showing an apparatus for manufacturing the OLED lighting module of Fig. 1,
FIG. 3 is a side view showing the printer unit constructed in the manufacturing apparatus of the OLED lighting module of FIG. 1,
4 is a view for explaining various mounting modes of the mobile unit according to the present invention,
FIG. 5 is a view for explaining a process in which a line beam according to the present invention is moved along a conductive adhesive material,
FIG. 6 is a diagram comparing the distribution profiles of the energy profiles of the spot beam and the line beam,
7 is a side view schematically showing an apparatus for manufacturing an OLED lighting module according to another embodiment of the present invention,
FIG. 8 is a side sectional view showing the printer section constructed in the manufacturing apparatus of the OLED lighting module of FIG. 7,
9 is a block diagram of a method of manufacturing an OLED lighting module using an apparatus for manufacturing an OLED lighting module according to an embodiment of the present invention.

Hereinafter, embodiments of an apparatus for manufacturing an OLED lighting module according to the present invention and a method of manufacturing an OLED lighting module using the same will be described in detail with reference to the accompanying drawings.

FIG. 1 is a side view schematically showing an apparatus for manufacturing an OLED lighting module according to an embodiment of the present invention, FIG. 2 is a front view showing an apparatus for manufacturing the OLED lighting module of FIG. 1, FIG. 4 is a view for explaining various mounting modes of the mobile unit according to the present invention, and FIG. 5 is a view illustrating a process in which the line beam according to the present invention is moved along the conductive adhesive material Fig. 6 is a diagram comparing the distribution profiles of the energy profiles of the spot beam and the line beam. Fig.

1 to 6, an apparatus 1 for manufacturing an OLED lighting module according to an embodiment of the present invention includes an OLED panel 10 and a flexible circuit board 20 via a conductive adhesive material 30 And includes a printer section 100, a substrate transfer section 200, a pressing section 300, and a laser irradiating section 400.

As shown in FIG. 1 or 3, the printer unit 100 includes an electrode unit 11a arranged on a stepped surface 11 which is recessed at one edge of the OLED panel 10, and the electrode unit 11a And the conductive adhesive material 30 is applied to the stepped surface 11.

Here, the conductive adhesive material 30 is a conductive paste 31, and the conductive paste 31 may be any one of an aluminum paste, a silver paste, and an anisotropic conductive adhesive material mixed with a solvent and a binder.

The conductive adhesive material 30 is relatively inexpensive and has an electric conductivity of at least 1.4 (x 10 < 5 > S / cm) higher than at least iron, And they are tightly adhered to each other at a temperature of less than 250 ° C for about 10 seconds to be consolidated.

As described above, according to the present invention, by using a flexible adhesive medium in a liquid state, unlike a film-shaped, adhesive medium such as ACF, even if the shape of the OLED lighting module M is changed, The adhesive layer can be freely formed on the stepped surface 11.

Further, since the conductive adhesive material 30 of the above-described kind is a relatively inexpensive material, in particular, about 1/10 per unit area, as compared with ACF, the present invention can lower the manufacturing cost of the OLED lighting module M . In this respect, there is a certain use for the use of the conductive adhesive material 30 of the above-described kind.

The printer unit 100 may be configured as follows.

3, when the conductive adhesive material 30 is the conductive paste 31, the printer unit 100 is separated from the step surface 11 and is moved in a straight line along the direction in which the conductive paste 31 is applied. And a blade part 120 coupled to the body part 110 and applying the conductive paste 31 to the stepped surface 11. The conductive paste 31 supplied to a mask (not shown) having a specific pattern groove corresponding to the stepped surface 11 is pressed flat by the blade portion 120 and the mask is separated from the stepped surface 11, And the conductive paste 31 is applied to the stepped surface 11.

1, the substrate transferring unit 200 includes a flexible circuit board (FPCB) 20 having a connection terminal 21 at a position corresponding to the electrode unit 11a, . The substrate transfer unit 200 may be composed of a robot arm or a motor which is connected to a normal control unit (not shown) and moves in the X-Y-Z axis.

The pressing unit 300 includes a pressing plate 310 disposed to face the flexible circuit board 20 and an elevation driving unit 320 for moving the pressing plate 310 toward the stepped surface 11. The elevation drive unit 320 is fixed at one end and coupled to the pressure plate 310 at the other end to elevate the pressure plate 310. In the present embodiment, the elevation drive unit 320 is constituted by a pneumatic cylinder, but can be replaced by various driving means capable of linear driving.

The pneumatic cylinder is a double acting cylinder in which the piston is raised and lowered at a constant height by pneumatic pressure alternately supplied to both ends of the cylinder and the supply of the pneumatic pressure is stopped when the piston touches the pair of cylinder sensors attached to the inside of the cylinder .

The laser irradiation unit 400 irradiates the conductive adhesive material 30 with a laser beam L. [ 2, the laser irradiation unit 400 includes a laser output unit 410 that outputs a laser beam L irradiated to the conductive adhesive material 30, and the laser beam L is irradiated onto the conductive adhesive material 30 The OLED panel 10 is moved so that the conductive adhesive material 30 is moved with respect to the laser beam L in a fixed state or the laser beam L is moved (500). ≪ / RTI >

The laser output unit 410 may be composed of a resonator, an optical amplifier, and a pump. Light emitted from the optical amplifier is induced by the energy supplied from the pump. The light is reflected by the resonator to be amplified by the resonator, so that the high density laser beam L is emitted. However, the present invention is not limited thereto and various configurations can be used. The laser beam L output from the laser output unit 410 can change its path by a plurality of reflectors.

The moving unit 500 may be coupled to the laser irradiation unit 400 to linearly move the laser irradiation unit 400 as shown in FIG. Or a linear drive means of a ballscrew type using a hydraulic cylinder or a gear engagement which linearly moves the stage.

The conductive adhesive material 30 may be heated by converting the shape of the laser beam L into the line beam LB. 5, the laser irradiation unit 400 includes a laser output unit 410 for outputting a laser beam L to be irradiated on the conductive adhesive material 30, and a laser output unit 410 for outputting the laser beam L as a linear line beam (500) that includes a line beam converter (420) that converts the laser beam (LB) into a laser beam (LB) and moves the laser irradiator (400) to move the line beam (LB) along the conductive adhesive material have.

At this time, the mobile unit 500 moves the laser irradiation unit 400 to move the line beam LB along the conductive adhesive material 30, or the line beam LB moves the conductive adhesive material 30 May be moved relative to the line beam LB.

The line beam converter 420 converts the laser beam L into a linear line beam LB. The line beam converter 420 includes a beam splitter which splits the laser beam L output from the laser output unit 410 into a plurality of beams and superimposes the beams onto the plurality of line beams LB ) In parallel to each other.

When a conventional hot bar is used as a heat source, it is virtually impossible for the hot bar to uniformly contact the flexible circuit board 20. This causes a temperature difference along the surface of the flexible circuit board 20, Since the heat is transferred through the flexible circuit board 20 without directly heating the conductive adhesive material 30, the heat supplied from the hot bar is not conducted to the conductive adhesive material 30, and the thermal efficiency is lowered.

In contrast, the apparatus 1 for manufacturing an OLED lighting module according to an embodiment of the present invention directly heats the conductive adhesive material 30 with the laser beam L, It is possible to irradiate the laser beam L in a line shape not in the form of dots, thereby greatly reducing the processing time.

In particular, when the laser beam L is irradiated in a point shape, that is, in the form of a spot beam, a Gaussian distribution in which most of the energy is concentrated in the central region of the laser beam L is shown as shown in FIG. 6 (a) . In this case, the quality of the bonding between the OLED panel 10 and the flexible circuit board 20 is degraded because the conductive adhesive material 30 is heated unevenly. 6B, the laser beam L is converted into the line beam LB through the line beam converter 420 while being superimposed on the entire line beam LB, The distribution of the energy profiles of the first and second electrodes is relatively uniformly changed. As described above, since the conductive adhesive material 30 can be uniformly heated, the present invention using the line beam LB can further improve the quality of bonding between the OLED panel 10 and the flexible circuit board 20. [

In the apparatus 1 for manufacturing an OLED lighting module according to an embodiment of the present invention configured as described above, the flexible circuit board 20 is pressed by the pressing plate 310, which is lowered according to the driving of the elevation driving unit 320 The conductive adhesive material 30 placed between the flexible circuit substrate 20 and the stepped surface 11 is pressed and the conductive adhesive material 30 is heated by the laser beam L irradiated from the laser irradiation unit 400 So that the OLED panel 10 and the flexible circuit board 20 are electrically connected to each other through conductive balls (not shown) included in the conductive adhesive material 30.

As described in the background art, when the flexible circuit board 20 is bonded to a plurality of OLED panels 10 arranged on a large area of a large-area substrate, the efficiency of the process is lowered. On the other hand, in the OLED lighting module manufacturing apparatus of the present invention, the conductive adhesive material 30 is applied to the step surfaces of the plurality of OLED panels 10 at one time and the line beam LB is continuously irradiated thereto, It is possible to perform a simple and efficient process at the same time on the plurality of OLED panels 10 and the flexible circuit board 20 arranged on the main substrate.

2, an apparatus 1 for manufacturing an OLED lighting module according to an embodiment of the present invention includes a laser controller 600, an elevation driving unit controller 700, and a control unit (not shown) .

The laser controller 600 controls the output of the laser beam L output from the laser output unit 410. The laser controller 600 selectively adjusts the output of the laser beam L by selectively passing the laser beam L oscillated in the resonator and adjusts the frequency of the laser beam L amplified by the optical amplifier, L, but it is not limited thereto.

The elevation driving unit controller (700) controls the pressing force of the elevation driving unit (320). Specifically, the elevation driving unit controller 700 adjusts the pressing force of the elevation driving unit 320 by adjusting the opening degree of a pressure regulating valve (not shown) provided on a pneumatic line connected to the cylinder.

The controller controls the laser controller 600 and the elevation driving unit controller 700 such that the output of the laser beam L and the pressing force of the elevation driving unit 320 are simultaneously raised or lowered.

If the heat is momentarily applied to the conductive adhesive material 30 and the heat is clogged between the OLED panel 10 and the flexible circuit board 20 and the heat is not properly dissipated, A phenomenon in which the conductive adhesive material fails to adhere properly and falls) may occur.

In order to prevent this, the control unit controls the laser controller 600 and the elevation driving unit controller 700 to raise the output of the laser beam step by step and increase the pressing force of the elevation driving unit in proportion to the change of the output of the laser beam. That is, the pressing and heating process of the conductive adhesive material 30 is progressed in order to prevent the above-described cold discharge phenomenon.

Hereinafter, an apparatus 2 for manufacturing an OLED lighting module according to another embodiment of the present invention will be described. The same components as those of the apparatus 1 for manufacturing an OLED lighting module according to an embodiment of the present invention are denoted by the same reference numerals as those for the apparatus 2 for manufacturing an OLED lighting module according to another embodiment of the present invention, Is omitted.

FIG. 7 is a side view schematically showing an apparatus for manufacturing an OLED lighting module according to another embodiment of the present invention, and FIG. 8 is a side sectional view showing a printer unit constructed in the manufacturing apparatus of the OLED lighting module of FIG.

Here, the conductive adhesive material 30 is the conductive ink 32, and the conductive ink 32 may be any one of aluminum ink, silver ink, and copper ink mixed with a solvent and a binder.

The printer unit 150 may be configured as follows.

When the conductive adhesive material 30 is the conductive ink 32, the printer unit 100 includes a nozzle cap 160 having an outer shape as shown in FIG. 8, a nozzle cap 160 spaced apart from the inside of the nozzle cap 160, And a nozzle cap transfer unit 190 for moving the nozzle cap 160 along the step difference surface 11. The nozzle cap 170 is provided with a discharge cap 180 surrounded by the nozzle cap 170,

The conductive adhesive material 30 supplied to the inside of the nozzle unit 170 is continuously discharged in droplet form onto the stepped surface 11 so that the conductive adhesive material 30 is applied to the stepped surface 11.

The dispensing needle 180 is formed of a metallic material in the form of a needle having a pointed end at the inside of the nozzle unit 170 so that it is possible to obtain the straightness of ejection of the conductive adhesive material 30, . Accordingly, the overall pattern shape of the conductive adhesive material 30 to be applied to the stepped surface 11 can be precisely formed, thereby improving the bonding quality of the OLED lighting module M. Particularly, even if the shape of the OLED lighting module M changes, since the conductive adhesive material 30 can be applied to the stepped surface 11 by adjusting the transfer area of the nozzle cap transfer unit 190, The conductive adhesive material 30 can be applied to the stepped surface 11 without adding the conductive adhesive material 30 to the stepped surface 11.

When the conductive adhesive material 30 is applied to the stepped surface 11 by the inkjet method, it is preferable to use a conductive ink 32 of a low viscosity type such as water. On the other hand, When the conductive paste 31 is used, it is preferable to apply the conductive adhesive material 30 to the stepped surface 11 by a conventional screen printing method.

Hereinafter, a method of manufacturing an OLED lighting module using an apparatus for manufacturing an OLED lighting module according to an embodiment of the present invention will be described. A method of manufacturing an OLED lighting module using an apparatus for manufacturing an OLED lighting module according to an embodiment of the present invention includes a conductive adhesive material applying step S1, a flexible circuit board mounting step S2, a conductive adhesive material bonding step S3 , And a conductive adhesive material curing step (S4).

9 is a block diagram of a method of manufacturing an OLED lighting module using an apparatus for manufacturing an OLED lighting module according to an embodiment of the present invention.

9,

(S1: conductive adhesive material application step)

The step of applying the conductive adhesive material S1 is a step of applying a conductive adhesive material 30 to the stepped surface 11 on which the electrode part 11a is arranged so as to be embedded in one edge of the OLED panel 10 . Since the width of the stepped surface 11 is very narrow, which is usually on the order of a few millimeters, it is preferable to apply the ink-jet printing method, that is, the method of printing the conductive adhesive material 30 on the stepped surface 11 by using a screen printing method using a squeegee module It is preferable that the conductive adhesive material 30 is applied to the stepped surface 11 by dropping dropwise in a droplet form.

(S2: flexible circuit board mounting step)

The flexible circuit board mounting step S2 may be performed by mounting the flexible circuit board 20 on the flexible circuit board 20 such that the connection terminals 21 of the flexible circuit board 20 and the electrode portions 11a of the OLED panel 10 correspond to each other, And is arranged in parallel on the upper surface of the adhesive material 30. [ A robot arm or a motor connected to a normal control unit and moving in the X-Y-Z axis may be used as described above.

(S3: bonding step of conductive adhesive material)

The step of bonding the conductive adhesive material S3 may be performed by pressing the conductive adhesive material 30 between the flexible circuit board 20 and the step surface 11 by pressing the flexible circuit board 20, 30 to the conductive adhesive material 30 to heat the conductive adhesive material 30.

Here, the conductive adhesive material adhering step S3 includes a pre-adhering step S3a for pressing the flexible circuit board 20 to the first pressure and heating the conductive adhesive material 30 to the first temperature, 20) to a second pressure higher than the first pressure, and heating the conductive adhesive material (30) to a second temperature higher than the first temperature. This is to minimize the refrigerant phenomenon between the OLED panel 10 and the flexible circuit board 20 as described above.

(S4: curing step of conductive adhesive material)

The conductive adhesive material curing step S4 is a step of curing the conductive adhesive material 30 for a predetermined time. At this time, the control unit controls the elevation driving unit 320, the elevation driving unit controller 700 and the laser controller 600 so that the pressing plate 310 presses the flexible circuit board 20 at a predetermined pressure, The output of the laser beam L is adjusted so that the conductive adhesive material 30 is cured while the temperature of the substance 30 is maintained at 180 ° C to 300 ° C within approximately 60 seconds.

If the curing process is performed at a temperature of 180 ° C or less, it may take a long time to cure and a predetermined hardness can not be obtained. If the curing process is performed at 300 ° C or more, the conductive adhesive material 30 is thermally decomposed, The substrate 20 may be deformed or bubbles may be generated.

The apparatus for manufacturing an OLED lighting module of the present invention constructed as described above and the method for manufacturing an OLED lighting module using the same may further include a step of forming an anisotropic conductive adhesive material including an aluminum paste, silver paste, copper or nickel mixed with a solvent and a binder By using any one of them, the manufacturing cost of the OLED lighting module can be lowered, and even if the shape of the OLED lighting module is changed, the adhesive layer can be freely formed on the step surface freely.

In addition, the OLED lighting module manufacturing method of the present invention configured as described above and the OLED lighting module manufacturing method using the same may further include a step of continuously discharging the conductive adhesive material in the form of droplets on the stepped surface to form a conductive adhesive material The entire pattern shape can be precisely formed and the effect of improving the bonding quality of the OLED lighting module can be obtained.

In addition, the apparatus for manufacturing an OLED lighting module of the present invention constructed as described above and the method of manufacturing an OLED lighting module using the same can obtain the discharge straightness of the conductive adhesive material through the discharge needle provided in the nozzle unit, It is possible to obtain an effect of improving the landing position accuracy.

Further, the apparatus for manufacturing an OLED lighting module of the present invention constructed as described above and the method of manufacturing an OLED lighting module using the same can adjust the transfer area of the nozzle cap transfer unit even if the shape of the OLED lighting module changes, The effect that the conductive adhesive material can be applied to the stepped surface can be obtained.

In addition, the apparatus for manufacturing an OLED lighting module of the present invention constructed as described above and the method for manufacturing an OLED lighting module using the same can directly increase the thermal efficiency by directly heating the conductive adhesive material with the laser beam, It is possible to irradiate the laser beam in the form of a line, not in a dot shape, so that the time required for the process can be greatly reduced.

In addition, the apparatus for manufacturing an OLED lighting module of the present invention configured as described above and the method for manufacturing an OLED lighting module using the same can uniformly heat the conductive adhesive material using a line beam having a relatively uniform energy profile distribution , Thereby improving the quality of the junction between the OLED panel and the flexible circuit board.

The apparatus for manufacturing an OLED lighting module of the present invention constructed as described above and the method of manufacturing an OLED lighting module using the same may further include a step of applying a conductive adhesive material to the step surfaces of a plurality of OLED panels arranged on a large- , And by continuously irradiating a line beam thereon, an effect of improving the yield of the process can be obtained.

In addition, the apparatus for manufacturing an OLED lighting module of the present invention constructed as described above and the method for manufacturing an OLED lighting module using the same may further include a step of sequentially pressing and heating the conductive adhesive material, The effect of preventing the phenomenon can be obtained.

The scope of the present invention is not limited to the above-described embodiments and modifications, but can be implemented in various forms of embodiments within the scope of the appended claims. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the appended claims.

100: Printer section
200: Substrate is sent
300:
400: laser irradiation unit
500: mobile unit
600: Laser controller
700: Lift control unit controller

Claims (11)

An OLED panel having an electrode section arranged on a stepped surface that is recessed on one edge of the OLED panel and a conductive adhesive material spaced apart from the electrode section and applying the conductive adhesive material to the stepped surface;
A substrate transferring part for arranging a flexible circuit board (FPCB) having connection terminals at positions corresponding to the electrode parts on the top surface of the conductive adhesive material;
A pressing portion disposed on the flexible circuit board so as to face the flexible circuit board; and a lifting and driving unit for lifting the pressing plate toward the stepped surface; And
And a laser irradiation unit for irradiating the conductive adhesive material with a laser beam,
The flexible printed circuit board is pressed by the pressing plate that is lowered in accordance with the driving of the elevation driving unit and the conductive adhesive material placed between the flexible circuit board and the stepped surface is pressed, Wherein the conductive adhesive material is heated and cured by a beam so that the OLED panel and the flexible circuit board are electrically connected to each other via the conductive adhesive material,
Wherein the pressure plate and the flexible circuit board are made of a light-transmitting material,
Wherein the laser beam irradiated from the laser irradiation unit sequentially passes through the pressing plate and the flexible circuit board to heat the conductive adhesive material. delete The method according to claim 1,
Wherein the laser irradiation unit includes a laser output unit for outputting a laser beam irradiated on the conductive adhesive material,
A moving unit for moving the laser irradiation unit such that the laser beam is moved along the conductive adhesive material or moving the OLED panel such that the conductive adhesive material is moved with respect to the laser beam in a fixed state, Further comprising: a light emitting diode (OLED) module. The method according to claim 1,
Wherein the laser irradiation unit includes a laser output unit for outputting a laser beam irradiated to the conductive adhesive material and a line beam converter for converting the laser beam into a linear line beam,
And a moving unit for moving the laser irradiating unit such that the line beam is moved along the conductive adhesive material. The method according to claim 1,
The conductive adhesive material is a conductive paste,
Wherein the conductive paste is one of an aluminum paste, a silver paste, and an anisotropic conductive adhesive material mixed with a solvent and a binder. 6. The method of claim 5,
The printer unit may further include a body portion that is spaced apart from the stepped surface and moves linearly along a direction in which the conductive paste is applied, and a blade portion coupled to the body portion and applying the conductive paste to the stepped surface. Device for manufacturing OLED lighting modules. The method according to claim 1,
The conductive adhesive material is a conductive ink,
Wherein the conductive ink is any one of aluminum ink, silver ink, and copper ink mixed with a solvent and a binder. 8. The method of claim 7,
The printer unit includes a nozzle cap forming an outer shape and a nozzle unit surrounded and enclosed within the nozzle cap,
Wherein the conductive ink supplied to the inside of the nozzle portion is continuously discharged in a droplet form on the stepped surface. The method of claim 3,
A laser controller for controlling the output of the laser beam output from the laser output unit;
An elevation driving unit controller for controlling a pressing force of the elevation driving unit; And
Further comprising a control unit for controlling the laser controller and the elevation driving unit controller such that the output of the laser beam and the pressing force of the elevation driving unit are simultaneously raised or lowered. A conductive adhesive material application step of applying a conductive adhesive material to the step surface of the OLED panel, the conductive adhesive material being formed on the edge of one surface of the OLED panel;
A flexible circuit board mounting step of disposing the flexible circuit board on the top surface of the conductive adhesive material such that the connection terminals and the electrode sections correspond to the flexible printed circuit board (FPCB);
A conductive adhesive material adhering step of heating the conductive adhesive material by applying a laser beam to the conductive adhesive material in a state in which the conductive adhesive material placed between the flexible circuit substrate and the step difference surface is pressed by pressing the flexible circuit substrate ;
And a conductive adhesive material curing step of curing the conductive adhesive material for a predetermined time,
Wherein the step of adhering the conductive adhesive material comprises a pre-adhering step of pressing the flexible circuit board to a first pressure and heating the conductive adhesive material to a first temperature, a pre-adhering step of adhering the flexible circuit board to a second pressure , And heating the conductive adhesive material to a second temperature higher than the first temperature. ≪ RTI ID = 0.0 > 31. < / RTI > delete

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