KR101806228B1 - Vinylester resin composition for UV curable sheet and preparation method thereof - Google Patents
Vinylester resin composition for UV curable sheet and preparation method thereof Download PDFInfo
- Publication number
- KR101806228B1 KR101806228B1 KR1020160028865A KR20160028865A KR101806228B1 KR 101806228 B1 KR101806228 B1 KR 101806228B1 KR 1020160028865 A KR1020160028865 A KR 1020160028865A KR 20160028865 A KR20160028865 A KR 20160028865A KR 101806228 B1 KR101806228 B1 KR 101806228B1
- Authority
- KR
- South Korea
- Prior art keywords
- acid
- vinyl ester
- weight
- ester resin
- resin composition
- Prior art date
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
- C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
- C08G59/186—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/10—Epoxy resins modified by unsaturated compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Emergency Medicine (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
More particularly, the present invention relates to a vinyl ester resin composition for producing a photocurable sheet, which comprises 30 to 50 wt% of an epoxy resin, 1 to 10 wt% of a dicarboxylic acid compound, 0.01 to 0.5 wt% of a first polymerization inhibitor, 25 to 30% by weight of a reactive diluent is added to a dicarboxylic acid chain-extended vinyl ester resin obtained by reacting an unsaturated carboxylic acid compound with 15 to 25% by weight of an amine catalyst, 15 to 25% by weight of an unsaturated carboxylic acid compound and 1 to 10% 2 polymerization inhibitor, 0.005 to 0.5 wt% of an antifoaming agent, 0.01 to 0.5 wt% of a defoamer, and 0.1 to 5 wt% of a photoinitiator. The vinyl ester resin composition for producing a photocurable sheet of the present invention has a higher viscosity than that of a conventional vinyl ester resin composition and has excellent photo-curing characteristics, and thus has an excellent processability in producing a photocurable sheet or a sheet molding compound (SMC) .
Description
The present invention relates to a vinyl ester resin composition usable in the production of a photocurable sheet or a sheet molding compound (SMC), and a method for producing the same.
Generally, vinyl ester resin is one of corrosion-resistant and thermosetting resins, which is obtained by reacting an unsaturated carboxylic acid with an epoxy resin and dissolving the resin in styrene. The vinyl ester resin is excellent in corrosion resistance, mechanical strength and elongation.
In addition, the vinyl ester resin is similar to the unsaturated polyester resin in the curing method and the operation method when used, and is easy and good in work, and its application field is also such as unsaturated polyester resin, corrosion resistant plastic structure, container, corrosion lining, And is widely used as an ultraviolet ray or electronically curing coating material because of its excellent properties such as reactivity and hardening.
However, in general, a resin used as a sheet molding compound (SMC) is required to be aged after a certain period of time from the production of a sheet to increase its viscosity, and the unsaturated polyester resin used therefor has an acid value of 18- 25, but the conventional vinyl ester resin has an acid value of less than 10 due to the nature of the starting materials and the production characteristics thereof, and thus the thickening effect is not good.
Some of the SMC resins may be used in combination as a method for improving the thickening of the vinyl ester resin as described above. However, since the physical properties of the resin are unlikely to have the inherent properties of the vinyl ester resin, they have not been popularized.
In general, since the vinyl ester resin is a thermosetting resin, there are various disadvantages such as workability and manufacturing cost in comparison with a photo-curable resin. Therefore, in the production of SMC or a cured sheet using a vinyl ester resin, It is necessary to develop a technique for imparting excellent photo-curing properties to the vinyl ester resin.
It is an object of the present invention to provide a vinyl ester resin composition excellent in workability in the production of a photo-curable sheet or a sheet molding compound (SMC), which has a higher viscosity than a conventional vinyl ester resin composition and has excellent photo- do.
An embodiment of the present invention relates to a vinyl ester resin composition for producing a photocurable sheet, and more specifically, to a vinyl ester resin composition for producing a photocurable sheet, which comprises 30 to 50% by weight of an epoxy resin, 1 to 10% by weight of a dicarboxylic acid compound, 0.01 to 0.5% 25 to 30 weight parts of a reactive diluent is added to a dicarboxylic acid chain-extended vinyl ester resin obtained by reacting 5 to 15% by weight of monomers, 0.1 to 2% by weight of an amine-based catalyst, 15 to 25% by weight of an unsaturated carboxylic acid compound and 1 to 10% % Of a second polymerization inhibitor, 0.005 to 0.5 wt% of a second polymerization inhibitor, 0.01 to 0.5 wt% of a defoamer, and 0.1 to 5 wt% of a photoinitiator.
Another aspect of the present invention relates to a method for producing a vinyl ester resin composition for the production of a photocurable sheet, and more specifically, to a method for producing a vinyl ester resin composition for producing a photocurable sheet, which comprises adding 30 to 50 wt.% Of an epoxy resin, 1 to 10 wt.% Of a dicarboxylic acid, By weight and styrene monomer in an amount of 5 to 15% by weight, and raising the temperature to 55 to 65 ° C; Adding 0.1 to 2% by weight of an amine catalyst to the reactor and raising the temperature to 100 to 120 ° C; Dropping 15 to 25% by weight of an unsaturated carboxylic acid compound into the reactor, and maintaining the reaction until the acid value is 30 or less; When the acid value is 30 or less, the temperature is cooled to 80 to 85 ° C, and 1 to 10% by weight of an acid anhydride is added to chain extend to dicarboxylic acid to prepare a polymerized vinyl ester resin. A vinyl ester resin composition for producing a photocurable sheet was prepared by adding 25 to 30 wt% of a reactive diluent, 0.005 to 0.5 wt% of a second polymerization inhibitor, 0.01 to 0.5 wt% of a defoamer, and 0.1 to 5 wt% of a photoinitiator to the vinyl ester resin prepared above ≪ / RTI >
The vinyl ester resin composition for producing a photocurable sheet according to the present invention has a higher viscosity than conventional vinyl ester resin compositions and has excellent photo-curing properties, and thus has an excellent processability in producing a photocurable sheet or sheet molding compound (SMC) have.
FIG. 1 is a graph showing changes in thickening properties over time of conventional vinyl ester resins, comparative examples, and examples according to the present invention.
BRIEF DESCRIPTION OF THE DRAWINGS The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated in the drawings and will be described in detail in the detailed description. It is to be understood, however, that the invention is not to be limited to the specific embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprises" or "having" and the like are used to specify that there is a feature, a number, a step, an operation, an element, a component or a combination thereof described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.
The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.
The present invention relates to a vinyl ester resin composition for the production of a photocurable sheet, and more particularly to a vinyl ester resin composition for producing a photocurable sheet which comprises a dicarboxylic acid obtained by reacting an epoxy resin, a dicarboxylic acid compound, a first polymerization inhibitor, a styrene monomer, an amine catalyst, an unsaturated carboxylic acid compound and an acid anhydride A styrene monomer diluent, a second polymerization inhibitor, a defoaming agent, and a photoinitiator to a chain-extended vinyl ester resin, to a vinyl ester resin composition for producing a photocurable sheet.
In general, epoxy resins are excellent in heat resistance, chemical resistance, solvent resistance, adhesiveness, abrasion resistance, and are excellent in electrical and mechanical properties and are used in various fields such as surface coating, electrical insulation, laminated structure, Is known as bisphenol A type epoxy, and free rotation is difficult due to presence of benzene nucleus (Bisphenol A), which improves chemical resistance, adhesion, toughness and high temperature characteristics. The epoxy resin is excellent in chemical resistance because it has an ether group in the molecule, is plastic, has hydrophilic hydroxyl groups and hydrophobic hydrocarbon groups arranged regularly, and is excellent in adhesiveness. However, yellowing occurs, curing time is long, and PE, PP, silicone, and acryl, which have no crystalline polymer or polarity, are poorly adhered and have a disadvantage that they must be mixed with a main curing agent. By introducing an acrylic group having a double bond in such an epoxy resin, a vinyl ester resin is produced as a photo-curable resin having photosensitivity. Such vinyl ester resin is used in many business fields due to energy saving and environmentally friendly characteristics required in modern society Which is difficult to apply to complex shaped structures and has a disadvantage in that it is expensive. However, unlike a general thermosetting reaction, it rapidly cures at a low temperature to save energy, has excellent hardening properties, Because of its liquid form using monomers, it has the advantage of not causing environmental problems due to air pollution. Because of these advantages, UV curing type coatings and adhesives are widely used for top coating and adhesive applications such as wood, plastic, As environmental problems are emerging, electronic components The application field and demand for the precision material sector is rapidly increasing.
As described above, the vinyl ester resin is excellent in curability, has a relatively small influence on oxygen, is excellent in characteristics such as strength, hardness, flexibility, and corrosion resistance and is more effective than conventional photocurable resins used in the art. However, since the vinyl ester resin has poor thickening effect, it is limited to use as a photo-curable sheet or a sheet molding compound (SMC). In the case of mixing a special resin for SMC to improve the thickening of vinyl ester resin, The present invention is characterized in that a chain extension technique using a dicarboxylic acid compound is applied in order to improve the thickening effect of the vinyl ester resin and to improve the physical properties. That is, chain extension occurs when the ring of the epoxy group is opened by the carboxyl group of the dicarboxylic acid by the polymerization reaction of the epoxy resin and the dicarboxylic acid compound.
In the present invention, any epoxy resin may be used as long as it is an epoxy resin containing at least one epoxy group. In order to maximize the thickening effect of the vinyl ester resin composition, it is preferable to use a phenol novolak type epoxy resin. The content of the resin is preferably 30 to 50% by weight.
In the present invention, the dicarboxylic acid compound is a compound containing two carboxyl groups in the molecule and acts as a ring-opening substance that opens the epoxy group of the epoxy resin. The dicarboxylic acid compound may be adipic acid, isophthalic acid isophthalic acid, terephthalic acid, 1,4-cyclohexanedicarboxybic acid, sebacic acid, succinic acid, azelaic acid, Itaconic acid, phthalic acid, and fumaric acid, from the viewpoint of improving the thickening effect of the vinyl ester resin composition. The content of the dicarboxylic acid compound is not particularly limited, but is preferably 1 to 10% by weight in the production of a vinyl ester resin composition in which the present thickening effect is maximized.
In the present invention, the first polymerization inhibitor may be any polymerization inhibitor as long as it is conventionally used. In the present invention, the first polymerization inhibitor may be hydroquinone, toluohydroquinone, methylhydroquinone, hydroquinone methyl ether, Quinone, methyl-p-benzoquinone, t-butylcatechol, 2,6-di-t-butyl-4-methylphenol, 4-methoxyphenol and phenothiazine , And the content thereof is preferably 0.01 to 0.5% by weight. Particularly, in the present invention, 0.01 to 0.25% by weight of hydroquinone and 0.01 to 0.25% by weight of toluhydroquinone are preferably used as the first polymerization inhibitor in view of the efficiency of the polymerization reaction.
In the present invention, the content of the styrene monomer to be reacted with the epoxy resin is preferably 5 to 15% by weight.
In the present invention, the amine-based catalyst is preferably at least one selected from the group consisting of triethylamine, ethyltrimethylammonium bromide, dimethylbenzylamine and di-n-butylamine, and most preferably triethylamine . The content of the amine-based catalyst is not particularly limited, but is preferably 0.1 to 2% by weight.
In the present invention, the unsaturated carboxylic acid compound to be reacted with the epoxy resin may be at least one selected from the group consisting of acrylic acid, methacrylic acid, methyl (meth) acrylic acid, BETA-Carboxy Ethyl Acrylate, 2- acryloyloxyethyl succinate Acryloyloxy Ethyl Succinate, 2-Acryloyloxy Ethyl Hexa Hydrophthalate, 2-Acryloyloxy Ethyl Phthalate, 2-acryloyloxyethyl tetrahydrophthalate, (2-acryloyloxyethyltetrahydrophthalate), and most preferably, it may be methacrylic acid. The content of the unsaturated carboxylic acid compound is preferably 15 to 25% by weight.
In the present invention, it is preferable that the acid anhydride is at least one selected from the group consisting of phthalic anhydride, maleic anhydride, tetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, and trimellitic anhydride. The content of the acid anhydride is preferably 1 to 10% by weight.
In the present invention, the reactive diluent is preferably a low viscosity monomer having a lower molecular weight than the resin component, reducing the viscosity of the resin, and containing one functional group capable of polymerizing when exposed to actinic radiation, Acrylates such as methyl (meth) acrylate, ethyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, octyl (meth) acrylate, dodecyl (meth) acrylate, octadecyl (Meth) acrylate, isobonyl (meth) acrylate, phenyl (meth) acrylate,
(Meth) acrylate, methoxyphenyl (meth) acrylate, bromophenyl (meth) acrylate, ethylene glycol di (meth) acrylate, 1,2-propylene glycol Butanediol di (meth) acrylate, 1,3-butanediol di (meth) acrylate, 1,3-propylene glycol (meth) (Meth) acrylate, neopentyl glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, dipropylene glycol di (meth) acrylate, diallyl terephthalate, (Meth) acrylate, pentaerythritol tetra (meth) acrylate, pentaerythritol hexa (meth) acrylate, ethoxy (meth) acrylate, When ethyl acrylate 1,6-hexanediol di (meth) acrylate, glycerin tri (meth) acrylate,
(Meth) acrylate, ethyleneglycol di (meth) acrylate, methylpropanediol di (meth) acrylate, polyethylene glycol di (meth) acrylate, styrene, halogenated styrene, vinyltoluene, divinylbenzene, (Meth) acrylate, and mixtures thereof. The content of the reactive diluent is preferably 25 to 30% by weight in order to maximize the photocuring property without inhibiting the thickening property of the resin composition of the present invention.
In the present invention, the second polymerization inhibitor is added together with a reactive diluent, a defoaming agent and a photoinitiator after the vinyl ester resin which is chain-elongated by dicarboxylic acid and made into a polymer is prepared. In order to suppress the polymerization of the monomer used as a reactive diluent . As the second polymerization inhibitor, any polymerization inhibitor may be used as long as it is conventionally used. In the present invention, the second polymerization inhibitor may be hydroquinone, toluohydroquinone, hydroquinone methyl ether, benzoquinone, methyl-p-benzo Quinone, t-butyl catechol, 2,6-di-t-butyl-4-methylphenol, 4-methoxyphenol, phenothiazine, 0.5% by weight. Particularly, in order to maximize polymerization inhibition efficiency with respect to the content of the reactive diluent of the present invention, it is most preferable to use 0.01 to 0.1 wt% of toluohydroquinone as the second polymerization inhibitor.
In the present invention, the defoaming agent is not particularly limited, but is preferably at least one selected from the group consisting of a silicone compound, a fluorine compound, and an acrylic compound, and a preferable content thereof is 0.01 to 0.5 wt%.
In the present invention, the photoinitiator serves to initiate photo-curing of the resin composition, and both a short-wavelength photoinitiator exhibiting light absorption in the range of 200-350 nm and a long-wavelength photoinitiator exhibiting light absorption in the range of 300-480 nm can be used. When a short-wavelength photoinitiator is used, it is advantageous to produce a cured product of a thick thickness, and when a long wavelength initiator is used, it is advantageous to manufacture a cured product of a thick thickness. When a long-wavelength photoinitiator is used, long-wavelength photoinitiator may be used alone, but it may be mixed with a short-wavelength photoinitiator and a proper composition ratio. However, when the above-mentioned photoinitiators are mixed and used, it is preferable to mix two or more photoinitiators having different absorption wavelength ranges. This is because the light energy can be utilized efficiently and the curing rate can be further increased. As short wavelength photoinitiators, any of those known in the art can be used, and examples thereof include 1-hydroxy-cyclohexyl-phenylketone, 2-hydroxy-2-methyl- Methylbenzoylformate,?,? -Dimethoxy-? -Phenylacetophenone, 2-benzoyl-2- (2-hydroxyethoxy) (Dimethylamino) -1- [4- (4-morpholinyl) phenyl] -1-butanone, 2- methyl- 1- [4- (methylcio) ) -1-propanone, and commercially available products include Irgacure 184, Darocur 1173, Irgacure 2959, Darocur MBF, Irgacure 651, Irgacure 369 and Irgacure 907 from BASF. The long wavelength photoinitiator may be any known one, for example, 2-benzyl-2-dimethylamino-1-butanone, diphenyl (2,4,6-trimethylbenzoyl) -phosphine oxide, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, benzyldimethyl ketal, 2,4,6-trimethylbenzophenone, oligo (2-hydroxy- Propane), 2,2-dimethoxy-1,2-diphenylethane-1-one, 1 -hydroxy-cyclohexyl phenyl ketone, 2- Diethyl thioxanthone, 3,3-dimethyl-4-methoxy-benzophenone, ethyl p-dimethyl aminobenzoate, isoamyl p-dimethyl aminobenzoate, bis (2,6-dichlorobenzoyl ) -Phenylphosphine oxide, bis (2,6-dichlorobenzoyl) -2,5-dimethylphenylphosphine oxide, bis (2,6-dichlorobenzoyl) -4-ethoxyphenylphosphine oxide, bis 2,6-dichlorobenzoyl) -4-propylphenylphosphine oxide, bis (2,6- Trimethylpentylphosphine oxide, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide and the like. Commercially available products include Irgacure 819, Irgacure 369, Irgacure 2020 Irgacure 2022, Irgacure 2100, Irgacure 784, Lucirin TPO, Darocur 4265, etc. The content of the photoinitiator in the present invention is preferably 0.1 to 5% by weight, though not particularly limited thereto.
The vinyl ester resin composition for producing a photocurable sheet according to the present invention has a higher viscosity than a conventional vinyl ester resin composition and has an excellent curing property and is thus excellent in workability in the production of a photocurable sheet or a sheet molding compound (SMC) .
Another aspect of the present invention relates to a photocurable sheet produced using the above-mentioned vinyl ester resin composition.
Still another aspect of the present invention relates to a sheet molding compound (SMC) produced using the above-mentioned vinyl ester resin composition.
In another embodiment of the present invention, there is provided a process for producing a vinyl ester resin composition for the production of a photocurable sheet, which comprises the steps of: (1) 0.5 to 5% by weight of styrene monomer, and 5 to 15% by weight of styrene monomer; Adding 0.1 to 2% by weight of an amine catalyst to the reactor and raising the temperature to 100 to 120 ° C; Dropping 15 to 25% by weight of an unsaturated carboxylic acid compound into the reactor, and maintaining the reaction until the acid value is 30 or less; When the acid value is 30 or less, the temperature is cooled to 80 to 85 ° C, and 1 to 10% by weight of an acid anhydride is added to chain extend to dicarboxylic acid to prepare a polymerized vinyl ester resin. A vinyl ester resin composition for producing a photocurable sheet was prepared by adding 25 to 30 wt% of a reactive diluent, 0.005 to 0.5 wt% of a second polymerization inhibitor, 0.01 to 0.5 wt% of a defoamer, and 0.1 to 5 wt% of a photoinitiator to the vinyl ester resin prepared above ≪ / RTI >
The reaction conditions such as the temperature condition and the acid value condition imparted to each step in the production process according to the present invention are important process conditions for producing the vinyl ester resin composition excellent in the viscosity of the present invention, If any one of them deviates, the problem that the present invention does not reach the desired thickening property may arise.
In the production process according to the present invention, any epoxy resin can be used as long as it is an epoxy resin containing at least one epoxy group. In order to maximize the thickening effect of the vinyl ester resin composition, it is preferable to use a phenol novolak type epoxy resin , And the content of the epoxy resin is preferably 30 to 50% by weight.
In the production process according to the present invention, the dicarboxylic acid compound acts as a ring-opening substance that opens two or more epoxy groups of the epoxy resin as a compound containing two carboxyl groups in the molecule and is not particularly limited in its kind, but adipic acid Isophthalic acid, terephthalic acid, 1,4-cyclohexanedicarboxybic acid, sebacic acid, succinic acid, azelaic acid, at least one selected from the group consisting of azelaic acid, itaconic acid, phthalic acid, and fumaric acid is preferable from the viewpoint of enhancing the thickening effect of the vinyl ester resin composition. The content of the dicarboxylic acid compound is not particularly limited, but is preferably 1 to 10% by weight in the production of a vinyl ester resin composition in which the present thickening effect is maximized.
In the production process according to the present invention, the first polymerization inhibitor may be any conventional polymerization inhibitor, but in the present invention, the first polymerization inhibitor may be hydroquinone, toluohydroquinone, hydroquinone methyl ether, benzo Quinone, methyl-p-benzoquinone, t-butylcatechol, 2,6-di-t-butyl-4-methylphenol, 4-methoxyphenol and phenothiazine , And the content thereof is preferably 0.01 to 0.5% by weight. Particularly, in the present invention, 0.01 to 0.25% by weight of hydroquinone and 0.01 to 0.25% by weight of toluhydroquinone are preferably used as the first polymerization inhibitor in view of the efficiency of the polymerization reaction.
In the production process according to the present invention, the amine-based catalyst is preferably at least one selected from the group consisting of triethylamine, ethyltrimethylammonium bromide, dimethylbenzylamine and di-n-butylamine, Amine. The content of the amine-based catalyst is not particularly limited, but is preferably 0.1 to 2% by weight.
In the production method according to the present invention, the unsaturated carboxylic acid compound to be reacted with the epoxy resin is preferably at least one selected from the group consisting of acrylic acid, methacrylic acid, and methyl (meth) acrylic acid, and most preferably methacrylic acid. The content of the unsaturated carboxylic acid compound is preferably 15 to 25% by weight.
It is preferable that the acid anhydride is at least one selected from the group consisting of phthalic anhydride, maleic anhydride, tetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, and trimellitic anhydride. The content of the acid anhydride is preferably 1 to 10% by weight.
In the production process according to the present invention, the reactive diluent is usually a monomer having a lower molecular weight than the resin component, lowering the viscosity of the resin, and containing a functional group capable of polymerizing when exposed to actinic radiation . Also, the content of the reactive diluent is preferably 25 to 30% by weight in order to maximize the photocuring property without inhibiting the thickening property of the resin composition of the present invention.
In the production process according to the present invention, the second polymerization inhibitor is added together with a reactive diluent, a defoaming agent, and a photoinitiator after the vinyl ester resin which is polymerized by chain extension with a dicarboxylic acid is prepared, . As the second polymerization inhibitor, any polymerization inhibitor may be used as long as it is conventionally used. In the present invention, the second polymerization inhibitor may be hydroquinone, toluohydroquinone, hydroquinone methyl ether, benzoquinone, methyl-p-benzo Quinone, t-butyl catechol, 2,6-di-t-butyl-4-methylphenol, 4-methoxyphenol, phenothiazine, 0.5% by weight. In particular, it is most preferable to use 0.01 to 0.1 wt% of toluohydroquinone as the second polymerization inhibitor in order to maximize the polymerization inhibiting performance of the reactive diluent.
In the production method according to the present invention, the defoaming agent is not particularly limited, but is preferably one selected from the group consisting of a silicone compound, a fluorine compound, and an acrylic compound, and the photoinitiator is a phosphine-based photoinitiator Or an alpha-hydroxyketone-based photoinitiator is preferably used.
Hereinafter, the present invention will be described by way of examples. The following examples are only illustrative of the present invention, and the scope of the present invention is not limited thereby.
<Examples>
Example
40 wt% of a phenol novolak type epoxy resin, 5 wt% of adipic acid, 0.03 wt% of a polymerization inhibitor, 0.02 wt% of a toluene hydroquinone and 10 wt% of a styrene monomer were charged into a reactor, and the temperature was raised to 60 캜. After adding 0.5% by weight of amine and raising the temperature to 100 캜, 16% by weight of methacrylic acid was dropped, and the reaction was maintained until the acid value became 30 or less.
When the acid value became 30 or less, the temperature was lowered to 85 ° C, 5% by weight of maleic anhydride was added, and the reaction was maintained for 1 hour to chain-extend to dicarboxylic acid to prepare a macromolecularized phenol novolak type vinyl ester resin.
The vinyl ester resin prepared through the reaction was diluted with 22 wt% of a styrene monomer diluent, 0.1 wt% of a polymerization inhibitor, and 0.05 wt% of a defoamer (BYK-500) were added, and a vinyl ester resin To prepare the composition, 1.3 wt% of a photoinitiator was added to prepare a phenol novaleak type vinyl ester resin composition for producing a photocurable sheet.
Comparative Example
30% by weight of bisphenol A type epoxy resin was added to the reactor and the temperature was raised to 90 ° C. Then, 0.5% by weight of triethylamine and 15% by weight of acrylic acid were dropped and the temperature was elevated to 110 ° C. Lt; / RTI >
After completion of the reaction at an acid value of 10 or less, the reaction mixture was cooled to 60 占 폚, 5% by weight of an isocyanate compound was dropped for 1 hour, and the reaction was maintained at 60 占 폚. When NCO% became 0, the reaction was terminated to prepare a vinyl ester resin Respectively.
The vinyl ester resin was diluted with 40% by weight of a styrene monomer diluent, and a vinyl ester resin composition for producing a photocurable sheet was prepared by adding 1% by weight of a hydroquinone polymerization inhibitor, 0.7% by weight of a dispersion and anti-decarboxylator, and 1.3% by weight of a photoinitiator .
Experimental Example 1:
150 g of calcium carbonate and 15 g of MgO were added to 150 g of each of the vinyl ester resin compositions prepared in the Examples and Comparative Examples, and the thickening effect was compared with the conventional vinyl ester resin (conventional VE). The results are shown in the following Table 1 and Fig. 1 As shown in Fig.
(Unit: Poise,
45 ° C)
According to the graph shown in Table 1 and FIG. 1, the conventional vinyl ester resin is not so much developed, so there is a limit in application to SMC (sheet molding compound) and photocurable sheet. In the case of the comparative resin composition, It is confirmed that the resin composition (example) according to the present invention has the greatest increase in viscosity compared to the resin composition (example) according to the present invention, although it is far superior to the conventional vinyl ester resin, SMC processing and photocuring sheets.
Experimental Example 2: Photocurability
The photocurability of the above Examples, Comparative Examples and conventional vinyl ester resins was evaluated by proceeding photo-curing under natural light conditions. The experimental results are shown in the following Table 2.
According to the above Table 2, the examples according to the present invention show that the photocurable properties are excellent even under natural light as compared with the conventional vinyl ester resins and the comparative resin compositions, and that the tensile strength is the highest when the resin is sheeted, The resin composition according to the present invention has an advantage that it can be easily applied anywhere, even without a separate ultraviolet equipment.
As described above, those skilled in the art will understand that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. It will be understood by those skilled in the art that the present invention may be embodied in many other specific forms without departing from the spirit or scope of the invention as defined by the appended claims and their equivalents. .
Claims (14)
Adding 0.1 to 2% by weight of an amine catalyst to the reactor and raising the temperature to 100 to 120 ° C;
Dropping 15 to 25% by weight of an unsaturated carboxylic acid compound into the reactor, and maintaining the reaction until the acid value is 30 or less;
When the acid value is 30 or less, the temperature is cooled to 80 to 85 ° C, and 1 to 10% by weight of an acid anhydride is added to chain extend to dicarboxylic acid to prepare a polymerized vinyl ester resin.
A vinyl ester resin composition for producing a photocurable sheet was prepared by adding 25 to 30 wt% of a reactive diluent, 0.005 to 0.5 wt% of a second polymerization inhibitor, 0.01 to 0.5 wt% of a defoamer, and 0.1 to 5 wt% of a photoinitiator to the vinyl ester resin prepared above A vinyl ester resin composition for the production of a photocurable sheet.
Wherein the epoxy resin is a phenol novolak type epoxy resin.
The dicarboxylic acid compound may be selected from the group consisting of adipic acid, isophthalic acid, terephthalic acid, 1,4-cyclohexanedicarboxylic acid, sebacic acid, At least one selected from the group consisting of citric acid, succinic acid, azelaic acid, itaconic acid, phthalic acid, and fumaric acid. A method for producing a vinyl ester resin composition for sheet production.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020160028865A KR101806228B1 (en) | 2016-03-10 | 2016-03-10 | Vinylester resin composition for UV curable sheet and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020160028865A KR101806228B1 (en) | 2016-03-10 | 2016-03-10 | Vinylester resin composition for UV curable sheet and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20170105782A KR20170105782A (en) | 2017-09-20 |
| KR101806228B1 true KR101806228B1 (en) | 2017-12-07 |
Family
ID=60033737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020160028865A KR101806228B1 (en) | 2016-03-10 | 2016-03-10 | Vinylester resin composition for UV curable sheet and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR101806228B1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108396644B (en) * | 2017-12-18 | 2024-01-19 | 河北恒瑞复合材料有限公司 | SMC composite material and pavement system using same |
| KR101999596B1 (en) * | 2018-11-15 | 2019-07-17 | (주)화승엑스윌 | Resin composition for UV curable sheet and preparation method thereof |
| KR102245148B1 (en) * | 2018-12-06 | 2021-04-28 | 재단법인 한국탄소융합기술원 | Resin composition for sheet molding compound and sheet molding compound using the same |
| KR102140039B1 (en) * | 2019-01-22 | 2020-07-31 | 재단법인 한국탄소융합기술원 | Composition of modified epoxy vinyl ester acrylate resin and prepreg using the same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100937918B1 (en) * | 2001-09-27 | 2010-01-21 | 스미또모 가가꾸 가부시키가이샤 | Resin composition |
-
2016
- 2016-03-10 KR KR1020160028865A patent/KR101806228B1/en active IP Right Grant
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100937918B1 (en) * | 2001-09-27 | 2010-01-21 | 스미또모 가가꾸 가부시키가이샤 | Resin composition |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20170105782A (en) | 2017-09-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105026444B (en) | Curable composition, transparent heat-resistant material, and use thereof | |
| US11591425B2 (en) | Curable compositions and uses thereof | |
| KR101806228B1 (en) | Vinylester resin composition for UV curable sheet and preparation method thereof | |
| JP6075514B2 (en) | Urethane (meth) acrylate resin, curable resin composition, cured product thereof, and plastic lens | |
| JP3994297B2 (en) | Resin composition and civil engineering building material | |
| JP2011153248A (en) | Curable resin composition, cured product thereof and plastic lens | |
| WO2019004125A1 (en) | Radical polymerizable resin composition and structure-repairing material | |
| JP5344794B2 (en) | Active energy ray-curable coating resin composition | |
| JP2011231231A (en) | Radically curable unsaturated resin composition and coating material | |
| JP4147468B2 (en) | Resin composition | |
| WO2002094897A1 (en) | Curable unsaturated resin composition | |
| JP4151310B2 (en) | Curable unsaturated resin composition | |
| CN112789259A (en) | Method for repairing structure | |
| JP6970514B2 (en) | Radical curable resin composition, protective layer and building construction method | |
| JP2020029543A (en) | Resin composition and method for producing resin composition | |
| JP2018053132A (en) | (meth)acrylate compound, synthesis method thereof and use of the (meth)acrylate compound | |
| JPH1160540A (en) | Aromatic ester (meth)acrylate dendrimer and curable resin composition | |
| WO2020040052A1 (en) | Curable resin composition and cured product therefrom | |
| JP4100120B2 (en) | Covering structure | |
| WO2017200082A1 (en) | Composition for carbon fiber-reinforced resin, carbon fiber-reinforced resin composition, cured article | |
| KR101999596B1 (en) | Resin composition for UV curable sheet and preparation method thereof | |
| KR102225655B1 (en) | UV curable sheet resin composition for repairing concrete and waterproof sheet and preparation mehtod thereof | |
| JP6452320B2 (en) | Urethane (meth) acrylate-based compound, active energy ray-curable resin composition, and coating agent composition | |
| JPWO2017110845A1 (en) | Active energy ray-curable resin composition and method for producing the same | |
| JP5845935B2 (en) | Radical polymerizable resin composition |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant |