KR101799627B1 - Method for manufacturing double-faced conductive laminate and double-faced conductive laminate manufactured by using same - Google Patents

Abstract

The present application relates to a method for producing a double-sided conductive laminate and a double-sided conductive laminate manufactured using the same and the use of the double-sided conductive laminate. In the method for producing a double-sided conductive laminate of the present application, a step of directly applying and drying a first pressure-sensitive adhesive layer and a second pressure-sensitive adhesive layer to a carrier film without introducing a mode in which a conventional carrier film is not used is introduced, Or by adjusting the drying temperature of the first pressure-sensitive adhesive layer and the drying temperature of the second pressure-sensitive adhesive layer so as to be at least equal to or more than a specific range, thereby reducing bubbling and removing bubbles, It is possible to maintain a low haze even after the heat treatment process for crystallizing the conductive layer, and to provide a double-sided conductive laminate having excellent transparency.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method for manufacturing a double-sided conductive laminate and a double-sided conductive laminate using the same,

The present application relates to a method for producing a double-sided conductive laminate and a double-sided conductive laminate manufactured using the same and the use of the double-sided conductive laminate.

BACKGROUND ART [0002] A touch panel or a touch screen is variously applied to various information processing terminals such as a mobile communication terminal or an ATM, or a display device such as a TV and a monitor. In addition, as the application to small portable electronic devices increases, the demand for a smaller and lighter touch panel or screen is increasing.

In the construction of the touch panel or the screen, a one-side or both-side conductive laminate is used.

In the production of the double-sided electroconductive laminate, bubbles tend to be generated during the laminating process when the carrier film is absent, and the bubbles are affected after the heat treatment process for crystallizing the ITO, thereby increasing the haze.

Patent Documents 1 and 2 propose the conductive laminate production method and the like.

Patent Document 1: Korean Patent Publication No. 2009-0066047 Patent Document 2: Korean Patent Publication No. 2009-0019634

The present application provides a method for producing a double-sided conductive laminate and uses of the double-sided conductive laminate and the double-sided conductive laminate manufactured using the same.

The present application relates to a method for producing a double-sided conductive laminate.

An exemplary method for producing a double-sided conductive laminate includes: applying and drying a first pressure-sensitive adhesive layer on at least one side of a substrate layer, followed by aging; And applying a second pressure-sensitive adhesive layer to the other side of the surface of the substrate layer on which the first pressure-sensitive adhesive layer is coated after the completion of the step, followed by drying. Herein, the terms "first pressure-sensitive adhesive layer" and "second pressure-sensitive adhesive layer" refer to the same layer containing constituent components including a pressure-sensitive adhesive polymer as described later, . Accordingly, the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer are separately described below, but the content of the first pressure-sensitive adhesive layer can be applied to the second pressure-sensitive adhesive layer, and conversely, the content of the second pressure- .

In the method for producing a double-sided conductive laminate of the present application, a process of directly applying and drying a first pressure-sensitive adhesive layer and a second pressure-sensitive adhesive layer to a carrier film without introduction of a form without using a conventional carrier film is introduced, It is possible to provide a double-sided conductive laminated body which can maintain a low haze even when a heat treatment process for crystallization of the conductive layer is performed by reducing the occurrence of bubbles and is thus excellent in transparency.

The step of applying the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer to both surfaces of the base layer is not particularly limited and can be applied by a conventional coating method. For example, spray coating, dip coating, spin coating, knife coating, Wet coating methods such as kiss coating, gravure coating, slot die coating, roll coating and bar coating, and dry coating methods such as physical vapor growth such as sputtering and vapor deposition and chemical vapor deposition. The application may be performed in a plurality of ways, or two different application methods may be combined.

The step of applying the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer to both surfaces of the base layer and then drying the pressure-sensitive adhesive layer is not particularly limited, but may be, for example, 50 to 200 캜, 70 to 180 캜, or 90 to 160 캜 For a period of from 0.1 minute to 10 minutes, from 0.5 minutes to 7.5 minutes, or from 1 minute to 5 minutes.

The first pressure-sensitive adhesive layer formed first among the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer may include a process of aging.

The step of aging the first pressure-sensitive adhesive layer is performed at a temperature of 5 to 100 캜, 15 to 75 캜 or 30 to 50 캜 for 1 to 48 hours, 10 to 40 hours, or 15 to 30 hours .

In the method for producing a double-sided conductive laminate of the present application, a step of directly applying and drying a first pressure-sensitive adhesive layer and a second pressure-sensitive adhesive layer to a substrate layer is introduced, and a step of applying and drying the first pressure- There is provided a double-sided electroconductive laminate which is capable of maintaining a low haze even when a heat treatment process for crystallizing the electroconductive layer is carried out by removing bubbles and bubbling in the process of manufacturing the double-side electroconductive laminate, can do.

In one example, the method for producing a double-sided conductive laminate of the present application includes: applying and drying a first pressure-sensitive adhesive layer on at least one side of a substrate layer; And applying and drying a second pressure-sensitive adhesive layer on the other surface of the base layer coated with the first pressure-sensitive adhesive layer, wherein the difference in drying temperature between the first pressure-sensitive adhesive layer and the second pressure- Or more.

The steps of applying and drying the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer on both surfaces of the base layer are as described above.

There is no particular limitation in the step of applying the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer on both sides of the base layer and then drying the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer, For example, the first pressure sensitive adhesive layer may be dried at a temperature of 50 to 250 DEG C, 80 to 200 DEG C or 110 to 180 DEG C, and the second pressure sensitive adhesive layer may be dried at 30 to 150 DEG C, Lt; RTI ID = 0.0 > 70 C < / RTI >

The drying time is not particularly limited as long as the above range of the temperature is satisfied, but may be performed, for example, from 0.1 minute to 10 minutes, from 0.5 minute to 7.5 minutes, or from 1 minute to 5 minutes.

In the method for producing a double-sided conductive laminate of the present application, a step of directly applying and drying a first pressure-sensitive adhesive layer and a second pressure-sensitive adhesive layer to a base layer is introduced, and the drying temperature of the first pressure- Can be maintained to have a low haze even if a heat treatment process for crystallization of the conductive layer is carried out by removing bubbling factors and bubbling during the manufacturing process of the double-side conductive laminate, The excellent double-sided conductive laminate can be provided.

The method for producing a double-sided conductive laminate of the present application may further comprise the step of forming a hard coat layer between the base layer and the first pressure-sensitive adhesive layer or between the base layer and the second pressure-sensitive adhesive layer.

The method of forming the hard coat layer is not particularly limited and may be formed in a usual manner, and a detailed description of the hard coat layer will be described later.

In addition, the method for producing a double-sided conductive laminate of the present application may further comprise the step of forming a protective film layer on the other surface of the first pressure-sensitive adhesive layer or the second pressure-sensitive adhesive layer on which the hard coating layer is formed.

The method of forming the protective film layer is not particularly limited and may be formed in a usual manner, and a detailed description of the protective film layer will be described later.

In addition, the method for producing a double-sided conductive laminate of the present application may include a step of removing the protective film layer and then forming a conductive laminate. As used herein, the term " conductive laminate " An undercoat layer formed on at least one surface of the substrate layer; And an electrically conductive layer formed on the undercoat layer.

An exemplary structure of the conductive laminate is shown in Fig. As shown in Fig. 1, the conductive laminate 50 includes a base layer 60; An undercoat layer (70) formed on at least one surface of the substrate layer (60); And an electrically conductive layer 80 formed on the undercoat layer 70. [0050]

The manner of forming the base layer, undercoat layer and conductive layer is not particularly limited and can be formed in a usual manner, and a detailed description of the base layer, undercoat layer and conductive layer will be described later.

The present application also relates to a double-sided conductive laminate produced by the above-described method for producing a double-sided conductive laminate.

The double-sided conductive laminate according to the present application is exemplarily shown in Fig.

As shown in Fig. 2, the double-sided conductive laminate includes a base layer 10; A first pressure-sensitive adhesive layer (30) formed on at least one side of the substrate layer (10) and being a crosslinked layer of a pressure-sensitive adhesive composition comprising a pressure-sensitive adhesive polymer; A second pressure-sensitive adhesive layer (40) which is a crosslinked layer of a pressure-sensitive adhesive composition which is formed on the other surface of the surface of the base layer on which the first pressure-sensitive adhesive layer is formed and contains a pressure-sensitive adhesive polymer; A hard coating layer 20 formed between the base layer 10 and the first pressure sensitive adhesive layer 30 and / or between the base layer 10 and the second pressure sensitive adhesive layer 40; And a conductive laminate 50 formed on the first pressure-sensitive adhesive layer 30 and the second pressure-sensitive adhesive layer 40.

3 is a more detailed view of the double-sided conductive laminate of the present application. As shown in FIG. 3, the conductive laminate 50 has a structure in which the base layer 60 is bonded to the first pressure-sensitive adhesive layer 30 and the second pressure-sensitive adhesive layer 40 to form the conductive layer 80 at the outermost periphery Structure.

As the base layer, for example, an optically transparent plastic film can be used. Examples of the plastic film include a polyester film such as a poly (ethylene terephthalate) film, a polyamide film, a polyvinyl chloride film, a polystyrene film, or a polyolefin film such as polyethylene or polypropylene have. The plastic film may be an unoriented or uniaxially or biaxially stretched film. The surface of the substrate layer may be subjected to treatment such as corona discharge treatment, ultraviolet ray irradiation treatment, plasma treatment, or sputter etching on the surface from the viewpoint of improvement of adhesion with the conductive layer. Such a base layer may have a thickness of, for example, about 10 탆 to 300 탆, 50 탆 to 200 탆, or 100 탆 to 150 탆.

The first pressure-sensitive adhesive layer and / or the second pressure-sensitive adhesive layer may be a crosslinked layer of a pressure-sensitive adhesive composition comprising a pressure-sensitive adhesive polymer.

The tacky polymer may include alkyl (meth) acrylate and a copolymerizable monomer having a crosslinkable functional group as polymerized units. In the present specification, the term " polymerization unit of a predetermined monomer " means a form in which the above-mentioned predetermined monomer is used in a polymerization process for producing the adhesive polymer to form a skeleton such as a main chain or side chain of the adhesive polymer after polymerization can do.

As the alkyl (meth) acrylate, an alkyl (meth) acrylate having an alkyl group having 1 to 14 carbon atoms may be used in consideration of physical properties such as adhesiveness to be described later. The alkyl group in the above may be straight-chain, branched-chain or cyclic. Examples of such alkyl (meth) acrylates include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, butyl (Meth) acrylate, n-octyl (meth) acrylate, isooctyl (meth) acrylate, isononyl (meth) acrylate, Acrylate, lauryl (meth) acrylate, and tetradecyl (meth) acrylate. One or more of these may be contained in a polymerized form in the resin.

The copolymerizable monomer having a crosslinkable functional group can provide a crosslinkable functional group capable of reacting with a crosslinking agent to be described later contained in the tacky polymer. As used herein, the term " comonomer having a crosslinkable functional group " is meant to include a monomer having both a crosslinkable functional group and a copolymerization site at the same time. Examples of such a crosslinkable functional group include a hydroxyl group, a carboxyl group, a nitrogen-containing group, an epoxy group or an isocyanate group, preferably a hydroxyl group, a carboxyl group or a nitrogen-containing group, and most preferably a hydroxyl group .

In the field of producing a pressure-sensitive adhesive layer using an acrylic polymer, various copolymerizable monomers capable of providing the above-mentioned crosslinkable functional groups to the pressure-sensitive polymer are known, and in the present application, such monomers can be used without limitation. Examples of the copolymerizable monomer having a hydroxyl group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) (Meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyleneglycol (meth) acrylate and the like can be used.

The crosslinkable functional group may be one or more, or two or more, and preferably two or more.

The pressure-sensitive adhesive polymer may comprise 80 to 99 parts by weight of polymerized units of alkyl (meth) acrylate and 1 to 20 parts by weight of polymerized units of copolymerizable monomers having a crosslinkable functional group. In the present specification, the unit " part by weight " may mean the ratio of the weight between each component. For example, when the tacky polymer comprises 80 to 99 parts by weight of the polymerization unit of the alkyl (meth) acrylate and 1 to 20 parts by weight of the polymerization unit of the copolymerizable monomer having a crosslinkable functional group, Means a case where the ratio (A: B) based on the weight of the alkyl (meth) acrylate (A) forming the unit and the copolymerizable monomer (B) having the crosslinkable functional group is from 80 to 99: 1 to 20 can do. The physical properties such as adhesiveness after crosslinking of the first pressure-sensitive adhesive layer and / or the second pressure-sensitive adhesive layer which is the crosslinking layer of the pressure-sensitive adhesive composition containing the pressure-sensitive adhesive polymer in the range of the weight ratio can be excellently maintained. Further, in another example, the viscous polymer may include 85 to 95 parts by weight of polymerized units of alkyl (meth) acrylate and 5 to 15 parts by weight of polymerized units of copolymerizable monomers having a crosslinkable functional group, It can be appropriately adjusted in consideration of physical properties such as adhesiveness.

The pressure-sensitive adhesive polymer contained in the first pressure-sensitive adhesive layer and / or the second pressure-sensitive adhesive layer may further include any other comonomer, if necessary, for example, when necessary for controlling adhesion, Monomers may be included as polymerized units. Examples of the comonomer include (meth) acrylonitrile, (meth) acrylamide, N-methyl (meth) acrylamide, N-butoxymethyl (meth) acrylamide, N-vinylpyrrolidone, Nitrogen-containing monomers such as lactam and the like; Styrene-based monomers such as styrene or methylstyrene; Glycidyl group-containing monomers such as glycidyl (meth) acrylate; And carboxylic acid vinyl esters such as vinyl acetate, but are not limited thereto. These comonomers may be included in the tacky polymer, if necessary, by selecting one or more suitable types. Such comonomers may be included in the adhesive polymer, for example, in a proportion of 20 parts by weight or less, or 0.1 parts by weight to 15 parts by weight, based on the weight of the other monomers in the adhesive polymer.

In one example, the weight average molecular weight of the tacky polymer may be from 300,000 to 2,000,000, from 600,000 to 1.7 million, or from 90,000 to 140. As used herein, the term " weight average molecular weight " means a value converted to standard polystyrene measured by GPC (Gel Permeation Chromatograph), and unless otherwise specified, the term molecular weight may mean weight average molecular weight. The weight average molecular weight of the pressure-sensitive adhesive polymer may be controlled within the above-mentioned range, and the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer containing the pressure-sensitive adhesive polymer may exhibit better physical properties such as adhesiveness after crosslinking.

The tacky polymer as described in the present application can be prepared by conventional polymerization methods in this field, for example, solution polymerization, photo polymerization, bulk polymerization, suspension polymerization or emulsion polymerization (Emulsion polymerization), or the like, preferably by a solution polymerization method.

In one example, the pressure-sensitive adhesive composition forming the first pressure-sensitive adhesive layer and / or the second pressure-sensitive adhesive layer may comprise a crosslinking agent.

The crosslinking agent is not particularly limited, but for example, a polyfunctional crosslinking agent can be used. The multifunctional crosslinking agent may be used without limitation as long as it has two or more functional groups, for example, two to six functional groups reacting with the crosslinkable functional group.

The multifunctional crosslinking agent contained in the pressure-sensitive adhesive composition may be at least one crosslinking agent selected from the group consisting of an isocyanate crosslinking agent, a polyvalent metal compound, an aziridine compound, an oxazoline resin, a carbodiimide compound, an epoxy compound and a melamine resin Can be used.

Examples of the isocyanate compound include, but are not limited to, 2,2-dimethylpentane diisocyanate, hexamethylene diisocyanate, 2,2,4-trimethylhexane diisocyanate, butene diisocyanate, 1,3- 1,4-diisocyanate, 2,4,4-trimethylhexamethylene diisocyanate, 1,6,11-undecatriisocyanate, 1,3,6-hexamethylene triisocyanate, 1,8-diisocyanate- Aliphatic isocyanate compounds such as cyanatomethyloctane, bis (isocyanatoethyl) carbonate and bis (isocyanatoethyl) ether; (Isocyanatomethyl) cyclohexane, 1,3-bis (isocyanatomethyl) cyclohexane, 1,4-bis (isocyanatomethyl) cyclohexane, isophorone diisocyanate, Alicyclic isocyanate compounds such as dicyclohexylmethane diisocyanate, cyclohexane diisocyanate, methylcyclohexane diisocyanate, dicyclohexyldimethylmethane isocyanate, and 2,2-dimethyldicyclohexylmethane isocyanate; (Isocyanatoethyl) benzene, bis (isocyanatopropyl) benzene, bis (isocyanatobutyl) benzene, bis (isocyanatomethyl) naphthalene, bis (isocyanatoethyl) Isocyanatomethyl) diphenyl ether, phenylenediisocyanate, ethylphenylenediisocyanate, isopropylphenylenediisocyanate, dimethylphenylenediisocyanate, diethylphenylenediisocyanate, diisopropylphenylenediisocyanate, trimethylbenzene triisocyanate, benzene tri Isocyanate, biphenyl diisocyanate, toluidine diisocyanate, 4,4-diphenylmethane diisocyanate, 3,3-dimethyldiphenylmethane-4,4-diisocyanate, bibenzyl-4,4-diisocyanate, bis Cyanatophenyl) ethylene, 3,3-dimethoxybiphenyl-4,4-diisocyanate, hexahydrobenzene diisocyanate, hexa Aromatic isocyanate compounds such as hydroiodiphenylmethane-4,4-diisocyanate; Bis (isocyanatoethyl) sulfide, bis (isocyanatoethyl) sulfide, bis (isocyanatopropyl) sulfide, bis (isocyanatohexyl) sulfide, bis Bis (isocyanatoethylthio) methane, bis (isocyanatoethylthio) methane, bis (isocyanatoethylthio) ethane, bis (isocyanatoethylthio) Aliphatic isocyanate compounds such as isocyanatomethylthio) ethane and 1,5-diisocyanato-2-isocyanatomethyl-3-thiapentane; Diphenylsulfide-2,4-diisocyanate, diphenylsulfide-4,4-diisocyanate, 3,3-dimethoxy-4,4-diisocyanatodibenzylthioether, bis (4- Diisocyanate, diphenyldisulfide-4,4-diisocyanate, 2,2-dimethyl diphenyldisulfide-5,5 Diisocyanate, 3,3-dimethyldiphenyldisulfide-5,5-diisocyanate, 3,3-dimethyldiphenyldisulfide-6,6-diisocyanate, 4,4- A sulfided aromatic isocyanate compound such as 5-diisocyanate, 3,3-dimethoxy diphenyl disulfide-4,4-diisocyanate and 4,4-dimethoxydiphenyl disulfide-3,3-diisocyanate; 2,5-bis (isocyanatomethyl) thiophene, 2,5-diisocyanatotetrahydrothiophene, 2,5-bis (isocyanatomethyl) (Isocyanatomethyl) tetrahydrothiophene, 2,5-diisocyanato-1,4-dithiane, 2,5-bis (isocyanatomethyl) Dithiane, 4,5-diisocyanato-1,3-dithiolane, 4,5-bis (isocyanatomethyl) -1,3-dithiolane, 4,5-bis Isocyanatomethyl) -2-methyl-1,3-dithiolane, and the like can be used.

The polyvalent metal compound is not particularly limited but a compound in which a polyvalent metal exists in a state of being fed to acetylacetone or ethyl acetonate can be used. As the polyvalent metal, there can be used aluminum, iron, zinc N, N'-toluene-2,4-bis (1-aziridinecarboxamide), N, N'-diphenylmethane diisocyanate, -Diphenylmethane-4,4'-bis (1-aziridine carboxamide), triethylene melamine, bisisopropanoyl-1- (2-methyl aziridine) Oxides, and the like, but they are not limited thereto.

Examples of the oxazoline resin include 2-vinyl-2-oxazoline, 2-vinyl-4-methyl-2-oxazoline, Phenyl-2-oxazoline, 2-isopropenyl-4-methyl-2-oxazoline or 2-isopropenyl-5-ethyl-2-oxazoline may be used. As the carbodiimide compound For example, 1,3-dicyclohexylcarbodiimide, HMV-8CA sold by NISSHINBO, HMV-10B, bis- (2,6-diisopropyl- Carbodiimide), poly- (1,3,5-triisopropyl-phenyl-2,4-carbodiimide), and the like, but the present invention is not limited thereto.

Examples of the epoxy compound include ethylene glycol diglycidyl ether, triglycidyl ether, trimethylolpropane triglycidyl ether, N, N, N ', N'-tetraglycidylethylenediamine or glycerin Diglycidyl ether and the like can be used. As the melamine compound, for example, a melamine resin containing an amino group or a butoxy group and a melamine compound containing a methoxy group can be used. Specific examples thereof include CYTEC, CYMEL 325, CYMEL 327; BE 3748, BE 3040 from BIP; RESIMENE 717 from MONSANTO; CYMEL 303 manufactured by UNITED CARBIDE, and CYMEL 1130 manufactured by AMERICAN CYANAMID. However, the present invention is not limited thereto.

The pressure-sensitive adhesive composition contained in the first pressure-sensitive adhesive layer and / or the second pressure-sensitive adhesive layer may contain 0.01 to 5 parts by weight, 0.05 to 3 parts by weight or 0.1 to 1 part by weight of a crosslinking agent based on 100 parts by weight of the pressure- can do. The content of the cross-linking agent contained in the pressure-sensitive adhesive composition may be suitably adjusted within the above-mentioned range to ensure excellent physical properties such as adhesiveness of the first pressure-sensitive adhesive layer and / or the second pressure-sensitive adhesive layer containing the pressure-sensitive adhesive composition.

The first pressure-sensitive adhesive layer and / or the second pressure-sensitive adhesive layer may have a thickness of, for example, from about 1 탆 to 100 탆, from 1 탆 to 50 탆, or from 1 탆 to 25 탆, .

The double-sided conductive laminate of the present application may include a hard coat layer between the above-described base layer and the first pressure-sensitive adhesive layer and / or between the base layer and the second pressure-sensitive adhesive layer.

The hard coat layer can be formed of a common material, and can be formed by, for example, a hard coat treatment method of applying and hardening a hard resin such as an acrylic urethane resin or a siloxane resin. In the hard coat treatment, a silicone resin or the like is mixed with a hard resin such as the acryl urethane-based resin or siloxane-based resin to roughen the surface of the hard resin, and when it is applied to a touch panel or the like, Plane can be formed at the same time. Such a hard coat layer can be formed to a thickness of about 0.1 탆 to about 30 탆 in consideration of hardness characteristics, anti-cracking properties, curl prevention properties, and the like.

The double-sided conductive laminate of the present application may include a protective film layer on the first pressure-sensitive adhesive layer and / or the second pressure-sensitive adhesive layer. The protective film layer is not particularly limited as long as it has appropriate hardness for protecting the surface, and can be formed from a normal material. In addition, the above-described conductive laminate may be located at a position corresponding to the protective film layer after being removed to produce the double-sided conductive laminate.

The conductive laminate may have a structure in which a base layer 60, an undercoat layer 70, and a conductive layer 80 are sequentially stacked as shown in FIG. 1 and the above description. Is the same as the description of the substrate layer 10 described above.

The undercoat layer 70 can improve the adhesion between the conductive layer 80 and the base layer 60 described below, for example.

The undercoat layer may include an inorganic material, an organic material, or an organic composite material. As the inorganic material, for example, SiO ₂ , MgF ₂ or Al ₂ O ₃ can be exemplified. As the organic material, an acrylic polymer, a urethane polymer, a melamine polymer, an alkyd polymer or a siloxane polymer can be exemplified As the organic-inorganic composite material, a composite of at least one kind of inorganic material and at least one kind of organic material can be exemplified. In one example, the undercoat layer can be formed using a thermosetting resin comprising a mixture of a melamine resin, an alkyd polymer and an organosilane condensate as a sol-gel reaction product of an organic silane-containing mixture or an organic material.

The undercoat layer may be formed by, for example, vacuum deposition, sputtering, ion plating or coating. The undercoat layer may be formed to a thickness of usually 100 nm or less, 15 nm to 100 nm, or 20 nm to 60 nm.

The conductive layer can be formed by, for example, a vacuum evaporation method, a sputtering method, an ion plating method, a spray pyrolysis method, a chemical plating method, an electroplating method, or a general thin film formation method combining two or more of the above methods, Can be formed by a vacuum deposition method or a sputtering method.

Examples of the material constituting the conductive layer include metals such as gold, silver, platinum, palladium, copper, aluminum, nickel, chromium, titanium, iron, cobalt, tin and alloys of two or more of the above metals, indium oxide, tin oxide, Titanium, cadmium oxide, or a mixture of two or more of the above metals, iodine and the like, and the conductive layer may be a crystalline layer or an amorphous layer. Preferably, indium tin oxide (ITO) may be used to form the conductive layer, but the present invention is not limited thereto. The thickness of the conductive layer may be adjusted to about 10 nm to 300 nm, preferably about 10 nm to 200 nm, in consideration of the possibility of forming a continuous coating film, conductivity, transparency, and the like.

In one example, the double-sided conductive laminate of the present application can satisfy the following expression (1).

[Equation 1]

In the above formula (1), X is the haze value measured before the heat treatment after the production of the double-sided conductive laminate, and Y indicates the haze value measured after the heat treatment of the double-sided conductive laminate.

In the above formula 1, the range of X may be in the range of 0.1% to 3%, 0.5% to 2.5% or 1% to 2%, and the range of Y may be 0.1% to 3%, 0.7% To 2%. ≪ / RTI >

The double-sided electroconductive laminate of the present application satisfies the above-mentioned formula (1), so that the haze value can be kept low even after the heat treatment to make the transparency more excellent.

The present application also relates to a touch panel including the double-sided conductive laminate or a display device including the touch panel.

An exemplary touch panel may include the double-sided conductive laminate as an electrode plate.

The touch panel in the present application can be formed in a known structure including a capacitive type or a resistive type as long as it includes the double-sided conductive laminate or the electrode plate. The structure of the display device to which such a touch panel is applied, Can be applied as it is.

In the method for producing a double-sided conductive laminate of the present application, a step of directly applying and drying a first pressure-sensitive adhesive layer and a second pressure-sensitive adhesive layer to a carrier film without introducing a mode in which a conventional carrier film is not used is introduced, Or by adjusting the drying temperature of the first pressure-sensitive adhesive layer and the drying temperature of the second pressure-sensitive adhesive layer so as to be at least equal to or more than a specific range, thereby reducing bubbling and removing bubbles, It is possible to maintain a low haze even after the heat treatment process for crystallizing the conductive layer, and to provide a double-sided conductive laminate having excellent transparency.

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a diagram schematically showing the structure of a conductive laminate. FIG.
2 is a diagram schematically showing a structure of a double-side conductive laminate according to one example of the present application.
3 is a view showing the structure of the double-sided conductive laminate according to one example of the present application in more detail.
4 is a diagram schematically showing the structure of the conductive laminate used in Comparative Example 4 of the present application.

Hereinafter, the present application will be described in more detail by way of examples according to the present application and comparative examples not complying with the present application, but the scope of the present application is not limited by the following examples.

Hereinafter, physical properties in Examples and Comparative Examples were evaluated in the following manner.

1. Adhesive strength measurement

The double-sided conductive laminate produced in Examples and Comparative Examples was cut to a size of 1 inch x 100 mm (width x length) to prepare a test piece. The test piece was subjected to a test at a stripping rate of 0.3 m / min and a stripping angle of 180 degrees The adhesion of the adhesive strength before and after the heat treatment (1) and after (adhesive strength (2)) was measured using a TA (Texture Analyzer) apparatus, and the measured values are shown in Table 1.

2. Hayes  Measure

Haze (COH-400, manufactured by Nippon Denshoku Co., Ltd.) was measured for each haze before and after the heat treatment (haze (1) and haze (2)) using the double-side conductive laminate prepared in Examples and Comparative Examples. Were measured according to the JIS K 7105-1 standard, and the measured values are shown in Table 1.

Manufacturing example . Production of sticky polymer

50 parts by weight of ethylhexyl acrylate (EHA), 40 parts by weight of methyl acrylate (MA), and 40 parts by weight of hydroxyethyl acrylate (HEA) were added to a 1 L reactor equipped with a cooling device to reflux nitrogen gas, 10 parts by weight. Subsequently, 150 parts by weight of ethyl acetate (EAc) was poured into the reactor, nitrogen gas was purged for 60 minutes to remove oxygen, and azobisisobutyronitrile as a reaction initiator AIBN) was added thereto to initiate the reaction. The reaction product was reacted for about 1 hour and diluted with ethyl acetate (EAc) to prepare a sticky polymer.

Example  One

[Preparation of pressure-sensitive adhesive composition]

0.25 parts by weight of xylylene diisocyanate (BXX-5627, manufactured by SAMYOUNG INK & CO., LTD.) As a crosslinking agent was uniformly mixed with 100 parts by weight of the pressure-sensitive adhesive polymer obtained in the above Production Example to prepare a pressure-sensitive adhesive composition.

[Double-sided conductivity Of the laminate  Produce]

The resulting pressure-sensitive adhesive composition was coated on one side of a PET (poly (ethylene terephthalate)) film having a thickness of 125 μm, dried at a temperature of about 120 ° C. for about 3 minutes, aged at about 40 ° C. for about 24 hours, To form a pressure-sensitive adhesive layer (first pressure-sensitive adhesive layer) having a thickness of about 15 mu m. Thereafter, the prepared pressure-sensitive adhesive composition was coated on the opposite side of the PET on which the first pressure-sensitive adhesive layer was formed, and then dried at a temperature of about 120 ° C for about 3 minutes to form a pressure-sensitive adhesive layer (second pressure- . Thereafter, a hard coat layer and a protective film layer are formed by using a known method and materials, the protective film layer is removed, and then a conductive laminate (a structure in which a PET layer, an undercoat layer and a conductive layer (ITO film) ) Were laminated to produce a double-sided conductive laminate.

Example  2

A pressure-sensitive adhesive composition and a double-sided conductive laminate were prepared in the same manner as in Example 1, except that the drying temperature of the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer was set at about 130 캜.

Example  3

The pressure-sensitive adhesive composition and the double-sided conductive laminate were prepared in the same manner as in Example 1, except that the drying temperature of the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer was about 140 캜.

Example  4

Except that the drying temperature of the first pressure sensitive adhesive layer was set to about 140 캜, the aging process of the first pressure sensitive adhesive layer was not performed, and the drying temperature of the second pressure sensitive adhesive layer was set to about 100 캜. 1, a pressure-sensitive adhesive composition and a double-sided conductive laminate were prepared.

Example  5

The pressure-sensitive adhesive composition and the double-sided conductive laminate were prepared in the same manner as in Example 4, except that the drying temperature of the second pressure-sensitive adhesive layer was set at about 90 캜.

Example  6

The pressure-sensitive adhesive composition and the double-sided conductive laminate were prepared in the same manner as in Example 4, except that the drying temperature of the second pressure-sensitive adhesive layer was set at about 80 캜.

Comparative Example  One

A pressure-sensitive adhesive composition and a double-sided conductive laminate were prepared in the same manner as in Example 1, except that aging of the first pressure-sensitive adhesive layer was not carried out.

Comparative Example  2

Except that the drying temperature of the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer was set at about 130 ° C, and the aging process of the first pressure-sensitive adhesive layer was not carried out. To prepare a laminate.

Comparative Example  3

Except that the drying temperature of the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer was set at about 140 ° C, and the aging process of the first pressure-sensitive adhesive layer was not carried out, the pressure- To prepare a laminate.

Comparative Example  4

Except that a conductive laminate, a pressure-sensitive adhesive layer, and a conductive laminate, which are formed by sequentially laminating a conductive laminate, a pressure-sensitive adhesive layer, and a conductive laminate (not shown) except for a carrier film (base layer) and including only one pressure- The pressure-sensitive adhesive composition and the double-sided conductive laminate were prepared in the same manner as in Example 1, except that the pressure-sensitive adhesive layer was dried at a temperature of 120 캜 for about 3 minutes.

Comparative Example  5

The pressure-sensitive adhesive composition and the double-sided conductive laminate were prepared in the same manner as in Example 4 except that the drying temperature of the second pressure-sensitive adhesive layer was set to about 120 캜.

Comparative Example  6

The pressure-sensitive adhesive composition and the double-sided conductive laminate were prepared in the same manner as in Example 4 except that the drying temperature of the second pressure-sensitive adhesive layer was set at about 130 캜.

Comparative Example  7

The pressure-sensitive adhesive composition and the double-sided conductive laminate were prepared in the same manner as in Example 4, except that the drying temperature of the second pressure-sensitive adhesive layer was set at about 140 캜.

The results of physical properties measured for the above Examples and Comparative Examples are shown in Table 1 below.

division Example Comparative Example One 2 3 4 5 6 One 2 3 4 5 6 7 Adhesion (1) 1.1 1.1 1.1 1.1 1.1 1.1 1.1 1.1 1.1 0.7 1.1 1.1 1.1 Adhesion (2) 1.4 1.4 1.4 1.4 1.4 1.4 1.4 1.4 1.4 0.9 1.4 1.4 1.4 Hayes (1) 1.5 1.5 1.5 1.5 1.5 1.5 1.8 1.7 1.9 2.0 1.7 1.7 1.9 Hayes (2) 1.6 1.6 1.7 1.6 1.6 1.7 3.5 3.6 3.7 4.1 3.3 3.5 3.4 Adhesion unit: kg / in
Haze Units:%

As can be seen from the above Table 1, in the case of the double-sided electroconductive laminate of the present application, a conventional adhesive film without a carrier film was introduced (Comparative Example 4, Fig. 4), and the first pressure- (Examples 1 to 3), or a process of directly applying and drying the first pressure-sensitive adhesive layer and drying the first pressure-sensitive adhesive layer, (Examples 4 to 6), it is possible to obtain a desired level of adhesion even if the heat treatment process for crystallization of the conductive layer is performed by removing bubbles and reducing bubble generation And can maintain a low haze at the same time, so that it is possible to provide a double-sided conductive laminate having superior adhesion and transparency.

10: substrate layer
20: hard coat layer
30: first pressure-sensitive adhesive layer
40: second pressure-sensitive adhesive layer
50: Conductive laminate
60: substrate layer
70: undercoat layer
80: conductive layer
100: pressure-sensitive adhesive layer

Claims (20)

Applying and drying a first pressure-sensitive adhesive layer on one side of the substrate layer, and then aging at 50 to 200 DEG C for 1 to 48 hours; And
Applying a second pressure-sensitive adhesive layer on the other surface of the base layer coated with the first pressure-sensitive adhesive layer after completion of the step, and then drying the second pressure-sensitive adhesive layer. The method for producing a double-sided conductive laminate according to claim 1, wherein the first pressure-sensitive adhesive layer or the second pressure-sensitive adhesive layer is dried at 50 ° C to 200 ° C for 0.1 minute to 10 minutes. delete Applying and drying a first pressure-sensitive adhesive layer on one side of the substrate layer; And
Applying and drying a second pressure sensitive adhesive layer on the other surface of the base layer coated with the first pressure sensitive adhesive layer,
Wherein the difference in drying temperature between the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer is 30 占 폚 or higher. 5. The method for producing a double-sided conductive laminate according to claim 4, wherein the first pressure-sensitive adhesive layer is dried at 50 DEG C to 250 DEG C for 0.1 minute to 10 minutes. The method for producing a double-sided conductive laminate according to claim 4, wherein the second pressure-sensitive adhesive layer is dried at 30 ° C to 150 ° C for 0.1 minute to 10 minutes. 5. The method of producing a double-side conductive laminate according to claim 4, further comprising the step of forming a hard coating layer between the substrate layer and the first pressure sensitive adhesive layer or between the substrate layer and the second pressure sensitive adhesive layer. The method according to claim 7, further comprising the step of forming a protective film layer on the other surface of the first pressure-sensitive adhesive layer or the second pressure-sensitive adhesive layer on which the hard coating layer is formed. The method for producing a double-sided conductive laminate according to claim 8, further comprising the step of removing the protective film layer and then forming a conductive laminate. 10. The electro-optical device according to claim 9, wherein the electroconductive laminate comprises a base layer; An undercoat layer formed on at least one surface of the substrate layer; And an electrically conductive layer formed on the undercoat layer. A double-sided conductive laminate produced by the method for producing a double-side conductive laminate according to any one of claims 1 to 4. 12. The double-sided conductive laminate according to claim 11, further comprising: a base layer; A first pressure-sensitive adhesive layer formed on one surface of the base layer and being a crosslinked layer of a pressure-sensitive adhesive composition comprising a pressure-sensitive adhesive polymer; A second pressure-sensitive adhesive layer formed on the other surface of the substrate layer on which the first pressure-sensitive adhesive layer is formed, the pressure-sensitive adhesive layer being a crosslinked layer of a pressure-sensitive adhesive composition comprising a pressure-sensitive adhesive polymer; A hard coat layer formed between the substrate layer and the first pressure sensitive adhesive layer or between the base layer and the second pressure sensitive adhesive layer; and a conductive laminate formed on the first pressure sensitive adhesive layer or the second pressure sensitive adhesive layer. The pressure-sensitive adhesive polymer according to claim 12, wherein the pressure-sensitive adhesive polymer forming the first pressure-sensitive adhesive layer or the second pressure-sensitive adhesive layer comprises 80 to 99 parts by weight of polymerized units of alkyl (meth) acrylate and 1 to 30 parts by weight of polymerized units 1 By weight to 20 parts by weight. 14. The double-sided conductive laminate according to claim 13, wherein the crosslinkable functional group is a hydroxy group. The double-sided conductive laminate according to claim 12, wherein the pressure-sensitive adhesive polymer forming the first pressure-sensitive adhesive layer or the second pressure-sensitive adhesive layer has a weight average molecular weight of 300,000 to 2,000,000 g / mol. The double-sided conductive laminate according to claim 12, wherein the pressure-sensitive adhesive composition for forming the first pressure-sensitive adhesive layer or the second pressure-sensitive adhesive layer comprises 0.01 to 5 parts by weight of a crosslinking agent relative to 100 parts by weight of the pressure-sensitive adhesive polymer. 13. The method of claim 12, wherein the conductive laminate comprises a base layer; An undercoat layer formed on at least one surface of the substrate layer; And an electrically conductive layer formed on the undercoat layer. 12. The double-sided conductive laminate according to claim 11, wherein the double-sided conductive laminate satisfies the following formula:
[Equation 1]

In the above formula (1), X is the haze value measured before the heat treatment after the production of the double-sided conductive laminate, and Y indicates the haze value measured after the heat treatment of the double-sided conductive laminate. A touch panel comprising the double-sided conductive laminate of claim 11. A display device comprising the touch panel of claim 19.

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