KR101643046B1 - Conductive laminate - Google Patents

Abstract

The present application relates to a conductive laminate. The conductive laminate of the present application effectively inhibits penetration of oxygen, water or other foreign matter at the interface between the base layer and the pressure-sensitive adhesive layer or at the interface between the conductive layer and the pressure-sensitive adhesive layer, and bubbles or the like are generated at the pressure- It is possible to prevent the phenomenon that the physical properties are lowered. In addition, when the pressure-sensitive adhesive layer adheres to the conductive layer, even when exposed to severe conditions such as high temperature, high temperature, and high humidity conditions, the resistance of the conductive layer is effectively suppressed and the touch panel can be stably driven for a long period of time .

Description

Conductive laminate {CONDUCTIVE LAMINATE}

The present application relates to a conductive laminate, a pressure-sensitive adhesive composition for a conductive laminate, a touch panel, and a display device.

BACKGROUND ART [0002] A touch panel or a touch screen is variously applied to various information processing terminals such as a mobile communication terminal or an ATM, or a display device such as a TV and a monitor. In addition, as the application to small portable electronic devices increases, the demand for a smaller and lighter touch panel or screen is increasing.

A conductive laminate is used in the construction of the touch panel or the screen. Such a conductive laminate should maintain its property even under severe conditions such as high temperature or high temperature and high humidity, be excellent in peeling force, and be capable of suppressing lifting and peeling. In addition, it is required to effectively suppress the generation of bubbles, which is a problem more frequently than when a plastic film is used as the base material of the conductive laminate.

In addition, when the component constituting the adhesive layer of the conductive laminate is directly adhered to the conductive thin film such as a thin film of indium tin oxide (ITO) according to the structure of the touch panel or the touch screen, Is required for the pressure-sensitive adhesive to suppress the change in the resistance of the conductive thin film so that the driving of the conductive thin film can be performed stably.

Patent Documents 1 and 2 disclose a pressure-sensitive adhesive to which conductivity is imparted in view of the above problems.

Patent Document 1: Korean Patent Publication No. 2011-007814 Patent Document 2: Korean Patent Publication No. 2012-010917

The present application provides a conductive laminate, a pressure-sensitive adhesive composition for a conductive laminate, a touch panel, and a display device.

The present application relates to a conductive laminate.

Exemplary conductive laminates include a substrate layer; A conductive layer formed on an upper surface of the substrate layer; And a pressure-sensitive adhesive layer formed on the lower surface of the substrate.

The basic structure of the conductive laminate is shown in Fig.

The structure shown in FIG. 1 has a structure in which a conductive layer 12 and a pressure-sensitive adhesive layer 11 are attached to one surface of the conductive layer 12, and the conductive layer may be composed of a plastic film.

In one example, as shown in Fig. 2, the conductive laminated body is formed such that the plastic substrate film 24 on which the conductive layer 22 is formed on one side and the substrate 23 are attached by the adhesive layer 21 Lt; / RTI > structure.

3, the conductive laminate has a structure in which the plastic substrate film 36 on which the conductive layer 33 is formed and the substrate 35 are attached by the pressure-sensitive adhesive layer 31 Layer structure having a structure in which the plastic base film 37 and the plastic base film 36 on which the other conductive layer 34 is formed are adhered by the adhesive layer 32. [

The kind of the material constituting the conductive layer included in the conductive laminate is not particularly limited. In the present application, the conductive layer can be used without limitation as long as it has transparency. Specific examples thereof include a polyester film, an acrylic resin film, a polycarbonate film, a polyamide film, a polyvinyl chloride film, a polystyrene film, A polyolefin film such as propylene, and the like can be used, and a polyester film or a polycarbonate film such as polyethylene terephthalate can be preferably used.

In the present application, the thickness of the conductive layer is not particularly limited and may be suitably set in accordance with the portion to which the conductive film is applied. For example, the conductive layer may have a thickness of about 3 탆 to 300 탆, preferably about 5 탆 to 250 탆, more preferably about 10 탆 to 200 탆.

As the base layer, for example, an optically transparent plastic film can be used. Examples of the plastic film include a polyester film such as a poly (ethylene terephthalate) film, a polyamide film, a polyvinyl chloride film, a polystyrene film, or a polyolefin film such as polyethylene or polypropylene have. The plastic film may be an unoriented or uniaxially or biaxially stretched film. The surface of the substrate layer may be subjected to treatment such as corona discharge treatment, ultraviolet ray irradiation treatment, plasma treatment, or sputter etching on the surface from the viewpoint of improvement of adhesion with the conductive layer. Such a base layer may have a thickness of, for example, about 3 탆 to 95 탆, 5 탆 to 90 탆, or 10 탆 to 80 탆.

In the conductive laminate of the present application, an undercoat layer may further be present between the base layer and the conductive layer. The undercoat layer improves the adhesion between the conductive layer and the base layer, for example, and can be advantageously used for improving scratch resistance, bending resistance and rutting characteristics.

The undercoat layer may include an inorganic material, an organic material, or an organic composite material. As the inorganic material, for example, SiO ₂ , MgF ₂ or Al ₂ O ₃ can be exemplified. As the organic material, an acrylic polymer, a urethane polymer, a melamine polymer, an alkyd polymer or a siloxane polymer can be exemplified As the organic-inorganic composite material, a composite of at least one kind of inorganic material and at least one kind of organic material can be exemplified. In one example, the undercoat layer can be formed using a thermosetting resin comprising a mixture of a melamine resin, an alkyd polymer and an organosilane condensate as a sol-gel reaction product of an organic silane-containing mixture or an organic material.

The undercoat layer may be formed by, for example, vacuum vapor deposition, sputtering, ion plating, coating or the like. The undercoat layer may be formed to a thickness of usually 100 nm or less, 15 nm to 100 nm, or 20 nm to 60 nm.

The conductive laminate of the present application may further include a hard coat layer present between a pressure-sensitive adhesive layer and a base layer described later.

The hard coat layer can be formed of a common material, and can be formed by, for example, a hard coat treatment method of applying and hardening a hard resin such as an acrylic urethane resin or a siloxane resin. In the hard coat treatment, a silicone resin or the like is mixed with a hard resin such as the acryl urethane-based resin or siloxane-based resin to roughen the surface of the hard resin, and when it is applied to a touch panel or the like, Plane can be formed at the same time. Such a hard coat layer can be formed to a thickness of about 0.1 탆 to about 30 탆 in consideration of hardness characteristics, anti-cracking properties, curl prevention properties, and the like.

The conductive laminate of the present application may include a pressure-sensitive adhesive layer formed on the lower surface of the base layer.

The pressure-sensitive adhesive layer may be a crosslinked layer of a pressure-sensitive adhesive composition comprising an acrylic pressure-sensitive adhesive polymer.

The acrylic pressure-sensitive adhesive polymer may include a (meth) acrylic acid ester monomer and a radically polymerizable monomer having a crosslinkable functional group.

The kind of the (meth) acrylic acid ester monomer is not particularly limited and, for example, alkyl (meth) acrylate can be used. In consideration of physical properties such as cohesion, glass transition temperature and tackiness, (Meth) acrylate having an alkyl group having 1 to 20 carbon atoms can be used. Examples of such alkyl (meth) acrylates include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, butyl (Meth) acrylate, n-octyl (meth) acrylate, isooctyl (meth) acrylate, isononyl (meth) acrylate, Acrylate, lauryl (meth) acrylate, and tetradecyl (meth) acrylate. One or more of these may be contained in a polymerized form in the resin.

The radically polymerizable monomer having a crosslinkable functional group can provide a crosslinkable functional group capable of reacting with a polyfunctional crosslinking agent to be described later contained in the acrylic pressure-sensitive adhesive polymer. Examples of such a crosslinkable functional group include a hydroxyl group, a carboxyl group, a nitrogen-containing group, an epoxy group or an isocyanate group, preferably a hydroxyl group, a carboxyl group or a nitrogen-containing group, and most preferably a hydroxyl group .

In the production of acrylic polymers, various copolymerizable monomers capable of providing the above-mentioned crosslinkable functional groups to the acrylic pressure-sensitive polymer are known. In the present application, such monomers can be used without limitation. Examples of the copolymerizable monomer having a hydroxyl group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) (Meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyleneglycol (meth) acrylate and the like can be used.

The crosslinkable functional group may be one or more than two, and preferably two or more.

In one example, the acrylic pressure-sensitive adhesive polymer comprises 70 to 99.9 parts by weight of an alkyl (meth) acrylate having an alkyl group having 1 to 14 carbon atoms or 85 to 95 parts by weight and 0.5 to 15 parts by weight of a radically polymerizable monomer having a hydroxy group, And 5 to 15 parts by weight of units.

In one example, the acrylic adhesive polymer comprises a hydroxy group and may not contain an acid functional group.

In the present specification, the term " may not contain an acid functional group " may mean that it does not include a reactive functional group having a property not showing an acidity in a certain compound.

In one example, the pressure-sensitive adhesive composition may include a polyfunctional isocyanate crosslinking agent capable of reacting with the hydroxy group to form a crosslinked structure.

Examples of the isocyanate crosslinking agent include 2,2-dimethylpentane diisocyanate, hexamethylene diisocyanate, 2,2,4-trimethylhexane diisocyanate, butene diisocyanate, 1,3-butadiene- Isocyanate, isocyanate, 2,4,4-trimethylhexamethylene diisocyanate, 1,6,11-undecatriisocyanate, 1,3,6-hexamethylene triisocyanate, 1,8-diisocyanate-4-isocyanatomethyloctane , Aliphatic isocyanate compounds such as bis (isocyanatoethyl) carbonate and bis (isocyanatoethyl) ether; (Isocyanatomethyl) cyclohexane, 1,3-bis (isocyanatomethyl) cyclohexane, 1,4-bis (isocyanatomethyl) cyclohexane, isophorone diisocyanate, Alicyclic isocyanate compounds such as dicyclohexylmethane diisocyanate, cyclohexane diisocyanate, methylcyclohexane diisocyanate, dicyclohexyldimethylmethane isocyanate, and 2,2-dimethyldicyclohexylmethane isocyanate; (Isocyanatoethyl) benzene, bis (isocyanatopropyl) benzene, bis (isocyanatobutyl) benzene, bis (isocyanatomethyl) naphthalene, bis (isocyanatoethyl) Isocyanatomethyl) diphenyl ether, phenylenediisocyanate, ethylphenylenediisocyanate, isopropylphenylenediisocyanate, dimethylphenylenediisocyanate, diethylphenylenediisocyanate, diisopropylphenylenediisocyanate, trimethylbenzene triisocyanate, benzene tri Isocyanate, biphenyl diisocyanate, toluidine diisocyanate, 4,4-diphenylmethane diisocyanate, 3,3-dimethyldiphenylmethane-4,4-diisocyanate, bibenzyl-4,4-diisocyanate, bis Cyanatophenyl) ethylene, 3,3-dimethoxybiphenyl-4,4-diisocyanate, hexahydrobenzene diisocyanate, hexa Aromatic isocyanate compounds such as hydroiodiphenylmethane-4,4-diisocyanate; Bis (isocyanatoethyl) sulfide, bis (isocyanatoethyl) sulfide, bis (isocyanatopropyl) sulfide, bis (isocyanatohexyl) sulfide, bis Bis (isocyanatoethylthio) methane, bis (isocyanatoethylthio) methane, bis (isocyanatoethylthio) ethane, bis (isocyanatoethylthio) Aliphatic isocyanate compounds such as isocyanatomethylthio) ethane and 1,5-diisocyanato-2-isocyanatomethyl-3-thiapentane; Diphenylsulfide-2,4-diisocyanate, diphenylsulfide-4,4-diisocyanate, 3,3-dimethoxy-4,4-diisocyanatodibenzylthioether, bis (4- Diisocyanate, diphenyldisulfide-4,4-diisocyanate, 2,2-dimethyl diphenyldisulfide-5,5 Diisocyanate, 3,3-dimethyldiphenyldisulfide-5,5-diisocyanate, 3,3-dimethyldiphenyldisulfide-6,6-diisocyanate, 4,4- A sulfided aromatic isocyanate compound such as 5-diisocyanate, 3,3-dimethoxy diphenyl disulfide-4,4-diisocyanate and 4,4-dimethoxydiphenyl disulfide-3,3-diisocyanate; 2,5-bis (isocyanatomethyl) thiophene, 2,5-diisocyanatotetrahydrothiophene, 2,5-bis (isocyanatomethyl) (Isocyanatomethyl) tetrahydrothiophene, 2,5-diisocyanato-1,4-dithiane, 2,5-bis (isocyanatomethyl) Dithiane, 4,5-diisocyanato-1,3-dithiolane, 4,5-bis (isocyanatomethyl) -1,3-dithiolane, 4,5-bis Isocyanatomethyl) -2-methyl-1,3-dithiolane, and the like can be used. In addition, at least one compound having at least one isocyanate group and / or an isothiocyanate group may be used alone or two or more of them may be used. Further, halogen substituents such as chlorine substituents and bromine substituents of the isocyanate compounds, alkyl substituents, alkoxy substituents, A prepolymer-type modified product of a substituent, a polyhydric alcohol or a thiol, a carbodiimide-modified product, a urea-modified product, a buret-modified product, a dimerization product or a trimarized product may be used.

In one example, the pressure-sensitive adhesive composition may include 0.1 to 10 parts by weight, 0.5 to 7.5 parts by weight or 1 to 5 parts by weight of the above-mentioned polyfunctional isocyanate crosslinking agent relative to 100 parts by weight of the acrylic pressure-sensitive adhesive polymer have. The content of the polyfunctional isocyanate crosslinking agent is controlled to be within the above-mentioned range to effectively control physical properties such as durability, peel strength and resistance change rate of the pressure-sensitive adhesive layer formed from the pressure-sensitive adhesive composition.

The pressure-sensitive adhesive composition of the present application may contain a polyfunctional compound having two or more functional groups capable of reacting with an isocyanate compound at the same time as the isocyanate compound.

The polyfunctional compound having two or more functional groups capable of reacting with the acid functional group is not particularly limited, and examples thereof include polyfunctional compounds such as polyvalent metal compounds, aziridine compounds, oxazoline resins, carbodiimide compounds, polyfunctional epoxy compounds and melamine resins Lt; / RTI >

The polyvalent metal compound includes a polyvalent metal ion compound, and the polyvalent metal ion compound is not particularly limited as long as it is capable of reacting with the acrylic pressure-sensitive polymer to crosslink, and may include a Lewis acid crosslinking agent. Examples of the Lewis acid crosslinking agent include aluminum trichloride, titanium trichloride, titanium tetrachloride, ferroschloride, perchloride, zinc chloride, zinc bromide, stannum chloride, stancloride, stannum bromide, Metal halide; Trialkylaluminum halide, monoalkylaluminum halide, tetraalkyltin, aluminum acetylacetonate, iron acetylacetonate, zirconium acetylacetonate, dibutyltin oxide, dibutyl tin acetylacetonate, di But are not limited to, butyltin dilaurate, dioctyltin ester maleate, magnesium naphthenate, calcium naphthenate, manganese naphthenate, iron naphthenate, cobalt naphthenate, zinc naphthenate, zinc naphthenate, zirconium naphthenate Zirconium octanoate, lead octanonate, lead octanonate, zinc octanoate, zinc octanoate, zinc octanoate, zirconium octanonate, lead octanonate, lead octanonate, zinc laurate , Magnesium stearate, aluminum stearate, calcium stearate, cobalt stearate Zinc stearate, lead stearate and the like can be used. These can be used alone or in combination of two or more, and more preferably, aluminum acetoacetonate can be used. Also, the polyvalent metals may be chelated and used.

Examples of the aziridine compound include N, N'-toluene-2,4-bis (1-aziridinecarboxamide), N, N'-diphenylmethane-4,4'-bis Compounds such as triethylenemalamine, bisisoproparyl-1- (2-methyl aziridine) or tri-1-aziridinylphosphine oxide or CL-422 or CL of MENADIONA -427, and the like can be used.

Examples of the oxazoline compound include 2,2-bis- (2-oxazoline), N, N'-hexamethylene-bis- (2-carbamoyl- -Methylene-bis- (2-oxazoline), 2,2'-ethylene-bis- (2-oxazoline), 2,2'- (2-oxazoline), 2,2-P-phenylene-bis- (2-oxazoline) or Epocros RPS-1005 manufactured by Japan Catalyst .

Examples of the carbodiimide compound include 1,3-dicyclohexylcarbodiimide, HMV-8CA sold by Nisshinbo, HMV-10B, bis- (2,6-diiso Phenyl-2,4-carbodiimide) and poly- (1,3,5-triisopropyl-phenyl-2,4-carbodiimide).

Examples of the polyfunctional epoxy compound include ethylene glycol diglycidyl ether, triglycidyl ether, trimethylolpropane triglycidyl ether, N, N, N ', N'-tetraglycidylethylenediamine Or glycerin diglycidyl ether may be used.

As the melamine resin, for example, a melamine resin containing an amino group or a butoxy group and a melamine resin containing a methoxy group may be used. Specific examples thereof include CYMEL 325, CYMEL327 of CYTEC; BE 3748, BE 3040 from BIP; RESIMENE 717 from MONSANTO; CYMEL 303 manufactured by UNITED CARBIDE, and CYMEL 1130 manufactured by AMERICAN CYANAMID.

In one example, the pressure-sensitive adhesive composition comprises 0.1 to 5 parts by weight, 0.25 to 4 parts by weight or more of a polyfunctional compound having two or more functional groups capable of reacting with the acid functional group, relative to 100 parts by weight of the acrylic pressure- 0.5 to 3 parts by weight. The content of the polyfunctional compound having two or more functional groups capable of reacting with the acid functional group is controlled to be within the above range to effectively control physical properties such as durability, peel strength and resistance change rate of the pressure sensitive adhesive layer formed from the pressure sensitive adhesive composition .

The conductive laminate of the present application may further include an initiator.

The initiator is not particularly limited, but may be, for example, a photoinitiator.

Examples of the photoinitiator include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin n-butyl ether, benzoin isobutyl ether, acetophenone, dimethyl anino acetophenone, 2 , 2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 2-hydroxy- Propane-1-one, 4- (2-hydroxyethoxy) phenyl-2- (hydroxy-2- propyl) Ketone, benzophenone, p-phenylbenzophenone, 4,4'-diethylaminobenzophenone, dichlorobenzophenone, 2-methyl anthraquinone, 2-ethyl anthraquinone, 2- Quinone, 2-methylthioxanthone, 2-ethylthioxanthone, 2-chlorothioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, benzyldimethylketal, acetophenone dimethylketal, p - dimethylamino benzoic acid Ester, oligo [2-hydroxy-2-methyl-1- [4- (1-methylvinyl) phenyl] propanone], 2,4,6- 2-benzoyl-2- (dimethylamino) -1- [4- (4-morpholinyl) phenyl] -1 -Butanone or 2,2-dimethoxy-2-phenylacetophenone. In the present invention, one or more of the above can be used.

In the conductive laminate, the photoinitiator may be contained in an amount of 0.01 part by weight to 1 part by weight, 0.01 part by weight to 0.5 part by weight, or 0.01 part by weight to 0.1 part by weight based on 100 parts by weight of the acrylic polymer. The content of the photoinitiator can be controlled within the above-mentioned range, so that the crosslinking and curing reaction can be smoothly performed.

In one example, the pressure-sensitive adhesive layer which is a crosslinked layer of the pressure-sensitive adhesive composition may satisfy the following expression (1).

[Equation 1]

{100 x (R - Ri) / Ri} = 10

In the formula (1), Ri is the resistance of the ITO film measured after the adhesion of the pressure sensitive adhesive layer of the conductive laminate to an ITO (Indium Tin Oxide) film, and R is the resistance of the ITO film with the pressure sensitive adhesive layer % ≪ / RTI > relative humidity for 240 hours.

The lower the numerical value of the resistance change rate is, the more stable the operation is to be applied to the touch panel, and the lower limit value is not limited.

On the other hand, in the pressure-sensitive adhesive layer of the present application, in addition to the above-mentioned components, a silane coupling agent; Tackifiers; Epoxy resin; Ultraviolet stabilizer; Antioxidants; Coloring agent; Reinforcing agents; Filler; Defoamer; A surfactant, a plasticizer, and the like may be further included.

In addition, in the present application, the acrylic adhesive polymer as described above can be used in a conventional polymerization system of this field, for example, solution polymerization, photo polymerization, bulk polymerization, suspension polymerization, Or emulsion polymerization, and may be produced by a solution polymerization method.

The present application also relates to a pressure-sensitive adhesive composition for a conductive laminate which can be used for forming the pressure-sensitive adhesive layer of the above-described conductive laminate.

Exemplary pressure-sensitive adhesive compositions for the conductive laminate include an acrylic adhesive polymer containing a hydroxyl group and not containing an acid functional group, a polyfunctional isocyanate crosslinking agent capable of reacting with the hydroxyl group to form a crosslinked structure; And a polyfunctional compound having two or more functional groups capable of reacting with an acid functional group.

Specific examples of the acrylic pressure-sensitive adhesive polymer, the polyfunctional isocyanate crosslinking agent, and the kind and content of the polyfunctional compound having at least two functional groups capable of reacting with the acid functional group are as described above.

The present application also relates to a touch panel including the conductive laminate or a display device including the touch panel. An exemplary touch panel may include the conductive laminate as an electrode plate.

The touch panel in the present application can be formed in a known structure including an electrostatic capacity type or a resistive type as long as the conductive laminated body or the electrode plate is included, and the structure of a display device to which such a touch panel is applied is also known The method can be applied as it is.

The conductive laminate of the present application effectively suppresses the formation of bubbles and provides a pressure-sensitive adhesive excellent in peeling force under severe conditions. When the pressure-sensitive adhesive layer adheres to the conductive layer, the resistance of the conductive layer is effectively suppressed, It can be stably driven even when used for a long period of time.

1 to 3 are views showing the structure of a conductive laminate according to one example of the present application.
4 is an explanatory view for explaining a method of measuring the resistance change rate in the present application.

Hereinafter, the present application will be described in more detail by way of examples according to the present application and comparative examples not complying with the present application, but the scope of the present application is not limited by the following embodiments.

The physical properties in the following examples and comparative examples were evaluated in the following manner.

1. Durability test

A hard coated surface of a polyethylene terephthalate film (thickness: 100 占 퐉) having a hard coating on both sides and a polycarbonate sheet (thickness: 1 mm) were adhered via a pressure sensitive adhesive layer and a size of 50 mm 占 100 mm After cutting, the sample was autoclaved at 60 DEG C and 5 atm for 30 minutes. Thereafter, the sample was allowed to stand at 80 DEG C for 240 hours, and then its durability was evaluated.

The durability was evaluated by observing the occurrence of bubbles, lifting and peeling after being left in each of the above-mentioned conditions. Specific measurement methods and criteria of each physical property are as follows.

≪ Evaluation of bubble generation &

?: When bubbles were not generated at the adhesive interface during observation with an optical microscope or bubbles having a diameter of 100 占 퐉 or less were dispersed in a small amount and observed

占 Bubbles having a diameter of 100 占 퐉 or more were observed at the adhesive interface at the time of observation under an optical microscope, or bubbles having a diameter of 100 占 퐉 or less were observed in a large aggregated state

≪ Extraction & peeling evaluation >

○: When there is no lifting and peeling at the adhesive interface

X: When peeling or peeling occurred at the adhesive interface

2. Resistance change rate test

The resistance change rate of the conductive laminate produced in the examples was measured in the manner as shown in Fig. A polyethylene terephthalate film 10 (hereinafter, referred to as conductive PET) (Oike's ITO film, trade name: KA500PS1-175-UH / P, Crystalline ITO) having an ITO thin film 20 formed on one surface thereof was cut into a size of 30 mm x 50 mm Length). 4, silver paste 30 was applied to both ends of the film so as to have a width of 10 mm and baked at 150 DEG C for 30 minutes. Subsequently, the conductive laminate having the release film 51 formed on both sides of the sintered film prepared in Examples and the like was cut into a size of 30 mm x 40 mm (width x length), and then the release film on one side was removed And the center of the pressure-sensitive adhesive layer 40 was attached to the center of the conductive PET (10, 20). Thereafter, the initial resistance Ri was measured using a conventional resistance meter 60. After the initial resistance measurement, the specimen having the structure of FIG. 4 was left for 240 hours at 85 ° C. and 85% relative humidity, and the resistance R was measured by the measuring device 60 in the same manner. , And the rate of change in resistance was measured.

[Equation 1]

{100 x (R - Ri) / Ri}

3. Peel force  Test

The peeling force was measured by preparing the prepared conductive laminate one inch wide, then using the polycarbonate laminate as an adherend, and reciprocating twice with a 2 kg roller. After a lapse of 30 minutes from the attachment, the peel force (peel rate: 300 mm / min) was measured at a peel angle of 180 ° at room temperature using a tensile tester (Texture Analyzer). The measurement is carried out three times or more per sample, and the average value thereof is shown in Table 2 below.

Manufacturing example  1. Preparation of acrylic polymer solution

50 parts by weight of ethylhexyl acrylate (EHA), 40 parts by weight of methyl acrylate (MA), and 40 parts by weight of hydroxyethyl acrylate (HEA) were added to a 1 L reactor equipped with a cooling device to reflux nitrogen gas, 10 parts by weight. Subsequently, 150 parts by weight of ethyl acetate (EAc) was poured into the reactor, nitrogen gas was purged for 60 minutes to remove oxygen, and azobisisobutyronitrile as a reaction initiator AIBN) was added thereto to initiate the reaction. The reaction product was reacted for about 1 hour and diluted with ethyl acetate (EAc) to prepare an acrylic polymer solution.

Example  One

[Preparation of pressure-sensitive adhesive composition]

2.5 parts by weight of a polyfunctional isocyanate crosslinking agent (BXX-5627, xylylene diisocyanate) and 1 part by weight of an aluminum-chelate compound (K-KAT 5218, KING INDUSTRY) were added to 100 parts by weight of the solid content of the acrylic polymer solution obtained in Preparation Example 1 Were uniformly mixed to prepare a pressure-sensitive adhesive composition.

[Conductivity Of the laminate  Produce]

The pressure-sensitive adhesive composition prepared above was coated on a surface of a PET (poly (ethylene terephthalate)) film on which a known ITO (Indium Tin Oxide) film was formed, on which the ITO film was not formed, to a thickness of about 20 μm after drying , Aged at an appropriate temperature to induce a crosslinking reaction to form a pressure-sensitive adhesive layer to prepare a conductive laminate.

Example  2

2.5 parts by weight of a polyfunctional isocyanate crosslinking agent (BXX-5627, xylylene diisocyanate) as a polyfunctional crosslinking agent and 1 part by weight of aluminum acetylacetonate as a polyvalent metal compound were uniformly added to 100 parts by weight of a solid content of the acrylic polymer solution obtained in Preparation Example 1 The conductive laminate was prepared in the same manner as in Example 1, except that the pressure-sensitive adhesive composition prepared by mixing was used.

Example  3

2.5 parts by weight of a polyfunctional isocyanate crosslinking agent (BXX-5627, xylylene diisocyanate) as a polyfunctional crosslinking agent and 1 part by weight of an oxazoline resin (RPS1005, Japan Catalyst Co., Ltd.) were uniformly dispersed in 100 parts by weight of the solid content of the acrylic polymer solution obtained in Production Example 1 The conductive layered product was prepared in the same manner as in Example 1, except that the pressure-sensitive adhesive composition was used.

Example  4

2.5 parts by weight of a polyfunctional isocyanate crosslinking agent (BXX-5627, xylylene diisocyanate) and 1 part by weight of an aziridine compound (CL427, manufactured by MENADIONA) were uniformly mixed with 100 parts by weight of a solid content of the acrylic polymer solution obtained in Production Example 1 The conductive laminate was prepared in the same manner as in Example 1, except that the pressure-sensitive adhesive composition was used.

Comparative Example  One

Except that only 2.5 parts by weight of a polyfunctional isocyanate crosslinking agent (BXX-5627, xylylene diisocyanate) was added to 100 parts by weight of the solid content of the acrylic polymer solution obtained in Preparation Example 1, .

The compositions of the above Examples and Comparative Examples are shown in Table 1 below.

division Example Comparative Example One 2 3 4 One Acrylic polymer
(Parts by weight) EHA 50 50 50 50 50 MA 40 40 40 40 40 HEA 10 10 10 10 10 Initiator (parts by weight) AIBN 0.04 0.04 0.04 0.04 0.04 Polyfunctional crosslinking agent BXX-5627 2.5 2.5 2.5 2.5 2.5 K-KAT5218 One - - - - AA - One - - - RPS-1005 - - One - - CL-427 - - - One - EHA: Ethylhexyl acrylate
MA: methyl acrylate
HEA: hydroxyethyl acrylate
AIBN: azobisisobutyronitrile
BXX-5627: Xylarylene diisocyanate
K-KAT5218: Aluminum chelate catalyst
AA: Aluminum acetylacetonate
RPS-1005: oxazoline compound
CL-427: aziridine compound

The durability test and the resistance change rate test results measured for each of the above Examples and Comparative Examples are shown in Table 2 below.

division Example Comparative Example One 2 3 4 One Bubble generation inhibiting property ○ ○ ○ ○ ○ Lift / peel evaluation ○ ○ ○ ○ ○ Rate of change in resistance (%) 9 9 9 8 11

As can be seen from the above Table 2, the pressure sensitive adhesive layer of the present application satisfies all the various physical properties required in the touch panel, and in particular, has a resistance change rate of 10% or less with respect to the conductive layer having the pressure sensitive adhesive layer An excellent pressure-sensitive adhesive and a conductive laminate using the same can be produced.

1, 2, 3: basic structure of touch panel
11, 21, 31, 32: pressure-sensitive adhesive layer
23, 35: substrate
22, 33, 34: conductive layer
12, 24, 36, 37: base layer or base film
10: PET film
20: ITO thin film
30: silver paste
40: pressure-sensitive adhesive layer
51: release film
60: Resistance Meter

Claims (14)

A base layer;
A conductive layer formed on an upper surface of the substrate layer; And
An acrylic adhesive polymer formed on the lower surface of the substrate and containing a hydroxyl group and not containing an acid functional group, a polyfunctional isocyanate crosslinking agent capable of reacting with the hydroxyl group to form a crosslinked structure; And a polyfunctional compound having at least two functional groups capable of reacting with an acid functional group, wherein the polyfunctional compound having at least two functional groups capable of reacting with the acid functional group is selected from the group consisting of a polyvalent metal compound, an aziridine compound, an oxazoline compound, And a pressure-sensitive adhesive layer which is a crosslinked layer of a pressure-sensitive adhesive composition which is at least one selected from the group consisting of an acrylic pressure-sensitive adhesive, a pressure-sensitive adhesive, a pressure-sensitive adhesive, The pressure-sensitive adhesive sheet according to claim 1, wherein the pressure-sensitive adhesive layer comprises a conductive laminate satisfying the following formula (1)
[Equation 1]
{100 x (R - Ri) / Ri} = 10
In the formula (1), Ri is the resistance of the ITO film measured after the adhesion of the pressure sensitive adhesive layer of the conductive laminate to an ITO (Indium Tin Oxide) film, and R is the resistance of the ITO film with the pressure sensitive adhesive layer % ≪ / RTI > relative humidity for 240 hours. The acrylic pressure-sensitive adhesive composition according to claim 1, wherein the acrylic pressure-sensitive adhesive polymer is a pressure-sensitive adhesive layer comprising 70 to 99.9 parts by weight of an alkyl (meth) acrylate having an alkyl group having 1 to 14 carbon atoms and 0.5 to 15 parts by weight of a radically polymerizable monomer having a hydroxy group sieve. The acrylic pressure-sensitive adhesive composition according to claim 1, wherein the acrylic pressure-sensitive adhesive polymer is an acrylic pressure-sensitive adhesive composition comprising 85 to 95 parts by weight of an alkyl (meth) acrylate having an alkyl group having 1 to 14 carbon atoms and 5 to 15 parts by weight of a radically polymerizable monomer having a hydroxy group sieve. The method of claim 1, wherein the polyfunctional isocyanate crosslinking agent is selected from the group consisting of tolylene diisocyanate, xylene diisocyanate, diphenylmethane diisocyanate, hexamethylene diisocyanate, isoboron diisocyanate, tetramethyl xylylene diisocyanate, naphthalene diisocyanate or toluene diisocyanate Or an isocyanate compound of at least one of toluylene diisocyanate, xylene diisocyanate, diphenylmethane diisocyanate, hexamethylene diisocyanate, isoboron diisocyanate, tetramethyl xylene diisocyanate, naphthalene diisocyanate, and toluene diisocyanate, An electrically conductive laminate as an additional reactant. The conductive laminate according to Claim 1, wherein the pressure-sensitive adhesive composition comprises a polyfunctional isocyanate crosslinking agent in an amount of 0.1 to 10 parts by weight based on 100 parts by weight of the acrylic pressure-sensitive adhesive polymer. delete The aziridine compound according to claim 1, wherein the polyvalent metal compound is a metal chelate compound in which at least one metal selected from the group consisting of aluminum, iron, zinc, tin, titanium, antimony, magnesium, Bis (1-aziridine carboxamide), N, N'-diphenylmethane-4,4'-bis (1-aziridine carboxamide), triethylene melamine, bis (2-methyl aziridine) or tri-1-aziridinyl phosphine oxide, and the oxazoline compound is 2,2-bis- (2-oxazoline), N, N'- (2-oxazoline), 2,2'-methylene-bis- (2-oxazoline), 2,2'-ethylene- , 2'-propylene-bis- (2-oxazoline), 1,3-phenylene-bis- (2-oxazoline), 2,2- Epocros RPS-1005 from Japan Catalyst, the carbodiimide compound is 1,3-dicyclohexyl HMV-10B, bis- (2,6-diisopropyl-phenyline-2,4-carbodiimide) or poly- (1,3,5-tri N, N ', N'-tetramethyluronium hexafluorophosphate), and the polyfunctional epoxy compound is at least one compound selected from the group consisting of ethylene glycol diglycidyl ether, triglycidyl ether, trimethylolpropane triglycidyl ether, N'-tetraglycidylethylenediamine or glycerin diglycidyl ether, and the melamine resin is CYMEL 325, CYMEL 327, BE 3748, BE 3040, RESIMENE 717, CYMEL 303 or CYMEL 1130. The conductive laminate according to claim 1, wherein the pressure-sensitive adhesive composition comprises 0.1 to 5 parts by weight of a multifunctional compound having two or more functional groups capable of reacting with an acid functional group, based on 100 parts by weight of the acrylic pressure-sensitive adhesive polymer. The conductive laminate according to claim 1, wherein the pressure-sensitive adhesive composition further comprises an initiator. The conductive laminate according to claim 10, wherein the initiator is contained in an amount of 0.01 part by weight to 1 part by weight based on 100 parts by weight of the acrylic pressure-sensitive adhesive polymer. An acrylic adhesive polymer containing a hydroxyl group and containing no acid functional group,
A polyfunctional isocyanate crosslinking agent capable of reacting with the hydroxyl group to form a crosslinked structure; And
A polyfunctional compound having at least two functional groups capable of reacting with an acid functional group,
The polyfunctional compound having at least two functional groups capable of reacting with the acid functional group is at least one selected from the group consisting of a polyvalent metal compound, an aziridine compound, an oxazoline compound, a carbodiimide compound, a polyfunctional epoxy compound and a melamine resin. Sensitive adhesive composition. A touch panel comprising the conductive laminate of claim 1. 14. A display device comprising the touch panel of claim 13.

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