KR101764473B1 - Pressure sensitive adhesive composition - Google Patents

Abstract

The present application relates to a pressure-sensitive adhesive composition, a conductive laminate, a touch panel, and a display device. The pressure-sensitive adhesive composition of the present application has a molecular weight distribution below a specific range and can realize a pressure-sensitive adhesive layer showing a storage elastic modulus in a specific range or more at a low temperature and a high temperature after implementing a crosslinked structure, and the pressure- It is possible to prevent air bubbles generated from the heat treatment process for crystallizing the conductive functional layer during manufacturing and to solve the visibility problem caused by the air bubbles thereby to provide a touch panel or display Device can be provided.

Description

[0001] PRESSURE SENSITIVE ADHESIVE COMPOSITION [0002]

The present application relates to a pressure-sensitive adhesive composition, a conductive laminate, a touch panel, and a display device.

BACKGROUND ART [0002] A touch panel or a touch screen is variously applied to various information processing terminals such as a mobile communication terminal or an ATM, or a display device such as a TV and a monitor. In addition, as the application to small portable electronic devices increases, there is an increasing tendency for a smaller and lighter touch panel or screen.

A conductive film such as the one disclosed in, for example, Patent Document 1 or 2 is used for constituting the touch panel or the screen. Such a conductive film may be classified into a one-side conductive film or a both-side conductive film depending on the manner in which the conductive functional layer is provided.

When the conductive film is produced, the conductive layer is located at the outermost periphery, and bubbles may be generated in the heat treatment process. The generated bubbles have low visibility, which hinders the application of the display device or the like to fields requiring transparency and the like.

Patent Documents 1 and 2 have proposed a pressure-sensitive adhesive composition for use in a conductive film.

Patent Document 1: Korean Patent Publication No. 2013-0096147 Patent Document 2: Korean Patent Publication No. 2009-0113669

The present application provides a pressure-sensitive adhesive composition, a conductive laminate, a touch panel, and a display device.

The present application relates to a pressure-sensitive adhesive composition.

An exemplary tackifier composition may be a tackifier composition applied to a conductive laminate. More specifically, the pressure-sensitive adhesive composition may be a pressure-sensitive adhesive composition capable of forming a pressure-sensitive adhesive layer contained in a one-sided or double-sided conductive laminate.

In one example, the pressure sensitive adhesive composition may comprise a tacky polymer.

The tacky polymer may include polymerized units of alkyl (meth) acrylate and copolymerizable monomers containing a crosslinkable functional group. In the present specification, the term " polymerization unit of a predetermined monomer " means a form in which the above-mentioned predetermined monomer is used in a polymerization process for producing the adhesive polymer to form a skeleton such as a main chain or side chain of the adhesive polymer after polymerization can do.

The type of the alkyl (meth) acrylate is not particularly limited, and an alkyl (meth) acrylate having a carbon number of 1 to 20, a carbon number of 1 to 16, a carbon number of 1 to 12, or a carbon number of 4 to 12 is selected in consideration of physical properties such as cohesive strength and storage elastic modulus (Meth) acrylate. The alkyl group may be straight-chain, branched or cyclic, substituted by one or more substituents, or may be unsubstituted. Examples of such alkyl (meth) acrylates include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) (Meth) acrylate, isobutyl (meth) acrylate, t-butyl (meth) acrylate, pentyl (Meth) acrylate, lauryl (meth) acrylate, isobonyl (meth) acrylate, and tetradecyl (meth) acrylate. Of these, May be included in polymerized form.

The cross-linkable functional group-containing comonomer can provide a crosslinkable functional group capable of reacting with the multifunctional crosslinking agent described later. In the present specification, the term " crosslinkable functional group-containing comonomer " is meant to include monomers having both a crosslinkable functional group and a copolymerization site simultaneously. Examples of such a crosslinkable functional group include a hydroxyl group, a carboxyl group, an epoxy group or an isocyanate group, and preferably a hydroxy group. In the production of sticky polymers, various monomers capable of providing the above-mentioned crosslinkable functional groups to the sticky polymer are known, and in the present application, such monomers can be used without limitation. Examples of the monomer having a hydroxyl group include hydroxymethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (Meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyleneglycol (meth) acrylate, Can be used.

In one example, the tacky polymer may comprise from 70 parts by weight to 99 parts by weight of polymerized units of alkyl (meth) acrylate and from 1 to 30 parts by weight of polymerized units of monomer containing a crosslinkable functional group. In the present specification, the unit " part by weight " may mean the ratio of the weight between each component. In another example, the viscous polymer may comprise 80 to 95 parts by weight of polymerized units of alkyl (meth) acrylate and 5 to 20 parts by weight of monomeric units containing a crosslinkable functional group. The content of the monomeric polymerization units in the tacky polymer may be controlled within the range described above, so that the tackiness and the storage modulus of the tacky composition can be appropriately controlled at desired levels.

In addition to the above-mentioned monomers, the tacky polymer may include, for example, (meth) acrylonitrile, (meth) acrylamide, N-methyl (meth) acrylamide, N-butoxymethyl Nitrogen-containing monomers such as pyrrolidone or N-vinylcaprolactam; Styrene-based monomers such as styrene or methylstyrene; Glycidyl group-containing monomers such as glycidyl (meth) acrylate; Or other monomeric units such as carboxylic acid vinyl esters such as vinyl acetate. These comonomers may be included in the tacky polymer, if necessary, by selecting one or more suitable types. Such comonomers may be included in the adhesive polymer in a proportion of, for example, 20 parts by weight or less, or 0.1 parts by weight to 15 parts by weight, based on the weight of the other total monomers.

The tacky polymer as described above in the present application can be prepared through conventional polymerization methods in this field. For example, a monomer mixture prepared by blending necessary monomers according to the desired monomer composition may be subjected to solution polymerization, photo polymerization, bulk polymerization, suspension polymerization or emulsion polymerization Emulsion polymerization, and the like, preferably by a solution polymerization method. In addition, when necessary in the above-mentioned production process, suitable polymerization initiators, molecular weight regulators, chain transfer agents and the like may be used together.

In one example, the tacky polymer may have a weight average molecular weight (Mw) of, for example, greater than or equal to 1 million, greater than or equal to 1.05 million, or greater than or equal to 1.15 million. As used herein, the term " weight average molecular weight " may refer to a value converted to a standard polystyrene measured by GPC (Gel Permeation Chromatograph). Unless otherwise specified otherwise, the term " molecular weight " in this specification may mean the above-mentioned " weight average molecular weight ".

The higher the molecular weight of the adhesive polymer is, the higher the cohesive force and the adhesive force are, and the upper limit is not particularly limited, and may be, for example, 5,000,000, 4,000,000, 3,000,000 or 2,000,000. When a pressure-sensitive adhesive polymer having such a molecular weight within such a range is included, a pressure-sensitive adhesive composition can be provided which is appropriately secured at desired levels of physical properties such as adhesive property, cohesive force and storage elastic modulus to be described later.

In one example, the tacky polymer has a molecular weight distribution (PDI; Mw / Mn), that is, a ratio (Mw / Mn) of a weight average molecular weight (Mw) to a number average molecular weight (Mn) of 5.0 or less, 4.5 or less, May be 3.0 or less. In another example, the molecular weight distribution of the tacky polymer may be 1.0 to 3.0, 1.5 to 3.0, or 2.0 to 3.0. By including the pressure-sensitive adhesive polymer having the above-mentioned molecular weight distribution, a pressure-sensitive adhesive composition or a pressure-sensitive adhesive layer having better bubble-generation inhibiting ability can be provided.

The pressure-sensitive adhesive composition of the present application may comprise a multifunctional crosslinking agent.

The multifunctional crosslinking agent may be used without limitation as long as it has two or more functional groups, for example, two to six functional groups reacting with the crosslinkable functional group.

The multifunctional crosslinking agent contained in the pressure-sensitive adhesive composition may be at least one crosslinking agent selected from the group consisting of an isocyanate crosslinking agent, a polyvalent metal compound, an aziridine compound, an oxazoline resin, a carbodiimide compound, an epoxy compound and a melamine compound Can be used.

Examples of the isocyanate compound include, but are not limited to, 2,2-dimethylpentane diisocyanate, hexamethylene diisocyanate, 2,2,4-trimethylhexane diisocyanate, butene diisocyanate, 1,3- 1,4-diisocyanate, 2,4,4-trimethylhexamethylene diisocyanate, 1,6,11-undecatriisocyanate, 1,3,6-hexamethylene triisocyanate, 1,8-diisocyanate- Aliphatic isocyanate compounds such as cyanatomethyloctane, bis (isocyanatoethyl) carbonate and bis (isocyanatoethyl) ether; (Isocyanatomethyl) cyclohexane, 1,3-bis (isocyanatomethyl) cyclohexane, 1,4-bis (isocyanatomethyl) cyclohexane, isophorone diisocyanate, Alicyclic isocyanate compounds such as dicyclohexylmethane diisocyanate, cyclohexane diisocyanate, methylcyclohexane diisocyanate, dicyclohexyldimethylmethane isocyanate, and 2,2-dimethyldicyclohexylmethane isocyanate; (Isocyanatoethyl) benzene, bis (isocyanatopropyl) benzene, bis (isocyanatobutyl) benzene, bis (isocyanatomethyl) naphthalene, bis (isocyanatoethyl) Isocyanatomethyl) diphenyl ether, phenylenediisocyanate, ethylphenylenediisocyanate, isopropylphenylenediisocyanate, dimethylphenylenediisocyanate, diethylphenylenediisocyanate, diisopropylphenylenediisocyanate, trimethylbenzene triisocyanate, benzene tri Isocyanate, biphenyl diisocyanate, toluidine diisocyanate, 4,4-diphenylmethane diisocyanate, 3,3-dimethyldiphenylmethane-4,4-diisocyanate, bibenzyl-4,4-diisocyanate, bis Cyanatophenyl) ethylene, 3,3-dimethoxybiphenyl-4,4-diisocyanate, hexahydrobenzene diisocyanate, hexa Aromatic isocyanate compounds such as hydroiodiphenylmethane-4,4-diisocyanate; Bis (isocyanatoethyl) sulfide, bis (isocyanatoethyl) sulfide, bis (isocyanatopropyl) sulfide, bis (isocyanatohexyl) sulfide, bis Bis (isocyanatoethylthio) methane, bis (isocyanatoethylthio) methane, bis (isocyanatoethylthio) ethane, bis (isocyanatoethylthio) Aliphatic isocyanate compounds such as isocyanatomethylthio) ethane and 1,5-diisocyanato-2-isocyanatomethyl-3-thiapentane; Diphenylsulfide-2,4-diisocyanate, diphenylsulfide-4,4-diisocyanate, 3,3-dimethoxy-4,4-diisocyanatodibenzylthioether, bis (4- Diisocyanate, diphenyldisulfide-4,4-diisocyanate, 2,2-dimethyl diphenyldisulfide-5,5 Diisocyanate, 3,3-dimethyldiphenyldisulfide-5,5-diisocyanate, 3,3-dimethyldiphenyldisulfide-6,6-diisocyanate, 4,4- A sulfided aromatic isocyanate compound such as 5-diisocyanate, 3,3-dimethoxy diphenyl disulfide-4,4-diisocyanate and 4,4-dimethoxydiphenyl disulfide-3,3-diisocyanate; 2,5-bis (isocyanatomethyl) thiophene, 2,5-diisocyanatotetrahydrothiophene, 2,5-bis (isocyanatomethyl) (Isocyanatomethyl) tetrahydrothiophene, 2,5-diisocyanato-1,4-dithiane, 2,5-bis (isocyanatomethyl) Dithiane, 4,5-diisocyanato-1,3-dithiolane, 4,5-bis (isocyanatomethyl) -1,3-dithiolane, 4,5-bis Isocyanatomethyl) -2-methyl-1,3-dithiolane, and the like can be used.

The polyvalent metal compound is not particularly limited but a compound in which a polyvalent metal exists in a state of being fed to acetylacetone or ethyl acetonate can be used. As the polyvalent metal, there can be used aluminum, iron, zinc N, N'-toluene-2,4-bis (1-aziridinecarboxamide), N, N'-diphenylmethane diisocyanate, -Diphenylmethane-4,4'-bis (1-aziridine carboxamide), triethylene melamine, bisisopropanoyl-1- (2-methyl aziridine) Oxides, and the like, but they are not limited thereto.

Examples of the oxazoline resin include 2-vinyl-2-oxazoline, 2-vinyl-4-methyl-2-oxazoline, Phenyl-2-oxazoline, 2-isopropenyl-4-methyl-2-oxazoline or 2-isopropenyl-5-ethyl-2-oxazoline may be used. As the carbodiimide compound For example, 1,3-dicyclohexylcarbodiimide, HMV-8CA sold by NISSHINBO, HMV-10B, bis- (2,6-diisopropyl- Carbodiimide), poly- (1,3,5-triisopropyl-phenyl-2,4-carbodiimide), and the like, but the present invention is not limited thereto.

Examples of the epoxy compound include ethylene glycol diglycidyl ether, triglycidyl ether, trimethylolpropane triglycidyl ether, N, N, N ', N'-tetraglycidylethylenediamine or glycerin A melamine compound containing an amino group or a butoxy group or a melamine compound containing a methoxy group can be used as the melamine compound. Specific examples of the melamine compound include CYTEC, CYMEL 325, CYMEL 327; BE 3748, BE 3040 from BIP; RESIMENE 717 from MONSANTO; CYMEL 303 manufactured by UNITED CARBIDE, and CYMEL 1130 manufactured by AMERICAN CYANAMID. However, the present invention is not limited thereto.

The multifunctional crosslinking agent may be included in the pressure-sensitive adhesive composition in a range of 0.01 to 10 parts by weight, 0.05 to 5 parts by weight, or 0.1 to 1 part by weight based on 100 parts by weight of the pressure-sensitive adhesive polymer. The content of the multifunctional crosslinking agent contained in the pressure-sensitive adhesive composition can be suitably controlled within the above-mentioned range to ensure excellent properties such as the adhesive strength of the pressure-sensitive adhesive composition or the pressure-sensitive adhesive layer formed therefrom, and the storage elastic modulus.

In one example, the pressure-sensitive adhesive composition may have a storage modulus of 0.03 MPa or more, 0.0325 MPa or more, or 0.035 MPa or more as measured at a temperature of 150 캜 and a frequency of 1 rad / sec in a crosslinked structure. In another example, the pressure-sensitive adhesive composition may have a storage modulus of 0.04 MPa or more measured at a temperature of 150 캜 and a frequency of 1 rad / sec in a state of implementing a crosslinked structure. The upper limit of the storage elastic modulus measured at the temperature of 150 DEG C and the frequency of 1 rad / sec is not particularly limited, and may be, for example, about 0.10 MPa, 0.09 MPa, or 0.08 MPa.

In another example, the pressure-sensitive adhesive composition may have a storage elastic modulus of 0.04 MPa or more, 0.0425 MPa or more, 0.045 MPa or more, or 0.0475 MPa or more at a temperature of 30 캜 and a frequency of 1 rad / sec in a state of realizing a crosslinked structure. The upper limit of the storage elastic modulus of the pressure-sensitive adhesive composition measured at a temperature of 30 DEG C and a frequency of 1 rad / sec is not particularly limited and may be, for example, about 0.10 MPa, 0.0975 MPa, 0.095 MPa, or 0.0925 MPa.

The storage elastic modulus of the pressure-sensitive adhesive composition can be controlled within the above-described range at low temperature and high temperature to prevent the occurrence of bubbles due to the heat treatment process in the production of the conductive laminate including the pressure-sensitive adhesive layer formed from the pressure-sensitive adhesive composition, It is possible to provide an electrically conductive laminate excellent in visibility.

In one example, the pressure-sensitive adhesive composition of the present application may have a gel fraction of at least 75 wt% or at least 80 wt% after implementing the crosslinked structure. The gel fraction can be calculated by the following general formula (1).

[Formula 1]

Gel fraction (%) = B / A x 100

In the general formula (1), A represents the mass of the pressure-sensitive adhesive composition which implements the crosslinked structure, and B represents the mass of the pressure-sensitive adhesive composition of mass A in a net of 200 mesh, The mass of the insoluble fractions collected after immersion was measured after drying for 1 hour at a temperature of 120 ° C.

In another example, the pressure-sensitive adhesive composition may have an elastic modulus characteristic represented by the following general formula (2).

[Formula 2]

G _L / G _H < 1.7

In the general formula 2, G _L represents the storage elastic modulus at 30 ° C and 1 rad / sec in the state of implementing the crosslinked structure, and G _H represents the storage elastic modulus at 150 ° C and 1 rad / sec in the state of implementing the crosslinked structure .

In the present specification, "a state in which a crosslinking structure is realized" may mean a state in which the crosslinking reaction is sufficiently advanced. In one specific example, a predetermined amount of the composition obtained by reacting the above- May refer to the composition or sample state after aging for about 48 hours to about 72 hours at a temperature.

When the properties of the gel fraction and / or the elastic modulus of the pressure-sensitive adhesive composition are controlled within the above ranges, bubbles due to the heat treatment process can be prevented in the production of the conductive laminate including the pressure-sensitive adhesive layer formed from the pressure- It is possible to provide an electrically conductive laminate excellent in visibility.

The present application also relates to a conductive laminate.

In one example, the conductive laminate comprises a substrate layer; A pressure-sensitive adhesive layer comprising a crosslinked layer of the aforementioned pressure-sensitive adhesive composition formed on at least one side of the base layer; And a conductive layer formed on the pressure-sensitive adhesive layer.

The conductive laminate according to the present application is exemplarily shown in Fig.

As shown in Fig. 1, the conductive laminate includes a base layer 10; A pressure-sensitive adhesive layer (20) comprising a crosslinked layer of the aforementioned pressure-sensitive adhesive composition formed on at least one side of the base layer (10); And a conductive layer 30 formed on the pressure-sensitive adhesive layer 20.

2 is a view showing still another example of the conductive laminate according to the present application. As shown in Fig. 2, the conductive laminate of the present application comprises a base layer 10; A pressure-sensitive adhesive layer (20) comprising a crosslinked layer of the aforementioned pressure-sensitive adhesive composition formed on both sides of the base layer (10); And a conductive layer 30 formed on the pressure-sensitive adhesive layer 20 formed on both sides of the base layer 10, respectively.

3 is a view showing the conductive layer 30 in more detail. As shown in FIG. 3, the conductive layer 30 includes a conductive base layer 50; An undercoat layer 40 formed on one surface of the conductive base layer 50; And an electrically conductive functional layer 60 formed on the undercoat layer 40.

As the base layer 10 or the conductive base layer 50, for example, an optically transparent plastic film can be used. The plastic film includes, for example, a polyester film such as a PET (poly (ethylene terephthalate) film; Polyamide film; Polyvinyl chloride films; Polystyrene film; Or a polyolefin film such as polyethylene or polypropylene, and the like. The plastic film may be an unoriented or uniaxially or biaxially stretched film. The surface of the conductive substrate layer may be subjected to a treatment such as corona discharge treatment, ultraviolet ray irradiation treatment, plasma treatment, or sputter etching on the surface from the viewpoint of improving adhesion with the conductive functional layer. The base layer or the conductive base layer may have a thickness of, for example, from about 10 탆 to 300 탆, from 50 탆 to 200 탆, or from 100 탆 to 150 탆, but is not limited thereto.

In one example, the conductive laminate of the present application may further include a hard coat layer between the base layer and the pressure-sensitive adhesive layer.

4 is a diagram schematically showing the structure of a conductive laminate further comprising the hard coat layer 70. [

In another example, the conductive laminate of the present application comprises a base layer; A pressure-sensitive adhesive layer formed on both surfaces of the base layer; And a conductive layer formed on the pressure-sensitive adhesive layer, wherein a hard coating layer is formed on both surfaces of the base layer, the conductive layer being in contact with the pressure-sensitive adhesive layer; An undercoat layer formed on the conductive base layer; And a conductive functional layer formed on the undercoat layer, and the pressure-sensitive adhesive layer may be a double-sided conductive three-ply laminate including the crosslinked layer of the pressure-sensitive adhesive composition described above.

More specifically, the structure of one exemplary double-sided conductive laminate of this application is shown in Fig.

As shown in Fig. 5, the conductive laminate of the present application comprises a base layer 10; A hard coating layer 70 formed on both sides of the substrate layer 10; A pressure-sensitive adhesive layer (20) comprising a crosslinked layer of the aforementioned pressure-sensitive adhesive composition formed on the hard coat layer (70); A conductive base layer (50) formed on the pressure sensitive adhesive layer (20); An undercoat layer 40 formed on the conductive base layer 50; And a conductive functional layer 60 formed on the undercoat layer 40, respectively.

The hard coat layer can be formed of a common material and can be formed by, for example, a hard coat treatment method of applying and hardening a hard resin such as an acrylic urethane resin or a siloxane resin. In the hard coat treatment, a silicone resin or the like is mixed with a hard resin such as the acryl urethane-based resin or siloxane-based resin to roughen the surface of the hard resin, and when it is applied to a touch panel or the like, Plane can be formed at the same time. Such a hard coat layer can be formed to a thickness of about 0.1 to 30 占 퐉 in consideration of hardness characteristics, anti-creep properties, curl prevention properties, and the like.

The pressure-sensitive adhesive layer is not particularly limited as long as it is formed from the above-described pressure-sensitive adhesive composition, but it may have a thickness of, for example, about 1 탆 to 50 탆, 1 탆 to 40 탆 or 1 탆 to 30 탆, Can also be adjusted appropriately if necessary.

The undercoat layer 40 can improve the adhesion of the conductive functional layer 60 and the conductive base layer 50 to be described later, for example.

The undercoat layer may include an inorganic material, an organic material, or an organic composite material. As the inorganic material, for example, SiO ₂ , MgF ₂ or Al ₂ O ₃ can be exemplified. As the organic material, an acrylic polymer, a urethane polymer, a melamine polymer, an alkyd polymer or a siloxane polymer can be exemplified As the organic-inorganic composite material, a composite of at least one kind of inorganic material and at least one kind of organic material can be exemplified. In one example, the undercoat layer can be formed using a thermosetting resin comprising a mixture of a melamine resin, an alkyd polymer and an organosilane condensate as a sol-gel reaction product of an organic silane-containing mixture or an organic material.

The undercoat layer may be formed by, for example, vacuum deposition, sputtering, ion plating or coating. The undercoat layer may be formed to a thickness of usually 100 nm or less, 15 nm to 100 nm, or 20 nm to 60 nm.

The conductive functional layer may be formed of a metal such as gold, silver, platinum, palladium, copper, aluminum, nickel, chromium, titanium, iron, cobalt, tin and two or more kinds of alloys thereof, indium oxide, tin oxide, Or a metal oxide composed of a mixture of two or more of the above, or another metal oxide composed of copper iodide, etc., and the conductive functional layer may be a crystalline layer or an amorphous layer. Preferably, indium tin oxide (ITO) may be used to form the conductive functional layer, but the present invention is not limited thereto. The thickness of the conductive functional layer may be adjusted to about 10 nm to 300 nm, preferably about 10 nm to 200 nm, in consideration of the possibility of formation of a continuous film, conductivity, transparency, and the like.

The conductive functional layer can be formed by, for example, a vacuum evaporation method, a sputtering method, an ion plating method, a spray pyrolysis method, a chemical plating method, an electroplating method, or a general thin film formation method combining two or more of the above methods, May be formed by a vacuum evaporation method or a sputtering method.

The method for producing the conductive laminate of the present application is not particularly limited, but it is preferable that the conductive laminate is produced in a straight-through manner as described in the following example section. In addition, within the range where the effect of the conductive laminate of the present application is not hindered, the non-carrier film can be manufactured by a manufacturing method in which a non-carrier film is introduced. In the case of the above production method using the non-carrier film, for example, a releasing film of the releasing film is coated with a pressure-sensitive adhesive formed from the pressure-sensitive adhesive composition, dried at 100 ° C for about 90 seconds, laminated with a releasing film having a low releasing force a non-carrier film type adhesive film may be manufactured, and the release film of the adhesive film may be removed to laminate and laminate an ITO film on both sides of the hard coated substrate.

The present application also relates to a touch panel or a display device including the touch panel.

The exemplary touch panel may include the conductive laminate as an electrode plate for a touch panel, for example.

The touch panel in the present application can be formed in a known structure including an electrostatic capacity type or a resistive type as long as the conductive laminated body or the electrode plate is included, and the structure of a display device to which such a touch panel is applied is also known The method can be applied as it is.

The pressure-sensitive adhesive composition of the present application has a molecular weight distribution below a specific range and can realize a pressure-sensitive adhesive layer showing a storage elastic modulus in a specific range or more at a low temperature and a high temperature after implementing a crosslinked structure, and the pressure- It is possible to prevent air bubbles generated from the heat treatment process for crystallizing the conductive functional layer during manufacturing and to solve the visibility problem caused by the air bubbles thereby to provide a touch panel or display Device can be provided.

Figs. 1 and 2 are views exemplarily showing a conductive laminate according to the present application. Fig.
Fig. 3 is a view showing an exemplary conductive layer included in the conductive laminate of the present application. Fig.
Figs. 4 and 5 are diagrams schematically showing the structure of the conductive laminate in one example of the present application. Fig.

Hereinafter, the present application will be described in more detail by way of examples according to the present application and comparative examples not complying with the present application, but the scope of the present application is not limited by the following examples.

Hereinafter, physical properties in Examples and Comparative Examples were evaluated in the following manner.

1. Molecular weight and molecular weight distribution measurement

The weight average molecular weight (Mw) and the molecular weight distribution (PDI) were measured using GPC under the following conditions, and the measurement results were converted using the standard polystyrene of the Agilent system for the calibration curve.

<Measurement Conditions>

Measuring instrument: Agilent GPC (Agilent 1200 series, U.S.)

Column: Two PL Mixed B connections

Column temperature: 40 ° C

Eluent: THF (Tetrahydrofuran)

Flow rate: 1.0 mL / min

Concentration: ~ 1 mg / mL (100 μL injection)

2. Gel Fractional  evaluation

A predetermined amount of the aged pressure-sensitive adhesive composition prepared in Examples or Comparative Examples was collected and placed in a constant-temperature and constant humidity chamber maintained at a temperature of 23 ° C and a relative humidity of 60% for 7 days, placed in a stainless steel wire mesh (200 mesh) 100 mL of ethyl acetate was added thereto so that all of the pressure-sensitive adhesive composition was locked, and kept in a dark room at room temperature for 3 days. After the storage, the pressure-sensitive adhesive composition which was not soluble in ethyl acetate was sampled and the weight (A, unit: g) was measured. The pressure-sensitive adhesive composition was kept in a dryer at 120 ° C for 1 hour and then weighed again : g). Subsequently, the measured weights A and B were substituted into the following general formula 1, and the gel fraction values were obtained and shown in Table 2.

[Formula 1]

Gel fraction (% by weight) = 100 x B / A

3. Storage elasticity ( G _L  And G _H ) Measure

The storage elastic moduli of the pressure-sensitive adhesive compositions prepared in Examples and Comparative Examples were measured using a Rheometer (Advanced Rheometric Expansion System G2, TA). The pressure-sensitive adhesive layer having the crosslinked structure of the pressure-sensitive adhesive composition was cut into a specimen having a thickness of 1 mm, and then a parallel plate fixture having a diameter of 8 mm was used to measure the strain at a rate of 10% and a frequency of 1 rad / sec And then the storage elastic modulus was measured while raising the temperature at a rate of 20 DEG C / min at a temperature between 30 DEG C and 150 DEG C. The values of G _L / G _H are shown in Table 2 as the storage elastic modulus (G _L ) measured at a temperature of 30 ° C and the storage elastic modulus (G _H ) measured at a temperature of 150 ° C and the elastic modulus characteristic .

4. Evaluation of bubble formation after heat treatment

Each of the double-sided conductive laminates prepared in Examples and Comparative Examples was cut into specimens having a width of 21 cm and a length of 29 cm, and then each of the specimens was heated in an oven at 150 ° C for 1 hour (evaluation of bubbles after heat treatment) The degree of generation of air bubbles on the surface of the double-sided conductive laminate after heat treatment was performed for 30 minutes (bubble evaluation (2) after heat treatment) and 15 minutes (temperature evaluation after bake evaluation (3)) in an oven at 190 deg. And evaluated according to the following criteria, which are shown in Table 3, respectively.

<Evaluation Criteria>

?: No visible bubbles were formed on the surface of the double-sided conductive laminate after heat treatment.

X: Bubbles were observed on the surface of the double-sided electroconductive laminate after the heat treatment.

Manufacturing example  1. Preparation of adhesive polymer (A)

50 parts by weight of 2-ethylhexyl acrylate (EHA), 40 parts by weight of methacrylate (MA) and 2 parts by weight of 2-hydroxyethyl acrylate (EA) were added to a 1 L reactor equipped with a cooling device for refluxing nitrogen gas, 10 parts by weight of HEA were added. Subsequently, 100 parts by weight of ethyl acetate (EAc) was poured into a solvent, and nitrogen gas was purged for 60 minutes to remove oxygen. Then, while maintaining the temperature at 60 占 폚, azobisisobutyronitrile (AIBN) were added to initiate the reaction. Thereafter, the reaction product which had been reacted for about 5 hours was diluted with ethyl acetate (EAc) to prepare a sticky polymer (A).

Manufacturing example  2 and Manufacturing example  3. Preparation of sticky polymers (B and C)

(B and C) were prepared in the same manner as in Production Example 1, except that the types and / or ratios of raw materials and additives used in the polymerizing the adhesive polymer were controlled as shown in Table 1 below.

division Raw material EA V-65 EHA MA HEA BA IBOA Stickiness
polymer A 50 40 10- - - 100 0.06 B - - 15 55 30 100 0.06 C 50 - 10 - 40 100 0.06 Content Unit: g
EHA: 2-ethylhexyl acrylate
MA: (meth) acrylate
HEA: 2-hydroxyethyl acrylate
BA: n-butyl acrylate
IBOA: isobornyl acrylate
EA: ethyl acetate
V-65: 2,2'-azobis (2,4-dimethyl valeronitrile)

Example  One

Preparation of pressure-sensitive adhesive composition

0.25 parts by weight of xylene diisocyanate (Takenate D110N, Mitsui Chemicals, Inc.) as a cross-linking agent was uniformly mixed with 100 parts by weight of the polymer (A) prepared in Preparation Example 1 to prepare a pressure-sensitive adhesive composition (coating solution).

Double-sided conductivity Of the laminate  Produce

The pressure-sensitive adhesive composition prepared above was coated on a base film having a thickness of 125 탆 and hard coated on both sides, dried at 100 캜 for about 90 seconds, and then laminated with a release film. Thereafter, the other surface of the base film was coated with the same conditions and coating solution, dried, and laminated with a release film. Subsequently, aging was carried out at 40 DEG C for about 72 hours. After removing the release films of the adhesive films on both sides of the substrate film, an ITO film having a thickness of 23 mu m was laminated to prepare a double-side conductive laminate.

Example  2

A pressure-sensitive adhesive composition and a double-sided electroconductive laminate were prepared in the same manner as in Example 1 except that the adhesive polymer A was used but the properties shown in Table 2 were varied.

Example  3

A pressure-sensitive adhesive composition and a double-sided conductive laminate were prepared in the same manner as in Example 1, except that B was used instead of A as a tacky polymer and the manner of having the physical properties shown in Table 2 was changed.

Example  4

A pressure-sensitive adhesive composition and a double-sided conductive laminate were prepared in the same manner as in Example 1, except that C was used instead of A as a tacky polymer and the manner of having the properties shown in Table 2 was changed.

Comparative Example  One

A pressure-sensitive adhesive composition and a double-sided electroconductive laminate were prepared in the same manner as in Example 1 except that the adhesive polymer A was used but the properties shown in Table 2 were varied.

Comparative Example  2

A pressure-sensitive adhesive composition and a double-sided electroconductive laminate were prepared in the same manner as in Example 1 except that the adhesive polymer A was used but the properties shown in Table 2 were varied.

Comparative Example  3

A pressure-sensitive adhesive composition and a double-sided conductive laminate were prepared in the same manner as in Example 1 except that B was used instead of A as the adhesive polymer, but the properties were changed so as to have physical properties shown in Table 2 below.

The results of physical properties measured for the above Examples and Comparative Examples are shown in Table 2 below.

division Example Comparative Example One 2 3 4 One 2 3 Sticky polymer A A B C A A B Molecular weight (unit: million) 130 171 148 120 129 93 72 Molecular weight distribution 2.78 2.55 2.98 2.84 8.96 2.95 5.94 Gel fraction (% by weight) 81 84 82 87 85 83 81.6 The storage elastic modulus (G _L )
(× 10 ⁴ )
(Unit: pa) 7.5 8.2 9.2 4.8 6.3 7.8 7.8 Storage modulus (G _H )
(× 10 ⁴ )
(Unit: pa) 4.6 5.4 7.1 4.0 2.8 3.5 4.4 Elastic modulus characteristic
(G _L / G _H ) 1.63 1.52 1.30 1.20 2.25 2.23 1.73

The results of the evaluation for each of the above Examples and Comparative Examples are shown in Table 3 below.

division Example Comparative Example One 2 3 4 One 2 3 Evaluation of Heat Treatment Bubble (1) ○ ○ ○ ○ × × × Heat treatment bubble evaluation (2) ○ ○ ○ ○ × × × Evaluation of Heat Treatment Bubble (3) ○ ○ ○ ○ × × × Heat treatment bubble evaluation (1): Evaluation of bubble after heat treatment at 150 ° C for 1 hour
Evaluation of Heat Treatment Bubble (2): Evaluation of Bubble after Heat Treatment at 170 ° C for 30 minutes
Heat treatment bubble evaluation (3): Evaluation of bubble after heat treatment at 190 ° C for 15 minutes

As can be seen from Tables 2 and 3, in the case of the double-sided conductive laminate of the present application, the pressure-sensitive adhesive layer contained therein is formed by a pressure-sensitive adhesive composition having a molecular weight distribution below a specific range, By controlling the storage elastic modulus to be higher than a specific range at a high temperature, it is possible to prevent the occurrence of bubbles due to the heat treatment process, thereby securing excellent visibility and thus being usefully applied to a touch panel or a display device.

10: substrate layer
20: pressure-sensitive adhesive layer
30: conductive layer
40: undercoat layer
50: conductive substrate layer
60: conductive functional layer
70: Hard coating layer

Claims (17)

A molecular weight distribution of not more than 5.0,
Wherein a storage elastic modulus at 150 ° C and 1 rad / sec is 0.03 MPa or more in a state of realizing a crosslinked structure, and has an elastic modulus characteristic of the following general formula (2).
[Formula 2]
G _L / G _H < 1.7
In the general formula 2, G _L represents the storage elastic modulus at 30 ° C and 1 rad / sec in the state of implementing the crosslinked structure, and G _H represents the storage elastic modulus at 150 ° C and 1 rad / sec in the state of implementing the crosslinked structure . The pressure-sensitive adhesive composition according to claim 1, wherein a storage elastic modulus at 150 ° C and 1 rad / sec is 0.04 MPa or more in a state of realizing a crosslinked structure. The pressure-sensitive adhesive composition according to claim 1, wherein the storage elastic modulus at 30 DEG C and 1 rad / sec is 0.04 MPa or more in a state of realizing a crosslinked structure. The pressure-sensitive adhesive composition according to claim 1, wherein the pressure-sensitive adhesive polymer comprises polymerized units of an alkyl (meth) acrylate and a copolymerizable monomer having a crosslinkable functional group. The pressure-sensitive adhesive composition according to claim 4, wherein the pressure-sensitive adhesive polymer comprises 70 to 99 parts by weight of polymerized units of alkyl (meth) acrylate and 1 to 30 parts by weight of polymerized units of the crosslinkable functional group-containing copolymerizable monomer. delete The pressure-sensitive adhesive composition according to claim 1, wherein the molecular weight distribution is 3.0 or less. The pressure-sensitive adhesive composition according to claim 1, further comprising a polyfunctional crosslinking agent. The pressure-sensitive adhesive composition according to claim 8, wherein the multifunctional crosslinking agent is contained in an amount of 0.01 to 10 parts by weight based on 100 parts by weight of the pressure-sensitive adhesive polymer. A base layer;
A pressure-sensitive adhesive layer comprising a crosslinked layer of the pressure-sensitive adhesive composition according to claim 1 formed on at least one side of the base layer; And
And a conductive layer formed on the pressure-sensitive adhesive layer. 11. The method of claim 10, wherein the conductive layer comprises a conductive base layer; An undercoat layer formed on one surface of the conductive substrate layer; And an electrically conductive functional layer formed on the undercoat layer. 12. The conductive laminate according to claim 10 or 11, wherein the base layer or the conductive base layer is at least one selected from the group consisting of a polyester film, a polyamide film, a polyvinyl chloride film, a polystyrene film and a polyolefin film. The conductive laminate according to claim 10, further comprising a hard coat layer between the base layer and the pressure-sensitive adhesive layer. The conductive laminate according to claim 10, wherein the thickness of the pressure-sensitive adhesive layer is in the range of 1 탆 to 50 탆. A base layer; A pressure-sensitive adhesive layer formed on both surfaces of the base layer; And a conductive layer formed on the pressure-sensitive adhesive layer,
On both sides of the base layer, a hard coating layer is formed,
The conductive layer includes a conductive base layer in contact with the pressure-sensitive adhesive layer; An undercoat layer formed on the conductive base layer; And an electrically conductive functional layer formed on the undercoat layer,
Wherein the pressure-sensitive adhesive layer comprises a crosslinked layer of the pressure-sensitive adhesive composition according to claim 1. A touch panel comprising the conductive laminate or the double-sided conductive laminate of claim 10 or 15. A display device comprising the touch panel of claim 16.

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